JP6310104B2 - Electronic device casing and method of manufacturing the same - Google Patents

Description

  The present invention relates to a structure including a conductive pattern and a wireless communication apparatus including the structure.

  In recent years, a technique for forming a conductive pattern integrally with a housing has been developed in order to reduce the thickness of an electronic device and simplify the configuration thereof.

  For example, in Patent Document 1, an antenna, a first molding layer that is joined to one surface of the antenna by primary injection molding, and a second molding that is joined to the other surface of the antenna by secondary injection molding. A case body for an electronic device comprising a base body having a second molding layer, wherein the first molding layer and the second molding layer cover at least a part of the antenna. Has been.

JP 2012-44654 A (published March 1, 2012)

  In the technique disclosed in Patent Document 1, the portion of the first molding layer where the antenna is not joined and the second molding layer are in good contact (adhesion) during the second injection molding. However, the portion of the first molding layer where the antenna is joined has a low adhesion strength with the second molding layer, and therefore the first molding layer and the second molding layer may peel off at the boundary surface. is there.

  The present invention has been made in view of the above problems, and is a structure in which a second resin layer is laminated on a first resin layer having a conductive pattern formed on the surface so as to sandwich the conductive pattern. The main object is to provide a technique for suppressing separation between the first resin layer and the second resin layer in the portion where the conductive pattern is provided.

  In order to solve the above problems, a structure according to one embodiment of the present invention includes a second resin layer stacked on a first resin layer having a conductive pattern formed on a surface thereof so as to sandwich the conductive pattern. A missing part where the conductive pattern is missing exists on the first resin layer, and the first resin layer and the second resin layer are bonded to each other at the missing part. It is characterized by having.

  According to one aspect of the present invention, on the first resin layer, a missing portion where the conductive pattern is missing is provided, and the first resin layer and the second resin layer are bonded at the missing portion, It can suppress that a 1st resin layer and a 2nd resin layer peel in the part in which the conductive pattern is provided.

(A) is a side sectional view showing a schematic configuration of a structure according to an embodiment (Embodiment 1) of the present invention, and (b) is an upper surface of the structure observed from the first resin layer side. FIG. It is a figure which shows typically the outline | summary of the manufacturing process of the structure which concerns on one Embodiment (Embodiment 1) of this invention. (A) is side sectional drawing which shows schematic structure of the structure which concerns on one Embodiment (Embodiment 2) of this invention, (b) is the upper surface which observed the said structure from the 1st resin layer side FIG. It is a figure which shows typically the outline | summary of the manufacturing process of the structure which concerns on one Embodiment (Embodiment 2) of this invention. It is side sectional drawing which shows schematic structure of the radio | wireless communication apparatus which concerns on one Embodiment (Embodiment 3) of this invention. It is the top view which observed the structure based on one Embodiment (Embodiment 3) of this invention from the 1st resin layer side.

  The structure according to the present invention is a structure in which a second resin layer is laminated on a first resin layer having a conductive pattern formed on the surface so as to sandwich the conductive pattern. Above, there is a missing part where the conductive pattern is missing, and the first resin layer and the second resin layer are bonded to each other at the missing part.

  Moreover, the radio | wireless communication apparatus which concerns on this invention is a structure provided with the housing | casing which comprises the structure which concerns on this invention, and the antenna which contains the said conductive pattern.

(Outline of structure)
The structure according to the present invention is incorporated in a general electronic device that requires a conductive pattern as an antenna element, a signal transmission path, a power transmission path, and the like, thereby providing the conductive pattern to the electronic device. For example, in one embodiment, a structure according to the present invention is incorporated in a wireless communication device and provides an antenna element of an antenna included in the wireless communication device. The structure according to the present invention may be incorporated in an electronic device, for example, to provide a signal transmission path, a power transmission path, and the like that connect a circuit board and other electronic components, or a circuit. A path for connecting the substrate and the ground may be provided.

  The structure according to the present invention may be fixed to an electronic device or may be detachably attached. In one embodiment, the structure concerning the present invention may constitute at least a part of the case of an electronic device. In other words, the structure according to the present invention can constitute a conductive pattern forming housing. The casing refers to a member that stores an electronic component included in the electronic device, and the conductive pattern forming casing refers to a casing in which a conductive pattern is formed. However, the structure according to the present invention is not limited to this, and may be a member other than the casing included in the electronic device.

  In the structure according to the present invention, since the conductive pattern is sandwiched between the first resin layer and the second resin layer, exposure of the conductive pattern to the outside can be suppressed. Thereby, aesthetics can be secured and damage, deformation, deterioration, etc. of the conductive pattern can be prevented.

  Both the first resin layer and the second resin layer are injection molded products, and may be made of the same resin or different resins. Examples of the resin constituting the first resin layer and the second resin layer include, but are not limited to, acrylonitrile-butadiene-styrene resin (ABS), polycarbonate-acrylonitrile-butadiene-styrene resin (PC-ABS). One or more resins selected from polycarbonate (PC), acrylonitrile-styrene resin (AS), polyethylene (PE), polypropylene (PP), polystyrene (PS), methacrylic resin (PMMA), and the like can be used. These resins may be mixed with other materials such as glass in order to increase the strength.

  Moreover, in one situation, you may use resin which has heat resistance rather than resin which comprises a 2nd resin layer as resin which comprises a 1st resin layer. Thereby, when shape | molding a 2nd resin layer, it can suppress that resin which forms a 1st resin layer and a 2nd resin layer melts too much. For example, PC can be used as the resin constituting the first resin layer, and ABS can be used as the resin constituting the second resin layer.

  The conductive pattern is a pattern made of a conductor formed on the surface of the first resin layer. The kind of the conductor is not particularly limited as long as it has conductivity, and metals such as copper, iron, nickel, and gold, conductive polymers, conductive carbon, and the like can be used. The method for forming the conductive pattern is not particularly limited. For example, the conductive pattern may be formed by plating a metal on the surface of the first resin layer, or a conductive paste containing a conductor A conductive pattern may be formed by printing on the surface of one resin layer, or a conductive pattern by sticking a flexible thin film conductive material such as copper foil to the surface of the first resin layer. May be formed. The conductor used for forming the conductive pattern is not limited to one type. For example, a conductive pattern may be formed by combining a plurality of conductors such as gold plating on a copper pattern.

  For example, in one embodiment, the conductive pattern can be formed using an LDS (Laser Direct Structuring) method. That is, an organic metal is mixed with the resin constituting the first resin layer, and the region on the surface of the first resin layer where the conductive pattern is formed is irradiated with laser. Thereby, an organic metal is deposited on the laser irradiation portion, and the laser irradiation portion is finely roughened (unevenness is formed), and the organic metal is bonded to the laser irradiation portion, thereby suitably forming a conductive pattern. be able to. In another embodiment, the conductive pattern may be formed using a DPA (Direct Printed Antenna) method. The DPA method is a method in which a printing plate for preparing a conductive pattern is prepared in advance, and the shape of the conductive pattern is transferred from the plate to a resin surface with a pad or the like.

  In the above-described method, particularly the LDS method, a conductive pattern is generated on the surface of the first resin layer by laser irradiation, and therefore the first resin layer and the conductive pattern are very closely adhered.

  In the structure according to the present invention, there is a missing part where the conductive pattern is missing on the first resin layer, and the first resin layer and the second resin layer are bonded to each other at the missing part. doing. Thereby, the adhesive strength of the 1st resin layer and the 2nd resin layer in the part in which the conductive pattern is provided can be improved, and it can suppress that a 1st resin layer and a 2nd resin layer peel. . In addition, it is preferable that at least one missing part is a missing part where the conductive pattern is missing in an island shape.

  In the present specification, the “missing portion where the conductive pattern is missing in an island shape” is a portion where no conductive pattern is provided on the first resin layer, and the conductive pattern is the sea area. In addition, it refers to a site that exists as if it were an island. That is, (i) a portion surrounded by a conductive pattern on the first resin layer, and (ii) when the conductive pattern is provided at the end of the first resin layer, This corresponds to a portion where the conductive pattern is missing on the end side of one resin layer.

  Moreover, the structure which concerns on this invention can be manufactured as follows, for example. First, a first resin layer is formed into a desired shape using a known injection molding technique (first resin layer forming step). Next, a conductive pattern is formed on the surface of the first resin layer using the method described above (conductive pattern forming step). At this time, the conductive pattern may be formed so that the missing part is provided in advance, or after forming the conductive pattern without the missing part, the missing part is formed by removing a part of the conductive pattern. Also good.

  Thereafter, a second resin layer is laminated on the first resin layer so as to sandwich the conductive pattern (lamination process). In the laminating step, it is preferable to insert-mold the second resin layer so as to be molded integrally with the already formed first resin layer. That is, by forming the second resin layer in the state where the first resin layer is arranged on the mold (insert molding), there is a conductive pattern including the above-mentioned missing portion between the first resin layer and the second resin layer. Good adhesion (adhesion) can be achieved in a region that is not.

  However, the present invention is not limited to this, and in the laminating process, a second resin layer previously formed using a known injection molding technique is bonded to a known adhesive such as a silicone-based adhesive or an epoxy resin-based adhesive. You may make it adhere | attach on a 1st resin layer using an agent. This also makes it possible to firmly bond the first resin layer and the second resin layer particularly in a region where the conductive pattern including the missing portion does not exist. This is because, generally, adhesion between resins is stronger than adhesion between a resin and a conductive pattern (particularly, a metal pattern).

  Subsequently, several embodiments of the present invention will be described in detail with reference to the drawings. However, the technical scope of the present invention is not limited to the description of the following embodiments and drawings, and the arrangement of each member, the presence or absence of each member, and the like may be changed as appropriate.

Embodiment 1
Fig.1 (a) is a sectional side view which shows schematic structure of the structure 10 which concerns on one Embodiment (Embodiment 1) of this invention. As shown in FIG. 1A, the structure 10 includes a first resin layer 1, a second resin layer 2, and a conductive pattern 3. The 1st resin layer 1 and the 2nd resin layer 2 are laminated | stacked so that the conductive pattern 3 may be pinched | interposed, and it has adhere | attached in the site | part which the 1st resin layer 1 and the 2nd resin layer 2 are in direct contact at least. . Further, the first resin layer 1 and the second resin layer 2 are bonded to each other at the missing portion 4 where the conductive pattern 3 is missing in the first resin layer 1.

  In the example shown in FIG. 1A, the second resin layer 2 is formed in a convex shape toward the missing part 4, but in the missing part 4, the first resin layer 1 and the second resin layer 2 If it is the structure which has adhere | attached, a shape will not be specifically limited, The missing part 4 of the 1st resin layer 1 may be formed in convex shape toward the 2nd resin layer 2. As shown in FIG. Moreover, both the 1st resin layer 1 and the 2nd resin layer 2 may be formed in convex shape toward each other, one side may be formed in concave shape, and the other may be formed in convex shape.

  Further, as described above, the adhesion between the first resin layer 1 and the second resin layer 2 in the missing portion 4 may be adhered (welded) by insert molding, or may be performed using an adhesive. .

  Moreover, FIG.1 (b) is the top view which observed the structure 10 from the 1st resin layer 1 side. As shown in FIG. 1B, in the first embodiment, the missing part 4 is formed by making a hole in the conductive pattern 3 and is surrounded by the conductive pattern 3.

  In the example shown in FIG. 1B, the missing part 4 is circular, but the shape of the missing part 4 is not particularly limited, and an arbitrary shape such as an ellipse, a quadrangle, or a polygon can be used. In addition, the number of missing parts 4 is not particularly limited, and one or more missing parts 4 can be provided. However, in order to improve the adhesion strength between the first resin layer 1 and the second resin layer 2, it is preferable to provide a plurality of missing portions 4.

  FIG. 2 is a diagram schematically showing an outline of the manufacturing process of the structure 10. A conductive pattern 3 is formed on the surface of the first resin layer 1 (FIG. 2A), and the second resin layer 2 is laminated so as to sandwich the conductive pattern 3 (FIG. 2B). 10 is completed (FIG. 2C).

(Advantages of Embodiment 1)
According to the first embodiment, the missing portion 4 where the conductive pattern 3 is missing is provided on the first resin layer 1, and the first resin layer 1 and the second resin layer 2 are bonded to each other at the missing portion 4. Therefore, it can suppress that the 1st resin layer 1 and the 2nd resin layer 2 peel in the part in which the conductive pattern 3 is provided.

  In the first embodiment, the missing portion 4 is surrounded by the conductive pattern 3. In other words, the missing part 4 is provided by making a hole in the conductive pattern 3. Therefore, the missing part 4 can be provided at an arbitrary position, and the first resin layer 1 and the second resin layer 2 can be suitably prevented from peeling off.

  In particular, even when the conductive pattern 3 becomes wide and the contact area between the portion of the first resin layer 1 where the conductive pattern 3 is not provided and the second resin layer 2 decreases, the first resin layer 1 And the second resin layer 2 can be suitably prevented from peeling.

[Embodiment 2]
Another embodiment (Embodiment 2) of the present invention will be described as follows. For convenience of explanation, members having the same functions as those described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  3A is a side sectional view showing a schematic configuration of the structure 20 according to the second embodiment, and FIG. 3B is a top view of the structure 20 observed from the first resin layer 1 side. is there. As shown in FIG. 3, the structure 20 according to the second embodiment is different from the structure 10 according to the first embodiment in the positions and shapes of the conductive pattern 3 and the missing part 4. It is the same.

  As shown in FIG. 3B, in the second embodiment, at least a part of the conductive pattern 3 is provided at the end of the first resin layer 1. The end portion of the first resin layer 1 refers to a portion near the end of the first resin layer 1, and a gap may exist between the conductive pattern 3 and the first resin layer 1.

  The missing portion 4 is a portion formed by missing a part of the conductive pattern 3 on the terminal side of the first resin layer 1 described above. In other words, the portion of the missing portion 4 other than the portion facing the end of the first resin layer 1 is surrounded by the conductive pattern 3.

  In the example shown in FIG. 3B, the missing portion 4 is rectangular, but the shape of the missing portion 4 is not particularly limited, and any shape such as a circle, an ellipse, or a polygon can be used. In addition, the number of missing parts 4 is not particularly limited, and one or more missing parts 4 can be provided. However, in order to improve the adhesion strength between the first resin layer 1 and the second resin layer 2, it is preferable to provide a plurality of missing portions 4.

  FIG. 4 is a diagram schematically showing the outline of the manufacturing process of the structure 20. By forming the conductive pattern 3 on the surface of the first resin layer 1 (FIG. 4A) and laminating the second resin layer 2 so as to sandwich the conductive pattern 3 (FIG. 4B), the structure 20 is completed (FIG. 4C).

(Advantages of Embodiment 2)
Also in the second embodiment, as in the first embodiment, the missing portion 4 where the conductive pattern 3 is missing is provided on the first resin layer 1, and the first resin layer 1 and the second resin layer 2 are provided in the missing portion 4. And the first resin layer 1 and the second resin layer 2 can be prevented from peeling off at the portion where the conductive pattern 3 is provided.

  In Embodiment 2, at least a part of the conductive pattern 3 is provided at the end of the first resin layer 1, and the first resin of the conductive pattern 3 provided at the end of the first resin layer 1 is used. A missing portion 4 is provided on the end side of the layer 1.

  Thereby, even if it is a case where the conductive pattern 3 is provided in the edge part of the 1st resin layer 1, by providing the missing part 4 near the terminal of the 1st resin layer 1, near the terminal of the 1st resin layer 1 It can suppress suitably that the 1st resin layer 1 and the 2nd resin layer 2 peel.

  In the prior art, when the conductive pattern 3 is provided at the end of the first resin layer 1, peeling between the first resin layer 1 and the second resin layer 2 is very likely to occur. Because, as described above, in the portion where the conductive pattern 3 is provided, peeling between the first resin layer 1 and the second resin layer 2 is likely to occur, so the first resin layer surrounds the conductive pattern 3. Although it is necessary to provide a portion where 1 and the second resin layer 2 are directly bonded (portion where no conductive pattern is provided), it is necessary to prevent peeling between the first resin layer 1 and the second resin layer 2. In the end portion of the first resin layer 1, a portion where the first resin layer 1 and the second resin layer 2 are directly bonded so as to surround the conductive pattern 3 (a portion where no conductive pattern is provided) is provided. This is because it is difficult.

  On the other hand, according to the present invention, peeling between the first resin layer 1 and the second resin layer 2 can be suppressed by adhesion at the missing portion 4 in the portion where the conductive pattern 3 is provided. Therefore, the conductive pattern 3 can be provided at the end of the first resin layer 1.

(Modification)
It is also possible to combine the first embodiment and the second embodiment. That is, the missing part 4 may be provided at a position surrounded by the conductive pattern 3, and the missing part 4 may be provided on the terminal side of the first resin layer 1 in the conductive pattern 3 provided at the end of the first resin layer 1. .

  The conductive pattern 3 may not be provided at the end of the first resin layer 1. Even in such a configuration, an effect of suppressing peeling between the first resin layer 1 and the second resin layer 2 can be obtained.

  Further, the missing part 4 may not be provided on the terminal side of the first resin layer 1. Even in such a configuration, an effect of suppressing peeling between the first resin layer 1 and the second resin layer 2 can be obtained.

[Embodiment 3]
Next, a configuration in which the structure according to the present invention is incorporated in an electronic device will be described. In the third embodiment, as an example, a structure in which a structure according to the present invention is incorporated in a wireless communication device will be described. However, the technical scope of the present invention is limited to the description of the following embodiments and drawings. is not. For convenience of explanation, members having the same functions as those described in the first and second embodiments are denoted by the same reference numerals and description thereof is omitted.

  FIG. 5 is a side sectional view showing a schematic configuration of the wireless communication device 60 according to the third embodiment. As illustrated in FIG. 5, the structure 30 is incorporated in the wireless communication device 60.

The structure (upper housing) 30 constitutes a housing 32 of the wireless communication device 60 together with the lower housing 31, and includes a circuit board (wireless circuit unit) 50 and a mounting component / shield 51 mounted on the circuit board 50. Storing. The structure 30 includes a first resin layer 1, a second resin layer 2, and a conductive pattern 3, and a missing portion 4 is provided on the first resin layer 1. In the third embodiment, the conductive pattern 3 functions as an antenna element. That is, the conductive pattern 3 is supplied with power from a wireless circuit unit mounted on the circuit board 50 via a power supply path (not shown) and operates as an antenna of the wireless communication device 60.

  FIG. 6 is a top view of the structure 30 observed from the first resin layer 1 side. As shown in FIG. 6, in the structure 30, the conductive pattern 3 is provided at the end of the first resin layer 1, and the circular missing portion 4 is provided at a position surrounded by the conductive pattern 3. However, the shape of the missing portion 4 is not particularly limited, and an arbitrary shape such as an ellipse, a quadrangle, or a polygon can be used.

  Moreover, it is preferable that the size of the missing portion 4 is set so as not to affect the antenna characteristics of the antenna constituted by the conductive pattern 3. For example, when the missing portion 4 is circular, the diameter thereof can be set to 1/8 wavelength with respect to the use frequency (resonance frequency) of the antenna constituted by the conductive pattern 3 as an example. That is, by making the individual area of the missing part 4 1/8 wavelength × 1/8 wavelength or less with respect to the use frequency of the antenna constituted by the conductive pattern 3, the influence on the antenna characteristics is suitably suppressed. can do.

(Advantages of Embodiment 3)
Also in Example 3, similarly to Examples 1 and 2, the missing part 4 in which the conductive pattern 3 is missing is provided on the first resin layer 1, and the first resin layer 1 and the second resin are provided in the missing part 4. Since the layer 2 is bonded, it is possible to prevent the first resin layer 1 and the second resin layer 2 from being peeled at the portion where the conductive pattern 3 is provided.

  Therefore, it can suppress that the conductive pattern 3 peels from the 2nd resin layer 2, and the resonant frequency from which an antenna operate | moves shift | deviates.

  Further, as shown in FIG. 5, by providing the conductive pattern 3 at the end of the first resin layer 1, the circuit board 50 and the mounted component / shield 51 stored in the wireless communication device 60, and the conductive pattern 3 are provided. The distance between can be increased. As a result, the distance from the circuit board 50 and the mounting component / shield 51 that is visible to the GND as viewed from the antenna is secured, and the conductive pattern 3 is coupled with the circuit board 50, the mounting component / shield 51, etc., and unnecessary resonance occurs. It can be avoided that the antenna characteristics are deteriorated.

  Note that, as described above, in the related art, when the conductive pattern 3 is provided at the end of the first resin layer 1, peeling between the first resin layer 1 and the second resin layer 2 is extremely generated. easy. On the other hand, according to the present invention, peeling between the first resin layer 1 and the second resin layer 2 can be suppressed by adhesion at the missing portion 4 in the portion where the conductive pattern 3 is provided. Therefore, the conductive pattern 3 can be successfully provided at the end of the first resin layer 1. Thereby, the effect of preventing the deterioration of the antenna characteristics described above can be obtained.

(Modification)
The shape and position of the missing portion 4 are not particularly limited, and can be formed as in the second embodiment, for example.

  Further, as in Embodiment 1, the conductive pattern 3 may not be provided at the end of the first resin layer 1. Even in such a configuration, it is possible to obtain an effect that the conductive pattern 3 can be prevented from being peeled off from the second resin layer 2 to shift the resonance frequency at which the antenna operates.

[Summary]
The structure (10) according to one embodiment of the present invention has a second resin layer (2) on the first resin layer (1) having the conductive pattern (3) formed on the surface thereof so as to sandwich the conductive pattern. A missing portion (4) where the conductive pattern is missing exists on the first resin layer, and the first resin layer and the second resin layer are present in the missing portion. The resin layer is bonded.

  According to said structure, the adhesion strength of the 1st resin layer and the 2nd resin layer in the part in which the conductive pattern is provided is adhere | attached by the 1st resin layer and the 2nd resin layer adhering in a missing part. Thus, the first resin layer and the second resin layer can be prevented from peeling off at the portion.

  In the structure according to one embodiment of the present invention, the at least one missing portion may be a missing portion where the conductive pattern is missing in an island shape.

  According to said structure, it can suppress more suitably that a 1st resin layer and a 2nd resin layer peel.

  In the structure according to one embodiment of the present invention, at least one of the missing portions may be surrounded by the conductive pattern.

  According to said structure, a missing part can be provided in arbitrary positions and it can suppress suitably that a 1st resin layer and a 2nd resin layer peel.

  In the structure (20) according to one embodiment of the present invention, at least a part of the conductive pattern is provided at an end of the first resin layer, and the first resin layer in the at least a part of the conductive pattern is provided. At least one missing portion may be provided on the terminal side.

  According to said structure, even if it is a case where a conductive pattern is provided in the edge part of a 1st resin layer, the part by which a conductive pattern is provided by providing a missing part near the terminal end of a 1st resin layer It can suppress suitably that a 1st resin layer and a 2nd resin layer peel.

  A wireless communication device (60) according to an aspect of the present invention includes a housing (32) including the structure (30) according to an aspect of the present invention and an antenna including the conductive pattern. ing.

  According to said structure, peeling of the boundary surface of a 2nd resin layer and a conductive pattern can be suppressed. Thereby, it can suppress that the resonant frequency which an antenna operates shift | deviates.

  In the wireless communication apparatus according to one aspect of the present invention, each area of the missing portion may be less than or equal to a square of 1/8 wavelength of the use frequency of the antenna.

  According to said structure, the influence which a missing part has on the antenna characteristic of the said antenna can be reduced.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

The present invention can be widely applied to various electronic components using a conductive pattern. Although not particularly limited to this, the present invention can be suitably applied to a wireless communication apparatus that uses a conductive pattern as an antenna element.

10, 20, 30 Structure 1 First resin layer 2 Second resin layer 3 Conductive pattern (antenna)
4 Missing part 32 Case 50 Circuit board 51 Mounted parts / shield 60 Wireless communication device

Claims (10)

  A first resin layer, a conductive pattern and a second resin layer;
  The conductive pattern is a metal plating formed on the surface of the first resin layer,
  On the first resin layer, the conductive pattern is missing, there are island-like, and circular or elliptical missing parts,
  On the first resin layer, the first resin layer and the second resin layer are bonded to each other at the missing portion by molding the second resin layer so as to sandwich the conductive pattern by insert molding. A housing of an electronic device characterized by   The case of the electronic device according to claim 1, wherein the conductive pattern is formed using an LDS method (Laser Direct Structuring).   The casing of the electronic device according to claim 1, wherein at least one of the missing portions is surrounded by the conductive pattern.   The case of the electronic device according to claim 1, wherein the conductive pattern is an antenna element.   5. The electronic device casing according to claim 4, wherein each area of the missing portion is 1/8 wavelength × 1/8 wavelength or less with respect to a use frequency of the antenna element.   A method for manufacturing a housing of an electronic device, comprising a first resin layer, a conductive pattern, and a second resin layer,
  Including a molding step of molding the second resin layer so as to sandwich the conductive pattern by insert molding on the first resin layer on which the conductive pattern is formed by plating a metal on the surface;
  On the first resin layer, there are island-like, circular, or elliptical missing portions where the conductive pattern is missing. By performing the molding step, A method for manufacturing a casing of an electronic device, comprising bonding a resin layer and a second resin layer.   The method for manufacturing a casing of an electronic device according to claim 6, wherein the conductive pattern is formed using an LDS method (Laser Direct Structuring).   8. The method of manufacturing an electronic device casing according to claim 6, wherein at least one of the missing portions is surrounded by the conductive pattern.   The method for manufacturing a casing of an electronic device according to any one of claims 6 to 8, wherein the conductive pattern is an antenna element.   10. The method for manufacturing a casing of an electronic device according to claim 9, wherein each area of the missing portion is 1/8 wavelength × 1/8 wavelength or less with respect to a use frequency of the antenna element. .

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