JP6380590B2 - LED module - Google Patents

Description

  The present disclosure relates to an LED module.

  An LED module in which a plurality of light emitting diode (LED) devices are arranged on a substrate is known (for example, Patent Document 1). In this LED module, the side surface of the LED device is composed of a fluorescent member or a reflective member, and a plurality of LED devices are arranged so that the fluorescent member of the LED device and the reflective member of another LED device face each other.

JP 2014-143246 A

  However, in the LED module according to Patent Document 1, when the reflective member of the LED device is arranged so as to be located on the outermost periphery of the LED module, the light from the inside of the LED device is reflected on the outermost periphery of the LED module. The light distribution of the LED module becomes narrow. That is, the light from the LED device hardly spreads outward from the outermost periphery of the LED module, and the light distribution becomes narrow. Such an LED module is not suitable for applications requiring a wide light distribution such as indoor lighting. Further, since the side surface made of the fluorescent member of one LED device faces the side surface made of the reflecting member of another adjacent LED device, the light emitted from the fluorescent member of one LED device is opposed to the LED. After being reflected by the reflection member of the device, it may enter and be absorbed by the fluorescent member of another LED device. This reduces the light extraction efficiency.

  The present disclosure includes the following inventions. An LED module comprising a substrate and a plurality of LED devices disposed adjacent to each other on the substrate, wherein the plurality of LED devices are respectively disposed on a side of the light emitting diode element and the light emitting diode element. A first LED device and a second LED device each having a reflective member and a translucent member disposed above the light emitting diode element, wherein the first LED device has all side surfaces. Adjacent to another LED device, having a reflecting member on all side surfaces of the translucent member, and having an upper surface as a light extraction surface, the second LED device includes a side surface adjacent to the other LED device, A side surface that is not adjacent to another LED device, a side surface that has a reflecting member on all side surfaces adjacent to the other LED device among the side surfaces of the translucent member, and is not adjacent to the other LED device Light extraction In and, LED module and the upper surface is characterized in that it is a light extraction surface.

  By providing the above configuration, an LED module having a wide light distribution and high efficiency can be realized.

It is a schematic plan view which shows the LED module which concerns on embodiment. It is a schematic cross section in the A-A 'line | wire of the 1st LED apparatus in FIG. It is a schematic cross section in the B-B 'line of the 2nd LED apparatus in FIG. It is a schematic cross section which shows the modification of a 2nd LED apparatus. It is a schematic cross section which shows the manufacturing method of a 1st LED apparatus. It is a schematic cross section which shows the manufacturing method of a 2nd LED apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a configuration for embodying the technical idea of the present invention, and does not specify the present invention. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

  In the LED module 100 according to the present embodiment, as shown in FIG. 1, a plurality of LED devices 10 are arranged adjacent to each other on a substrate 20. Each of the plurality of LED devices 10 includes a light emitting diode element 11, and a reflecting member 12 is disposed on the side of the light emitting diode element 11. Further, a first light transmissive member 13 is disposed above each light emitting diode element 11. Here, the first translucent member 13 contains a phosphor. And among these LED devices 10, as shown in FIG.1 and FIG.2, as for the 1st LED device 10a, all the side surfaces adjoin other LED devices, and all the 1st translucent members 13 exist. The reflecting member 12 is disposed on the side surface of the. Furthermore, the upper surface of the first LED device 10a is a light extraction surface. On the other hand, as shown in FIGS. 1 and 3, the second LED device 10 b has a side surface adjacent to the other LED device and a side surface not adjacent to the other LED device, and the first light-transmissive member 13. The reflective member 12 is disposed on all the side surfaces adjacent to the other LED devices, and the side surface not adjacent to the other LED devices is the light extraction surface. In the second LED device 10b, the upper surface is also a light extraction surface. Thereby, as shown in FIG. 1, the second LED device 10 b is disposed on the outermost periphery of the LED module 100, and the first LED device 10 a is disposed on a region other than the outermost periphery of the LED module 100. The first LED device 10a is surrounded on all sides by other LED devices. In such an LED module 100, since the light extraction surface is provided on the side surface of the LED module 100, it is possible to achieve a wide light distribution as compared with the case where the light extraction surface is not provided on the side surface of the LED module 100. That is, since the light extraction surface of the second LED device 10b is located on the side surface of the LED module 100, light can be emitted to the side of the LED module 100, and a wide light distribution can be achieved.

  In addition, since the first light-transmissive member 13 of the first LED device 10a has the reflection members 12 on all side surfaces, the light emitted inside the first LED device 10a is reflected by the reflection member 12, It is taken out above the first LED device 10a. Thereby, it is possible to reduce the possibility that light emitted inside the first LED device 10a is incident on and absorbed by another LED device. Similarly, since all the side surfaces adjacent to the other LED devices among the side surfaces of the first light-transmissive member 13 of the second LED device 10b have the reflecting member 12, light is incident on the other LED devices. The possibility of being absorbed can be reduced. In addition, the possibility that light from the first LED device 10a and the second LED device 10b is incident on the substrate 20 of the LED module 100 and is absorbed can be reduced. The reflecting member 12 is preferably provided so as to cover the entire side surface of the first light-transmissive member 13 on the side surface of the first light-transmissive member 13 on which the reflective member 12 is disposed. The second LED device 10b has a light extraction surface on the side surface, but the side surface serving as the light extraction surface is not adjacent to another LED device, and thus light may be incident on and absorbed by the other LED device. Is low. As a result, a decrease in light extraction efficiency of the LED module 100 can be suppressed.

  Furthermore, since the first light-transmissive member 13 of the first LED device 10a and the second LED device 10b has the reflective member 12 on the side surface adjacent to the other LED devices, it is compared with the case where there is no reflective member 12. Thus, the path through which the light travels before the light is extracted from above the LED module 100 can be shortened. Thereby, since it can suppress that light is absorbed by the board | substrate 20 grade | etc., The fall of the extraction efficiency of light can be suppressed. That is, when the reflecting member 12 is provided on the side surface of the first light transmissive member 13 of the first LED device 10a and the second LED device 10b, the light emitted inside the LED device 10 immediately hits the reflecting member 12 and is reflected by the LED. It is taken out from above the device 10. For this reason, light can be extracted from above the LED module 100 before the light extraction efficiency decreases.

  Further, as shown in FIGS. 2 and 3, since the reflecting member 12 is disposed on the side of the light emitting diode element 11, light generated from the light emitting diode element 11 can be absorbed by the adjacent light emitting diode element. Can be reduced. That is, the light generated in the light emitting layer of the light emitting diode element 11 is more easily absorbed as the composition of the material to which the light hits is similar to that of the light emitting layer. However, by arranging the reflecting member 12, the light is adjacent to the light emitting diode. It can be made difficult to be absorbed by the light emitting layer of the element and its periphery. The reflecting member 12 is preferably provided on the side of the light emitting diode element 11 on which the reflecting member 12 is disposed so as to cover the entire side of the light emitting diode element 11.

  Hereinafter, each member in the LED module 100 will be described.

(LED device)
The plurality of LED devices 10 may be of a CSP (Chip Size Package or Chip Scale Package) type in which the reflecting member 12 is disposed on the side of the light emitting diode element 11 instead of providing a housing for housing the light emitting diode element 11. preferable. In the CSP type LED device 10, the reflecting member 12 may be disposed below the light emitting diode element 11. In the CSP-type LED device 10, it is preferable that the n-side electrode 15a and the p-side electrode 15b of the light-emitting diode element 11 are provided with metal terminals for external connection such as metal bumps and post electrodes. Thereby, since the LED device 10 can be closely arranged on the substrate 20, the number of the LED devices 10 that can be arranged on the substrate 20 is increased, and the light emission intensity of the LED module 100 can be improved. In addition, by closely arranging the LED device 10, when the LED module 100 is viewed from above, the light emitting surface can be illuminated more uniformly. In addition, when the number of LED devices 10 is the same, the LED device 10 can be closely arranged to reduce the size of the substrate 20 and thus reduce the member cost. Specifically, the LED device 10 can have a substantially rectangular shape with one side of about 1 mm to 2 mm when viewed from above. Considering the mounting accuracy when the LED device 10 is closely arranged on the substrate 20, the distance between the light emitting diode elements 11 is preferably about 0.4 mm to 1.2 mm, and the distance between the LED devices 10 is about 0.00 mm. 2 mm to 1 mm is preferable.

  As shown in FIG. 1, the plurality of LED devices 10 are preferably arranged in a matrix in a top view. As a result, the LED device 10 can be easily mounted, and the wiring of the substrate 20 for mounting the LED device 10 can be easily designed. In addition, since the plurality of LED devices 10 are rectangular in a top view, the LED devices 10 can be closely arranged up to the outermost periphery of the substrate 20. The plurality of LED devices 10 are preferably connected in series. Thereby, since the electric current value of the some LED apparatus 10 becomes substantially the same, the light emission from the some LED apparatus 10 can also be made substantially the same. Furthermore, the plurality of LED devices 10 are preferably disposed on the upper surface and the lower surface of the substrate 20. Thereby, since it also light-emits also from the lower surface of the LED module 100, the LED module 100 can be made further wide light distribution.

  In the LED module 100, the desired LED module 100 is obtained by arranging the first LED device 10a and the second LED device 10b in combination. The first LED device 10a and the second LED device 10b can be manufactured, for example, by the following method. Hereinafter, the second LED device 10b will be described as an example.

  First, as shown in FIG. 5A, a support substrate 30 is prepared and disposed on the upper surface of the support substrate 30 with the electrode 15 side of the light emitting diode element 11 facing up. Then, as shown in FIG. 5C, the periphery of the light emitting diode element 11 and the light emitting diode element 11 is filled with the reflecting member 12 so that the electrode 15 of the light emitting diode element 11 is exposed from the upper surface of the reflecting member 12. The reflecting member 12 is made of a white resin, for example. As shown in FIG. 5B, a second light transmissive member 14 described later may be formed on the side of the light emitting diode element 11 before the reflecting member 12 is disposed. Thereafter, as shown in FIGS. 5D and 5E, the support substrate 30 is removed, and the first light-transmissive member 13 is disposed in the removed region. The 1st translucent member 13 consists of a fluorescent substance sheet, for example. Thereby, the 1st translucent member 13 is arrange | positioned at the light emission surface side of the light emitting diode element 11. FIG. Next, as shown in FIGS. 5 (f) and 5 (g), a part of the first light transmissive member 13 disposed on the light emitting surface side of the light emitting diode element 11 is removed, and a reflection member is formed in the removed region. 12 is arranged. Thereafter, as shown in FIG. 5H, the first LED member 10b can be obtained by cutting the first translucent member 13 and the reflecting member 12 and separating the light emitting diode elements 11 into individual pieces. .

  At this time, when viewed from above, the first light-transmissive member 13 is partially removed so as to surround the two adjacent light-emitting diode elements 11, and the reflecting member 12 is disposed, so that a light extraction surface is provided on one side surface. Two second LED devices 10b can be obtained simultaneously. Similarly, when viewed from above, the light-extracting surface is formed on two adjacent side surfaces by surrounding the four light-emitting diode elements 11 adjacent to each other and removing the first translucent member 13 and disposing the reflecting member 12. Four second LED devices 10b having the above can be obtained simultaneously. In addition, as shown to Fig.6 (a)-(h), the 1st LED apparatus 10a can be obtained using the same method. In this case, one first LED device 10a is obtained by surrounding the one light emitting diode element 11 in a top view and removing the first light transmissive member 13 and disposing the reflecting member 12. Can do.

  As shown in FIGS. 5 (f) and 6 (f), when part of the first light transmissive member 13 is removed, the reflection member 12 in the vicinity of the region where the first light transmissive member 13 and the reflection member 12 are in contact with each other is also used. Part of it is preferably removed. Thereby, the possibility that the first translucent member 13 to be partially removed remains without being removed can be reduced. As a result, it is possible to reduce the possibility that light is emitted from the side surface of the first light-transmissive member 13 of the first LED device 10a and the second LED device 10b adjacent to the other LED devices. Further, it is preferable that the depth at which the reflecting member 12 is removed is smaller than half the thickness of the reflecting member 12. Thereby, since most of the reflective member 12 remains without being removed, the strength of the LED device 10 can be maintained.

  In addition, it is preferable not to remove the second translucent member 14 when partially removing the first translucent member 13. Thereby, since the 2nd translucent member 14 can maintain the inclination mentioned later, the light from the light emitting diode element 11 can be more easily reflected by the reflecting member 12.

(Light-emitting diode element)
As the light emitting diode element 11, a semiconductor light emitting element can be used. The semiconductor light emitting device can include a translucent substrate and a semiconductor stacked body formed thereon. For the light-transmitting substrate, for example, a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or a semiconductor (for example, a nitride-based semiconductor) that transmits light from the semiconductor stacked body is used. it can. The semiconductor stacked body includes, for example, a first conductivity type semiconductor layer (for example, an n-type semiconductor layer), a light emitting layer, and a second conductivity type semiconductor layer (for example, a p-type semiconductor layer). The semiconductor layer can be formed of a semiconductor material such as a III-V group compound semiconductor, for example. _{Specifically, In X Al Y Ga 1-} X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride such as based semiconductor (e.g. InN, AlN, GaN, InGaN, AlGaN, InGaAlN and the like ) Can be used.

(Reflective member)
The reflecting member 12 can be formed of, for example, a metal layer or a white resin. It is preferable that the reflecting member 12 disposed on the side of the light emitting diode element 11 has a slope in which the surface on the light emitting diode element 11 side increases the distance from the light emitting diode element 11 as the distance from the substrate 20 increases. Thereby, the light from the light emitting diode element 11 hits the inclination of the reflecting member 12 and travels mainly upward. As a result, the light extraction efficiency of the LED device 10 can be improved as compared with the case where the reflecting member 12 does not have an inclination. In addition, by making the inclined surface of the reflecting member 12 a curved surface, the light from the light emitting diode element 11 can be easily reflected upward of the LED device 10, and the light extraction efficiency of the LED device 10 can be further improved. Can do.

(Second translucent member)
A second light transmissive member 14 can be disposed between the reflecting member 12 and the light emitting diode element 11. Thereby, the light from the light emitting diode element 11 can be more easily reflected by the reflecting member 12. Examples of such materials include silicone resins and epoxy resins. The second translucent member 14 preferably has a slope in which the surface on the reflecting member 12 side increases the distance from the light emitting diode element 11 as the distance from the substrate 20 increases. Thereby, the reflecting member 12 can be formed along the inclination of the second light-transmissive member 14.

  The second light transmissive member 14 having such an inclination can be formed by the following method, for example. First, the light emitting diode element 11 is disposed on the support substrate 30 with the electrode 15 side facing up. And when the 2nd translucent member 14 is formed from a translucent resin material, the liquid resin material used as the raw material of the 2nd translucent member 14 is supported with the light emitting diode element 11 using a dispenser etc. Application is performed along the boundary with the substrate 30. Thereby, the liquid resin material spreads on the support substrate 30 and crawls up the side surface of the light emitting diode element 11 by the surface tension. Thereafter, the liquid resin material is cured by heating or the like to obtain the second light transmissive member 14. As a result, the 2nd translucent member 14 which has an inclination can be obtained. What is necessary is just to form the reflection member 12 so that the inclined surface of such a 2nd translucent member 14 may be covered.

  The distance by which the liquid resin material climbs up the light emitting diode element 11 can be controlled by adjusting the viscosity and the coating amount of the liquid resin material. The viscosity of the liquid resin material can be adjusted by adding a filler or the like.

(First translucent member)
The light extraction surface of the LED device 10 is composed of the first light transmissive member 13. The 1st translucent member 13 can also be comprised only with a translucent material, for example, and can also contain a translucent material and fluorescent substance. When the 1st translucent member 13 contains the fluorescent substance, the light from the light emitting diode element 11 can be converted and the converted light can be taken out. It is preferable that the 1st translucent member 13 is provided in the position which plugs up all the paths from the light emitting diode element 11 to the light extraction surface of the LED device 10. Furthermore, it is preferable that the light extraction surface of the LED device 10 is composed of the first light transmissive member 13. Thereby, the light emitting diode element 11 can be protected from the outside while taking out the light from the light emitting diode element 11 to the outside. Moreover, when the 1st translucent member 13 contains fluorescent substance and a light-scattering agent, the color nonuniformity of the light from the LED apparatus 10 can be reduced. As shown in FIG. 4, the 1st translucent member 13 is arrange | positioned in the side of the light emitting diode element 11 located in the side surface which is not adjacent to the other LED device 10 among the side surfaces of the 2nd LED apparatus 10b. It is preferred that Thereby, since light is emitted also from the side of the light emitting diode element 11, the LED module 100 can have a wider light distribution. As the translucent material, translucent resin, glass, or the like can be used. As the light-transmitting resin, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, or a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin can be used. In particular, a silicone resin excellent in light resistance and heat resistance is preferable.

  A phosphor that can be excited by light emission from the light emitting diode element 11 is used. For example, phosphors that can be excited by blue light or ultraviolet light include cerium-activated yttrium / aluminum / garnet phosphors, cerium-activated lutetium / aluminum / garnet phosphors, europium and / or chromium. Activated nitrogen-containing calcium aluminosilicate phosphors, silicate phosphors activated with europium, β sialon phosphors, CASN phosphors, nitride phosphors such as SCASN phosphors, KSF phosphors, sulfides Examples thereof include physical phosphors and quantum dot phosphors. By combining these phosphors with the blue light emitting diode element 11 or the ultraviolet light emitting diode element 11, various color LED devices 10 (for example, white LED devices 10) can be manufactured. The first translucent member 13 may contain various fillers for the purpose of adjusting the viscosity. When a silicone resin is used as the main material of the first translucent member 13, the first translucent member 13 may be covered with a coat film mainly composed of an epoxy resin having a tackiness lower than that of the silicone resin. .

(substrate)
A plurality of LED devices 10 are mounted on the substrate 20. A wiring pattern for supplying current to the plurality of LED devices 10 is preferably formed on the surface of the substrate 20. Thereby, the LED device 10 is arranged on the wiring pattern, and the electrode 15 of the LED device 10 is connected to the wiring pattern by a metal bump, a conductive adhesive, or the like, so that a current can be supplied to the LED device 10. . Specifically, an aluminum substrate, a copper substrate, an AlN substrate, a SiC substrate, or the like can be used as the substrate 20.

DESCRIPTION OF SYMBOLS 100 LED module 10 LED apparatus 10a 1st LED apparatus 10b 2nd LED apparatus 11 Light emitting diode element 12 Reflective member 13 1st translucent member 14 2nd translucent member 15 Electrode 15a n side electrode 15b p side electrode 20 Substrate 30 Support substrate

Claims (5)

An LED module comprising a substrate and a plurality of LED devices arranged adjacent to each other on the substrate,
Each of the plurality of LED devices includes a light emitting diode element, a reflective member disposed on a side of the light emitting diode element, and a translucent member disposed above the light emitting diode element. A device and a second LED device,
In the first LED device, all side surfaces are adjacent to other LED devices, the translucent member has reflection members on all side surfaces, and the upper surface is a light extraction surface,
The second LED device has a side surface that is adjacent to another LED device and a side surface that is not adjacent to another LED device, and all of the side surfaces of the translucent member that are adjacent to the other LED device. An LED module comprising a reflecting member on a side surface, a side surface not adjacent to the other LED device being a light extraction surface, and an upper surface being a light extraction surface.   The reflecting member disposed on the side of the light emitting diode element has a slope in which a surface on the side of the light emitting diode element increases in distance from the light emitting diode element as the distance from the substrate increases. LED module according to 1.   The LED module according to claim 1, wherein the plurality of LED devices are arranged in a matrix in a top view.   The LED module according to claim 1, wherein the plurality of LED devices are connected in series.   The LED module according to claim 1, wherein the plurality of LED devices are arranged on an upper surface and a lower surface of the substrate.

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