JP6324602B2 - Method for producing conductive polymer conductor and method for producing substrate - Google Patents

Description

  The present invention relates to a conductive polymer conductor using a conductive polymer, a base material for forming the conductive polymer conductor, and a method for producing the same.

  In recent years, a conductive polymer fiber in which a conductive polymer such as PEDOT-PSS {poly (3.4-ethylenedioxythiophene) -poly (styrenesulfonic acid)} is attached to a substrate made of silk is known. (For example, refer to Patent Document 1). Since the conductive polymer fiber has conductivity, hydrophilicity, tensile strength, and water resistance, it can be used particularly as a material for a bioelectrode. However, since this conductive polymer fiber uses silk, which is a natural fiber, there is a problem that productivity is poor and price is high. Therefore, the use of a substrate other than silk has been studied.

JP2015-77414A

  However, when a base material other than silk is used, there is a problem that the conductivity becomes low, and the conductive polymer attached to the base material is peeled off when washed.

  The present invention has been made on the basis of such a problem, and can improve the conductivity, and can suppress the peeling of the conductive polymer, a conductive polymer conductor, a base material, and It aims at providing those manufacturing methods.

  The conductive polymer conductor of the present invention is obtained by attaching a conductive polymer to a base material, and the base material has a base member and a fixing layer containing sericin formed on the base member. Is.

  The base material of the present invention forms a conductive polymer conductor by attaching a conductive polymer, and has a base member and a fixing layer containing sericin formed on the base member. Is.

  The method for producing a conductive polymer conductor according to the present invention is a method for producing a conductive polymer conductor in which a conductive polymer is attached to a base material, wherein a fixing layer containing sericin is formed on a base member, It includes a base material forming step for forming the base material and a conductive polymer forming step for attaching the conductive polymer to the base material on which the fixing layer is formed on the base member.

  The base material manufacturing method of the present invention manufactures a base material that forms a conductive polymer conductor by attaching a conductive polymer, and forms a fixing layer containing sericin on a base member. It includes a base material forming step.

  According to the present invention, since the base member is formed by forming the fixing layer containing sericin on the base member, the adhesion between the base member and the conductive polymer is improved regardless of the material of the base member. The conductivity can be improved, and the peeling of the conductive polymer due to washing can be suppressed. Therefore, the range of selection for the material of the base member is widened, and the productivity can be improved at low cost.

  Moreover, when forming a base material, if it wash | cleans, after making sericin adhere to a base member, electroconductivity can be improved more. Furthermore, when the base material is formed, if the sericin aqueous solution containing sericin and added with urea is attached to the base member, the conductivity can be improved and the variation can be reduced. , Can improve reproducibility.

It is a figure showing schematic structure of the conductive polymer conductor which concerns on one embodiment of this invention. It is a flowchart showing the process of the manufacturing method of the conductive polymer conductor which concerns on one embodiment of this invention. It is a characteristic view which shows the resistance value of the conductive polymer conductor which concerns on Examples 1-1 to 1-3. It is a characteristic view showing the relationship between the density | concentration of the sericin aqueous solution in the sericin adhesion process, and the resistance value of a conductive polymer conductor. It is a characteristic view showing the relationship between the impregnation time to the sericin aqueous solution in a sericin adhesion process, and the resistance value of a conductive polymer conductor. It is a characteristic view showing the relationship between the temperature of the sericin aqueous solution in a sericin adhesion process, and the resistance value of a conductive polymer conductor. It is a characteristic view showing the relationship between the addition of urea to the sericin aqueous solution in the sericin adhesion step and the resistance value of the conductive polymer conductor. It is a characteristic view showing the relationship between the urea addition amount of the sericin aqueous solution in a sericin adhesion process, and the resistance value of a conductive polymer conductor.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a schematic configuration of a conductive polymer conductor 10 according to an embodiment of the present invention. The conductive polymer conductor 10 is obtained by attaching a conductive polymer 12 to a base material 11, and can be used as, for example, a conductive polymer electrode. Moreover, the base material 11 is used for formation of the conductive polymer conductor 10, and forms the conductive polymer conductor 10 by attaching the conductive polymer 12. Preferred examples of the conductive polymer 12 include poly 3,4-ethylenedioxythiophene (hereinafter referred to as PEDOT).

  The base material 11 has a base member 11A and a fixing layer 11B containing sericin formed on the base member 11A. By forming the fixing layer 11B containing sericin in this way, the adhesion between the base material 11 and the conductive polymer 12 can be improved regardless of the material of the base member 11A. It has become. As for the shape of the base material 11, a thread form, cloth shape, or a sheet form is mentioned preferably, for example. When the base material 11 is formed in a cloth or sheet shape, for example, the fixing layer 11B may be formed on the cloth-like or sheet-like base member 11A, and the fixing layer 11B is formed on the thread-like base member 11A. May be formed into a cloth shape or a sheet shape. 1A shows a schematic configuration when the base material 11 is in the form of a thread, and FIG. 1B shows a schematic configuration when the fixing layer 11B is formed on the cloth-like or sheet-like base member 11A. Yes.

  The material constituting the base member 11A may be any material, but fibers other than silk are preferred, those containing chemical fibers, and those containing synthetic fibers are preferred. More preferably, it is a chemical fiber, and among these, a synthetic fiber. This is because the price is low, the productivity is excellent, and the expansion and contraction is excellent. The fixing layer 11B is preferably configured by applying, for example, sericin. That is, the fixing layer 11B is preferably composed of sericin, and a part of the base member 11A may be impregnated. Sericin is a protein constituting silk.

  In the case where the fixing layer 11B is formed on the cloth-like or sheet-like base member 11A, for example, as shown in FIG. 1B, the fixing layer 11B is formed on both surfaces of the base member 11A. Alternatively, although not shown, it may be formed on one side. The conductive polymer 12 may be formed on one surface of the base material 11 as shown in FIG. 1B, for example, when the base material 11 is in the form of a cloth or a sheet, although not shown. It may be formed on both sides. Further, the conductive polymer 12 may be soaked into the base material 11.

  FIG. 2 shows the steps of a method for producing a conductive polymer conductor and a method for producing a substrate according to an embodiment of the present invention. First, the fixing layer 11B containing sericin is formed on the base member 11A to form the base material 11 (base material forming step: step S110). In the base material forming step (step S110), for example, it is preferable to attach sericin to the base member 11A (sericin attaching step: step S111) and then wash (cleaning step: step S112). As described above, the base member 11A may be any material, but fibers other than silk are preferred, and those containing chemical fibers, particularly those containing polyester synthetic fibers, are preferred.

  In the sericin adhesion step (step S111), for example, the base member 11A is impregnated in a sericin aqueous solution containing sericin, and the sericin aqueous solution is sprayed on the base member 11A with a sprayer (shower) or a dispenser. A sericin aqueous solution may be attached to the member 11A to attach sericin. The concentration of sericin in the sericin aqueous solution is preferably in the range of 0.01% to 0.2%. This is because the conductivity can be further improved within this range. Moreover, it is preferable that the temperature at the time of attaching sericin shall be in the range of 10 degreeC or more and 40 degrees C or less, for example. This is because the conductivity can be further improved within this range.

  Moreover, it is preferable to add urea to the sericin aqueous solution. Since sericin has an amino acid with a non-polar side chain, it is hardly soluble in polar solvents such as water and is in a partially soluble state, but is uniformly dispersed due to the hydrophobic effect on the solvent side. Difficult to hold. It is preferable to add urea to the aqueous sericin solution because the hydrophobic effect is weakened by urea, the uniformity of dispersion can be improved, conductivity can be improved, and reproducibility can be improved. The addition concentration of urea in the sericin aqueous solution is more than 0M, preferably 0.5M or less, and more preferably 0.4M or less. This is because increasing the amount of urea added decreases the conductivity.

  In the cleaning process (step S112), for example, treatment with an acid or alkali aqueous solution, hot water, soap solution, or the like is performed to remove impurities such as fat. Conducting this washing step is preferable because the conductivity can be further improved. The washing time is preferably 10 minutes or more, and more preferably 30 minutes or less. This is because if the cleaning time is too short, the conductivity cannot be sufficiently improved, and if the cleaning time is too long, the fixing layer 11B is reduced and the effect of improving the conductivity is reduced.

  In the base material forming step (step S110), for example, it is preferable to perform at least the sericin adhesion step (step S111) a plurality of times. This is because the conductivity can be further improved. The number of repetitions is preferably 2 to 5 times, for example. This is because even if the number of times is increased, the difference in the effect of improving the conductivity is small, and a sufficient effect can be obtained within this range. When the sericin attachment step (step S111) is performed a plurality of times, the sericin attachment step (step S111) and the cleaning step (step S112) may be alternately repeated, and the sericin attachment step (step S111). The cleaning process (step S112) may be performed after performing a plurality of times. Furthermore, after performing the sericin adhesion step (step S111) a plurality of times, the step of performing the cleaning step (step S112) may be repeated a plurality of times.

  After the base material 11 is formed, the conductive polymer 12 is adhered to the base material 11 on which the fixing layer 11B is formed on the base member 11A (conductive polymer forming step: step S120). In the conductive polymer formation step (step S120), first, for example, after the base material 11 is heated, or the base material 11 is heated, the raw material containing the monomer of the conductive polymer 12 in the base material 11 is used. A solution is applied (raw material application process: step S121).

  Next, after applying the raw material solution to the substrate 11, for example, an oxidizing agent that promotes polymerization of the monomer, a dopant for developing conductivity in the conductive polymer, and a thickening agent Is applied (manufacturing solution coating step: step S122). This manufacturing solution application step (step S122) may be performed after the raw material application step (step S121) is completed, but is performed in parallel before the raw material application step (step S121) is completed. Also good.

  Preferred examples of the oxidizing agent for the production solution include iron salts. As the dopant, for example, p-toluenesulfonic acid is preferably mentioned, and an iron salt of p-toluenesulfonic acid (hereinafter referred to as pTS) is preferably used because it can function as an oxidizing agent. . Other examples of the dopant include acetonitrile and trifluoroacetic acid. The thickener increases the viscosity of the production solution, thereby suppressing the spread when the production solution is applied, reducing the bleeding of the conductive polymer, and promoting the polymerization reaction of the monomer. belongs to. As the thickener, those that do not react with the polymerization reaction of the conductive polymer are preferable, and for example, glycerol, polyethylene glycol, gelatin, or polysaccharide is preferable. The production solution may also contain a solvent. Examples of the solvent include organic solvents such as butanol or ethanol.

  In the manufacturing solution coating step (step S122), the substrate 11 is preferably in a heated state. This is because when the production solution is applied, a chemical polymerization reaction is immediately caused to reduce bleeding. The temperature of the substrate 11 when applying the production solution, that is, the reaction temperature, for example, is preferably 50 ° C. or higher and 120 ° C. or lower, 50 ° C. or higher and 80 ° C. or lower, and further 55 ° C. or higher and 60 ° C. or lower. It is more preferable. If the temperature is lower than 50 ° C., the chemical polymerization reaction rate is slow, so that bleeding is likely to occur. If the temperature is higher than 120 ° C., the silk protein or polymer may be broken.

  After the manufacturing solution coating step (step S122), it is preferable to wash the substrate 11 after a predetermined reaction time, and to wash away and remove unreacted substances from the applied raw material solution and manufacturing solution ( Washing step: Step S123). This is to prevent the unreacted substance from reacting gradually and spreading blur. In the cleaning process, for example, the base material 11 may be put into a tank containing a cleaning liquid for cleaning, and the cleaning liquid is sprayed onto the base material 11 with a sprayer (shower) or a dispenser to perform cleaning. Also good. As the cleaning liquid, for example, a liquid containing at least one of ethanol and acetic acid is preferable.

  As described above, according to the present embodiment, since the base member 11 is formed by forming the fixing layer 11B containing sericin on the base member 11A, the base member 11 and the base member 11 are electrically conductive regardless of the material of the base member 11A. Adhesiveness with the conductive polymer 12 can be improved, conductivity can be improved, and peeling of the conductive polymer 12 due to washing can be suppressed. Therefore, the range of selection for the material of the base member 11A is widened, and the productivity can be improved at low cost.

  Further, when forming the base material 11, if sericin is attached to the base member 11 </ b> A and then washed, the conductivity can be further improved. Furthermore, when the base material 11 is formed, if the sericin aqueous solution containing sericin and added with urea is attached to the base member 11A, the conductivity can be improved and the variation can be reduced. And reproducibility can be improved.

(Examples 1-1 to 1-3)
As the base member 11A, a bleached cloth in Example 1-1, a cotton cloth in Example 1-2, and a polyester cloth in Example 1-3 were prepared, cut into a size of 40 mm × 50 mm, and 10 minutes at 80 ° C. Washed with water and dried. Next, the base member 11A was impregnated in a 0.05% aqueous sericin solution at 95 ° C. and held for 10 minutes (sericin adhesion step: step S111). Subsequently, the base member 11A to which sericin was adhered was washed with water at 95 ° C. for 10 minutes (cleaning step: step S112). Thereby, the base material 11 in which the fixing layer 11B containing sericin was formed on the base member 11A was obtained (base material forming step: step S110).

  Next, PEDOT monomer solution (Heraeus Clevios M-V2) as a raw material solution and pTS (Heraeus Clevios C-B40V2) as an oxidant and a dopant to ethylene glycol (Sigma Aldrich Japan Co., Ltd.). The production solution to which 25% by mass was added was mixed and stirred immediately before each 0.3 cc, sufficiently contained, and heated at 60 ° C. for 2 minutes. As the heating device, Rick Cook hot air oven FVX-M3A, IRIS OHYAMA was used. After that, it was impregnated with ethanol for 1 minute, dried and then washed with water at 80 ° C. for 10 minutes (washing step: step S123). Thereby, the conductive polymer conductor 10 was obtained (conductive polymer formation process: step S120).

  About the obtained conductive polymer conductor 10, the surface resistance between three points 8 mm apart was measured. As the measuring device, Loresta-AX MCP-T370 manufactured by Mitsubishi Chemical Analytech was used. FIG. 3 shows the results obtained.

  As Comparative Examples 1-1 to 1-3 with respect to Examples 1-1 to 1-3, except that a fixing layer is not formed on the base member, the rest is the same as in Examples 1-1 to 1-3. Polymer conductivity was prepared and the surface resistance was measured. As for the base member, Comparative Example 1-1 is bleached cloth, Comparative Example 1-2 is cotton cloth, and Comparative Example 1-3 is polyester cloth. FIG. 3 shows the obtained results together with the results of Examples 1-1 to 1-3.

  As shown in FIG. 3, according to Examples 1-1 to 1-3, all of the resistance values could be lowered as compared with the corresponding Comparative Examples 1-1 to 1-3. That is, it was found that the conductivity can be improved by forming the fixing layer 11B on the base member 11A. Further, in Examples 1-1 and 1-2, the resistance value decreased slightly compared to Comparative Examples 1-1 and 1-2, but Example 1-3 was smaller than Comparative Example 1-3. The resistance value could be greatly reduced. That is, it was found that a higher effect can be obtained when the base member 11A is made of chemical fibers such as polyester as compared with the case where the base member 11A is made of natural fibers such as bleach or cotton. This is because the natural fiber is excellent in water absorption, and therefore the conductive polymer 12 can be held in or on the base member 11A. However, in the case of chemical fiber, the water absorption is poor. Conceivable.

(Examples 2-1 and 2-2)
In Example 2-1, the base material 11 was formed in the same manner as in Example 1-3 except that the cleaning process (step S112) was not performed in the base material formation process (step S110). Conductive polymer conductor 10 was produced. In Example 2-2, except that the cleaning process (step S112) was performed for 30 minutes, the base material 11 was formed in the same manner as in Example 1-3, and the conductive polymer conductor 10 was manufactured. . For the obtained conductive polymer conductors 10 of Examples 2-1 and 2-2, the surface resistance was measured in the same manner as in Example 1-3. Table 1 shows the obtained results together with the results of Example 1-3 and Comparative Example 1-3.

  As shown in Table 1, in Example 2-1 where the cleaning was not performed and Example 2-2 where the cleaning was performed for a long time, compared with Comparative Example 1-3 where the fixing layer 11B was not formed. Although resistance became low, resistance was high compared with Example 1-3 which performed the washing | cleaning process (step S112). That is, when sericin is attached, the conductivity can be improved, but it has been found that the conductivity can be further improved by washing. Further, it has been found that if the cleaning time is too long, the conductivity cannot be sufficiently improved, which is not preferable.

(Example 3-1)
In the base material forming step (step S110), except that the sericin adhesion step (step S111) and the cleaning step (step S112) were repeated three times in order, the same as in Example 1-3 The base material 11 was formed and the conductive polymer conductor 10 was produced. For the obtained conductive polymer conductor 10 of Example 3-1, the surface resistance was measured in the same manner as in Example 1-3. Table 2 shows the obtained results together with the results of Example 1-3 and Comparative Example 1-3.

  As shown in Table 1, according to Example 3-1, the resistance can be further reduced as compared with Example 1-3, and the resistance can be significantly reduced as compared with Comparative Example 1-3. It was. That is, it was found that if the sericin adhesion step (step S111) is performed a plurality of times, the conductivity can be further improved.

Example 4
The substrate 11 was formed in the same manner as in Example 1-3 except that the concentration of the sericin aqueous solution was changed from 0.01% to 1% in the sericin adhesion step (step S111). A molecular conductor 10 was produced. The temperature of the sericin aqueous solution is 95 ° C., and the impregnation time is 10 minutes. The surface resistance of the obtained conductive polymer conductor 10 was also measured in the same manner as in Example 1-3. FIG. 4 shows the results obtained.

  As shown in FIG. 4, when the concentration of the sericin aqueous solution is from 1% to 0.02%, the resistance continues to decrease as the concentration is lowered, and after 0.02% shows the lowest sheet resistance (200Ω), There was a tendency for resistance to increase at 0.01%. In this example, when the concentration of the sericin aqueous solution is from 1% to 0.02%, the resistance decreases as the deposited sericin layer becomes thin, and when the concentration is 0.01%, the thickness of the deposited sericin layer is not good. It is considered that the resistance was increased because the fixing layer 11B that was sufficient and could not be formed in the subsequent washing step could not be formed. Another factor that caused the resistance to decrease until the concentration of the aqueous sericin solution was 0.02% was that the viscosity of the aqueous solution obtained by diluting sericin decreased, and a sericin layer was formed in every corner of the sample. Sex is also conceivable. Therefore, it was found that the concentration of the sericin aqueous solution is preferably 0.01% or more and 0.2% or less.

(Example 5)
In the sericin adhesion step (step S111), except that the concentration of the sericin aqueous solution is 0.02% and the time for impregnation of the sericin aqueous solution is changed from 5 minutes to 30 minutes, or the concentration of the sericin aqueous solution is 0.05%. A base material 11 was formed in the same manner as in Example 1-3, except that the time for impregnation with the aqueous sericin solution was changed from 10 minutes to 25 minutes, and a conductive polymer conductor 10 was produced. The temperature of the sericin aqueous solution is 95 ° C. The surface resistance of the obtained conductive polymer conductor 10 was also measured in the same manner as in Example 1-3. FIG. 5 shows the results obtained.

  As shown in FIG. 5, when the concentration of the sericin aqueous solution was 0.02%, the lowest resistance value was obtained after the impregnation time of 15 minutes. Further, when the concentration of the sericin aqueous solution was 0.05%, 20 minutes was the lowest resistance value, and it was suggested that the optimum impregnation time was increased by increasing the concentration. The resistance value at the optimum impregnation time was 0.02% lower than the 0.05% concentration of the sericin aqueous solution. From these results, when the concentration of the sericin aqueous solution is 0.02%, the diffusion rate inside the fabric of the base member 11A is increased, and the sericin layer is formed faster and the thinner sericin layer is formed on the entire fabric. It is thought that it was done.

(Example 6)
In the sericin adhesion step (step S111), the base was the same as in Example 1-3 except that the concentration of the sericin aqueous solution was changed from 25 ° C. to 95 ° C. and the time for impregnation into the sericin aqueous solution was 20 minutes. The material 11 was formed, and the conductive polymer conductor 10 was produced. The concentration of the sericin aqueous solution is 0.05%. The surface resistance of the obtained conductive polymer conductor 10 was also measured in the same manner as in Example 1-3. FIG. 6 shows the results obtained.

  As shown in FIG. 6, when the temperature of the sericin aqueous solution, that is, the impregnation temperature was decreased, the resistance value was also decreased, and the maximum value decreased from 497Ω to 300Ω (25 ° C.). Therefore, it was found that the temperature of the sericin aqueous solution is preferably 10 ° C. or higher and 40 ° C. or lower.

(Examples 7-1 and 7-2)
In Example 7-1, a polyester cloth having a size of 40 mm × 50 mm was prepared as the base member 11A, impregnated in a 1% sericin aqueous solution at 25 ° C., and held for 5 to 30 minutes (sericin adhesion step: step S111). . Subsequently, the base member 11A to which sericin was adhered was washed with water (cleaning step: step S112). Thereby, the base material 11 in which the fixing layer 11B containing sericin was formed on the base member 11A was obtained (base material forming step: step S110).

  Next, PEDOT monomer solution (Heraeus Clevios M-V2) as a raw material solution and pTS (Heraeus Clevios C-B40V2) as an oxidant and a dopant to ethylene glycol (Sigma Aldrich Japan Co., Ltd.). The production solution to which 25% by mass of the product was added was mixed and stirred immediately before each 0.3 cc, sufficiently contained, and heated at 55 ° C. for 3.5 minutes. As the heating device, Rick Cook hot air oven FVX-M3A, IRIS OHYAMA was used. After that, it was impregnated with ethanol for 1 minute, dried and washed with water (washing step: step S123). Thereby, the conductive polymer conductor 10 was obtained (conductive polymer formation process: step S120).

  In Example 7-2, except that urea was added to the sericin aqueous solution (sericin concentration 1%) at an addition concentration of 0.168M, the substrate 11 was formed in the same manner as in Example 7-1, A conductive polymer conductor 10 was produced. Three samples were prepared in each of Examples 7-1 and 7-2, and the surface resistance of each conductive polymer conductor 10 between three points separated by 8 mm was measured. As the measuring device, Loresta-AX MCP-T370 manufactured by Mitsubishi Chemical Analytech was used. FIG. 7 shows the results obtained. The sheet resistance shown in FIG. 7 is an average value in each example.

  As shown in FIG. 7, the sheet resistance of Example 7-1 was 326 Ω / □, whereas the sheet resistance of Example 7-2 was 118 Ω / □. The standard deviation of Example 7-1 was 20, whereas the standard deviation of Example 7-2 was 4.5. That is, it has been found that if urea is added to the sericin solution, the conductivity can be improved, the variation can be reduced, and the reproducibility can be improved.

(Example 8)
Sericin adhesion step: The substrate 11 was formed in the same manner as in Examples 7-1 and 7-2 except that the sericin concentration of the aqueous sericin solution and the addition concentration of urea were changed in step S111). The polymer conductor 10 was produced and the surface resistance was measured in the same manner. FIG. 8 shows the results obtained. As shown in FIG. 8, it was found that as the amount of urea added increases, the sheet resistance decreases and then increases. That is, it has been found that the urea concentration in the aqueous sericin solution is more than 0M, preferably 0.5M or less, and more preferably 0.4M or less.

  The present invention has been described with reference to the embodiment. However, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above-described embodiment, each component has been specifically described. However, not all the components may be provided, and other components may be provided.

In recent years, in Japan, the aging of society has progressed, and in order to extend health monitoring and healthy life expectancy, biometric information such as electrocardiograms (information that is the basis of electrocardiograms; the same applies hereinafter) and electromyograms are detected by casual sensing. Thus, the development of wearable devices that can prevent illness and injury and that can detect illness early is underway. However, when measuring an electrocardiogram or the like, conventionally, it is necessary to apply a gel or a sticky sticker, or to press it strongly with a belt, which makes it difficult to wear it for a long time. In addition, disposable seals are used instead, but there is a sense of discomfort at the time of wearing, which may cause problems such as rough skin.
Conventionally, a material mainly coated with Ag metal is generally used, but there is a concern about adverse effects on living bodies. Furthermore, there is a problem that the electrodes are oxidized by moisture and sweat, resulting in performance deterioration. That is, an electrode that does not adversely affect the living body even when used for a long time is desired.
According to the present invention, it is possible to apply a protein (sericin) to the surface of a commercially available underwear, print a conductive solution thereon, polymerize it by a chemical reaction, and give the underwear a conductive function. it can. The electrode can be measured without being strongly pressed against a living body, underwear can be manufactured at a lower cost than conventional products, and biological information can be detected. If the price of clothing is reduced, it can be widely applied to support robots for health care and nursing care, support robots for work, fitness, work clothes, and the like.

  DESCRIPTION OF SYMBOLS 10 ... Conductive polymer conductor, 11 ... Base material, 11A ... Base member, 11B ... Fixing layer, 12 ... Conductive polymer

Claims (6)

A method for producing a conductive polymer conductor having a conductive polymer attached to a substrate,
A base material forming step of forming a base material by forming a fixing layer containing sericin on a base member made of fibers other than silk;
Look containing a conductive polymer formation step of depositing the conductive polymer to a substrate to form a fixing layer to the base member,
The base material forming step includes a sericin attachment step of attaching sericin to the base member, and in the sericin attachment step, a sericin aqueous solution containing sericin and added with urea is attached to the base member. A method for producing a conductive polymer conductor. Said substrate forming step, said sericin adhering step, said After the base member is adhered sericin process according to claim 1, wherein the conductive polymer conductor, characterized in that it comprises a cleaning step of cleaning . It said base member manufacturing method of the conductive polymer conductor of claim 1 or claim 2, characterized in that it comprises a chemical fiber. A method of manufacturing a substrate that forms a conductive polymer conductor by attaching a conductive polymer,
A substrate forming step of forming a fixing layer comprising sericin to base member made of fibers other than silk seen including,
The base material forming step includes a sericin attachment step of attaching sericin to the base member, and in the sericin attachment step, a sericin aqueous solution containing sericin and added with urea is attached to the base member. A method for manufacturing a substrate. The method for producing a base material according to claim 4, wherein the base material forming step includes the sericin attaching step and a cleaning step of cleaning after attaching sericin to the base member. The base material manufacturing method according to claim 4, wherein the base member includes a chemical fiber.

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