JP6424992B1 - プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 - Google Patents

プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 Download PDF

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Publication number
JP6424992B1
JP6424992B1 JP2018537543A JP2018537543A JP6424992B1 JP 6424992 B1 JP6424992 B1 JP 6424992B1 JP 2018537543 A JP2018537543 A JP 2018537543A JP 2018537543 A JP2018537543 A JP 2018537543A JP 6424992 B1 JP6424992 B1 JP 6424992B1
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Prior art keywords
prepreg
glass
mass
printed wiring
wiring board
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Japanese (ja)
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JPWO2018124158A1 (ja
Inventor
知樹 濱嶌
知樹 濱嶌
翔平 山口
翔平 山口
孝史 久保
孝史 久保
環 伊藤
環 伊藤
英祐 志賀
英祐 志賀
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/24—Thermosetting resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2463/02—Polyglycidyl ethers of bis-phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2018537543A 2016-12-28 2017-12-27 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 Active JP6424992B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016255270 2016-12-28
JP2016255270 2016-12-28
PCT/JP2017/046840 WO2018124158A1 (fr) 2016-12-28 2017-12-27 Préimprégné, carte stratifiée, carte stratifiée plaquée de feuille métallique, carte de circuit imprimé, et carte de circuit imprimé multicouche

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018200090A Division JP6681052B2 (ja) 2016-12-28 2018-10-24 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板

Publications (2)

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JP6424992B1 true JP6424992B1 (ja) 2018-11-21
JPWO2018124158A1 JPWO2018124158A1 (ja) 2018-12-27

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JP2018537543A Active JP6424992B1 (ja) 2016-12-28 2017-12-27 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板
JP2018200090A Active JP6681052B2 (ja) 2016-12-28 2018-10-24 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板

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Country Status (5)

Country Link
JP (2) JP6424992B1 (fr)
KR (1) KR102026591B1 (fr)
CN (1) CN110139893B (fr)
TW (2) TWI656151B (fr)
WO (1) WO2018124158A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019048990A (ja) * 2016-12-28 2019-03-28 三菱瓦斯化学株式会社 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102199879B1 (ko) * 2017-12-27 2021-01-07 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판 및 다층 프린트 배선판
CN114127205B (zh) * 2019-06-26 2022-10-25 三菱瓦斯化学株式会社 树脂片、覆金属箔层叠板和印刷电路板
CN114698223B (zh) * 2020-12-29 2024-06-14 广东生益科技股份有限公司 一种覆不对称金属箔的层压板和包含其的印刷线路板

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JPH1072752A (ja) * 1996-05-15 1998-03-17 Matsushita Electric Ind Co Ltd プリント配線板用不織布基材とこれを用いたプリプレグ
JP2015089622A (ja) * 2013-11-05 2015-05-11 住友ベークライト株式会社 金属張積層板、プリント配線基板、および半導体装置
JP2015157467A (ja) * 2014-02-24 2015-09-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． 銅張積層板の製造方法
JP2016196549A (ja) * 2015-04-03 2016-11-24 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
WO2017187783A1 (fr) * 2016-04-27 2017-11-02 住友精化株式会社 Composition de résine thermodurcissable, objet durci, matériau de moulage et objet moulé
WO2018016527A1 (fr) * 2016-07-22 2018-01-25 京セラ株式会社 Corps isolant organique, stratifié revêtu de métal et tableau de connexions

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JP3173332B2 (ja) 1995-03-13 2001-06-04 新神戸電機株式会社 金属箔張り積層板の製造法
JP5024205B2 (ja) 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
TW201204548A (en) 2010-02-05 2012-02-01 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
WO2011108588A1 (fr) * 2010-03-02 2011-09-09 日本化薬株式会社 Composition de résine durcissable et article durci obtenu à partir de celle-ci
JP2013001807A (ja) 2011-06-16 2013-01-07 Panasonic Corp 電子回路基板材料用樹脂組成物、プリプレグ及び積層板
JP2013216884A (ja) 2012-03-14 2013-10-24 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、プリプレグ及び積層板
TWI620781B (zh) * 2012-05-31 2018-04-11 Ajinomoto Co., Inc. Resin composition
KR102008550B1 (ko) * 2012-06-08 2019-08-07 가부시키가이샤 아데카 경화성 수지 조성물, 수지 조성물, 이들을 사용하여 이루어지는 수지 시트, 및 이들의 경화물
KR102280840B1 (ko) * 2013-01-15 2021-07-22 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판 및 프린트 배선판
WO2014196501A1 (fr) * 2013-06-03 2014-12-11 三菱瓦斯化学株式会社 Composition de résine pour carte de circuit imprimé ainsi que pré-imprégné mettant en œuvre celle-ci, feuille de résine, plaque stratifiée revêtue d'une feuille de métal, et carte de circuit imprimé
EP3094162B1 (fr) * 2014-01-07 2023-08-09 Mitsubishi Gas Chemical Company, Inc. Couche isolante pour carte de circuit imprimé, et carte de circuit imprimé
KR101755323B1 (ko) * 2014-02-19 2017-07-20 한국생산기술연구원 신규한 에폭시 화합물, 이를 포함하는 혼합물, 조성물, 경화물, 이의 제조 방법, 및 이의 용도
WO2016010033A1 (fr) * 2014-07-18 2016-01-21 三菱瓦斯化学株式会社 Composition de résine, préimprégné, stratifié revêtu d'une feuille métallique, et carte à câblage imprimé
TWI656151B (zh) * 2016-12-28 2019-04-11 日商三菱瓦斯化學股份有限公司 預浸體、疊層板、覆金屬箔疊層板、印刷電路板、及多層印刷電路板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1072752A (ja) * 1996-05-15 1998-03-17 Matsushita Electric Ind Co Ltd プリント配線板用不織布基材とこれを用いたプリプレグ
JP2015089622A (ja) * 2013-11-05 2015-05-11 住友ベークライト株式会社 金属張積層板、プリント配線基板、および半導体装置
JP2015157467A (ja) * 2014-02-24 2015-09-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． 銅張積層板の製造方法
JP2016196549A (ja) * 2015-04-03 2016-11-24 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
WO2017187783A1 (fr) * 2016-04-27 2017-11-02 住友精化株式会社 Composition de résine thermodurcissable, objet durci, matériau de moulage et objet moulé
WO2018016527A1 (fr) * 2016-07-22 2018-01-25 京セラ株式会社 Corps isolant organique, stratifié revêtu de métal et tableau de connexions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019048990A (ja) * 2016-12-28 2019-03-28 三菱瓦斯化学株式会社 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板

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WO2018124158A1 (fr) 2018-07-05
CN114196204A (zh) 2022-03-18
KR20190026953A (ko) 2019-03-13
TWI725387B (zh) 2021-04-21
TW201920399A (zh) 2019-06-01
JP6681052B2 (ja) 2020-04-15
CN110139893B (zh) 2021-11-19
TWI656151B (zh) 2019-04-11
JP2019048990A (ja) 2019-03-28
KR102026591B1 (ko) 2019-09-27
JPWO2018124158A1 (ja) 2018-12-27
CN110139893A (zh) 2019-08-16
TW201831572A (zh) 2018-09-01

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