JP6360674B2 - ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法 - Google Patents

ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法 Download PDF

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Publication number
JP6360674B2
JP6360674B2 JP2013237024A JP2013237024A JP6360674B2 JP 6360674 B2 JP6360674 B2 JP 6360674B2 JP 2013237024 A JP2013237024 A JP 2013237024A JP 2013237024 A JP2013237024 A JP 2013237024A JP 6360674 B2 JP6360674 B2 JP 6360674B2
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JP
Japan
Prior art keywords
solder
void
image
voids
evaluation
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JP2013237024A
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English (en)
Japanese (ja)
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JP2015096836A5 (enExample
JP2015096836A (ja
Inventor
鈴木　貴
貴 鈴木
末喜 馬場
末喜 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BEAMSENSE CO., LTD.
The University of Osaka
Original Assignee
BEAMSENSE CO., LTD.
Osaka University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by BEAMSENSE CO., LTD., Osaka University NUC filed Critical BEAMSENSE CO., LTD.
Priority to JP2013237024A priority Critical patent/JP6360674B2/ja
Priority to US15/034,302 priority patent/US9965849B2/en
Priority to PCT/JP2014/079717 priority patent/WO2015072424A1/ja
Publication of JP2015096836A publication Critical patent/JP2015096836A/ja
Publication of JP2015096836A5 publication Critical patent/JP2015096836A5/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/401—Imaging image processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6113—Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/648—Specific applications or type of materials voids
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10116—X-ray image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2013237024A 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法 Active JP6360674B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013237024A JP6360674B2 (ja) 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法
US15/034,302 US9965849B2 (en) 2013-11-15 2014-11-10 Void evaluation apparatus and void evaluation method in the solder
PCT/JP2014/079717 WO2015072424A1 (ja) 2013-11-15 2014-11-10 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013237024A JP6360674B2 (ja) 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法

Publications (3)

Publication Number Publication Date
JP2015096836A JP2015096836A (ja) 2015-05-21
JP2015096836A5 JP2015096836A5 (enExample) 2017-02-16
JP6360674B2 true JP6360674B2 (ja) 2018-07-18

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JP2013237024A Active JP6360674B2 (ja) 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法

Country Status (3)

Country Link
US (1) US9965849B2 (enExample)
JP (1) JP6360674B2 (enExample)
WO (1) WO2015072424A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020159758A (ja) * 2019-03-25 2020-10-01 豊田合成株式会社 発光装置の製造方法および半田接合部検査装置
JP7728536B2 (ja) * 2020-01-15 2025-08-25 株式会社クオルテック 電子部品を接続する接合部のボイド・クラックの検出方法
JP7708639B2 (ja) * 2021-10-11 2025-07-15 Ｊｆｅスチール株式会社 耐火物の欠陥評価方法
KR20250077084A (ko) * 2023-11-23 2025-05-30 삼성전자주식회사 반도체 패키지 불량 검출 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60022672T2 (de) * 1999-11-08 2006-06-29 Teradyne Inc., Boston Röntgentomographische bga ( ball grid array ) prüfungen
JP3922172B2 (ja) * 2002-12-17 2007-05-30 トヨタ自動車株式会社 電子部品の放熱性検査方法及びその装置
JP4631460B2 (ja) 2005-02-18 2011-02-16 パナソニック株式会社 Ｘ線検査方法
JP4728092B2 (ja) * 2005-10-27 2011-07-20 名古屋電機工業株式会社 Ｘ線画像出力装置、ｘ線画像出力方法およびｘ線画像出力プログラム
JP2011075470A (ja) * 2009-10-01 2011-04-14 Fujitsu Ltd 画像処理プログラム、画像処理方法および画像処理装置
US8306311B2 (en) * 2010-04-14 2012-11-06 Oracle International Corporation Method and system for automated ball-grid array void quantification
JP5700186B1 (ja) * 2013-07-08 2015-04-15 ソニー株式会社 硬化条件の決定方法、回路デバイスの製造方法及び回路デバイス

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US9965849B2 (en) 2018-05-08
WO2015072424A1 (ja) 2015-05-21
US20160267646A1 (en) 2016-09-15
JP2015096836A (ja) 2015-05-21

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