JP6347875B2 - Substrate processing system and piping cleaning method - Google Patents

Description

  The present invention relates to a substrate processing system for processing a substrate and a piping cleaning method for cleaning piping.

  2. Description of the Related Art A substrate processing apparatus is used to perform various processes on a substrate such as a semiconductor wafer. For example, the substrate processing apparatus described in Patent Document 1 includes a plurality of processing units that process a substrate with a processing liquid, and a processing liquid supply unit that supplies the processing liquid to these processing units. The processing liquid supply unit includes a plurality of processing liquid supply modules. When processing the substrate, the processing liquid is supplied from one of the plurality of processing liquid supply modules to the nozzle of each processing unit through the piping. A processing liquid is discharged from the nozzle onto the substrate.

  When such a substrate processing apparatus is installed in a factory or the like, contaminants such as particles (dust) existing inside pipes and nozzles must be removed before the substrate processing apparatus is operated. Moreover, the deposits on the piping and the like generated by using the substrate processing apparatus must be removed at an appropriate time. Therefore, it is necessary to clean the piping of the substrate processing apparatus.

  In the substrate processing apparatus described in Patent Document 1, a three-way valve is provided in the processing liquid supply module. A processing liquid supply pipe and a cleaning liquid supply pipe are connected to the three-way valve. At the time of processing the substrate, the three-way valve is switched so that the processing liquid supplied from the processing liquid supply pipe is supplied to the processing unit. At the time of cleaning the piping or the like, the three-way valve is switched so that the cleaning liquid supplied from the cleaning liquid supply pipe is supplied to the processing unit. Thereby, piping etc. are washed.

JP 2010-147212 A

  In the substrate processing apparatus described in Patent Document 1, for example, pure water is used as the cleaning liquid. However, there are cases where contaminants inside the piping and the like are not removed only with pure water. In that case, it is necessary to perform cleaning using a cleaning liquid composed of a chemical liquid. For example, when a cleaning liquid composed of a mixture of a plurality of chemical liquids is used, it takes time to prepare the cleaning liquid. Further, after washing with the mixed solution, it is necessary to wash away the mixed solution using a rinse solution as the washing solution. Thus, when a pipe or the like is cleaned using a plurality of cleaning liquids, the time required for the cleaning process becomes long.

  An object of the present invention is to provide a substrate processing system and a pipe cleaning method capable of shortening a cleaning time when a pipe is cleaned using a plurality of cleaning liquids.

(1) A substrate processing system according to the present invention includes a substrate processing apparatus for processing a substrate, a processing liquid supply unit for supplying a processing liquid to the substrate processing apparatus through a first pipe, and a cleaning liquid and a rinsing liquid for the processing liquid supply unit. and a selectively supplying cleaning unit bets, the processing solution supply unit, when processing the substrate by the substrate processing apparatus includes a processing solution tank in which the treatment liquid, the substrate processing apparatus, supplying a processing liquid to a substrate The processing liquid tank and the processing unit are connected by a first pipe, and the processing unit includes a substrate holding unit that holds the substrate, a cup that surrounds the substrate holding unit, and a first a nozzle connected to the pipe, and a second pipe connected to the outlet of the processing unit, the second pipe is connected resistivity meter, a cleaning liquid to the cleaning unit or et processing liquid supply unit Ri, a first step of storing the wash solution to the processing solution tank, the wash solution stored in the processing liquid tank feeding toward the first pipe, a second step of the first pipe is washed with a washing solution, the After the completion of the two steps, the third step of supplying the rinsing liquid from the cleaning unit to the processing liquid tank of the processing liquid supply unit, and the rinsing liquid supplied to the processing liquid tank by the third step are supplied to the nozzle through the first pipe. On the other hand, the fourth step of detecting the specific resistance value of the rinsing liquid discharged from the processing unit through the second pipe with a specific resistance meter, and when the specific resistance detected with the specific resistance meter reaches a predetermined value, the processing liquid tank is transferred to the nozzle. a fifth step of stopping the supply of the rinsing liquid towards, but you executed sequentially.
(2) The substrate processing system may further perform the sixth step you prepare the rinsing liquid in parallel with the cleaning unit and the second step.
(3) In the substrate processing system, the cleaning unit includes a cleaning liquid tank capable of storing both the cleaning liquid and the rinsing liquid, and a drain pipe connected to the cleaning liquid tank, and a resistivity meter is interposed in the drain pipe. Also good.
(4) the processing solution supply unit, before starting the first step may be performed a step of storing the cleaning liquid to the wash solution tank.
(5) washing unit, a replacement step of replacing the cleaning liquid in the cleaning liquid in the tank with a rinsing liquid may be performed before the start of the third step.
(6) The replacement process may be terminated when the specific resistance meter reaches a predetermined value .
(7) washing Kiyoshiyu knit comprises a cleaning liquid tank capable of storing the washing solution and a rinsing liquid tank capable of storing a rinsing liquid, in a first step, sending a cleaning liquid to the processing liquid tank from the washing liquid tank, processing a step of storing the wash solution in the liquid tank, and a step of preparing a rinsing solution may be performed in parallel with the rinsing liquid tank.
(8) The processing solution includes buffered hydrofluoric acid, dilute hydrofluoric acid, hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid or ammonia water, or a mixed solution, photoresist solution or developer. But you can.
(9) The cleaning solution may include a mixed solution of ammonia and hydrogen peroxide solution or a mixed solution of hydrochloric acid and hydrogen peroxide solution.
(10) The rinse liquid may contain carbonated water, ozone water, magnetic water, reduced water or ionic water, or an organic solvent.
(11) A pipe cleaning method according to the present invention is a pipe cleaning method for cleaning a first pipe in a substrate processing apparatus and a processing liquid supply unit, wherein the processing liquid tank and the processing unit are connected by a first pipe and processed. unit includes a substrate holder for holding a substrate, comprising: a cup surrounding the substrate holder, and a nozzle connected to a first pipe and a second pipe connected to the outlet of the processing unit, the second pipe is connected resistivity meter, the piping cleaning method, sends the cleaning liquid to the cleaning unit or et processing liquid supply unit, a first step of storing the wash solution to the processing liquid tank, washing stored in the processing liquid tank Kiyoshi directs the liquid to the first pipe, a second step of washing the first pipe with a cleaning solution, after the completion of the second step, a third scan is supplied to the processing solution tank of the processing liquid supply unit the rinsing liquid from the cleaning unit And-up, while the rinse liquid supplied to the processing solution tank by the third step and supplied to the nozzle through the first pipe, detecting the specific resistance of the rinsing liquid discharged from the processing unit through the second piping resistivity meter And a fifth step of sequentially stopping the supply of the rinse liquid from the processing liquid tank toward the nozzle when the specific resistance detected by the specific resistance meter reaches a predetermined value .

  In the substrate processing system, the processing liquid is stored in the processing liquid tank of the processing liquid supply unit when the substrate is processed. The processing liquid stored in the processing liquid tank is supplied to the substrate processing apparatus through the piping. In the substrate processing apparatus, the supplied processing liquid is supplied to the substrate by the processing unit, and the substrate is processed.

  At the time of cleaning the pipe, the first cleaning liquid is supplied from the cleaning unit to the processing liquid tank of the processing liquid supply unit. In the processing liquid supply unit, after the first cleaning liquid supplied from the cleaning unit is stored in the processing liquid tank, the first cleaning liquid in the processing liquid tank is supplied to the processing unit through a pipe. Thereby, the piping is cleaned with the first cleaning liquid.

  In the cleaning unit, after the first cleaning liquid is supplied to the processing liquid tank, the second cleaning liquid is prepared in parallel with the cleaning of the pipe with the first cleaning liquid. The prepared second cleaning liquid is supplied to the processing liquid tank of the processing liquid supply unit. In the processing liquid supply unit, after the second cleaning liquid supplied from the cleaning unit is stored in the processing liquid tank, the second cleaning liquid in the processing liquid tank is supplied to the processing unit through a pipe. Thereby, the piping is cleaned with the second cleaning liquid.

  As described above, since the pipe cleaning with the first cleaning liquid and the preparation of the second cleaning liquid are performed in parallel, the time required for cleaning the pipe with the first cleaning liquid and the second cleaning liquid can be shortened. As a result, it is possible to shorten the cleaning time when the pipe is cleaned using a plurality of cleaning liquids.

  (2) The substrate processing system further includes a supply path for supplying the first cleaning liquid and the second cleaning liquid from the cleaning unit to the processing liquid tank, and an open / close device that opens and closes the supply path. The supply path may be opened when the first cleaning liquid is supplied to the processing liquid tank, and the supply path may be closed after the first cleaning liquid is supplied to the processing liquid tank.

  In this case, after supplying the first cleaning liquid, the cleaning unit and the processing liquid tank are separated from each other. Therefore, the preparation of the second cleaning liquid can be started in the cleaning unit immediately after the supply of the first cleaning liquid from the cleaning unit to the processing liquid tank. Thereby, it becomes possible to further reduce the cleaning time when the pipe is cleaned using a plurality of cleaning liquids.

  (3) The substrate processing system may further include an inert gas supply unit that supplies an inert gas into the supply path and the cleaning unit after the piping is cleaned with the second cleaning liquid.

  In this case, since the inert gas is sealed in the supply path and the processing unit after the piping is cleaned, contamination in the supply path and the cleaning unit due to intrusion of particles or the like is prevented.

  (4) The processing liquid supply unit further includes a circulation path for circulating the first cleaning liquid in the processing liquid tank through the filter, and the cleaning unit prepares the second cleaning liquid in parallel with the circulation of the first cleaning liquid through the circulation path. May be.

  In this case, particles mixed in the first cleaning liquid are removed by the filter. In addition, the second cleaning liquid is prepared in parallel with the circulation of the first cleaning liquid through the circulation path and the cleaning of the pipe with the first cleaning liquid. Therefore, even when the preparation of the second cleaning liquid requires a relatively long time, an increase in the time required for cleaning the pipe with the first cleaning liquid and the second cleaning liquid is suppressed.

  (5) The cleaning unit may be provided so that it can be connected to and disconnected from the processing liquid supply unit.

  In this case, the cleaning unit can be connected to the processing liquid supply unit when the pipe is cleaned, and the cleaning unit can be disconnected from the processing liquid supply unit after the pipe is cleaned. Therefore, by sequentially connecting the cleaning units to the plurality of processing liquid supply units, it is possible to sequentially clean the piping in the plurality of processing liquid supply units and the plurality of substrate processing apparatuses. Further, since the cleaning unit can be separated during the processing of the substrate, an increase in the size of the substrate processing system is suppressed.

  (6) The processing liquid supply unit may include a plurality of processing liquid tanks, and the cleaning unit may be configured to be connectable to the plurality of processing liquid tanks.

  In this case, a plurality of pipes connecting the plurality of processing liquid tanks and the substrate processing apparatus can be cleaned by a single cleaning unit.

  (7) A pipe cleaning method according to the present invention is a pipe cleaning method for cleaning pipes in a substrate processing apparatus and a processing liquid supply unit, and the processing liquid supply unit is a processing liquid in a processing liquid supply unit during processing of a substrate. The processing liquid is configured to be supplied from the tank to the processing unit of the substrate processing apparatus through the pipe, and the pipe cleaning method supplies the first cleaning liquid from the cleaning unit to the processing liquid tank of the processing liquid supply unit when cleaning the pipe. And, after supplying the first cleaning liquid to the processing liquid tank, cleaning the pipe by supplying the first cleaning liquid to the processing unit of the substrate processing apparatus through the piping from the processing liquid tank, and cleaning the pipe with the first cleaning liquid. In parallel, the step of preparing the second cleaning liquid in the cleaning unit and the cleaning of the pipe with the first cleaning liquid, And supplying the second cleaning liquid click, after the supply of the second cleaning liquid into the processing liquid tank, it is intended to include a step of washing the pipe by supplying a second washing solution from the processing solution tank to the processing unit through the pipe.

  In the pipe cleaning method, since the pipe cleaning with the first cleaning liquid and the preparation of the second cleaning liquid are performed in parallel, the cleaning time when shortening the time required for cleaning the pipe with the first cleaning liquid and the second cleaning liquid is reduced. Can be shortened. As a result, it is possible to shorten the cleaning time when the pipe is cleaned using a plurality of cleaning liquids.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to shorten the washing | cleaning time in the case of wash | cleaning piping using a some washing | cleaning liquid.

1 is a schematic diagram showing a configuration of a substrate processing system according to a first embodiment of the present invention. It is a flowchart which shows the piping washing | cleaning operation | movement by control of the control part of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the piping cleaning operation | movement of the substrate processing system in each step of FIG. It is a schematic diagram which shows the structure of the substrate processing system which concerns on the 2nd Embodiment of this invention. It is a schematic diagram which shows the structure of the washing | cleaning unit in the 3rd Embodiment of this invention.

  Hereinafter, a substrate processing system and a pipe cleaning method according to an embodiment of the present invention will be described. In the following description, a substrate means a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, or the like.

[1] First Embodiment (1) Overall Configuration of Substrate Processing System FIG. 1 is a schematic diagram showing a configuration of a substrate processing system according to a first embodiment of the present invention.

  A substrate processing system 100 in FIG. 1 includes a portable cleaning unit 1, a plurality of processing liquid supply units 2, and a substrate processing apparatus 3. The substrate processing apparatus 3 includes a plurality of processing units 31. In FIG. 1, two processing units 31 are illustrated. In each processing unit 31, processing using a processing liquid is performed on the substrate W.

  The cleaning unit 1 includes a cleaning liquid tank 11, weighing tanks 12 and 13, a pump 14, a filter 15, a specific resistance meter 16, and a control unit 17. A liquid circulation pipe P <b> 1 is connected between the liquid inlet and the liquid outlet of the cleaning liquid tank 11. Valve V1, pump 14, and filter 15 are inserted in piping P1. A pipe P2 is provided so as to branch from the pipe P1. The pipe P2 is connected to the connection portion C1 of the processing liquid supply unit 2.

  The weighing tanks 12 and 13 are connected to the liquid inlet of the cleaning liquid tank 11 through pipes P3 and P4, respectively. Valves V2 and V3 are inserted in the pipes P3 and P4, respectively. Chemical liquid supply units 41 and 42 are connected to the weighing tanks 12 and 13 through pipes P5 and P6, respectively. A pure water supply source 43 is connected to the liquid inlet of the cleaning liquid tank 11 through the pipe P7. A valve V4 is inserted in the pipe P7.

  The first chemical solution is supplied from the chemical solution supply unit 41 to the weighing tank 12, and the second chemical solution is supplied from the chemical solution supply unit 42 to the weighing tank 13. In this case, when the valves V2 and V3 are opened, the first and second chemical liquids in the weighing tanks 12 and 13 are supplied to the cleaning liquid tank 11, and the first and second chemical liquids are mixed. As a result, a cleaning liquid is generated. The first chemical solution is, for example, ammonia, and the second chemical solution is, for example, hydrogen peroxide solution. In this case, a mixed liquid of ammonia and hydrogen peroxide (hereinafter referred to as SC1) is generated as a cleaning liquid. When the first chemical solution is hydrochloric acid (HCl) and the second chemical solution is hydrogen peroxide solution, a mixed solution of hydrochloric acid and hydrogen peroxide solution (hereinafter referred to as SC2) is generated as a cleaning solution. .

  When the valve V4 is opened, pure water is supplied from the pure water supply source 43 to the cleaning liquid tank 11. In that case, pure water is used as the cleaning liquid. Instead of pure water, a rinse liquid other than pure water may be used as the cleaning liquid. In this case, as the rinse liquid, for example, carbonated water, ozone water, magnetic water, reduced water (hydrogen water) or ionic water, or an organic solvent such as IPA (isopropyl alcohol) may be used.

  The liquid outlet of the cleaning liquid tank 11 is connected to the resistivity meter 16 through the pipe P8. A valve V5 is inserted in the pipe P8. A pipe P9 is connected to the specific resistance meter 16. A valve V6 is inserted in the pipe P9. The pipe P9 is connected to the connection portion C2 of the processing liquid supply unit 2. The specific resistance meter 16 is connected to a drain pipe P10. The control unit 17 controls operations of the cleaning unit 1 such as opening and closing of the valves V1 to V6 and operation of the pump 14.

  The processing liquid supply unit 2 includes one or a plurality of processing liquid tanks 21 and a control unit 24. In the present embodiment, one processing liquid tank 21 is provided. A pipe P11 is connected between the liquid inlet of the processing liquid tank 21 and the connection portion C1. Valves V7 and V8 are inserted in the pipe P11. A pipe P12 is connected to the pipe P11 between the valves V7 and V8. A valve V9 is inserted in the pipe P12. Nitrogen gas can be supplied to the pipe P11 through the pipe P12.

  A liquid circulation pipe P <b> 13 is connected between the liquid inlet and the liquid outlet of the processing liquid tank 21. A valve V10, a pump 22 and a filter 23 are inserted in the pipe P13. A pipe P14 is provided to branch from the pipe P13. A valve V11 is inserted in the pipe P14. The pipe P14 is connected to the connection part C2.

  A pipe P15 is provided so as to branch from the pipe P13. A valve V12 is inserted in the pipe P15. A plurality of pipes P16 are branched from the pipe P15.

  When processing the substrate in the substrate processing apparatus 3, the processing liquid is stored in the processing liquid tank 21 of the processing liquid supply unit 2. As the treatment liquid, a chemical liquid or a rinse liquid is used. Examples of the chemical solution include aqueous solutions such as buffered hydrofluoric acid (BHF), dilute hydrofluoric acid (DHF), hydrofluoric acid (hydrogen fluoride water: HF), hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid, or aqueous ammonia. Or a mixed solution thereof. The processing solution may be a photoresist solution or a developing solution.

  The control unit 24 controls operations of the processing liquid supply unit 2 such as opening and closing of the valves V7 to V12 and operation of the pump 22. The substrate processing apparatus 3 includes a plurality of processing units 31. Each processing unit 31 includes a substrate holder 32 that holds the substrate W, a cup 33, and a nozzle 34. The nozzle 34 is connected to the pipe P16. A valve V13 is inserted in each pipe P16. A pipe P <b> 17 is connected to the discharge port of each processing unit 31. A valve V14 is inserted in the pipe P17. The pipe P17 is connected to the specific resistance meter 16 of the cleaning unit 1. The control unit 35 controls the operation of the substrate processing apparatus 3 such as opening and closing of the valves V13 and V14.

  The cleaning unit 1 can be connected to and disconnected from the processing liquid supply unit 2 at the connection portions C1 and C2. During the pipe cleaning operation described below, the cleaning unit 1 is connected to the processing liquid supply unit 2. Further, when the substrate W is processed, the cleaning unit 1 is separated from the processing liquid supply unit 2.

(2) Pipe Cleaning Operation Next, a pipe cleaning operation in the substrate processing system 100 will be described. The control unit 17 of the cleaning unit 1, the control unit 24 of the processing liquid supply unit 2, and the control unit 35 of the substrate processing apparatus 3 communicate with each other while the cleaning unit 1, the processing liquid supply unit 2 and the substrate processing apparatus 3 are in communication with each other. Control the behavior.

  FIG. 2 is a flowchart showing a pipe cleaning operation under the control of the control units 17, 24, and 35 in FIG. 3 to 11 are schematic views showing the pipe cleaning operation of the substrate processing system 100 in each step of FIG.

  Here, an example in which piping of the processing liquid supply unit 2 and the substrate processing apparatus 3 is cleaned using the first cleaning liquid, the second cleaning liquid, and the third cleaning liquid will be described. In this example, the first cleaning liquid is SC1, the second cleaning liquid is pure water, and the third cleaning liquid is also pure water. In the initial state, it is assumed that the valves V1 to V14 are closed.

  First, the cleaning unit 1 prepares the first cleaning liquid under the control of the control unit 17 (step S1 in FIG. 2). In this case, the control unit 17 opens the valves V2 and V3 in FIG. Thereby, as indicated by a thick dotted line arrow in FIG. 3, ammonia is supplied from the weighing tank 12 to the cleaning liquid tank 11 as the first chemical liquid, and hydrogen peroxide water is supplied from the weighing tank 13 as the second chemical liquid to the cleaning liquid tank 11. And ammonia and hydrogen peroxide solution are mixed. As a result, SC1 is generated as the first cleaning liquid. Thereafter, the control unit 17 closes the valves V2 and V3, opens the valve V1 in FIG. As a result, the first cleaning liquid circulates in the pipe P1 as indicated by the thick solid arrow in FIG. As a result, particles in the cleaning liquid tank 11 and particles contained in the first cleaning liquid are removed by the filter 15.

  Next, the first cleaning liquid is supplied from the cleaning liquid tank 11 to the processing liquid tank 21 under the control of the control unit 24 (step S2). In this case, the control unit 17 closes the valve V1 of FIG. 1 to stop the return of the first cleaning liquid to the cleaning liquid tank 11, and then the control unit 24 opens the valves V7 and V8 of FIG. As a result, as indicated by a thick solid arrow in FIG. 4, the first cleaning liquid is supplied from the pipe P1 to the processing liquid tank 21 through the pipe P11.

  Thereafter, circulation of the first cleaning liquid and preparation for cleaning are performed under the control of the control unit 24 (step S3). In this case, the control unit 24 closes the valves V7 and V8 in FIG. 1, opens the valve V10, and operates the pump 22. As a result, as indicated by a thick solid line arrow in FIG. 5, the first cleaning liquid circulates through the pipe P <b> 13, and particles in the processing liquid tank 21 and particles contained in the first cleaning liquid are removed by the filter 23.

  Next, pipe cleaning is performed under the control of the control unit 24 and the control unit 35 (step S4). In this case, the control unit 24 opens the valve V12 in FIG. 1, and the control unit 35 opens the valves V13 and V14 in FIG. As a result, as indicated by the thick solid arrow in FIG. 6, the first cleaning liquid is supplied from the pipe P <b> 13 through the pipes P <b> 15 and P <b> 16 and the nozzle 34 into each processing unit 31. The first cleaning liquid in each processing unit 31 is discharged through the pipings P17 and P10. Accordingly, the pipes P13, P15 to P17, the valves V12 to V14, and the nozzle 34 are cleaned with the first cleaning liquid. After the pipe cleaning with the first cleaning liquid is completed, the control unit 24 closes the valves V10 and V12, and the control unit 35 closes the valves V13 and V14.

  In parallel with the circulation and cleaning preparation of the first cleaning liquid in step S3 and the pipe cleaning in step S4, the second cleaning liquid is prepared under the control of the control unit 17 (step S5). In this case, the control unit 17 opens the valves V1, V4, and V5 shown in FIG. As a result, as shown by the thick dashed line arrows in FIGS. 5 and 6, pure water is supplied as the second cleaning liquid from the pure water supply source 43 to the cleaning liquid tank 11 through the pipe P7, and FIGS. As indicated by the white arrow, the first cleaning liquid in the cleaning liquid tank 11 is discharged through the pipes P8 and P10. Further, the second cleaning liquid circulates through the pipe P1. As a result, the first cleaning liquid in the cleaning liquid tank 11, the pipe P1, the pump 14, and the filter 15 is replaced with the second cleaning liquid. Further, the control unit 17 measures the specific resistance of the second cleaning liquid using the specific resistance meter 16. When the specific resistance reaches a predetermined value, the control unit 17 closes the valve V <b> 5 of FIG. 1 and stores the second cleaning liquid in the cleaning liquid tank 11. Thereafter, the control unit 17 closes the valve V4 in FIG.

  Next, the second cleaning liquid is supplied from the cleaning liquid tank 11 to the processing liquid tank 21 under the control of the control unit 24 (step S6). In this case, the control unit 17 closes the valve V1 in FIG. 1 to stop returning the second cleaning liquid to the cleaning liquid tank 11, and then the control unit 24 opens the valves V7 and V8 in FIG. As a result, the second cleaning liquid is supplied from the pipe P1 to the processing liquid tank 21 through the pipe P11 as indicated by a thick dashed line arrow in FIG. Further, the control unit 24 opens the valve V10. Accordingly, the second cleaning liquid circulates through the pipe P13, and the first cleaning liquid in the cleaning liquid tank 11, the pipe P13, the filter 15, and the pump 14 is washed away with the second cleaning liquid.

  Next, pipe cleaning is performed under the control of the control unit 24 and the control unit 35 (step S7). In this case, the control unit 24 opens the valve V12 in FIG. 1, and the control unit 35 opens the valves V13 and V14 in FIG. As a result, as indicated by a thick dashed line arrow in FIG. 8, the second cleaning liquid is supplied from the pipe P13 through the pipes P15 and P16 and the nozzle 34 into each processing unit 31. The second cleaning liquid in each processing unit 31 is discharged through the pipes P17 and P10. Accordingly, the pipes P13, P15 to P17, the valves V12 to V14, and the nozzle 34 are cleaned with the second cleaning liquid.

  Moreover, it is determined whether the specific resistance of a 2nd washing | cleaning liquid is a predetermined value by control of the control part 17 (step S8). In this case, the control unit 17 measures the specific resistance of the second cleaning liquid using the specific resistance meter 16. If the specific resistance is not a predetermined value, the process returns to step S6, and the second cleaning liquid is supplied from the cleaning liquid tank 11 to the processing liquid tank 21 and the pipe is cleaned with the second cleaning liquid. When the specific resistance reaches a predetermined value, the control unit 24 closes the valves V10 and V12 in FIG. 1, and the control unit 35 closes the valves V13 and V14.

  In parallel with the pipe cleaning in step S7, the third cleaning liquid is prepared under the control of the control unit 17 (step S9). In this case, the control unit 17 opens the valves V1, V4, and V5 shown in FIG. As a result, as indicated by a thick two-dot chain line arrow in FIG. 8, pure water is supplied as the third cleaning liquid from the pure water supply source 43 to the cleaning liquid tank 11 through the pipe P7, and in FIG. As shown, the second cleaning liquid in the cleaning liquid tank 11 is discharged through the pipes P8 and P10. Further, the third cleaning liquid circulates through the pipe P1. As a result, the second cleaning liquid in the cleaning liquid tank 11, the pipe P1, the pump 14, and the filter 15 is replaced with the third cleaning liquid. Further, the control unit 17 measures the specific resistance of the third cleaning liquid using the specific resistance meter 16. When the specific resistance reaches a predetermined value, the control unit 17 closes the valve V <b> 5 of FIG. 1 and stores the third cleaning liquid in the cleaning liquid tank 11. Thereafter, the control unit 17 closes the valve V4.

  Next, the third cleaning liquid is supplied from the cleaning liquid tank 11 to the processing liquid tank 21 and the processing liquid tank 21 is cleaned under the control of the control unit 24 (step S10). In this case, the control unit 17 closes the valve V1 in FIG. 1 to stop the return of the third cleaning liquid to the cleaning liquid tank 11, and then the control unit 24 opens the valves V7 and V8 in FIG. As a result, as indicated by the thick two-dot chain line arrow in FIG. 9, the third cleaning liquid is supplied from the pipe P1 to the processing liquid tank 21 through the pipe P11. Further, the control unit 24 opens the valve V10 of FIG. Accordingly, the third cleaning liquid circulates through the pipe P13, and the second cleaning liquid of the cleaning liquid tank 11, the pipe P13, the filter 15, and the pump 14 is washed away with the third cleaning liquid.

  Further, it is determined whether or not the specific resistance of the third cleaning liquid is a predetermined value under the control of the control unit 17 and the control unit 24 (step S11). In this case, the control unit 17 opens the valve V6 in FIG. 1, and the control unit 24 opens the valve V11 in FIG. As a result, as indicated by thick two-dot chain arrows in FIG. 10, the third cleaning liquid in the processing liquid tank 21 and the pipe P13 is discharged through the pipes P14, P9, and P10. The controller 17 measures the specific resistance of the third cleaning liquid using the specific resistance meter 16. If the specific resistance is not a predetermined value, the process returns to step S10, and the third cleaning liquid is supplied from the cleaning liquid tank 11 to the processing liquid tank 21 and the third cleaning liquid is circulated.

  When the specific resistance reaches a predetermined value, the third cleaning liquid in the processing liquid tank 21 and the pipes P13, P14, P9, and P10 is discharged under the control of the control unit 24 and the control unit 17 (step S12). After discharging the third cleaning liquid in the processing liquid tank 21 and the pipes P13, P14, P9, P10, the control unit 24 closes the valves V6, V10, V11 in FIG.

  The inside of the processing liquid tank 21 can be sufficiently cleaned by the above steps S9 to S12.

  Thereafter, nitrogen gas is sealed under the control of the control unit 24 (step S13). In this case, the control unit 24 opens the valves V7 and V9, and the control unit 17 opens the valve V1. Thus, nitrogen gas is sealed in the pipes P11, P2 and P1 and the cleaning liquid tank 11 as indicated by thick broken arrows in FIG.

(3) Effect In the substrate processing system 100 according to the present embodiment, the cleaning unit 1 prepares the second cleaning liquid (step S5) in parallel with the cleaning of the pipes P13 and P15 to P17 with the first cleaning liquid (step S4). )It can be performed. In parallel with the cleaning of the pipes P13, P15 to P17 with the second cleaning liquid (step S7), the cleaning unit 1 can prepare the third cleaning liquid (step S9). Therefore, the time required for cleaning the pipes P13, P15 to P17 with the first cleaning liquid and the second cleaning liquid can be shortened. As a result, the pipes P13 and P15 to P17 can be cleaned in a short time using a plurality of cleaning liquids.

  Furthermore, in parallel with the circulation and cleaning preparation (step S3) of the first cleaning liquid in the processing liquid supply unit 2, it is also possible to prepare the third cleaning liquid (step S9) in the cleaning unit 1. In this case, the time required for cleaning the pipes P13, P15 to P17 with the first cleaning liquid and the second cleaning liquid can be further shortened.

  Further, since the valves V7 and V8 inserted in the pipe P11 are closed after the supply of the first cleaning liquid from the cleaning unit 1 to the processing liquid tank 21, the supply of the first cleaning liquid from the cleaning unit 1 to the processing liquid tank 21 is closed. Immediately after the end, preparation of the second cleaning liquid can be started in the cleaning unit 1. As a result, the pipes P13 and P15 to P17 can be cleaned with the first cleaning liquid and the second cleaning liquid in a shorter time.

  Further, after the pipes P13, P15 to P17 and the processing liquid tank 21 are cleaned, nitrogen gas is sealed in the cleaning liquid tank 11 and the pipes P2, P11 of the cleaning unit 1, so that the pipes P2, P11 and Contamination in the cleaning liquid tank 11 is prevented.

  Furthermore, since the cleaning unit 1 can be connected to and disconnected from the processing liquid supply unit 2, the cleaning unit 1 is disconnected from the processing liquid supply unit 2 after the cleaning of the pipes P13 and P15 to P17, and another processing liquid supply is performed. Can be connected to unit 2. Thereby, the piping of the plurality of processing liquid supply units 2 and the plurality of substrate processing apparatuses 3 can be sequentially cleaned by the single cleaning unit 1. Moreover, since the cleaning unit 1 can be separated from the processing liquid supply unit 2 when the substrate processing apparatus 3 processes the substrate W, an increase in the size of the substrate processing system 100 during operation of the substrate processing apparatus 3 is suppressed.

[2] Second Embodiment FIG. 12 is a schematic diagram showing a configuration of a substrate processing system according to a second embodiment of the present invention. The configuration and operation of the substrate processing system 100 according to the second embodiment are the same as the configuration and operation of the substrate processing system 100 according to the first embodiment except for the following points.

  As shown in FIG. 12, in the present embodiment, the processing liquid supply unit 2 is provided with a processing liquid tank 21a in addition to the processing liquid tank 21 of FIG. A pipe P11a is provided so as to branch from the part of the pipe P11 between the valve V7 and the connection portion C1.

  The pipe P11a is connected to the liquid inlet of the processing liquid tank 21a. Valves V7a and V8a are inserted in the pipe P11a. A pipe P12a is provided so as to branch from a portion of the pipe P12 on the upstream side of the valve V9. A pipe P12a is connected to the pipe P11a between the valves V7a and V8a. A valve V9a is inserted in the pipe P12a. Nitrogen gas can be supplied to the pipe P11a through the pipe P12a.

  A liquid circulation pipe P13a is connected between the liquid inlet and the liquid outlet of the processing liquid tank 21a. A valve V10a, a pump 22a, and a filter 23a are inserted in the pipe P13a. A pipe P14a is provided so as to branch from the pipe P13a. A valve V11a is inserted in the pipe P14a. The pipe P14a is connected to the connection part C2. A pipe P15a is provided so as to branch from the pipe P13a. A valve V12a is inserted in the pipe P15a. A plurality of pipes P16a are branched from the pipe P15a.

  The control unit 24 controls operations of the processing liquid supply unit 2 such as opening and closing of the valves V7 to V12 and V7a to V12a and operation of the pumps 22 and 22a.

  When the substrate is processed in the substrate processing apparatus 3, the processing liquid is stored in the processing liquid tanks 21 and 21a. Different types of processing liquids may be stored in the processing liquid tanks 21 and 21a. Alternatively, treatment liquids having the same components and different concentrations may be stored in the treatment liquid tanks 21 and 21a.

  Each processing unit 31 of the substrate processing apparatus 3 includes a nozzle 34 a in addition to the substrate holding part 32, the cup 33 and the nozzle 34. The nozzle 34a is connected to the pipe P16a. A valve V13a is inserted in each pipe P16a. The control unit 35 controls operations of the substrate processing apparatus 3 such as opening and closing of the valves V13, V13a, and V14.

  In the substrate processing system 100 of FIG. 12, when the valves V7, V8, V7a, V8a are opened, the cleaning liquid is simultaneously supplied from the cleaning unit 1 to the two processing liquid tanks 21, 21a. When the valves V10, V10a, V12, and V12a are opened while the cleaning liquid is stored in the two processing liquid tanks 21 and 21a, the cleaning liquid in the processing liquid tanks 21 and 21a is piped P15, P15a, P16, and P16a. And it supplies in each processing unit 31 through the nozzles 34 and 34a. Thereby, the two process liquid tanks 21 and 21a and the pipes P11 to P16 and P11a to P16a of the process liquid supply unit 2 can be cleaned at the same time.

  Also, different cleaning liquids can be supplied from the cleaning unit 1 to the processing liquid tanks 21 and 21a of the processing liquid supply unit 2, respectively. In this case, the cleaning liquid can be supplied from the cleaning unit 1 to the processing liquid tank 21 by opening the valves V7 and V8. Further, the cleaning liquid can be supplied from the cleaning unit 1 to the processing liquid tank 21a by opening the valves V7a and V8a. For example, after SC1 is supplied as the first cleaning liquid to the processing liquid tank 21, pure water is supplied as the second cleaning liquid to the processing liquid tank 21. Thereafter, SC2 is supplied as the first cleaning liquid to the processing liquid tank 21a, and then pure water is supplied as the second cleaning liquid to the processing liquid tank 21a.

  In this case, pure water is prepared in the cleaning unit 1 in parallel with the pipe cleaning by SC1, SC2 is prepared in the cleaning unit 1 in parallel with pipe cleaning by pure water, and pure water is supplied in parallel with pipe cleaning by SC2. Can be prepared. Thereby, the time required for cleaning the treatment liquid tank 21 and the pipes P13, P15 to P17 with SC1 and pure water can be shortened, and the treatment liquid tank 21a and the pipes P13a, P15a to P17a with SC2 and pure water can be washed. Can be shortened.

[3] Third Embodiment A substrate processing system according to a third embodiment has the same configuration as the substrate processing system 100 according to the first embodiment except for the configuration of the cleaning unit 1. FIG. 13 is a schematic diagram showing the configuration of the main part of the cleaning unit according to the third embodiment of the present invention.

  As shown in FIG. 13, the cleaning unit 1 in the present embodiment includes a cleaning liquid tank 11 a in addition to the cleaning liquid tank 11. A pipe P1a for circulating liquid is connected to the cleaning liquid tank 11a. A valve V1a, a pump 14a, and a filter 15a are inserted in the pipe P1a. A pipe P2a is provided so as to branch from the pipe P1a. The pipe P2a is connected to the pipe P2.

  In FIG. 13, the weighing tanks 12 and 13, the pipes P <b> 5 to P <b> 10, the valves V <b> 4 to V <b> 6, the specific resistance meter 16, and the control unit 17 of FIG. Further, illustration of a weighing tank, a valve, and piping connected to the cleaning liquid tank 11a is also omitted.

  In the cleaning unit 1 of FIG. 13, different types of cleaning liquids or cleaning liquids having different concentrations can be stored in the cleaning liquid tanks 11 and 11a. For example, SC1 is used as the first cleaning liquid, pure water is used as the second cleaning liquid, SC2 is used as the third cleaning liquid, and pure water is used as the fourth cleaning liquid. In this case, the second cleaning liquid can be prepared in the cleaning liquid tank 11 in parallel with the pipe cleaning with the first cleaning liquid. In addition, the fourth cleaning liquid can be prepared in the cleaning liquid tank 11a in parallel with the pipe cleaning with the third cleaning liquid. Therefore, it is possible to clean the piping in a short time using a plurality of cleaning liquids.

[4] Other Embodiments (a) In the first embodiment described above, SC1 is used as the first cleaning liquid, pure water is used as the second cleaning liquid, SC2 is used as the third cleaning liquid, and the fourth cleaning liquid is used as the fourth cleaning liquid. Pure water may be used. In this case, after performing steps S1 to S8 of FIG. 2 for the first cleaning liquid and the second cleaning liquid, steps S1 to S8 are performed for the third cleaning liquid and the fourth cleaning liquid, and then steps S9 to S13 are performed. Thereby, particles in the processing liquid tank 21 and the pipes P13, P15 to P17 can be cleaned using SC1, and metal-based contaminants in the processing liquid tank 21 and the pipes P13, P15 to P17 can be cleaned using SC2. .

  (B) In the cleaning unit 1 of FIG. 13, the pipe P <b> 2 and the pipe P <b> 2 a may be provided separately without being connected. Further, in the treatment liquid supply unit 2 of FIG. 12, the pipe P11 and the pipe P11a may be provided separately without being connected. In this case, the pipes P2 and P2a of the cleaning unit 1 can be connected to the pipes P11 and P11a of the processing liquid supply unit 2, respectively. In this case, the cleaning liquid is supplied from the cleaning liquid tank 11 of FIG. 13 to the processing liquid tank 21 of FIG. 12 through the pipe P2, and the processing liquid is supplied from the cleaning liquid tank 11a of FIG. 13 to the processing liquid tank 21a of FIG. .

  (C) In the above embodiment, the control units 17, 24, and 35 are provided in the cleaning unit 1, the processing liquid supply unit 2, and the substrate processing apparatus 3, respectively, but the present invention is not limited to this. Instead of the plurality of control units 17, 24, and 35, a single control unit that controls the cleaning unit 1, the processing liquid supply unit 2, and the substrate processing apparatus 3 may be provided.

[5] Correspondence relationship between each constituent element of claim and each part of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each part of the embodiment will be described. It is not limited.

In the above embodiment, the substrate processing apparatus 3 is an example of a substrate processing apparatus, the processing liquid supply units 2 and 2a are examples of a processing liquid supply unit, the cleaning unit 1 is an example of a processing unit, and the processing liquid The tanks 21 and 21a are examples of processing liquid tanks, the processing unit 31 is an example of a processing unit, and the pipes P13, P15. P16, P13a, P15a, and P16a are examples of the first piping. The pipe P17 is an example of the second pipe.

  Pipes P2, P11, and P2a are examples of supply paths, valves V7, V8, V7a, and V8a are examples of switching devices, nitrogen gas is an example of inert gas, and pipe P12 is an inert gas supply. The pipes P13 and P13a are examples of circulation paths.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

The present invention can be used for cleaning piping in a substrate processing system.
[6] Reference form
(1) A substrate processing system according to this embodiment includes a substrate processing apparatus that processes a substrate, a processing liquid supply unit that supplies a processing liquid to the substrate processing apparatus through a pipe, and a cleaning unit. Includes a processing liquid tank that stores a processing liquid when processing the substrate, and the substrate processing apparatus includes a processing unit that supplies the processing liquid to the substrate when processing the substrate, and the processing liquid tank and the processing unit are connected by piping. The connected cleaning unit supplies the first cleaning liquid to the processing liquid tank of the processing liquid supply unit and then prepares the second cleaning liquid and supplies the prepared second cleaning liquid to the processing liquid tank when the pipe is cleaned. The processing liquid supply unit stores the first cleaning liquid supplied from the cleaning unit in the processing liquid tank and then distributes the first cleaning liquid in the processing liquid tank when the pipe is cleaned. The piping is cleaned by supplying the processing unit to the processing unit, the second cleaning solution supplied from the cleaning unit is stored in the processing solution tank, and then the second cleaning solution in the processing solution tank is supplied to the processing unit through the piping. The cleaning unit prepares the second cleaning liquid in parallel with the cleaning of the pipe with the first cleaning liquid.
In the substrate processing system, the processing liquid is stored in the processing liquid tank of the processing liquid supply unit when the substrate is processed. The processing liquid stored in the processing liquid tank is supplied to the substrate processing apparatus through the piping. In the substrate processing apparatus, the supplied processing liquid is supplied to the substrate by the processing unit, and the substrate is processed.
At the time of cleaning the pipe, the first cleaning liquid is supplied from the cleaning unit to the processing liquid tank of the processing liquid supply unit. In the processing liquid supply unit, after the first cleaning liquid supplied from the cleaning unit is stored in the processing liquid tank, the first cleaning liquid in the processing liquid tank is supplied to the processing unit through a pipe. Thereby, the piping is cleaned with the first cleaning liquid.
In the cleaning unit, after the first cleaning liquid is supplied to the processing liquid tank, the second cleaning liquid is prepared in parallel with the cleaning of the pipe with the first cleaning liquid. The prepared second cleaning liquid is supplied to the processing liquid tank of the processing liquid supply unit. In the processing liquid supply unit, after the second cleaning liquid supplied from the cleaning unit is stored in the processing liquid tank, the second cleaning liquid in the processing liquid tank is supplied to the processing unit through a pipe. Thereby, the piping is cleaned with the second cleaning liquid.
As described above, since the pipe cleaning with the first cleaning liquid and the preparation of the second cleaning liquid are performed in parallel, the time required for cleaning the pipe with the first cleaning liquid and the second cleaning liquid can be shortened. As a result, it is possible to shorten the cleaning time when the pipe is cleaned using a plurality of cleaning liquids.
(2) The substrate processing system further includes a supply path for supplying the first cleaning liquid and the second cleaning liquid from the cleaning unit to the processing liquid tank, and an open / close device that opens and closes the supply path. The supply path may be opened when the first cleaning liquid is supplied to the processing liquid tank, and the supply path may be closed after the first cleaning liquid is supplied to the processing liquid tank.
In this case, after supplying the first cleaning liquid, the cleaning unit and the processing liquid tank are separated from each other. Therefore, the preparation of the second cleaning liquid can be started in the cleaning unit immediately after the supply of the first cleaning liquid from the cleaning unit to the processing liquid tank. Thereby, it becomes possible to further reduce the cleaning time when the pipe is cleaned using a plurality of cleaning liquids.
(3) The substrate processing system may further include an inert gas supply unit that supplies an inert gas into the supply path and the cleaning unit after the piping is cleaned with the second cleaning liquid.
In this case, since the inert gas is sealed in the supply path and the processing unit after the piping is cleaned, contamination in the supply path and the cleaning unit due to intrusion of particles or the like is prevented.
(4) The processing liquid supply unit further includes a circulation path for circulating the first cleaning liquid in the processing liquid tank through the filter, and the cleaning unit prepares the second cleaning liquid in parallel with the circulation of the first cleaning liquid through the circulation path. May be.
In this case, particles mixed in the first cleaning liquid are removed by the filter. In addition, the second cleaning liquid is prepared in parallel with the circulation of the first cleaning liquid through the circulation path and the cleaning of the pipe with the first cleaning liquid. Therefore, even when the preparation of the second cleaning liquid requires a relatively long time, an increase in the time required for cleaning the pipe with the first cleaning liquid and the second cleaning liquid is suppressed.
(5) The cleaning unit may be provided so that it can be connected to and disconnected from the processing liquid supply unit.
In this case, the cleaning unit can be connected to the processing liquid supply unit when the pipe is cleaned, and the cleaning unit can be disconnected from the processing liquid supply unit after the pipe is cleaned. Therefore, by sequentially connecting the cleaning units to the plurality of processing liquid supply units, it is possible to sequentially clean the piping in the plurality of processing liquid supply units and the plurality of substrate processing apparatuses. Further, since the cleaning unit can be separated during the processing of the substrate, an increase in the size of the substrate processing system is suppressed.
(6) The processing liquid supply unit may include a plurality of processing liquid tanks, and the cleaning unit may be configured to be connectable to the plurality of processing liquid tanks.
In this case, a plurality of pipes connecting the plurality of processing liquid tanks and the substrate processing apparatus can be cleaned by a single cleaning unit.
(7) A pipe cleaning method according to the present embodiment is a pipe cleaning method for cleaning pipes in a substrate processing apparatus and a processing liquid supply unit, and the processing liquid supply unit performs processing of a processing liquid supply unit during processing of a substrate. The processing liquid is supplied from the liquid tank to the processing unit of the substrate processing apparatus through the pipe, and the pipe cleaning method supplies the first cleaning liquid from the cleaning unit to the processing liquid tank of the processing liquid supply unit when cleaning the pipe. A step of cleaning the piping by supplying the first cleaning liquid from the processing liquid tank to the processing unit of the substrate processing apparatus through the piping after supplying the first cleaning liquid to the processing liquid tank; and cleaning of the piping by the first cleaning liquid The step of preparing the second cleaning solution in the cleaning unit in parallel with the cleaning unit, and the processing from the cleaning unit after cleaning the pipe with the first cleaning solution And supplying the second cleaning liquid tank, after the supply of the second cleaning liquid into the processing liquid tank, it is intended to include a step of washing the pipe by supplying a second washing solution from the processing solution tank to the processing unit through the pipe.
In the pipe cleaning method, since the pipe cleaning with the first cleaning liquid and the preparation of the second cleaning liquid are performed in parallel, the cleaning time when shortening the time required for cleaning the pipe with the first cleaning liquid and the second cleaning liquid is reduced. Can be shortened. As a result, it is possible to shorten the cleaning time when the pipe is cleaned using a plurality of cleaning liquids.

DESCRIPTION OF SYMBOLS 1 Cleaning unit 2, 2a Processing liquid supply unit 3 Substrate processing apparatus 11 Cleaning liquid tank 12, 13 Weighing tank 14, 22, 14a, 22a Pump 15, 23, 15a, 23a Filter 16 Specific resistance meter 17, 24, 35 Control part 21 Processing liquid tank 31 Processing unit 32 Substrate holding part 33 Cup 34, 34a Nozzle 41, 42 Chemical liquid supply unit 43 Pure water supply source 100 Substrate processing system C1, C2 connection part P1-P17, P1a, P2a, P11a-P17a Piping V1- V14, V1a, V7a-V13a Valve W Substrate

Claims (11)

A substrate processing apparatus for processing the substrate;
A processing liquid supply unit for supplying a processing liquid to the substrate processing apparatus through a first pipe;
A cleaning unit that selectively supplies a cleaning liquid and a rinsing liquid to the processing liquid supply unit ;
The processing liquid supply unit includes a processing liquid tank that stores the processing liquid when the substrate processing apparatus processes the substrate,
The substrate processing apparatus includes a processing unit for processing the substrate by supplying the processing liquid to the substrate,
The processing liquid tank and the processing unit are connected by the first pipe,
The processing unit includes a substrate holding unit for holding a substrate, a cup surrounding the substrate holding unit, a nozzle connected to the first pipe, and a second pipe connected to a discharge port of the processing unit ,
A specific resistance meter is connected to the second pipe ,
A first step of feeding a cleaning solution, storing the previous Kiarai washing liquid in the processing liquid tank to said cleaning unit or we pre Symbol treatment liquid supply unit,
Directs Kiarai solution purification before being stored in the processing liquid tank to the first pipe, a second step of cleaning the first pipe in the cleaning solution,
A third step of supplying the rinsing liquid from the cleaning unit to the processing liquid tank of the processing liquid supply unit after completion of the second step;
The specific resistance value of the rinsing liquid discharged from the processing unit through the second pipe while the rinsing liquid supplied to the processing liquid tank by the third step is supplied to the nozzle through the first pipe. A fourth step of detecting with a resistivity meter;
The rinsing liquid fifth step and the board processing system that sequentially executing, stopping the supply of the detected specific resistance by the resistivity meter toward the nozzle from the processing liquid tank and a predetermined value. The second in parallel with step further executes a sixth step you prepare the rinsing liquid in the cleaning unit, the substrate processing system of claim 1, wherein. The washing unit is
A cleaning liquid tank capable of storing both the cleaning liquid and the rinse liquid;
A drain pipe connected to the cleaning liquid tank ,
The substrate processing system according to claim 1 , wherein the resistivity meter is interposed in the drain pipe . Wherein before starting the first step, performing the step of storing the cleaning liquid prior to Kiarai solution purification tank, the substrate processing system according to claim 3. Said replacement step of replacing at the rinse cleaning liquid, the third run before the start of the step, the substrate processing system of claim 4, wherein said washing liquid tank. The substrate processing system according to claim 5 , wherein the replacing step ends when the specific resistance meter reaches a predetermined value . Said washing Kiyoshiyu knit solution tank capable of storing a pre Kiarai purification liquid, and a reservoir capable of rinsing liquid tank said rinsing liquid,
In the first step, feeding the washing liquid to the processing liquid tank from the solution tank, a step of storing the pre Kiarai washing liquid in the processing liquid tank, a step of preparing the rinsing liquid in the rinsing liquid tank The substrate processing system according to claim 1, wherein the two are executed in parallel. The processing solution includes buffered hydrofluoric acid, dilute hydrofluoric acid, hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid or ammonia water, or a mixed solution thereof, a photoresist solution or a developer. Item 8. The substrate processing system according to any one of Items 1 to 7. The substrate processing system according to claim 1, wherein the cleaning liquid includes a mixed liquid of ammonia and hydrogen peroxide water or a mixed liquid of hydrochloric acid and hydrogen peroxide water. The said rinse liquid is a substrate processing system as described in any one of Claims 1-9 containing carbonated water, ozone water, magnetic water, reduced water or ionic water, or an organic solvent. A pipe cleaning method for cleaning a first pipe in a substrate processing apparatus and a processing liquid supply unit,
The treatment liquid tank and the treatment unit are connected by the first pipe,
The processing unit includes a substrate holding unit for holding a substrate, a cup surrounding the substrate holding unit, a nozzle connected to the first pipe, and a second pipe connected to a discharge port of the processing unit ,
A specific resistance meter is connected to the second pipe ,
The pipe cleaning method is:
Feeding a cleaning liquid to the cleaning unit or we pre Symbol treatment liquid supply unit, a first step of storing a pre Kiarai washing liquid in the processing liquid tank,
Directs Kiarai solution purification before being stored in the processing liquid tank to the first pipe, a second step of cleaning the first pipe in the cleaning solution,
A third step of supplying a rinsing liquid from the cleaning unit to the processing liquid tank of the processing liquid supply unit after completion of the second step;
The specific resistance value of the rinsing liquid discharged from the processing unit through the second pipe while the rinsing liquid supplied to the processing liquid tank by the third step is supplied to the nozzle through the first pipe. A fourth step of detecting with a resistivity meter;
A pipe cleaning method that sequentially executes a fifth step of stopping the supply of the rinse liquid from the processing liquid tank toward the nozzle when the specific resistance detected by the specific resistance meter reaches a predetermined value .

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