KR102040580B1 - Adhesive unit having uniform flatness and manufacturing method thereof, Heat exchanger using adhesive unit having uniform flatness and method of manufacturing the same - Google Patents

Abstract

The present invention adheres to the same plane by fixing the heat-conducting device and the heat-transfer block in close contact with the heat-conducting heat-curing adhesive to form a single part, and processing the surface of the heat-transfer block so that the thickness of the adhesive is consistent, thereby making the flatness uniform. When assembling a plurality of water, the flatness is matched by a certain thickness, eliminating the process of adjusting the flatness in the assembly process, and assembling is simplified. Also, when the heat exchanger is manufactured using this adhesive, the housing and the screw are not used. By fixing the adhesive in a non-conductive state, not only can the assembly work be reduced, but also the thickness of the contact surface of the conventional heat sink, which was inevitably thicker than necessary to secure the screw fastening place, increases the heat transfer efficiency, and furthermore, in case of failure of the thermal semiconductor element. Replace the adhesive to simply match flatness Heat exchanger using an adhesive having a uniform flatness and a manufacturing method thereof and an adhesive having a uniform flatness to solve the conventional inconvenience of having to perform the process of matching the flatness again in the process of furnace replacement and the manufacture thereof It is about a method.

Description

Thermoelectric semiconductor device adhesive and its manufacturing method with uniform flatness, heat exchanger using thermal semiconductor device adhesive with uniform flatness and manufacturing method thereof [Adhesive unit having uniform flatness and manufacturing method etc, Heat exchanger using adhesive unit having uniform flatness and method of manufacturing the same}

The present invention relates to a heat exchanger, and more particularly, a heat conductive block and a heat transfer block in close contact with it are fixed by a heat conduction heat curing adhesive to form a single part, and the surface of the heat transfer block is processed to have a uniform thickness of the adhesive. By uniformizing the drawings, when assembling a plurality of adhesives on the same plane, the flatness is matched by a constant thickness, thus eliminating the process of matching the flatness pointed out as a conventional problem in the assembly process, and simplifying the assembly. When manufacturing the heat exchanger by using an adhesive, fixing the adhesive without the housing and the screw not only reduces the assembly work, but also the thickness of the contact surface of the conventional heat sink, which was inevitably thicker than necessary to secure the screw fastening place. Thin construction improves heat transfer efficiency, furthermore heat transfer When the conductor element breaks down, the adhesive is replaced to simply match the flatness so that the flatness can be eliminated, and the manufacturing method of the flatness can be eliminated. The present invention relates to a heat exchanger using an adhesive having a uniform flatness and a method of manufacturing the same.

The heat exchanger is a type of air conditioner that cools or heats a heat exchange target to be heat exchanged using a heat exchange medium. The present invention uses a thermoelectric semiconductor device as a heat exchange medium.

The thermoelectric semiconductor element is an element that enables an environmentally friendly cooling method that deviates from the existing cooling system using a compressor to circulate the refrigerant. Both sides of the thin plate made of a small ceramic material provide cooling and heat dissipation through electrode switching. It is a component that performs at the same time, and forms a unit together with the heat transfer block in close contact with it and is currently widely used in the heat exchange industry.

The thermoelectric semiconductor device is formed in a thin plate shape, and when power is supplied, one side is cooled and the other side is necessarily radiated so that the cooling state can be continuously maintained. Therefore, the lower the temperature of the heat dissipation surface, the lower the temperature of the cooling surface, and the cooling efficiency is good.

Therefore, the heat exchanger using the thermoelectric semiconductor element is to cool the heat dissipation surface of the thermoelectric semiconductor element as much as possible to reduce the temperature of the heat dissipation surface by the cooling means like the heat sink for this purpose.

Next, look at the technology of the heat exchanger using a conventional thermoelectric semiconductor device.

There is a cooling device using a thermoelectric device of Publication No. 10-2006-0100882 (published on September 21, 2006). This technique is based on the base plate 10, the thermoelectric element 20, which is attached to the upper surface of the base plate 10 by the grease, the upper portion of the thermoelectric element 20 as can be seen in Figures 1 to 4 Cooling block 30 attached to the surface by grease, the case 40 coupled to the cooling block 30 and the base plate 10, and the cooling block 30 and the base plate coupled to the case 40 An airtight member 50 for sealing the space between the two is included.

In this technique, when power is supplied to the thermoelectric element 20, the thermoelectric element 20 cools the cooling block 30 in which one side is cooled and is in close contact with the thermoelectric element 20, and the other side is radiated in close contact with it. The base plate 10 which is in contact is heated. Therefore, the cooling block 30 always performs the original purpose of cooling the heat exchange object in close contact with the cooling state, and the base plate 10 is fixed to a heat sink (not shown) provided separately to dissipate heat. Will perform.

The heat exchange device is a thermoelectric component that is an independent component because the case 40 is fastened and fixed to the base plate 10 using a screw in a state in which the thermoelectric element 20 and the cooling block 30 are accommodated in the case 40. In order to fix the device 20 and the cooling block 30, the case 40 and the screw must be used.

However, since the case 40 has a considerable width along the outer circumference of the case 40 so as to surround the thermoelectric element 20 and the cooling block 30, the case 40 is bulky and a screw is fastened to the extension 40. Since the ball 41 is formed, the structure is complicated, and when the thermoelectric elements 20 are densely arranged in order to increase the heat exchange performance, the case 40 interferes and the limits of the thermoelectric elements 20 are densely arranged. there was.

In addition, since the case 40 is fixed to the base plate 10 by a screw, the base plate 10 has a problem that the screw should have a sufficient thickness so that the screw can be securely fastened. More specifically, the base plate 10 is fixed to a heat sink provided separately to perform heat dissipation, and if its thickness is thicker than necessary, the heat transfer to the heat sink is delayed by the heat dissipation efficiency and the heat dissipation efficiency is lowered. If it is low, there is a problem that the cooling performance of the heat exchanger is reduced in the end.

The above-mentioned problem occurs because the thermoelectric element 20 and the cooling block 30 are simply stacked, and the case 40 accommodating them is fixed with a screw. That is, since the thermoelectric element 20 and the cooling block 30 to be closely adhered to each other are simply stacked and fixedly fixed to the case 40, the cost increase and the inconvenience of assembly due to the use of the case 40 cannot be avoided. In particular, in order to increase the thermal conductivity, the thermoelectric element 20 and the cooling block 30 should be closely adhered to each other. Since they simply remain stacked, fine pores (pores due to the roughness of the contact surface) are formed between their contact surfaces, thereby making intimate contact. If the cooling efficiency is not good problem occurs.

In particular, the thermoelectric device uses an adhesive inside the manufacturing process, since the thickness varies depending on the amount of adhesive used, the thermoelectric device made by all manufacturers has an allowance for use. That is, even in the case of thermoelectric devices manufactured under the same conditions, the thickness of each of the thermoelectric elements may be different depending on the use of the adhesive.

Therefore, when a plurality of cases 40, which are stacked and accommodated with the thermoelectric element 20 and the cooling block 30, are installed on the same plane, a plurality of cases 40 are stacked in each case 40 to cool the object. Since the thickness and flatness of the case 20 are different from each other in the stack of the case 40, the base plate 10 and the cooling block 30 in contact with the thick thermoelectric element 20 closely contact the heat sink and the object in contact with them. The base plate 10 and the cooling block 30 which are in contact with the thin thermoelectric element 20 are not in contact with the heat sink and the object to be in contact with them, or are in intimate contact with each other, resulting in low cooling efficiency. Could not be avoided.

That is, since the thermoelectric elements 20 accommodated in each case 40 do not coincide in thickness and flatness, only the base plate 10 and the cooling block 30 stacked with the thick thermoelectric element 20 are in contact with the heat sink and the object. There was a serious problem.

In addition, as another conventional technology, a thermoelectric semiconductor device unit of Patent Application No. 10-2010-0004145 (November 03, 2010) and a manufacturing method thereof have been disclosed. In the case of this technique, the housing 20 is formed by using a screw in a state in which the thermoelectric semiconductor element 30 and the first and second blocks 40 and 50, which are independent components, are stored inside the housing 20. It fixed to the heat sink H as follows.

Therefore, in order to fix the thermoelectric semiconductor device 30 and the first and second blocks 40 and 50 to the heat dissipation plate H, the housing 20 and the screw must be used. And it has the problem that the fastening portion of the heat sink (H) need to be unnecessarily thick in order to secure the thickness that the screw is securely fastened.

In addition, a plurality of housings 20 in which the thermoelectric semiconductor elements 30 and the first and second blocks 40 and 50 are accommodated are installed on the same plane to cool the target object, and thus, are stacked inside the housing 20. Since the thickness and flatness of the thermoelectric semiconductor device 30 are different from each other, a serious problem of the conventional art in which only the first and second blocks 40 and 50 stacked with the thick thermoelectric semiconductor device 30 are in contact with the heat sink and the target is still avoided. Could not.

In the related art, a thermoelectric semiconductor device unit of Patent Application No. 10-2009-0058735 (September 28, 2010) and a manufacturing method thereof are disclosed. This technique is similar to the technique described in Patent Application No. 10-2010-0004145 already described, and the problems caused by the use of the housing and the screw described above, and when the plurality of housings 20 are used in the same plane to cool a wide object, Only the first and second blocks 40 and 50 stacked together with the thermoelectric semiconductor element 30 having the thickness still exist because the problem of contacting the heat sink and the object is not solved.

Meanwhile, another conventional technique is a thermoelectric semiconductor device unit of Publication No. 10-2010-0123320 (published November 24, 2010), and Patent Application No. 10-2012-0013936 (March 10, 2014 announcement). The thermoelectric semiconductor device unit of was disclosed. As already explained, this technology still has the problems of housing and screw use. In addition, the spring is embedded in the housing to tightly compress and fix the block and the thermoelectric semiconductor element. However, as the spring is used, the height is increased to increase the thickness of the heat exchanger.

As another conventional technique, a chiller and a method of manufacturing the same are disclosed in Korean Patent Application Publication No. 10-2012-0132018 (published on December 05, 2012). This technology is a technique developed by the present invention relates to a method of fixing the heat dissipation surfaces of a plurality of thermoelectric elements to the heat sink, and has a technology for matching the flatness, which is more advanced than the prior art.

Specifically, disposing a plurality of thermoelectric elements 23 on one side or both sides of the heat sink 22 in a surface contact state; Mounting a cool block (24) on top of each of the arranged thermoelectric elements (23); The cool block 24 and the thermoelectric element 23 are covered by the cover 25 to expose the cool block 24, and the cover 25 is fixed to the heat sink 22 to cool the block 24 and the thermoelectric element. Fixing 23; Fixing the case (26) to the heat sink (22) to accommodate and protect the thermoelectric elements (23) inside the case (26); Fixing the heat sink 22 to the jig G, and then processing the exposed cool blocks 24 and the case 26 to the same height to match the flatness; The cool blocks 24 and the case 26 may be fixed to the heat exchanger 22 on which the processed cool blocks 24 are mounted on one or both sides of the heat exchanger 21. Fixing to the surface contact state to; And the injection hole 26a penetrates the side surface of the case 26 and fills the heat insulating member 27 in the case 26 through the injection hole 26a to discharge the internal air to the outside, and then the injection hole 26a is opened. Sealing;

In this technique, as shown in FIGS. 14 to 16, a heat exchanger 21 in which a thermoelectric element 23 and a cool block 24 are mounted is mounted between both outer heat sinks 22. Arrange a plurality of thermoelectric elements 23 and cool blocks 24 on a contact surface in a stacking manner, wrap them with a cover 25 so that the cool blocks 24 are exposed, and then fasten a screw to a contact surface of a heat sink 22 to cover the cover. After fixing the 25 and fixing the heat sink 22 to the jig G, the exposed cool blocks 24 were processed at the same height using a machine tool to adjust the flatness.

The reason for adjusting the flatness by processing the exposed cool blocks 24 is to uniformize the height and flatness of the thermoelectric elements 23 having different thicknesses and the cool blocks 24 stacked thereon.

If the plurality of thermoelectric elements 23 used do not have the same flatness, that is, if the thickness and the flatness of each of the thermoelectric elements 23 are different, the cool blocks 24 contacting them may be processed to a constant thickness. The thin thermoelectric element 23 is not in intimate contact with the heat sink 22, and the cool block 24 stacked on the thin thermoelectric element 23 is also not in intimate contact with the heat exchanger 21 contact surface. Therefore, since the low temperature of the cooling surface of the thermoelectric element 23 does not transfer smoothly to the heat exchanger 21, and the heat dissipation surface is separated from the heat sink 22, the heat dissipation does not proceed smoothly. The problem arises that the cooling performance is significantly lowered.

In order to solve this problem, a process for uniformizing the height and flatness of each of the thermoelectric elements 23 and the cool blocks 24 stacked in parallel between the heat exchanger 21 and the heat sink 22 is required. As a method of the related art, the prior art cannot process the thermoelectric element 23. Thus, as shown in FIG. 11, the surface of each cool block 24 fixed to the cover 25 and laminated to the thermoelectric element 23 is machine tool ( It was processed uniformly using M) to uniformly adjust the flatness.

However, since the conventional technology wraps the thermoelectric element 23 and the cool block 24 to be stacked with a cover 25 and fastens the cover 25 to the heat sink 22 using a screw, as in the conventional art already pointed out. The problems associated with the use of the lid 25 remain intact. And if any one of the manufactured use of the chiller breaks out of the thermoelectric element 23, the failed thermoelectric element 23 must be replaced, the thermoelectric element 23 is replaced because the flatness is different from those already in use, the thickness Since there is no way to match the flatness and the heat sink 22 to the jig again there is a hassle to rework the surface of each cool block 24 with a machine tool (M). Due to this problem, the conventional chiller is a waste of the chiller itself because the replacement work is cumbersome when the thermoelectric element 23 is broken.

Republic of Korea Patent Publication No. 10-2006-0100882 (Published September 21, 2006) Republic of Korea Patent Application No. 10-2010-0004145 (announced November 03, 2010) Republic of Korea Patent Publication No. 10-2010-0123320 (published 24 November 2010) Republic of Korea Patent Application No. 10-2012-0013936 (announced March 10, 2014) Republic of Korea Patent Publication No. 10-2012-0132018 (published 05 December 2012)

Therefore, the present invention is to solve the problems of the conventional heat exchanger as described above, the object of the heat-conducting device and the heat-transfer block in close contact with the heat-conducting heat-curing adhesive to fix and form a single part form the thickness of the adhesive By processing the surface of the heat transfer block to make it uniform, the flatness is matched by a certain thickness when assembling a plurality of adhesives on the same plane, eliminating the process of matching the flatness pointed out as a conventional problem in the assembly process. It is an object of the present invention to provide a thermoelectric semiconductor device adhesive and a method of manufacturing the same having a flatness that can simplify assembly.

Another object of the present invention is to reduce the number of assembly work by fixing the adhesive without the housing and the screw when manufacturing the heat exchanger using the adhesive as well as thicker than necessary to secure the screw fastening place The present invention provides a heat exchanger using a heat conductive semiconductor device adhesive having a uniform flatness to improve heat transfer efficiency by forming a thin contact surface thickness of a conventional heat sink, and a method of manufacturing the same.

Another object of the present invention is to replace the corresponding adhesive when the thermoelectric semiconductor device failure, so that the flatness is simply matched flatness that can solve the conventional hassle to perform the process of matching the flatness again in the replacement process The present invention provides a heat exchanger using a uniform thermoelectric semiconductor device adhesive and a method of manufacturing the same.

Another object of the present invention is to seal the outer surface of the heat exchanger device manufactured by using a thermoelectric semiconductor device adhesive with uniform flatness by sealing with a hermetic member in a vacuum state, the water condensed around the cooling surface of the thermoelectric semiconductor device when in use The present invention provides a heat exchanger using a thermoelectric semiconductor device adhesive having a uniform flatness that can be infiltrated into and thereby prevent the flow of electricity inside the heat exchanger, thereby ensuring safety of use, and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a method for manufacturing a thermoconductor device adhesive having a uniform flatness, the method comprising: closely bonding a heat transfer block to a surface of the thermoconductor device with an adhesive (S1);

Fixing the adhesive to which the thermoconductor element and the heat transfer block are attached to a jig (S2); And

And flattening the exposed surface of the heat transfer block fixed to the jig with a cutter to adjust the flatness to uniform thickness of the adhesive (S3).

In the present invention, the adhesive for bonding the heat conducting semiconductor element and the heat transfer block in step S1 is a heat conducting heat curing adhesive, and its physical properties are viscosity 8,000-8,800 Pa · s, thermal conductivity 1-1.44 W / m · K, hardness Shore (D Type) 55 to 62D.

The heat transfer block of the present invention has a horizontal or vertical width larger than the heat conducting semiconductor element, and both sides forming a wider or vertical thickness having a larger width are tightly fixed to the jig, and the jig has an upper end than the upper surface of the heat transfer block. Secure the heat transfer block in a low state so that the cutter does not collide with the cutter when machining the heat transfer block surface.

On the other hand, the method of manufacturing a heat exchange apparatus using a heat conduction device adhesive having a uniform flatness according to the present invention comprises the step (S1) of closely bonding the heat transfer block on the surface of the heat conduction semiconductor device with an adhesive, and the heat conduction device and the heat transfer block Fixing the bonded adhesive to the jig (S2), by processing the exposed surface of the heat transfer block fixed to the jig with a cutter to uniform the thickness of the adhesive to proceed the step (S3) Manufacturing a thermoconductor device adhesive having a uniform flatness (S10); And

Fixing the heat exchange object and the heat sink by arranging the heat conduction element adhesive between the heat exchange object and the heat sink such that the surface of the heat transfer block of the plurality of thermoconductor device adhesives are in close contact with the contact surface of the heat sink, respectively. It includes; step (S20).

According to another aspect of the present invention, there is provided a method of manufacturing a heat exchange apparatus using a thermally conductive semiconductor device having a uniform flatness, in which a heat transfer block is closely adhered to the surface of a thermal semiconductor device using an adhesive (S1), Fixing the adhesive to which the heat transfer block is bonded to the jig (S2), and flattening the exposed surface of the heat transfer block fixed to the jig with a cutter to adjust the thickness of the adhesive to uniformity (S3) Proceeding to the step of producing a thermoconductor device adhesive uniformity (S10);

Arranging the surfaces of the respective heat transfer blocks of the plurality of thermoconductor element adhesives to be in close contact with the contact surfaces of the heat sinks to the contact surfaces of the heat exchange targets (S20);

Disposing a gasket at an edge between the heat exchange object and the heat sink (S30); And

And fastening the heat exchange target object and the heat sink edge by screwing the thermoelectric semiconductor element adhesives and the gasket in close contact therewith (S40).

According to still another aspect of the present invention, there is provided a method of manufacturing a heat exchange apparatus using a thermally conductive semiconductor device having a uniform flatness, in which a heat transfer block is closely adhered to the surface of a thermal semiconductor device by an adhesive (S1), and the thermal semiconductor device. And fixing the adhesive to which the heat transfer block is bonded to the jig (S2), and flattening the exposed surface of the heat transfer block fixed to the jig with a cutter to adjust the thickness of the adhesive to uniformity (S3). Proceeding to produce a thermoelectric semiconductor device adhesive uniformity (S10);

Arranging the surfaces of the respective heat transfer blocks of the plurality of thermoconductor element adhesives to be in close contact with the contact surfaces of the heat sinks to the contact surfaces of the heat exchange targets (S20);

Disposing a gasket at an edge between the heat exchange object and the heat sink (S30);

Fastening the heat exchange target and the heat sink edge with screws to tightly fix the thermoelectric semiconductor element adhesives and the gasket therein (S40); And

Comprising the step S40 put the heat exchanger in a vacuum chamber and coating an airtight member on the outside of the heat exchanger in a vacuum (S50); includes.

The heat sink of the present invention is a heat sink fin is housed in the inner heat exchange chamber, the heat exchange chamber is sealed with a cover, the inlet and outlet through which the coolant enters and exits are formed on the side communicating with the heat exchange chamber, the contact surface is in close contact with the thermoelectric semiconductor element ;

The contact surface processing of the heat sink in which the thermoelectric semiconductor elements are in close contact with each other forms the thickness of the heat sink with a jig, and the flat upper surface, the lower surface, or the upper and lower surfaces are processed with a cutter to flatten the flatness. The jig is fixed to the side edge of the heat sink in which the wall of the heat exchange chamber is located so that the flatness of the contact surface does not change even if the jig fixed state of the jig is released after processing.

According to the present invention, the heat conduction element and the heat transfer block are bonded with a heat conduction heat curing adhesive, and then the adhesives are fixed to the prepared jig to process the surface of the heat transfer block to a certain height to match the thickness and flatness of the heat transfer element and the heat transfer block. The mass production of the adhesive as a separate part has the advantage that the assembly can be simplified by simply solving the flatness problem pointed out as the most problem when using the thermoelectric semiconductor device.

In addition, the present invention can be easily replaced with a new adhesive already flattened in the case of thermoelectric semiconductor element failure to make the flatness of all the adhesives the same as the original assembly state, thereby simplifying the replacement work and continuing to reuse the heat exchanger in use. Has the advantage.

In addition, the present invention does not need to use a housing that is fastened to the heat sink to secure the thermoelectric semiconductor element and the block to fasten the thermoelectric semiconductor element and a screw fastening the housing, so that the cost can be reduced as well as the assembly labor. It has the advantage of being reduced.

In addition, the present invention has the advantage of increasing the heat transfer efficiency by removing the latent heat hidden in the heat sink while the heat transfer proceeds quickly by configuring a thin contact surface thickness of the conventional heat sink was inevitably thicker than necessary to secure the screw fastening place. .

That is, the thickness of the heat sink contact surface to which the thermoelectric semiconductor device is in close contact is significantly reduced than before, so that the heat radiated from the thermoelectric semiconductor element is immediately transferred to the heat sink through the thickness of the thin contact surface to increase the heat radiation efficiency.

In addition, the present invention by placing the heat exchanger in a vacuum chamber at the end of the manufacturing process and coating the airtight member on the outer surface in a vacuum state, the condensation water is generated when the heat transfer semiconductor element cools the heat transfer block by removing the air inside. In addition, the coated airtight member seals the heat exchanger, thereby blocking the flow of electricity inherently, thereby solving the conventional problem of electric leakage caused by condensed water.

1 is a front sectional view of a heat exchanger according to the present invention;
2 is an enlarged conceptual view of an adhesive according to the present invention;
3 is a conceptual view showing a state in which the adhesive of the present invention is fixed to the jig
Figure 4 is a front sectional view of the heat exchanger device assembled with the adhesive and gasket according to the present invention
5 is a plan view showing the inside of the heat sink according to the present invention
6 is a plan view of the heat sink in which the adhesive according to the present invention is disposed
7 is a flow chart manufacturing adhesive according to the invention
8 is a flow chart of manufacturing a heat exchanger according to an embodiment of the present invention
9 is a flow chart of manufacturing a heat exchanger according to another embodiment of the present invention
10 is a flow chart of manufacturing a heat exchanger according to another embodiment of the present invention
11 is a flow chart of manufacturing a heat exchanger according to another embodiment of the present invention

Hereinafter, with reference to the accompanying drawings will be described in detail the heat exchanger and its manufacturing method according to the present invention.

As can be seen in the drawings, the method for manufacturing a thermally conductive semiconductor device adhesive 1 having a uniform flatness according to the present invention, as shown in FIG. 7, heat transfer block 3 is attached to the surface of the thermally conductive semiconductor device 2. Closely bonding (S1);

Fixing the adhesive (1) to which the thermoconductor element (2) and the heat transfer block (3) are attached to the jig (S2); And

And flattening the exposed surface of the heat transfer block (3) fixed to the jig (5) with a cutter (61) to adjust the flatness of the adhesive (1) to achieve a flatness (S3).

The adhesive 4 used in the step S1 of closely bonding the heat transfer block 3 to the surface of the heat conducting semiconductor element 2 with the adhesive 4 uses a heat conductive heat curing adhesive.

As described above, when power is supplied, one side of the thermoelectric semiconductor element 2 becomes a cooling surface due to a low temperature, and the other side becomes a heat dissipating surface that takes heat from the cooling surface and radiates heat to the outside. The temperature is considerably higher than cotton. Therefore, since the heat of the heat dissipation surface is smoothly radiated and the temperature is lowered, the temperature of the cooling surface is also lowered in proportion to it. Therefore, it is required to lower the temperature of the heat dissipation surface as much as possible to increase the cooling efficiency.

In the present invention, the cooling surface of the heat conductive semiconductor element 2 is closely adhered to the heat transfer block 3 using a heat conductive heat curing adhesive. Of course, if the polarity of the power source is changed, the cooling surface may be the heat dissipation surface, and the heat dissipation surface may be the cooling surface, and such polarity change may be changed according to the power polarity selection of the user.

The heat exchange object 7 can be cooled faster and to a lower temperature by directly bringing the heat exchange object 7 to be cooled directly into the cooling surface of the heat transfer semiconductor element 2 without using the heat transfer block 3. . Nevertheless, the reason for closely contacting the heat transfer block 3 to the heat transfer semiconductor element 2 and firmly fixing the heat transfer block 3 to the heat exchange target 7 is inevitably used to match the flatness. That is, in order to cool the heat exchange target 7 having a large area, a plurality of thermoelectric semiconductor elements 2 are arranged at regular intervals as shown in FIG. 6 to uniformly cool the entire heat exchange target 7. Since the two thermoelectric semiconductor elements 2 are each different in thickness and flatness, it is impossible to closely adhere the heat dissipation surface to the heat dissipation plate 8 to all of the cooling surfaces thereof to the heat exchange object 7.

More specifically, if you look closely at the current thermoelectric semiconductor devices on the market, even though the thickness of the two sides of each side is not parallel, the slope does not match the flatness. Therefore, only some of the thicker thermoelectric semiconductor elements 2 have their cooling surfaces close to the heat exchange targets 7, and the heat dissipation surfaces closely adhere to the heat sink 8, and the thinner thermoelectric semiconductor elements 2 have only their cooling surfaces having heat exchange targets 7. Since the heat dissipation surface is not in contact with the heat dissipation plate 8, the heat dissipation does not proceed smoothly, and thus the cooling efficiency is low, so that the heat exchange target 7 cannot be lowered to the desired cooling temperature.

Due to this problem, the present invention uses a heat transfer block 3 of a non-ferrous metal having a good thermal conductivity on the cooling surface of the heat conducting semiconductor element 2 as shown in FIGS. 1 to 2, and a heat transfer block 3 mainly made of aluminum or copper as a heat conduction heat curing adhesive. After making a close contact with the adhesive (1) to fix the heat transfer block (3) constituting the adhesive (1) to the jig (5), the exposed surface is processed to heat the semiconductor element 2 and the heat transfer block ( The process of matching the flatness while uniformizing the thickness of 3) is performed. At this time, the bottom surface of the thermoconductor element 2 is in close contact with the bottom surface of the jig 5, and in this state, the cutter 61 of the machine tool 6 lowers the heat transfer block 3 mounted on the thermoconductor element 2. The flatness is uniform because the surface is processed while pressing.

In this case, the thickness of the bonded heat conducting semiconductor element 2 and the heat transfer block 3 is uniform and uniform even. Therefore, the adhesives 1 used when the heat exchanger 10 is cooled by using the plurality of adhesives 1 to cool the heat exchange targets 7 have a uniform thickness and uniform flatness, so that each heat transfer block 3 The thermoelectric semiconductor element 2 is closely attached to the heat sink 8 so that the heat exchange object 7 can be cooled to a lower temperature than before.

In the step S1, as shown in FIG. 2, the heat conductive semiconductor device 2 and the heat transfer block 3 are closely adhered to each other using a heat conductive heat curing adhesive. This can be done manually or by an automated process by a mechanical device. After bonding, the thermal conductive curing agent is dried for a certain period of time to dry. The thermally conductive thermosetting adhesive used is a well-known one, and its physical property uses viscosity 8,000-8,800 Pa.s, thermal conductivity 1-1.44 W / m * K, hardness Shore (type D) 55-62D. Since the thermally conductive thermal curing adhesive is excellent in heat transfer, almost no heat loss occurs, thereby achieving the object of the present invention.

When the heat conductive heat curing adhesive is dried, the heat conductive semiconductor element 2 and the heat transfer block 3 are firmly adhered to each other to form a single adhesive 1, and thus are inseparable. Therefore, if the thermal semiconductor element 2 breaks down during use, it is replaced together with the heat transfer block 3.

Since the step S1 is a process of adhesively fixing the thermoconductor element 2 and the heat transfer block 3 with an adhesive 4, its operation is relatively simple. However, there is no prior art for bonding the thermoconductor element 2 and the heat transfer block 3 to make the adhesive 1 before assembling the heat exchanger 10, and also integrating a single part to achieve flatness before assembly. There is also no technique for processing the heat transfer block 3 of the adhered material 1.

The prior art Patent Publication No. 10-2012-0132018 is a method developed by the inventors several years ago to match the flatness. As pointed out, the thermoelectric element 23 and the cool block 24 are covered with a cover 25, and the cover 25 is fixed with a screw so that the problems caused by the use of the cover 25 and the use of the chiller can be achieved. If the element 23 fails, the surface of each of the cool blocks 24 must be reworked after replacing the failed thermoelectric element 23. If the thermoelectric element 23 fails due to this problem, the chiller itself is discarded. Currently not used because of the problem.

In order to solve this conventional problem, the present invention has fixed the thermoconductor element 2 and the heat transfer block 3 with an adhesive (4) to form a single part, and put the single part in the jig (5) exposed heat transfer Since the block 3 is processed to uniform the thickness and flatness of the adhesive 1 before assembling the heat exchanger 10, the present invention has a technical concept compared to the prior art of the Patent Publication No. 10-2012-0132018. This is something completely different.

After the step S1 is completed, the step (S2) of fixing the adhesives (1) to the jig (5) to match the flatness of the adhesive (1) consisting of the heat conducting semiconductor element (2) and the heat transfer block (3) Proceed. The jig 5 may be configured in various forms, and as an example, as shown in FIG. 3, an accommodating groove 51 is formed to accommodate the adhesives 1, and an adhesive inserted into the accommodating groove 51 is formed. The slide member 52 is formed at the end of the bolt 53 so as to fix the side of the water 1 so that the side of the heat transfer block 3 constituting the adhesive 1 by reciprocating when the bolt 53 rotates is formed. It will be fixed. The plurality of receiving grooves 51 are formed in a row, and the slide member 52 and the cutter 61 are formed long to correspond to the receiving grooves 51 to form the surfaces of the plurality of heat transfer blocks 3 at once. It is preferable to process and make the flatness of the adhesive 1 uniform. In the step S2, if the bottom surface of the thermoconductor element 2 constituting the adhesive 1 is fixed to the bottom surface of the jig 5, the adhesive 1 is fixed. ) Thickness and flatness match.

The heat transfer block 3 has a horizontal or vertical width larger than that of a heat conducting semiconductor, and both sides forming a larger horizontal or vertical thickness are tightly fixed to the jig 5, and the jig 5 is The heat transfer block 3 is fixed to the upper end of the heat transfer block 3 so that the cutter 61 does not collide with the cutter 61 when the surface of the heat transfer block 3 is processed. In addition, when fastening and fixing the slide member 52 to the heat transfer block (3) side by fastening the bolts 53 so that the heat transfer block (3) is too compressed to be convexly deformed. If the bolt 53 is tightened so strongly that the exposed plane of the heat transfer block 3 is convex or concave, the cutter 61 processes the plane in that state, and the slide member 52 is moved after the process. By releasing the pressurized state, since the heat transfer block 3 is restored to its original state in the processed state, the processing surface is inevitably deformed and the flatness does not match, and thus the object of the present invention cannot be achieved.

After the step S2 is completed, flattening the exposed surface of the heat transfer block 3 fixed to the jig 5 with the cutter 61 to adjust the flatness of the adhesive 1 to achieve a flatness ( S3) proceeds.

In the step S3, for example, a cylindrical cutter 61 rotating while linearly moving on the jig 5 may be used. When the cutter 61, which is linearly and rotationally moved while the jig 5 is fixed, processes the surface of the heat transfer block 3 of the adhesive 1 fixed to the receiving groove 51 of the jig 5, the bonding is performed. Since the waters 1 are processed to a set thickness, the flatness becomes uniform.

As described above, since the plurality of thermoconductor elements 2 used are adhesives 4 in manufacturing, the thicknesses of the thermoconductor elements 2 are different from each other and the flatness is not matched. The thickness and flatness of the water 1 will be different again. Therefore, after fixing the adhesives 1 to the jig 5 and processing the exposed surface of the heat transfer block 3 with the cutter 61 of the machine tool 6, the processed adhesives 1 have a constant thickness. Flatness is consistent. When the plane of the heat transfer block 3 is machined with the cutter 61 of the machine tool 6, the cutter 61 presses the surface of the heat transfer block 3 to process the adhesive. Since the pressure is maintained without moving, the thickness of all the adhesives 1 to be processed is uniform to uniformity.

Since the processed adhesives 1 are processed and mass-produced in a state where a plurality of them are fixed in the jig 5, they are easy to use and can be easily replaced in case of failure of the thermoelectric semiconductor element 2 during use of the heat exchanger 10. In addition, there is an effect of not having to perform a cumbersome additional work of adjusting the flatness separately in the replacement process.

When the step S3 is completed, the thermoelectric semiconductor device adhesive 1 of which the flatness of the present invention is uniform is completed.

Next, a method of manufacturing the heat exchange apparatus 10 using the thermoelectric semiconductor device adhesive 1 having a uniform flatness manufactured through the steps S1 to S3 will be described.

Method for manufacturing a heat exchanger device 10 according to the present invention comprises the steps of preparing a thermoelectric device adhesive (1) having a uniform flatness through the steps S1 to S3 as shown in Figure 8 (S10); And

The surface of the heat transfer block 3 of the plurality of thermoconductor element adhesives 1 is in contact with the contact surface of the heat exchange target 7, and the surface of the heat conduction semiconductor element 2 is in close contact with the contact surface of the heat sink 8, respectively. And arranging the thermoelectric semiconductor element adhesive 1 between the heat sinks 8 to fix the heat exchange target 7 and the heat sinks 8 (S20).

Since step S10 is a process including step S1 to step S3, since it has already been described above, a detailed description thereof will be omitted.

When the step S10 is completed, the step (S20) of fixing the adhesive (1) in close contact between the heat exchange target 7 and the heat sink (8) is in progress. That is, the surface of the heat transfer block 3 of the adhesive 1 is fixed to the contact surface of the heat exchange target 7 so that the surface of the heat conducting semiconductor element 2 is in close contact with the contact surface of the heat sink 8, respectively.

When the plurality of adhesives 1 are installed between the heat exchange target 7 and the heat sink 8 in step S20, the heat conductive semiconductor elements 2 of the adhesives 1 are spaced apart from the heat sink 8 as shown in FIG. The heat exchange object (7) is mounted on the heat transfer block (3), and then the edge of the heat sink (8) and the edge of the heat exchange object (7) are fastened and fastened with screws (9). Fix it. When the heat exchange object 7 is mounted on the heat transfer block 3 in the assembling process, the heat transfer block 3 is bonded to the heat conductive semiconductor element 2 to form a single part when the heat transfer block 3 moves to set the assembly position. Therefore, it does not move separately from the thermoelectric semiconductor element 2.

In the step S20, since the housing used as a fixing means for fixing the thermoelectric semiconductor is not used, the adhesives 1 can be densely arranged in close proximity. Thus, if the adhesives 1 are densely arranged, the thermoelectric semiconductor element 2 ) Can be used more than in the prior art can increase the heat exchange performance of the heat exchange device (10). In addition, since the present invention does not fasten the screw fixing the housing to the heat sink 8 because the housing is not used, the assembly labor is reduced, and the heat sink 8 is thicker than necessary to have a depth at which the screw is stably fastened. It does not have to be formed. If the thickness of the heat sink 8 is formed thin within the safe range as shown in FIG. 4, heat of the heat dissipation surface of the thermoelectric semiconductor element 2 is quickly transferred to the heat sink 8, and heat dissipation proceeds smoothly as much as that. ) Heat exchange efficiency can be improved.

The reason why the conventional housing is not used and the screw fixing the housing may not be used, is because the thermoconductor element 2 and the heat transfer block 3 are bonded to each other to form a single part. .

When the heat conductive semiconductor element 2 and the heat transfer block 3 are bonded to each other to form a single part, that is, the adhesive 1, they are not separated during assembly, so that they are separated between the heat exchange object 7 and the heat sink 8. Easy to assemble If the heat transfer element 2 and the heat transfer block 3 are separated from each other without bonding with the adhesive 4 as in the related art, the heat transfer block 3 is simply laminated on the heat transfer element 2 when assembling them. The heat transfer block 3 moves when the heat transfer element 2 is placed on the heat sink 8 in the state and moved to match the assembly position with the heat exchange target 7 mounted on the heat transfer block 3. Therefore, since the heat transfer block 3 is stacked on the heat conducting semiconductor element 2 in a state outside the initial assembly position, the contact area thereof is reduced, and thus the problem of low heat exchange efficiency cannot be avoided.

On the other hand, the heat exchange apparatus 10 manufacturing method according to another embodiment of the present invention is a step of manufacturing a thermoelectric semiconductor device adhesive (1) of uniform flatness through the step S1 to S3 as shown in Figure 9 (S10) ;

Arranging the surfaces of the respective heat transfer blocks 3 of the plurality of thermoconductor element adhesives 1 on the contact surfaces of the heat exchange targets 7 so that the surfaces of the respective heat conduction semiconductor elements 2 are in close contact with the contact surfaces of the heat sink 8 (S30). );

Disposing a gasket (11) at an edge between the heat exchange target (7) and the heat sink (S40); And

And fastening the heat exchange target 7 and the edge of the heat sink 8 with screws 9 to closely fix the thermoelectric semiconductor element adhesives 1 and the gasket 11 located therein (S50).

Here, since step S10 has already been described above, a detailed description thereof will be omitted to avoid duplication.

The step S30 is a step of arranging the heat dissipation surfaces of the thermoelectric semiconductor elements 2 constituting the adhesive 1 on the heat dissipation plate 8 at regular intervals as shown in FIG. 6. Since 2) is used a lot, the heat exchanger 10 has a good cooling performance.

In the disposing of the gasket 11 (S40), the gasket 11 is fixed to an edge between the heat exchange target 7 and the heat sink 8 to seal the adhesives 1. A plurality of adhesives 1 are disposed between the heat exchange target 7 and the heat sink 8, and the peripheral cooling when the thermoelectric semiconductor elements 2 constituting the adhesive 1 cools the heat exchange target 7. When the temperature falls below the dew point, water vapor gathers to form condensed water, which is inevitably generated due to temperature difference. As time passes, the condensation water generated around the thermoelectric semiconductor element 2 gradually increases in quantity and flows down to the surroundings, thereby causing corrosion of the heat exchange object 7 and the heat sink 8 made of a metal material. If there is a problem, there is a problem that the electrical effect on the heat exchange object (7) and the entire system using the heat exchange object (7) to produce a defective product or cause a failure of the entire system itself.

For example, the heat exchanger 1 of the present invention is used to suppress overheating of the apparatus for manufacturing a wafer in a semiconductor manufacturing process, and is used in a state in which the cooled heat exchange target 7 is in close contact with the wafer manufacturing apparatus. A wafer is a high-precision product in which elements such as transistors and diodes are made on the surface and electrodes are formed, that is, several hundred IC chips are arranged. When electricity outside of the allowance is supplied to the apparatus for manufacturing the wafer and the current and the voltage change, the density of the wafer becomes abnormal and the expensive wafer becomes defective and the economic loss is enormous. In order to solve this problem, when a leakage current occurs in a device for manufacturing a wafer, a monitoring device is provided that immediately shows system operation to prevent defective wafer production.

When the condensate generated around the thermoelectric semiconductor element 2 is energized in the wafer manufacturing process and the coolant (not shown) circulating inside the heat exchange target 7 causes a change in characteristics, the wafer manufacturing apparatus is not normally cooled. Rather, the condensate leaks electricity, which in turn causes a serious problem of stopping the entire system of wafer-producing devices. It is very important to block the flow of power to the condensed water generated around the thermoelectric element to block this phenomenon.

Gasket 11 used in the step of placing the gasket 11 (S40) is coated with an adhesive (not shown) on both ends forming a thickness, that is, both ends in close contact with the heat exchange object (7) and the heat sink (8). By adhering to the heat exchange target (7) and the heat sink (8) so that outside air does not penetrate into the gasket (11).

When the gasket 11 is disposed in the step S40 as described above, the edges of the heat exchange object 7 and the heat sink 8 are then fastened with screws 9 to sandwich the thermoelectric semiconductor element adhesives 1 and the gasket therebetween. Step (S50) of closely fixing the 11 is in progress. When the screw 9 is fastened, the heat exchange object 7 and the heat sink 8 are pulled together and press the plurality of adhesives 1 and the gasket 11 positioned therebetween, thereby constituting the adhesive 1. The heat transfer semiconductor element 2 is in contact with the heat sink 8, the heat transfer block 3 is in close contact with the heat exchange target 7, and both ends of the gasket 11 are also fixed in close contact with each other.

On the other hand, the heat exchange apparatus 10 manufacturing method according to another embodiment of the present invention is a step of manufacturing a thermoelectric semiconductor device adhesive 1 having a uniform flatness through the steps S1 to S3 as shown in FIG. );

Arranging the surfaces of the respective heat transfer blocks 3 of the plurality of thermoconductor element adhesives 1 on the contact surfaces of the heat exchange targets 7 so that the surfaces of the respective heat conduction semiconductor elements 2 are in close contact with the contact surfaces of the heat sink 8 (S30). );

Disposing a gasket (11) at an edge between the heat exchange target (7) and the heat sink (S40);

Fastening the heat exchange target (7) and the heat sink (8) by the screw (9) to tightly fix the thermoelectric semiconductor element adhesives (1) and the gasket (11) located therein (S50); And

Comprising the step S50, the heat exchanger 10 is put into a vacuum chamber and coating a gas tight member on the outside of the heat exchanger 10 in a vacuum state (S60); includes.

Since steps S10 to S50 have already been described, a detailed description thereof will be omitted. However, the adhesive is not used when arranging the gasket 11 fixed to the heat exchange target 7 and the heat sink 8 at the step S40. The reason is that when the airtight member 12, which will be described later, is coated on the surface of the heat exchanger 10, the air present in the gasket 11 is discharged to the outside so that the inside of the gasket 11 can be maintained in a vacuum state. to be. If the adhesive is not used, a gap is generated in a portion where the gasket 11 is in contact, and thus the air inside the gasket 11 escapes through the gap, and the inside becomes a vacuum state.

The step S60 is to block the condensation water generated by the condensation of water when the thermoelectric semiconductor element 2 cools the heat exchange target 7 to penetrate into the heat exchanger 10 so that electricity is energized. After the step of the heat exchanger 10 is put in a vacuum chamber is a process of coating the outside of the heat exchanger 10 with an airtight member 12 in a vacuum state.

The coating of the present invention is a polymer coating method that is deposited on the outside of the heat exchange apparatus 10 in units of micro thickness in a gaseous form in a vacuum state. More specifically, the powdered dimer is evaporated by heat, the evaporated dimer is converted into a gaseous state through pyrolysis, cooled before the monomer dimer diffuses into the vacuum chamber, and cooled gas particles. Is polymerized in the vacuum chamber to form a film on the surface of the heat exchanger (10).

Since the polymerization reaction of the coating of the present invention occurs at a very low pressure and a room temperature of 30 ° C. or less, the coating is made even in minute cracks, unlike wet coating, without generating thermal stress on the surface of the heat exchanger 10. A uniform coating film can be formed irrespective of the shape of the contact gap, sharp needles, corners, corners, and fine holes, and excellent porosity is formed because no pores are formed on the coating surface. This coating method is applied to the PCB surface protection and requires corrosion resistance, chemical resistance, chemical resistance, lubricity, etc., so it is a well-known parallax for protecting devices, components, and surfaces in the electrical, mechanical, aerospace, medical, and engineering industries. Lean coatings are widely used in the industry.

Since the coating process of the present invention is carried out in a vacuum chamber, since the inside of the heat exchanger device 10 is in a vacuum state and no air is present, the airtight member 12 is coated on the surface of the heat exchanger device 10 in the form of a protective film, thereby coating. Since the outside air does not penetrate into the gasket 11, condensation water is not generated inside the gasket 11 because there is no water vapor around the thermoelectric element even when the thermoelectric element is cooled.

Therefore, the heat exchanger 10 of the present invention is coated with an airtight member 12 as the entire outer surface, so the inside of the vacuum is completely isolated from the outside through which electricity flows, so that electricity does not flow, and there is a cause of energization inside. Since condensation water cannot be produced, the phenomenon of condensation water leaking as a conventional problem can be eliminated at once.

In the heat exchange apparatus 10 of the present invention, since the temperature of the cooling surface is lowered together when the temperature of the heat dissipation surface of the thermoelectric semiconductor element 2 is low, the heat dissipation surface is cooled by the heat sink 8. The heat dissipation surface of the thermoelectric semiconductor element 2 is in close contact with the heat dissipation plate 8 to be cooled, and the heat dissipation plate 8 of the present invention uses water cooling as shown in FIGS. 5 to 6.

In the heat sink 8 of the present invention, the heat dissipation fins 82 are accommodated in the internal heat exchange chamber 81, and the heat exchange chamber 81 is sealed by a cover 83, and cooling water is provided on a side surface communicating with the heat exchange chamber 81. The inlet 84 and the outlet 85 which enter and exit are formed, and the contact surface to which the heat dissipation surface of the thermoelectric-conductor element 2 comes in close contact is plane-processed.

The contact surface of the heat sink 8 corresponds to an upper surface, a lower surface, or both upper and lower surfaces. In order to closely adhere the heat dissipation surface of the thermoelectric semiconductor element 2 to the contact surface of the manufactured heat sink 8, it is required to smoothly planarize the contact surface to match the flatness. If the flatness is not uniform, there is a problem that the heat exchange efficiency is lowered since the flatness is not in intimate contact with the heat dissipation surfaces of the plurality of thermoelectric semiconductor elements 2.

Therefore, the contact surface processing of the heat sink 8 in which the thermoelectric semiconductor element 2 is in close contact is the upper surface, the lower surface, or the upper and lower surfaces exposed while pressing and fixing both sides forming the thickness of the heat sink 8 with the jig 5. The flat surface with the cutter 61 to uniform the flatness, and the jig 5 is press-fixed and fixed to the side edge of the heat sink 8 where the wall 86 of the heat exchange chamber 81 is located. Even if the crimp fixed state of 5) is released, the flatness of the contact surface does not change.

The side edges of the heat sink 8 are located at the heat exchange chamber 81 wall 86 and thus resist the compressive force when the wall 86 is squeezed by the jig 5, so that the contact surface of the heat sink 8, i.e., the top or the bottom The surface remains flat without deforming convexly or concavely. Therefore, even if the cutter 61 of the machine tool 6 planes the contact surface and then releases the crimp of the jig 5, the contact surface is not deformed and the flatness is maintained.

If the jig 5 does not press-fix the side edges of the heat sink 8 and press-fixes the central part of the side forming the heat exchange chamber 81, the heat sink 8 may be convex or fine at the top or bottom surface thereof. If the jig 5 is released after the contact surface is planar processed in that state, the deformation state of the contact surface is restored to its original position. .

The present inventors suffered from a lot of time for about a year to find the cause of the unevenness of the contact surface of the heat sink 8 even after processing, and eventually found this problem to invent the present invention. It became.

On the other hand, the heat exchange apparatus 10 manufacturing method according to another embodiment of the present invention is a step of manufacturing a thermoelectric semiconductor device adhesive 1 having a uniform flatness through the steps S1 to S3 as shown in FIG. );

The surface of the heat transfer block 3 of the plurality of thermoconductor element adhesives 1 is in contact with the contact surface of the heat exchange target 7, and the surface of the heat conduction semiconductor element 2 is in close contact with the contact surface of the heat sink 8, respectively. Disposing a thermoelectric semiconductor element adhesive (1) between the heat sinks (8) to fix the heat exchange target (7) and the heat sinks (S20); And

Comprising the step S20 put the heat exchanger device 10 in a vacuum chamber and coating the airtight member 12 on the outside of the heat exchanger device 10 in a vacuum state (S60).

Since the embodiment performs step S60 without using the gasket 11, the description thereof has been already described above, and thus a detailed description thereof will be omitted. Since the embodiment does not use the gasket 11, the airtight member 12 is fixed on the surface of the adhesive 1, thereby eventually blocking the surface of the heat exchanger 10 from the outside.

According to the present invention manufactured as described above, the heat conductive semiconductor device 2 and the heat transfer block 3 are bonded to each other with a heat conductive heat curing adhesive, and then the surface of the heat transfer block 3 is processed to have a flat surface to uniformly bond the adhesive 1. It starts from manufacturing.

The present invention is the result of much effort to remove the conventional housing that wraps around the adhesive 1 and is secured with a screw 9. The result of the adhesive (1) may seem simple, but the productivity is achieved by eliminating the process of removing the housing and tightening many screws to secure the housing, and pre-production of the flattened part prior to assembly. Considering the efficiency, the assemblability to match the flatness, the replaceability during use, and the heat exchange performance due to the increase in quantity due to the removal of the housing are not technologies that can be easily considered by those skilled in the art.

1 adhesive 2 thermoelectric semiconductor element
3: heat transfer block 4: adhesive
5: jig 7: heat exchange target
8: heat sink 9: screw
10: heat exchanger 11: gasket
12: airtight member

Claims (10)

delete delete delete delete delete Closely bonding the heat transfer block 3 to the surface of the heat conductive element 2 with an adhesive 4 (S1), and attaching the adhesive 1 to which the heat transfer element 2 and the heat transfer block 3 are bonded. Fixing to the jig (5) (S2), and the exposed surface of the heat transfer block (3) fixed to the jig (5) planar processing with a cutter 61 to uniform thickness of the adhesive (1) Manufacturing a thermoconductor element adhesive 1 having a uniform flatness including a step of adjusting the flatness (S3);
Arranging the surfaces of the respective heat transfer blocks 3 of the plurality of thermoconductor element adhesives 1 on the contact surfaces of the heat exchange targets 7 so that the surfaces of the heat transfer semiconductor elements 2 are in close contact with the contact surfaces of the heat sink 8 (S30). );
Disposing a gasket (11) at an edge between the heat exchange target (7) and the heat sink (S40); And
And fastening the heat exchange target (7) and the heat sink (8) by screwing the thermoelectric semiconductor element adhesives (1) and the gasket (11) in close contact therewith (S50). A method of manufacturing a heat exchanger using a thermoelectric semiconductor device adhesive having a uniform flatness.
Closely bonding the heat transfer block 3 to the surface of the heat conductive element 2 with an adhesive 4 (S1), and attaching the adhesive 1 to which the heat transfer element 2 and the heat transfer block 3 are bonded. Fixing to the jig (5) (S2), and the exposed surface of the heat transfer block (3) fixed to the jig (5) planar processing with a cutter 61 to uniform thickness of the adhesive (1) Manufacturing a thermoconductor element adhesive 1 having a uniform flatness including the step of adjusting the flatness (S3);
Arranging the surfaces of the respective heat transfer blocks 3 of the plurality of thermoconductor element adhesives 1 on the contact surfaces of the heat exchange targets 7 so that the surfaces of the heat transfer semiconductor elements 2 are in close contact with the contact surfaces of the heat sink 8 (S30). );
Disposing a gasket (11) at an edge between the heat exchange target (7) and the heat sink (S40);
Fastening the heat exchange target (7) and the heat dissipation plate (8) by screwing the thermoelectric semiconductor device adhesives (1) and the gasket (11) in close contact therewith (S50); And
Put the heat exchanger device 10 after the step S50 into the vacuum chamber and coating the airtight member 12 on the outside of the heat exchanger device 10 in a vacuum state (S60); Method for manufacturing a heat exchanger using a semiconductor device adhesive.
Closely bonding the heat transfer block 3 to the surface of the heat conductive element 2 with an adhesive 4 (S1), and attaching the adhesive 1 to which the heat transfer element 2 and the heat transfer block 3 are bonded. Fixing to the jig (5) (S2), and the exposed surface of the heat transfer block (3) fixed to the jig (5) planar processing with a cutter 61 to uniform thickness of the adhesive (1) Manufacturing a thermoconductor element adhesive 1 having a uniform flatness including a step of adjusting the flatness (S3);
The surface of the heat transfer block 3 of the plurality of thermoconductor element adhesives 1 is in contact with the contact surface of the heat exchange target 7, and the surface of the heat conduction semiconductor element 2 is in close contact with the contact surface of the heat sink 8, respectively. Arranging the thermoelectric semiconductor element adhesive (1) between the heat sinks (8) to fix the heat exchange target (7) and the heat sinks (S20); And
Put the heat exchange apparatus 10 after the step S20 into the vacuum chamber and coating the airtight member 12 on the outside of the heat exchange apparatus 10 in a vacuum state (S60); Method for manufacturing a heat exchanger using a semiconductor device adhesive.

delete A heat exchanger using a thermoelectric semiconductor device adhesive having a uniform flatness, characterized in that it is manufactured by any one of claims 6 to 8.

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