JP6411765B2 - LED lighting device - Google Patents
LED lighting device Download PDFInfo
- Publication number
- JP6411765B2 JP6411765B2 JP2014080265A JP2014080265A JP6411765B2 JP 6411765 B2 JP6411765 B2 JP 6411765B2 JP 2014080265 A JP2014080265 A JP 2014080265A JP 2014080265 A JP2014080265 A JP 2014080265A JP 6411765 B2 JP6411765 B2 JP 6411765B2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- led lamp
- baffle
- led
- lighting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012546 transfer Methods 0.000 claims description 18
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 238000000605 extraction Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 50
- 239000000758 substrate Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000005286 illumination Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 235000019640 taste Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Connecting Device With Holders (AREA)
Description
本発明は、発光ダイオード(以下、LED(Light Emitting Diode)と適宜称する)を光源に使用したLED照明装置に係わり、特にLEDランプの交換が可能なLED照明装置に関するものである。 The present invention relates to an LED illumination device using a light emitting diode (hereinafter referred to as an LED (Light Emitting Diode) as appropriate) as a light source, and more particularly to an LED illumination device in which an LED lamp can be replaced.
近年、環境意識の高まりから、省電力化に優れたLEDチップを光源に使用したLED照明装置が盛んに用いられるようになってきた。特に最近は、LEDチップの発光効率の改善やLED照明装置内での光量損失を抑える技術の開発が進み、照明能力の点では従来に比べて少ないLEDチップ数で従来と同等の明るさが確保できるようになってきている。 2. Description of the Related Art In recent years, with increasing environmental awareness, LED lighting devices using LED chips with excellent power savings as light sources have been actively used. In particular, recently, the development of technology to improve the light emission efficiency of LED chips and reduce light loss in LED lighting devices has progressed, and in terms of lighting capacity, the same brightness as before has been secured with fewer LED chips than conventional ones. It is becoming possible.
搭載するLEDチップ数が減らせるとLED照明装置の消費電力が削減でき、LEDチップを点灯させる点灯回路の規模も小さくて済むためLED照明装置の小型化、軽量化に加え低価格化が図れる利点がある。 If the number of LED chips to be mounted can be reduced, the power consumption of the LED lighting device can be reduced, and the scale of the lighting circuit for lighting the LED chip can be reduced, so that the LED lighting device can be reduced in size and weight, and the cost can be reduced. There is.
ところで、発光素子であるLEDチップが高温に弱いためLED照明装置には高い放熱性能が求められる。LEDチップから発した熱を複数の部品を経由して、高い放熱性能を確保したまま筐体(放熱部)へ伝熱するための手法として、伝熱経路に関係する部品に金属やセラミックのような高い熱伝導率を有する材料を用いることや、部品と部品が接触する部分の接触面積をできる限り広く確保することが有効である。表面接触の熱抵抗を下げるために部品と部品の接触部をネジ止めして加圧したり、部品間に熱伝導性シートを挟むなども有効である。 By the way, since the LED chip which is a light emitting element is weak at high temperature, high heat dissipation performance is calculated | required by the LED lighting apparatus. As a method for transferring heat generated from the LED chip to the housing (heat radiating part) while ensuring high heat dissipation performance via multiple parts, the parts related to the heat transfer path are made of metal or ceramic. It is effective to use a material having a high thermal conductivity and to ensure a contact area as large as possible between the parts where the parts are in contact. In order to reduce the thermal resistance of the surface contact, it is also effective to screw and press the contact portion between the components and to insert a heat conductive sheet between the components.
現状のLED照明装置では、LEDチップを実装した基板をヒートシンクに直接ネジ止めしたり、放熱フィンを備えて放熱部の性能を高める対策の他、伝熱に関与する部品に金属製部品を多用したり、部品間に熱伝導性シートを挟むなどの対策を採ったものが多い。 In the current LED lighting device, the board on which the LED chip is mounted is directly screwed to the heat sink, or the heat radiation fins are provided to improve the performance of the heat radiation part, and metal parts are frequently used for the heat transfer parts. In many cases, measures are taken such as sandwiching a heat conductive sheet between parts.
したがって、単に、LED照明装置の小型化や軽量化を行うと、筺体の小型化に伴って筺体表面積が減少するため放熱性能が低下することや、構成部品間の接触面積が相対的に減少し接触面積に比例する傾向のある熱伝導性能が低下することなどが影響し、高い放熱性能を確保することが難しくなる。 Therefore, simply reducing the size and weight of the LED lighting device reduces the heat dissipation performance due to the reduction in the surface area of the housing as the housing is downsized, and the contact area between the components is relatively reduced. It is difficult to ensure high heat dissipation performance due to a decrease in heat conduction performance that tends to be proportional to the contact area.
例えば、特許文献1には、LEDモジュールがネジ止めされた基部と、LEDモジュールから発した光の入射口及び出射口をもつ枠体とからなるダウンライトに関して、LEDモジュールと枠体の入射口の間に十分なスペースを確保するとともに枠体の入射口周縁に反射部材を設けることによって良好な放熱性能と光量損失の低減を実現し小型化を図る技術が開示されている。 For example, Patent Document 1 discloses an LED module and an entrance of a frame with respect to a downlight that includes a base portion to which the LED module is screwed and a frame having an entrance and an exit for light emitted from the LED module. There has been disclosed a technique for achieving a reduction in size by securing a sufficient space between them and providing a reflecting member at the periphery of the entrance of the frame to achieve good heat dissipation performance and reduction in light loss.
一方、今後、より省エネ化の進んだLEDランプが開発され、加えて発光色や光配向性の異なるLEDランプや外観のデザイン性に優れたLEDランプなどが豊富に品揃えされれば、照明装置本体はそのまま使用しLEDランプのみを省エネタイプに交換したり、被照明物の種類に応じて、或いは個人の趣好に合わせてLEDランプのみを交換取り換えるなどのランプ交換需要が高まることが予測される。 On the other hand, LED lamps with more energy saving will be developed in the future, and if there are a wide variety of LED lamps with different emission colors and light orientations and LED lamps with excellent appearance design, etc. It is expected that the demand for lamp replacement will increase, such as using the main unit as it is, replacing only the LED lamp with an energy-saving type, or replacing only the LED lamp according to the type of object to be illuminated, or according to individual tastes. The
このような手軽にランプ交換が可能なLED照明装置として、特許文献2には、LED電球を用いるダウンライトに関して、LED電球の筒部を、熱伝導性パッキンを介して反射部(筺体)と熱的に連結させることによって放熱性能を改善し小型化を図る技術が開示されている。 As an LED lighting device capable of easily exchanging the lamp, Patent Document 2 discloses a downlight using an LED bulb, and connects the tube portion of the LED bulb with a reflective portion (housing) and a heat through a thermally conductive packing. A technique for improving the heat dissipation performance and reducing the size by connecting them together is disclosed.
特許文献1に示された装置構造ではLEDモジュールが照明装置内部にネジ止めされている。ネジ止めは部品と部品の接触部に圧力をかけて表面接触の熱抵抗を下げる効果があり、良好な放熱性能が保証されるが、LEDランプのみを交換することはできず、敢えてランプ交換を望む場合は照明装置本体ごと交換する必要がある。特許文献2に開示されたLED照明装置では、LED電球とLED照明装置との接触面積を確保し難く、接触部への加圧も構造的に難しい。 In the device structure disclosed in Patent Document 1, the LED module is screwed inside the lighting device. Screwing has the effect of lowering the thermal resistance of the surface contact by applying pressure to the contact part between parts, and good heat dissipation performance is guaranteed, but it is not possible to replace only the LED lamp, so you should replace the lamp. If desired, the entire lighting device body must be replaced. In the LED lighting device disclosed in Patent Document 2, it is difficult to secure a contact area between the LED bulb and the LED lighting device, and pressurization to the contact portion is structurally difficult.
本発明の目的は、上記の問題点に鑑み、LEDランプが交換可能な構造を持つとともに、LED照明装置のソケットに装着したLEDランプの発熱を効率的に装置本体側へ伝熱させることができるLED照明装置を提供することにある。
In view of the above-described problems, the object of the present invention is to have a structure in which an LED lamp can be replaced and to efficiently transfer heat generated by the LED lamp mounted on the socket of the LED lighting device to the apparatus main body side. The object is to provide an LED lighting device.
本発明は、上記の課題を解決するための第1の手段として、ソケットを有し、当該ソケットに対して挿抜されるLEDランプを着脱自在に装着して点灯させるLED照明装置において、前記ソケットを前記LEDランプの挿抜方向に移動可能に支持する装置本体と、前記LEDランプを装着する前記ソケットを前記LEDランプの挿入方向に付勢する付勢手段とを備えることを特徴とする。 The present invention provides, as a first means for solving the above-described problems, an LED illumination device that has a socket and is detachably mounted with an LED lamp that is inserted into and removed from the socket. An apparatus main body supporting the LED lamp so as to be movable in the insertion / extraction direction of the LED lamp, and an urging means for urging the socket for mounting the LED lamp in the insertion direction of the LED lamp.
本発明は、上記の課題を解決するための第2の手段として、前記付勢手段がコイルスプリングであって、前記コイルスプリングの伸縮方向は前記LEDランプの挿抜方向と略一致した方向であることを特徴とする。 According to the present invention, as a second means for solving the above-described problem, the biasing means is a coil spring, and the expansion / contraction direction of the coil spring is a direction substantially coincident with the insertion / extraction direction of the LED lamp. It is characterized by.
本発明は、上記の課題を解決するための第3の手段として、前記ソケットはE型ソケットであって、前記ソケットの移動可能な方向は前記LEDランプの挿抜方向と略一致した方向であることを特徴とする。 According to the present invention, as a third means for solving the above-described problem, the socket is an E-type socket, and the movable direction of the socket is a direction substantially coincident with the insertion / extraction direction of the LED lamp. It is characterized by.
本発明は、上記の課題を解決するための第4の手段として、前記ソケットは、E型螺合部が形成された筒部の中心軸を通り、且つ当該中心軸と直交する方向に張り出した張出部を有し、当該張出部は前記コイルスプリングの上端外周の径よりも外方に張り出していることを特徴とする。 According to the present invention, as a fourth means for solving the above-described problem, the socket projects in a direction perpendicular to the central axis and passing through the central axis of the cylindrical portion in which the E-type threaded portion is formed. It has an overhang | projection part, The said overhang | projection part is overhanging outward rather than the diameter of the upper end outer periphery of the said coil spring, It is characterized by the above-mentioned.
本発明は、上記の課題を解決するための第5の手段として、前記LEDランプが前記ソケットに装着された状態においては、前記コイルスプリングの内側に前記ソケットの前記LEDランプとのE型螺合部が位置し、前記E型螺合部の内側に前記LEDランプのE型口金が位置する構成となることを特徴とする。 According to the present invention, as a fifth means for solving the above-described problem, when the LED lamp is mounted in the socket, an E-type threaded engagement with the LED lamp of the socket is inside the coil spring. The portion is located, and the E-type base of the LED lamp is located inside the E-type screwing portion.
本発明は、上記の課題を解決するための第6の手段として、前記LEDランプを挿抜するための回転操作に対し、前記ソケットの回転を阻止する機構を備えることを特徴とする。 The present invention is characterized in that as a sixth means for solving the above-mentioned problems, there is provided a mechanism for preventing the rotation of the socket with respect to a rotation operation for inserting and removing the LED lamp.
本発明は、上記の課題を解決するための第7の手段として、前記LEDランプを装着したことを特徴とする。 The present invention is characterized in that the LED lamp is mounted as a seventh means for solving the above-mentioned problems.
本発明によれば、LEDランプが交換可能な構造を持つとともに、LED照明装置のソケットに装着したLEDランプの発熱を効率的に装置本体側へ伝熱させることができるLED照明装置が提供可能となる。
ADVANTAGE OF THE INVENTION According to this invention, while having the structure which can replace | exchange LED lamp, it can provide the LED lighting apparatus which can transfer the heat_generation | fever of the LED lamp with which the socket of LED lighting apparatus was mounted | worn efficiently to the apparatus main body side. Become.
以下に本発明の好適な実施の形態について、図面を参照しながら詳細に説明する。なお本実施形態は一例であり、これに限定されるものではない。
LED照明装置の一例として、天井に設けられた取り付け孔に取り付けることができるダウンライトを採り上げて説明する。なお、以下では便宜的にダウンライトが天井に取り付けられ、ダウンライトの照明光は下方に向けて照射されるものとして説明する。
Preferred embodiments of the present invention will be described below in detail with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.
As an example of the LED lighting device, a downlight that can be attached to an attachment hole provided in the ceiling will be described. In the following description, it is assumed that the downlight is attached to the ceiling for the sake of convenience, and the illumination light of the downlight is emitted downward.
(1.LED照明装置の構成)
LED照明装置1、ここでは一実施の形態として示すダウンライト10は、図1乃至図3に示すように、商用電力の入力部となる端子部2と、その商用電力をLEDランプ6へ中継するソケット部3と、LEDランプ6から発する照明光の照射角を規定するとともにLEDランプ6からの発熱を外部環境に放出する役割を担う装置本体部5と、自装置を天井板8に固定するための装置固定部材7から構成されている。
(1. Configuration of LED lighting device)
As shown in FIGS. 1 to 3, the LED lighting device 1, here, the downlight 10 shown as an embodiment, relays the commercial power to the LED lamp 6 and the terminal unit 2 serving as a commercial power input unit. In order to fix the socket 3, the device main body 5 that defines the irradiation angle of the illumination light emitted from the LED lamp 6 and releases the heat generated from the LED lamp 6 to the external environment, and the ceiling plate 8. It is comprised from the apparatus fixing member 7 of this.
(2.ダウンライトの固定方法)
ダウンライト10を天井板8に取り付ける際は、図4及び図5に示すように、天井板8に設けられた取り付け孔81の下方からダウンライト10を挿入する。バッフル下部開口513(図1参照)の外周に沿って形成されているバッフル外鍔部514とバッフル天板511に設けられた「V」字状の取付け板バネ71との間に、天井板8の取り付け孔81の周辺部82を挟み込んでバッフル51を天井板8に固定する。なお、バッフル外鍔部514にはリング状のクッション72(図2参照)が載っており、天井板8の下面には弾性を有するクッション72が接することになり、天井板8の下面を傷つける虞は少ない。なお、取付け板バネ71は通常、金属製のものを用いる。
(2. Downlight fixing method)
When the downlight 10 is attached to the ceiling board 8, the downlight 10 is inserted from below the attachment hole 81 provided in the ceiling board 8, as shown in FIGS. Between the baffle outer casing 514 formed along the outer periphery of the baffle lower opening 513 (see FIG. 1) and the “V” -shaped attachment plate spring 71 provided on the baffle top plate 511, the ceiling plate 8 The baffle 51 is fixed to the ceiling plate 8 with the peripheral portion 82 of the mounting hole 81 interposed therebetween. Note that a ring-shaped cushion 72 (see FIG. 2) is placed on the baffle outer flange portion 514, and the elastic cushion 72 is in contact with the lower surface of the ceiling plate 8, which may damage the lower surface of the ceiling plate 8. There are few. The attachment leaf spring 71 is usually made of metal.
(3.−1 端子部)
端子部2は、商業電力供給源と電気的に接続される端子台21と、絶縁性材料からなる端子カバー22と、ソケット連結部材23で構成されている。ソケット連結部材23は矩計状の金属板を「L」字状に板金加工したもので、長辺方向の一方の端部に端子台21が取り付けられる。ソケット連結部材23は、立方体において連続する2面が開放するような形状のソケットカバー31に取り付けられる。端子カバー22は、有底の筒状をなし、端子台21を下方から覆う。
なお、端子部2は、端子台21、端子カバー22、ソケット連結部材23を備えているが、ソケット側の構成によっては、少なくとも端子台21を備えるような構成としてもよい。
また、端子部2には、ここでは図示しないが、規格の異なる照明ランプが装着された場合に備え、規格が異なることを電気的に検出し、商業電力の受電を停止するスイッチを備えてもよい。
(3-1 Terminal part)
The terminal unit 2 includes a terminal block 21 electrically connected to a commercial power supply source, a terminal cover 22 made of an insulating material, and a socket connecting member 23. The socket connecting member 23 is a rectangular metal plate processed into an “L” shape, and the terminal block 21 is attached to one end in the long side direction. The socket connecting member 23 is attached to a socket cover 31 having such a shape that two continuous surfaces in a cube are opened. The terminal cover 22 has a bottomed cylindrical shape and covers the terminal block 21 from below.
In addition, although the terminal part 2 is provided with the terminal block 21, the terminal cover 22, and the socket connection member 23, it is good also as a structure provided with the terminal block 21 at least depending on the structure by the side of a socket.
Further, although not shown here, the terminal unit 2 may be provided with a switch that electrically detects that the standard is different and stops receiving commercial power, in case an illumination lamp having a different standard is mounted. Good.
(3.−2 ソケット部)
ソケット部3は、ソケットカバー31とソケット32で構成される。ソケットカバー31は金属製で、例えば、厚さが0.8mmから1mmの溶融亜鉛めっき鋼板をプレス加工して製作される。ソケットカバー31の開放されていない3方の側面板の下部側には、ネジの貫通穴が設けられた固定辺311が外向きに形成されている。ソケットカバー31はバッフル51のバッフル天板511にネジで固定される。
ソケットカバー31の内部にはソケット32が収まる。LEDランプ6のE型口金61がこのソケット32にねじ込まれてLEDランプ6がダウンライト10に装着され、図外のスイッチがONされるとソケット32を介して受電し点灯する。
(3-2 Socket part)
The socket unit 3 includes a socket cover 31 and a socket 32. The socket cover 31 is made of metal, and is manufactured, for example, by pressing a hot dip galvanized steel sheet having a thickness of 0.8 mm to 1 mm. A fixed side 311 provided with a screw through hole is formed outwardly on the lower side of the three side plates of the socket cover 31 that are not opened. The socket cover 31 is fixed to the baffle top plate 511 of the baffle 51 with screws.
A socket 32 is accommodated in the socket cover 31. When the E-type base 61 of the LED lamp 6 is screwed into the socket 32 and the LED lamp 6 is attached to the downlight 10 and a switch (not shown) is turned on, the power is received through the socket 32 and lights up.
ソケット32は、内部にLEDランプ6の口金61と電気接続するソケット機能を有するソケット筒部321と、端子部2と電気的に接続する配線とソケット筒部321との電気接続部分をカバーする配線カバー部322とを有する。ソケット筒部321は、後述するバッフル連結部材52の連結材開口壁524を通って、バッフル51の内側の空間に露出する。ソケットはE17タイプのソケットであり、ソケット筒部321の内周面はLEDランプ6の口金61のシェル部と螺合するネジ面となっている。これにより、ソケット32にLEDランプ6のE17タイプの口金61がねじ込まれたLEDランプ6を着抜可能に装着する。
ソケット筒部321は、上部に外方へ張り出す張出部分を有している。ここでは、張出部分が、配線カバー部322により兼用されている。張出部分は、一例として、ソケット筒部321の中心軸を通り且つ当該中心軸と直交する1本の仮想線分に沿って張り出している。なお、張出量は、後述するコイルスプリング41の上端部の外周よりも外方に張り出していれば良い。
The socket 32 includes a socket tube portion 321 having a socket function to be electrically connected to the base 61 of the LED lamp 6, a wire electrically connected to the terminal portion 2, and a wire that covers an electrical connection portion between the socket tube portion 321. And a cover portion 322. The socket cylinder portion 321 is exposed to a space inside the baffle 51 through a connecting material opening wall 524 of a baffle connecting member 52 described later. The socket is an E17 type socket, and the inner peripheral surface of the socket tube portion 321 is a screw surface that is screwed with the shell portion of the base 61 of the LED lamp 6. Thereby, the LED lamp 6 in which the E17 type cap 61 of the LED lamp 6 is screwed into the socket 32 is detachably mounted.
The socket tube portion 321 has an overhanging portion that protrudes outward at the top. Here, the overhanging portion is shared by the wiring cover portion 322. As an example, the overhanging portion extends along one imaginary line segment that passes through the central axis of the socket tube portion 321 and is orthogonal to the central axis. In addition, the overhang | projection amount should just protrude over the outer periphery of the upper end part of the coil spring 41 mentioned later.
(3.−3 装置本体部)
装置本体部5は、バッフル51とバッフル連結部材52で構成される。バッフル51は、やや末広がりな天板付円筒に類似の外観形状を有している。バッフル51は、バッフル下部開口513がダウンライト10の照射角を規定するとともに、LEDランプ6からの発熱を外部環境に放出する役割を担う。照明装置の小型化とトレードオフの関係となるが、熱を外部に放出する観点からバッフル51の表面積はできるだけ広いことが望ましい。
バッフル下部開口513の外周に設けられたバッフル外鍔部514は、先述したようにダウンライト10を天井板8へ固定するために使用される。
バッフル天板511の裏面側(内面側)、すなわちバッフル下部開口513の側の面にはLEDランプ6からの熱をバッフル51に伝熱する役割を担うバッフル連結部材52がネジで固定される。
(3-3 Device body)
The apparatus main body 5 includes a baffle 51 and a baffle connecting member 52. The baffle 51 has an external appearance similar to a slightly widened cylinder with a top plate. The baffle 51 plays a role in which the baffle lower opening 513 defines the irradiation angle of the downlight 10 and releases heat generated from the LED lamp 6 to the external environment. Although it is in a trade-off relationship with downsizing of the lighting device, it is desirable that the surface area of the baffle 51 is as large as possible from the viewpoint of releasing heat to the outside.
The baffle outer casing 514 provided on the outer periphery of the baffle lower opening 513 is used to fix the downlight 10 to the ceiling board 8 as described above.
A baffle connecting member 52 that plays a role of transferring heat from the LED lamp 6 to the baffle 51 is fixed to the back surface side (inner surface side) of the baffle top plate 511, that is, the surface on the baffle lower opening 513 side with screws.
バッフル連結部材52は、一端に連結材天板523を、他端(下端)に連結材外鍔部525を有した円筒形で、ハット帽子に類似の形状である。連結材天板523の中央には連結材天板開口522が設けられ、連結材天板開口522の周囲には連結材開口壁524がパイプ状に上方向に伸びている。先述のとおりLEDランプ6を装着したとき、ソケット筒部321がこの連結材開口壁524の内側を通って降下してくる。連結材開口壁524は、リブの効果により、バッフル51との接触面である連結材天板523の剛性を高める効果がある。連結材天板523が変形し難くなることから、バッフル51との接触において平面度が確保され、良好な熱的接触が可能になる。さらに、当該接触部はネジ止めされるため、より高い伝熱性能が確保される。
また、連結材外鍔部525の下面は、バッフル連結部材52がLEDランプ6と接触する接触面(図2参照)である。連結材外鍔部525も外周端部を上方に屈曲させるリブ形成により剛性を高めて平面度を確保している。これにより、バッフル連結部材52とLEDランプ6の接触部も良好な熱的接触が可能となっている。
なお、バッフル51及びバッフル連結部材52は、伝熱機能の観点から、高い熱伝導率を必要とするため、共に金属製である。金属材料としては、厚さが0.8mmから1.5mmの冷間圧延鋼板などの深絞り加工に適した鋼材のほか、アルミニウム材を用いることもできる。固定は、ネジ以外でもよく、たとえば溶接、リベット等でもよい。
ここでは、装置本体部5は、バッフル51とバッフル連結部材52とからなるが、少なくともバッフル51を備えていればよく、バッフル連結部材52を備えない構成としてもよい。但し、LEDランプ6との接触部を有する必要がある。
The baffle connecting member 52 has a cylindrical shape having a connecting material top plate 523 at one end and a connecting material outer flange 525 at the other end (lower end), and has a shape similar to a hat hat. A connecting material top plate opening 522 is provided at the center of the connecting material top plate 523, and a connecting material opening wall 524 extends upward in a pipe shape around the connecting material top plate opening 522. As described above, when the LED lamp 6 is mounted, the socket tube portion 321 descends through the inside of the connecting material opening wall 524. The connecting material opening wall 524 has an effect of increasing the rigidity of the connecting material top plate 523 which is a contact surface with the baffle 51 due to the effect of the rib. Since the connecting material top plate 523 is hardly deformed, flatness is ensured in contact with the baffle 51, and good thermal contact is possible. Furthermore, since the contact portion is screwed, higher heat transfer performance is ensured.
In addition, the lower surface of the connecting material outer flange 525 is a contact surface (see FIG. 2) where the baffle connecting member 52 contacts the LED lamp 6. The connecting material outer flange portion 525 also has a flatness by increasing the rigidity by forming a rib that bends the outer peripheral end portion upward. Thereby, the favorable contact of the contact part of the baffle connection member 52 and the LED lamp 6 is also possible.
In addition, since the baffle 51 and the baffle connection member 52 require high heat conductivity from a viewpoint of a heat transfer function, both are metal. As the metal material, an aluminum material can be used in addition to a steel material suitable for deep drawing such as a cold rolled steel plate having a thickness of 0.8 mm to 1.5 mm. The fixing may be other than screws, for example, welding, rivets or the like.
Here, the apparatus main body 5 includes the baffle 51 and the baffle connecting member 52, but it is sufficient that at least the baffle 51 is provided, and the baffle connecting member 52 may not be provided. However, it is necessary to have a contact portion with the LED lamp 6.
バッフル天板511は、平面視すると円形状をなし、その中心位置にバッフル天板開口512が設けられている。また、バッフル連結部材52の連結材天板523にも、バッフル天板開口512に対応して連結材天板開口522が設けられている。つまり、連結材筒部521を平面視すると、円形状をなし、その中心位置に連結材天板開口522が設けられ、当該連結材天板開口522の中心位置とバッフル天板開口512の中心位置とが略一致する。なお、連結材天板開口522は、バッフル天板開口512よりも開口径が小さい。 前述のとおり、連結材天板開口522の周縁には上方に伸びるパイプ状の連結材開口壁524が設けられており、この連結材開口壁524はバッフル天板開口512を上方に抜ける状態で、バッフル連結部材52がバッフル51に取り付けられる。
なお、連結材開口壁524がバッフル天板開口512を上方に抜ける状態にすると、前述したようにバッフル天板511の裏面に、連結材天板523の表面が接触する。
The baffle top plate 511 has a circular shape in plan view, and a baffle top plate opening 512 is provided at the center position thereof. Also, the connecting material top plate 523 of the baffle connecting member 52 is provided with a connecting material top plate opening 522 corresponding to the baffle top plate opening 512. That is, when the connecting material cylinder portion 521 is viewed in plan view, it forms a circular shape, and the connecting material top plate opening 522 is provided at the center position. The central position of the connecting material top plate opening 522 and the central position of the baffle top plate opening 512 are provided. And approximately match. The connecting material top plate opening 522 has an opening diameter smaller than that of the baffle top plate opening 512. As described above, a pipe-shaped connecting material opening wall 524 extending upward is provided at the periphery of the connecting material top plate opening 522, and this connecting material opening wall 524 passes through the baffle top plate opening 512 upward. A baffle connecting member 52 is attached to the baffle 51.
Note that when the connecting material opening wall 524 passes through the baffle top plate opening 512 upward, the surface of the connecting material top plate 523 contacts the back surface of the baffle top plate 511 as described above.
LEDランプ6の交換時に、ソケット筒部321は連結材天板開口522に嵌った状態で上方又は下方に移動可能に設けられており、パイプ状の連結材開口壁524はソケット筒部321に対してスムーズな上下移動を援けるガイド機能を果たすことができる。 At the time of replacement of the LED lamp 6, the socket tube portion 321 is provided so as to be movable upward or downward while being fitted to the connecting material top plate opening 522, and the pipe-shaped connecting material opening wall 524 is located with respect to the socket tube portion 321. It can fulfill the guide function that supports smooth vertical movement.
連結材天板開口522の開口径は、ソケット筒部321に対して大きすぎるとソケット筒部321の移動時のガタつきを抑制できずガイド機能が十分に果たせない。また、小さすぎるとソケット筒部321との接触が頻発しスムーズな移動を妨げる虞がある。従って、連結材天板開口522の開口径はソケット筒部321の外径よりやや大きく、その寸法的余裕は直径において0.2mmから5mmの範囲であることが望ましい。 If the opening diameter of the connection material top plate opening 522 is too large with respect to the socket cylinder part 321, the play at the time of the movement of the socket cylinder part 321 cannot be suppressed, and the guide function cannot be performed sufficiently. On the other hand, if it is too small, contact with the socket tube portion 321 occurs frequently and smooth movement may be hindered. Accordingly, it is desirable that the opening diameter of the connecting material top plate opening 522 is slightly larger than the outer diameter of the socket tube portion 321 and the dimensional margin is in the range of 0.2 mm to 5 mm in diameter.
また、バッフル天板開口512の開口径は、大きすぎるとバッフル連結部材52との接触面積が減少しバッフル51とバッフル連結部材52の間の熱伝導性能が低下し、小さすぎると連結材開口壁524と干渉する虞がある。従って、バッフル天板開口512の開口径は、連結材開口壁524の外径よりやや大きく、その寸法的余裕は直径において0.2mmから5mmの範囲であることが望ましい。 Further, if the opening diameter of the baffle top plate opening 512 is too large, the contact area with the baffle connecting member 52 is reduced, and the heat conduction performance between the baffle 51 and the baffle connecting member 52 is deteriorated. There is a risk of interference with 524. Therefore, the opening diameter of the baffle top plate opening 512 is slightly larger than the outer diameter of the connecting material opening wall 524, and the dimensional margin is preferably in the range of 0.2 mm to 5 mm in diameter.
後述するが、LEDランプ6の基板支持部材63は伝熱面632を有し、LEDランプ6がダウンライト10に装着されると、伝熱面632がバッフル連結部材52の連結材外鍔部525の裏面と接触する。連結材外鍔部525は、LEDランプ6の発熱をバッフル連結部材へ伝熱する重要な面である。
ここでは、バッフル51とバッフル連結部材を2つの別部品としたが、例えば金属のダイキャストで一体加工してもよい。
As will be described later, the substrate support member 63 of the LED lamp 6 has a heat transfer surface 632, and when the LED lamp 6 is attached to the downlight 10, the heat transfer surface 632 is a connecting material outer flange 525 of the baffle connecting member 52. Contact with the back of the. The connecting material outer casing 525 is an important surface for transferring heat generated by the LED lamp 6 to the baffle connecting member.
Here, although the baffle 51 and the baffle connecting member are two separate parts, they may be integrally processed by, for example, metal die casting.
(3.−4 付勢手段)
ソケット部3と装置本体部5の間には、付勢手段4を設ける。付勢手段4の一例として、ここではスプリングを用いる。スプリングにはコイルタイプや板バネタイプなど多くの種類が知られているが、ここではコイルタイプのコイルスプリング41が利用される。コイルスプリング41は、例えば、直径1mmの鋼線を4巻きし、平面視した上端の円径が25mm、正面視したコイル長が25mmである。
コイルスプリング41は、上端部の直径よりも下端部の直径の方が大きい。つまり、コイルスプリング41は、上端から下端に移るに従って巻径が大きくなる下広がり状(円錐台状)をしている。
コイルスプリング41は、ソケット32をLEDランプ6の口金61のねじ部分の中心軸の延伸する方向に移動可能に支持する役割を担う。具体的には、コイルスプリング41は、その下端部が、連結材開口壁524に外嵌する状態で連結材天板開口522の外側に配されている。コイルスプリング41の上端は、ソケット筒部321がコイルスプリング41の内部に配された状態で、配線カバー部322を下方から支持している。
ダウンライト10にLEDランプ6が装着された状態では、コイルスプリング41の内部にソケット筒部321が配され、そのソケット筒部321の内周に設けられたネジ面に螺合されてLEDランプ6が取り付けられる。
(3-4 Energizing means)
An urging means 4 is provided between the socket part 3 and the apparatus main body part 5. As an example of the biasing means 4, a spring is used here. Many types of springs, such as a coil type and a leaf spring type, are known. Here, a coil type coil spring 41 is used. The coil spring 41 has, for example, four windings of a steel wire having a diameter of 1 mm, the upper end circular diameter in plan view is 25 mm, and the coil length in front view is 25 mm.
The coil spring 41 has a lower end diameter larger than an upper end diameter. That is, the coil spring 41 has a downward spreading shape (conical frustum shape) in which the winding diameter increases as it moves from the upper end to the lower end.
The coil spring 41 plays a role of supporting the socket 32 so as to be movable in the extending direction of the central axis of the threaded portion of the base 61 of the LED lamp 6. Specifically, the lower end portion of the coil spring 41 is arranged outside the connecting material top plate opening 522 in a state of being fitted around the connecting material opening wall 524. The upper end of the coil spring 41 supports the wiring cover portion 322 from below with the socket cylinder portion 321 being disposed inside the coil spring 41.
In a state in which the LED lamp 6 is mounted on the downlight 10, the socket tube portion 321 is disposed inside the coil spring 41, and is screwed onto a screw surface provided on the inner periphery of the socket tube portion 321, so that the LED lamp 6. Is attached.
後述するが、ダウンライト10にLEDランプ6を装着すると、コイルスプリング41は内部にソケット筒部321が配された状態で圧縮され、その復元力がソケット32の配線カバー部322を上方に押し上げる力として働く。コイルスプリング41の伸縮方向はLEDランプ6の挿抜方向と一致した方向となり、ソケット32の移動可能方向もLEDランプ6挿抜方向と一致した方向となる。 As will be described later, when the LED lamp 6 is mounted on the downlight 10, the coil spring 41 is compressed with the socket tube portion 321 disposed therein, and the restoring force pushes the wiring cover portion 322 of the socket 32 upward. Work as. The expansion / contraction direction of the coil spring 41 is a direction that matches the insertion / extraction direction of the LED lamp 6, and the movable direction of the socket 32 is also a direction that matches the insertion / extraction direction of the LED lamp 6.
しかし、コイルスプリング41の上端部の直径がソケット筒部321の直径より大きすぎると、平面視したコイルスプリング41の円の仮想中心と、平面視したソケット筒部321の円の仮想中心が一致しない状態、いわゆるコイルスプリング41の中でソケット筒部321が偏心した位置状態になる可能性がある。このような偏心が起こると、コイルスプリング41がソケット32の配線カバー部322を上方に押し上げる力が、ソケット筒部321の前記した仮想中心から偏心した位置に働くため、コイルスプリング41が非対象形に変形(圧縮)し、コイルスプリング41の中に配されているソケット32を、装置本体部5に対して傾けてしまう虞がある。ソケット32が傾くと、ソケット32に装着されたLEDランプ6も装置本体部5に対して傾く。そのため、LEDランプ6の伝熱面632とバッフル連結部材52の連結材外鍔部525の下面の接触が、面全体が接触しない、いわゆる片当たりの状態となって面接触しないため、LEDランプ6からバッフル連結部材52への熱伝導性能が著しく劣化してしまう虞がある。 However, if the diameter of the upper end portion of the coil spring 41 is too larger than the diameter of the socket tube portion 321, the virtual center of the circle of the coil spring 41 in plan view does not match the virtual center of the circle of the socket tube portion 321 in plan view. There is a possibility that the socket cylinder 321 is in an eccentric position in the so-called coil spring 41. When such an eccentricity occurs, the force by which the coil spring 41 pushes the wiring cover portion 322 of the socket 32 upward acts at a position eccentric from the virtual center of the socket tube portion 321, so that the coil spring 41 is in an untargeted shape. The socket 32 disposed in the coil spring 41 may be tilted with respect to the apparatus main body 5. When the socket 32 is tilted, the LED lamp 6 attached to the socket 32 is also tilted with respect to the apparatus main body 5. Therefore, the contact between the heat transfer surface 632 of the LED lamp 6 and the lower surface of the connecting material outer flange portion 525 of the baffle connecting member 52 does not contact the entire surface, that is, a so-called one-sided state and does not contact the LED lamp 6. There is a possibility that the heat conduction performance from the first to the baffle connecting member 52 is significantly deteriorated.
このような熱伝導性能の劣化を回避するためには、コイルスプリング41の中でのソケット32の偏心を防ぐ必要があり、コイルスプリング41の上端部の直径とソケット筒部321の外形の差は、頻繁に接触してしまうことがない範囲で小さくすることが望ましい。ここでは、コイルスプリング41の上端部の直径は、ソケット筒部321の直径よりやや大きく、その寸法的余裕は直径において、0.2mmから5mmの範囲であることが望ましい。また、コイルスプリング41の下端部の直径は、コイルスプリング41を安定して連結材天板523上に配置できるよう上端部の直径より大きくしている。その下端部直径は、パイプ状に形成された連結材開口壁524のパイプ外径よりやや大きく、その寸法的余裕は、直径において0.5mmから10mmの範囲であることが望ましい。 In order to avoid such deterioration of the heat conduction performance, it is necessary to prevent the eccentricity of the socket 32 in the coil spring 41, and the difference between the diameter of the upper end portion of the coil spring 41 and the outer shape of the socket tube portion 321 is as follows. It is desirable to make it as small as possible without causing frequent contact. Here, the diameter of the upper end portion of the coil spring 41 is slightly larger than the diameter of the socket tube portion 321, and the dimensional margin is preferably in the range of 0.2 mm to 5 mm in diameter. The diameter of the lower end portion of the coil spring 41 is larger than the diameter of the upper end portion so that the coil spring 41 can be stably disposed on the connecting material top plate 523. The lower end diameter is slightly larger than the pipe outer diameter of the connecting material opening wall 524 formed in a pipe shape, and the dimensional margin is preferably in the range of 0.5 mm to 10 mm in diameter.
(3.−5 LEDランプ)
LEDランプ6は、図10及び図11に示すように、複数のLEDチップ65が下方側の片面に実装されたLED基板64と、LED基板64が基板支持面633に固定される基板支持部材63と、E型の口金61を備えた口金付絶縁カバー62と、光拡散カバー67とで構成されている。
(3-5 LED lamp)
As shown in FIGS. 10 and 11, the LED lamp 6 includes an LED substrate 64 on which a plurality of LED chips 65 are mounted on one lower surface, and a substrate support member 63 on which the LED substrate 64 is fixed to the substrate support surface 633. And an insulating cover 62 with a base provided with an E-type base 61, and a light diffusion cover 67.
LEDチップ65を点灯させる、ここでは図示しない点灯回路の回路部品は、LED基板64の上面、すなわちLEDチップ65が実装されていない面の中央部に高密度で実装され、基板支持部材63の突起部631の内側スペースに収められている。 The circuit components of the lighting circuit (not shown) for lighting the LED chip 65 are mounted at a high density on the upper surface of the LED substrate 64, that is, the central portion of the surface where the LED chip 65 is not mounted, and the protrusion of the substrate support member 63. It is stored in the inner space of the part 631.
LED基板64は、LEDチップ65が実装されている面の裏面、すなわち点灯回路の回路部品が実装された面が基板支持部材63と接触する。LED基板64の回路部品が実装された面の外周部には、LEDチップ65からの発熱を基板支持部材63へ効率よく伝熱するに十分な基板支持部材63との接触面積が確保されている。
なお、LED基板64は、基板支持部材63にネジ止めされており、基板支持部材63とLED基板64の接触面は高い伝熱性能が確保されている。
複数のLEDチップ65が発する熱はLED基板64から基板支持部材63に伝わり、伝熱面632からバッフル連結部材52に伝熱され、更にバッフル51に伝わり外部環境に放熱される。ここで、伝熱面632は、バッフル連結部材52の連結材外鍔部525の下面と互いに合致するような形状を有し、LEDランプ6で発生した熱をバッフル連結部材52へ伝熱する重要な役割を担う面である。
The back surface of the LED substrate 64 on which the LED chip 65 is mounted, that is, the surface on which circuit components of the lighting circuit are mounted is in contact with the substrate support member 63. A contact area with the substrate support member 63 sufficient to efficiently transfer heat generated from the LED chip 65 to the substrate support member 63 is secured on the outer peripheral portion of the surface of the LED substrate 64 on which the circuit components are mounted. .
The LED substrate 64 is screwed to the substrate support member 63, and the contact surface between the substrate support member 63 and the LED substrate 64 ensures high heat transfer performance.
The heat generated by the plurality of LED chips 65 is transferred from the LED substrate 64 to the substrate support member 63, transferred from the heat transfer surface 632 to the baffle connecting member 52, further transferred to the baffle 51, and dissipated to the external environment. Here, the heat transfer surface 632 has a shape that matches the lower surface of the connecting material outer flange 525 of the baffle connecting member 52, and is important for transferring heat generated by the LED lamp 6 to the baffle connecting member 52. It is a surface that plays a role.
(3.−6 付勢手段の機能)
次に、コイルスプリング41の具体的な挿入位置及びLEDランプ6をダウンライト10に装着したときの機能を図6によって説明する。なお、図6はコイルスプリング41の位置を平易に図示できるようダウンライト10の構成部材の一部を非表示とした。
平面視したコイルスプリング41の円形の内部にソケット筒部321が挿通される。コイルスプリング41の上端はソケット32の配線カバー部322の下面に接し、コイルスプリング41の下端はバッフル51のバッフル天板開口512を抜けて、バッフル連結部材52の連結材天板523に接している。また、コイルスプリング41の下部には、パイプ状の開口壁524が挿通されている。
(3-6 Function of biasing means)
Next, the specific insertion position of the coil spring 41 and the function when the LED lamp 6 is mounted on the downlight 10 will be described with reference to FIG. In FIG. 6, some of the constituent members of the downlight 10 are not shown so that the position of the coil spring 41 can be easily illustrated.
The socket tube portion 321 is inserted into the circular shape of the coil spring 41 in plan view. The upper end of the coil spring 41 is in contact with the lower surface of the wiring cover portion 322 of the socket 32, and the lower end of the coil spring 41 passes through the baffle top plate opening 512 of the baffle 51 and is in contact with the connection material top plate 523 of the baffle connection member 52. . A pipe-shaped opening wall 524 is inserted under the coil spring 41.
この状態で、ダウンライト10にLEDランプ6を取り付けるには、図7に示すように、バッフル51の下部開口513から、バッフル51の内部に固定されたバッフル連結部材52の連結材天板開口522に向けて、LEDランプ6の口金61を差し込み、ソケット筒部321にねじ込む。 In order to attach the LED lamp 6 to the downlight 10 in this state, as shown in FIG. 7, the connecting material top plate opening 522 of the baffle connecting member 52 fixed to the inside of the baffle 51 from the lower opening 513 of the baffle 51. The base 61 of the LED lamp 6 is inserted and screwed into the socket tube 321.
LEDランプ6の取り付け前の状態(図8)から、LEDランプ6を回転しながらソケット筒部321に口金61をねじ込んでいくと、LEDランプ6は基板支持部材63の伝熱面632(図3参照)がバッフル連結部材52の連結材外鍔部525の裏面に接するまで徐々に上方へ移動し、連結材外鍔部525の裏面に接した時点でLEDランプ6の上方への移動が止まる。しかし、この停止位置ではLEDランプ6の口金頂部611はソケット筒部32の最上部に設けられている給電端子(図示していない)に届いておらず電気的接続は完了していない。 When the base 61 is screwed into the socket tube 321 while rotating the LED lamp 6 from the state before the LED lamp 6 is attached (FIG. 8), the LED lamp 6 is heated by the heat transfer surface 632 of the substrate support member 63 (FIG. 3). Is gradually moved upward until it comes into contact with the back surface of the connecting material outer flange 525 of the baffle connecting member 52, and when the LED lamp 6 comes into contact with the rear surface of the connecting material outer flange 525, the upward movement of the LED lamp 6 stops. However, at this stop position, the top portion 611 of the LED lamp 6 does not reach the power supply terminal (not shown) provided at the uppermost portion of the socket tube portion 32 and the electrical connection is not completed.
ここで、ソケット筒部321にLEDランプ6をねじ込むと、ソケット32は、ねじを回転する方向に回転しようとするが、ソケットカバー31には、短冊状の2片のソケットガイド312(図3、図9)が並列して設けられ、配線カバー部322の側壁(平面)部に近接して対向している。ソケット筒部321にLEDランプ6がねじ込まれたとき、配線カバー部322がこのソケットガイド312に当接するため、ソケット32は回転を阻止される。なお、ソケットガイド312は必ずしも短冊状である必要ななく、ソケットカバー31の内部でソケット32が回転することを防ぐためのリブをソケットカバー31に形成してもよい。
また、ソケット32にLEDランプ6を挿入する際の初期、ソケット32はLEDランプ6に押されて、ソケットカバー31の中で上方へ押し上げられるが、ソケットカバー31の天板に当接するため、ソケット32がソケットカバー31から外れることはない。
Here, when the LED lamp 6 is screwed into the socket tube portion 321, the socket 32 tends to rotate in the direction of rotating the screw, but the socket cover 31 has two strip-shaped socket guides 312 (FIG. 3, 9) are provided in parallel and face each other in the vicinity of the side wall (planar) portion of the wiring cover portion 322. When the LED lamp 6 is screwed into the socket tube portion 321, the wiring cover portion 322 contacts the socket guide 312, so that the socket 32 is prevented from rotating. The socket guide 312 does not necessarily have a strip shape, and a rib for preventing the socket 32 from rotating inside the socket cover 31 may be formed on the socket cover 31.
Further, in the initial stage when the LED lamp 6 is inserted into the socket 32, the socket 32 is pushed by the LED lamp 6 and pushed upward in the socket cover 31, but the socket 32 comes into contact with the top plate of the socket cover 31. 32 does not come off the socket cover 31.
更に、LEDランプ6のねじ込み操作を続けると、LEDランプ6は上方への移動ができないため、ソケット32がコイルスプリング41を圧縮しながら下方に移動してくる。ソケット32は、LEDランプ6の口金頂部611がソケット32の給電端子に達しLEDランプ6のねじ込みがそれ以上できなくなる位置(図9)まで降下してくる。ここでLEDランプ6の取り付け操作が完了する。 Furthermore, if the screwing operation of the LED lamp 6 is continued, the LED lamp 6 cannot move upward, so that the socket 32 moves downward while compressing the coil spring 41. The socket 32 descends to a position (FIG. 9) where the top 611 of the LED lamp 6 reaches the power supply terminal of the socket 32 and the LED lamp 6 can no longer be screwed. Here, the mounting operation of the LED lamp 6 is completed.
このLEDランプ6の装着が完了した状態では、常時、圧縮によって蓄勢されたコイルスプリング41の復元力が、LEDランプ6の構成部品である基板支持部材63の伝熱面632とバッフル連結部材52の連結材外鍔部525の裏面との接触に圧力を加える。これにより、LEDランプ6とバッフル連結部材52が強い接触圧で接触するため、高い熱伝導性能が維持されて、LEDランプ6からの発熱がバッフル連結部材52に効率よく伝熱される。バッフル連結部材52に伝わった熱は、バッフル51から放射や、周辺大気との対流による熱交換を通して放熱される。
なお、コイルスプリング41が金属製であることから、前述の圧縮状態からの復元力には、プラスチックやゴムでは無視できない経年変化(劣化)がほとんどないため、LEDランプ6とバッフル連結部材52との接触面は、長期間にわたって高い熱伝導性能が維持される。また、コイルスプリング41が金属製であることから、LEDランプ6からバッフル51への伝熱にも寄与することができる。
In the state where the mounting of the LED lamp 6 is completed, the restoring force of the coil spring 41 that is always stored by compression is the heat transfer surface 632 of the substrate support member 63 that is a component of the LED lamp 6 and the baffle connecting member 52. A pressure is applied to the contact with the back surface of the connecting material outer flange 525. Thereby, since the LED lamp 6 and the baffle connecting member 52 are in contact with each other with a strong contact pressure, high heat conduction performance is maintained, and heat generated from the LED lamp 6 is efficiently transferred to the baffle connecting member 52. The heat transmitted to the baffle coupling member 52 is radiated from the baffle 51 through heat exchange through heat exchange by convection with the surrounding atmosphere.
In addition, since the coil spring 41 is made of metal, the restoring force from the above-described compressed state has almost no secular change (deterioration) that cannot be ignored with plastic or rubber. The contact surface maintains high heat conduction performance over a long period of time. Further, since the coil spring 41 is made of metal, it can also contribute to heat transfer from the LED lamp 6 to the baffle 51.
以上のように、本実施形態では、ダウンライトにLEDランプを装着した状態で、常時、ソケットとバッフルの間に設けた付勢手段としてのコイルスプリングの圧縮状態からの復元力によって、LEDランプとバッフル部を高い接触圧で接触させることができ、LEDランプからの発熱を効率よく放熱できるようになる。 As described above, in the present embodiment, with the LED lamp attached to the downlight, the LED lamp and the LED lamp are always restored by the restoring force from the compressed state of the coil spring as the biasing means provided between the socket and the baffle. The baffle part can be brought into contact with a high contact pressure, and the heat generated from the LED lamp can be efficiently radiated.
また、ソケットをE型のねじ込み式とし、LEDランプの口金もこれに適合したものとして説明したが、ソケットのタイプやソケットサイズもこれに限定されるものではない。 以上、この発明の実施の形態を説明したが、この発明はこれらの実施の形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計変更があっても本発明に含まれる。すなわち、当業者であれば、当然なしえるであろう各種変形、修正もまた本発明に含まれる。 In addition, the socket is assumed to be an E-type screw-in type, and the base of the LED lamp is adapted to this, but the socket type and socket size are not limited to this. As mentioned above, although embodiment of this invention was described, this invention is not restricted to these embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, various changes and modifications that can be naturally made by those skilled in the art are also included in the present invention.
本発明は、ショールームやホール、更に、会議室や事務所の各居室等の天井面に沿って設置されるダウンライト等のLED照明器具に広く適用することができる。 The present invention can be widely applied to LED lighting fixtures such as downlights installed along the ceiling surfaces of showrooms and halls, as well as conference rooms and office rooms.
1:LED照明器具
10:ダウンライト
2:端子部
21:端子台
22:端子カバー
23:ソケット連結部材
3:ソケット部
31:ソケットカバー
311:固定辺
312:ソケットガイド
32:ソケット
321:ソケット筒部
322:配線カバー部
4:付勢手段
41:コイルスプリング
5:装置本体部
51:バッフル
511:バッフル天板
512:バッフル天板開口
513:バッフル下部開口
514:バッフル外鍔部
52:バッフル連結部材
521:連結材筒部
522: 連結材天板開口
523:連結材天板
524:連結材開口壁
525:連結材外鍔部
6:LEDランプユニット
61:E型口金
611:口金頂部
62:口金付絶縁カバー
63:基板支持部材
631:突起部
632:伝熱面
633:基板支持面
64:LED基板
65:LEDチップ
67:光拡散カバー
7:照明装置固定部材
71:取り付け板バネ
72:クッション
8:天井板
81:取り付け孔
82:孔縁部
1: LED lighting fixture 10: Downlight 2: Terminal portion 21: Terminal block 22: Terminal cover 23: Socket connecting member 3: Socket portion 31: Socket cover 311: Fixed side 312: Socket guide 32: Socket 321: Socket tube portion 322: Wiring cover part
4: Biasing means 41: Coil spring 5: Device main body 51: Baffle 511: Baffle top plate 512: Baffle top plate opening 513: Baffle lower opening 514: Baffle outer flange 52: Baffle connecting member 521: Connecting material cylinder 522: Connecting material top plate opening 523: Connecting material top plate 524: Connecting material opening wall 525: Connecting material outer casing 6: LED lamp unit 61: E-type base 611: Base top 62: Insulating cover with base 63: Substrate support Member 631: Protruding portion 632: Heat transfer surface 633: Substrate support surface 64: LED substrate 65: LED chip 67: Light diffusion cover 7: Lighting device fixing member 71: Mounting plate spring 72: Cushion 8: Ceiling plate 81: Mounting hole 82: Hole edge
Claims (5)
前記ソケットを前記LEDランプの挿抜方向に移動可能に支持する装置本体と、
前記LEDランプを装着する前記ソケットを前記LEDランプの挿入方向に付勢する付勢手段と、を備えており、
前記装置本体は、バッフル部と前記バッフル部の内側に配置されたバッフル連結部を有し、前記LEDランプを装着した場合に、前記LEDランプの伝熱面が前記バッフル連結部に接触することを特徴とするLED照明装置。 In an LED lighting device that has a socket and is detachably mounted with an LED lamp that is inserted into and removed from the socket, and lit.
An apparatus main body for supporting the socket so as to be movable in the insertion / extraction direction of the LED lamp;
Biasing means for biasing the socket for mounting the LED lamp in the insertion direction of the LED lamp ;
The apparatus main body has a baffle part and a baffle connecting part arranged inside the baffle part, and when the LED lamp is mounted, the heat transfer surface of the LED lamp comes into contact with the baffle connecting part. LED lighting device characterized.
前記ソケットは、前記バッフル連結部の連結材開口壁を挿通するソケット筒部を有することを特徴とするLED照明装置。 The LED lighting device according to claim 1,
The socket, L ED lighting device you further comprising a socket cylindrical portion for inserting the coupling member aperture wall of the baffle connecting portion.
前記連結材開口壁は、パイプ状に上方向に伸びていることを特徴とするLED照明装置。 The LED lighting device according to claim 2,
The connecting member opening wall, L ED lighting device you characterized in that extends upward like a pipe.
前記付勢手段は、コイルスプリングであって、
前記コイルスプリングの下端部の直径は、前記コイルスプリングの上端部の直径よりも大きいことを特徴とするLED照明装置。 The LED lighting device according to claim 1, wherein
The biasing means is a coil spring,
The diameter of the lower end portion of the coil spring, L ED lighting device it is greater than the diameter of the upper end portion of the coil spring.
前記ソケットは、配線カバー部およびソケットカバーを有し、
前記ソケットカバーに設けられたソケットガイドは前記配線カバー部の側壁に近接して対向していることを特徴とするLED照明装置。 The LED lighting device according to claim 1, wherein
The socket has a wiring cover part and a socket cover,
The socket guide provided on the socket cover is L ED lighting device you characterized in that faces in proximity to the side wall of the wiring cover section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014080265A JP6411765B2 (en) | 2014-04-09 | 2014-04-09 | LED lighting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014080265A JP6411765B2 (en) | 2014-04-09 | 2014-04-09 | LED lighting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015201378A JP2015201378A (en) | 2015-11-12 |
JP6411765B2 true JP6411765B2 (en) | 2018-10-24 |
Family
ID=54552451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014080265A Active JP6411765B2 (en) | 2014-04-09 | 2014-04-09 | LED lighting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6411765B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022057878A1 (en) * | 2020-09-18 | 2022-03-24 | 苏州欧普照明有限公司 | Down lamp body and down lamp |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4716008B2 (en) * | 2005-08-09 | 2011-07-06 | 東芝ライテック株式会社 | Socket and lighting device |
US7766512B2 (en) * | 2006-08-11 | 2010-08-03 | Enertron, Inc. | LED light in sealed fixture with heat transfer agent |
JP5477529B2 (en) * | 2008-11-28 | 2014-04-23 | 東芝ライテック株式会社 | lighting equipment |
JP2010129489A (en) * | 2008-11-28 | 2010-06-10 | Toshiba Lighting & Technology Corp | Socket assembly and lighting fixture |
JP5255468B2 (en) * | 2009-02-05 | 2013-08-07 | パナソニック株式会社 | Light bulb shaped lamp |
-
2014
- 2014-04-09 JP JP2014080265A patent/JP6411765B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015201378A (en) | 2015-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4463127B2 (en) | Lighting fixture and lighting device | |
JP5467547B2 (en) | lighting equipment | |
JP2011159472A (en) | Luminaire | |
JP5072132B2 (en) | lighting equipment | |
US9033559B2 (en) | Assembling heat dissipating lighting device | |
JP2008204692A (en) | Luminaire | |
JP2008311237A (en) | Lighting fixture | |
JP2008117558A (en) | Reflector for illumination and light source device | |
JP2014146503A (en) | Lighting device | |
JP5718199B2 (en) | Light bulb-type lighting device | |
JP4674269B1 (en) | Light bulb shaped LED lamp and lighting apparatus | |
JP2014107106A (en) | Lighting device | |
JP2012160264A (en) | Lighting fixture | |
US20130215615A1 (en) | Laterally installable rotating lamp | |
JP6411765B2 (en) | LED lighting device | |
JP2008311238A (en) | Lighting fixture | |
KR20110026598A (en) | Light emitting diode lamp | |
JP5789565B2 (en) | Lighting device | |
JP6919452B2 (en) | lighting equipment | |
JP2012204200A (en) | Lighting fixture | |
JP6719097B2 (en) | Mounting auxiliary member and lighting device including the mounting auxiliary member | |
JP5574485B2 (en) | lighting equipment | |
JP2012160266A (en) | Lighting fixture | |
JP2012160265A (en) | Lighting fixture | |
JP2011210513A (en) | Mini krypton lamp type led bulb |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20160212 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170323 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180301 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20180301 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180904 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180927 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6411765 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |