JP6293362B2 - Isotropic pressure press capable of heating and cooling, and chip part manufacturing method using the same - Google Patents

Description

  The present invention relates to an isotropic pressure press apparatus that performs isotropic pressure compression molding using a pressure medium filled in a pressure vessel, and a chip part manufacturing method using the same.

  Generally, an isotropic pressure press is a device that injects a gas or a fluid into a pressure vessel in a state where a workpiece is put in the pressure vessel, and performs compression molding by the pressure of the gas or the fluid. Many are used to manufacture chip components.

  A conventional isotropic pressure pressing apparatus is disclosed in Patent Document 1 as an “isostatic pressure pressing apparatus”.

  As shown in FIG. 1, the conventional isotropic pressure pressurizing apparatus includes a heat insulator 3 that forms a processing chamber R that accommodates a workpiece W, a pressure vessel 2 that covers the heat insulator 3, and the pressure vessel 2. And a pressure medium supply device 5 capable of supplying a pressure medium to the inside of the pressure vessel 2, and a pressure medium capable of introducing the pressure medium between the heat insulator 3 and the pressure vessel 2. An introduction space S is provided, the processing chamber R communicates with the pressure medium introduction space S through a communication hole formed in the upper part of the heat insulator 3, and the pressure medium through a pressure medium introduction port 18 formed in the lower part of the pressure vessel. The pressure medium supply device 5 is configured to communicate with the introduction space S.

  The isotropic pressure pressurizer having such a configuration was able to perform compression molding while the workpiece W was heated by heating the pressure medium by heating the pressure vessel 2 with a heating device.

  However, in the conventional isotropic pressure pressurizing apparatus, in order to heat the workpiece W, the pressure vessel 2 has to be heated, so that it takes a long time to heat the workpiece W. In addition to waste of heat loss, there is a problem that it is difficult to heat the workpiece at a uniform temperature.

  In addition, there is a problem that the packing provided on the lid for sealing the pressure vessel 2 is damaged due to the high temperature and high pressure due to the heating of the pressure vessel 2.

  In addition, the conventional isotropic pressure pressurizing apparatus has a function of only heating the pressure medium, but cannot perform a cooling function. Therefore, the workpiece W for having a dense structure through firing and curing is provided. Was not processed.

Korean Published Patent No. 10-2007-0112718

  The present invention has been made in view of the above problems, and its object is to heat or cool a workpiece in a short time by a pressurizing medium that pressurizes the workpiece, thereby reducing compression molding time and heat loss. Another object is to provide an isotropic pressure pressing device capable of heating or cooling a workpiece to a uniform temperature.

  Another object of the present invention is to perform cooling together with heating, compression-molding the workpiece so as to have a dense structure, minimizing the defect rate of the workpiece, preventing damage to the packing, An object of the present invention is to provide an isotropic pressure press apparatus capable of preventing pressure loss and improving airtightness.

  Another object of the present invention is to provide a chip component which can compress and mold a chip component in a short time by heating and cooling a pressurized medium, and which can produce a chip component having a dense structure and a low defect rate. It is to provide a manufacturing method.

  In order to achieve the above-mentioned object, an isotropic pressure pressing apparatus capable of heating and cooling according to an embodiment of the present invention has an accommodation groove in which a workpiece is accommodated, and the accommodation groove is filled with a pressurized medium. And a press apparatus having a pressure vessel for pressurizing a workpiece with an isotropic pressure, the pressurizing medium and the pressurizing medium provided in the housing groove and heated or cooled so as to heat or cool the pressurizing medium supplied to the housing groove. A heat exchanger having a heat exchange member for heat exchange is provided.

  The heat exchange member may be heated or cooled by a heat medium supplied to the heat exchange member.

  The heat exchanger may include a heating unit that heats the heat medium and cooling that cools the heat medium.

  The heat exchanger may include a selective supply unit that selectively supplies a heat medium heated or cooled in the heating unit and the cooling unit to the heat exchange member.

  The heat exchanger may include a heat medium storage tank that stores the heat medium.

  The heat exchange member is configured to circulate the heat exchange member in a zigzag manner, an inflow port through which a heat medium that cools or heats the heat exchange member flows, an exhaust port through which the heat medium that has flowed into the inflow port is discharged, and the heat exchange member. In addition, a fine channel connecting the inlet and the outlet may be provided.

  The heat medium may include water.

  The heat exchange member may include a heater that is heated by electricity.

  The heat exchange member may include a cooling unit that is cooled by a refrigerant.

  The heat exchange member may be formed in any one of a plate shape, a cylindrical shape, and a spiral shape.

  The heat exchange member has a plurality of through holes penetrating the heat exchange member or a plurality of protrusions protruding from an outer surface of the heat exchange member so that a contact area with the pressurized medium is widened. Also good.

  You may have the heat insulating material provided in the inner surface of the said accommodation groove | channel, and preventing that the heat of the said heat exchange member is transmitted to the exterior of the said accommodation groove | channel.

  The heat insulating material may include any one of resin and ceramic.

  The pressure vessel further includes an upper cap and a lower cap that seal the upper and lower portions of the pressure vessel, respectively, provided on one or both of the upper cap and the lower cap, and heating the pressure medium. You may have a heater.

  The pressure vessel further includes an upper cap and a lower cap that seal the upper and lower portions of the pressure vessel, respectively, and a shelf that is coupled to one of the upper cap and the lower cap and on which a workpiece is seated. You may have.

  According to an embodiment of the present invention, there is provided a chip part manufacturing method using an isotropic pressure pressing device, wherein an accommodation groove for accommodating a chip part is formed, and the accommodation groove is filled with a pressure medium to A pressure vessel that pressurizes with pressure, and a heat exchanger that is provided in the housing groove and has a heat exchange member that exchanges heat with the pressurized medium so as to heat or cool the pressurized medium supplied to the housing groove. A method of manufacturing a chip component using an isotropic pressure pressing device comprising: a step of loading the chip component into the receiving groove; and a method of supplying a pressure medium to the receiving groove to Performing pressure compression molding, heating the heat exchanging member for exchanging heat with the pressurizing medium so that the chip component is heated in a state in which the pressure is maintained by the pressurizing medium, and housing The pressurized medium supplied to the groove A step of discharging the contents groove, characterized in that it comprises a the steps of unloading the chip components accommodated in the accommodating groove.

  Before or after the step of heating the heat exchange member for exchanging heat with the pressure medium, the pressure medium and the heat are heated so that the chip component is cooled in a state where the pressure is maintained by the pressure medium. You may have the step of cooling the said heat exchange member to replace | exchange.

  According to the isotropic pressure press apparatus capable of heating and cooling according to the present invention, the workpiece is heated or cooled in a short time by directly heating or cooling the workpiece with the pressurized medium, and the compression molding time. And heat loss can be minimized.

  In addition, since the fired workpiece can be immediately cured in a state where the pressure is maintained, a workpiece having a dense structure can be obtained, and the defect rate can be minimized.

  Further, a heat insulating material is provided inside the pressure vessel, and by preventing the internal heat from being transferred to the pressure vessel, the packing can be prevented from being damaged, pressure loss can be prevented, and airtightness can be improved. .

  Further, since the workpiece is cooled or heated by the pressurized medium, the workpiece can be heated or cooled to a uniform temperature.

  According to the method of manufacturing a chip component using the isotropic pressure press apparatus of the present invention, the chip component is heated or cooled directly by a pressurized medium, whereby the chip component is heated or cooled in a short time to obtain a dense structure. In addition to manufacturing a chip component having the above, it is possible to minimize the defect rate of the chip component.

  Further, by omitting the firing or curing process for manufacturing the chip component, the equipment cost and the manufacturing time can be greatly reduced.

It is a sectional side view which shows the conventional isotropic pressure pressurization apparatus. It is a schematic block diagram which shows the isotropic pressure press apparatus by the Example of this invention. It is a schematic block diagram which shows the isotropic pressure press apparatus by the Example of this invention, Comprising: It is a figure which shows the state which open | released the accommodation groove | channel. It is a schematic block diagram which shows the heat exchanger which comprises the isotropic pressure press apparatus by the Example of this invention. It is a perspective view which shows the heat exchange member which comprises the heat exchanger of the isotropic pressure press apparatus by the Example of this invention. It is sectional drawing of FIG. It is a perspective view which shows the modification of the heat exchange member which comprises the heat exchanger of the isotropic pressure press apparatus by the Example of this invention, Comprising: The heat exchange member formed in the cylindrical shape. FIG. 6 is a perspective view showing another modification of the heat exchange member constituting the heat exchanger of the isotropic pressure press device according to the embodiment of the present invention, the heat exchange member formed in a spiral shape. It is a schematic flowchart which shows the manufacturing method of the chip component using the isotropic pressure press apparatus by the Example of this invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  First, an isotropic pressure pressing apparatus 100 according to the present invention includes a workpiece, for example, a chip capacitor, a chip varistor, a chip resistor, a chip inductor, a chip antenna, a chip component made of ceramic such as a chip EMI filter, and an FPCB. It is used not only in a compression molding process performed when manufacturing a substrate such as a PCB, but also in various fields in which a powder material is compression molded.

  As shown in FIGS. 2 and 3, the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention may include a pressure vessel 110. The pressure vessel 110 is formed in a hollow cylindrical shape and accommodates a workpiece to be molded with isotropic pressure.

  On the other hand, the accommodating groove 111 of the pressure vessel 110 is filled with a pressurizing medium that pressurizes the workpiece with isotropic pressure, and an upper cap 113 and a lower cap 115 are coupled to the open upper and lower portions of the pressure vessel 110. The pressure vessel 110 is sealed.

  Here, the pressure of the pressurizing medium filled in the accommodation groove 111 is several tens bar to several thousand bar, and isotropic pressure compression molding is performed by the pressure of the pressurizing medium.

  In the structure in which the upper cap 113 and the lower cap 115 of the pressure vessel 110 are coupled, for example, the upper cap 113 that seals the upper portion of the pressure vessel 110 and the lower cap 115 that seals the lower portion of the pressure vessel 110 include: A structure in which a screw thread is formed in the periphery and the screw thread is tightened and coupled to the pressure vessel 110, a structure that is coupled to each other by a bolt, a structure that is coupled to each other in a form in which a pin penetrates, and a structure that is coupled by a jig The upper cap 113 and the lower cap 115 are coupled to each other by a structure that is sandwiched between frames so as not to be detached from the pressure vessel 110.

  Here, the structure in which the upper cap 113 and the lower cap 115 of the pressure vessel 110 are coupled is not limited to these because various known methods are used.

  In addition, a medium supply port for supplying a pressurized medium to the accommodation groove 111 of the pressure vessel 110 is formed in one of the upper cap 113 and the lower cap 115, and the supplied pressurized medium is provided outside. A medium discharge port for discharging may be formed, and both the medium supply port and the medium discharge port may be formed in one of the upper cap 113 and the lower cap 115.

  In addition, a shelf 114 on which an object to be stored is seated is provided on one of the upper cap 113 and the lower cap 115. The shelf 114 is connected to the upper cap 113 or the lower cap 115 that opens the pressure vessel, and is exposed to the outside from the pressure vessel 110 together with the upper cap 113 or the lower cap 115 when the upper cap 113 or the lower cap 115 is opened.

  An isotropic pressure pressing apparatus 100 according to an embodiment of the present invention includes a pressurized medium supply mechanism 130.

  The pressurizing medium supply mechanism 130 supplies a pressurizing medium that pressurizes the workpiece to the accommodation groove 111 of the pressure vessel 110.

  On the other hand, the pressurized medium supply mechanism 130 supplies the pressurized medium stored in the pressurized medium storage tank 131 from the medium supply port formed in the upper cap 113 or the lower cap 115 to the receiving groove 111, The supply mechanism 130 can include a pressurizing pump 133.

  The pressurizing pump 133 pressurizes the pressurizing medium with a high pressure and supplies the pressurized medium to the accommodation groove 111.

  Here, the pressurizing medium may be a fluid or a gas such as water or oil, but it is usually most preferable to be a fluid water, and the water is rapidly heated or cooled, or the pressure is applied. Other ingredients than water may be included to increase.

  Further, the pressurized medium supply mechanism 130 can include a pressurizing pump 133 and a medium supply line 135.

  The pressurizing pump 133 can supply the pressurized medium with an increased pressure, and the medium supply line 135 increases the pressure of the fluid in the pressurizing pump 133 and supplies the fluid to the receiving groove 111.

  In this embodiment, the medium supply line 135 is installed in the lower 4 cap 115, and the pressurization medium is supplied to the receiving groove 111 in a state where the lower cap 115 seals the receiving groove 111. The line 135 may be connected to the pressure vessel 110 or the upper cap 113 to supply the pressurized medium to the receiving groove 111.

  In addition, a check valve can be provided in the medium supply line 135, and the check valve can supply the pressurized medium to the accommodation groove 111 or can block the supply of the pressurized medium.

  The isotropic pressure press device 100 according to the embodiment of the present invention may have a drive mechanism (not shown).

  This drive mechanism moves the upper cap 113 or the lower cap 115 to the upper or lower portion of the pressure vessel 110 in order to carry the workpiece into the pressure vessel 110 or to carry out the workpiece that has been compression-molded with isotropic pressure. Move and open or seal pressure vessel 110.

  Further, the drive mechanism moves the pressure vessel 110 left and right or up and down with the upper cap 113 and the lower cap 115 opening the accommodation groove 111 so that the workpiece can be easily carried out and carried in. Composed.

  Meanwhile, the drive mechanism may be implemented by a hydraulic or pneumatic cylinder.

  As shown in FIGS. 5 and 6, the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention includes a heat exchanger 200.

  The heat exchanger 200 can heat or cool the pressurized medium filled in the accommodation groove 111, and the heat exchanger 200 can have a heat exchange member 210.

  The heat exchange member 210 is provided inside the accommodation groove 111, and can directly heat or cool the pressurized medium filled in the accommodation groove 111, and a plurality of heat exchange members 210 may be provided inside the accommodation groove 111. Good.

  On the other hand, the heat exchange member 210 may be configured to include a cooling member and a heating member.

  That is, the heat exchange member 210 is divided into a cooling member and a heating member, the cooling member cools the pressurized medium filled in the accommodation groove 111, and the heating member heats the pressurized medium filled in the accommodation groove 111. Each can also be configured as follows.

  Here, the heating member may be implemented by a heater that is heated by electricity, and the cooling member may be implemented by a cooling sink or an evaporator that absorbs heat.

  In addition, the heat exchange member 210 may be embodied as a Peltier module that electrically cools one surface and heats the other surface.

  Further, as in the embodiment, the heat exchange member 210 is configured such that a heat medium that is a fluid or a gas cools or heats the pressurized medium via the heat exchange member 210 while passing through the heat exchange member 210. May be.

  At this time, the heat exchange member 210 is formed with an inflow port 211 through which the heat medium flows and an exhaust port 212 through which the heat medium is discharged. The inflow port 211 and the exhaust port 212 pass through the heat exchange member 210 in a zigzag manner. The heat medium that is connected to each other through the fine flow path 213 and flows into the inflow port 211 circulates through the heat exchange member 210 as a whole through the fine flow path 213 and is discharged from the discharge port 212.

  Here, the heat exchange member 210 may be in a form in which two plates having a fine channel 213, an inflow port 211, and a discharge port 212 formed on one surface are bonded together, When isotropic pressure compression molding is performed with a pressurized medium, the sheet is formed in various depths and shapes depending on the thickness of the plate so as not to collapse.

  Further, the heat exchanging member 210 may be formed in a plate shape or may be formed in a cylindrical shape as shown in FIG. 7 in order to minimize the volume occupied in the receiving groove 111. In this case, the fine channel 213 is formed in a spiral shape inside.

  Moreover, as shown in FIG. 8, the heat exchange member 210 may be formed by bending a pipe in a spiral shape.

  In addition, the heat exchange member 210 has a plurality of through holes 214 so that the pressurized medium accommodated in the accommodation groove 111 freely moves through the heat exchange member 210 and has a large contact area. Although not shown, a plurality of protrusions may be provided to increase the contact area.

  Further, the heat exchange member 210 is provided with a temperature sensor 215 for measuring the temperature of the pressurized medium.

  On the other hand, the heat exchange member 210 may be installed in one or both of the upper cap 113 and the lower cap 115, and the heat exchange member 210 provided in the upper cap 113 or the lower cap 115 is electrically heated. A heater is preferred.

  The heat exchanger 200 can have a heat medium storage tank 280. The heat medium storage tank 280 accommodates a heat medium that should exchange heat with the pressurized medium via the heat exchange member 210.

  In addition, the heat exchanger 200 can include a heating unit 220 and a cooling unit 230. The heating unit 220 and the cooling unit 230 may be supplied with the heat medium stored in the heat medium storage tank 280 to be heated or cooled.

  That is, the heating unit 220 can heat the heat medium stored in the heat medium storage tank 280, and the cooling unit 230 can cool the heat medium stored in the heat medium storage tank 280.

  The heating unit 220 can be configured to include a heater 221 that is heated by electricity or heated by a heat medium, and the cooling unit 230 can be configured to include a cooling unit 231 that is cooled by a refrigerant. At this time, the cooling unit 231 is implemented by an evaporator or a cooling sink, and the cooling unit 230 is implemented by a chiller that circulates and cools a general refrigerant.

  In addition, when the heat exchange member 210 is divided into a cooling member and a heating member, the heating unit 220 is connected to the heating member, the cooling unit 230 is connected to the cooling member, and is cooled by the cooling unit 230. The heat medium may be configured to cool the pressure medium via the cooling member, and the heat medium heated by the heating unit 220 may be configured to heat the pressure medium via the heating member.

  In addition, the heat exchanger 200 can have a selective supply unit 240.

  The selective supply unit 240 can selectively supply the heat medium stored in the heat medium storage tank 280 from the cooling unit 230 to the heat exchange member 210 or supply the heat medium from the heating unit 220 to the heat exchange member 210. .

  Here, the selective supply unit 240 is implemented by an electromagnetic valve that supplies and blocks the heat medium from the cooling unit 230 or the heating unit 220 to the heat exchange member 210.

  Further, the selective supply unit 240 has a supply pump 250. The supply pump 250 supplies the heat medium stored in the heat medium storage tank 280 to the heat exchange member 210 via the cooling unit 230 or the heating unit 220, and again supplies the heat medium supplied to the heat exchange member 210 to the heat medium. The heat medium is circulated so as to be stored in the storage tank 280.

  Here, the heat medium may be a fluid or a gas, but is preferably fluid water. When the heat medium is water, other additives are added so that heat exchange can be performed quickly. It may be mixed.

  The heat exchanger 200 configured as described above is stored in the heat medium storage tank 280 when the selective supply unit 240 is selected to heat the pressurized medium stored in the storage groove 111. Is supplied to the heating unit 220 and supplied to the heat exchange member 210 in a state in which the heat medium is heated, or when the pressurized medium is selected to be cooled, the heat stored in the heat medium storage tank 280 is stored. By supplying the medium to the cooling unit 230 and supplying the heat medium to the heat exchange member 210 in a cooled state, the pressurized medium can be cooled or heated in a short time.

  The isotropic pressure pressing apparatus 100 according to the embodiment of the present invention may include a heat insulating material 300. The heat insulating material 300 is provided on the inner surface of the housing groove 111 and prevents heat from the heat exchange member 210 from being transmitted to the pressure vessel 110.

  That is, the heat insulating material 300 insulates heat from leaking outside the housing groove 111 by heat-insulating the heat exchange member 210 so as to exchange heat only with the pressurized medium housed in the housing groove 111.

  Further, not only the inside of the pressure vessel 110 but also the upper cap 113 and the lower cap 115 that seal the housing groove 111 may be provided.

  Further, the heat insulating material 300 may be formed by including any one of Teflon (registered trademark), a resin such as polyimide, and a ceramic having a high hardness and a high thermal barrier rate in order to withstand the high pressure of the pressurized medium. It may be formed of only one material.

  Next, operations and effects between the above-described components will be described.

  In the isotropic pressure press device 100 according to the embodiment of the present invention, the heat exchange member 210 is provided in the accommodation groove 111 of the pressure vessel 110, and the heat insulating material 300 is provided in the accommodation groove 111. Is prevented from being transmitted to the outside of the pressure vessel 110.

  In addition, the heat exchange member 210 is positioned outside the pressure vessel 110 so that the heat medium cooled or heated by the cooling unit 230 or the heating unit 220 is supplied to the inlet 211 of the heat exchange member 210. The unit 230 and the heating unit 220 are connected to each other through the heat medium supply pipe 260.

  Here, although the drawing shows that the heat exchange member 210 is connected to the heat exchange member 210 from the upper cap 113, the heat exchange medium 210 is supplied to the heat exchange member 210 from the side surface of the lower cap 115 or the pressure vessel 110. It may be configured to supply.

  The heat exchange member 210 is connected to the heat medium storage tank at the discharge port 212 of the heat exchange member 210 so that the heat medium circulated through the fine flow path 213 of the heat exchange member 210 is discharged to the heat medium storage tank 280. 280 and the heat medium discharge pipe 270 are connected to each other.

  Further, the heating unit 220 and the cooling unit 230 are provided with a selective supply unit 240, which can selectively supply the heat medium heated by the heating unit 220 or the heat medium cooled by the cooling unit 230 to the heat exchange member 210. Configured.

  On the other hand, the pressure vessel 110 is inserted into the insertion port of the frame, and the drive mechanism is installed in the frame so that the upper cap 113 or the lower cap 115 is moved by the drive mechanism and the accommodation groove 111 of the pressure vessel 110 is opened or sealed. Alternatively, the pressure vessel 110 may be provided.

  Further, the lower cap 115 of the pressure vessel 110 is connected to a pressurized medium supply mechanism 130 that supplies a pressurized medium to the accommodating groove 111 when the accommodating groove 111 is sealed.

  In order to perform isotropic pressure compression molding, the isotropic pressure press apparatus 100 configured as described above first uses an upper cap 113 or a lower portion using a drive mechanism to carry a workpiece into the receiving groove 111. The cap 115 is moved and the pressure vessel 110 is opened.

  In addition, the work piece is carried into the opened accommodation groove 111. At this time, when the shelf 114 is provided on the upper cap 113 or the lower cap 115, the work piece is seated on the shelf 114, The upper cap 113 or the lower cap 115 is moved again using the drive mechanism so as to seal the housing groove 111, and the pressurized medium is supplied into the housing groove 111 by the pressurized medium supply mechanism 130, so that the isotropic pressure is increased. Perform compression molding.

  On the other hand, when it is necessary to heat the workpiece to an arbitrary temperature or more during the isotropic pressure compression molding, for example, when firing the workpiece while maintaining the applied pressure, the heat medium storage tank The heat medium stored in 280 is heated by the heating unit 220, supplied to the heat exchange member 210, and the workpiece is heated at an arbitrary temperature by heat exchange between the heat exchange member 210 and the pressure medium.

  At this time, even if the heat medium is water, since the pressure of the accommodation groove 111 is high, the boiling point of water becomes high, the pressure medium can be heated to 100 ° C. or more, and the temperature of the pressure medium is measured by the temperature sensor. 215 can be measured and kept uniform.

  Also, when it is necessary to cool the work piece to an arbitrary temperature or less during the isotropic pressure compression molding, for example, when curing the work piece in a state where the pressure is maintained, the heat medium storage tank The heat medium stored in 280 is cooled by the cooling unit 230, supplied to the heat exchange member 210, and heat exchange between the heat exchange member 210 and the pressure medium cools the workpiece to an arbitrary temperature or lower. be able to.

  Also at this time, the temperature sensor 215 measures the temperature of the pressurized medium to be cooled, and can be cooled while maintaining a uniform temperature.

  In addition, when the isotropic compression molding is completed, using the drive mechanism, the upper cap 113 or the lower cap 115 of the pressure vessel 110 is opened, and the pressurized medium filled in the accommodation groove 111 is discharged to the outside. Alternatively, the isotropic compression molding operation is completed in such a manner that the workpieces recovered by the pressurized medium supply mechanism 130 and seated on the shelf 114 of the upper cap 113 or the lower cap 115 are carried out.

  Therefore, the isotropic pressure press device 100 according to the embodiment of the present invention can directly heat or cool the pressurizing medium that applies pressure to the workpiece with the isotropic pressure by the heat exchanger 200. The workpiece can be heated or cooled to minimize compression molding time and heat loss.

  Further, since the workpiece is directly heated or cooled by the pressurized medium, the workpiece can be heated or cooled at a uniform temperature.

  Further, by heating or cooling the workpiece while maintaining the pressure, a workpiece having a dense structure can be obtained, and the defect rate of the workpiece can be minimized.

  In addition, a heat insulating material is provided inside the pressure vessel 110 to prevent the heat in the inside from being transmitted to the pressure vessel 110, thereby preventing damage to the packing, preventing pressure loss, and improving airtightness. Can do.

  Hereinafter, a method for manufacturing a chip component using the above-described isotropic pressure pressing apparatus 100 according to an embodiment of the present invention will be described.

  The chip part manufacturing method according to this embodiment will be described as using the above-described isotropic pressure press device 100 according to the embodiment of the present invention. As long as the exchanger 200 is provided, any can be applied.

  First, the chip component may go through a semi-finished product forming stage before the chip component is carried into the isotropic pressure press device 100 according to the embodiment of the present invention.

  In this semi-finished product molding stage, a solvent, binder, etc. are mixed with the powder to produce a slurry with high moldability. This slurry is formed into a sheet and laminated together with the electrode, or molded into an arbitrary shape. Thus, the semi-finished product can be formed in the form of forming the electrode.

  For example, in the case of chip capacitors and chip varistors among chip components, a slurry is manufactured in a sheet shape, and a semi-finished product is formed by alternately laminating electrodes and sheets. Different semi-finished products can be formed for each chip component, for example, by laminating sheets having a magnetic pattern formed in a shape.

  On the other hand, in the semi-finished product forming stage, the powder may be ceramic powder or metal powder, and polymer powder such as polyimide or epoxy is mixed with ceramic powder or metal powder, or ceramic powder, metal powder, polymer resin is mixed. Mixing together may produce a slurry that does not require a binder.

  Here, when molding a semi-finished product with a slurry containing a binder, it is necessary to perform a burnout process to remove the binder, but when molding a semi-finished product with a slurry that does not require a binder including a polymer resin, There is no need to perform a burnout process. Therefore, in this invention, it is preferable to shape | mold a semi-finished product with the slurry containing the polymer resin which does not perform a burnout process.

  Thus, when the semi-finished product for manufacturing a chip component is shape | molded, it compresses using the isostatic press apparatus 100 by the Example of this invention as follows.

  As shown in FIG. 9, the chip part manufacturing method using the isotropic pressure apparatus 100 according to the embodiment of the present invention may include a step (S10) of carrying in a chip part as a workpiece.

  In the step of carrying in the chip parts (S100), the chip parts are carried into the receiving grooves 111 of the isotropic pressure press device 100 in order to compress and mold the semi-finished product formed in the semi-finished product forming stage.

  At this time, in order to load the chip component into the receiving groove 111, the chip component can be transferred into the receiving groove 111 with the upper cap 113 or the lower cap 115 of the pressure vessel 110 opened, and the chip component is stored in the receiving groove 111. In order to be easily seated and transported to 111, the chip component is carried into the receiving groove 111 in a state where it is seated on a shelf coupled to the upper cap 113 or the lower cap 115.

  When the chip component is received in the receiving groove 111, the upper cap 113 or the lower cap 115 is closed to seal the pressure vessel 110.

  The chip part manufacturing method using the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention may include a step (S20) of performing isotropic pressure compression molding of the chip part.

  In the step of performing isotropic pressure compression molding of the chip part (S20), a pressurized medium is supplied to the receiving groove 111 by the pressurized medium supply mechanism 130, and isotropic pressure is applied to the chip part carried into the receiving groove 111. Perform compression molding.

  At this time, the isotropic pressure compression molding is to supply the pressurized medium to the receiving groove 111 with a preset pressure and perform the isotropic pressure compression molding for a preset time.

  The chip part manufacturing method using the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention may include a step (S30) of heating the heat exchange member 210 that exchanges heat with the pressurized medium.

  In the step of heating the heat exchange member 210 that exchanges heat with the pressure medium (S30), the pressure medium can be heated by heating the heat exchange member 210. That is, the pressure medium can be heated in order to perform firing on the chip component.

  Here, in the step of heating the heat exchanging member 210 that exchanges heat with the pressurized medium (S30), the pressurized medium is supplied to the receiving groove 111, and isotropic pressure compression to the chip component for a preset time. The pressurizing medium can be heated in a state where the pressurizing force of the pressurizing medium is maintained after the molding is completed or during the isotropic pressure compression molding.

  On the other hand, the heat medium heated by the heating unit 220 of the heat exchanger 200 is supplied to the heat exchange member 210 and the heat exchange member 210 heated by the heat medium exchanges heat with the pressure medium. The heating medium can be heated.

  At this time, the pressurized medium is heated during a preset time while maintaining a preset temperature by the temperature sensor 215 provided in the heat exchange member 210.

  The chip component manufacturing method using the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention may include a step of cooling the heat exchange member 210 that exchanges heat with the pressurized medium (S40).

  In the step of cooling the heat exchange member 210 that exchanges heat with the pressurized medium (S40), the chip component can be cooled in the form of cooling the pressurized medium in order to cure the chip component.

  For example, if the chip component is cooled in a heated state, a chip component having a dense structure can be produced. At this stage, the chip component that has been baked using a pressure medium is cooled in a form that is cooled. Done.

  Here, the step of cooling the heat exchange member 210 that exchanges heat with the pressurized medium may be performed after the step of heating the heat exchange member 210 that exchanges heat with the pressurized medium, or It may be performed before the step of heating the heat exchange member 210 to exchange heat.

  On the other hand, the step (S40) of cooling the heat exchange member 210 that exchanges heat with the pressurized medium is performed for a preset time while maintaining a preset temperature by the temperature sensor 215 provided in the heat exchange member 210. Between.

  When the pressurized medium is cooled, the cooling medium 230 of the heat exchanger 200 cools the heated medium, the cooled heat medium is supplied to the heat exchange member 210, and finally the heat exchange member 210 is pressurized. It can comprise so that it may cool by exchanging heat with a medium.

  The chip component manufacturing method using the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention may include a step of discharging the pressurized medium supplied to the receiving groove 111 from the receiving groove 111 (S50).

  The step of discharging the pressurized medium supplied to the receiving groove 111 from the receiving groove 111 is to press the pressure medium filled in the receiving groove 111 in order to carry out the isotropic pressure compression molded chip parts in the receiving groove 111. Is discharged to the outside of the pressure vessel 110.

  Meanwhile, in the step of discharging the pressurized medium supplied to the storage groove 111 from the storage groove 111 (S50), the upper cap 113 or the lower cap 115 that seals the lower portion of the pressure vessel 110 is moved from the pressure vessel 110 by the drive mechanism. Alternatively, the pressurized medium accommodated in the accommodation groove 111 can be discharged from the accommodation groove 111 in a form in which the pressurized medium is recovered again by the pressurized medium supply mechanism 130.

  The chip component manufacturing method using the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention may include a step (S60) of unloading the chip component accommodated in the accommodating groove 111.

  The step (S60) of unloading the chip component housed in the housing groove 111 is a step of unloading the chip component that has undergone the isotropic pressure compression molding from the isotropic pressure press device 100 for the next process.

  On the other hand, in order to carry out the chip component housed in the housing groove 111, the lower cap 115 or the upper cap 113 that seals the pressure vessel 110 is moved by the driving mechanism, and the chip component is opened in the state where the housing groove 111 is opened. Take it out.

  Thus, the chip parts carried out from the isotropic pressure pressing apparatus 100 are easily mounted on the circuit board in a state where the chip parts are cut to a size suitable for the application and polished so that the stacked electrodes are exposed to the outside. Thus, the production of the chip part is completed by forming the external electrode.

  At this time, the external electrode is formed of tin, nickel tin, or the like by electroplating, and the chip part can be manufactured through different processes after unloading from the isotropic pressure press device 100 according to the type of the chip part. it can.

  Accordingly, the chip part manufacturing method using the isotropic pressure pressing apparatus 100 according to the embodiment of the present invention is to perform firing and curing on the chip part together in the isotropic pressure pressing apparatus 100 that performs isotropic pressure compression molding. Therefore, it is possible to manufacture a chip component having a dense structure and minimize the defect rate of the chip component.

  Further, since it is not necessary to provide other production equipment for firing and curing the chip component, the production cost of the chip component can be reduced.

  Further, since the chip component is directly heated or cooled by the pressurizing medium, the chip component manufacturing time can be shortened by heating or cooling the chip component in a short time.

  Although the embodiment of the present invention has been described above, the scope of the right of the present invention is not limited to this. The embodiment of the present invention can be easily used by those having ordinary knowledge in the technical field to which the present invention belongs. And includes all changes and modifications to the extent permitted to be equivalent.

  Used in industrial fields such as semiconductor manufacturing, ceramic processing and compression molding.

DESCRIPTION OF SYMBOLS 100 Isostatic press apparatus 110 Pressure vessel 111 Accommodating groove 113 Upper cap 114 Shelf 115 Lower cap 130 Pressurized medium supply mechanism 131 Pressurized medium storage tank 133 Pressurized pump 135 Medium supply line 200 Heat exchanger 210 Heat exchange member 211 Flow Inlet 212 Discharge port 213 Micro flow path 214 Through hole 215 Temperature sensor 220 Heating unit 221 Heater 230 Cooling unit 231 Cooling unit 240 Selective supply unit 250 Supply pump 260 Heat medium supply pipe 270 Heat medium discharge pipe 280 Heat medium storage tank 300 Insulating material

Claims (20)

In the isotropic pressure press apparatus, the accommodating groove for accommodating the workpiece that is a chip part is formed, the accommodating groove is filled with a pressure medium, and the pressure vessel pressurizes the workpiece with isotropic pressure. provided receiving groove, so as to heat or cool the supplied pressure medium to the receiving groove, Rutotomoni comprises a heat exchanger having a heat exchange member for heat exchange by the pressurizing medium and the heating medium, the pressure In the configuration comprising an upper cap and a lower cap that seal the upper and lower portions of the container, respectively .
The heat exchanger selectively supplies, to the heat exchange member, a heating unit that heats the heat medium, a cooling unit that cools the heat medium, and a heat medium that is heated or cooled by the heating unit and the cooling unit. Having a selective supply unit to
The heat exchange member has a plate shape, and the plate shape has an inflow port through which the heat medium flows in, an exhaust port through which the heat medium flowing into the inflow port is discharged, and a zigzag inside the plate shape. In order to circulate, it comprises a fine channel connecting the inlet and the outlet,
The isotropic pressure press device , wherein the heat exchange member is installed on at least one of the upper cap and the lower cap .   The heat exchange member has a plurality of through holes penetrating the heat exchange member so that a contact area with the pressurized medium is widened, or a plurality of protrusions protruding from an outer surface of the heat exchange member. The isotropic pressure pressing device according to claim 1, comprising:   The isotropic pressure press apparatus according to claim 2, wherein the heat exchanger has a heat medium storage tank for storing the heat medium.   The isotropic pressure pressing apparatus according to claim 2, wherein the heat medium includes water.   The isotropic pressure pressing apparatus according to claim 1, wherein the heat exchange member includes a heater that is heated by electricity.   The isotropic pressure pressing apparatus according to claim 1, wherein the heat exchange member includes a cooling unit cooled by a refrigerant.   The isotropic pressure pressing apparatus according to claim 1, further comprising a heat insulating material provided on an inner surface of the housing groove and preventing heat of the heat exchange member from being transmitted to the outside of the housing groove. The isotropic pressure pressing apparatus according to claim 7 , wherein the heat insulating material includes one of resin and ceramic.   The isotropic pressure pressing apparatus according to claim 1, wherein the pressure vessel includes a heater that is provided on one or both of the upper cap and the lower cap and that heats the pressurizing medium.   2. The isotropic pressure pressing apparatus according to claim 1, wherein the pressure vessel includes a shelf that is coupled to one of the upper cap and the lower cap and on which a workpiece is seated. An accommodation groove for accommodating a chip component is formed, and the accommodation groove is filled with a pressurizing medium, and a pressure vessel that pressurizes the chip component with an isotropic pressure, and provided in the accommodation groove and supplied to the accommodation groove A heat exchanger having a heat exchange member for exchanging heat with the pressurized medium and the heat medium so as to heat or cool the pressurized medium, and an upper cap and a lower cap for sealing the upper and lower portions of the pressure vessel, respectively. Prepared ,
The heat exchanger selectively supplies, to the heat exchange member, a heating unit that heats the heat medium, a cooling unit that cools the heat medium, and a heat medium that is heated or cooled by the heating unit and the cooling unit. Having a selective supply unit to
The heat exchange member has a plate shape, and the plate shape has an inflow port through which the heat medium flows in, an exhaust port through which the heat medium flowing into the inflow port is discharged, and a zigzag inside the plate shape. In order to circulate, it comprises a fine channel connecting the inlet and the outlet,
The heat exchanging member is a chip part manufacturing method using an isotropic pressure pressing device installed on at least one of the upper cap or the lower cap ,
In the stage of carrying the chip component into the housing groove, supplying the pressurizing medium to the housing groove and performing isotropic pressure compression molding of the chip component, and maintaining the pressure by the pressurizing medium, Heating the heat exchange member for exchanging heat with the pressurized medium such that the chip component is heated, discharging the pressurized medium supplied to the receiving groove from the receiving groove, Unloading the chip component accommodated in the accommodation groove,
Before or after the step of heating the heat exchange member for exchanging heat with the pressure medium, the pressure medium and the heat are heated so that the chip component is cooled in a state where the pressure is maintained by the pressure medium. A method of manufacturing a chip component using an isotropic pressure pressing device, comprising the step of cooling the heat exchange member to be replaced . The method of manufacturing a chip part using the isotropic pressure press according to claim 11 , wherein the heat exchanger has a heat medium storage tank for storing the heat medium. The method for manufacturing a chip part using the isotropic pressure press according to claim 11 , wherein the heat medium contains water. The method of manufacturing a chip part using the isotropic pressure press according to claim 11 , wherein the heat exchange member includes a heater heated by electricity. The method of manufacturing a chip part using the isotropic pressure press according to claim 11 , wherein the heat exchange member includes a cooling unit cooled by a refrigerant. The heat exchange member has a plurality of through holes penetrating the heat exchange member so that a contact area with the pressurized medium is widened, or a plurality of protrusions protruding from an outer surface of the heat exchange member The chip part manufacturing method using the isotropic pressure press according to claim 11 . The isotropic pressure press device according to claim 11 , further comprising a heat insulating material provided on an inner surface of the housing groove and preventing heat of the heat exchange member from being transmitted to the outside of the housing groove. Manufacturing method of chip parts used. The method of manufacturing a chip part using the isotropic pressure press according to claim 17 , wherein the heat insulating material includes one of resin and ceramic. The isotropic pressure press apparatus according to claim 11 , wherein the pressure vessel includes a heater that is provided on one or both of the upper cap and the lower cap and that heats the pressure medium. Manufacturing method for chip parts. The isotropic pressure press apparatus according to claim 11 , wherein the pressure vessel includes a shelf that is coupled to one of the upper cap and the lower cap and on which a workpiece is seated. Chip part manufacturing method.

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