JP6325536B2 - 透明スペーサによってledから離隔された蛍光体 - Google Patents
透明スペーサによってledから離隔された蛍光体 Download PDFInfo
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- JP6325536B2 JP6325536B2 JP2015519438A JP2015519438A JP6325536B2 JP 6325536 B2 JP6325536 B2 JP 6325536B2 JP 2015519438 A JP2015519438 A JP 2015519438A JP 2015519438 A JP2015519438 A JP 2015519438A JP 6325536 B2 JP6325536 B2 JP 6325536B2
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- led die
- phosphor
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- light
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 85
- 125000006850 spacer group Chemical group 0.000 title 1
- 239000011521 glass Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 31
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 18
- 239000012790 adhesive layer Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000605 extraction Methods 0.000 description 9
- 229910052594 sapphire Inorganic materials 0.000 description 7
- 239000010980 sapphire Substances 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
Claims (12)
- 蛍光体変換式の発光ダイオード(LED)構造体であって、
成長基板上に成長されたエピタキシャル半導体層を有するLEDダイであり、前記成長基板は除去されている、LEDダイと、
前記LEDダイの頂面に取り付けられた実質的に透明な層であり、250ミクロンより大きい厚さを有し、且つ頂面及び側壁を有する実質的に透明な層と、
前記実質的に透明な層の前記頂面及び前記側壁と直に接触する蛍光体層であり、当該蛍光体層によって前記実質的に透明な層内に放たれた一部の光が、前記実質的に透明な層の前記側壁から出て行くようにされている、蛍光体層と、
を有する構造体。 - 前記実質的に透明な層は、接着層を用いて前記LEDダイに取り付けられている、請求項1に記載の構造体。
- 前記接着層はシリコーンを有する、請求項2に記載の構造体。
- 前記実質的に透明な層は、前記LEDダイの上に取り付けられたガラス層を有する、請求項1に記載の構造体。
- 前記エピタキシャル半導体層の前記成長基板は、前記実質的に透明な層が前記LEDダイの上に取り付けられるのに先立って除去されている、請求項4に記載の構造体。
- 前記LEDダイを封止する、前記蛍光体層の上のレンズ、を更に有する請求項1に記載の構造体。
- 当該構造体は更に、前記LEDダイが上にマウントされたサブマウントを有し、前記サブマウントの頂面部分は、前記LEDダイ及び前記蛍光体層によって放出された下向きの光を反射するように反射性である、請求項1に記載の構造体。
- 前記LEDダイが上にマウントされた反射性のリードフレームアセンブリ、を更に有する請求項1に記載の構造体。
- 前記LEDダイは青色光を放出し、前記蛍光体の光が前記青色光と組み合わさって白色光を生成する、請求項1に記載の構造体。
- 前記実質的に透明な層と前記蛍光体層とが略同じ屈折率を有する、請求項1に記載の構造体。
- 前記LEDダイはフリップチップである、請求項1に記載の構造体。
- 前記実質的に透明な層は、蛍光体を含有する接着層を用いて前記LEDダイに取り付けられている、請求項1に記載の構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261668062P | 2012-07-05 | 2012-07-05 | |
US61/668,062 | 2012-07-05 | ||
PCT/IB2013/055207 WO2014006539A1 (en) | 2012-07-05 | 2013-06-25 | Phosphor separated from led by transparent spacer |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015522212A JP2015522212A (ja) | 2015-08-03 |
JP6325536B2 true JP6325536B2 (ja) | 2018-05-16 |
Family
ID=49223795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015519438A Active JP6325536B2 (ja) | 2012-07-05 | 2013-06-25 | 透明スペーサによってledから離隔された蛍光体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9391243B2 (ja) |
EP (1) | EP2870641B1 (ja) |
JP (1) | JP6325536B2 (ja) |
KR (1) | KR102183516B1 (ja) |
CN (1) | CN104396035B (ja) |
TW (1) | TWI590495B (ja) |
WO (1) | WO2014006539A1 (ja) |
Families Citing this family (11)
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US10439107B2 (en) * | 2013-02-05 | 2019-10-08 | Cree, Inc. | Chip with integrated phosphor |
DE102014101492A1 (de) * | 2014-02-06 | 2015-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
US9412724B2 (en) * | 2014-04-23 | 2016-08-09 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Chip-scale packaged LED device |
CN106605309B (zh) * | 2014-06-19 | 2022-10-18 | 英克伦股份有限公司 | Led灯、led灯的制造方法及led装置的密封方法 |
KR20160059706A (ko) * | 2014-11-19 | 2016-05-27 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 그 패키지를 포함하는 조명 장치 |
JP2016119454A (ja) * | 2014-12-17 | 2016-06-30 | 日東電工株式会社 | 蛍光体層被覆光半導体素子およびその製造方法 |
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DE102015121074A1 (de) * | 2015-12-03 | 2017-06-08 | Osram Opto Semiconductors Gmbh | Halbleiterbauteil mit lichtleiterschicht |
CN111883635B (zh) * | 2015-12-30 | 2023-06-30 | 晶元光电股份有限公司 | 发光装置以及其制造方法 |
JPWO2018066209A1 (ja) * | 2016-10-07 | 2019-07-25 | ソニー株式会社 | 発光装置、表示装置および照明装置 |
KR102391399B1 (ko) * | 2019-11-29 | 2022-04-27 | (주)애니캐스팅 | 색변환 기능을 갖는 마이크로 렌즈 어레이 및 이를 구비하는 마이크로 엘이디 디스플레이 모듈 |
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-
2013
- 2013-06-25 US US14/412,026 patent/US9391243B2/en active Active
- 2013-06-25 WO PCT/IB2013/055207 patent/WO2014006539A1/en active Application Filing
- 2013-06-25 KR KR1020157003019A patent/KR102183516B1/ko active IP Right Grant
- 2013-06-25 EP EP13765437.2A patent/EP2870641B1/en active Active
- 2013-06-25 CN CN201380035810.4A patent/CN104396035B/zh active Active
- 2013-06-25 JP JP2015519438A patent/JP6325536B2/ja active Active
- 2013-07-04 TW TW102124072A patent/TWI590495B/zh active
Also Published As
Publication number | Publication date |
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KR102183516B1 (ko) | 2020-11-27 |
KR20150036383A (ko) | 2015-04-07 |
US20150207041A1 (en) | 2015-07-23 |
TW201409767A (zh) | 2014-03-01 |
EP2870641B1 (en) | 2020-05-13 |
EP2870641A1 (en) | 2015-05-13 |
JP2015522212A (ja) | 2015-08-03 |
WO2014006539A1 (en) | 2014-01-09 |
CN104396035A (zh) | 2015-03-04 |
US9391243B2 (en) | 2016-07-12 |
TWI590495B (zh) | 2017-07-01 |
CN104396035B (zh) | 2019-11-05 |
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