JP6328644B2 - 導電体の接続構造及び表示装置 - Google Patents
導電体の接続構造及び表示装置 Download PDFInfo
- Publication number
- JP6328644B2 JP6328644B2 JP2015536543A JP2015536543A JP6328644B2 JP 6328644 B2 JP6328644 B2 JP 6328644B2 JP 2015536543 A JP2015536543 A JP 2015536543A JP 2015536543 A JP2015536543 A JP 2015536543A JP 6328644 B2 JP6328644 B2 JP 6328644B2
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- JP
- Japan
- Prior art keywords
- conductor
- connection structure
- insulating film
- terminal
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 title claims description 98
- 239000010410 layer Substances 0.000 claims description 40
- 239000002245 particle Substances 0.000 claims description 35
- 239000011229 interlayer Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 9
- 239000012212 insulator Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
Description
なお、図2における一点鎖線は、層間絶縁膜のエッジの位置を表している。
4 切り欠き
11 支持体(第1の基板)
12 第1端子(第1導電体)
12a 電極
12b 導電層
21 支持体(第2の基板)
22 第2端子(第2導電体)
23 絶縁膜
32 導電粒子
33 層間絶縁膜
Claims (6)
- 第1の基板上に並置形成されている複数の第1導電体と、第2の基板上に絶縁体で被覆されて並置形成されている複数の第2導電体の前記絶縁体から延出させてある一端部とを、導電粒子を分散した異方性導電膜にて接続してある導電体の接続構造において、
前記第2導電体の一端部に対応した前記第1導電体の部分に切り欠きを形成してあり、前記切り欠きを形成してある位置は、前記第1導電体の層間絶縁膜のエッジ近傍であって、延設された前記第1導電体の前記層間絶縁膜のエッジと交差する部分であることを特徴とする導電体の接続構造。 - 前記切り欠きは、前記第1導電体における前記層間絶縁膜のエッジと交差する位置を中心として前記第1導電体の長手方向の所定長領域にわたって、前記第1導電体の幅方向両側に形成されている請求項1に記載の導電体の接続構造。
- 前記第1導電体及び前記第2導電体は電極を含むことを特徴とする請求項1または2に記載の導電体の接続構造。
- 前記第1導電体及び前記第2導電体は導電層を含むことを特徴とする請求項1または2に記載の導電体の接続構造。
- 前記第1導電体及び前記第2導電体の周囲に絶縁膜を設けてあることを特徴とする請求項1〜4のいずれかに記載の導電体の接続構造。
- 画像を表示する表示パネルと、該表示パネルの動作を制御する信号を伝送する伝送体と、前記表示パネル及び前記伝送体の間に設けられた請求項1〜5のいずれかに記載の導電体の接続構造とを備えることを特徴とする表示装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013187546 | 2013-09-10 | ||
JP2013187546 | 2013-09-10 | ||
PCT/JP2014/073216 WO2015037496A1 (ja) | 2013-09-10 | 2014-09-03 | 導電体の接続構造及び表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015037496A1 JPWO2015037496A1 (ja) | 2017-03-02 |
JP6328644B2 true JP6328644B2 (ja) | 2018-05-23 |
Family
ID=52665602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015536543A Expired - Fee Related JP6328644B2 (ja) | 2013-09-10 | 2014-09-03 | 導電体の接続構造及び表示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9814141B2 (ja) |
JP (1) | JP6328644B2 (ja) |
CN (1) | CN105531878B (ja) |
WO (1) | WO2015037496A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104678620A (zh) * | 2015-03-20 | 2015-06-03 | 合肥京东方光电科技有限公司 | 一种阵列基板及具有该阵列基板的显示装置 |
JP6834289B2 (ja) * | 2016-09-21 | 2021-02-24 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器 |
CN106842735B (zh) * | 2017-04-05 | 2019-10-25 | 深圳市华星光电半导体显示技术有限公司 | 用于邦定覆晶薄膜引脚的面板引脚结构及液晶显示装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6288393A (ja) | 1985-10-15 | 1987-04-22 | セイコーエプソン株式会社 | 回路基板のパタ−ン構造 |
JP2004184805A (ja) | 2002-12-05 | 2004-07-02 | Tohoku Pioneer Corp | 導電配線の接続構造 |
KR100559937B1 (ko) * | 2003-01-08 | 2006-03-13 | 엘에스전선 주식회사 | 미세회로의 접속방법 및 그에 의한 접속 구조체 |
US7038327B2 (en) * | 2003-11-11 | 2006-05-02 | Au Optronics Corp. | Anisotropic conductive film bonding pad |
JP5281762B2 (ja) | 2007-06-22 | 2013-09-04 | パナソニック株式会社 | 電極接合構造体 |
DE102010030063A1 (de) * | 2010-06-15 | 2011-12-15 | Robert Bosch Gmbh | Elektrische Verbindungsanordnung |
-
2014
- 2014-09-03 WO PCT/JP2014/073216 patent/WO2015037496A1/ja active Application Filing
- 2014-09-03 US US14/917,225 patent/US9814141B2/en active Active
- 2014-09-03 JP JP2015536543A patent/JP6328644B2/ja not_active Expired - Fee Related
- 2014-09-03 CN CN201480049791.5A patent/CN105531878B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN105531878A (zh) | 2016-04-27 |
JPWO2015037496A1 (ja) | 2017-03-02 |
WO2015037496A1 (ja) | 2015-03-19 |
CN105531878B (zh) | 2018-07-17 |
US9814141B2 (en) | 2017-11-07 |
US20160205779A1 (en) | 2016-07-14 |
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