JP6367804B2 - 容量性無線給電システムのための電気的破壊保護 - Google Patents

容量性無線給電システムのための電気的破壊保護 Download PDF

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Publication number
JP6367804B2
JP6367804B2 JP2015529149A JP2015529149A JP6367804B2 JP 6367804 B2 JP6367804 B2 JP 6367804B2 JP 2015529149 A JP2015529149 A JP 2015529149A JP 2015529149 A JP2015529149 A JP 2015529149A JP 6367804 B2 JP6367804 B2 JP 6367804B2
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JP
Japan
Prior art keywords
pair
conductive material
product
electrodes
type
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Expired - Fee Related
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JP2015529149A
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English (en)
Japanese (ja)
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JP2015534427A5 (enExample
JP2015534427A (ja
Inventor
ゴアー デーブ ウィレム バン
ゴアー デーブ ウィレム バン
デン ビガラー テオドルス ヨハネス ペトルス バン
デン ビガラー テオドルス ヨハネス ペトルス バン
オスカー ヘンドリクス ウィレムセン
オスカー ヘンドリクス ウィレムセン
レナート イセブート
レナート イセブート
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Signify Holding BV
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Signify Holding BV
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Publication of JP2015534427A5 publication Critical patent/JP2015534427A5/ja
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/05—Circuit arrangements or systems for wireless supply or distribution of electric power using capacitive coupling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/22—Capacitive coupling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/16—Capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24752—Laterally noncoextensive components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24752—Laterally noncoextensive components
    • Y10T428/2476—Fabric, cloth or textile component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24752—Laterally noncoextensive components
    • Y10T428/24769—Cellulosic

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Signal Processing (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2015529149A 2012-08-28 2013-08-09 容量性無線給電システムのための電気的破壊保護 Expired - Fee Related JP6367804B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261693959P 2012-08-28 2012-08-28
US61/693,959 2012-08-28
PCT/IB2013/056525 WO2014033572A2 (en) 2012-08-28 2013-08-09 Electrical breakdown protection for a capacitive wireless powering system

Publications (3)

Publication Number Publication Date
JP2015534427A JP2015534427A (ja) 2015-11-26
JP2015534427A5 JP2015534427A5 (enExample) 2016-09-29
JP6367804B2 true JP6367804B2 (ja) 2018-08-01

Family

ID=49356476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015529149A Expired - Fee Related JP6367804B2 (ja) 2012-08-28 2013-08-09 容量性無線給電システムのための電気的破壊保護

Country Status (5)

Country Link
US (1) US10186903B2 (enExample)
EP (1) EP2891255B1 (enExample)
JP (1) JP6367804B2 (enExample)
CN (1) CN104584447B (enExample)
WO (1) WO2014033572A2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160156228A1 (en) * 2013-07-11 2016-06-02 Koninklijke Philips N.V. Capacitive powering system with increased efficiency
CN106849370A (zh) * 2015-12-04 2017-06-13 中兴通讯股份有限公司 设备外壳、设备、充电座及无线充电方法
US10283952B2 (en) 2017-06-22 2019-05-07 Bretford Manufacturing, Inc. Rapidly deployable floor power system
US10390468B2 (en) 2017-08-25 2019-08-20 Qualcomm Incorporated Wireless power-transmission shield
WO2022008631A1 (en) * 2020-07-08 2022-01-13 Danmarks Tekniske Universitet Capacitive power transfer for space sensitive electronic devices
CN116846099B (zh) * 2023-09-01 2023-12-19 中国人民解放军海军工程大学 一种电容式无线电能传输耦合器及其应用

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NL6818572A (enExample) * 1968-02-14 1969-08-18
JPS4811872B1 (enExample) * 1968-07-10 1973-04-16
JPS5428361U (enExample) * 1977-07-28 1979-02-24
FR2758020B1 (fr) 1996-12-30 1999-02-26 Alsthom Cge Alcatel Moyens de commande de convertisseur d'energie electrique a niveaux multiples, dit convertisseur multiniveaux
JP3821174B2 (ja) * 1997-01-20 2006-09-13 東レエンジニアリング株式会社 印刷装置
DE69909313T2 (de) * 1998-10-16 2004-06-03 Paratek Microwave, Inc. Spannungsgesteuerte varaktoren und abstimmbare geräte mit derartigen varaktoren
JP3445511B2 (ja) * 1998-12-10 2003-09-08 株式会社東芝 絶縁基板、その製造方法およびそれを用いた半導体装置
JP2004511078A (ja) * 2000-10-13 2004-04-08 フラット　ホワイト　ライティング　ピーティーワイ　リミテッド 照明システム
US6870475B2 (en) * 2002-07-08 2005-03-22 Draeger Medical Systems Inc. Electrically isolated power and data coupling system suitable for portable and other equipment
JP2005033475A (ja) * 2003-07-11 2005-02-03 Tokai Rika Co Ltd アンテナ装置
KR100584996B1 (ko) * 2003-11-22 2006-05-29 주식회사 하이닉스반도체 산화하프늄과 산화알루미늄이 혼합된 유전막을 갖는캐패시터 및 그 제조 방법
JP2006350990A (ja) * 2005-05-17 2006-12-28 Sony Corp 情報処理システム、および情報処理方法
FI120853B (fi) * 2007-09-18 2010-03-31 Powerkiss Oy Energiansiirtojärjestely ja -menetelmä
JP2009089520A (ja) * 2007-09-28 2009-04-23 Takenaka Komuten Co Ltd 電力供給システム
KR20090121021A (ko) * 2008-05-21 2009-11-25 호서대학교 산학협력단 마이카 커패시터 및 그 제조 방법
JP4557049B2 (ja) * 2008-06-09 2010-10-06 ソニー株式会社 伝送システム、給電装置、受電装置、及び伝送方法
US20100087143A1 (en) * 2008-10-03 2010-04-08 Seagate Technology Llc Wireless power and data transfer via capacitive coupling
KR101232857B1 (ko) * 2009-06-25 2013-02-13 가부시키가이샤 무라타 세이사쿠쇼 전력 전송 시스템 및 비접촉 충전 장치
CN102804550B (zh) * 2009-06-25 2014-12-03 株式会社村田制作所 功率传送系统和非接触充电装置
CN102858691B (zh) * 2010-04-28 2015-09-23 株式会社村田制作所 具有阴离子控制的介电性质的钙钛矿材料、薄膜电容器器件及其制造方法
JP2011259649A (ja) * 2010-06-11 2011-12-22 Takenaka Komuten Co Ltd 非接触電力供給システムのための電極構造、及び非接触電力供給システム
JP2012119160A (ja) * 2010-11-30 2012-06-21 Takenaka Komuten Co Ltd 静電駆動スイッチ、送電体、受電体、及び電力供給システム
KR101077411B1 (ko) 2010-12-14 2011-10-26 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법
EP2745379B1 (en) 2011-08-16 2019-10-16 Signify Holding B.V. A capacitive contactless powering system

Also Published As

Publication number Publication date
CN104584447A (zh) 2015-04-29
CN104584447B (zh) 2017-09-26
US20150263570A1 (en) 2015-09-17
WO2014033572A2 (en) 2014-03-06
EP2891255B1 (en) 2018-05-30
JP2015534427A (ja) 2015-11-26
EP2891255A2 (en) 2015-07-08
WO2014033572A3 (en) 2014-05-08
US10186903B2 (en) 2019-01-22

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