JPH0878284A - Composite electronic device and its production - Google Patents
Composite electronic device and its productionInfo
- Publication number
- JPH0878284A JPH0878284A JP6207294A JP20729494A JPH0878284A JP H0878284 A JPH0878284 A JP H0878284A JP 6207294 A JP6207294 A JP 6207294A JP 20729494 A JP20729494 A JP 20729494A JP H0878284 A JPH0878284 A JP H0878284A
- Authority
- JP
- Japan
- Prior art keywords
- composite electronic
- electronic component
- glass
- sintered body
- glass powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、磁性体と誘電体を一
体焼成した複合電子部品とその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component in which a magnetic material and a dielectric material are integrally fired and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来よりＮｉ−Ｚｎフェライト等の磁性
体とチタン酸ジルコン酸鉛等の誘電体を、印刷法やドク
ターブレード法等により成形したシートに、Ａｇまたは
Ａｇ−Ｐｄ等の所要の内部電極を形成し、このシートを
積層一体化して形成した複合電子部品がある。2. Description of the Related Art Conventionally, a magnetic material such as Ni-Zn ferrite and a dielectric material such as lead zirconate titanate are molded into a sheet by a printing method, a doctor blade method or the like, and a required internal material such as Ag or Ag-Pd is formed. There is a composite electronic component formed by forming electrodes and laminating and integrating these sheets.
【０００３】[0003]
【発明が解決しようとする課題】磁性体と誘電体を一体
焼成した複合電子部品は、磁性体、誘電体をそれぞれ別
々に単体で焼成したものよりも焼結密度が低く、ポーラ
スになる。つまり、異なる磁器材質を焼成において一体
化する場合、異なる材質の磁器の焼結性を合致させて、
緻密な焼結体を得ることは非常に困難であった。The composite electronic component in which the magnetic substance and the dielectric substance are integrally fired has a lower sintering density and becomes porous than those obtained by firing the magnetic substance and the dielectric substance separately. In other words, when different porcelain materials are integrated during firing, the sinterability of different porcelain materials should be matched,
It was very difficult to obtain a dense sintered body.
【０００４】その理由として磁性体と誘電体の熱膨張率
の差によることと、相互拡散による焼結性の変化が挙げ
られる。このため焼結体の吸水性が大きくなり、耐湿負
荷試験における絶縁抵抗劣化がおこり、複合電子部品の
寿命が短いという問題があった。The reason for this is due to the difference in the coefficient of thermal expansion between the magnetic substance and the dielectric substance and the change in sinterability due to mutual diffusion. As a result, the water absorbency of the sintered body is increased, the insulation resistance is deteriorated in the moisture resistance load test, and there is a problem that the life of the composite electronic component is short.
【０００５】この発明の目的は、磁性体と誘電体を一体
焼成する複合電子部品において、焼結密度の低下による
内部のポーラス化を防ぎ、耐湿負荷試験による信頼性の
低下を防ぐ、複合電子部品とその製造方法を提供するこ
とである。An object of the present invention is to provide a composite electronic component in which a magnetic material and a dielectric material are integrally fired, which prevents the inside from becoming porous due to a decrease in sintering density and prevents the reliability from being deteriorated due to a moisture resistance load test. And a method of manufacturing the same.
【０００６】[0006]
【課題を解決するための手段】請求項１に係る発明は、
磁性体と誘電体を積層し焼成して一体化した焼結体の表
面および内部にガラスを拡散させた複合電子部品であ
る。The invention according to claim 1 is
This is a composite electronic component in which glass is diffused on the surface and inside of a sintered body in which a magnetic material and a dielectric material are laminated, fired and integrated.
【０００７】請求項２に係る発明は、磁性体と誘電体を
積層し焼成して一体化した焼結体の表面および内部にガ
ラスおよび雰囲気調節剤を拡散させた複合電子部品であ
る。According to a second aspect of the present invention, there is provided a composite electronic component in which glass and an atmosphere control agent are diffused on the surface and inside of a sintered body in which a magnetic material and a dielectric material are laminated, fired and integrated.
【０００８】請求項３に係る発明は、ガラス粉末は、ホ
ウケイ酸系ガラス、ホウ酸系ガラス、ケイ酸系ガラス、
あるいはそれらの複合物である複合電子部品である。In the invention according to claim 3, the glass powder is borosilicate glass, boric acid glass, silicate glass,
Alternatively, it is a composite electronic component that is a composite of them.
【０００９】請求項４に係る発明は、雰囲気調節剤は、
ジルコニア、アルミナ、磁性体材料あるいは磁性体材料
を構成する化合物の少なくとも１種、誘電体材料あるい
は誘電体材料を構成する化合物の少なくとも１種、およ
びそれらの複合物のうちいずれかである複合電子部品で
ある。In the invention according to claim 4, the atmosphere control agent is
Zirconia, alumina, at least one compound forming a magnetic material or a magnetic material, at least one compound forming a dielectric material or a dielectric material, and a composite electronic component thereof. Is.
【００１０】請求項５に係る発明は、ガラス粉末の添加
量が、前記焼結体に対して、５wt％以下（ただし、０wt
％は含まない）からなる複合電子部品である。In the invention according to claim 5, the addition amount of the glass powder is 5 wt% or less (however, 0 wt% based on the sintered body).
% Is not included) is a composite electronic component.
【００１１】請求項６に係る発明は、磁性体と誘電体を
接合し、一体焼成した焼結体からなる複合電子部品とガ
ラス粉末を、撹拌しながら熱処理する複合電子部品の製
造方法である。According to a sixth aspect of the present invention, there is provided a method of manufacturing a composite electronic component, in which a magnetic material and a dielectric material are joined together, and a composite electronic component made of a sintered body integrally fired and a glass powder are heat treated while being stirred.
【００１２】請求項７に係る発明は、磁性体と誘電体を
接合し、一体焼成した焼結体からなる複合電子部品とガ
ラス粉末および雰囲気調節剤粉末を、撹拌しながら熱処
理する複合電子部品の製造方法である。According to a seventh aspect of the present invention, there is provided a composite electronic component in which a magnetic material and a dielectric material are joined and integrally sintered, and the composite electronic component and the glass powder and the atmosphere modifier powder are heat treated while stirring. It is a manufacturing method.
【００１３】請求項８に係る発明は、ガラス粉末が、ホ
ウケイ酸系ガラス、ホウ酸系ガラス、ケイ酸系ガラス、
あるいはそれらの複合物である複合電子部品の製造方法
である。In the invention according to claim 8, the glass powder is borosilicate glass, boric acid glass, silicate glass,
Alternatively, it is a method for manufacturing a composite electronic component which is a composite of those.
【００１４】請求項９に係る発明は、雰囲気調節剤が、
ジルコニア、アルミナ、磁性体材料あるいは磁性体材料
を構成する化合物の少なくとも１種、誘電体材料あるい
は誘電体材料を構成する化合物の少なくとも１種、およ
びそれらの複合物のうちいずれかである複合電子部品の
製造方法である。In the invention according to claim 9, the atmosphere control agent is
Zirconia, alumina, at least one compound forming a magnetic material or a magnetic material, at least one compound forming a dielectric material or a dielectric material, and a composite electronic component thereof. Is a manufacturing method.
【００１５】請求項１０に係る発明は、熱処理時のガラ
ス粉末の添加量が、前記焼結体に対して、５wt％以下
（ただし、０wt％は含まない）からなる複合電子部品の
製造方法である。According to a tenth aspect of the present invention, there is provided a method of manufacturing a composite electronic component, wherein the amount of glass powder added during heat treatment is 5 wt% or less (not including 0 wt%) with respect to the sintered body. is there.
【００１６】上記組成範囲内に限定したのは、下記の理
由による。ガラス粉末は、焼結体の耐湿負荷試験におけ
る絶縁抵抗劣化と電気的特性に関係し、添加しなければ
耐湿負荷試験時の絶縁抵抗劣化時間が短く、信頼性に劣
る。また、５wt％を越えると焼結体中に内部電極が存在
する場合、この内部電極と外部電極との接続性が悪くな
り、インダクタンス値も容量値も低下する。The reason why the above composition range is limited is as follows. The glass powder is related to the insulation resistance deterioration and electric characteristics of the sintered body in the humidity resistance load test, and unless added, the insulation resistance deterioration time in the humidity resistance load test is short and the reliability is poor. On the other hand, if it exceeds 5 wt%, if the internal electrode exists in the sintered body, the connectivity between the internal electrode and the external electrode deteriorates, and the inductance value and the capacitance value decrease.
【００１７】雰囲気調節剤は、焼結体内の元素あるいは
ガラス粉末の拡散、付着の補助、焼結体の特性改善、撹
拌熱処理時の焼結体からの成分蒸発抑制、撹拌熱処理時
の流動性の向上に関与するものであり、添加の上限は特
に限定されるものではなく、焼結体の特性に悪影響を与
えない量、具体的な値としては焼結体に対して２００wt
％、３００wt％等、実用的には５０wt％ぐらいまでが適
当量である。The atmosphere control agent is used to diffuse and adhere elements or glass powder in the sintered body, improve adhesion of the sintered body, suppress evaporation of components from the sintered body during stirring heat treatment, and improve fluidity during stirring heat treatment. The upper limit of the addition is not particularly limited, as long as it is related to the improvement and does not adversely affect the characteristics of the sintered body.
%, 300 wt%, and the like, practically up to about 50 wt% are suitable amounts.
【００１８】[0018]
【作用】この発明の複合電子部品によれば、ガラス粉末
あるいはガラス粉末と雰囲気調節剤が焼結体の表面を覆
うため、吸水率が低下し、耐湿負荷試験における絶縁抵
抗劣化が起こらない。According to the composite electronic component of the present invention, since the glass powder or the glass powder and the atmosphere modifier cover the surface of the sintered body, the water absorption rate is lowered and the insulation resistance is not deteriorated in the humidity resistance load test.
【００１９】また、この発明の複合電子部品の製造方法
によれば、焼結体内にガラス粉末あるいはガラス粉末と
雰囲気調節剤が拡散することから、焼結体の粒成長の促
進を助け、焼結体内のポーラス化がなくなり、複合電子
部品の特性値の向上と耐湿負荷試験後の絶縁抵抗劣化が
ない。Further, according to the method for manufacturing a composite electronic component of the present invention, since the glass powder or the glass powder and the atmosphere control agent are diffused in the sintered body, the sintering is assisted by promoting the grain growth. No porosity in the body, improvement of characteristic values of composite electronic parts and deterioration of insulation resistance after humidity resistance load test.
【００２０】[0020]
【実施例】この発明の実施例を下記に説明する。この発
明の複合電子部品のより詳細な構成を、その製造方法と
ともに以下に説明する。図２は、この発明の実施例にか
かる複合電子部品を示す外観斜視図である。複合電子部
品は、磁性体層１と、誘電体層２とを積層してなる積層
体を用いて構成されている。磁性体層１内には、後述の
インダクタ部が、誘電体層２内には、後述のコンデンサ
部が構成されている。また、積層体の外表面には、第１
の外部電極４、５及び第２の外部電極６、７が形成され
ている。Embodiments of the present invention will be described below. A more detailed structure of the composite electronic component of the present invention will be described below together with its manufacturing method. FIG. 2 is an external perspective view showing a composite electronic component according to an embodiment of the present invention. The composite electronic component is configured using a laminated body formed by laminating the magnetic layer 1 and the dielectric layer 2. The magnetic layer 1 has an inductor section described later, and the dielectric layer 2 has a capacitor section described later. Further, the outer surface of the laminate has a first
External electrodes 4, 5 and second external electrodes 6, 7 are formed.
【００２１】図３は、グリーンシート法による積層体の
積層前の分解斜視図である。Ｎｉ−Ｚｎ−Ｃｕフェライ
トからなる磁性体シート１ａ、１ｂ、１ｃと、Ｐｂ系複
合ペロブスカイトからなる誘電体シート２ａ、２ｂは次
のように準備される。つまり、各セラミック粉末にバイ
ンダと溶剤を添加して混合した各スラリーから磁性体シ
ートと誘電体シートをそれぞれ成形し、積層し、一体焼
成することにより構成されている。シート枚数は５枚に
限らず任意である。FIG. 3 is an exploded perspective view of the laminated body before the lamination by the green sheet method. The magnetic sheets 1a, 1b, 1c made of Ni-Zn-Cu ferrite and the dielectric sheets 2a, 2b made of Pb-based composite perovskite are prepared as follows. That is, the magnetic sheet and the dielectric sheet are formed from the respective slurry obtained by adding the binder and the solvent to the respective ceramic powders and mixed, laminated, and integrally fired. The number of sheets is not limited to five and is arbitrary.
【００２２】磁性体シート１ｂ上には、コイルとなるた
めの帯状導体路の内部導体パターン３ａが形成されてお
り、また、誘電体シート２ａ、２ｂ上には、それぞれ、
容量を取り出すための容量電極の内部導体パターン３
ｂ、３ｃが形成されている。これら内部導体パターン３
ａ、３ｂ、３ｃは、銀−パラジウムを主成分とするペー
ストで印刷により形成されている。内部導体パターン３
ａ、３ｂ、３ｃは一例であり、コイル用に内部導体パタ
ーン３ａはスパイラル状やスルーホールを介してコイル
状となるものでもよいし、容量電極の内部導体パターン
３ｂ、３ｃも電極間で容量が取れるようなパターン形状
であれば図のようなものに限らない。An internal conductor pattern 3a of a strip-shaped conductor path for forming a coil is formed on the magnetic sheet 1b, and on the dielectric sheets 2a and 2b, respectively.
Internal conductor pattern 3 of capacitance electrode for taking out capacitance
b, 3c are formed. These internal conductor patterns 3
a, 3b, and 3c are formed by printing with a paste containing silver-palladium as a main component. Inner conductor pattern 3
a, 3b, 3c are examples, and the internal conductor pattern 3a for the coil may have a spiral shape or a coil shape via a through hole, and the internal conductor patterns 3b, 3c of the capacitor electrodes also have a capacitance between the electrodes. The pattern shape is not limited to the one shown in the figure as long as it can be taken.
【００２３】上記のパターンを形成された磁性体シート
１ａ、１ｂ、１ｃと誘電体シート２ａ、２ｂを積層し、
１０００kg／cm2の圧力で圧着し、所定の大きさ、例え
ば焼成後の形状が、４．５×３．２×１．２mmになるよ
うに切断した後、１０００℃で２時間、焼成して焼結体
が得られる。The magnetic sheets 1a, 1b, 1c having the above pattern and the dielectric sheets 2a, 2b are laminated,
After pressure bonding with a pressure of 1000 kg / cm 2 , cutting into a predetermined size, for example, the shape after firing is 4.5 × 3.2 × 1.2 mm, and then firing at 1000 ° C. for 2 hours. A sintered body is obtained.
【００２４】そしてこのようにして得られた焼結体と、
ホウケイ酸鉛ガラス粉末を焼結体に対して０〜１０wt％
と、雰囲気調節剤（ＰｂＯとジルコニアを１：１の割合
で混合したもの）を前記焼結体に対して５０wt％を、ア
ルミナの円筒容器に一緒に入れ、空気中で容器を回転さ
せながら７５０℃で１時間熱処理を行い、焼結体の外表
面にＡｇ含有ペーストを印刷し、８００℃、２０分間の
条件で焼き付けることにより外部電極を形成し、Ｌ型Ｌ
Ｃ複合電子部品が得られる。And the sintered body thus obtained,
Lead borosilicate glass powder is 0-10wt% with respect to the sintered body
And 50% by weight of an atmosphere control agent (mixture of PbO and zirconia in a ratio of 1: 1) together with the sintered body in a cylindrical container of alumina, and 750 while rotating the container in air. Heat treatment is performed at ℃ for 1 hour, Ag-containing paste is printed on the outer surface of the sintered body, and the external electrode is formed by baking at 800 ℃ for 20 minutes.
C composite electronic parts are obtained.
【００２５】次に、この発明の複合電子部品のインダク
タンスＬ値と容量Ｃ値を測定し表１にその結果を示し
た。表１内の＊印はこの発明の範囲外、それ以外のもの
はこの発明の範囲内である。Next, the inductance L value and the capacitance C value of the composite electronic component of the present invention were measured, and the results are shown in Table 1. The asterisks in Table 1 are outside the scope of the present invention, and others are within the scope of the present invention.
【００２６】[0026]
【表１】 [Table 1]
【００２７】さらに、耐湿負荷試験として、温度４０
℃、湿度９５％、印加電圧５０Vの条件で行い、その結
果を図１に示す。図１の従来例とは熱処理を行わなかっ
た以外は実施例と同じ製造方法で得られた複合電子部品
である。Further, as a humidity resistance load test, a temperature of 40
The test was carried out under conditions of temperature, humidity 95% and applied voltage 50V, and the results are shown in FIG. The conventional example of FIG. 1 is a composite electronic component obtained by the same manufacturing method as that of the example except that no heat treatment is performed.
【００２８】図１は、絶縁抵抗ｌｏｇＩＲを縦軸に、耐
湿負荷試験の試験時間を横軸にとり、○は従来例、△は
ガラス添加量０wt％、□はガラス添加量１．５wt％、☆
はガラス添加量３．０wt％、▽はガラス添加量５．０wt
％である。未処理のＬＣ複合部品に対して処理をする
と、絶縁抵抗劣化が改善された。In FIG. 1, the insulation resistance logIR is plotted on the ordinate and the test time of the moisture resistance load test is plotted on the abscissa. ◯ is the conventional example, Δ is the glass addition amount of 0 wt%, □ is the glass addition amount of 1.5 wt%, and ☆.
Is 3.0 wt% of glass addition, ▽ is 5.0 wt% of glass addition
%. Treatment of untreated LC composite parts improved insulation resistance degradation.
【００２９】ガラス添加量が５wt％を越えると焼結体中
に内部電極が存在する場合、この内部電極と外部電極と
の接続性が悪くなり、インダクタンス値も容量値も低下
する。また、ガラス添加量を０〜５wt％変化させる間
に、Ｌ値およびＣ値を２０％調節することができた。If the amount of glass added exceeds 5 wt%, if the internal electrode exists in the sintered body, the connectivity between the internal electrode and the external electrode deteriorates, and the inductance value and the capacitance value decrease. Also, the L value and the C value could be adjusted by 20% while changing the glass addition amount by 0 to 5 wt%.
【００３０】なお、この発明に係る複合電子部品は上記
実施例に限定するものではなく、その要旨の範囲内で種
々に変形することができる。磁性体はＮｉ−Ｃｕ系、Ｍ
ｎ−Ｚｎ系、Ｎｉ−Ｚｎ系、Ｃｕ−Ｚｎ系等の各種のフ
ェライトの内の適宜のものを用いても良い。誘電体は鉛
系複合ペロブスカイトに限らず、酸化チタン系、チタン
酸系複合酸化物、ジルコン酸系複合酸化物、あるいはこ
れらの混合物を用いることができる。The composite electronic component according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist thereof. Magnetic material is Ni-Cu system, M
An appropriate one of various ferrites such as n-Zn type, Ni-Zn type, and Cu-Zn type may be used. The dielectric is not limited to the lead-based composite perovskite, and titanium oxide-based, titanic acid-based composite oxide, zirconate-based composite oxide, or a mixture thereof can be used.
【００３１】具体的には、酸化チタン系としては、必要
に応じＮｉＯ、ＣｕＯ、Ｍｎ3Ｏ4、Ａｌ2Ｏ3、ＭｇＯ、
ＳｉＯ2等を含むＴｉＯ2等が、チタン酸系複合酸化物と
しては、ＢａＴｉＯ3、ＳｒＴｉＯ3、ＣａＴｉＯ3、Ｍ
ｇＴｉＯ3やこれらの混合物等が、ジルコン酸系複合酸
化物としては、ＢａＺｒＯ3、ＳｒＺｒＯ3、ＣａＺｒＯ
3、ＭｇＺｒＯ3やこれらの混合物等が挙げられる。Concretely, as the titanium oxide type, NiO, CuO, Mn 3 O 4 , Al 2 O 3 , MgO,
TiO 2 and the like including SiO 2 and the like can be used as titanic acid-based composite oxides such as BaTiO 3 , SrTiO 3 , CaTiO 3 , and M.
Examples of zirconic acid-based composite oxides such as gTiO 3 and mixtures thereof include BaZrO 3 , SrZrO 3 , and CaZrO.
3 , MgZrO 3 and mixtures thereof.
【００３２】磁性体、誘電体のシートの形成方法は押し
出し法、印刷法、シート法等の内の適宜のものを用いれ
ば良い。内部電極および外部電極は、Ａｇ、Ａｇ−Ｐ
ｄ、Ｃｕ等あるいはそれらの合金を塗布、印刷またはス
パッタリング等により形成してもよい。As a method for forming the magnetic material sheet and the dielectric material sheet, an appropriate method such as an extrusion method, a printing method and a sheet method may be used. Inner electrode and outer electrode are Ag, Ag-P
You may form d, Cu, etc., or those alloys by coating, printing, sputtering, etc.
【００３３】この発明のガラスとしては実施例のホウケ
イ酸鉛ガラスの他に、ホウケイ酸系ガラスとしてホウケ
イ酸亜鉛ガラス、ホウケイ酸ビスマスガラスを用いても
良い。その他に、ホウ酸系ガラス、ケイ酸系ガラスがあ
る。また、ホウケイ酸系ガラス、ホウ酸系ガラス、ケイ
酸系ガラスに添加物としてアルカリ金属、アルカリ土類
金属あるいは４族、５族の金属酸化物を含むガラスを用
いても良い。As the glass of the present invention, in addition to the lead borosilicate glass of the embodiment, zinc borosilicate glass or bismuth borosilicate glass may be used as the borosilicate glass. In addition, there are boric acid type glass and silicic acid type glass. Further, borosilicate glass, boric acid glass, and glass containing silicic acid glass containing an alkali metal, an alkaline earth metal, or a metal oxide of Group 4 or Group 5 as an additive may be used.
【００３４】また、雰囲気調節剤は、加熱処理に介在す
る元素の拡散調節および接合、焼結の促進を目的とした
化学的機能と加熱混合時のチップ、ガラス等の流動およ
び均一分散を目的とした物理的機能を有したものであ
り、１種類もしくはそれ以上の混合物または化合物から
なる。雰囲気調節剤の具体例としては、そのうち、化学
的機能を有する物として、誘電体、磁性体及びその構成
元素及びそれらを含む混合物、化合物、また、物理的機
能を有する物として、ジルコニア、アルミナ、磁性体材
料あるいは磁性体材料を構成する化合物の少なくとも１
種、誘電体材料あるいは誘電体材料を構成する化合物の
少なくとも１種、およびそれらの元素およびそれらを含
む混合物、化合物、複合物がある。The atmosphere control agent has a chemical function for the purpose of diffusion control and bonding of elements intervening in heat treatment, and promotion of sintering, and the purpose of fluidizing and evenly dispersing chips, glass and the like during heating and mixing. It has the above-mentioned physical function and is composed of a mixture or compound of one or more kinds. Specific examples of the atmosphere modifier, among them, as a substance having a chemical function, a dielectric, a magnetic substance and a mixture and compound containing them and their constituent elements, and as a substance having a physical function, zirconia, alumina, At least one of magnetic materials or compounds constituting the magnetic materials
There are at least one kind of a species, a dielectric material or a compound constituting the dielectric material, and an element and a mixture, a compound or a composite containing them.
【００３５】また、ガラス粉末や雰囲気調節剤の添加量
は焼結体の組成によって変化するものであり、特に、雰
囲気調節剤は、焼結体によって添加しないものもある。
この実施例では、焼結体に対して５０wt％添加している
が、流動性及び焼結体からの成分の蒸発拡散制御が最も
良くなったためである。The amount of the glass powder or atmosphere modifier added varies depending on the composition of the sintered body, and in particular, the atmosphere modifier may not be added depending on the sintered body.
In this example, 50 wt% was added to the sintered body, but this is because the fluidity and the evaporation and diffusion control of the components from the sintered body were the best.
【００３６】第１、第２の外部電極の形成は、導電ペー
ストの塗布焼き付け、メッキまたはスパッタリング等に
より行ってもよい。The first and second external electrodes may be formed by coating and baking a conductive paste, plating or sputtering.
【００３７】この発明の複合電子部品は、上記したＬＣ
複合部品の他に、例えば、インダクタとコンデンサを有
する積層混成集積回路素子（ＭＨＰ）が含まれる。積層
混成集積回路素子（ＭＨＰ）は、例えば、上記ＬＣ複合
部品上に抵抗体、コンデンサ、ＩＣ等を載せたものであ
る。また前述したＬＣを有する複合電子部品で有れば、
どのような構成のものであってもこの発明を適用するこ
とができる。The composite electronic component of the present invention is the above-mentioned LC.
In addition to the composite component, for example, a multilayer hybrid integrated circuit element (MHP) having an inductor and a capacitor is included. The multilayer hybrid integrated circuit element (MHP) is, for example, one in which a resistor, a capacitor, an IC and the like are mounted on the above LC composite component. Further, if it is a composite electronic component having the above-mentioned LC,
The present invention can be applied to any structure.
【００３８】[0038]
【発明の効果】この発明の複合電子部品は、ガラス粉末
あるいはガラス粉末と雰囲気調節剤が焼結体の表面を覆
うため、吸水率が低下し、耐湿負荷試験における絶縁抵
抗劣化が起こらない。In the composite electronic component of the present invention, the glass powder or the glass powder and the atmosphere control agent cover the surface of the sintered body, so that the water absorption rate is lowered and the insulation resistance is not deteriorated in the moisture resistance load test.
【００３９】また、焼結体内にもガラス粉末あるいはガ
ラス粉末と雰囲気調節剤が拡散することから、焼結体の
粒成長の促進を助け、焼結体内のポーラス化がなくな
り、複合電子部品の特性値の向上と耐湿負荷試験後の絶
縁抵抗劣化がない。Further, since the glass powder or the glass powder and the atmosphere controlling agent diffuse into the sintered body, it promotes the grain growth of the sintered body, the porous inside the sintered body disappears, and the characteristics of the composite electronic component are eliminated. No increase in value and no deterioration of insulation resistance after humidity resistance load test.
【００４０】さらに、この発明の製造方法によれば、ガ
ラス粉末あるいはガラス粉末と雰囲気調節剤を焼結体と
一緒に熱処理することにより、複合電子部品の表面をコ
ーティングするだけでなく、内部にも浸透して磁性体、
誘電体の焼結性を変化させ、吸水率を小さくする。その
ことにより、耐湿負荷試験時の信頼性が向上する。Further, according to the manufacturing method of the present invention, not only the surface of the composite electronic component is coated but also the inside of the composite electronic component is coated by heat treating the glass powder or the glass powder and the atmosphere modifier together with the sintered body. Penetrating magnetic material,
Change the sinterability of the dielectric and reduce the water absorption. As a result, the reliability in the moisture resistance load test is improved.
【図１】この発明の実施例にかかる複合電子部品のガラ
ス添加量による絶縁抵抗と耐湿負荷時間の関係を表して
いる。FIG. 1 shows the relationship between the insulation resistance and the moisture resistance load time depending on the glass addition amount of a composite electronic component according to an example of the present invention.
【図２】この発明の実施例にかかる複合電子部品を示す
外観斜視図であるFIG. 2 is an external perspective view showing a composite electronic component according to an embodiment of the present invention.
【図３】この発明の実施例にかかる複合電子部品を示す
分解斜視図であるFIG. 3 is an exploded perspective view showing a composite electronic component according to an embodiment of the present invention.
１ 磁性体層 １ａ，１ｂ，１ｃ 磁性体シート ２ 誘電体層 ２ａ，２ｂ 誘電体シート ３ａ，３ｂ，３ｃ 内部導体パターン ４，５ 第１外部電極 ６，７ 第２外部電極 1 Magnetic Layer 1a, 1b, 1c Magnetic Sheet 2 Dielectric Layer 2a, 2b Dielectric Sheet 3a, 3b, 3c Internal Conductor Pattern 4,5 First External Electrode 6,7 Second External Electrode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 河端 利夫 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 (72)発明者 森井 博史 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Kawabata 2 26-10 Tenjin Tenjin, Nagaokakyo, Kyoto Prefecture Murata Manufacturing Co., Ltd. (72) Inventor Hiroshi Morii 2 26-10 Tenjin Tenjin, Nagaokakyo, Kyoto Murata Manufacturing
Claims (10)
した焼結体の表面および内部にガラスを拡散させたこと
を特徴とする複合電子部品。1. A composite electronic component in which glass is diffused on the surface and inside of a sintered body obtained by laminating and firing a magnetic body and a dielectric body.
した焼結体の表面および内部にガラスおよび雰囲気調節
剤を拡散させたことを特徴とする複合電子部品。2. A composite electronic component in which glass and an atmosphere control agent are diffused on the surface and inside of a sintered body obtained by laminating and firing a magnetic body and a dielectric body.
ス、ホウ酸系ガラス、ケイ酸系ガラス、あるいはそれら
の複合物であることを特徴とする請求項１または請求項
２のいずれかに記載の複合電子部品。3. The glass powder according to claim 1, wherein the glass powder is borosilicate glass, boric acid glass, silicate glass, or a composite thereof. Composite electronic component.
ミナ、磁性体材料あるいは磁性体材料を構成する化合物
の少なくとも１種、誘電体材料あるいは誘電体材料を構
成する化合物の少なくとも１種および、それらの複合物
のうちいずれかであることを特徴とする請求項２または
請求項３のいずれかに記載の複合電子部品。4. The atmosphere control agent is zirconia, alumina, at least one kind of a magnetic material or a compound constituting the magnetic material, at least one kind of a dielectric material or a compound constituting the dielectric material, and a combination thereof. The composite electronic component according to claim 2 or 3, which is one of composites.
に対して、５wt％以下（ただし、０wt％は含まない）か
らなることを特徴とする請求項１、請求項２、請求項３
または請求項４のいずれかに記載の複合電子部品。5. The addition amount of the glass powder is 5 wt% or less (however, 0 wt% is not included) with respect to the sintered body, and the glass powder is added. Three
Alternatively, the composite electronic component according to claim 4.
焼結体からなる複合電子部品とガラス粉末を、撹拌しな
がら熱処理することを特徴とする複合電子部品の製造方
法。6. A method of manufacturing a composite electronic component, which comprises heat-treating a composite electronic component made of a sintered body obtained by joining a magnetic material and a dielectric material and integrally firing and glass powder while stirring.
焼結体からなる複合電子部品とガラス粉末および雰囲気
調節剤粉末を、撹拌しながら熱処理することを特徴とす
る請求項６に記載の複合電子部品の製造方法。7. The composite electronic component made of a sintered body obtained by joining a magnetic material and a dielectric material and integrally firing, glass powder and atmosphere modifier powder, and heat-treating with stirring. Manufacturing method of composite electronic component.
ス、ホウ酸系ガラス、ケイ酸系ガラス、あるいはそれら
の複合物であることを特徴とする請求項６または請求項
７のいずれかに記載の複合電子部品の製造方法。8. The glass powder according to claim 6, wherein the glass powder is borosilicate glass, boric acid glass, silicate glass, or a composite thereof. Manufacturing method of composite electronic component.
ミナ、磁性体材料あるいは磁性体材料を構成する化合物
の少なくとも１種、誘電体材料あるいは誘電体材料を構
成する化合物の少なくとも１種、およびそれらの複合物
のうちいずれかであることを特徴とする請求項７または
請求項８のいずれかに記載の複合電子部品の製造方法。9. The atmosphere control agent is zirconia, alumina, at least one kind of a magnetic material or a compound forming the magnetic material, at least one kind of a dielectric material or a compound forming the dielectric material, and a combination thereof. 9. The method for manufacturing a composite electronic component according to claim 7, which is one of composites.
は、前記焼結体に対して、５wt％以下（ただし、０wt％
は含まない）からなることを特徴とする請求項６、請求
項７、請求項８または請求項９のいずれかに記載の複合
電子部品の製造方法。10. The amount of glass powder added during the heat treatment is 5 wt% or less (however, 0 wt% relative to the sintered body).
The method for manufacturing a composite electronic component according to claim 6, claim 7, claim 8 or claim 9,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6207294A JPH0878284A (en) | 1994-08-31 | 1994-08-31 | Composite electronic device and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6207294A JPH0878284A (en) | 1994-08-31 | 1994-08-31 | Composite electronic device and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0878284A true JPH0878284A (en) | 1996-03-22 |
Family
ID=16537409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6207294A Pending JPH0878284A (en) | 1994-08-31 | 1994-08-31 | Composite electronic device and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0878284A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009120667A3 (en) * | 2008-03-26 | 2009-12-17 | Skyworks Solutions, Inc. | Co-firing of magnetic and dielectric materials for fabricating composite assemblies for circulators and isolators |
| JP2015228438A (en) * | 2014-06-02 | 2015-12-17 | Tdk株式会社 | Laminate coil part |
| US11081770B2 (en) | 2017-09-08 | 2021-08-03 | Skyworks Solutions, Inc. | Low temperature co-fireable dielectric materials |
| US11387532B2 (en) | 2016-11-14 | 2022-07-12 | Skyworks Solutions, Inc. | Methods for integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites |
| US11565976B2 (en) | 2018-06-18 | 2023-01-31 | Skyworks Solutions, Inc. | Modified scheelite material for co-firing |
| US11603333B2 (en) | 2018-04-23 | 2023-03-14 | Skyworks Solutions, Inc. | Modified barium tungstate for co-firing |
-
1994
- 1994-08-31 JP JP6207294A patent/JPH0878284A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009120667A3 (en) * | 2008-03-26 | 2009-12-17 | Skyworks Solutions, Inc. | Co-firing of magnetic and dielectric materials for fabricating composite assemblies for circulators and isolators |
| US7687014B2 (en) | 2008-03-26 | 2010-03-30 | Skyworks Solutions, Inc. | Co-firing of magnetic and dielectric materials for fabricating composite assemblies for circulators and isolators |
| CN101981753A (en) * | 2008-03-26 | 2011-02-23 | 天工方案公司 | Co-firing of magnetic and dielectric materials for fabricating composite assemblies for circulators and isolators |
| KR101235964B1 (en) * | 2008-03-26 | 2013-02-21 | 스카이워크스 솔루션즈 인코포레이티드 | Co-firing of magnetic and dielectric materials for fabricating composite assemblies for circulators and isolators |
| JP2015228438A (en) * | 2014-06-02 | 2015-12-17 | Tdk株式会社 | Laminate coil part |
| US11387532B2 (en) | 2016-11-14 | 2022-07-12 | Skyworks Solutions, Inc. | Methods for integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites |
| US11804642B2 (en) | 2016-11-14 | 2023-10-31 | Skyworks Solutions, Inc. | Integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites |
| US11081770B2 (en) | 2017-09-08 | 2021-08-03 | Skyworks Solutions, Inc. | Low temperature co-fireable dielectric materials |
| US11715869B2 (en) | 2017-09-08 | 2023-08-01 | Skyworks Solutions, Inc. | Low temperature co-fireable dielectric materials |
| US11603333B2 (en) | 2018-04-23 | 2023-03-14 | Skyworks Solutions, Inc. | Modified barium tungstate for co-firing |
| US11958778B2 (en) | 2018-04-23 | 2024-04-16 | Allumax Tti, Llc | Modified barium tungstate for co-firing |
| US11565976B2 (en) | 2018-06-18 | 2023-01-31 | Skyworks Solutions, Inc. | Modified scheelite material for co-firing |
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