JP6405810B2 - Module parts manufacturing method - Google Patents

Module parts manufacturing method Download PDF

Info

Publication number
JP6405810B2
JP6405810B2 JP2014181857A JP2014181857A JP6405810B2 JP 6405810 B2 JP6405810 B2 JP 6405810B2 JP 2014181857 A JP2014181857 A JP 2014181857A JP 2014181857 A JP2014181857 A JP 2014181857A JP 6405810 B2 JP6405810 B2 JP 6405810B2
Authority
JP
Japan
Prior art keywords
support member
elements
substrate
module component
filling material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014181857A
Other languages
Japanese (ja)
Other versions
JP2016058464A (en
Inventor
兼二 難波
兼二 難波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2014181857A priority Critical patent/JP6405810B2/en
Publication of JP2016058464A publication Critical patent/JP2016058464A/en
Application granted granted Critical
Publication of JP6405810B2 publication Critical patent/JP6405810B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

本発明は、半導体素子と基板との接続強度を高めるモジュール部品、及びモジュール部品製造方法に関する。   The present invention relates to a module component that increases the connection strength between a semiconductor element and a substrate, and a module component manufacturing method.

モジュール部品において、半導体素子の周辺に樹脂コートを形成するモジュール部品が知られている。このモジュール部品は、半導体素子と基板との接続強度を高める。   As a module component, a module component in which a resin coat is formed around a semiconductor element is known. This module component increases the connection strength between the semiconductor element and the substrate.

モジュール部品の一例が特許文献１に記載されている。特許文献１に記載されたモジュール部品は、半導体スイッチの線膨張係数と基板の線膨張係数の違いに由来する、熱応力によるはんだのクラックを、半導体スイッチの周辺に形成したポリイミドコートの機械的強度及び応力分散効果により防止する。   An example of a module component is described in Patent Document 1. The module component described in Patent Document 1 is based on the mechanical strength of a polyimide coat in which solder cracks due to thermal stress are formed around the semiconductor switch due to the difference between the linear expansion coefficient of the semiconductor switch and the linear expansion coefficient of the substrate. And prevent it by the stress dispersion effect.

特開２０１３−１８３０３８号公報JP 2013-183038 A

しかしながら、上述した特許文献１に記載された技術は、半導体スイッチの周辺だけにポリイミドコートが形成されている。半導体素子と基板とを接続する接続材料は導電性材料であり、特許文献１においてははんだを使用している。このようなモジュール部品において、半導体素子の厚みが薄い場合、素子の発熱を逃がすこと、十分な接続強度を得ることを両立させるためには、接続材料の厚みを一定量確保する必要がある。しかし、素子の厚みが１００マイクロメートル以下の場合、接続材料の供給量を制御することが困難である。そのため、供給量過多による素子回路面への接続材料の這い上がりや、供給量不足による接続強度不足が発生する。したがって、特許文献１に記載された技術は、電気的特性の劣化や接続不良が発生するという問題点がある。   However, in the technique described in Patent Document 1 described above, a polyimide coat is formed only around the semiconductor switch. The connection material for connecting the semiconductor element and the substrate is a conductive material, and in Patent Document 1, solder is used. In such a module component, when the thickness of the semiconductor element is thin, it is necessary to secure a certain amount of the thickness of the connection material in order to achieve both the escape of heat generation of the element and sufficient connection strength. However, when the thickness of the element is 100 micrometers or less, it is difficult to control the supply amount of the connection material. For this reason, the connection material to the element circuit surface rises due to the excessive supply amount, and the connection strength is insufficient due to the insufficient supply amount. Therefore, the technique described in Patent Document 1 has a problem that electrical characteristics are deteriorated and connection failure occurs.

本発明の目的の一例は、上述した問題点を解決できるモジュール部品およびモジュール部品製造方法を提供することにある。   An object of the present invention is to provide a module part and a module part manufacturing method that can solve the above-described problems.

本発明の一形態における第１のモジュール部品は、あらかじめ素子間および素子の側面の周囲に充填材料が形成された複数個の素子を、素子と充填材料の形成物の底面全域に接続材料を供給され、基板上にフェイスアップで実装される。   In the first module component according to one aspect of the present invention, a plurality of elements, in which a filling material is formed in advance between the elements and around the side surfaces of the elements, are supplied to the entire bottom surface of the formed element and the filling material. And mounted face up on the board.

本発明の一形態における第１のモジュール部品製造方法は、支持部材上に複数個の素子をフェイスアップで搭載し、支持部材上に搭載された複数個の素子の周囲を覆うように充填材料を形成し、支持部材より周囲に充填材料が形成された複数個の素子を剥離し、基板上に接続材料を供給し、周囲に絶縁性樹脂膜が形成された複数個の素子をフェイスアップで実装し、複数個の素子上に形成された任意の素子電極間、又は任意の素子電極と基板電極間を金属ワイヤで接続する。   In a first module component manufacturing method according to an aspect of the present invention, a plurality of elements are mounted face-up on a support member, and a filling material is provided so as to cover the periphery of the plurality of elements mounted on the support member. Form, peel off multiple elements with filling material formed around the support member, supply the connection material on the substrate, and mount multiple elements with insulating resin film around the face up Then, between any element electrodes formed on a plurality of elements, or between any element electrodes and a substrate electrode, is connected with a metal wire.

本発明によれば、モジュール部品の接続信頼性の向上が図られ、また電気的不良を抑制できるという効果が得られる。   According to the present invention, it is possible to improve the connection reliability of module parts and to obtain an effect of suppressing electrical failure.

図１は、本発明の第１の実施の形態におけるモジュール部品１０００の構成を示す上面図である。FIG. 1 is a top view showing a configuration of a module component 1000 according to the first embodiment of the present invention. 図２は、第１の実施の形態の図１におけるＡ−Ａ‘断面図である。FIG. 2 is a cross-sectional view taken along the line AA ′ in FIG. 1 of the first embodiment. 図３は、第１の実施の形態に係る支持部材８００上に素子２００、２０１、２０２が載せられ、各素子の位置が決定された製造途中のモジュール部品の一例を示す断面図である。FIG. 3 is a cross-sectional view showing an example of a module part in the process of being manufactured in which the elements 200, 201, 202 are placed on the support member 800 according to the first embodiment and the positions of the elements are determined. 図４は、第１の実施の形態に係る支持部材８００上において位置が決定された素子２００、２０１、２０２側面の周囲および各素子間に、充填材料４００による層が形成された製造途中のモジュール部品の一例を示す断面図である。FIG. 4 shows a module in the middle of manufacturing in which a layer of a filling material 400 is formed around the side surfaces of the elements 200, 201, and 202 whose positions are determined on the support member 800 according to the first embodiment and between the elements. It is sectional drawing which shows an example of components. 図５は、第１の実施の形態に係る支持部材８００上の形成物から支持部材８００が剥離された製造途中のモジュール部品の一例を示す断面図である。FIG. 5 is a cross-sectional view showing an example of a module component in the middle of manufacture in which the support member 800 is peeled from the formed product on the support member 800 according to the first embodiment. 図６は、第１の実施の形態に係る支持部材８００から剥離された形成物が基板１００上に接続材料３００を介して接続された製造途中のモジュール部品の一例を示す断面図である。FIG. 6 is a cross-sectional view showing an example of a module component in the middle of manufacture in which the formed product peeled from the support member 800 according to the first embodiment is connected to the substrate 100 via the connection material 300. 図７は、第１の実施の形態に係る基板１００上面の各基板電極と各素子上面の各素子電極とを金属ワイヤを用いて電気的に接続されたモジュール部品の一例を示す断面図である。FIG. 7 is a cross-sectional view showing an example of a module component in which each substrate electrode on the upper surface of the substrate 100 and each element electrode on the upper surface of each element are electrically connected using a metal wire according to the first embodiment. . 図８は、本発明の第２の実施形態に係るモジュール部品１００１の構成を示す断面図である。FIG. 8 is a cross-sectional view showing a configuration of a module component 1001 according to the second embodiment of the present invention. 図９は、第２の実施の形態に係る支持部材８０１上に素子２００、２０１、２０２が載せられ、各素子の位置が決定された製造途中のモジュール部品の一例を示す断面図である。FIG. 9 is a cross-sectional view showing an example of a module part in the process of being manufactured in which the elements 200, 201, and 202 are placed on the support member 801 according to the second embodiment and the positions of the elements are determined. 図１０は、第２の実施の形態に係る支持部材８０１上において位置が決定された素子２００、２０１、２０２側面の周囲、底面の一部および各素子間に、充填材料４０１による層が形成された製造途中のモジュール部品の一例を示す断面図である。FIG. 10 shows that layers of the filling material 401 are formed around the side surfaces of the elements 200, 201, and 202 whose positions are determined on the support member 801 according to the second embodiment, a part of the bottom surface, and between the elements. It is sectional drawing which shows an example of the module component in the middle of manufacture. 図１１は、第２の実施の形態に係る支持部材８０１上の形成物から支持部材８０１が剥離された製造途中のモジュール部品の一例を示す断面図である。FIG. 11 is a cross-sectional view illustrating an example of a module component in the middle of manufacture in which the support member 801 is peeled from the formed product on the support member 801 according to the second embodiment. 図１２は、第２の実施の形態に係る支持部材８０１から剥離された形成物が基板１００上に接続材料３０１を介して接続された製造途中のモジュール部品の一例を示す断面図である。FIG. 12 is a cross-sectional view showing an example of a module component in the middle of manufacture in which the formed product peeled off from the support member 801 according to the second embodiment is connected to the substrate 100 via the connection material 301. 図１３は、第２の実施の形態に係る基板１００上面の各基板電極と各素子上面の各素子電極とを金属ワイヤを用いて電気的に接続されたモジュール部品の一例を示す断面図である。FIG. 13 is a cross-sectional view showing an example of a module component in which each substrate electrode on the upper surface of the substrate 100 and each element electrode on the upper surface of each element are electrically connected using a metal wire according to the second embodiment. .

次に、本発明の実施形態について図面を参照して詳細に説明する。   Next, embodiments of the present invention will be described in detail with reference to the drawings.

［第１の実施の形態］
図１は、本発明の第１の実施の形態におけるモジュール部品１０００の構成を示す上面図である。また、図１のＡ−Ａ‘断面図を図２に示す。図１および図２を参照すると、モジュール部品１０００は、基板１００上に素子２００、２０１、２０２を備える。また、電子部品である素子２００、２０１、２０２の側面の周囲および各素子間には充填材料４００による層が形成されている。基板１００の上面と素子２００、２０１、２０２および充填材料４００の底面とは接続材料３００を介して固定または接着される。 [First Embodiment]
FIG. 1 is a top view showing a configuration of a module component 1000 according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. Referring to FIGS. 1 and 2, the module component 1000 includes elements 200, 201, and 202 on a substrate 100. Further, a layer made of the filling material 400 is formed around the side surfaces of the elements 200, 201, and 202 that are electronic components and between the elements. The upper surface of the substrate 100 and the elements 200, 201, 202 and the bottom surface of the filling material 400 are fixed or bonded via the connection material 300.

モジュール部品１０００は、基板１００の上面に６つの基板電極６００、６０１を備える。基板電極６００は、図１の左側に形成された３つの電極で、基板電極６０１は、図１の右側に形成された３つの電極である。また、各素子の上面に６つの素子電極を備え、金属ワイヤによって特定の素子間が電気的に接続される。各素子の底面及び側面には、電気的接続のための電極および端子は、形成されていない。素子２００の片側３つの素子電極は、基板電極６００に接続され、素子２０２の片側３つの素子電極は、基板電極６０１に接続される。   The module component 1000 includes six substrate electrodes 600 and 601 on the upper surface of the substrate 100. The substrate electrode 600 is the three electrodes formed on the left side of FIG. 1, and the substrate electrode 601 is the three electrodes formed on the right side of FIG. Moreover, six element electrodes are provided on the upper surface of each element, and specific elements are electrically connected by metal wires. Electrodes and terminals for electrical connection are not formed on the bottom and side surfaces of each element. Three element electrodes on one side of the element 200 are connected to the substrate electrode 600, and three element electrodes on one side of the element 202 are connected to the substrate electrode 601.

その電気的接続の一例をさらに詳しく説明する。基板１００の上面の３つの基板電極６００と素子２００の上面の３つの素子電極５００とは、金属ワイヤ７００によってそれぞれ電気的に接続される。素子２００の上面の３つの素子電極５０１と素子２０１の上面の３つの素子電極５０２とは、金属ワイヤ７０１によってそれぞれ電気的に接続される。素子２０１の上面の３つの素子電極５０３と素子２０２の上面の３つの素子電極５０４とは、金属ワイヤ７０２によってそれぞれ電気的に接続される。素子２０２の上面の３つの素子電極５０５と基板１００の上面の３つの基板電極６０１とは、金属ワイヤ７０３によってそれぞれ電気的に接続される。なお、基板１００上の基板電極の数および各素子上の素子電極の数はこれに限らない。   An example of the electrical connection will be described in more detail. The three substrate electrodes 600 on the upper surface of the substrate 100 and the three element electrodes 500 on the upper surface of the element 200 are electrically connected by metal wires 700, respectively. The three element electrodes 501 on the upper surface of the element 200 and the three element electrodes 502 on the upper surface of the element 201 are electrically connected by metal wires 701, respectively. The three element electrodes 503 on the upper surface of the element 201 and the three element electrodes 504 on the upper surface of the element 202 are electrically connected by metal wires 702, respectively. The three element electrodes 505 on the upper surface of the element 202 and the three substrate electrodes 601 on the upper surface of the substrate 100 are electrically connected by metal wires 703, respectively. Note that the number of substrate electrodes on the substrate 100 and the number of element electrodes on each element are not limited thereto.

充填材料４００は、絶縁性を有する材料である。たとえば感光性樹脂や熱可塑性樹脂、及び熱硬化性樹脂が用いられる。   The filling material 400 is an insulating material. For example, a photosensitive resin, a thermoplastic resin, and a thermosetting resin are used.

接続材料３００は、基板１００と素子２００、２０１、２０２を接続する。接続材料３００は、通電中の素子が放出する熱を拡散することおよび素子と基板との十分な接続強度を得ることが求められる。通常、銀（Ａｇ）や銅（Ｃｕ）などの金属フィラを含有した導電性樹脂が使用される。なお、基板１００および素子２００、２０１、２０２の接続材料３００が接触する面部分には、電極等の導電材料が形成されていない。接続材料３００は、導電性樹脂であるが、素子２００、２０１、２０２の間の電気的接続材料として、および各素子と基板１００との間の電気的接続材料として機能させる目的で使用されていない。しかし、素子のタイプによっては、そのような目的を兼ねてもよい。   The connection material 300 connects the substrate 100 and the elements 200, 201, and 202. The connection material 300 is required to diffuse heat released from the energized element and to obtain a sufficient connection strength between the element and the substrate. Usually, a conductive resin containing a metal filler such as silver (Ag) or copper (Cu) is used. Note that a conductive material such as an electrode is not formed on a surface portion where the substrate 100 and the connection material 300 of the elements 200, 201, and 202 are in contact with each other. The connection material 300 is a conductive resin, but is not used for the purpose of functioning as an electrical connection material between the elements 200, 201, 202 and as an electrical connection material between the elements and the substrate 100. . However, depending on the type of element, such a purpose may be used.

次に、第１の実施の形態におけるモジュール部品１０００の製造方法について図３〜図７を参照して説明する。なお、図３〜図７は図２と同様のＡ−Ａ‘断面図として示す。   Next, the manufacturing method of the module component 1000 in 1st Embodiment is demonstrated with reference to FIGS. 3 to 7 are shown as A-A 'sectional views similar to FIG.

まず、支持部材８００上に素子２００、２０１、２０２がフェイスアップで載せられ、モジュール部品１０００における各素子の位置が決定される。図３は、本実施の形態に係る支持部材８００上に素子２００、２０１、２０２が載せられ、各素子の位置が決定された製造途中のモジュール部品の一例を示す断面図である。   First, the elements 200, 201, and 202 are placed face up on the support member 800, and the position of each element in the module component 1000 is determined. FIG. 3 is a cross-sectional view showing an example of a module part in the middle of manufacture in which the elements 200, 201, and 202 are placed on the support member 800 according to the present embodiment and the position of each element is determined.

支持部材８００は、載せられた素子を固定するために表面に一定の粘着性を有する部材である。支持部材８００としてはたとえばアクリルシートが用いられる。また、一定の粘着性とは、後述する剥離工程で容易に支持部材８００上の形成物から支持部材８００が剥離される程度の粘着力を有することである。本実施形態では平面状の支持部材８００を用いる。   The support member 800 is a member having a certain stickiness on the surface in order to fix the mounted element. As the support member 800, for example, an acrylic sheet is used. Moreover, fixed adhesiveness is having adhesive force of the grade which the support member 800 peels easily from the formation on the support member 800 at the peeling process mentioned later. In the present embodiment, a planar support member 800 is used.

次に、位置が決定された素子２００、２０１、２０２の各側面の周囲および各素子間に、充填材料４００による層が形成される。図４は、本実施の形態に係る支持部材８００上において位置が決定された素子２００、２０１、２０２側面の周囲および各素子間に、充填材料４００による層が形成された製造途中のモジュール部品の一例を示す断面図である。充填材料４００の供給方法としては、ディスペンス方式など、どのような方法でもよい。充填材料４００の供給量は、層形成後に各素子と密着性が確保でき、また各素子の周囲が全て覆われる供給量であればよい。また充填材料４００の層の厚さは、充填材料４００の層が接する素子の厚みより薄くても構わない。また、素子の厚みよりも充填材料４００の層が厚く形成された場合においても、素子上の素子電極に充填材料４００が付着していなければよい。また、充填材料４００による層の形成方法は、たとえば支持部材８００上の素子２００、２０１、２０２側面の周囲および各素子間に樹脂状の材料を注入し、硬化して層を形成する。硬化の手段は使用する材料の種類によって決定される。たとえば、支持部材８００としてアクリルシートが用いた場合、アクリルシートに耐熱性がないため、充填材料４００として感光性樹脂を使用する。この場合、支持部材８００上の素子２００、２０１、２０２の側面の周囲および各素子間に感光性樹脂を注入した後、光を照射して感光性樹脂を硬化させる。   Next, a layer of filler material 400 is formed around and between each side of the elements 200, 201, 202 whose positions have been determined. FIG. 4 shows a module part being manufactured in which a layer of the filling material 400 is formed around the side surfaces of the elements 200, 201, and 202, whose positions are determined on the supporting member 800 according to the present embodiment, and between the elements. It is sectional drawing which shows an example. As a method for supplying the filling material 400, any method such as a dispensing method may be used. The supply amount of the filling material 400 may be a supply amount that can ensure adhesion with each element after forming the layer and that covers the entire periphery of each element. Further, the thickness of the layer of the filling material 400 may be smaller than the thickness of the element with which the layer of the filling material 400 is in contact. Even when the layer of the filling material 400 is formed thicker than the thickness of the element, the filling material 400 may not be attached to the element electrode on the element. In addition, as a method for forming a layer using the filling material 400, for example, a resinous material is injected around the side surfaces of the elements 200, 201, and 202 on the support member 800 and between the elements and cured to form a layer. The curing means is determined by the type of material used. For example, when an acrylic sheet is used as the support member 800, a photosensitive resin is used as the filling material 400 because the acrylic sheet has no heat resistance. In this case, after injecting a photosensitive resin around the side surfaces of the elements 200, 201, and 202 on the support member 800 and between the elements, the photosensitive resin is cured by irradiation with light.

次に、前工程によって形成された支持部材８００上の形成物から支持部材８００が剥離される。図５は本実施の形態に係る支持部材８００上の形成物から支持部材８００が剥離された製造途中のモジュール部品の一例を示す断面図である。支持部材８００を剥離するに際して、前工程によって形成された支持部材８００上の形成物を、図示しない吸着固定手段により固定した上で支持部材８００を剥離してもよい。   Next, the support member 800 is peeled from the formed product on the support member 800 formed by the previous process. FIG. 5 is a cross-sectional view showing an example of a module component in the middle of manufacture in which the support member 800 is peeled from the formed product on the support member 800 according to the present embodiment. When the support member 800 is peeled off, the support member 800 may be peeled off after the formed product on the support member 800 formed in the previous step is fixed by a suction fixing means (not shown).

次に、支持部材８００から剥離された図５に示す形成物が基板１００上に接続材料３００を介して接続される。図６は本実施の形態に係る支持部材８００から剥離された形成物が基板１００上に接続材料３００を介して接続された製造途中のモジュール部品の一例を示す断面図である。このとき各素子がフェイスアップとなるよう支持部材８００から剥離された形成物が接続される。素子２００、２０１、２０２とその側面の周囲および各素子間に形成された充填材料４００の層からなる形成物の底面全域に接続材料３００が塗布され、通電中の素子が放出する熱を十分拡散でき、かつ素子と基板との十分な接続強度が得られる厚みとなるよう接続材料３００の供給量や供給パターンを制御することが望ましい。接続材料３００の供給方法としては、ディスペンス方式や印刷方式など、どのような方法でもよい。また、素子と基板との十分な接続強度が得られるための後処理を適宜実施してもよい。たとえば、接続材料３００にＡｇやＣｕなどの金属フィラを含有した導電性樹脂を用いた場合、熱硬化処理を行う。   Next, the formed product peeled off from the supporting member 800 is connected to the substrate 100 via the connecting material 300. FIG. 6 is a cross-sectional view showing an example of a module component in the middle of manufacture in which the formed product peeled from the support member 800 according to the present embodiment is connected to the substrate 100 via the connection material 300. At this time, the formed product separated from the support member 800 is connected so that each element is face-up. The connection material 300 is applied to the entire bottom surface of the element 200, 201, 202, the periphery of the side surfaces thereof, and the bottom surface of the formed material 400 formed between the elements, thereby sufficiently diffusing the heat released by the energized elements. It is desirable to control the supply amount and supply pattern of the connection material 300 so that the thickness is sufficient to obtain sufficient connection strength between the element and the substrate. The connection material 300 may be supplied by any method such as a dispensing method or a printing method. Further, post-treatment may be appropriately performed to obtain sufficient connection strength between the element and the substrate. For example, when a conductive resin containing a metal filler such as Ag or Cu is used for the connection material 300, a thermosetting process is performed.

次に、基板１００上面の各基板電極と各素子上面の各素子電極とを金属ワイヤを用いて電気的に接続する。図７は本実施の形態に係る基板１００の上面の各基板電極と各素子上面の各素子電極とを金属ワイヤを用いて電気的に接続されたモジュール部品１０００の一例を示す断面図である。具体的な接続は、図1で説明した通りである。   Next, each substrate electrode on the upper surface of the substrate 100 and each element electrode on the upper surface of each element are electrically connected using a metal wire. FIG. 7 is a cross-sectional view showing an example of a module component 1000 in which each substrate electrode on the upper surface of the substrate 100 and each element electrode on the upper surface of each element are electrically connected using a metal wire according to the present embodiment. The specific connection is as described in FIG.

以上で、モジュール部品１０００の製造方法の説明を終了する。   This is the end of the description of the method for manufacturing the module component 1000.

次に、本発明の第１の実施の形態の効果について説明する。   Next, effects of the first exemplary embodiment of the present invention will be described.

上述した本実施形態におけるモジュール部品１０００は、接続信頼性の向上が図られ、また電気的不良を抑制できる。   The module component 1000 in the present embodiment described above can improve connection reliability and suppress electrical failures.

その理由は、以下のような構成を含むからである。即ち、モジュール部品１０００において、複数個の素子の周囲に充填材料４００が形成され、基板１００上に接続材料３００を介し接続されているからである。また、このような構成により、素子と基板１００との接続面積を広く採ることができる。   This is because the following configuration is included. That is, in the module component 1000, the filling material 400 is formed around a plurality of elements and connected to the substrate 100 via the connection material 300. Further, with such a configuration, a large connection area between the element and the substrate 100 can be taken.

また、各素子は互いに離れて配置され、また、各素子間が充填材料４００の層が形成されている。これにより、モジュール部品１０００は、十分な接続強度が得られ、また、接続材料３００の供給量が過剰になったとしても、導電性の接続材料３００の各素子の回路面への這い上がりを防止できる。したがって、接続信頼性の一層の向上が図られ、また電気的不良を抑制できるという効果を高めることができる。   Each element is arranged away from each other, and a layer of the filling material 400 is formed between the elements. As a result, the module component 1000 can obtain a sufficient connection strength, and even if the supply amount of the connection material 300 becomes excessive, it prevents the conductive connection material 300 from creeping up to the circuit surface of each element. it can. Therefore, the connection reliability can be further improved and the effect of suppressing electrical failure can be enhanced.

［第２の実施形態］
次に、本発明の第２の実施形態について図面を参照して詳細に説明する。以下、本実施形態の説明が不明確にならない範囲で、前述の説明と重複する内容については説明を省略する。 [Second Embodiment]
Next, a second embodiment of the present invention will be described in detail with reference to the drawings. Hereinafter, the description overlapping with the above description is omitted as long as the description of the present embodiment is not obscured.

図８は、本発明の第２の実施形態に係るモジュール部品１００１の構成を示す断面図である。この断面図は第１の実施の形態における図２のモジュール部品１０００のＡ−Ａ‘断面図と同じ位置の断面図である。   FIG. 8 is a cross-sectional view showing a configuration of a module component 1001 according to the second embodiment of the present invention. This sectional view is a sectional view at the same position as the A-A ′ sectional view of the module component 1000 of FIG. 2 in the first embodiment.

図８を参照すると、本実施形態におけるモジュール部品１００１は、第１の実施形態のそれと比べて、接続材料３０１と充填材料４０１が異なる。また、製造工程において使用される支持部材８０１の形状が第１の実施形態における支持部材８００と異なる。   Referring to FIG. 8, the module component 1001 in the present embodiment is different in the connection material 301 and the filling material 401 from those in the first embodiment. Further, the shape of the support member 801 used in the manufacturing process is different from that of the support member 800 in the first embodiment.

充填材料４０１は、第１の実施形態の充填材料４００と異なり、底面が各素子の底面と同一平面上にはなく、充填材料４０１の層が各素子の底面の一部にまで形成され、かつ各素子底面より突出した構造となっている。これに伴い、接続材料３０１は各素子とその側面の周囲および各素子間に形成された充填材料の層からなる形成物の底面のみならず、充填材料４０１が形成する突出部の側面でも接続されている。   Unlike the filling material 400 of the first embodiment, the filling material 401 has a bottom surface that is not flush with the bottom surface of each element, the layer of the filling material 401 is formed up to a part of the bottom surface of each element, and The structure protrudes from the bottom of each element. Accordingly, the connection material 301 is connected not only to the bottom surface of each element, the periphery of the side surface thereof, and the bottom surface of the formed material formed between the elements, but also to the side surface of the protrusion formed by the filling material 401. ing.

次に、第２の実施の形態におけるモジュール部品１００１の製造方法について図９〜図１３を参照して説明する。なお、図９〜図１３も図２、図８と同様のＡ−Ａ‘断面図として示す。第１の実施形態と重複する内容については省略する。   Next, the manufacturing method of the module component 1001 in 2nd Embodiment is demonstrated with reference to FIGS. 9 to 13 are also shown as A-A ′ sectional views similar to FIGS. 2 and 8. The contents overlapping with those of the first embodiment are omitted.

まず、支持部材８０１上に素子２００、２０１、２０２がフェイスアップで載せられ、モジュール部品１００１における各素子の位置が決定される。図９は、本実施の形態に係る支持部材８０１上に素子２００、２０１、２０２が載せられ、各素子の位置が決定された製造途中のモジュール部品の一例を示す断面図である。   First, the elements 200, 201, and 202 are placed face up on the support member 801, and the position of each element in the module component 1001 is determined. FIG. 9 is a cross-sectional view showing an example of a module component in the middle of manufacture in which the elements 200, 201, and 202 are placed on the support member 801 according to the present embodiment and the position of each element is determined.

支持部材８０１は、第１の実施形態における支持部材８００と同様、載せられた素子を固定するために表面に一定の粘着性を有する部材であるが、素子２００、２０１、２０２が載せられる部分のみ各素子に接する面が突出していることが異なる。また、支持部材８０１の突出部分すなわち各素子に接する部分は、それぞれ載せられている素子より小さい面積とする。また、支持部材８０１の突出部分の高さ（厚さ）は、後述する接続材料３０１が、通電中の素子が放出する熱を十分拡散でき、かつ十分な接続強度が得られる厚みとなるよう調整された高さとしてもよい。また更に、後述する剥離工程で容易に剥離するため、支持部材８０１の突出部分の側面はテーパ状とし、支持部材８０１の突出部分を含めた支持部材８０１の上面には離型材を供給してもよい。また、支持部材８０１の表面に一定の粘着性を有さず、載せられた素子を固定する機構、たとえば吸引する機構を有してもよい。   The support member 801 is a member having a certain adhesiveness on the surface in order to fix the mounted element, like the support member 800 in the first embodiment, but only the part on which the elements 200, 201, 202 are mounted. The difference is that the surface in contact with each element protrudes. Further, the protruding portion of the support member 801, that is, the portion in contact with each element, has a smaller area than the element on which it is placed. Further, the height (thickness) of the protruding portion of the support member 801 is adjusted so that the connection material 301 described below can sufficiently diffuse the heat released from the energized element and can provide sufficient connection strength. It may be the height that was set. Furthermore, in order to peel easily in the peeling process described later, the side surface of the protruding portion of the supporting member 801 is tapered, and a release material is supplied to the upper surface of the supporting member 801 including the protruding portion of the supporting member 801. Good. Further, the surface of the support member 801 does not have a certain adhesive property, and may have a mechanism for fixing the mounted element, for example, a suction mechanism.

次に、位置が決定された素子２００、２０１、２０２の側面の周囲および各素子間に、充填材料４０１による層が形成される。図１０は、本実施の形態に係る支持部材８０１上において位置が決定された素子２００、２０１、２０２側面の周囲、底面の一部および各素子間に、充填材料４０１による層が形成された製造途中のモジュール部品の一例を示す断面図である。充填材料４０１による層の形成方法は、たとえば充填材料４０１として感光性樹脂を用いる場合、支持部材８０１の材質に透明なガラスなどを用い、支持部材８０１の底面側より光を当て感光させることで硬化することができる。支持部材８０１の底面側より光を当てることで、各素子の底面の一部に供給された充填材料４０１すなわち感光性樹脂も感光し硬化することができる。   Next, a layer of the filling material 401 is formed around the side surfaces of the elements 200, 201, and 202 whose positions are determined and between the elements. FIG. 10 shows a manufacturing method in which a layer made of a filling material 401 is formed around the side surfaces of the elements 200, 201, and 202 whose positions are determined on the support member 801 according to the present embodiment, a part of the bottom surface, and between the elements. It is sectional drawing which shows an example of the module component in the middle. For example, when a photosensitive resin is used as the filling material 401, the layer formation method using the filling material 401 is made by using transparent glass or the like as the material of the support member 801 and exposing it to light from the bottom side of the support member 801 to be cured. can do. By applying light from the bottom surface side of the support member 801, the filling material 401, that is, the photosensitive resin supplied to a part of the bottom surface of each element can also be exposed and cured.

次に、前工程によって形成された支持部材８０１上の形成物から支持部材８０１が剥離される。図１１は本実施の形態に係る支持部材８０１上の形成物から支持部材８０１が剥離された製造途中のモジュール部品の一例を示す断面図である。この時、支持部材８０１の突出部分の側面がテーパ状であること、支持部材８０１の突出部分を含む支持部材８０１上面には離型材が供給されている場合、容易に支持部材８０１から周囲に充填材料４０１が形成された複数の素子を剥離することができる。ここで、各素子の底面や充填材料４０１の表面に離型材が残存している場合、離型材を除去するために必要な処置を行ってもよい。たとえばＡｒプラズマ処理などでエッチングし各素子の底面や充填材料４０１の表面の改質を図ってもよい。剥離後の充填材料４０１は、支持部材８０１の突出部分の高さの分、各素子の底面より突出した形状として形成される。従って、支持部材８０１の突出部分の高さによって、充填材料４０１の突出部分の高さを容易に制御することが可能である。   Next, the support member 801 is peeled from the formed product on the support member 801 formed in the previous step. FIG. 11 is a cross-sectional view showing an example of a module component in the middle of production in which the support member 801 is peeled from the formed product on the support member 801 according to the present embodiment. At this time, when the side surface of the projecting portion of the support member 801 is tapered, and when a release material is supplied to the upper surface of the support member 801 including the projecting portion of the support member 801, the support member 801 can easily fill the periphery. A plurality of elements over which the material 401 is formed can be peeled off. Here, when the release material remains on the bottom surface of each element or the surface of the filling material 401, a necessary treatment for removing the release material may be performed. For example, the bottom of each element or the surface of the filling material 401 may be modified by etching with Ar plasma treatment or the like. The peeled filling material 401 is formed in a shape protruding from the bottom surface of each element by the height of the protruding portion of the support member 801. Therefore, the height of the protruding portion of the filling material 401 can be easily controlled by the height of the protruding portion of the support member 801.

次に、支持部材８０１から剥離された形成物が基板１００上に接続材料３０１を介して接続される。図１２は本実施の形態に係る支持部材８０１から剥離された形成物が基板１００上に接続材料３０１を介して接続された製造途中のモジュール部品の一例を示す断面図である。このとき各素子がフェイスアップとなるよう支持部材８０１から剥離された形成物が接続される。素子２００、２０１、２０２とその側面の周囲、底面の一部および各素子間に形成された充填材料４０１の層からなる形成物の底面全域に接続材料３００が塗布され、通電中の素子が放出する熱を十分拡散でき、かつ素子と基板との十分な接続強度が得られる厚みとなるよう接続材料３００の供給量や供給パターンを制御することが望ましい。また、基板１００上に周囲に充填材料４０１が形成された複数の素子を加重制御方式で実装し、充填材料４０１で支持され、素子の底面では任意の接続材料３０１の厚みが得られるようにしてもよい。   Next, the formed product peeled from the support member 801 is connected to the substrate 100 via the connection material 301. FIG. 12 is a cross-sectional view showing an example of a module component in the middle of manufacture in which the formed product peeled from the support member 801 according to the present embodiment is connected to the substrate 100 via the connection material 301. At this time, the formed product separated from the support member 801 is connected so that each element is face-up. The connection material 300 is applied to the entire area of the bottom surface of the element 200, 201, 202 and the periphery of the side surface, a part of the bottom surface, and the formation material layer formed between the elements, and the current-carrying element is emitted. It is desirable to control the supply amount and the supply pattern of the connection material 300 so that the thickness of the connection material 300 can be sufficiently diffused and a sufficient connection strength between the element and the substrate can be obtained. In addition, a plurality of elements each having a filling material 401 formed on the substrate 100 are mounted by a weight control method, supported by the filling material 401, and an arbitrary thickness of the connection material 301 can be obtained on the bottom surface of the element. Also good.

次に、基板１００上面の各基板電極と各素子上面の各素子電極とを金属ワイヤを用いて電気的に接続する。図１３は本実施の形態に係る基板１００上面の各基板電極と各素子上面の各素子電極とを金属ワイヤを用いて電気的に接続されたモジュール部品１００１の一例を示す断面図である。   Next, each substrate electrode on the upper surface of the substrate 100 and each element electrode on the upper surface of each element are electrically connected using a metal wire. FIG. 13 is a cross-sectional view showing an example of a module component 1001 in which each substrate electrode on the upper surface of the substrate 100 and each element electrode on the upper surface of each element are electrically connected using a metal wire according to the present embodiment.

以上で、モジュール部品１００１の製造方法の説明を終了する。   Above, description of the manufacturing method of the module component 1001 is complete | finished.

次に、本発明の第２の実施の形態の効果について説明する。   Next, effects of the second exemplary embodiment of the present invention will be described.

上述した本実施形態におけるモジュール部品１００１は、より高く接続信頼性の向上が図られる。   The module component 1001 in the present embodiment described above is higher and the connection reliability is improved.

その理由は、以下のような構成を含むからである。即ち、モジュール部品１００１は、充填材料４０１の層が各素子の裏面より突出した構造であり、充填材料４０１が形成する突出部の側面でも接続材料と接続することができる。したがって、より広く接続面積が確保されるので、モジュール部品１００１は、より高く接続信頼性の向上が図られるという効果が得られる。   This is because the following configuration is included. That is, the module component 1001 has a structure in which the layer of the filling material 401 protrudes from the back surface of each element, and can be connected to the connection material also on the side surface of the protruding portion formed by the filling material 401. Accordingly, since a wider connection area is ensured, the module component 1001 has an effect that the connection reliability is higher and the connection reliability is improved.

以上、各実施の形態を参照して本発明を説明したが、本発明は上記実施の形態に限定されるものではない。本発明の構成や詳細には、本発明のスコープ内で当業者が理解しえる様々な変更をすることができる。   Although the present invention has been described with reference to each embodiment, the present invention is not limited to the above embodiment. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

１００ 基板
２００、２０１、２０２ 素子
３００、３０１ 接続材料
４００、４０１ 充填材料
５００、５０１、５０２、５０３、５０４、５０５ 素子電極
６００、６０１ 基板電極
７００、７０１、７０２、７０３ 金属ワイヤ
８００、８０１ 支持部材 100 Substrate 200, 201, 202 Element 300, 301 Connection material 400, 401 Filling material 500, 501, 502, 503, 504, 505 Element electrode 600, 601 Substrate electrode 700, 701, 702, 703 Metal wire 800, 801 Support member

Claims (3)

支持部材上に複数個の素子をフェイスアップで搭載し、
前記支持部材上に搭載された複数個の前記素子の周囲を覆うように充填材料を形成し、
前記支持部材より周囲に前記充填材料が形成された複数個の前記素子を剥離し、
基板上に接続材料を供給し、周囲に前記充填材料が形成された複数個の前記素子をフェイスアップで実装し、
複数個の前記素子上に形成された任意の素子電極間、又は任意の前記素子電極と基板電極間を金属ワイヤで接続する
モジュール部品製造方法。
A plurality of elements are mounted face up on the support member,
Forming a filling material so as to cover the periphery of the plurality of elements mounted on the support member;
A plurality of the elements having the filler material formed around the support member are peeled off,
A connection material is supplied onto the substrate , and a plurality of the elements in which the filling material is formed are mounted face up,
A method for manufacturing a module component, comprising: connecting any element electrode formed on a plurality of the elements, or any element electrode and a substrate electrode with a metal wire.
前記支持部材表面に突出部分が形成され、
前記突出部分上に複数個の前記素子をフェイスアップで搭載し、
前記支持部材上に搭載された複数個の前記素子の周囲および底面の一部を覆うように充填材料を形成する請求項１記載のモジュール部品製造方法。 A protruding portion is formed on the surface of the support member,
A plurality of the elements are mounted face up on the protruding portion,
Module component manufacturing method according to claim 1, wherein forming the filler material so as to cover a portion of the periphery and the bottom surface of a plurality of the elements mounted on the support member. 感光性の絶縁性樹脂を前記支持部材上に搭載された複数個の前記素子の周囲または周囲と底面の一部を覆うように供給し、
前記支持部材裏面より光を当て感光させることで硬化させ充填材料を形成する請求項１または２に記載のモジュール部品製造方法。 Supplying a photosensitive insulating resin so as to cover the periphery of the plurality of elements mounted on the support member or a part of the periphery and the bottom;
Module component production method according to claim 1 or 2 to form a filling material is cured by causing the photosensitive illuminated from the support member rear surface.
JP2014181857A 2014-09-08 2014-09-08 Module parts manufacturing method Active JP6405810B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014181857A JP6405810B2 (en) 2014-09-08 2014-09-08 Module parts manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014181857A JP6405810B2 (en) 2014-09-08 2014-09-08 Module parts manufacturing method

Publications (2)

Publication Number Publication Date
JP2016058464A JP2016058464A (en) 2016-04-21
JP6405810B2 true JP6405810B2 (en) 2018-10-17

Family

ID=55758842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014181857A Active JP6405810B2 (en) 2014-09-08 2014-09-08 Module parts manufacturing method

Country Status (1)

Country Link
JP (1) JP6405810B2 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115553A (en) * 1980-02-18 1981-09-10 Fujitsu Ltd Method of mounting integrated circuit
JPS61156792A (en) * 1984-12-28 1986-07-16 株式会社東芝 Manufacture of circuit module
JPS6464293A (en) * 1987-09-03 1989-03-10 Toshiba Corp Manufacture of circuit module
JPH0456137A (en) * 1990-06-26 1992-02-24 General Electric Co <Ge> Method of connecting die by using high-density mutually connected assembly
JP2002076190A (en) * 2000-08-24 2002-03-15 Toshiba Corp Circuit board, semiconductor device and their manufacturing method
JP3653460B2 (en) * 2000-10-26 2005-05-25 三洋電機株式会社 Semiconductor module and manufacturing method thereof
JP2003303919A (en) * 2002-04-10 2003-10-24 Hitachi Ltd Semiconductor device and its manufacturing method
JP4525636B2 (en) * 2006-06-09 2010-08-18 株式会社日立製作所 Power module
JP4270282B2 (en) * 2007-01-23 2009-05-27 セイコーエプソン株式会社 Manufacturing method of semiconductor device
JP5454154B2 (en) * 2010-01-13 2014-03-26 日亜化学工業株式会社 Light emitting device and method for manufacturing light emitting device
JP5900620B2 (en) * 2012-07-05 2016-04-06 三菱電機株式会社 Semiconductor device
WO2014009996A1 (en) * 2012-07-11 2014-01-16 三菱電機株式会社 Semiconductor device and method for producing same

Also Published As

Publication number Publication date
JP2016058464A (en) 2016-04-21

Similar Documents

Publication Publication Date Title
JP5289832B2 (en) Semiconductor device and manufacturing method of semiconductor device
US9510450B2 (en) Printed wiring board and method for manufacturing the same
JP2009158770A (en) Method of manufacturing wiring board
KR101219905B1 (en) The printed circuit board and the method for manufacturing the same
JP2011060859A (en) Method of manufacturing electronic component, and electronic component
JP6589985B2 (en) Manufacturing method of LED mounting substrate
JP6405810B2 (en) Module parts manufacturing method
JP2012182350A (en) Module component and manufacturing method of the same
JP2008159671A (en) Printed wiring board, and electronic apparatus
JP2017174953A (en) Printed wiring board and manufacturing method of printed wiring board
KR20170000795A (en) Wiring board and manufacturing method thereof
JP6332330B2 (en) WIRING SUBSTRATE MANUFACTURING METHOD, LIGHT-EMITTING DEVICE MANUFACTURING METHOD USING SAME, WIRING SUBSTRATE, AND LIGHT-EMITTING DEVICE USING SAME
JP2016100352A (en) Printed wiring board and manufacturing method of the same
JP2015204379A (en) Printed wiring board
KR20130046716A (en) The printed circuit board and the method for manufacturing the same
JP6367902B2 (en) Wiring board
JP2016025337A (en) Wiring board
JP2015144150A (en) Manufacturing method of wiring board
JP6075789B2 (en) Wiring board manufacturing method
JP6062872B2 (en) Wiring board
JP2016025096A (en) Printed wiring board and method of manufacturing the same
JP5610039B2 (en) Wiring board manufacturing method
JP2016025339A (en) Wiring board
WO2011093068A1 (en) Method for producing substrate with built-in components, and substrate with built-in components
JP2004165321A (en) Wiring board and its manufacturing method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170809

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180326

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180410

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180611

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180619

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180821

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180903

R150 Certificate of patent or registration of utility model

Ref document number: 6405810

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150