JP6395793B2 - 半導体装置レシピ管理システム - Google Patents
半導体装置レシピ管理システム Download PDFInfo
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- JP6395793B2 JP6395793B2 JP2016237816A JP2016237816A JP6395793B2 JP 6395793 B2 JP6395793 B2 JP 6395793B2 JP 2016237816 A JP2016237816 A JP 2016237816A JP 2016237816 A JP2016237816 A JP 2016237816A JP 6395793 B2 JP6395793 B2 JP 6395793B2
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- recipe
- erc
- inspection tool
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Strategic Management (AREA)
- Entrepreneurship & Innovation (AREA)
- Human Resources & Organizations (AREA)
- Economics (AREA)
- Game Theory and Decision Science (AREA)
- Tourism & Hospitality (AREA)
- Development Economics (AREA)
- Theoretical Computer Science (AREA)
- Marketing (AREA)
- Operations Research (AREA)
- Quality & Reliability (AREA)
- Educational Administration (AREA)
- General Business, Economics & Management (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- General Factory Administration (AREA)
- Information Retrieval, Db Structures And Fs Structures Therefor (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Description
(1)外部レシピコンポーネント配信のためのシステムであって、
第1の外部レシピコンポーネントを保持するデータストアを含む第1の光学検査ノードと、
第2の外部レシピコンポーネントを保持するデータストアを含む第2の光学検査ノードと、
前記第1の外部レシピコンポーネントおよび前記第2の外部レシピコンポーネントに関連する少なくとも1つの光学検査対象レシピを保持するデータストアを含むレシピ配信サーバーと、
を備えるシステム。
(2)前記レシピ配信サーバーが、
前記第1の光学検査ノードから前記光学検査対象レシピを採用する光学検査対象の検査を実行する要求を受信し、かつ
前記第2の光学検査ノードから前記第1の光学検査ノードへの前記第2の外部レシピコンポーネントの前記転送を開始するように構成された、
前記(1)に記載のシステム。
(3)前記少なくとも1つの光学検査対象レシピが、
前記第1の外部レシピコンポーネントおよび前記第2の外部レシピコンポーネントのうちの少なくとも1つに関連する少なくとも1つのプロキシコンポーネントを含む、
前記(1)に記載のシステム。
(4)前記レシピ配信サーバーが、
前記第2の外部レシピコンポーネントに関連する前記プロキシコンポーネントに従って、前記第2の光学検査ノードから前記第1の光学検査ノードへの前記第2の外部レシピコンポーネントの前記転送を開始するように構成された、
前記(2)に記載のシステム。
Claims (3)
- 外部レシピコンポーネント配信のためのシステムであって、
第1の外部レシピコンポーネントを保持するデータストアを含む第1の光学検査ノードと、
第2の外部レシピコンポーネントを保持するデータストアを含む第2の光学検査ノードと、
前記第1の外部レシピコンポーネントおよび前記第2の外部レシピコンポーネントに関連する少なくとも1つの光学検査対象レシピを保持するデータストアを含むレシピ配信サーバーと、
を備え、
前記レシピ配信サーバーが、
前記第1の光学検査ノードから前記光学検査対象レシピを採用する光学検査対象の検査を実行する要求を受信し、前記第2の光学検査ノードから前記第1の光学検査ノードへの前記第2の外部レシピコンポーネントの転送を開始するように構成された、システム。 - 前記少なくとも1つの光学検査対象レシピが、
前記第1の外部レシピコンポーネントおよび前記第2の外部レシピコンポーネントのうちの少なくとも1つに関連する少なくとも1つのプロキシコンポーネントを含む、
請求項1に記載のシステム。 - 前記レシピ配信サーバーが、
前記第2の外部レシピコンポーネントに関連するプロキシコンポーネントに従って、前記第2の光学検査ノードから前記第1の光学検査ノードへの前記第2の外部レシピコンポーネントの転送を開始するように構成された、
請求項1に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/833,350 | 2010-07-09 | ||
US12/833,350 US8392136B2 (en) | 2010-07-09 | 2010-07-09 | In-place management of semiconductor equipment recipes |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015159472A Division JP6058763B2 (ja) | 2010-07-09 | 2015-08-12 | 半導体装置レシピ管理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017054543A JP2017054543A (ja) | 2017-03-16 |
JP6395793B2 true JP6395793B2 (ja) | 2018-09-26 |
Family
ID=45439188
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013519684A Active JP5921541B2 (ja) | 2010-07-09 | 2011-05-24 | 半導体装置レシピ管理方法 |
JP2015159472A Active JP6058763B2 (ja) | 2010-07-09 | 2015-08-12 | 半導体装置レシピ管理方法 |
JP2016237816A Active JP6395793B2 (ja) | 2010-07-09 | 2016-12-07 | 半導体装置レシピ管理システム |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013519684A Active JP5921541B2 (ja) | 2010-07-09 | 2011-05-24 | 半導体装置レシピ管理方法 |
JP2015159472A Active JP6058763B2 (ja) | 2010-07-09 | 2015-08-12 | 半導体装置レシピ管理方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8392136B2 (ja) |
JP (3) | JP5921541B2 (ja) |
KR (1) | KR101764951B1 (ja) |
CN (1) | CN102986015B (ja) |
TW (1) | TWI444612B (ja) |
WO (1) | WO2012005818A2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9063097B2 (en) * | 2011-02-11 | 2015-06-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Systems and methods eliminating false defect detections |
US20140214192A1 (en) * | 2013-01-25 | 2014-07-31 | Dmo Systems Limited | Apparatus For Design-Based Manufacturing Optimization In Semiconductor Fab |
WO2014139012A1 (en) * | 2013-03-15 | 2014-09-18 | Suncor Energy Inc. | Herbicidal compositions |
WO2021039389A1 (ja) * | 2019-08-26 | 2021-03-04 | 東京エレクトロン株式会社 | 情報処理装置および基板処理方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5760893A (en) * | 1996-12-24 | 1998-06-02 | Teradyne, Inc. | Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture |
JP3892553B2 (ja) * | 1997-10-29 | 2007-03-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JPH11340111A (ja) * | 1998-05-27 | 1999-12-10 | Kokusai Electric Co Ltd | 半導体製造システム |
JP2002373836A (ja) * | 2001-06-15 | 2002-12-26 | Canon Inc | データ編集装置、データ編集方法、半導体製造装置および半導体製造方法 |
JP3708031B2 (ja) | 2001-06-29 | 2005-10-19 | 株式会社日立製作所 | プラズマ処理装置および処理方法 |
JP2003099113A (ja) * | 2001-09-21 | 2003-04-04 | Olympus Optical Co Ltd | 一括管理装置 |
JP4584531B2 (ja) | 2002-08-02 | 2010-11-24 | 株式会社日立製作所 | 異物モニタリングシステム |
US6959251B2 (en) * | 2002-08-23 | 2005-10-25 | Kla-Tencor Technologies, Corporation | Inspection system setup techniques |
AU2003290752A1 (en) * | 2002-11-12 | 2004-06-03 | Fei Company | Defect analyzer |
JP2007071678A (ja) | 2005-09-07 | 2007-03-22 | Hitachi High-Technologies Corp | 検査システム |
JP5062806B2 (ja) * | 2006-04-27 | 2012-10-31 | 東京エレクトロン株式会社 | 群管理システム、プロセス情報管理装置、制御装置、およびプログラム |
JP4607157B2 (ja) * | 2007-07-25 | 2011-01-05 | 株式会社日立ハイテクノロジーズ | 観察装置、観察装置のレシピ設定方法 |
US8126255B2 (en) * | 2007-09-20 | 2012-02-28 | Kla-Tencor Corp. | Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions |
US20090088997A1 (en) * | 2007-09-28 | 2009-04-02 | Hitachi High Technologies Corporation | Data processing system |
JP5159373B2 (ja) * | 2008-03-06 | 2013-03-06 | オリンパス株式会社 | 基板検査方法 |
JP2009272497A (ja) * | 2008-05-08 | 2009-11-19 | Hitachi High-Technologies Corp | レシピパラメータ管理装置およびレシピパラメータ管理方法 |
JP5042266B2 (ja) * | 2009-04-27 | 2012-10-03 | 株式会社日立国際電気 | 半導体製造装置及び半導体製造装置の表示方法及びレシピ制御方法及びレシピ実行プログラム |
-
2010
- 2010-07-09 US US12/833,350 patent/US8392136B2/en active Active
-
2011
- 2011-05-24 WO PCT/US2011/037771 patent/WO2012005818A2/en active Application Filing
- 2011-05-24 CN CN201180033894.9A patent/CN102986015B/zh active Active
- 2011-05-24 KR KR1020137003352A patent/KR101764951B1/ko active IP Right Grant
- 2011-05-24 JP JP2013519684A patent/JP5921541B2/ja active Active
- 2011-05-27 TW TW100118719A patent/TWI444612B/zh active
-
2015
- 2015-08-12 JP JP2015159472A patent/JP6058763B2/ja active Active
-
2016
- 2016-12-07 JP JP2016237816A patent/JP6395793B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20120010843A1 (en) | 2012-01-12 |
WO2012005818A2 (en) | 2012-01-12 |
CN102986015B (zh) | 2015-09-09 |
US8392136B2 (en) | 2013-03-05 |
WO2012005818A3 (en) | 2012-03-29 |
TWI444612B (zh) | 2014-07-11 |
JP2017054543A (ja) | 2017-03-16 |
JP2013535816A (ja) | 2013-09-12 |
JP5921541B2 (ja) | 2016-05-24 |
JP2016015497A (ja) | 2016-01-28 |
KR101764951B1 (ko) | 2017-08-03 |
TW201211527A (en) | 2012-03-16 |
CN102986015A (zh) | 2013-03-20 |
JP6058763B2 (ja) | 2017-01-11 |
KR20130035269A (ko) | 2013-04-08 |
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