JP6340904B2 - Inverter device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an inverter device for various vehicles provided with a high-voltage DC power supply and a method for manufacturing the same.

In recent years, vehicles equipped with a high-voltage DC power source typified by a hybrid vehicle and a fuel cell vehicle are rapidly spreading.
A vehicle equipped with such a high-voltage DC power supply uses a high-voltage DC power supply having a voltage lower than the motor drive voltage mainly from the viewpoint of safety. A boost converter / inverter circuit system is mainly employed in which the output voltage of the high-voltage DC power source is boosted by a boost converter (up converter) and applied to an inverter for driving a motor.

  Such a boost converter / inverter circuit is configured by connecting a boost converter that boosts the voltage of a high-voltage DC power supply and an inverter that applies this boost DC voltage to an AC rotating electrical machine as an AC voltage (for example, a patent) Reference 1).

  In a boost converter / inverter circuit, a smoothing capacitor for a converter is connected between a pair of input terminals of the boost converter, and a smoothing capacitor for an inverter is connected between a pair of input terminals of the inverter. These smoothing capacitors are capacitors for reducing pulsating current (ripple) in the DC waveform generated by AC / DC conversion, and the smoothing capacitor for the converter is close to the switching element of the boost converter to reduce the switching surge voltage, Further, the smoothing capacitor for the inverter is arranged in the vicinity of the switching element of the inverter.

  In the boost converter / inverter circuit, a discharge resistance element is connected in parallel with the smoothing capacitor for the inverter. The discharge resistance element is a normal discharge resistance element that discharges between a pair of input terminals of the inverter when the motor is stopped (hereinafter referred to as a normal discharge resistance element), and when an abnormality such as a collision occurs in the vehicle. In order to ensure safety, an emergency discharge resistance element (hereinafter referred to as a short-time discharge resistance element) that discharges between a pair of input terminals of the inverter in a short time is connected in parallel.

The short-time discharge resistor element is a smoothing capacitor for the converter when the power cable from the high-voltage DC power supply to the boost converter / inverter circuit is cut off due to the power cable between the high-voltage DC power supply and the boost converter being disconnected. The smoothing capacitor for the inverter is discharged in a short time (for example, within several minutes) to improve electrical safety. That is, the short-time discharge resistance element directly discharges the smoothing capacitor for the inverter and discharges the smoothing capacitor for the converter through a diode built in the boost converter.
For this purpose, for example, a switch element that is opened and closed by a signal from a sensor that detects a collision impact of a vehicle may be connected in series to the short-time discharge resistance element.

JP 2005-253276 A

  Conventionally, a cement resistor having a relatively large installation space has been used as a normal discharge resistance element or a short-time discharge resistance element incorporated in an inverter, and is arranged separately for heat dissipation. For this reason, the installation space for the inverter device is increased, and space saving is difficult.

  The present invention has been made in view of the above-described circumstances, and enables an inverter device provided with a discharge resistance element to save space, and can reliably cool the discharge resistor, and its An object is to provide a manufacturing method.

In order to solve the above problems, an inverter device according to the present invention includes a heat dissipation member made of Al, a discharge resistor including a resistor formed on one surface side of a first ceramic member, and one surface side of a second ceramic member. An insulating circuit board having a circuit layer formed thereon, wherein the discharge resistor and the insulating circuit board are respectively joined to one surface side of the heat dissipation member by a brazing material, and the discharge resistance The body is characterized in that a normal discharge resistor and a short-time discharge resistor are disposed on one surface side of the heat radiating member .

According to the inverter device of the present invention, the insulating circuit board constituting the inverter circuit and the discharge resistance element are directly joined to one surface side of one heat radiating member via the brazing material. As a result, it is possible to efficiently dissipate heat generated in these insulating circuit boards and discharge resistors by one heat dissipating member. Compared with the case where a heat dissipating member is provided for each individual insulating circuit board or discharge resistor, a simple configuration can be achieved, and a low-cost inverter device can be realized. In addition, the inverter device can be reduced in size and weight.
In addition, by directly bonding the discharge resistance element to the one surface side of the heat radiating member via a brazing material, for example, the discharge resistance element with a rapid temperature rise during a short discharge operation can be reliably cooled, and the heat of the discharge resistance element can be reduced. Breakage can be prevented.
Furthermore, by providing a normal discharge resistor and a short-time discharge resistor as the discharge resistors, for example, an inverter circuit, a normal discharge resistor, and a short-time discharge resistor, which are optimal for on-vehicle use of an electric vehicle, are combined into one. A space-saving inverter device mounted on the heat dissipation member can be realized.

In the present invention, at least one of the discharge resistor and the insulated circuit board may be disposed on one side of the heat radiating member.
By disposing at least one of the plurality of discharge resistors and the insulated circuit board on one heat radiating member, the plurality of discharge resistors and the insulated circuit board are efficiently cooled together by one heat radiating member. can do.

In the present invention, a power element may be mounted on the circuit layer of the insulating circuit board.
By forming the power element on the insulating circuit board, an arbitrary electric circuit can be configured according to the type of the power element. For example, an inverter circuit can be formed by this power element.

In the present invention, the insulated circuit board may include a buffer layer on the other surface side of the second ceramic member.
By forming a buffer layer on the other surface side of the second ceramic member, it is possible to absorb the thermal stress caused by the difference in thermal expansion coefficient between the heat dissipation member and the second ceramic member, and to damage the second ceramic member. Can be prevented.

In the present invention, the discharge resistor may include a buffer layer on the other surface side of the first ceramic member.
By forming a buffer layer on the other surface side of the first ceramic member, it is possible to absorb the thermal stress caused by the difference in thermal expansion coefficient between the heat radiating member and the first ceramic member, and to damage the first ceramic member. Can be prevented.

In this invention, the refrigerant | coolant distribution | circulation member which cools the said heat radiating member may be formed in the other surface side of the said heat radiating member.
By further providing a refrigerant flow member on the other surface side of the heat dissipation member and allowing the refrigerant to flow, it is possible to more efficiently dissipate heat from the heat dissipation member and further increase the cooling capacity of the inverter device.

  The method for manufacturing an inverter device according to the present invention is a method for manufacturing the inverter device, wherein the discharge resistor and the insulating circuit substrate are collectively bonded to one surface side of the heat radiating member.

  According to the method for manufacturing an inverter device of the present invention, a discharge resistor and an insulating circuit board are collectively bonded to one surface side of a heat dissipation member, for example, an inverter device having a plurality of discharge resistors and an insulating circuit board. The joining process can be greatly simplified as compared with the case where the discharge resistor and the insulated circuit board are joined individually. Therefore, it becomes possible to manufacture an inverter device at low cost. Further, if a plurality of discharge resistors and an insulating circuit board are bonded to one insulating circuit board, it is possible to achieve a reduction in size and weight of the inverter device.

The upper surface of the discharge resistor and the upper surface of the insulated circuit board may be located on the same plane when the discharge resistor and the insulated circuit board are joined.
Thus, for example, using a pressurizing jig with a flat pressing surface in contact with the discharge resistor and the insulating circuit board, a load is applied to the discharge resistor and the insulating circuit board with a uniform pressure, and these discharge resistors Each structural member can be joined without generating a strain stress between the body and the insulating circuit board.

  ADVANTAGE OF THE INVENTION According to this invention, the mounting of the discharge resistor incorporated in an inverter apparatus can be simplified, and the inverter apparatus which can be cooled reliably at the time of electricity supply to a discharge resistor, and its manufacturing method can be provided.

It is a top view of the inverter apparatus of this invention. It is sectional drawing of the inverter apparatus of this invention. It is explanatory drawing which shows the electrical constitution of the inverter apparatus of this invention. It is sectional drawing which shows another embodiment of the refrigerant | coolant distribution | circulation member in the inverter apparatus of this invention. It is sectional drawing which shows the manufacturing method of the inverter apparatus of this invention. It is sectional drawing which shows the manufacturing method of the inverter apparatus of this invention. It is sectional drawing which shows another embodiment of the manufacturing method of the inverter apparatus of this invention.

  Hereinafter, an inverter device of the present invention will be described with reference to the drawings. Each embodiment described below is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there is a case where a main part is shown in an enlarged manner for convenience, and the dimensional ratio of each component is the same as the actual one. Not necessarily.

(Inverter device)
The inverter device of the present invention will be described with reference to FIGS.
1 is a plan view of the inverter device as viewed from above, FIG. 2 (a) is a cross-sectional view taken along the line AA in the inverter device of FIG. 1, and FIG. 2 (b) is the inverter device of FIG. It is sectional drawing along the BB line. FIG. 3 is an explanatory diagram showing an electrical configuration of the inverter device.

  The inverter device 10 includes a heat radiating member 11 made of Al, two types of discharge resistors 21, 22 having different discharge characteristics, a plurality of power modules 31, 31, and a refrigerant flow member for cooling the heat radiating member 11. 41. In addition, the heat radiating member 11 and the refrigerant | coolant distribution | circulation member 41 may be a member formed integrally.

  The heat dissipation member 11 is made of Al or an Al alloy containing Al. For example, A1000 series Al alloy, A3000 series Al alloy, A6000 series Al alloy, etc. can be used. In this embodiment, an A1000 series Al alloy (A1050) is used.

  The discharge resistor 21 includes a first ceramic member 23a, a resistor 24a formed on one surface of the first ceramic member 23a, and electrodes 25a and 25a of the resistor 24a. In addition, connection terminals 27a and 27a are connected to the electrodes 25a and 25a via, for example, solder layers 26a and 26a.

  The discharge resistor 21 is joined to the one surface 11 a side of the heat dissipation member 11. That is, the first ceramic member 23a constituting the discharge resistor 21 and the one surface 11a of the heat radiating member 11 are joined by a brazing material, for example, an Al—Si based brazing material.

  The discharge resistor 22 includes, for example, a first ceramic member 23b, a resistor 24b formed on one surface of the first ceramic member 23b, and electrodes 25b and 25b of the resistor 24b. In addition, connection terminals 27b and 27b are connected to the respective electrodes 25b and 25b through solder layers 26b and 26b, for example.

  The discharge resistor 22 is joined to the one surface 11 a side of the heat dissipation member 11. That is, the first ceramic member 23b constituting the discharge resistor 21 and the one surface 11a of the heat radiating member 11 are joined by a brazing material, for example, an Al—Cu brazing material.

The first ceramic members 23a and 23b are made of ceramics such as Si ₃ N ₄ (silicon nitride), AlN (aluminum nitride), and Al ₂ O ₃ (alumina), which are excellent in insulation and heat dissipation, for example. In the present embodiment, the first ceramic members 23a and 23b are made of Al ₂ O ₃ (alumina). The thickness of the first ceramic members 23a and 23b is set, for example, within a range of 0.2 to 1.5 mm, and is set to 0.635 mm in the present embodiment.

The resistors 24a and 24b are for functioning as electric resistance when current flows through the discharge resistors 21 and 22. As an example of the constituent material, Ta-Si thin film resistors and RuO ₂ thick film resistors are used. The body is mentioned. In the present embodiment, the resistor 12 is composed of a Ta—Si-based thin film resistor and has a thickness of, for example, 0.5 μm.

  The electrodes 25a and 25b are electrical connection portions for applying voltages to the resistors 24a and 24b, respectively, and are made of a conductor such as Cu, Cu alloy, Al, Ag, silver-palladium alloy, or the like. ing. In this embodiment, it is composed of a silver-palladium alloy. For example, the thickness is 0.5 μm

  The connection terminals 27a and 27b are lead terminals connected to the electrodes 25a and 25b, and are made of a conductor, for example, Cu or Cu alloy. In this embodiment, it is made of Cu. The thickness of the connection terminals 27a and 27b is, for example, not less than 2 μm and not more than 3 μm. In the present embodiment, the thickness is 1.6 μm. Note that, as the connection terminals 27a and 27b, various metals having a high conductivity such as Al and Ag can be adopted in addition to Cu.

  The solder layers 26a and 26b electrically connect the electrodes 25a and 25b of the discharge resistors 21 and 22 and the connection terminals 27a and 27b to each other. Examples of the solder constituting the solder layers 26a and 26b include Sn-Ag, Sn-In, or Sn-Ag-Cu solder.

  It is also preferable that a buffer layer is further formed between the discharge resistors 21 and 22 and the heat radiating member 11. Such a buffer layer is comprised from the plate-shaped member which consists of high purity Al whose purity is 99.98 mass% or more, for example. The thickness of this buffer layer should just be 0.4 mm or more and 2.5 mm or less, for example. By further forming such a buffer layer between the discharge resistors 21 and 22 and the heat radiating member 11, it is possible to absorb the thermal stress caused by the difference in thermal expansion coefficient between the heat radiating member 11 and the first ceramic member 23a. The damage of the first ceramic member 23a can be prevented.

  Further, by forming the buffer layer with high purity Al having a purity of 99.98 mass% or more, the deformation resistance is reduced, and the thermal stress generated in the first ceramic members 23a and 23b when the cooling / heating cycle is loaded is applied to the buffer layer. It can be absorbed by the layer, and it is possible to suppress the occurrence of cracks due to thermal stress applied to the first ceramic members 23a and 23b.

  The power module 31 includes an insulating circuit board 35 including a second ceramic member 32 and metal members 33 and 34 formed on one surface side and the other surface side of the second ceramic member 32, respectively. The power element 36 is mounted on the metal member 33. The metal member (circuit layer) 33 formed on one surface side of the second ceramic member 32 constitutes a circuit layer of the inverter circuit. In addition, a connection terminal 37 is connected to the power element 36.

The second ceramic member 32 is made of, for example, ceramics such as Si ₃ N ₄ (silicon nitride), AlN (aluminum nitride), and Al ₂ O ₃ (alumina) that are excellent in insulation and heat dissipation. In the present embodiment, the second ceramic member 32 is made of AlN (aluminum nitride) that is particularly excellent in heat dissipation. Moreover, the thickness of the 2nd ceramic member 32 is set, for example in the range of 0.2-1.5 mm, and is set to 0.635 mm in this embodiment.

  The metal members 33 and 34 are made of a metal having excellent conductivity and thermal conductivity, such as Al and Cu. In the present embodiment, Al (so-called 4N—Al) having a purity of 99.99 mass% or more is used as the metal members 33 and 34. Moreover, the thickness of the metal members 33 and 34 is 0.1 mm-5.0 mm, and is 0.4 mm in this embodiment.

The metal member (circuit layer) 33 and the second ceramic member 32, and the metal member 34 and the second ceramic member 32 are each directly joined using a brazing material. Examples of the brazing material include an Al—Cu based brazing material and an Al—Si based brazing material. In this embodiment, an Al—Si brazing material is used.
Similarly, the metal member 34 and the one surface 11a side of the heat radiating member 11 are also directly joined by a brazing material, for example, an Al—Si brazing material.

The power element 36 is a power electronic component that constitutes an inverter circuit, such as a resistor, a thyristor, or a transistor. Such a power element 36 is connected to a metal member (circuit layer) 33 via a solder layer 38.
Examples of the solder constituting the solder layer 38 include Sn-Ag, Sn-In, or Sn-Ag-Cu solder.

  The connection terminal 37 is a lead terminal connected to one electrode of the power element 36, and is made of a conductor, for example, Cu or Cu alloy. In this embodiment, it is made of Cu. The thickness of the connection terminal 37 is, for example, 2 μm or more and 3 μm or less, and is 1.6 μm in the present embodiment. In addition to Cu, for example, various metals having high conductivity such as Al and Ag can be used as the connection terminal 37.

  It is also preferable that a buffer layer is further formed between the metal member 34 on the other surface side of the insulated circuit board 35 constituting the power module 31 and the heat radiating member 11. Such a buffer layer is comprised from the thin plate-shaped member which consists of high purity Al whose purity is 99.98 mass% or more, for example. The thickness of this buffer layer should just be 0.4 mm or more and 2.5 mm or less, for example. By further forming such a buffer layer between the metal member 34 and the heat radiating member 11, it is possible to absorb the thermal stress caused by the difference in thermal expansion coefficient between the heat radiating member 11 and the second ceramic member 32. Damage to the ceramic member 32 can be prevented.

  Further, by forming the buffer layer with high purity Al having a purity of 99.98 mass% or more, the deformation resistance is reduced, and the thermal stress generated in the second ceramic member 32 when the cooling / heating cycle is loaded is caused by the buffer layer. It can absorb, and it can control that a thermal stress is added to the 2nd ceramic member 32, and a crack occurs.

  The refrigerant circulation member 41 is formed on the other surface 11 b side of the heat dissipation member 11. The refrigerant circulation member 41 is, for example, a member provided with a flow path 41 a for circulating a refrigerant for cooling the heat dissipation member 11. Examples of the refrigerant that cools the heat radiating member 11 include water, air, and organic gas. In the present embodiment, a so-called water-cooling method is used in which water is used as the coolant that circulates the flow path 41a.

  Such a refrigerant circulation member 41 is made of the same material as the heat radiating member 11, for example, Al. It is also preferable that the refrigerant flow member 41 is formed integrally with the heat dissipation member 11. In this embodiment, the heat radiating member 11 and the refrigerant | coolant distribution | circulation member 41 are formed with the integral Al member.

  As another embodiment of the refrigerant circulation member, for example, as shown in FIG. 4, air is used as the refrigerant, and a large number of fins 45, 45,. The provided refrigerant circulation member 46 may be formed on the other surface 11b side of the heat radiating member 11.

  As shown in FIG. 1, the inverter device 10 according to the present embodiment includes six power modules 31, 31..., And a discharge resistor 21 and a discharge resistor 22 having different characteristics. An array is mounted on 11a.

  These six power modules 31, 31..., And the discharge resistor 21 and the discharge resistor 22 are collectively put together by one heat radiating member 11 and a refrigerant flow member 41 (see FIG. 2) that cools this. Cooled.

  The inverter device 10 of this embodiment is incorporated in, for example, a drive system of an electric vehicle, and one connection side is connected to a high-voltage DC power source 3 via a boost converter (up-converter) circuit 2 as shown in FIG. Yes. One connection side is connected to the motor 4.

  The high-voltage DC power source 3 is a battery that can supply a high-voltage DC current, such as a fuel cell or a lithium ion battery. The boost converter circuit 2 boosts the voltage of the high-voltage DC power supply 3 to a voltage capable of driving the motor 4, for example, about 600V. The inverter device 10 is between the step-up converter circuit 2 and the motor 4 and performs so-called AC / DC conversion that converts a high-voltage DC current into an AC current.

The inverter device 10 includes an inverter circuit 15 including power modules 31, 31... (See FIGS. 1 and 2). The discharge resistor 21 normally constitutes the discharge resistor element 16, and the discharge resistor 22 constitutes the short-time discharge resistor element 17.
Further, the inverter device 10 includes a smoothing capacitor 18 between a pair of input terminals. The smoothing capacitor 18 reduces pulsating current (ripple) in a DC waveform caused by AC / DC conversion.

  The normal discharge resistance element 16 (discharge resistance body 21) discharges between the pair of input terminals of the inverter device 10 when the operation of the motor 4 is stopped.

  On the other hand, the short-time discharge resistance element 17 (discharge resistor 22) discharges between the pair of input terminals of the inverter device 10 in a short time to ensure safety when an abnormality such as a collision occurs in the electric vehicle. To ensure electrical safety. The short-time discharge resistance element 17 directly discharges the smoothing capacitor 18 when energized, and discharges the smoothing capacitor 19 of the boost converter device 2 through a diode built in the boost converter circuit 2.

  For this purpose, for example, a switch element 52 that is opened and closed by a signal from a collision sensor 51 that detects a collision impact of a vehicle is connected in series to the short-time discharge resistance element 17. When the switch element 52 is closed, the discharge resistance element 17 is energized for a short time.

  As described above, the inverter device 10 of the present invention includes the plurality of power modules 31, 31... Constituting the inverter circuit 15, the normal discharge resistance element 16 (discharge resistor 21), and the short-time discharge resistance element 17 (discharge resistance). The body 22) was directly joined to one surface 11a of one heat radiating member 11 via a brazing material. This makes it possible to efficiently dissipate heat generated during the operation of the power modules 31, 31..., The discharge resistor 21 and the discharge resistor 22 by the single heat radiating member 11. Compared with the case where a heat radiating member is provided for each individual element, a simple configuration can be achieved, and the low-cost inverter device 10 can be realized. Further, the inverter device 10 can be reduced in size and weight.

Moreover, the normal discharge resistance element 16 (discharge resistor 21) is directly bonded to the one surface 11a of the heat radiating member 11 via the brazing material, so that the normal discharge resistance element 16 (discharge resistor 21) is reliably cooled. The temperature rise during the discharge operation can be prevented, and the thermal damage of the normal discharge resistance element 16 (discharge resistor 21) can be prevented.
Further, the short-time discharge resistance element 17 (discharge resistor 22) is directly bonded to the one surface 11a of the heat radiating member 11 via the brazing material, so that even if a rapid temperature rise occurs in an emergency, the short-time discharge resistance The element 17 (discharge resistor 22) can be reliably cooled to prevent thermal damage to the discharge resistor element 17 (discharge resistor 22) for a short time.

As mentioned above, although embodiment of the inverter apparatus of this invention was described, this invention is not limited to this, It can change suitably in the range which does not deviate from the technical idea of the invention.
For example, in the above-described embodiment, the normal discharge resistance element applied to the electric vehicle and the short-time discharge resistance element are exemplified as the discharge resistor, but other than this, for example, a plurality of discharge resistors having the same electrical characteristics are provided. The structure etc. which arrange | position, or arrange | position the discharge resistor from which three or more types of electrical characteristics differ may be sufficient.

  Moreover, in the said embodiment, although it has the structure which has arrange | positioned the normal discharge resistance element and the short time discharge resistance element in parallel, one discharge which integrated these normal discharge resistance elements and the short time discharge resistance elements. The resistor element may be formed on the heat dissipating member.

  Depending on the discharge conditions, the short-time discharge resistance element may generate less heat, and in such a case, there is no limitation on the arrangement of the short-time discharge resistance element as long as it is on the heat dissipation member. For example, it is also possible to arrange the discharge resistance element for a short time at a location where the cooling efficiency is poor, such as an end portion of the heat radiating member or a portion other than directly above the flow path. In the case of air cooling, a structure without fins may be provided directly under the short-time discharge resistance element.

  Moreover, in the said embodiment, although the inverter circuit is comprised by power module 31,31 ..., power module 31,31 ... is an electronic component other than this, for example, it is a capacitor | condenser other than comprising an inverter circuit. An electronic component may be included.

(Inverter device manufacturing method)
A method for manufacturing an inverter device according to the present invention will be described with reference to FIGS.
5 and 6 are cross-sectional views showing the method of manufacturing the inverter device of the present invention step by step. In the present embodiment, in order to simplify the description, an example in which a discharge resistance element and a power module are formed adjacent to each other as shown in FIGS. 5 and 6 is shown.

First, as shown in FIG. 5A, the buffer layer 61 and the first ceramic member 23 constituting the discharge resistor 21 are sequentially mounted on the one surface 11a of the heat radiating member 11 integrally formed with the refrigerant flow member 41. Put. For example, Al ₂ O ₃ is used for the first ceramic member 23. The buffer layer 61 is made of, for example, a thin plate member made of high-purity Al having a purity of 99.98 mass% or more.

  The first ceramic member 23 is previously formed with a resistor 24 and an electrode 25 by printing and firing. Further, brazing material foils 62 and 62 made of Al—Si are disposed between the heat dissipation member 11 and the buffer layer 61 and between the buffer layer 61 and the first ceramic member 23, respectively.

  Further, the metal member 34, the second ceramic member 32, and the metal member 33 that constitute the insulating circuit substrate 35 are placed in this order on the one surface 11 a of the heat radiating member 11. For example, AlN is used for the second ceramic member 32. For the metal members 33 and 34, for example, Al (so-called 4N-Al) having a purity of 99.99 mass% or more is used.

Also, a brazing material foil made of Al-Si between the heat dissipation member 11 and the metal member 34, between the metal member 34 and the second ceramic member 32, and between the second ceramic member 32 and the metal member 33, respectively. 62, 62... Are arranged.
An insulating circuit board 35 in which the metal members 33 and 34 are bonded to one surface and the other surface of the second ceramic member 32 in advance by a brazing material is placed on the one surface 11a of the heat radiating member 11 via the brazing material foil 62. It may be a method of placing.

Next, as shown in FIG. 5B, these laminates S are sandwiched between two pressing jigs 71 and 72. The pressurizing jigs 71 and 72 are made of, for example, carbon, and the pressurizing surfaces 71a and 71b facing each other form a flat surface. Then, for example, a load is applied by a spring or the like from the pressing jig 71 side. Load to be applied, for ^example, the range of 1kgf / cm ² ~5kgf / cm 2 is suitable.

When applying a load using such pressurizing jigs 71 and 72, the upper surface of the discharge resistor 21, that is, the surface of the resistor 24 or the surface of the electrode 25, and the upper surface of the insulated circuit board 35, that is, the metal member 33. It is preferable to set the thicknesses of the respective members so that the surface of each member is located on the same plane.
Thus, for example, a load is applied to the discharge resistor 21 and the insulating circuit board 35 with a uniform pressure using the pressing jig 72 having a flat pressing surface 72a in contact with the discharge resistor 21 and the insulating circuit board 35. Can be applied.

  Then, as shown in FIG. 6A, the laminate S1 sandwiched between the two pressing jigs 71 and 72 and applied with a load is introduced into, for example, a vacuum heating furnace H, and the brazing material foil 62, Heating to the melting temperature of 62 (see FIG. 5A). For example, the laminate S is heated to about 610 ° C. The heating temperature at this time is set to a temperature lower than the firing temperature when the resistor 24 is printed and fired on the first ceramic member 23. Thereby, when the laminate S is heated, problems such as peeling of the resistor 24 from the first ceramic member 23 are prevented.

By such heat treatment, the brazing material foils 62, 62... Are melted, and Al − between the heat dissipation member 11 and the buffer layer 61 of the first ceramic member 23 and between the buffer layer 61 and the first ceramic member 23, respectively. Joined by Si brazing material. Also, the Al—Si brazing material joins between the heat dissipation member 11 and the metal member 34, between the metal member 34 and the second ceramic member 32, and between the second ceramic member 32 and the metal member 33. Is done.
Thereby, the discharge resistor 21 and the insulated circuit board 35 are formed on the one surface 11a of the heat radiating member 11 in which the refrigerant circulation member 41 is integrally formed.

  Thereafter, as shown in FIG. 6B, the power element 36 is joined to the metal member 33 constituting the circuit layer via the solder layer 38. As the solder constituting the solder layer 38, for example, Sn—Ag, Sn—In, or Sn—Ag—Cu solder is preferably used. Further, the connection terminal 37 is joined to the power element 36. The connection terminal 37 is made of, for example, Cu or a Cu alloy.

  On the other hand, the connection terminal 27 is connected to the electrode 25 of the resistor 24 via the solder layer 26. The connection terminal 27 is made of a conductor, for example, Cu or Cu alloy. As the solder constituting the solder layer 26, it is preferable to use, for example, Sn—Ag, Sn—In, or Sn—Ag—Cu solder.

Bonding temperature when the power element 36 is bonded to the metal member 33 via the solder layer 38 and bonding temperature when the connection terminal 27 is connected to the electrode 25 of the resistor 24 via the solder layer 26. Is set to a temperature lower than the firing temperature at which the resistor 24 is printed and fired on the first ceramic member 23 and the joining temperature at which the laminate S is heated and the members are joined by the Al—Si brazing material. To do. That is, it is preferable to set it as the range of 200 to 400 degreeC.
Thereby, when the power element 36 and the connection terminal 27 are joined, problems such as peeling of the printed and fired resistor 24 and each member joined by the Al—Si brazing material are prevented.

  The inverter device 10 of the present invention is manufactured through the above steps. The manufactured inverter device 10 is incorporated, for example, between a step-up converter (upconverter) 2 and a motor 4 of a drive system of an electric vehicle shown in the figure, and can be used for AC / DC conversion.

In the above-described method for manufacturing an inverter device, it is also preferable to further form a buffer layer on the power element.
In the method for manufacturing the inverter device shown in FIG. 7, a buffer layer 63 is further formed between the metal member 34 formed on the other surface side of the second ceramic member 32 and the one surface 11 a of the heat radiating member 11. For the buffer layer 63, for example, a thin plate member made of high purity Al having a purity of 99.98 mass% or more is used. The buffer layer 63 and the one surface 11a of the heat dissipation member 11, and the buffer layer 63 and the metal member 34 are joined together by a brazing material made of Al-Si.

  Moreover, in the said embodiment, between the heat radiating member 11 and the buffer layer 61 of the 1st ceramic member 23, between the buffer layer 61 and the 1st ceramic member 23, between the heat radiating member 11 and the metal member 34, a metal member 34 and the second ceramic member 32 and the second ceramic member 32 and the metal member 33 are brazed at the same time, but not limited to this, the discharge resistor 21 (discharge resistor 22) and the insulated circuit board 35 It is also possible to separately manufacture and braze them to the heat dissipation member 11 at the same time.

When such a laminate S2 is pressed, when the height on the upper surface side is not uniform, for example, when the height of the discharge resistor 21 is lower than the height of the insulating circuit board 35, the pressurization for sandwiching the laminate S2 is performed. Of the jigs 71 and 73, a step is formed on the pressing surface 73a of the pressing jig 73 in contact with the upper surface side.
For example, the portion of the pressing surface 73a that contacts the discharge resistor 21 protrudes more than the portion that contacts the insulating circuit substrate 35, thereby pressing the discharge resistor 21 and the insulating circuit substrate 35 with a uniform applied pressure. Can do.

  The protruding amount of the protruding portion of the pressing surface 73 a of the pressing jig 73 may be the same as the difference in height between the discharge resistor 21 and the insulating circuit board 35. In addition, a height adjusting member having a thickness corresponding to the protruding portion described above can be sandwiched by using a pressing jig 72 having a flat pressing surface 72a shown in FIG.

As mentioned above, although the manufacturing method of the inverter apparatus of this invention was demonstrated, this invention is not limited to this, In the range which does not deviate from the technical idea of the invention, it can change suitably.
For example, in the above-described embodiment, the upper surface side of the discharge resistor 21 and the insulating circuit board 35 is collectively pressed by one pressing jig 72. However, the discharge resistor 21 and the insulating circuit board 35 are individually connected. It is also possible to pressurize according to each height with a pressurizing jig.

  Moreover, the junction temperature of each member at the time of manufacturing the inverter apparatus 10 mentioned above, and its height relationship are examples, and it depends on the material of each member which comprises the inverter apparatus 10, the material used for joining, such as a brazing material and solder. Are appropriately selected.

DESCRIPTION OF SYMBOLS 10 Inverter apparatus 11 Heat radiating member 21, 22 Discharge resistor 23a, 23b 1st ceramic member 24a, 24b Resistor 32 2nd ceramic member 33, 34 Metal member 36 Power element

Claims (8)

An inverter device comprising: a heat dissipating member made of Al; a discharge resistor including a resistor formed on one side of a first ceramic member; and an insulating circuit board having a circuit layer formed on one side of a second ceramic member. There,
The discharge resistor and the insulated circuit board are respectively joined to one surface side of the heat dissipation member by a brazing material ,
As the discharge resistor, an ordinary discharge resistor and a short-time discharge resistor are disposed on one surface side of the heat radiating member .   2. The inverter device according to claim 1, wherein a plurality of at least one of the discharge resistor and the insulated circuit board are disposed on one surface side of the heat radiating member.   The inverter device according to claim 1, wherein a power element is mounted on the circuit layer of the insulating circuit board.   The inverter device according to any one of claims 1 to 3, wherein the insulating circuit board includes a buffer layer on the other surface side of the second ceramic member.   5. The inverter device according to claim 1, wherein the discharge resistor includes a buffer layer on the other surface side of the first ceramic member. 6.   The inverter device according to any one of claims 1 to 5, wherein a refrigerant circulation member that cools the heat dissipation member is formed on the other surface side of the heat dissipation member. A method for manufacturing an inverter device according to any one of claims 1 to 6 ,
The method of manufacturing an inverter device, wherein the discharge resistor and the insulating circuit board are collectively bonded to one surface side of the heat dissipation member. 8. The manufacturing method of an inverter device according to claim 7 , wherein the upper surface of the discharge resistor and the upper surface of the insulated circuit board are located on the same plane when the discharge resistor and the insulated circuit board are joined. Method.

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