JP2012204200A - Lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting fixture which effectively utilizes an installation frame, promotes heat radiation from the front side and the rear side of a light-emitting module, and effectively controls temperature rise of a light-emitting element.SOLUTION: The lighting fixture 1 includes a light-emitting module 2 which has a light-emitting element as a light source and has a light emitting part 23 from which light from the light source is emitted, and in which at least a part of an outer shell 21 has thermal conductivity and is thermally coupled with the light-emitting element, a heat sink 3 which is installed on the rear side of the light-emitting module 2 and is thermally coupled with a part of the outer shell 21, a light distribution member 4 which surrounds the surrounding of the light emitting part 23 of the light emitting module 2 and has a reflecting surface expanding toward the irradiation direction of light, an installation frame 6 of nearly cylindrical shape which is installed at the surrounding of the light distribution member 4 and has thermal conductivity, and a connecting member 5 which connects a part of the outer shell 21 in the light emitting module 2 with the installation frame 6 and transmit heat from the outer shell 21 to the installation frame 6.

Description

  Embodiments of the present invention relate to a luminaire that uses a light emitting element such as an LED as a light source and can improve heat dissipation of the light emitting element.

  As the temperature of a light emitting element such as an LED increases, the light output decreases and the service life is shortened. For this reason, for lighting fixtures that use solid light emitting elements such as LEDs and EL elements as light sources, it is possible to suppress the temperature of the light emitting elements from rising in order to extend the service life or improve characteristics such as light emission efficiency. It is necessary.

  For this reason, conventionally, in lighting fixtures employing LEDs as light sources, attempts have been made to improve heat dissipation by transferring heat generated from the LEDs to the fixture body or by circulating outside air through the fixture body. In addition, in the lighting fixtures that are embedded and installed in the ceiling, an attachment frame may be provided to support the lighting fixture body on the ceiling.

JP 2006-172895 A JP 2008-186776 A

  In the conventional lighting fixture described above, a configuration that improves heat dissipation is adopted, but the mounting frame is not effectively used to improve the heat dissipation effect.

  An object of the present invention is to provide a lighting fixture that effectively uses a mounting frame, promotes heat radiation from the front side and the back side of a light emitting module, and effectively suppresses a temperature rise of the light emitting element.

  A lighting fixture according to an embodiment of the present invention uses a light emitting element as a light source, has a light emitting portion from which light from the light source is emitted, and at least a part of the outer shell has thermal conductivity, and the light emitting element A thermally coupled light emitting module is provided.

Also, a heat sink that is provided on the back side of the light emitting module and that is thermally coupled to a part of the outer shell, and a reflective surface that surrounds the periphery of the light emitting portion of the light emitting module and expands in the light irradiation direction And a substantially cylindrical mounting frame having thermal conductivity disposed around the light distribution member.
Furthermore, a connection member is provided that connects a part of the outer shell of the light emitting module and the mounting frame to transfer heat from the outer shell to the mounting frame.

  According to the embodiment of the present invention, it is possible to provide a lighting fixture that effectively uses a mounting frame, promotes heat radiation from the front side and the back side of the light emitting module, and effectively suppresses the temperature rise of the light emitting element. .

It is a perspective view which shows the lighting fixture which concerns on the 1st Embodiment of this invention. It is a side view which shows a part in the lighting fixture in cross section. It is a top view which shows the lighting fixture. It is a front view which shows a part in the lighting fixture in cross section. It is a top view which abbreviate | omits and shows the heat sink in the lighting fixture. It is a perspective view which shows the light emitting module and connection member in the same lighting fixture. It is a top view which shows the connection member in the lighting fixture. It is a front view which shows the connection member in the lighting fixture. It is a side view which shows the connection member in the same lighting fixture. It is a side view which shows a part in cross section in the lighting fixture which concerns on the 2nd Embodiment of this invention. It is a top view which shows the lighting fixture. It is a perspective view which shows the light emitting module and connection member in the same lighting fixture. It is explanatory drawing which shows the installation method of the lighting fixture (1st step). It is explanatory drawing which shows the installation method of the lighting fixture (2nd step). It is explanatory drawing which shows the installation method of the lighting fixture (3rd step).

  A lighting apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 9. 1 shows a downlight as a lighting fixture, FIG. 2 is a side view showing the right half of the light distribution member and mounting frame in cross section, FIG. 3 is a top view, and FIG. 4 is a light distribution member and mounting. FIG. 5 is a top view showing the right half of the frame in cross section, FIG. 5 is a top view showing the heat sink omitted, FIG. 6 shows the light emitting module and the connecting member, and FIGS. 7 to 9 show the connecting member. . In addition, the same code | symbol is attached | subjected to the same part in each figure, and the overlapping description is abbreviate | omitted.

  The lighting fixture of this embodiment is a type of downlight 1 that is installed in a ceiling C. As shown in FIGS. 1 and 2, the light emitting module 2, the heat sink 3, the light distribution member 4, and the connection member. 5, a mounting frame 6, and a power supply unit 7. In FIG. 2 and subsequent figures, illustration of the radiation fins 31 formed on the heat sink 3 is omitted, and the outer shape of the entire heat sink 3 is shown.

  As representatively shown in FIG. 6, the light emitting module 2 includes a substantially rectangular parallelepiped outer shell 21, a substrate disposed in the outer shell 21, a light emitting element as a light source mounted on the substrate, And a phosphor thin film layer 22 provided on the front side of the light emitting element.

  The light emitting element is a surface mount type LED, and a plurality of the LEDs are mounted on a substrate. The substrate is made of, for example, a glass epoxy resin material, and an LED that emits blue light is used to emit white light. Further, a circular phosphor thin film layer 22 is disposed so as to cover the substrate, and the phosphor thin film layer 22 has a blue light and a phosphor to emit white light. Uses a yellow phosphor that emits yellow light that is complementary. Accordingly, the front surface side of the phosphor thin film layer 22 is configured as the light emitting portion 23, and the light emitted from the LED passes through the phosphor thin film layer 22 and is emitted as white light from the light emitting portion 23 to the outside. The

  The outer shell 21 is formed of a metal material such as aluminum having at least a part, for example, both side surfaces 21a and back surface 21b, that is, heat conduction relative to other portions of the outer shell 21. It is formed of a material having a high rate and is thermally coupled to the light emitting element through the substrate so that heat generated from the light emitting element is conducted. A power line introduction port 24 (mainly see FIG. 2) through which a power line for supplying power to the LED is introduced is formed on one surface of the outer shell 21.

  As shown in FIGS. 1 and 2, the heat sink 3 has a substantially short cylindrical shape, and a large number of metal radiating fins 31 having thermal conductivity are formed on the outer periphery so as to extend in the vertical direction. The heat sink 3 is thermally coupled and attached so as to be in contact with the back surface 21b of the outer shell 21 in the light emitting module 2. Incidentally, for example, a Synjet DML cooler manufactured by Nuventix can be applied to the heat sink 3.

  As shown mainly in FIGS. 2 and 4, the light distribution member 4 is made of a metal material such as aluminum, and expands toward the irradiation direction of the light emitted from the light emitting portion 23, that is, toward the front side. The light emitting portion 23 is disposed so as to surround the light emitting portion 23 in a circular shape. Moreover, the inner peripheral surface is comprised as a reflective surface to which the satin finish processing which exhibits silver color was given.

  Further, a translucent cover member 41 is disposed at the opening end of the substantially circular shape that expands toward the front side of the light distribution member 4. The cover member 41 is formed in a circular shape by a transparent material of synthetic resin such as acrylic resin, and is disposed so as to cover the front side opening of the light distribution member 4.

  Furthermore, a flange-shaped decorative frame 42 made of a cold-rolled steel plate and extending in the outer peripheral direction is attached to the opening end of the light distribution member 4. The decorative frame 42 is painted white. In addition, an attachment spring 43 for attaching the light distribution member 4 to the attachment frame 6 is provided on the outer periphery of the light distribution member 4. The mounting springs 43 are V-shaped torsion coil springs formed from piano wires, and a pair of mounting springs 43 are provided to face the outer peripheral portion on the front surface side of the light distribution member 4.

  The light distribution member 4 configured in this manner has a function of controlling the light distribution of the light emitted from the light emitting unit 23 in the form of an inclined reflecting surface that expands toward the front side. For example, it has a function of suppressing glare.

Next, as shown in FIGS. 1 to 4, the mounting frame 6 is formed of a metal material such as a hot-dip galvanized steel plate having thermal conductivity, and has a substantially cylindrical shape with an opening on the back side and the front side. It is arranged around the optical member 4. The attachment frame 6 is a member that is installed and fixed on the back side of the ceiling C through the embedded hole H of the ceiling C, and the light emitting module 2 is attached to the member so that the light emitting module 2 and the heat sink 3 are supported. It has become. Further, on the inner peripheral surface side of the mounting frame 6, a cut-and-raised piece 61 that is locked and guided by the mounting spring 43 is provided, and on the outer peripheral surface side, a mounting bracket 62 is provided.

  As representatively shown in FIGS. 6 to 9, the connection member 5 is a connection bracket that connects the light emitting module 2 and the mounting frame 6, and is made of a material having thermal conductivity. For example, it is formed of a metal material such as a hot dip galvanized steel plate in a generally U shape, and includes a pair of side walls 51 facing each other and a back wall 52 connecting the side walls 51.

  The pair of side walls 51 and the back wall 52 are formed in a substantially rectangular shape, and an arm-shaped attachment piece 53 is formed in the substantially central portion on the lower side of the side wall 51 and the back wall 52. It is formed in a direction orthogonal to the back wall 52 and extending outward. And the front-end | tip part of the attachment piece 53 has the screw through-hole 53a, and is bent so that it may hang down.

  As shown in FIGS. 2, 3, 4, and 6, the connection member 5 configured as described above is screwed and attached so that the pair of side walls 51 are in close contact with both side surfaces 21 a of the light emitting module 2. It has been. Further, the connection member 5 is disposed on the back side of the mounting frame 6 and is attached to the mounting frame 6 by mounting screws. Specifically, the bent tip portion of the attachment piece 53 is positioned at the outer peripheral edge portion on the back side of the attachment frame 6, and the attachment screw is screwed through the screw through hole 53a.

  In the state where the connection member 5 is attached in this way, as shown in FIG. 5, the pair of side walls 51 of the connection member 5 are in surface contact with both side surfaces 21 a of the light emitting module 2, and the arm-like attachment pieces 53 are formed. It is connected to the mounting frame 6 in a heat conductive manner. Therefore, the heat from the light emitting module 2 can be effectively transmitted to the mounting frame 6.

  Further, in this case, the mounting piece 53 is formed in an arm shape and does not block the opening O on the back side of the mounting frame 6, so that the heat dissipation of the connecting member 5 and the mounting frame 6 is good. It becomes possible to do.

  2 and 3, the heat sink 3 is attached to the back surface 21 b of the light emitting module 2, and the light emitting module 2 is attached to the attachment frame 6 by the connecting member 5. The outer shell dimension in the direction orthogonal to the vertical direction, that is, the outer diameter dimension, is substantially equal or has a dimensional relationship in which the heat sink 3 is formed smaller than the mounting frame 6.

  In addition, the dimensions of the light emitting module 2 disposed between the heat sink 3 and the mounting frame 6 are smaller than these, and a concave portion Cc directed inward is formed between the heat sink 3 and the mounting frame 6. .

  As described above, the dimensional relationship between the heat sink 3 and the mounting frame 6 and the recess Cc are formed, so that the downlight 1 is embedded in the ceiling C as will be described in detail in a second embodiment to be described later. In the case of installation, the workability can be improved.

  The power supply unit 7 is rotatably attached to a holder 71 attached to the heat sink 3 via a hinge 72. The power supply unit 7 includes a power supply circuit 73, a power supply terminal block 74, and support legs 75, is connected to a commercial power supply, and is electrically connected to the light emitting module 2. Specifically, the power supply unit and the light emitting module 2 are connected by a power supply line W led out from the power supply line introduction port 24 of the light emitting module 2, and power is supplied to the light emitting module 2 through the power supply line W. The The light emitting module 2 receives a direct current output from the power supply circuit, and the light emitting element is controlled to be turned on.

  In this case, since the power supply unit 7 is connected to the light emitting module 2 side via the hinge 72 without being separated from the light emitting module 2 side, the wiring length of the power supply line W can be shortened. .

  When installing such a downlight 1, it is inserted from the side of the power supply unit 7 into the embedding hole on the ceiling C surface, and then the mounting frame 6 is inserted and the mounting bracket 62 is operated and fixed to the back of the ceiling C. Next, the light distribution member 4 is disposed inside the mounting frame 6. In this case, the mounting spring 43 of the light distribution member 4 is locked to the cut and raised piece 61 of the mounting frame 6, and the light distribution member 4 is pushed up by the elastic force by which the mounting spring 43 expands. The flange-shaped decorative frame 42 is brought into contact with the peripheral edge of the embedding hole, and the downlight 1 is installed on the ceiling C surface.

  Next, when the power supply unit is energized from the power supply, power is supplied to the substrate of the light emitting module 2 so that the light emitting element emits light. Most of the light emitted from each light emitting element through the phosphor thin film layer 22 is transmitted through the cover member 41 and irradiated forward (directly below). Further, a part of the light is light distribution controlled by the reflecting surface of the light distribution member 4 and is transmitted forward through the cover member 41.

  Heat is generated during light emission of the light emitting element. The heat generated from the light emitting element is mainly conducted to the both side surfaces 21 a and the back surface 21 b of the outer shell 21 of the light emitting module 2. The heat conducted to the back surface 21 b is conducted to the heat sink 3, is transmitted to the numerous heat radiation fins 31 and is radiated at this portion. The heat conducted to both side surfaces 21a is conducted from the pair of side walls 51 of the connecting member 5 to the attachment piece 53, conducted to the attachment frame 6, and radiated from the front side.

  That is, the heat generated from the light emitting element is effectively dissipated from the front side and the back side of the light emitting module 2, and the temperature rise of the light emitting element can be suppressed. Moreover, the mounting frame 6 can be used effectively in the heat radiation from the front side.

  Furthermore, since the mounting piece 53 is formed in an arm shape and is disposed so as not to close the opening O on the back side of the mounting frame 6, the back side of the mounting frame 6 is in an open state, and has a heat dissipation property. Improvement can be expected.

  As described above, according to this embodiment, it is possible to provide a lighting fixture that promotes heat dissipation from the front side and the back side of the light emitting module 2 and effectively suppresses the temperature rise of the light emitting element.

  Next, the lighting fixture which concerns on the 2nd Embodiment of this invention is demonstrated with reference to FIG.10 and FIG.11. 10 is a side view showing the right half of the light distribution member and the mounting frame in cross section, FIG. 11 is a top view, FIG. 12 shows the light emitting module and the connection member, and FIGS. 13 to 15 show the downlight. The process of installing on the ceiling surface is shown. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

  In the present embodiment, the light emitting module 2 is a high output type as compared with the first embodiment. The outer shell 21 has a substantially rectangular parallelepiped shape having a slightly longer length. The outer shell 21 accommodates a substrate on which a light emitting element as a light source is mounted, and a phosphor thin film layer 22 is provided on the front side of the light emitting element.

  The light emitting module 2 is arranged such that the power supply line introduction port 24 is directed to the attachment portion of the power supply unit 7, that is, the attachment position of the holder 71, and the longitudinal direction coincides with the attachment position. By arranging the light emitting module 2 in this manner, the wiring length of the power supply line W between the light emitting module 2 and the power supply unit 7 can be shortened.

  Similarly to the first embodiment, both side surfaces 21a and the back surface 21b of the outer shell 21 are formed of a metal material such as aluminum having thermal conductivity so that heat generated from the light emitting element is conducted. It has become.

  Further, a blower mechanism 32 is built in the central portion of the heat sink 3 to cause the diaphragm to vibrate by an electromagnetic coil, thereby forcing air to flow to the heat radiating fins 31. Therefore, since air is blown from the blower mechanism 32 of the heat sink 3 by energization and the heat dissipating fins 31 are forcibly cooled, the temperature rise of the light emitting element can be reliably suppressed.

  The power supply unit 7 is rotatably attached to a holder 71 attached to the heat sink 3 via a hinge 72, but is attached at a high position in the rear side direction. Thereby, when the downlight 1 is installed by being embedded in the ceiling, the insertion into the embedded hole H can be facilitated while there are dimensional restrictions on the embedded hole H formed in the ceiling surface.

Next, the installation method of the downlight 1 is demonstrated with reference to FIG. 13 thru | or FIG. First, the power line wired on the back of the ceiling C is pulled out from the embedded hole H formed in the ceiling C and connected to the power terminal block 74 of the power unit 7.
(First stage)

As shown in FIG. 13, the power supply unit 7 is inserted into the embedded hole H from the rear end side. And it arrange | positions so that the part of the heat sink 3 may fit in the embedding hole H. FIG. In this case, the outer diameter dimensions of the heat sink 3 and the mounting frame 6 are substantially the same or have a dimensional relationship in which the heat sink 3 is formed smaller than the mounting frame 6. This makes it easier to insert and avoid being caught.
Next, the main body side of the downlight 1 is slightly rotated clockwise and tilted in the drawing.
(Second stage)

As shown in FIG. 14, the downlight 1 is moved so that the edge of the embedding hole H (for the thickness of the ceiling) is inserted into the recess Cc formed between the heat sink 3 and the mounting frame 6. In this case, the recess Cc is formed, so that the light emitting module 2 can be inserted into the embedding hole H even though the length of the light emitting module 2 is large. That is, although the light emitting module 2 protrudes P from the mounting frame 6 on the power supply unit 7 side, the edge of the embedding hole H can be inserted into the recess Cc, so that the light emitting module 2 can be inserted.
Next, the main body side of the downlight 1 is slightly rotated counterclockwise in the drawing and moved in the direction of the arrow to push up the mounting frame 6 and insert it into the embedded hole H.
(3rd stage)

  As shown in FIG. 15, the mounting bracket 62 of the mounting frame 6 is operated to fix the mounting frame 6 to the back of the ceiling. Next, the light distribution member 4 is disposed inside the mounting frame 6 by the mounting spring 43. As a result, the installation is completed, the decorative frame 42 is brought into contact with the periphery of the embedding hole, and the support leg 75 of the power supply unit 7 is brought into contact with the back of the ceiling to support the power supply unit 7.

  As described above, according to the present embodiment, similarly to the first embodiment, a lighting fixture that promotes heat radiation from the front side and the back side of the light emitting module 2 and effectively suppresses the temperature rise of the light emitting element is provided. can do.

In addition, this invention is not limited to the structure of the said embodiment, A various deformation | transformation is possible in the range which does not deviate from the summary of invention. The light emitting module and the heat sink are not particularly limited to the configuration of the above embodiment. For example, the outer shell of the light emitting module can be applied to a rectangular parallelepiped shape or a cylindrical shape.
Moreover, solid light emitting elements, such as LED and EL element, are applicable to the light emitting element provided in a light emitting module.

1 ... Lighting fixture (downlight), 2 ... Light emitting module,
3 ... heat sink, 4 ... light distribution member,
5 ... connecting member, 6 ... mounting frame,
7 ... Power supply unit, 21 ... Outer shell,
23 ... Light emitting part, 32 ... Blower mechanism,
51 ... side wall, 52 ... back wall,
53 ... Mounting piece, O ... Opening

Claims (3)

A light emitting module having a light emitting element as a light source and having a light emitting portion from which light from the light source is emitted, and at least a part of the outer shell having thermal conductivity and thermally coupled to the light emitting element;
A heat sink provided on the back side of the light emitting module and thermally coupled to a part of the outer shell;
A light distribution member including a reflection surface that surrounds a light emitting portion of the light emitting module and expands in a light irradiation direction;
A substantially cylindrical mounting frame having thermal conductivity disposed around the light distribution member;
A connection member that connects a part of the outer shell of the light emitting module and the mounting frame to transfer heat from the outer shell to the mounting frame;
The lighting fixture characterized by comprising.   The lighting fixture according to claim 1, wherein an opening is formed on a back side of the mounting frame, and the connection member is disposed so as not to close the opening.   The lighting apparatus according to claim 1 or 2, wherein an outer shell dimension of the heat sink and the mounting frame in a direction perpendicular to a vertical direction is substantially equal or the heat sink is smaller than the mounting frame.

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