JP6419845B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6419845B2 JP6419845B2 JP2016563610A JP2016563610A JP6419845B2 JP 6419845 B2 JP6419845 B2 JP 6419845B2 JP 2016563610 A JP2016563610 A JP 2016563610A JP 2016563610 A JP2016563610 A JP 2016563610A JP 6419845 B2 JP6419845 B2 JP 6419845B2
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- JP
- Japan
- Prior art keywords
- thickness
- laminated structure
- adhesive layer
- semiconductor chip
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
2 積層構造体
10 モールド樹脂
20 リードフレーム(第1の構成部品)
30 第2の接着剤層(接着剤層)
40 中間部材(第2の構成部品)
50 第1の接着剤層
60 半導体チップ
70 薄膜部(検出部)
Claims (1)
- 複数の構成部品を積層して、第1の構成部品である半導体チップと、前記半導体チップが搭載される第2の構成部品である基板との間に、厚さ方向に圧縮することにより塑性変形して厚さが薄くなる接着剤層を介在させ、前記複数の構成部品を厚さ方向に圧縮することにより積層構造体を作成する工程と、
前記積層構造体の表面に設けられた被計測気体の流量を検出する前記半導体チップの少なくとも一部をモールド樹脂から外部に露出させ、該積層構造体を前記モールド樹脂でモールドする工程と、を含み、
前記積層構造体を前記モールド樹脂でモールドする工程では、モールド金型の少なくとも一部を前記半導体チップの表面に押圧した状態で、モールドすることを特徴とする半導体装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014249022 | 2014-12-09 | ||
JP2014249022 | 2014-12-09 | ||
PCT/JP2015/083308 WO2016093075A1 (ja) | 2014-12-09 | 2015-11-27 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016093075A1 JPWO2016093075A1 (ja) | 2017-08-31 |
JP6419845B2 true JP6419845B2 (ja) | 2018-11-07 |
Family
ID=56107265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016563610A Active JP6419845B2 (ja) | 2014-12-09 | 2015-11-27 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6419845B2 (ja) |
WO (1) | WO2016093075A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112830448B (zh) * | 2021-01-19 | 2023-12-26 | 潍坊歌尔微电子有限公司 | 麦克风封装工艺和麦克风封装结构 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10290000A (ja) * | 1997-04-14 | 1998-10-27 | Hitachi Ltd | 圧接型半導体装置 |
JP2012015225A (ja) * | 2010-06-30 | 2012-01-19 | Hitachi Ltd | 半導体装置 |
JP5632881B2 (ja) * | 2012-06-15 | 2014-11-26 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
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2015
- 2015-11-27 WO PCT/JP2015/083308 patent/WO2016093075A1/ja active Application Filing
- 2015-11-27 JP JP2016563610A patent/JP6419845B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2016093075A1 (ja) | 2017-08-31 |
WO2016093075A1 (ja) | 2016-06-16 |
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