JP6350679B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
- Publication number
- JP6350679B2 JP6350679B2 JP2016569261A JP2016569261A JP6350679B2 JP 6350679 B2 JP6350679 B2 JP 6350679B2 JP 2016569261 A JP2016569261 A JP 2016569261A JP 2016569261 A JP2016569261 A JP 2016569261A JP 6350679 B2 JP6350679 B2 JP 6350679B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- insulating film
- lower half
- semiconductor substrate
- upper half
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 61
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000012535 impurity Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 38
- 150000004767 nitrides Chemical class 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 39
- 230000000694 effects Effects 0.000 description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 13
- 229920005591 polysilicon Polymers 0.000 description 13
- 230000015556 catabolic process Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- HAYXDMNJJFVXCI-UHFFFAOYSA-N arsenic(5+) Chemical compound [As+5] HAYXDMNJJFVXCI-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
Description
・半導体装置の構造
図1は、実施の形態にかかる半導体装置の活性部を示す断面図である。図1に示すように、半導体装置は、トレンチゲート型のIGBTである。このトレンチゲート型IGBTは、第1の溝(トレンチ)21、ゲート電極3、p型の第1の不純物領域22、n型の第2の不純物領域23、第1の絶縁膜24、第2の溝(トレンチ)25、第2の絶縁膜26、第3の絶縁膜27、エミッタ電極9、p型の第3の不純物層28及びコレクタ電極13を有する。
図2は、図1に示す半導体装置の製造途中の様子を示す断面図である。図3は、図2の続きを示す断面図である。図4は、図3の続きを示す断面図である。図5は、図4の続きを示す断面図である。図6は、図5の続きを示す断面図である。
上述した半導体装置の製造方法に従って作製した1200V耐圧クラスのIGBTを実施例とする。一方、比較のため、図9に示す従来構造の1200V耐圧クラスのIGBTを従来例とする。
9 エミッタ電極
13 コレクタ電極
21 第1の溝
22 第1の不純物領域
23 第2の不純物領域
24 第1の絶縁膜
25 第2の溝
26 第2の絶縁膜
27 第3の絶縁膜
28 第3の不純物層
31 第1の絶縁膜の下半部
Claims (4)
- 第1導電型の半導体基板と、
前記半導体基板のおもて面側に設けられた第1の溝と、
前記第1の溝内に充填された導電体でできたゲート電極と、
前記半導体基板のおもて面側に前記第1の溝に接するように設けられた第2導電型の第1の不純物領域と、
前記第1の不純物領域の表面近傍領域に設けられた第1導電型の第2の不純物領域と、
前記第1の溝と前記ゲート電極との間に設けられ、前記第1の不純物領域に接する上半部よりも厚い下半部を有する第1の絶縁膜と、
前記半導体基板のおもて面側に設けられた第2の溝と、
前記第2の溝内に設けられ、上半部よりも厚い下半部を有する第2の絶縁膜と、
前記第1の溝の上と前記第2の溝の上とに跨って設けられた第3の絶縁膜と、
前記第3の絶縁膜上に設けられ、前記第1の不純物領域及び前記第2の不純物領域に電気的に接続されたエミッタ電極と、
前記半導体基板の裏面側に設けられた第2導電型の第3の不純物層と、
前記第3の不純物層の表面に設けられたコレクタ電極と、
を備え、
前記第1の絶縁膜の下半部と前記第2の絶縁膜の下半部とが繋がっており、
前記第1の絶縁膜の下半部に接する部分の前記ゲート電極の幅は、前記第1の絶縁膜の上半部に接する部分の前記ゲート電極の幅よりも狭いことを特徴とする半導体装置。 - 前記第1の絶縁膜と前記第2の絶縁膜と前記第3の絶縁膜とによって囲まれた領域に前記半導体基板の一部分を含むことを特徴とする請求項1に記載の半導体装置。
- 前記第1の絶縁膜と前記第2の絶縁膜と前記第3の絶縁膜とによって囲まれた前記半導体基板の一部分の不純物濃度は、前記第1の不純物領域の不純物濃度と同じであることを特徴とする請求項3に記載の半導体装置。
- 第1導電型の半導体基板に第1の溝の上半部及び第2の溝の上半部を形成し、
前記第1の溝の側面及び前記第2の溝の側面をそれぞれ窒化膜で覆い、
前記窒化膜をマスクとして異方性エッチングを行って、前記第1の溝の上半部の底及び前記第2の溝の上半部の底に、それぞれ前記第1の溝の上半部及び前記第2の溝の上半部よりも狭い第1の溝の下半部及び第2の溝の下半部を形成し、
前記窒化膜をマスクとして酸化処理を行って、前記第1の溝の下半部及び前記第2の溝の下半部のそれぞれの周囲に酸化膜を生成し、前記第1の溝の下半部の周囲の酸化膜と前記第2の溝の下半部の周囲の酸化膜とを繋げ、
前記窒化膜を除去して、前記第1の溝の上半部及び前記第1の溝の下半部を導電体で埋めることを特徴とする半導体装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015004051 | 2015-01-13 | ||
JP2015004051 | 2015-01-13 | ||
PCT/JP2015/084539 WO2016114043A1 (ja) | 2015-01-13 | 2015-12-09 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016114043A1 JPWO2016114043A1 (ja) | 2017-08-31 |
JP6350679B2 true JP6350679B2 (ja) | 2018-07-04 |
Family
ID=56405598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016569261A Active JP6350679B2 (ja) | 2015-01-13 | 2015-12-09 | 半導体装置及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10103256B2 (ja) |
JP (1) | JP6350679B2 (ja) |
CN (1) | CN107078155B (ja) |
DE (1) | DE112015004505T5 (ja) |
WO (1) | WO2016114043A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106057877B (zh) * | 2016-08-01 | 2019-06-11 | 上海华虹宏力半导体制造有限公司 | 载流子存储型igbt及其制造方法 |
KR20210003997A (ko) * | 2019-07-02 | 2021-01-13 | 삼성전자주식회사 | 반도체 소자 및 그의 제조방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4823435B2 (ja) * | 2001-05-29 | 2011-11-24 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
DE10203164B4 (de) | 2002-01-28 | 2005-06-16 | Infineon Technologies Ag | Leistungshalbleiterbauelement und Verfahren zu dessen Herstellung |
US6919248B2 (en) * | 2003-03-14 | 2005-07-19 | International Rectifier Corporation | Angled implant for shorter trench emitter |
US7075147B2 (en) * | 2003-06-11 | 2006-07-11 | International Rectifier Corporation | Low on resistance power MOSFET with variably spaced trenches and offset contacts |
JP2005340626A (ja) * | 2004-05-28 | 2005-12-08 | Toshiba Corp | 半導体装置 |
US20060163650A1 (en) * | 2005-01-27 | 2006-07-27 | Ling Ma | Power semiconductor device with endless gate trenches |
DE102007020657B4 (de) * | 2007-04-30 | 2012-10-04 | Infineon Technologies Austria Ag | Halbleiterbauelement mit einem Halbleiterkörper und Verfahren zur Herstellung desselben |
US20090057713A1 (en) * | 2007-08-31 | 2009-03-05 | Infineon Technologies Austria Ag | Semiconductor device with a semiconductor body |
US8344480B2 (en) * | 2008-09-30 | 2013-01-01 | Ixys Corporation | Insulated gate bipolar transistor |
EP2546882B1 (en) | 2010-03-09 | 2018-04-18 | Fuji Electric Co., Ltd. | Semiconductor device |
JP5694505B2 (ja) * | 2010-03-23 | 2015-04-01 | アーベーベー・テヒノロギー・アーゲー | 電力半導体デバイス |
JP2011204711A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 半導体装置およびその製造方法 |
JP5969771B2 (ja) * | 2011-05-16 | 2016-08-17 | ルネサスエレクトロニクス株式会社 | Ie型トレンチゲートigbt |
JP5973730B2 (ja) * | 2012-01-05 | 2016-08-23 | ルネサスエレクトロニクス株式会社 | Ie型トレンチゲートigbt |
JP6190206B2 (ja) * | 2012-08-21 | 2017-08-30 | ローム株式会社 | 半導体装置 |
US9419080B2 (en) * | 2013-12-11 | 2016-08-16 | Infineon Technologies Ag | Semiconductor device with recombination region |
US9570577B2 (en) * | 2014-05-12 | 2017-02-14 | Infineon Technologies Ag | Semiconductor device and insulated gate bipolar transistor with source zones formed in semiconductor mesas |
-
2015
- 2015-12-09 DE DE112015004505.8T patent/DE112015004505T5/de active Granted
- 2015-12-09 CN CN201580057250.1A patent/CN107078155B/zh active Active
- 2015-12-09 WO PCT/JP2015/084539 patent/WO2016114043A1/ja active Application Filing
- 2015-12-09 JP JP2016569261A patent/JP6350679B2/ja active Active
-
2017
- 2017-05-01 US US15/583,982 patent/US10103256B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2016114043A1 (ja) | 2017-08-31 |
US10103256B2 (en) | 2018-10-16 |
WO2016114043A1 (ja) | 2016-07-21 |
DE112015004505T5 (de) | 2017-11-30 |
CN107078155B (zh) | 2020-07-07 |
CN107078155A (zh) | 2017-08-18 |
US20170236927A1 (en) | 2017-08-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11610884B2 (en) | Semiconductor device | |
JP5865618B2 (ja) | 半導体装置 | |
JP2016040820A (ja) | 半導体装置 | |
US10297683B2 (en) | Method of manufacturing a semiconductor device having two types of gate electrodes | |
JP6072445B2 (ja) | 半導体装置およびそれを用いた電力変換装置 | |
JP6287407B2 (ja) | 半導体装置 | |
JP5412717B2 (ja) | トレンチ型絶縁ゲート半導体装置 | |
JP6354458B2 (ja) | 半導体装置 | |
JP2016219772A (ja) | 半導体装置 | |
JP2018152426A (ja) | 半導体装置 | |
JP2020025050A (ja) | 半導体装置 | |
JP2014112625A (ja) | 電力半導体素子およびその製造方法 | |
JP6353804B2 (ja) | 半導体装置及びそれを用いた電力変換装置 | |
JP6350679B2 (ja) | 半導体装置及びその製造方法 | |
JP2014154739A (ja) | 半導体装置 | |
JP6173987B2 (ja) | 半導体装置 | |
JP5875026B2 (ja) | 半導体装置 | |
JP2017045874A (ja) | 半導体装置 | |
WO2024062664A1 (ja) | 半導体装置 | |
KR102042833B1 (ko) | 전력 반도체 소자 및 그 제조방법 | |
JP2018157190A (ja) | 半導体装置および半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A527 Effective date: 20170501 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170501 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180508 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180521 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6350679 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |