JP6421464B2 - Multilayer coil parts - Google Patents

Description

  The present invention relates to a laminated coil component.

  2. Description of the Related Art Conventionally, a multilayer coil component in which a coil is formed inside a multilayer body composed of a plurality of insulating layers is known as a kind of multilayer electronic component. For example, Patent Document 1 below discloses a multilayer coil component in which an electrode is provided on the bottom surface (surface on the mounting substrate side) of a multilayer body on which a coil is formed.

Japanese Patent No. 5229305

  One type of laminated coil component is a composite component (LC composite component) in which a capacitor is further formed inside the laminate. Such an attenuation characteristic of the LC composite component can be adjusted by a capacitance (so-called parasitic capacitance) other than the capacitance of the capacitor.

  However, it is not easy to add a parasitic capacitance that is large enough to adjust the attenuation characteristic. In particular, when the component size is reduced, it becomes more difficult to form the parasitic capacitance.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a laminated coil component capable of adjusting the damping characteristics.

  A multilayer coil component according to an aspect of the present invention includes a multilayer body in which a plurality of insulating layers are stacked and having a bottom surface perpendicular to the stacking direction, and a plurality of internal electrodes interposed between the plurality of insulating layers. A plurality of internal electrodes and a bottom electrode formed on the bottom surface of the laminate and made of an electrode material containing glass, and the bottom electrode and the internal electrodes overlap at least partially in the stacking direction. .

  In such a laminated coil component, the bottom electrode and the internal electrode are at least partially overlapped, and a parasitic capacitance is formed in the overlap region. In this overlapping region, the glass component contained in the electrode material of the bottom electrode diffuses to increase the dielectric constant, thereby obtaining a high parasitic capacitance. That is, the parasitic capacitance is formed in the superposed region, so that the attenuation characteristic of the laminated coil component can be adjusted.

  Further, the coil and the capacitor may be arranged along the stacking direction, the capacitor may be positioned on the bottom surface side, and the bottom electrode may be opposed to the internal electrode constituting the capacitor. Compared to the internal electrode of the coil, the internal electrode of the capacitor has a larger formation area, so the opposing area can be designed wider by making the internal electrode and the bottom electrode of the capacitor face each other, increasing the parasitic capacitance. Can do.

  Moreover, the aspect whose glass contained in the electrode material of a bottom electrode is boron-type glass may be sufficient. Boron-based glass has a low softening temperature and is suitable for enhancing the sinterability of the laminate.

  According to one aspect and various embodiments of the present invention, a laminated coil component capable of adjusting a damping characteristic is provided.

It is a schematic perspective view of the laminated coil component which concerns on one Embodiment. It is the II-II sectional view taken on the line of the laminated coil component shown in FIG. FIG. 2 is a plan view of the laminated coil component shown in FIG. 1. It is a disassembled perspective view which shows the layer structure of the laminated body of the laminated coil component shown in FIG. It is the figure which showed the equivalent circuit of the laminated coil component shown in FIG.

  Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  A laminated coil component 1 shown in FIGS. 1, 2, and 3 is an electronic component that functions as an LC filter that is a kind of LC composite component. More specifically, the laminated coil component 1 is a three-terminal low-pass filter.

  The laminated coil component 1 includes a laminated body 10 having a rectangular parallelepiped shape, a pair of external electrode terminals 20 provided on opposite end surfaces 10a of the laminated body 10, and a pair of bottom faces provided on a bottom surface 10c of the laminated body 10. An electrode 25 and a pair of ground electrode terminals 30 provided on the opposite side surface 10b of the multilayer body 10 are provided. 1 to 3 are illustrated with the laminated coil component 1 turned upside down so that the state of the bottom surface 10c can be clearly understood. Are appropriately reversed so that the bottom surface 10c faces the mounting surface of the substrate.

  The laminated body 10 has a configuration in which a plurality of insulating layers are laminated, and the coil 40 and the capacitor 50 are formed by a predetermined internal electrode pattern formed between the insulating layers. The material constituting the insulating layer of the laminate is, for example, a forsterite dielectric or a titanium oxide composite dielectric, and the material constituting the internal electrode pattern is, for example, silver or copper.

  The coil 40 is composed of two coils 41 and 42, and these coils 41 and 42 are perpendicular to the stacking direction of the laminate 10 (the vertical direction in FIG. 2) (that is, the insulating layer extends). In the existing direction). The coil axes of the coils 41 and 42 are parallel to the stacking direction of the stacked body 10.

  The capacitor 50 is formed to overlap the coil 40 in the vertical direction in the stacking direction of the stacked body 10. More specifically, the capacitor 50 is located closer to the bottom surface 10 c of the multilayer body 10 than the coil 40.

  The external electrode terminal 20 and the ground electrode terminal 30 are formed by baking (for example, 600 to 700 ° C.) an electrode material on the end face and side face of the multilayer body 10. The material constituting the external electrode terminal 20 and the ground electrode terminal 30 is, for example, silver or copper. Each terminal of the external electrode terminal 20 and the ground electrode terminal 30 partially wraps around from the end surface 10a side of the laminate 10 to the bottom surface 10c side and the top surface 10d side.

  The bottom electrode 25 is formed by pattern forming of an electrode material, similarly to the internal electrode pattern described later. Of the pair of bottom electrodes 25, one bottom electrode 25A is in contact with the corresponding one of the external electrode terminals 20A, and the other bottom electrode 25B is in contact with and the other corresponding external electrode terminal 20B. Yes.

  Hereinafter, the internal electrode pattern formed between the insulating layers will be described in more detail with reference to FIG.

  As shown in FIG. 4, the laminated body 10 is configured by laminating a plurality of rectangular insulating layers L1 to L13 having substantially the same dimensions. More specifically, the layer structure of the laminated body 10 is, in order from the bottom, the outermost insulating layer L1, the coil layers L2 to L5, the via connection layers L6 and L7, the capacitor layers L8 to L12, and the outermost insulating layer L13. It has a layer structure in which are stacked. In FIG. 4, broken lines extending vertically indicate the connection relationship between internal electrode patterns that overlap vertically, and these connections are realized by vias (not shown) that penetrate the insulating layer.

  The outermost insulating layer L1 is a layer in which insulating layers composed of a plurality of layers (three layers in FIG. 4) are stacked.

  Coil patterns P2 to P5 constituting the coil 40 described above are formed on each of the coil layers L2 to L5.

  The coil pattern P2 includes a pair of coil patterns (a first coil pattern P21 and a second coil pattern P22), and the first coil pattern P21 and the second coil pattern P22 are arranged in the longitudinal direction of the insulating layer L3. Along each other, they are separated by a predetermined distance. The first coil pattern P21 is formed over the entire region of the one side region in the longitudinal direction of the insulating layer L3, and the second coil pattern P22 extends over the entire region of the other side region in the longitudinal direction of the insulating layer L2. Is formed. And the 1st coil pattern P21 and the 2nd coil pattern P22 form the non-pattern area | region extended in a straight line along the transversal direction of the insulating layer L2 in the intermediate position regarding the long side direction of the insulating layer L2. So that they are separated. One end of each coil pattern P21, P22 extends to the short side of the insulating layer L2, is exposed at the end face 10a of the laminate 10, and is connected to the external electrode terminal 20 described above.

  Similarly to the coil pattern P2, the coil pattern P3 also includes a pair of coil patterns (a first coil pattern P31 and a second coil pattern P32). The formation area of the first coil pattern P31 substantially overlaps the formation area of the first coil pattern P21 of the coil pattern P2, and the formation area of the second coil pattern P32 is the second coil of the coil pattern P2. It substantially overlaps with the formation region of the pattern P22. Also in the coil pattern P3, the first coil pattern P31 and the second coil pattern P32 are arranged at a predetermined distance along the longitudinal direction of the insulating layer L3, thereby forming the non-pattern region.

  Similarly to the coil patterns P2 and P3, the coil pattern P4 also includes a pair of coil patterns (a first coil pattern P41 and a second coil pattern P42). The formation region of the first coil pattern P41 substantially overlaps the formation region of the first coil patterns P21 and P31 of the coil patterns P2 and P3, and the formation region of the second coil pattern P42 is the coil pattern 2, 3 substantially overlaps with the formation region of the second coil patterns P22 and P32. Also in the coil pattern P4, the first coil pattern P41 and the second coil pattern P42 are arranged at a predetermined distance along the longitudinal direction of the insulating layer L4 to form the non-pattern region.

  The coil pattern P5 includes a pair of coil patterns (a first coil pattern P51 and a second coil pattern P52) and a coil connection pattern P53. The first coil pattern P51 and the second coil pattern P52 are: They are arranged along the longitudinal direction of the insulating layer L5, and are electrically connected via a coil connection pattern P53 located substantially at the center of the insulating layer L5.

  The first coil patterns P21, P31, P41, and P51 of the coil patterns P2 to P5 are connected with respect to the stacking direction via vias (not shown), whereby the coil 41 described above is configured. Similarly, the above-described coil 42 is configured by connecting the second coil patterns P22, P32, P42, and P52 of the coil patterns P2 to P5 with respect to the stacking direction via vias (not shown).

  In the via connection layers L6 and L7, via patterns P6 and P7 are formed at the center position of the insulating layer, that is, the position overlapping the coil connection pattern P53 of the coil pattern P5. These via patterns P6 and P7 are electrically connected to the coil connection pattern P53 of the coil pattern P5 by vias not shown.

  In each of the capacitor layers L8 to L12, capacitor patterns P8 to P12 that form the above-described capacitor 50 and extend over substantially the entire area of the insulating layer are formed. The capacitor patterns P8 to P12 arranged in the stacking direction of the stacked body 10 are electrically connected as appropriate by vias (not shown).

  The capacitor pattern P8 includes a counter electrode pattern P81 and a via pattern P82. The counter electrode pattern P81 is formed over substantially the entire area of the insulating layer L8. Further, a part of the counter electrode pattern P81 extends to the end portion on the long side at the middle position of the long side of the insulating layer L8, is exposed to the side surface 10b of the stacked body 10, and is connected to the ground electrode terminal 30 described above. The The via pattern P82 is formed at the center position of the insulating layer, that is, the position overlapping the coil connection pattern P53 of the coil pattern P5. The via pattern P82 is electrically insulated from the counter electrode pattern P81 by a non-pattern region formed around the via pattern P82.

  The capacitor pattern P9 is configured only by the counter electrode pattern facing the counter electrode pattern P81 of the capacitor pattern P8 described above.

  The capacitor pattern P10 includes a counter electrode pattern P101 and a via pattern P102. The capacitor pattern P10 is the same pattern as the capacitor pattern P8, and the counter electrode pattern P101 and the via pattern P102 of the capacitor pattern P10 correspond to the counter electrode pattern P81 and the via pattern P82 of the capacitor pattern P8, respectively. That is, also in the capacitor pattern P10, a part of the counter electrode pattern P101 extends to the end of the long side at the middle position of the long side of the insulating layer L10 and is exposed to the side surface 10b of the multilayer body 10, and the above-described ground Connected to the electrode terminal 30.

  The capacitor pattern P11 is composed only of the counter electrode pattern facing the counter electrode pattern P101 of the capacitor pattern P10 described above.

  The capacitor pattern P12 includes only a counter electrode pattern, and this counter electrode pattern is formed over substantially the entire area of the insulating layer L12. A part of the capacitor pattern P12 extends to the end of the long side at the middle position of the long side of the insulating layer L12, is exposed on the side surface 10b of the multilayer body 10, and is connected to the ground electrode terminal 30 described above.

  Like the outermost insulating layer L1, the outermost insulating layer L13 is a layer in which insulating layers composed of a plurality of layers (three layers in FIG. 4) are stacked. A pair of bottom electrode patterns P13 (bottom electrode patterns P131 and P132) is formed on the outermost insulating layer of the outermost insulating layer L13. The insulating layer L13 is formed over the entire region on one side in the longitudinal direction.

  The electrode material used for the bottom electrode pattern P13 is different from the electrode material used for the electrode patterns P2 to P12 described above, and is made of an electrode material containing glass. As an example, silver or copper can be adopted as an electrode material used for the bottom electrode pattern P13.

  The bottom electrode pattern P13 partially overlaps the capacitor pattern P12 of the insulating layer L12 constituting the capacitor 50. As a result, as shown in FIG. 2, a parasitic capacitance region 27 is formed in the overlapping region between the bottom electrode pattern P13 and the capacitor pattern P12.

  Therefore, the equivalent circuit of the laminated coil component 1 includes a capacitance corresponding to the parasitic capacitance region 27 in addition to the coil 40 and the capacitor 50 as shown in FIG. In FIG. 5, “IN / OUT” indicates connection to each external electrode terminal 20, and “GND” indicates connection to each ground electrode terminal 30.

  In the parasitic capacitance region 27, when the laminate 10 in which the insulating layers L1 to L13 are stacked is fired (for example, 850 to 960 ° C.), the glass component (that is, the glass component contained in the electrode material of the bottom electrode pattern P13 (that is, Diffuses low melting point oxides such as boron). The diffusion promotes the grain growth of the insulating material constituting the insulating layer and improves the density (decreases the porous property), thereby realizing a high dielectric constant in the parasitic capacitance region 27.

  As described above, in the laminated coil component 1 described above, the laminated body 10 in which the insulating layers L1 to L13 are laminated, the plurality of internal electrode patterns P2 to P12 interposed between the plurality of insulating layers, and the laminated body 10 A bottom electrode 25 formed of an electrode material including glass and formed on the bottom surface 10c. In the stacking direction, the bottom electrode 25 and the internal electrode pattern P12 at least partially overlap each other, whereby the parasitic capacitance region 27 is formed. Is formed.

  In the parasitic capacitance region 27, the dielectric constant is increased by diffusing the glass component contained in the electrode material of the bottom electrode 25, and a high parasitic capacitance is obtained. That is, adjustment of the attenuation characteristic of the multilayer coil component 1 is realized by forming a parasitic capacitance in the parasitic capacitance region 27.

  Further, the bottom electrode 25 faces the internal electrode pattern P12 constituting the capacitor 50, and as shown in FIG. 4, the internal electrodes P8 to P12 of the capacitor 50 are compared with the internal electrode patterns P2 to P5 of the coil 40. Since the formation region is wider, the opposing area can be designed wider by making the internal electrode pattern of the capacitor 50 and the bottom electrode 25 face each other, and the parasitic capacitance can be further increased.

  Furthermore, since the glass contained in the electrode material of the bottom electrode is boron-based glass, the softening temperature is low, which is suitable for enhancing the sinterability of the laminate.

  In addition, this invention is not limited to embodiment mentioned above, In the range which does not deviate from the summary of this invention, it can change variously.

  For example, the shape of the bottom electrode pattern and the shape of the internal electrode pattern can be appropriately changed as long as the parasitic capacitance region is formed. Further, the number of coils arranged in parallel in the laminated body is not limited to two, and may be one or three or more. Furthermore, the number of insulating layers constituting the stacked body can be changed as appropriate.

  DESCRIPTION OF SYMBOLS 1 ... Laminated coil component, 10 ... Laminated body, 20 ... External electrode terminal, 25 ... Bottom electrode, 40 ... Coil, 50 ... Capacitor, L1-L13 ... Insulating layer, P2-P5 ... Coil pattern, P8-P12 ... Capacitor pattern .

Claims (3)

A laminate in which a plurality of insulating layers are laminated, and has a bottom surface orthogonal to the lamination direction and an end face extending along the lamination direction ;
A plurality of internal electrodes interposed between the plurality of insulating layers, constituting a coil and a capacitor, and a plurality of internal electrodes in which a part of the internal electrodes are exposed on an end surface of the laminate;
An external electrode terminal formed on an end surface of the laminate and connected to the internal electrode exposed on the end surface;
Formed on the bottom surface of the laminate, not connected to the internal electrode, electrically connected to the external electrode terminal, and comprises a bottom electrode made of an electrode material containing glass,
A laminated coil component in which the bottom electrode and the internal electrode are at least partially overlapped in the lamination direction. The coil and the capacitor are aligned along the stacking direction, and the capacitor is located on the bottom side,
The multilayer coil component according to claim 1, wherein the bottom electrode is opposed to the internal electrode constituting the capacitor.   The laminated coil component according to claim 1 or 2, wherein the glass contained in the electrode material of the bottom electrode is boron-based glass.

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