JP6432936B2 - Small equipment maintenance mechanism - Google Patents

Description

  The present invention relates to a film forming apparatus in which a chamber is attached to a film forming source, and a processing apparatus for a minimal fab system in which a wafer processing unit is provided in a processing chamber cut off from outside air.

  In recent years, as a semiconductor device production line, it is fundamental to create one device on a 0.5-inch (half-inch) wafer. For this purpose, the manufacturing process is composed of a plurality of portable unit processing devices. , A minimal fab system has been proposed that makes it easy to relocate these multiple unit processing devices to flowships and job shops, making it suitable for ultra-low volume production and multi-product production ( For example, see Patent Document 1.)

  A unit processing apparatus adapted to this minimal fab system is provided with a casing formed in a substantially rectangular parallelepiped shape having a longitudinal direction in the vertical direction and shielded from the outside air, and a half-inch size wafer is provided in the casing. (See, for example, Patent Document 2).

International Publication No. 2012/029775 International Publication No. 2013/084574

  The minimal fab system of Patent Document 1 is a method of processing half-inch wafers one by one with a unit processing apparatus. As the unit processing apparatus adapted to the minimal fab system, the apparatus described in Patent Document 2 is used. Although known, no film forming apparatus for forming a predetermined film on the surface of a half-inch wafer has been proposed. In particular, this type of film-forming apparatus is generally configured to prevent adhesion of target atoms generated during film formation into the chamber with an anti-adhesion plate, and replacement of the anti-adhesion plate is essential. There is a need for improvement in maintenance.

  The present invention has been made from the above-described state of the art, and its purpose is suitable for forming a very small wafer such as a half inch size which can be used in the above-described minimal fab system and the like. An object of the present invention is to provide a film forming apparatus and a processing apparatus for a minimal fab system that improve the maintainability.

To achieve the above object, the present invention includes a deposition source, a sealed hollow chamber which is provided with an opening on one side, the opening withdrawable attached to the opening in the chamber and anda drawer body which constitute one aspect of the chambers, the drawer body is in a state attached to the Chang bar, a deposition preventing plate for covering at least the upper and lower surfaces and one side of the chamber It was set as the film-forming apparatus characterized by having.

According to the present invention configured as described above, by pulling out the drawer body from the opening of the chamber , one side surface of the chamber is opened, access to the inside of the chamber from the outside is possible, and at least above the inside of the chamber An adhesion-preventing plate that covers the lower surface and one side surface can be pulled out of the chamber together with the drawer . As a result, the maintainability in the chamber can be improved and the replacement of the deposition preventing plate can be facilitated.

  Further, the present invention is the film forming apparatus according to the above invention, wherein the drawer body has a frame body, and the deposition preventing plate is detachably attached to the frame body.

  According to the present invention configured as described above, the frame body can be taken out from the chamber by pulling out the drawer body from the chamber. Therefore, since the adhesion prevention plate can be removed from the frame body taken out from the chamber, the adhesion prevention plate can be replaced more easily.

  Further, the present invention is the film forming apparatus according to the above invention, wherein the drawer has a stage on which a film formation target film formed by the film formation source is placed.

  In the present invention configured as above, the stage can be pulled out from the chamber by pulling out the drawer from the chamber. Therefore, by pulling out the drawer from the chamber, the maintainability of the stage can be improved along with the maintainability within the chamber.

  In addition, the present invention is the film forming apparatus according to the above invention, wherein the drawer has a shutter that shields the film formation target placed on the stage from the film formation source.

  In the present invention configured as described above, the shutter can be pulled out from the chamber by pulling out the drawer from the chamber. Therefore, in addition to the maintainability in the chamber, the maintainability of the shutter can be improved.

  Further, the present invention is the film forming apparatus according to the above invention, wherein the drawer body has an elevating mechanism for moving the stage up and down.

  In the present invention configured as described above, an elevating mechanism for moving the stage up and down can be pulled out from the chamber by pulling out the drawer from the chamber. Therefore, in addition to the maintainability in the chamber, the maintainability of the stage lifting mechanism can be improved.

  Further, the present invention is the film forming apparatus according to the above invention, wherein the drawer body has a temperature control mechanism for adjusting the temperature of the film forming body installed on the stage.

  In the present invention configured as described above, a temperature control mechanism for adjusting the temperature of the film formation target placed on the stage can be pulled out from the chamber by pulling out the drawer from the chamber. Therefore, in addition to the maintainability in the chamber, the maintainability of the temperature control mechanism for adjusting the temperature of the deposition target can be improved.

The present invention further includes a processing chamber that is shielded from outside air, and a wafer processing unit that is provided in the processing chamber and processes a wafer, and the wafer processing unit accommodates the wafer during processing of the wafer. And a drawer body attached so as to be able to be pulled out from the chamber. The chamber has a hollow shape with an opening provided on one side surface, and the drawer body can be pulled out into the opening of the chamber. And the opening is sealed to form one side of the chamber, and in the state of being attached to the chamber, there is a deposition plate that covers at least the upper and lower surfaces and one side of the chamber. The processing device for a minimal fab system.

In the present invention configured as described above, by pulling out the drawer from the opening of the chamber , one side surface of the chamber is opened, and access to the inside of the chamber from the outside becomes easy. At the same time, an adhesion-preventing plate covering at least the upper and lower surfaces and one side surface in the chamber can be pulled out from the chamber together with the drawer body. Therefore, in various processing apparatuses adapted to the minimal fab system, the maintainability in the chamber can be improved , and the replacement of the deposition plate can be facilitated .

  The present invention is the processing apparatus for a minimal fab system according to the above invention, wherein the wafer has a disk shape having an outer diameter of 12.5 mm.

  The present invention configured as described above improves the maintainability in the chamber in a processing apparatus that processes a disc-shaped wafer having a very small outer diameter of 12.5 mm and performs various processes adapted to the minimal fab system. be able to.

  According to the present invention, by pulling out the drawer body from the chamber, it is possible to access the inside of the chamber from the outside, and the deposition plate can be pulled out from the chamber together with the drawer body, so that the maintainability in the chamber can be improved. In addition, it is possible to more easily replace the protection plate.

It is a perspective view which shows the external appearance of the processing apparatus for minimal fab systems which concerns on one Embodiment of this invention. It is the schematic which shows the internal structure of the processing apparatus for said minimal fab systems. It is a figure which shows the outline | summary of the film-forming apparatus accommodated in the said processing apparatus for minimal fab systems, (a) is a side view, (b) is a top view. It is the schematic which shows the state which pulled out the drawer body of the said film-forming apparatus, (a) is a side view, (b) is a top view. It is a perspective view which shows the outline | summary of the frame attached to the drawer body of the said film-forming apparatus, and an adhesion prevention board.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Overall configuration>
As shown in FIG. 1, a processing apparatus 1 for a minimal fab system according to an embodiment of the present invention is based on a unit processing based on a minimal fabrication concept housed in a case 2 having a standardized size. It is a device (small device). The minimal fab system processing apparatus 1 is a film forming apparatus used when a predetermined film is formed on the wafer W, for example, a minimal sputtering apparatus. Here, the minimal fab concept is optimal for the semiconductor manufacturing market with a small amount of various products, and can cope with various fabs that save resources, save energy, save investment, and have high performance. For example, it is described in JP 2012-54414 A It realizes a minimal production system that minimizes production.

  The casing 2 is formed in a substantially rectangular parallelepiped shape having a longitudinal direction in the vertical direction, and is unified to a size of width (x) 0.294 m × depth (y) 0.45 m × height (z) 1.44 m. The processing chamber is configured to block the intrusion of fine particles and gas molecules into the interior and from the outside air. Various processing apparatus main bodies 3 for processing the wafers W are accommodated in the upper part 2 a of the upper side of the housing 2. The processing apparatus main body 3 is a wafer processing unit capable of performing a film forming process for forming a predetermined film on the surface of the wafer W, for example. In the upper part 2a of the apparatus, on the upper side of the processing apparatus main body 3, a sputtering power source 4 serving as a power source for the processing apparatus main body 3, a gas cylinder / mass flow meter (mass flow) 5, and the like are accommodated.

  The lower part of the housing 2 is provided with a device lower part 2b for incorporating a control unit / DC power source 6 for controlling the processing device main body 3, a pump 7, a radiator unit 8, and the like. The apparatus lower part 2 b is provided with a support part m for supporting the housing 2.

  In the middle part of the upper part 2a of the device upper part 2a of the housing 2, the front side of the device upper part 2a is cut into a concave shape upward. An operation panel 2c is attached to the upper front side of the apparatus upper portion 2a. The lower part of the upper part 2 a of the apparatus is a front chamber 2 d for carrying the wafer W into the housing 2. A substantially circular docking port 2e as a shuttle accommodating portion for installing a shuttle (not shown) as a transfer container is provided at a substantially central portion on the upper surface of the front chamber 2d. The docking port 2e is provided with a clamp (not shown) for fixing the shuttle fitted to the docking port 2e. The front chamber 2d is configured to block each of fine particles and gas molecules into the housing 2. A PLAD (Particle Lock Air-tight Docking) system 9 is attached to the front chamber 2d so that the wafer W accommodated in the shuttle can be taken in and out of the housing 2 without being exposed to the outside air.

<Processing device body>
The processing apparatus main body 3 is a film forming unit that constitutes a sputtering apparatus that is a film forming apparatus for forming a film on the surface of a disk-shaped wafer W formed in a predetermined size. The wafer W to be processed by the processing apparatus main body 3 is formed in a disk shape having a circular surface having a predetermined size, for example, a diameter of 12.5 mm (half inch size). As the wafer W, various substrates such as a bare silicon wafer can be used.

  The processing apparatus main body 3 has a process chamber 32 as a vacuum container provided with a sputtering source 31 as a film forming source, and a turbo molecular pump 33 installed below the process chamber 32. A target (material) is attached to the sputter source 31, a high voltage is applied to the target, and an ionized inert gas such as argon is collided with the material, so that target atoms are repelled and enter the process chamber 32. A target atom is made to reach and adhere to the surface of the installed wafer W to form a film (sputtering). As shown in FIGS. 3A and 3B, the process chamber 32 includes a hollow cubic chamber 34. The chamber 34 is a process container that accommodates the wafer W when the wafer W is sputtered in the process chamber 32. The chamber 34 and the PLAD system 9 are connected via a load lock chamber 11 as a transfer chamber, and the wafer W in the shuttle is processed by the PLAD system 9 via the load lock chamber 11 without being exposed to the atmosphere. The apparatus main body 3 is configured to be able to carry in and out to a predetermined position in the chamber 34.

A rectangular opening 34 a is provided on one side surface of the chamber 34 opposite to the load lock chamber 11. A drawer body 35 is attached to the opening 34 a so as to be able to be pulled out from the chamber 34. The drawer body 35 includes a drawer body 35a formed in a substantially cubic shape with an upper opening, and a rectangular flat door body 35b that is attached to one side surface of the drawer body 35a and closes the opening 34a of the chamber 34. It is a maintenance mechanism provided . On both sides of the switch Yanba 34, a pair of guide rails 36a serving as a slider, 36b is installed horizontally. As shown in FIGS. 4A and 4B, the drawer body 35 can be completely pulled out along the horizontal direction by the guide rails 36a and 36b from the opening 34a of the chamber 34 to the outside of the chamber 34. This configuration can be stored in a predetermined position in the chamber 34 from this state.

  The door body 35b of the drawer body 35 is formed so that when the drawer body 35a of the drawer body 35 is accommodated in the chamber 34 from the opening 34a of the chamber 34, the opening 34a of the chamber 34 can be hermetically closed. 34 has a structure constituting one side surface. On the inner side surface of the door 35b, as shown in FIG. 3B, a stage 35c for installing a wafer W as a film formation target to be formed, and a wafer W installed on the stage 35c. A shutter 35d for shielding the sputtering source 31 and a substantially U-shaped attachment plate 35m are attached so as to straddle the stage 35c and the shutter 35d. The stage 35c includes a stage main body 35e, an installation part 35f that is attached to the upper side of the stage main body 35e so as to be movable up and down, and that holds and holds the wafer W. A mechanism 35g, and a cooling mechanism 35h as a temperature adjustment mechanism for adjusting the temperature of the wafer W installed in the installation unit 35f, specifically, for cooling, are provided. In addition, according to the process by the processing apparatus main body 3, it is possible to use a superheating mechanism that superheats the wafer W installed on the installation unit 35f of the stage 35c, instead of the cooling mechanism 35h, and forms on the wafer W as necessary. It is also possible to improve film adhesion and film quality.

  The shutter 35d is configured to be driven by a motor 35i as a drive source attached to the outer surface of the door body 35b, and shields the wafer W installed on the installation portion 35f of the stage 35c from the sputtering source 31. It can move in the horizontal direction so that it can. In the installation unit 35 f, the wafer W transferred into the process chamber 32 through the load lock chamber 11 by the PLAD system 9 is installed. The wafer W that has been processed in the process chamber 32, that is, after film formation, is accommodated in the shuttle fitted into the docking port 2e by the PLAD system 9 through the load lock chamber 11 from the installation portion 35f. . The elevating mechanism 35g includes a motor 35j serving as a drive source and a drive unit 35k that is driven in the vertical direction by the motor 35j, and moves the installation unit 35f up and down by moving the drive unit 35k up and down by driving the motor 35j. . The cooling mechanism 35h cools the wafer W on the installation part 35f by cooling the stage main body 35e and the installation part 35f of the stage 35c by circulating supply of cooling water from the pump 7, for example.

  As shown in FIG. 4A, FIG. 4B and FIG. 5, the drawer body 35a is provided with an adhesion prevention plate mechanism 37 having a plurality of, for example, five rectangular flat plate adhesion prevention plates 37a to 37e. Contained as possible. The protection plate mechanism 37 is a state in which the drawer body 35 is accommodated in the chamber 34, and at least a part of the chamber 34, specifically, the upper and lower surfaces, both side surfaces of the chamber 34, and the load lock chamber 11 side. It is configured to cover the side. The protection plate mechanism 37 is configured to be removable above the drawer main body 35 a in a state where the drawer body 35 is pulled out from the opening 34 a of the chamber 34. As shown in FIG. 5, the adherence plate mechanism 37 includes a frame body 38 that is a frame-like frame having each side of a legislative body that is open on one surface. The frame body 38 has a configuration in which the adhesion preventing plates 37a to 37e can be removably attached to the upper and lower surfaces, both side surfaces, and one side surface of the load lock chamber 11, respectively.

  Each of the adhesion preventing plates 35m, 37a to 37e prevents the target atoms (materials) from adhering to the chamber 34, and the adhering target atoms are peeled off to rise into the chamber 34, thereby preventing deterioration of the quality of the sputtering process. It is a part that requires maintenance, that is, replacement or cleaning when a predetermined sputtering process is performed. The adhesion preventing plate 35m is detachably attached to the inner surface of the door body 35b.

  The adhesion preventing plate 37a attached to the upper surface of the frame body 38 is provided with a circular opening 37f for allowing the target atoms from the sputtering source 31 to pass therethrough. The adhesion preventing plate 37e attached to the load lock chamber 11 side of the frame 38 is also provided with an opening 37g that allows the wafer W transferred from the load lock chamber 11 by the PLAD system 9 to be carried in and out of the chamber 34. ing. The other side surface of the frame body 38 to which the adhesion preventing plates 37a to 37e are not attached is a portion located on the door body 35b side of the drawer body 35a, and a stage 35c and a shutter 35d attached to the inner side surface of the door body 35b. The adhesion preventing plate mechanism 37 is attached to a predetermined position of the drawer body 35 so as to be accommodated in the drawer main body 35a.

  Next, the operation of the minimal fab system processing apparatus 1 according to the embodiment will be described.

<Film formation process>
First, the shuttle accommodating the wafer W is fitted into the docking port 2e of the minimal fab system processing apparatus 1. In this state, the clamp is operated to fix the shuttle fitted to the docking port 2e. Next, the operation panel 2c is operated to select a predetermined recipe, and then the film forming process for the wafer W is started.

  Then, the wafer W is taken out from the shuttle by the PLAD system 9, and the wafer W is transferred onto the stage 35 c of the processing apparatus main body 3 through the load lock chamber 11. Next, the vertical position of the wafer W placed on the stage 35c is adjusted by the lifting mechanism 35g.

  Then, after the chamber 34 is evacuated, an inert gas such as argon is introduced into the chamber 34, and then the pressure in the chamber 34 is adjusted. Further, if necessary, the cooling mechanism 35h is driven to cool the wafer W on the stage 35c, that is, to adjust the temperature. If necessary, the shutter 35d is driven to shield at least part of the surface of the wafer W from the sputtering source 31. In this state, emission of target atoms from the sputtering source 31 is started, and film formation processing on the surface of the wafer W, specifically, pre-sputtering and main sputtering are performed.

  Thereafter, the wafer W on the stage 35 c is transferred into the shuttle via the load lock chamber 11 by the PLAD system 9. And the shuttle which accommodated the wafer W in which the film-forming process was performed can be removed from the docking port 2e by canceling | releasing fixation with the clamp of the docking port 2e.

<Maintenance>
When replacing the deposition prevention plates 37 a to 37 e in the chamber 34, first, a panel (not shown) attached to the back surface of the housing 2 of the minimal fab system processing apparatus 1 is removed to remove the processing apparatus main body 3. After the door body is exposed, the door body 35b is pulled out from the chamber 34 along the guide rails 36a and 36b, as shown in FIGS. 4 (a) and 4 (b).

  As a result, the drawer body 35 can be completely pulled out of the chamber 34. In this state, the deposition preventing plate mechanism 37 having the deposition preventing plates 37a to 37e attached to predetermined surfaces of the frame body 38 is moved upward by lifting or the like, and removed from the drawer body 35a. Then, as shown in FIG. 5, by removing the respective adhesion preventing plates 37 a to 37 e of the adhesion preventing plate mechanism 37 from the frame body 38, the respective adhesion preventing plates 37 a to 37 e can be replaced and cleaned.

  In the state where the drawer body 35 is pulled out from the chamber 34, the stage 35c, the shutter 35d, the elevating mechanism 35g, and the cooling mechanism 35h are pulled out of the chamber 34 together with the drawer body 35. Therefore, the stage 35c, shutter 35d, Each of the elevating mechanism 35g and the cooling mechanism 35h can also be maintained in the state of being taken out from the chamber 34.

  In a state where the drawer body 35 is pulled out from the chamber 34 and the adhesion preventing plate mechanism 37 is detached from the drawer body 35a, the opening 34a of the chamber 34 is opened larger than in a state where the drawer body 35 is simply pulled out from the chamber 34. Thus, access to the chamber 34 becomes easier, and maintenance in the chamber 34 becomes easier.

  Then, after the washed adhesion prevention plates 37a to 37e or new adhesion prevention plates 37a to 37e attached to the frame body 38 are accommodated in the drawer body 35a and attached, the door body 35b is pushed, etc. Then, by accommodating the drawer body 35 in the chamber 34, the replacement of the adhesion preventing plates 37 a to 37 e and the maintenance in the chamber 34 are completed.

<Effect>
In the minimal fab system processing apparatus 1 according to the above-described embodiment, after removing the rear panel of the housing 2, the door body 35b of the processing apparatus main body 3 is moved along the guide rails 36a and 36b. The drawer body 35 can be pulled out from the chamber 34. As a result, by pulling out the drawer body 35 from the chamber 34, the opening 34a of the chamber 34 opens greatly, and access to the inside of the chamber 34 from the outside becomes possible. For example, when opening the side surface of the chamber 34, etc. Compared to the above, it is possible to improve the maintainability in the chamber 34, and it is possible to easily replace the components in the chamber where the necessity of replacing the components is high. Therefore, the maintainability in the chamber 34 in the processing apparatus 1 for the minimal fab system for processing various processes adapted to the minimal fab concept for processing a disc-shaped half-inch wafer W having a very small outer diameter of 12.5 mm. Can also be improved. Even if the wafer W is left in the chamber 34 of the processing apparatus main body 3 due to some trouble, the wafer W in the chamber 34 can be removed by pulling out the drawer 35 from the chamber 34. .

  In particular, because the drawer body 35a of the drawer body 35 accommodates the adhesion prevention plate mechanism 37 with the adhesion prevention plates 37a to 37e attached thereto, the drawer body 35 and the adhesion prevention plate are pulled out by pulling out the drawer body 35 from the chamber 34. The mechanism 37 can be withdrawn from the chamber 34. Therefore, by removing the adhesion preventing plate mechanism 37 from the drawer body 35a drawn out from the chamber 34 and removing the adhesion preventing plates 37a to 37e from the frame body 38 of the adhesion preventing plate mechanism 37, these adhesion preventing plates 37a to 37e can be replaced or removed. Since cleaning becomes possible, the maintenance work of these adhesion prevention plates 37a-37e can be made easy. At this time, since the adhesion prevention plate mechanism 37 in which the adhesion prevention plates 37a to 37e are attached to the frame body 38 is accommodated in the drawer body 35a and attached to the drawer body 35, the adhesion prevention plate mechanism 37 is attached to the drawer body 35a. By removing from the drawer body 35, it is possible to remove the plurality of adhesion prevention plates 37a to 37e from the drawer body 35 at once, and to easily remove the adhesion prevention plates 37a to 37e from the drawer body 35. Further, by removing the adhesion preventing plate mechanism 37 from the drawer body 35a, the adhesion preventing plate 35m attached to the inner surface of the door body 35b can be easily replaced.

  Further, the stage 35 c, the shutter 35 d, the elevating mechanism 35 g, and the cooling mechanism 35 h of the processing apparatus body 3 are each attached to the inner surface of the door body 35 b of the drawer body 35. Therefore, by pulling out the drawer body 35 from the chamber 34, the stage 35c, the shutter 35d, the lifting mechanism 35g, and the cooling mechanism 35h can be pulled out from the chamber 34 together with the drawer body 35. Therefore, by pulling out the drawer body 35 from the chamber 34, the maintainability of the stage 35c, the shutter 35d, the elevating mechanism 35g, and the cooling mechanism 35h can be improved along with the maintainability in the chamber 34.

  Further, when the drawer body 35 is pulled out from the chamber 34, the drawer body 35 is moved along the guide rails 36 a and 36 b so that the drawer body 35 can be completely pulled out of the chamber 34. Therefore, the opening 34 a of the chamber 34 can be opened larger than when the guide rails 36 a and 36 b are not used and a part of the drawer body 35 is locked to the chamber 34. Therefore, since access to the chamber 34 can be performed more easily, the maintainability in the chamber 34 can be further improved. Further, when the drawer body 35 is pulled out of the chamber 34 when the drawer body 35 is pulled out of the chamber 34 without using the guide rails 36a and 36b, the drawer body 35 is pulled out of the chamber 34. Since the unexpected drop and damage of the drawer body 35 can be prevented, the maintainability of the processing apparatus main body 3 can be further improved.

<Others>
In the above embodiment, the minimal fab system processing apparatus 1 including the processing apparatus main body 3 for forming the surface of the half-inch wafer W adapted to the minimal fab concept has been described. However, the present invention is not limited to this, and the pull-out structure of the chamber 34 can be used even in the processing apparatus 1 for the minimal fab system including the various processing apparatus main bodies 3 having the chamber 34 for processing the wafer. . Furthermore, the structure of the drawer body 35 may be a configuration that facilitates access in the chamber 34 and replacement of the adhesion preventing plates 37a to 37e. That is, for example, at least one of the stage 35 c and the shutter 35 d may be provided in the chamber 34 separately from the drawer body 35, and at least the deposition preventing plates 37 a to 37 e may be pulled out of the chamber 34 together with the drawer body 35. Various configurations are possible.

1 Processing equipment for minimal fab system 2 Housing (processing room)
2a Upper part of the apparatus 2b Lower part of the apparatus 2c Operation panel 2d Front chamber 2e Docking port 3 Processing apparatus main body (wafer processing part, film forming apparatus)
4 Power supply for sputtering 5 Gas cylinder / mass flow 6 Control unit / DC power supply 7 Pump 8 Radiator unit 9 PLAD system 11 Load lock chamber 31 Sputtering source (deposition source)
32 Process chamber 33 Turbo molecular pump 34 Chamber 34a Opening 35 Drawer 35a Drawer body 35b Door 35c Stage 35d Shutter 35e Stage body 35f Installation part 35g Lifting mechanism 35h Cooling mechanism (temperature adjustment mechanism)
35i motor 35j motor 35k drive unit 35m deposition plate 36a, 36b guide rail 37 deposition plate mechanism 37a to 37e deposition plate 37f opening 37g opening 38 frame W wafer (film formation body)
m Support part

Claims (8)

A hollow chamber having a film forming source and having an opening on one side ;
Anda drawer body which withdrawable attached to the opening of the chamber to seal the opening constitute one aspect of said chamber,
The drawer body is in a state attached to the Chang bar, deposition apparatus characterized in that it has a deposition preventing plate for covering at least the upper and lower surfaces and one side surface of the chamber. The film forming apparatus according to claim 1,
The drawer body has a frame body,
The deposition apparatus, wherein the deposition preventing plate is detachably attached to the frame. In the film-forming apparatus of Claim 1 or 2,
The drawer body has a stage on which a film formation target film is formed by the film formation source. In the film-forming apparatus of Claim 3,
The film-drawing apparatus is characterized in that the drawer has a shutter that shields the film-forming body placed on the stage from the film-forming source. In the film-forming apparatus of Claim 3 or 4,
The drawer has a lifting mechanism for moving the stage up and down. In the film-forming apparatus as described in any one of Claims 3 thru | or 5,
The film-drawing apparatus characterized in that the drawer has a temperature control mechanism for adjusting the temperature of the film-forming object installed on the stage. A processing chamber isolated from the outside air;
A wafer processing unit provided in the processing chamber for processing a wafer;
The wafer processing unit includes a chamber that accommodates the wafer when the wafer is processed, and a drawer attached so as to be able to be pulled out from the chamber .
The chamber has a hollow shape with an opening provided on one side surface,
The drawer body is detachably attached to the opening of the chamber to seal the opening to constitute one side of the chamber, and at least the upper and lower sides and one side of the chamber in a state of being attached to the chamber. A processing apparatus for a minimal fab system, characterized in that it has a deposition preventing plate . A processing apparatus for a minimal fab system according to claim 7,
The processing apparatus for a minimal fab system, wherein the wafer has a disk shape with an outer diameter of 12.5 mm.