JP2015201378A - Led lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device which has a structure enabling replacement of an LED lamp and efficiently transmits heat generated by the LED lamp attached to a socket of the LED lighting device to the device body side.SOLUTION: In an LED lighting device, a socket is included and an LED lamp, which is inserted into or removed from the socket, is detachably attached to the socket to light. The LED lighting device includes: a device body which movably supports the socket so that the socket may move in an insertion/removal direction of the LED lamp; and biasing means which biases the socket, to which the LED lamp is attached, in an insertion direction of the LED lamp.

Description

  The present invention relates to an LED illumination device using a light emitting diode (hereinafter referred to as an LED (Light Emitting Diode) as appropriate) as a light source, and more particularly to an LED illumination device in which an LED lamp can be replaced.

  2. Description of the Related Art In recent years, with increasing environmental awareness, LED lighting devices using LED chips with excellent power savings as light sources have been actively used. In particular, recently, the development of technology to improve the light emission efficiency of LED chips and reduce light loss in LED lighting devices has progressed, and in terms of lighting capacity, the same brightness as before has been secured with fewer LED chips than conventional ones. It is becoming possible.

If the number of LED chips to be mounted can be reduced, the power consumption of the LED lighting device can be reduced, and the scale of the lighting circuit for lighting the LED chip can be reduced, so that the LED lighting device can be reduced in size and weight, and the cost can be reduced. There is.

By the way, since the LED chip which is a light emitting element is weak at high temperature, high heat dissipation performance is calculated | required by the LED lighting apparatus. As a method for transferring heat generated from the LED chip to the housing (heat radiating part) while ensuring high heat dissipation performance via multiple parts, the parts related to the heat transfer path are made of metal or ceramic. It is effective to use a material having a high thermal conductivity and to ensure a contact area as large as possible between the parts where the parts are in contact. In order to reduce the thermal resistance of the surface contact, it is also effective to screw and press the contact portion between the components and to insert a heat conductive sheet between the components.

In the current LED lighting device, the board on which the LED chip is mounted is directly screwed to the heat sink, or the heat radiation fins are provided to improve the performance of the heat radiation part, and metal parts are frequently used for the heat transfer parts. In many cases, measures are taken such as sandwiching a heat conductive sheet between parts.

Therefore, simply reducing the size and weight of the LED lighting device reduces the heat dissipation performance due to the reduction in the surface area of the housing as the housing is downsized, and the contact area between the components is relatively reduced. It is difficult to ensure high heat dissipation performance due to a decrease in heat conduction performance that tends to be proportional to the contact area.

For example, Patent Document 1 discloses an LED module and an entrance of a frame with respect to a downlight that includes a base portion to which the LED module is screwed and a frame having an entrance and an exit for light emitted from the LED module. There has been disclosed a technique for achieving a reduction in size by securing a sufficient space between them and providing a reflecting member at the periphery of the entrance of the frame to achieve good heat dissipation performance and reduction in light loss.

On the other hand, LED lamps with more energy saving will be developed in the future, and if there are a wide variety of LED lamps with different emission colors and light orientations and LED lamps with excellent appearance design, etc. It is expected that the demand for lamp replacement will increase, such as using the main unit as it is, replacing only the LED lamp with an energy-saving type, or replacing only the LED lamp according to the type of object to be illuminated, or according to individual tastes. The

As an LED lighting device capable of easily exchanging the lamp, Patent Document 2 discloses a downlight using an LED bulb, and connects the tube portion of the LED bulb with a reflective portion (housing) and a heat through a thermally conductive packing. A technique for improving the heat dissipation performance and reducing the size by connecting them together is disclosed.

In the device structure disclosed in Patent Document 1, the LED module is screwed inside the lighting device. Screwing has the effect of lowering the thermal resistance of the surface contact by applying pressure to the contact part between parts, and good heat dissipation performance is guaranteed, but it is not possible to replace only the LED lamp, so you should replace the lamp. If desired, the entire lighting device body must be replaced. In the LED lighting device disclosed in Patent Document 2, it is difficult to secure a contact area between the LED bulb and the LED lighting device, and pressurization to the contact portion is structurally difficult.

JP 2011-210621 A JP 2013-143235 A

In view of the above-described problems, the object of the present invention is to have a structure in which an LED lamp can be replaced and to efficiently transfer heat generated by the LED lamp mounted on the socket of the LED lighting device to the apparatus main body side. The object is to provide an LED lighting device.

The present invention provides, as a first means for solving the above-described problems, an LED illumination device that has a socket and is detachably mounted with an LED lamp that is inserted into and removed from the socket. An apparatus main body supporting the LED lamp so as to be movable in the insertion / extraction direction of the LED lamp, and an urging means for urging the socket for mounting the LED lamp in the insertion direction of the LED lamp.

According to the present invention, as a second means for solving the above-described problem, the biasing means is a coil spring, and the expansion / contraction direction of the coil spring is a direction substantially coincident with the insertion / extraction direction of the LED lamp. It is characterized by.

According to the present invention, as a third means for solving the above-described problem, the socket is an E-type socket, and the movable direction of the socket is a direction substantially coincident with the insertion / extraction direction of the LED lamp. It is characterized by.

According to the present invention, as a fourth means for solving the above-described problem, the socket projects in a direction perpendicular to the central axis and passing through the central axis of the cylindrical portion in which the E-type threaded portion is formed. It has an overhang | projection part, The said overhang | projection part is overhanging outward rather than the diameter of the upper end outer periphery of the said coil spring, It is characterized by the above-mentioned.

According to the present invention, as a fifth means for solving the above-described problem, when the LED lamp is mounted in the socket, an E-type threaded engagement with the LED lamp of the socket is inside the coil spring. The portion is located, and the E-type base of the LED lamp is located inside the E-type screwing portion.

The present invention is characterized in that as a sixth means for solving the above-mentioned problems, there is provided a mechanism for preventing the rotation of the socket with respect to a rotation operation for inserting and removing the LED lamp.

The present invention is characterized in that the LED lamp is mounted as a seventh means for solving the above-mentioned problems.

ADVANTAGE OF THE INVENTION According to this invention, while having the structure which can replace | exchange LED lamp, it can provide the LED lighting apparatus which can transfer the heat_generation | fever of the LED lamp with which the socket of LED lighting apparatus was mounted | worn efficiently to the apparatus main body side. Become.

It is a perspective view of the LED lighting apparatus of this invention. It is sectional drawing of the LED lighting apparatus of this invention equipped with the LED lamp. It is a disassembled perspective view of the LED lighting apparatus of this invention equipped with the LED lamp. It is a perspective view which shows the process in which the LED lighting apparatus of this invention is attached to a ceiling. It is a perspective view which shows the state which attached the LED lighting apparatus of this invention to the ceiling. It is a disassembled perspective view which shows the biasing means (coil spring) used for this invention. It is a perspective view which shows the method of attaching an LED lamp to the LED lighting apparatus of this invention. It is sectional drawing of the LED lighting apparatus of this invention. It is sectional drawing of the state which mounted | wore the LED lighting apparatus of this invention with the LED lamp. It is a disassembled perspective view of an LED lamp. It is sectional drawing of an LED lamp.

Preferred embodiments of the present invention will be described below in detail with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.
As an example of the LED lighting device, a downlight that can be attached to an attachment hole provided in the ceiling will be described. In the following description, it is assumed that the downlight is attached to the ceiling for the sake of convenience, and the illumination light of the downlight is emitted downward.

(1. Configuration of LED lighting device)
As shown in FIGS. 1 to 3, the LED lighting device 1, here, the downlight 10 shown as an embodiment, relays the commercial power to the LED lamp 6 and the terminal unit 2 serving as a commercial power input unit. In order to fix the socket 3, the device main body 5 that defines the irradiation angle of the illumination light emitted from the LED lamp 6 and releases the heat generated from the LED lamp 6 to the external environment, and the ceiling plate 8. It is comprised from the apparatus fixing member 7 of this.

(2. Downlight fixing method)
When the downlight 10 is attached to the ceiling board 8, the downlight 10 is inserted from below the attachment hole 81 provided in the ceiling board 8, as shown in FIGS. Between the baffle outer casing 514 formed along the outer periphery of the baffle lower opening 513 (see FIG. 1) and the “V” -shaped attachment plate spring 71 provided on the baffle top plate 511, the ceiling plate 8 The baffle 51 is fixed to the ceiling plate 8 with the peripheral portion 82 of the mounting hole 81 interposed therebetween. Note that a ring-shaped cushion 72 (see FIG. 2) is placed on the baffle outer flange portion 514, and the elastic cushion 72 is in contact with the lower surface of the ceiling plate 8, which may damage the lower surface of the ceiling plate 8. There are few. The attachment leaf spring 71 is usually made of metal.

(3-1 Terminal part)
The terminal unit 2 includes a terminal block 21 electrically connected to a commercial power supply source, a terminal cover 22 made of an insulating material, and a socket connecting member 23. The socket connecting member 23 is a rectangular metal plate processed into an “L” shape, and the terminal block 21 is attached to one end in the long side direction. The socket connecting member 23 is attached to a socket cover 31 having such a shape that two continuous surfaces in a cube are opened. The terminal cover 22 has a bottomed cylindrical shape and covers the terminal block 21 from below.
In addition, although the terminal part 2 is provided with the terminal block 21, the terminal cover 22, and the socket connection member 23, it is good also as a structure provided with the terminal block 21 at least depending on the structure by the side of a socket.
Further, although not shown here, the terminal unit 2 may be provided with a switch that electrically detects that the standard is different and stops receiving commercial power, in case an illumination lamp having a different standard is mounted. Good.

(3-2 Socket part)
The socket unit 3 includes a socket cover 31 and a socket 32. The socket cover 31 is made of metal, and is manufactured, for example, by pressing a hot dip galvanized steel sheet having a thickness of 0.8 mm to 1 mm. A fixed side 311 provided with a screw through hole is formed outwardly on the lower side of the three side plates of the socket cover 31 that are not opened. The socket cover 31 is fixed to the baffle top plate 511 of the baffle 51 with screws.
A socket 32 is accommodated in the socket cover 31. When the E-type base 61 of the LED lamp 6 is screwed into the socket 32 and the LED lamp 6 is attached to the downlight 10 and a switch (not shown) is turned on, the power is received through the socket 32 and lights up.

The socket 32 includes a socket tube portion 321 having a socket function to be electrically connected to the base 61 of the LED lamp 6, a wire electrically connected to the terminal portion 2, and a wire that covers an electrical connection portion between the socket tube portion 321. And a cover portion 322. The socket cylinder portion 321 is exposed to a space inside the baffle 51 through a connecting material opening wall 524 of a baffle connecting member 52 described later. The socket is an E17 type socket, and the inner peripheral surface of the socket tube portion 321 is a screw surface that is screwed with the shell portion of the base 61 of the LED lamp 6. Thereby, the LED lamp 6 in which the E17 type cap 61 of the LED lamp 6 is screwed into the socket 32 is detachably mounted.
The socket tube portion 321 has an overhanging portion that protrudes outward at the top. Here, the overhanging portion is shared by the wiring cover portion 322. As an example, the overhanging portion extends along one imaginary line segment that passes through the central axis of the socket tube portion 321 and is orthogonal to the central axis. In addition, the overhang | projection amount should just protrude over the outer periphery of the upper end part of the coil spring 41 mentioned later.

(3-3 Device body)
The apparatus main body 5 includes a baffle 51 and a baffle connecting member 52. The baffle 51 has an external appearance similar to a slightly widened cylinder with a top plate. The baffle 51 plays a role in which the baffle lower opening 513 defines the irradiation angle of the downlight 10 and releases heat generated from the LED lamp 6 to the external environment. Although it is in a trade-off relationship with downsizing of the lighting device, it is desirable that the surface area of the baffle 51 is as large as possible from the viewpoint of releasing heat to the outside.
The baffle outer casing 514 provided on the outer periphery of the baffle lower opening 513 is used to fix the downlight 10 to the ceiling board 8 as described above.
A baffle connecting member 52 that plays a role of transferring heat from the LED lamp 6 to the baffle 51 is fixed to the back surface side (inner surface side) of the baffle top plate 511, that is, the surface on the baffle lower opening 513 side with screws.

The baffle connecting member 52 has a cylindrical shape having a connecting material top plate 523 at one end and a connecting material outer flange 525 at the other end (lower end), and has a shape similar to a hat hat. A connecting material top plate opening 522 is provided at the center of the connecting material top plate 523, and a connecting material opening wall 524 extends upward in a pipe shape around the connecting material top plate opening 522. As described above, when the LED lamp 6 is mounted, the socket tube portion 321 descends through the inside of the connecting material opening wall 524. The connecting material opening wall 524 has an effect of increasing the rigidity of the connecting material top plate 523 which is a contact surface with the baffle 51 due to the effect of the rib. Since the connecting material top plate 523 is hardly deformed, flatness is ensured in contact with the baffle 51, and good thermal contact is possible. Furthermore, since the contact portion is screwed, higher heat transfer performance is ensured.
In addition, the lower surface of the connecting material outer flange 525 is a contact surface (see FIG. 2) where the baffle connecting member 52 contacts the LED lamp 6. The connecting material outer flange portion 525 also has a flatness by increasing the rigidity by forming a rib that bends the outer peripheral end portion upward. Thereby, the favorable contact of the contact part of the baffle connection member 52 and the LED lamp 6 is also possible.
In addition, since the baffle 51 and the baffle connection member 52 require high heat conductivity from a viewpoint of a heat transfer function, both are metal. As the metal material, an aluminum material can be used in addition to a steel material suitable for deep drawing such as a cold rolled steel plate having a thickness of 0.8 mm to 1.5 mm. The fixing may be other than screws, for example, welding, rivets or the like.
Here, the apparatus main body 5 includes the baffle 51 and the baffle connecting member 52, but it is sufficient that at least the baffle 51 is provided, and the baffle connecting member 52 may not be provided. However, it is necessary to have a contact portion with the LED lamp 6.

The baffle top plate 511 has a circular shape in plan view, and a baffle top plate opening 512 is provided at the center position thereof. Also, the connecting material top plate 523 of the baffle connecting member 52 is provided with a connecting material top plate opening 522 corresponding to the baffle top plate opening 512. That is, when the connecting material cylinder portion 521 is viewed in plan view, it forms a circular shape, and the connecting material top plate opening 522 is provided at the center position. The central position of the connecting material top plate opening 522 and the central position of the baffle top plate opening 512 are provided. And approximately match. The connecting material top plate opening 522 has an opening diameter smaller than that of the baffle top plate opening 512. As described above, a pipe-shaped connecting material opening wall 524 extending upward is provided at the periphery of the connecting material top plate opening 522, and this connecting material opening wall 524 passes through the baffle top plate opening 512 upward. A baffle connecting member 52 is attached to the baffle 51.
Note that when the connecting material opening wall 524 passes through the baffle top plate opening 512 upward, the surface of the connecting material top plate 523 contacts the back surface of the baffle top plate 511 as described above.

At the time of replacement of the LED lamp 6, the socket tube portion 321 is provided so as to be movable upward or downward while being fitted to the connecting material top plate opening 522, and the pipe-shaped connecting material opening wall 524 is located with respect to the socket tube portion 321. It can fulfill the guide function that supports smooth vertical movement.

If the opening diameter of the connection material top plate opening 522 is too large with respect to the socket cylinder part 321, the play at the time of the movement of the socket cylinder part 321 cannot be suppressed, and the guide function cannot be performed sufficiently. On the other hand, if it is too small, contact with the socket tube portion 321 occurs frequently and smooth movement may be hindered. Accordingly, it is desirable that the opening diameter of the connecting material top plate opening 522 is slightly larger than the outer diameter of the socket tube portion 321 and the dimensional margin is in the range of 0.2 mm to 5 mm in diameter.

Further, if the opening diameter of the baffle top plate opening 512 is too large, the contact area with the baffle connecting member 52 is reduced, and the heat conduction performance between the baffle 51 and the baffle connecting member 52 is deteriorated. There is a risk of interference with 524. Therefore, the opening diameter of the baffle top plate opening 512 is slightly larger than the outer diameter of the connecting material opening wall 524, and the dimensional margin is preferably in the range of 0.2 mm to 5 mm in diameter.

As will be described later, the substrate support member 63 of the LED lamp 6 has a heat transfer surface 632, and when the LED lamp 6 is attached to the downlight 10, the heat transfer surface 632 is a connecting material outer flange 525 of the baffle connecting member 52. Contact with the back of the. The connecting material outer casing 525 is an important surface for transferring heat generated by the LED lamp 6 to the baffle connecting member.
Here, although the baffle 51 and the baffle connecting member are two separate parts, they may be integrally processed by, for example, metal die casting.

(3-4 Energizing means)
An urging means 4 is provided between the socket part 3 and the apparatus main body part 5. As an example of the biasing means 4, a spring is used here. Many types of springs, such as a coil type and a leaf spring type, are known. Here, a coil type coil spring 41 is used. The coil spring 41 has, for example, four windings of a steel wire having a diameter of 1 mm, the upper end circular diameter in plan view is 25 mm, and the coil length in front view is 25 mm.
The coil spring 41 has a lower end diameter larger than an upper end diameter. That is, the coil spring 41 has a downward spreading shape (conical frustum shape) in which the winding diameter increases as it moves from the upper end to the lower end.
The coil spring 41 plays a role of supporting the socket 32 so as to be movable in the extending direction of the central axis of the threaded portion of the base 61 of the LED lamp 6. Specifically, the lower end portion of the coil spring 41 is arranged outside the connecting material top plate opening 522 in a state of being fitted around the connecting material opening wall 524. The upper end of the coil spring 41 supports the wiring cover portion 322 from below with the socket cylinder portion 321 being disposed inside the coil spring 41.
In a state in which the LED lamp 6 is mounted on the downlight 10, the socket tube portion 321 is disposed inside the coil spring 41, and is screwed onto a screw surface provided on the inner periphery of the socket tube portion 321, so that the LED lamp 6. Is attached.

  As will be described later, when the LED lamp 6 is mounted on the downlight 10, the coil spring 41 is compressed with the socket tube portion 321 disposed therein, and the restoring force pushes the wiring cover portion 322 of the socket 32 upward. Work as. The expansion / contraction direction of the coil spring 41 is the same direction as the LED lamp 6 insertion / extraction direction, and the movable direction of the socket 32 is also the same direction as the LED lamp 6 insertion / extraction direction.

However, if the diameter of the upper end portion of the coil spring 41 is too larger than the diameter of the socket tube portion 321, the virtual center of the circle of the coil spring 41 in plan view does not match the virtual center of the circle of the socket tube portion 321 in plan view. There is a possibility that the socket cylinder 321 is in an eccentric position in the so-called coil spring 41. When such an eccentricity occurs, the force by which the coil spring 41 pushes the wiring cover portion 322 of the socket 32 upward acts at a position eccentric from the virtual center of the socket tube portion 321, so that the coil spring 41 is in an untargeted shape. The socket 32 disposed in the coil spring 41 may be tilted with respect to the apparatus main body 5. When the socket 32 is tilted, the LED lamp 6 attached to the socket 32 is also tilted with respect to the apparatus main body 5. Therefore, the contact between the heat transfer surface 632 of the LED lamp 6 and the lower surface of the connecting material outer flange portion 525 of the baffle connecting member 52 does not contact the entire surface, that is, a so-called one-sided state and does not contact the LED lamp 6. There is a possibility that the heat conduction performance from the first to the baffle connecting member 52 is significantly deteriorated.

In order to avoid such deterioration of the heat conduction performance, it is necessary to prevent the eccentricity of the socket 32 in the coil spring 41, and the difference between the diameter of the upper end portion of the coil spring 41 and the outer shape of the socket tube portion 321 is as follows. It is desirable to make it as small as possible without causing frequent contact. Here, the diameter of the upper end portion of the coil spring 41 is slightly larger than the diameter of the socket tube portion 321, and the dimensional margin is preferably in the range of 0.2 mm to 5 mm in diameter. The diameter of the lower end portion of the coil spring 41 is larger than the diameter of the upper end portion so that the coil spring 41 can be stably disposed on the connecting material top plate 523. The lower end diameter is slightly larger than the pipe outer diameter of the connecting material opening wall 524 formed in a pipe shape, and the dimensional margin is preferably in the range of 0.5 mm to 10 mm in diameter.

(3-5 LED lamp)
As shown in FIGS. 10 and 11, the LED lamp 6 includes an LED substrate 64 on which a plurality of LED chips 65 are mounted on one lower surface, and a substrate support member 63 on which the LED substrate 64 is fixed to the substrate support surface 633. And an insulating cover 62 with a base provided with an E-type base 61, and a light diffusion cover 67.

The circuit components of the lighting circuit (not shown) for lighting the LED chip 65 are mounted at a high density on the upper surface of the LED substrate 64, that is, the central portion of the surface where the LED chip 65 is not mounted, and the protrusion of the substrate support member 63. It is stored in the inner space of the part 631.

The back surface of the LED substrate 64 on which the LED chip 65 is mounted, that is, the surface on which circuit components of the lighting circuit are mounted is in contact with the substrate support member 63. A contact area with the substrate support member 63 sufficient to efficiently transfer heat generated from the LED chip 65 to the substrate support member 63 is secured on the outer peripheral portion of the surface of the LED substrate 64 on which the circuit components are mounted. .
The LED substrate 64 is screwed to the substrate support member 63, and the contact surface between the substrate support member 63 and the LED substrate 64 ensures high heat transfer performance.
The heat generated by the plurality of LED chips 65 is transferred from the LED substrate 64 to the substrate support member 63, transferred from the heat transfer surface 632 to the baffle connecting member 52, further transferred to the baffle 51, and dissipated to the external environment. Here, the heat transfer surface 632 has a shape that matches the lower surface of the connecting material outer flange 525 of the baffle connecting member 52, and is important for transferring heat generated by the LED lamp 6 to the baffle connecting member 52. It is a surface that plays a role.

(3-6 Function of biasing means)
Next, the specific insertion position of the coil spring 41 and the function when the LED lamp 6 is mounted on the downlight 10 will be described with reference to FIG. In FIG. 6, some of the constituent members of the downlight 10 are not shown so that the position of the coil spring 41 can be easily illustrated.
The socket tube portion 321 is inserted into the circular shape of the coil spring 41 in plan view. The upper end of the coil spring 41 is in contact with the lower surface of the wiring cover portion 322 of the socket 32, and the lower end of the coil spring 41 passes through the baffle top plate opening 512 of the baffle 51 and is in contact with the connection material top plate 523 of the baffle connection member 52. . A pipe-shaped opening wall 524 is inserted under the coil spring 41.

In order to attach the LED lamp 6 to the downlight 10 in this state, as shown in FIG. 7, the connecting material top plate opening 522 of the baffle connecting member 52 fixed to the inside of the baffle 51 from the lower opening 513 of the baffle 51. The base 61 of the LED lamp 6 is inserted and screwed into the socket tube 321.

When the base 61 is screwed into the socket tube 321 while rotating the LED lamp 6 from the state before the LED lamp 6 is attached (FIG. 8), the LED lamp 6 is heated by the heat transfer surface 632 of the substrate support member 63 (FIG. 3). Is gradually moved upward until it comes into contact with the back surface of the connecting material outer flange 525 of the baffle connecting member 52, and when the LED lamp 6 comes into contact with the rear surface of the connecting material outer flange 525, the upward movement of the LED lamp 6 stops. However, at this stop position, the top portion 611 of the LED lamp 6 does not reach the power supply terminal (not shown) provided at the uppermost portion of the socket tube portion 32 and the electrical connection is not completed.

Here, when the LED lamp 6 is screwed into the socket tube portion 321, the socket 32 tends to rotate in the direction of rotating the screw, but the socket cover 31 has two strip-shaped socket guides 312 (FIG. 3, 9) are provided in parallel and face each other in the vicinity of the side wall (planar) portion of the wiring cover portion 322. When the LED lamp 6 is screwed into the socket tube portion 321, the wiring cover portion 322 contacts the socket guide 312, so that the socket 32 is prevented from rotating. The socket guide 312 does not necessarily have a strip shape, and a rib for preventing the socket 32 from rotating inside the socket cover 31 may be formed on the socket cover 31.
Further, in the initial stage when the LED lamp 6 is inserted into the socket 32, the socket 32 is pushed by the LED lamp 6 and pushed upward in the socket cover 31, but the socket 32 comes into contact with the top plate of the socket cover 31. 32 does not come off the socket cover 31.

Furthermore, if the screwing operation of the LED lamp 6 is continued, the LED lamp 6 cannot move upward, so that the socket 32 moves downward while compressing the coil spring 41. The socket 32 descends to a position (FIG. 9) where the top 611 of the LED lamp 6 reaches the power supply terminal of the socket 32 and the LED lamp 6 can no longer be screwed. Here, the mounting operation of the LED lamp 6 is completed.

In the state where the mounting of the LED lamp 6 is completed, the restoring force of the coil spring 41 that is always stored by compression is the heat transfer surface 632 of the substrate support member 63 that is a component of the LED lamp 6 and the baffle connecting member 52. A pressure is applied to the contact with the back surface of the connecting material outer flange 525. Thereby, since the LED lamp 6 and the baffle connecting member 52 are in contact with each other with a strong contact pressure, high heat conduction performance is maintained, and heat generated from the LED lamp 6 is efficiently transferred to the baffle connecting member 52. The heat transmitted to the baffle coupling member 52 is radiated from the baffle 51 through heat exchange through heat exchange by convection with the surrounding atmosphere.
In addition, since the coil spring 41 is made of metal, the restoring force from the above-described compressed state has almost no secular change (deterioration) that cannot be ignored with plastic or rubber. The contact surface maintains high heat conduction performance over a long period of time. Further, since the coil spring 41 is made of metal, it can also contribute to heat transfer from the LED lamp 6 to the baffle 51.

  As described above, in the present embodiment, with the LED lamp attached to the downlight, the LED lamp and the LED lamp are always restored by the restoring force from the compressed state of the coil spring as the biasing means provided between the socket and the baffle. The baffle part can be brought into contact with a high contact pressure, and the heat generated from the LED lamp can be efficiently radiated.

In addition, the socket is assumed to be an E-type screw-in type, and the base of the LED lamp is adapted to this, but the socket type and socket size are not limited to this. As mentioned above, although embodiment of this invention was described, this invention is not restricted to these embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, various changes and modifications that can be naturally made by those skilled in the art are also included in the present invention.

  The present invention can be widely applied to LED lighting fixtures such as downlights installed along the ceiling surfaces of showrooms and halls, as well as conference rooms and office rooms.

1: LED lighting fixture 10: Downlight 2: Terminal portion 21: Terminal block 22: Terminal cover 23: Socket connecting member 3: Socket portion 31: Socket cover 311: Fixed side 312: Socket guide 32: Socket 321: Socket tube portion 322: Wiring cover part
4: Biasing means 41: Coil spring 5: Device main body 51: Baffle 511: Baffle top plate 512: Baffle top plate opening 513: Baffle lower opening 514: Baffle outer flange 52: Baffle connecting member 521: Connecting material cylinder 522: Connecting material top plate opening 523: Connecting material top plate 524: Connecting material opening wall 525: Connecting material outer casing 6: LED lamp unit 61: E-type base 611: Base top 62: Insulating cover with base 63: Substrate support Member 631: Protruding portion 632: Heat transfer surface 633: Substrate support surface 64: LED substrate 65: LED chip 67: Light diffusion cover 7: Lighting device fixing member 71: Mounting plate spring 72: Cushion 8: Ceiling plate 81: Mounting hole 82: Hole edge

Claims (7)

In an LED lighting device that has a socket and is detachably mounted with an LED lamp that is inserted into and removed from the socket, and lit.
An apparatus main body for supporting the socket so as to be movable in the insertion / extraction direction of the LED lamp;
An LED lighting device, comprising: an urging unit that urges the socket in which the LED lamp is mounted in an insertion direction of the LED lamp. The LED illuminating apparatus according to claim 1, wherein the urging means is a coil spring, and an extension / contraction direction of the coil spring is a direction substantially coinciding with an insertion / extraction direction of the LED lamp.   3. The LED lighting device according to claim 1, wherein the socket is an E-type socket, and a direction in which the socket can move is substantially the same as an insertion / extraction direction of the LED lamp. The socket has a projecting portion that projects through the central axis of the cylindrical portion on which the E-type threaded portion is formed and is orthogonal to the central axis, and the projecting portion is an outer periphery of the upper end of the coil spring. The LED illumination device according to claim 1, wherein the LED illumination device protrudes outward from the diameter of the LED illumination device.   In a state where the LED lamp is mounted in the socket, an E-type threaded portion of the socket with the LED lamp is located inside the coil spring, and the LED lamp is located inside the E-type threaded portion. The LED illumination device according to claim 1, wherein an E-type base is located.   The LED lighting device according to claim 1, further comprising a mechanism that prevents the socket from rotating with respect to a rotation operation for inserting and removing the LED lamp. The LED lighting device according to claim 1, wherein the LED lamp is mounted.