JP6409358B2 - External processing apparatus and device manufacturing system - Google Patents

Description

  The present invention relates to an external processing apparatus and a device which are externally incorporated into a device manufacturing apparatus including a plurality of small processing apparatuses each performing a single process on a wafer for manufacturing a micro unit device. The present invention relates to a device manufacturing system including a manufacturing apparatus and an external processing apparatus.

  A conventional semiconductor device production line includes a plurality of large processing apparatuses arranged in a large clean room, and a large diameter wafer such as 12 inches (304.8 mm) is processed in each processing apparatus. It is common to manufacture thousands of semiconductor chips from a single wafer. However, in the conventional huge semiconductor manufacturing system, each manufacturing apparatus is huge and cannot be easily moved in the factory. In addition, there are problems such as the fact that the amount of capital investment has reached several hundred billion yen, which is huge, and that it is difficult to put the results of research and development related to device manufacturing such as semiconductors into practical production lines.

  On the other hand, in recent years, a production system for manufacturing a small amount of semiconductor called a “minimal fab” has been developed (see Patent Document 1). In other words, “minimal fab” means that a plurality of small processing devices each executing a single processing process of a device manufacturing process are arranged in a normal processing chamber whose cleanness is not necessarily controlled. The device is manufactured by executing various processing processes on the wafer while transporting the wafer.

  In this case, since there is no need for a large clean room for accommodating the production line, there is an advantage that the energy efficiency related to the production can be greatly improved as compared with the conventional production line for semiconductor devices. In addition, the “minimal fab” has an advantage that the amount of capital investment for constructing a production line can be significantly reduced as compared with a conventional production line for semiconductor devices.

JP 2012-054414 A

  By the way, as a lithography process in such a low-volume production semiconductor manufacturing production system (minimal fab), a technique using a small laser exposure apparatus has been developed. However, when a small laser exposure apparatus is used, it is considered difficult to form a fine pattern of 1 μm or less. On the other hand, the conventional electron beam lithography apparatus can form a fine pattern of 1 μm or less, but there is a problem that if the device is downsized, it becomes weak against vibration. It is considered difficult to incorporate it into a manufacturing production system (minimal fab). For this reason, a miniaturized electron beam drawing apparatus having the same size as other small processing apparatuses has not been developed in a small volume production semiconductor manufacturing production system (minimal fab).

  The present invention has been made to solve the above-mentioned problems, and its purpose is to change a large processing apparatus into a low-volume production semiconductor production system without greatly changing the basic concept of the low-volume production semiconductor production system. An object is to provide an external processing apparatus and a device manufacturing system that can be incorporated.

  An external processing apparatus according to an embodiment of the present invention is externally incorporated into a device manufacturing apparatus including a plurality of small processing apparatuses each performing a single process on a wafer for manufacturing a device in a very small unit. An external processing apparatus, the processing chamber having an internal cleanness controlled, and one of a plurality of processes that are disposed in the processing chamber and that manufactures the ultra-small device for the wafer A large-scale processing apparatus for performing a process, and a delivery unit having an opening / closing portion that opens and closes when the wafer is transferred to the processing chamber, and automatically transfers a wafer between the large-scale processing apparatus and the delivery unit. Is performed.

  In the external processing apparatus according to an embodiment of the present invention, the large processing apparatus may be an electron beam drawing apparatus.

  In the external processing device according to an embodiment of the present invention, the external processing device may be movable.

  In the external processing apparatus according to an embodiment of the present invention, the processing chamber has a length of 6.0 m to 6.1 m, a height of 2.5 m to 2.6 m, and a width of 2.4 m to 2.5 m. It may be.

  In the external processing apparatus according to an embodiment of the present invention, the wafer may be circular, and the diameter of the wafer may be 0.5 inches (12.7 mm).

  In the external processing apparatus according to an embodiment of the present invention, a transport line for transporting the wafer is provided between each small processing apparatus of the device manufacturing apparatus and the external processing apparatus, and the delivery unit includes You may receive the said wafer conveyed from the conveyance line.

  A device manufacturing system according to an embodiment of the present invention includes a device manufacturing apparatus including a plurality of small processing apparatuses that respectively execute a single process on a wafer for manufacturing a device of an extremely small unit, and the device manufacturing apparatus. And the external processing device incorporated externally.

  In the device manufacturing system according to an embodiment of the present invention, the large processing apparatus is an electron beam drawing apparatus, at least one of the plurality of small processing apparatuses is an exposure apparatus, and each of the small processing apparatuses of the device manufacturing apparatus. A transfer line for transferring the wafer is provided between the wafer and the external processing apparatus, and the transfer line is capable of switching the wafer that has been subjected to the preprocessing step to the electron beam drawing apparatus or the exposure apparatus. It may be conveyed.

According to the present invention, it is possible to incorporate a large processing apparatus into a low-volume production semiconductor production system without greatly changing the basic concept of the low-volume production semiconductor production system.

FIG. 1 is a schematic plan view showing an external processing apparatus according to an embodiment of the present invention and a device manufacturing apparatus in which the external processing apparatus is incorporated. FIG. 2 is a perspective view showing a small processing apparatus. FIG. 3 is a schematic cross-sectional view showing an external processing apparatus according to an embodiment of the present invention. FIG. 4 is a schematic plan view showing an external processing apparatus and a device manufacturing apparatus according to a modification.

  Embodiments of the present invention will be described below with reference to the drawings. Drawing is an illustration and may exaggerate a characteristic part for explanation, and may differ from an actual thing. In addition, the present invention can be implemented with appropriate modifications without departing from the technical idea. Note that, in the following drawings, the same portions are denoted by the same reference numerals, and some detailed description may be omitted.

  First, a configuration of a device manufacturing apparatus in which an external processing apparatus according to an embodiment of the present invention is incorporated will be described. FIG. 1 is a schematic plan view showing an external processing apparatus according to the present embodiment and a device manufacturing apparatus in which the external processing apparatus is incorporated.

  A device manufacturing apparatus 10 shown in FIG. 1 is a so-called “minimal fab”, a small-scale production semiconductor manufacturing production system, and includes a building 11 and a plurality of small processing devices 20 arranged in the building 11. An external processing device 30 according to the present embodiment is arranged outside the building 11. The device manufacturing apparatus 10 and the external processing apparatus 30 constitute a device manufacturing system 60 according to this embodiment.

  The building 11 may be, for example, a normal factory building whose cleanness is not controlled. The building 11 is provided with a door 12 for moving the wafer W between the small processing apparatus 20 and the external processing apparatus 30.

  Each of the small processing apparatuses 20 executes a single process on the wafer W on which a semiconductor device of an extremely small unit is manufactured. For example, a coater (coating machine), an exposure machine, an etcher (etching apparatus), a developer, and the like. (Developer), cleaning machine, CVD furnace, sputtering apparatus and the like.

As will be described later, the small processing apparatus 20 includes one or a small number of semiconductor devices of a very small unit, typically, a circular 0.5 inch (12.7 mm) size wafer W. A wafer size for manufacturing a semiconductor device is set as a processing target and is processed one by one. From such a 0.5 inch diameter wafer, one 1 cm ² semiconductor device can be fabricated. That is, the device manufacturing apparatus 10 according to the present embodiment employs a processing method in which wafers of a wafer size for manufacturing a semiconductor device in a minimum unit are used, and the wafers are processed one by one. In the present specification, the “wafer” is not limited to a circular outer shape, but includes a wafer having an arbitrary outer shape.

  In this case, the wafers W are stored one by one in the hermetic transfer container 13 and are sequentially transferred between the small processing apparatuses 20 in this state. The wafer W is taken out from the hermetic transfer container 13 by the small processing apparatus 20, and various processes for manufacturing semiconductor devices are performed in the small processing apparatus 20. Thereafter, the wafer W is accommodated in the hermetic transfer container 13 by the small processing apparatus 20 and unloaded from the small processing apparatus 20.

  Each small processing apparatus 20 is a substantially rectangular parallelepiped standardized to an external dimension of width about 294 mm × depth about 450 mm × height about 1440 mm, and its weight varies depending on each small processing apparatus 20, but is typically about 60 kilograms. Of these, the process processing main body 21 has a substantially rectangular parallelepiped desktop size standardized to be about 30 cm in length and width and about 70 cm in height, and its weight is typically about 30 kilograms. In the present specification, the “small processing apparatus” refers to a processing apparatus having the above-mentioned standardized outer dimensions. The “large processing apparatus” refers to a processing apparatus having a larger outer dimension than the “small processing apparatus”, and includes, for example, a processing apparatus having a conventional shape.

  As shown in FIG. 2, each small processing apparatus 20 includes a process processing main body 21 having a processing space for performing a single processing process, a raw material supply system, an exhaust system, a control device, and the like for the process processing main body 21. And an upper and lower connecting spacer 23 that connects the process main body 21 and the apparatus lower part 22 in a separable manner.

  Among these, the process main body 21 is a sealed type that can be shut off from the outside air, and is cleaned inside by a local cleaning device included in the lower part 22 of the apparatus or provided outside the small processing apparatus 20. Can be done.

  In addition, a wafer entrance / exit chamber 24 for transferring one wafer W between each small processing apparatus 20 and the hermetic transfer container 13 is connected to one surface of each small processing apparatus 20. The wafer entrance / exit chamber 24 has a standardized outer shape and the same configuration, and is arranged at a predetermined position with respect to any small processing apparatus 20 and configured to function in the same manner. ing. The wafer entrance / exit chamber 24 has a function similar to that of a load lock chamber and an unload lock chamber provided in a processing chamber in a conventional semiconductor manufacturing apparatus, and a docking port 25 for connection to the hermetic transfer container 13 is provided. It is provided at the top.

  Further, a transfer line 14 for transferring the hermetic transfer container 13 for storing the wafer W is provided between the small processing apparatuses 20. The transport line 14 may be a mechanism that is normally used in a semiconductor manufacturing apparatus such as a belt type or a mechanical type. The transfer line 14 is configured to transfer the sealed transfer container 13 between the wafer entrance / exit chambers 24 of the small processing apparatus 20.

  Next, an outline of the external processing device 30 according to the present embodiment will be described with reference to FIG.

  As shown in FIG. 3, the external processing device 30 includes a processing chamber 31 composed of a clean room, a large processing device 40 disposed in the processing chamber 31, and a delivery unit 32 provided on the side surface of the processing chamber 31. I have. The external processing apparatus 30 has a configuration capable of moving together with the processing chamber 31 and can be appropriately moved by a conveying means such as a forklift.

  The processing chamber 31 is provided with, for example, an air supply / exhaust system 33 for removing dust in the air, thereby controlling the cleanness inside the processing chamber 31 and increasing the cleanness. In addition, the processing chamber 31 can control the environment such as temperature, humidity, airflow, vibration, AC magnetic field and the like in the processing chamber 31 by an environment control device (not shown). The environmental control device may be incorporated in the processing chamber, or may be a system that introduces air controlled from the outside with respect to temperature, humidity, and the like.

  The processing chamber 31 has a rectangular parallelepiped shape having a general container size, and the size (outer shape) is, for example, 6.0 m to 6.1 m in length and 2.5 m to 2.6 m in height. The width is 2.4 m to 2.5 m. Thus, the external processing device 30 can be easily transported using a general container transportation means such as a forklift or a container truck. Moreover, when the external processing apparatus 30 is a self-propelled type, this becomes easy to move. In the present specification, the length of the processing chamber 31 refers to the length along the axis (X axis) orthogonal to the vertical axis (Z axis) of one side of the rectangular parallelepiped constituting the processing chamber 31. The height of 31 refers to the length along the vertical axis (Z axis) of one side of the rectangular parallelepiped constituting the processing chamber 31, and the width of the processing chamber 31 refers to the one side of the rectangular parallelepiped constituting the processing chamber 31. The length along the axis (Y axis) perpendicular to the vertical axis (Z axis) and the longitudinal axis (X axis) is said.

  The delivery unit 32 has an opening / closing window (opening / closing part) 34 that opens and closes when the wafer W is transferred to the processing chamber 31. With this open / close window 34, the sealed transfer container 13 can be carried into and out of the processing chamber 31. The delivery unit 32 has the same configuration as the wafer entrance / exit chamber 24 of the small processing apparatus 20 described above, and the open / close window 34 has the same configuration as the docking port 25 of the small processing apparatus 20. Yes. In this case, since the delivery unit 32 has the same configuration as the standardized wafer entrance / exit chamber 24, the external processing apparatus 30 can be easily incorporated externally into various device manufacturing apparatuses 10. .

  The delivery unit 32 is connected to the transfer line 14 of the device manufacturing apparatus 10 described above. In this case, the delivery unit 32 is configured to receive the wafer W accommodated in the sealed transfer container 13 transferred from the transfer line 14. Further, the delivery unit 32 is configured to automatically deliver the wafer W to and from the large processing apparatus 40.

  That is, the delivery unit 32 closes the opening / closing window 34 after carrying the sealed transport container 13 through the opened opening / closing window 34. Thereafter, the wafer W is taken out from the hermetic transfer container 13 in a state where the degree of cleanliness inside is increased, and the wafer W is delivered to the large processing apparatus 40. On the other hand, after processing the wafer W by the large processing apparatus 40, the delivery unit 32 receives the wafer W from the large processing apparatus 40 and stores it in the hermetic transfer container 13. Thereafter, the opening / closing window 34 is opened, and the wafer W accommodated in the sealed transfer container 13 is transferred to the transfer line 14.

  Further, the large processing apparatus 40 executes one of a plurality of processes for manufacturing a device in a minimum unit for the wafer W, and includes, for example, an electron beam drawing apparatus.

  As shown in FIG. 3, a large processing apparatus (electron beam drawing apparatus) 40 irradiates an electron beam onto a wafer W coated with an electron beam resist by a small processing apparatus 20 made of a coater, for example. A predetermined pattern shape is drawn on the resist.

  The large processing apparatus 40 includes, for example, an electron gun 44 including a cathode 41, a Wehnelt 42, and an anode 43, an alignment coil 45, a first aperture 46, a reduction lens system 47, a second aperture 48, an objective, and the like. And a lens 49. The electron gun 44, the alignment coil 45, the first aperture 46, the reduction lens system 47, the second aperture 48, and the objective lens 49 are surrounded by the housing 50. The wafer W is placed on the stage 51 when the electron beam is irradiated, and can be moved horizontally by the stage 51. The basic configuration of the electron beam drawing apparatus is substantially the same as that conventionally known, and detailed description thereof is omitted here.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, in the small processing apparatus 20 of the device manufacturing apparatus 10, an electron beam resist is applied to the entire surface of the wafer W in the small processing apparatus 20 made of a coater such as a spin coater. After the electron beam resist coating process is completed, the wafer W is taken out from the wafer entrance / exit chamber 24 of the small processing apparatus 20 (coater) while being accommodated in the hermetic transfer container 13.

  Next, the wafer W is transferred to the small processing apparatus 20 including a pre-baking apparatus via the transfer line 14. Subsequently, the wafer W is taken out from the hermetic transfer container 13 in the wafer entrance / exit chamber 24 of the small processing apparatus 20 (pre-baking apparatus) and subjected to pre-baking processing. Specifically, the solvent is removed from the electron beam resist applied to the wafer W. After the pre-baking process is completed, the wafer W is taken out from the wafer entrance / exit chamber 24 of the small processing apparatus 20 (pre-baking apparatus) while being accommodated in the hermetic transfer container 13.

  Subsequently, the wafer W is unloaded from the building 11 of the device manufacturing apparatus 10 by the transfer line 14 and transferred toward the external processing apparatus 30. After reaching the external processing apparatus 30, the wafer W is transferred from the transfer line 14 to the delivery unit 32 of the external processing apparatus 30. The delivery unit 32 closes the opening / closing window 34 after carrying the sealed transport container 13 through the opened opening / closing window 34. Thereafter, the delivery unit 32 increases the cleanliness of the interior, takes out the wafer W from the hermetic transfer container 13, and automatically delivers the taken-out wafer W to the large-scale processing apparatus 40 including an electron beam drawing apparatus.

  In the large processing apparatus 40 (electron beam drawing apparatus), the wafer W is irradiated with an electron beam, and a predetermined pattern shape is drawn on the electron beam resist on the wafer W. In this case, an electron beam is emitted from the electron gun 44 of the large processing apparatus 40 (electron beam drawing apparatus), and the center of the electron beam is adjusted to the optical axis by the alignment coil 45, and the first aperture 46 blurs the surrounding blur. The portion is cut, the beam diameter is reduced through the reduction lens system 47, the beam is shaped by the second aperture 48, focused on the wafer W by the objective lens 49, and drawing is performed.

  After the electron beam drawing process is completed in this way, the wafer W is automatically delivered from the large processing apparatus 40 (electron beam drawing apparatus) to the delivery unit 32. The delivery unit 32 accommodates the wafer W in the sealed transfer container 13 with the internal cleanliness enhanced, and then opens the opening / closing window 34 to deliver the sealed transfer container 13 to the transfer line 14.

  Next, the wafer W is again carried into the building 11 of the device manufacturing apparatus 10 from the external processing apparatus 30 by the transfer line 14 and is sent to the small processing apparatus 20 including a developing device. Subsequently, the wafer W is taken out from the hermetic transfer container 13 in the chamber 24 before entering / exiting the wafer in the small processing apparatus 20 (developing apparatus) and subjected to development processing. Specifically, the unexposed portion of the electron beam resist applied to the wafer W is removed by the developer. After the development processing is completed, the wafer W is taken out from the wafer entrance / exit chamber 24 of the small processing apparatus 20 (developing apparatus) while being accommodated in the hermetic transfer container 13.

  Thereafter, various processes are performed on the wafer W by sequentially passing through a small processing apparatus 20 such as an etcher, thereby producing a device in a minimum unit.

  As described above, according to the present embodiment, the external processing apparatus 30 is a device manufacturing device configured by a plurality of small processing apparatuses 20 each performing a single process on a wafer W for manufacturing a device of a minimum unit. Incorporated externally to the device 10. In addition, the device manufacturing apparatus 10 includes a large processing apparatus 40 that executes one of a plurality of processes for manufacturing a device in an extremely small unit with respect to the wafer W. Thereby, the large-sized processing apparatus 40 can be incorporated in a low-volume production semiconductor manufacturing production system without significantly changing the basic concept of the low-volume production semiconductor production production system (minimal fab).

  Further, according to the present embodiment, since the large processing apparatus 40 is an electron beam drawing apparatus, it is possible to form a fine pattern of 1 μm or less, particularly 100 nm or less on the wafer W with high resolution and high accuracy. It becomes. In particular, it is possible to link an electron beam lithography apparatus, which is considered difficult to downsize due to problems such as weakness to vibration, to a small-volume production semiconductor manufacturing production system (minimal fab).

  Further, according to the present embodiment, since the external processing apparatus 30 is movable, it is easy to carry and position the work when changing the layout of the device manufacturing apparatus 10 or moving the device manufacturing apparatus 10. Can be done. Further, since the external processing device 30 has a general container size, it can be transported using a general transportation means such as a forklift or a container truck.

  In addition, according to the present embodiment, since the external processing apparatus 30 is movable, the same external processing apparatus 30 can be used only when necessary in a plurality of device manufacturing lines.

  Further, according to the present embodiment, the device manufacturing apparatus 10 has the transfer line 14 for transferring the wafer W between the small processing apparatuses 20, and the delivery unit 32 of the external processing apparatus 30 is transferred from the transfer line. Received wafer W. Thereby, the wafer W can be automatically transferred between the external processing apparatus 30 and each small processing apparatus 20, and labor saving can be achieved.

  However, the present invention is not limited to this, and when the number of processes is small, an operator may manually transfer the hermetic transfer container 13 between the external processing apparatus 30 and each small processing apparatus 20. In this case, it is possible to flexibly cope with various processing processes.

  In the above-described embodiment, the case where the resist on the wafer W is exposed using the large processing apparatus 40 (electron beam drawing apparatus) of the external processing apparatus 30 has been described as an example. However, the present invention is not limited to this, and at least one of the small processing apparatuses 20 is an exposure apparatus including a small laser exposure apparatus or the like, and the exposure apparatus and the large processing apparatus 40 (electron beam drawing apparatus) are selectively used as a wafer. The resist on W may be exposed.

  In this case, as shown in FIG. 4, in the building 11 of the device manufacturing apparatus 10, a small processing apparatus 20A (coater), a small processing apparatus 20B (pre-baking apparatus), a small processing apparatus 20C (exposure apparatus), and a small processing apparatus 20D. (Developing device) and a small processing device 20E (Etcher) are arranged. An external processing device 30 having a large processing device (electron beam drawing device) 40 is disposed outside the building 11. In the transfer line 14, the wafer W that has been subjected to the pretreatment process by the small processing apparatus 20 (coater) and the small processing apparatus 20B (pre-baking apparatus) can be switched to the external processing apparatus 30 or the small processing apparatus 20C (exposure apparatus). It is designed to be transported. Thus, for example, when a single device is produced or when a fine pattern is formed, a large processing apparatus (electron beam drawing apparatus) 40 is used, and when a large number of devices that do not include a fine pattern are produced, a small size is used. The processing method can be flexibly switched according to the device, such as using the processing apparatus 20C (exposure apparatus). In FIG. 4, the same parts as those in the embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals.

  In the above embodiment, the case where the large processing apparatus 40 is an electron beam drawing apparatus has been described as an example. However, the present invention is not limited thereto, and the large processing apparatus 40 may be, for example, a CVD apparatus or an ion implantation apparatus. good.

  It is also possible to appropriately combine a plurality of constituent elements disclosed in the embodiment and the modification examples as necessary. Or you may delete a some component from all the components shown by the said embodiment and modification.

DESCRIPTION OF SYMBOLS 10 Device manufacturing apparatus 13 Sealed conveyance container 14 Conveyance line 20 Small processing apparatus 21 Process processing main-body part 22 Apparatus lower part 23 Vertical connection spacer 24 Wafer entrance / exit room 30 External processing apparatus 31 Processing chamber 32 Delivery unit 33 Supply / exhaust system 34 Opening / closing window 34 (Opening and closing part)
40 Large processing equipment 60 Device manufacturing system

Claims (8)

A device manufacturing apparatus comprising: a building whose degree of cleanness is not controlled; and a plurality of small processing apparatuses each performing a single process on a wafer which is arranged in the building and which produces a device of a minimum unit An external processing device incorporated externally outside the building ,
A processing chamber with a controlled internal cleanliness,
A large-scale processing apparatus that is disposed in the processing chamber and that executes one of a plurality of processes for manufacturing the ultra-small device on the wafer;
A delivery unit having an opening / closing part that opens and closes when the wafer is transported to the processing chamber;
An external processing apparatus, wherein a wafer is automatically transferred between the large processing apparatus and the transfer unit.   The external processing apparatus according to claim 1, wherein the large processing apparatus is an electron beam drawing apparatus.   3. The external processing apparatus according to claim 1, wherein the external processing apparatus is movable.   4. The method according to claim 1, wherein the processing chamber has a length of 6.0 m to 6.1 m, a height of 2.5 m to 2.6 m, and a width of 2.4 m to 2.5 m. An external processing apparatus according to claim 1.   5. The external processing apparatus according to claim 1, wherein the wafer is circular, and the diameter of the wafer is 0.5 inches (12.7 mm).   A transfer line for transferring the wafer is provided between each small processing apparatus of the device manufacturing apparatus and the external processing apparatus, and the delivery unit receives the wafer transferred from the transfer line. An external processing apparatus according to any one of claims 1 to 5. A device manufacturing apparatus including a plurality of small processing apparatuses each performing a single process on a wafer for manufacturing a device in a very small unit;
A device manufacturing system comprising: the external processing apparatus according to claim 1, which is externally incorporated into the device manufacturing apparatus.   The large processing apparatus is an electron beam drawing apparatus, at least one of the plurality of small processing apparatuses is an exposure apparatus, and the wafer is placed between each small processing apparatus of the device manufacturing apparatus and the external processing apparatus. 8. A device according to claim 7, wherein a transfer line for transferring is provided, and the transfer line transfers the pre-processed wafer to the electron beam drawing apparatus or the exposure apparatus in a switchable manner. Manufacturing system.

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