KR20190054023A - Adhesive unit having uniform flatness and manufacturing method thereof, Heat exchanger using adhesive unit having uniform flatness and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a bonded part having a uniform flatness and a manufacturing method thereof; and a heat exchanger using a bonded part having a uniform flatness and a manufacturing method thereof. According to the present invention, a thermoelectric semiconductor element and a heat transfer block bonded thereto are bonded and fixed by a thermal conductive thermosetting adhesive and made into a single component form, and the surface of the heat transfer block is machined so as to make the thickness of the bonded part uniform, thereby achieving a uniform flatness, so that when assembling a plurality of bonded parts on the same plane, the flatness thereof would be uniform due to the uniform thickness of the bonded parts, and thus the flatness adjustment process can be eliminated from the assembly process, thus facilitating the assembly. In addition, when a heat exchanger is manufactured by using the bonded parts, the bonded parts are fixed without using a housing and screws, thereby reducing the number of assembly holes. Further, the present invention can increase heat transfer efficiency by providing the contact surface of a heat sink to be thin, whereas a conventional heat sink was necessarily excessively thick in order to secure the screw fastening space. Furthermore, the inconvenience of a conventional method, in which a flatness adjustment process needs to be carried out once more in a replacement process, is eliminated since a corresponding bonded part can be conveniently replaced in the event of a failure of the semiconductor element, thereby conveniently adjusting the flatness thereof.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a thermoelectric semiconductor element adhesive having uniform flatness, a method for producing the same, a heat exchanger using a thermoelectric semiconductor element adhesive having a uniform flatness, uniform flatness and method of manufacturing the same}

More particularly, the present invention relates to a heat exchange device, and more particularly, to a heat exchange device, in which a thermoelectric semiconductor element and a heat transfer block adhered thereto are adhered and fixed with a thermally conductive thermosetting adhesive to form a single component, It is possible to simplify the assembly by eliminating the process of matching the flatness pointed out as a conventional problem in the assembling process by matching the flatness by a certain thickness when a plurality of adhesive substances are assembled on the same plane by making the degrees uniform, It is possible to reduce the number of assembly holes by fixing the adhesive without using the housing and the screw when the heat exchanger is manufactured using the heat exchanger, and the thickness of the contact surface of the conventional heat sink, The heat transfer efficiency can be increased, and furthermore, An adhesive having uniform flatness which can eliminate the hassle of replacing the adhesive when the conductor element fails and matching the flatness with the flatness simply by matching the flatness again in the replacement process, and a method of manufacturing the same And a heat exchange apparatus using an adhesive material having a uniform flatness, and a method of manufacturing the same.

The heat exchanger is a type of air conditioner that uses a heat exchange medium to cool or heat a heat exchange object to be heat exchanged. The present invention uses a thermoelectric semiconductor element as a heat exchange medium.

The thermoelectric semiconductor device is an element that enables an environmentally friendly cooling system that breaks the existing cooling system using a compressor to circulate the refrigerant. Both sides of the thin plate made of a ceramic material are cooled and radiated Is a component to be carried out at the same time, and forms a unit together with a heat transfer block closely attached thereto, and is widely used in the heat exchange industry at present.

Such a thermoelectric semiconductor device is formed in a thin plate shape, and one side is cooled when power is supplied, and the other side is necessarily dissipated so that the cooling state can be continuously maintained. Therefore, the lower the temperature of the heat dissipation surface, the lower the temperature of the cooling surface as well as the cooling efficiency.

Therefore, the heat exchanging device using the thermoelectric semiconductor device has to cool the heat radiating surface of the thermoelectric semiconductor element as much as possible. Therefore, the temperature of the heat radiating surface is lowered by the cooling means like the heat radiating plate.

Hereinafter, the technology of a heat exchanger using a thermoelectric semiconductor device will be described.

Open No. 10-2006-0100882 (published on September 21, 2006), there is a cooling apparatus using a thermoelectric element. As can be seen from FIGS. 1 to 4, this technique includes a base plate 10, a thermoelectric element 20 attached by grease to the upper surface of the base plate 10, A cooling block 30 attached to the case 40 by a grease and a case 40 coupled to the cooling block 30 and the base plate 10 and a cooling block 30 coupled to the case 40, And a hermetic member 50 that hermetically seals the hermetic container 10.

In this technique, when power is supplied to the thermoelectric element 20, the thermoelectric element 20 cools one side of the cooling block 30, which is in close contact with the other side thereof, and the other side is radiated, Thereby heating the base plate 10 that is in contact. Therefore, the cooling block 30 is always kept in a cooled state to perform the original purpose of cooling a heat exchange object in intimate contact with the cooling block 30. The base plate 10 is fixed to a heat sink (not shown) .

Since the case 40 is fastened and fixed to the base plate 10 by using a screw in a state where the thermoelectric element 20 and the cooling block 30 are accommodated in the case 40, In order to fix the element 20 and the cooling block 30, the case 40 and the screw must be used.

However, since the case 40 has a large width along the periphery of the thermoelectric element 20 and the cooling block 30 so as to protrude therefrom with a considerable width, the case 40 has a large volume, The structure is complicated because the cavity 41 is formed and the case 40 is disturbed when the thermoelectric elements 20 are densely arranged in order to increase the heat exchange performance so that the thermoelectric elements 20 can not be densely arranged there was.

Further, since the case 40 is fixed to the base plate 10 with screws, there is a problem that the base plate 10 must have a sufficient thickness so that the screw can be securely fixed. More specifically, the base plate 10 is fixed to a separate heat radiating plate to perform heat radiation. If the thickness of the base plate 10 is excessively large, the heat transfer to the heat radiating plate is delayed to lower the heat radiation efficiency, There is a problem that the cooling performance of the heat exchanger is deteriorated.

This is because the thermoelectric element 20 and the cooling block 30 are simply stacked and the case 40 accommodating the thermoelement 20 and the cooling block 30 is fixed with a screw. That is, since the thermoelectric elements 20 and the cooling block 30, which should be tightly adhered to each other, are simply stacked and tightly fixed to the case 40, the cost increase and assembly inconvenience associated with the use of the case 40 can not be avoided In particular, the thermoelectric elements 20 and the cooling block 30 must be closely adhered to each other in order to increase the thermal conductivity. Since the thermoelectric elements 20 and the cooling block 30 are simply stacked, fine voids (voids due to roughness of the contact surfaces) The cooling efficiency is not good.

In particular, since thermoelectric elements use an adhesive in the inside of the manufacturing process, the thickness of the thermoelectric device varies depending on the amount of adhesive used. That is, even thermoelectrons manufactured under the same conditions have different thicknesses depending on the use of the adhesive, and the flatness of the single body does not match due to the inclination of both sides.

Therefore, when a plurality of cases 40, in which the thermoelectric elements 20 and the cooling blocks 30 are laminated and housed, are provided on the same plane to cool the object, the thermoelectric elements The thickness and the flatness of the base plate 10 and the cooling block 30 in contact with the thick thermoelectric elements 20 are set so as to be close to the heat sink plate and the object The base plate 10 and the cooling block 30 which are in contact with the thin thermoelectric elements 20 are not in contact with or closely contacted with the heat sink and the object to be in contact therewith, I could not avoid it.

That is, since the thermoelectric elements 20 accommodated in the respective cases 40 are not coincident in thickness and flatness, only the thick thermoelectric elements 20, the stacked base plate 10 and the cooling block 30 are brought into contact with the heat sink and the object There was a serious problem.

In addition, a thermoelectric semiconductor element unit of a patent application No. 10-2010-0004145 (published on Nov. 03, 2010) and a manufacturing method thereof have been disclosed. In this case, the housings 20 are housed in the housing 20 in a state in which the thermoelectric semiconductor elements 30 and the first and second blocks 40 and 50 are housed in the housing 20, (H) as shown in Fig.

Therefore, in order to fix the thermoelectric semiconductor element 30 and the first and second blocks 40 and 50 to the heat sink H, the housing 20 and the screw must be used. Therefore, And the connecting portion of the heat sink H must be made unnecessarily thick in order to secure a thickness at which the screw is stably clamped.

A plurality of housings 20 accommodating the thermoelectric semiconductor elements 30 and the first and second blocks 40 and 50 are provided on the same plane so that when the object is cooled, Since the thickness and the flatness of the thermoelectric semiconductor elements 30 are different from each other, the conventional serious problem that only the thick thermoelectric semiconductor element 30 and the first and second blocks 40 and 50 which are laminated to the heat sink and the object are still avoided I could not.

Other prior arts have disclosed a thermoelectric semiconductor element unit of Patent Application No. 10-2009-0058735 (issued on September 28, 2010) and a manufacturing method thereof. This technology is similar to the technology of the already-mentioned Patent Application No. 10-2010-0004145 described above, and has a problem in using the housing and the screw as described above, and a problem that when a plurality of the housings 20 are used on the same plane, Only the first and second blocks 40 and 50 stacked together with the thermoelectric semiconductor element 30 having a thickness are in contact with the heat sink and the object.

On the other hand, another conventional technique is a thermoelectric semiconductor device unit disclosed in Japanese Patent Laid-Open No. 10-2010-0123320 (published on Nov. 24, 2010), a patent application No. 10-2012-0013936 (published on Mar. 10, 2014) Has been disclosed. This technique, as already described, has the same problems as using the housing and the screw. Although the spring and the spring are embedded in the housing to tightly fix the block and the thermoelectric semiconductor element, the height of the block is increased by the use of the spring, thereby increasing the thickness of the heat exchanger.

As another conventional technique, a chiller disclosed in Japanese Patent Application Laid-Open No. 10-2012-0132018 (published on Dec. 5, 2012) and a manufacturing method thereof have been disclosed. This technique is a technique developed by the present inventor and relates to a method of fixing a heat radiating surface of a plurality of thermoelectric elements to a heat sink, and it is a more advanced technology than the conventional technology because it has a technique of matching flatness.

Specifically, arranging a plurality of thermoelectric elements (23) in a surface contact state on one side or both sides of the heat sink (22); Mounting a cool block (24) on each of the thermoelectric elements (23) arranged; The cool block 24 and the thermoelectric element 23 are covered with the lid 25 so that the cool block 24 is exposed and the lid 25 is fixed to the heat radiating plate 22, (23); Fixing the case (26) to the heat sink (22) so as to receive and protect the thermoelectric elements (23) inside the case (26); Fixing the heat sink (22) to the jig (G), processing the exposed cool blocks (24) and the case (26) to the same height to match the flatness; The cool blocks 24 and the case 26 are connected to the outside of the heat exchanger 21 so as to fix the heat sink 22 on which the processed cool blocks 24 are mounted to one side or both sides of the heat exchanger 21. [ In a surface contact state; And the case 26 is inserted into the case 26 through the injection port 26a and the case 26 is filled with the heat insulating member 27 to discharge the inside air to the outside, And sealing.

This technique mounts a heat exchanger 21 having a thermoelectric element 23 and a cooling block 24 mounted between two outer heat sinks 22 as shown in FIGS. 14 to 16, A plurality of thermoelectric elements 23 and a cool block 24 are stacked on the contact surface and the cool block 24 is covered with a lid 25 so that the upper part of the cool block 24 is exposed. Then, the screw is fastened to the contact surface of the heat sink 22, The heat sink 22 is fixed to the jig G and then the exposed cool blocks 24 are processed to the same height by using a machine tool or the like to achieve a flatness.

The reason why the exposed cool blocks 24 are processed to adjust the flatness is to uniformize the height and flatness of the thermoelectric elements 23 having different thicknesses and the cool block 24 stacked thereon.

If the flatness of the plurality of thermoelectric elements 23 does not coincide with each other, that is, if the thickness and flatness of the thermoelectric elements 23 are different from each other, The thermoelectric element 23 having a small thickness does not come into close contact with the heat sink 22 and the cool block 24 which is laminated on the thin thermoelectric element 23 does not come into close contact with the contact surface of the heat exchanger 21. Therefore, not only the low temperature of the cooling surface of the thermoelectric element 23 can be transmitted smoothly to the heat exchanger 21, but also the heat radiating surface is separated from the heat radiating plate 22, There arises a problem that the cooling performance is significantly lowered.

In order to solve such a problem, a process is required to uniformize the height and flatness of each of the thermoelectric elements 23 and the cool blocks 24 stacked in parallel between the heat exchanger 21 and the heat sink 22, The surface of each cool block 24, which is laminated on the thermoelectric element 23 and is fixed to be exposed to the lid 25, as shown in Fig. 11, M) to uniformly adjust the flatness.

However, in the related art, since the laminated thermoelectric element 23 and the cool block 24 are wrapped with the lid 25 and the lid 25 is fastened to the heat sink 22 using screws, And it has all the problems associated with the use of the lid 25. If any one of the thermoelectric elements 23 of the manufactured chiller is broken, the failed thermoelement 23 must be replaced. Since the replaced thermoelement 23 has a flatness different from that of the already used thermoelement 23, It is troublesome to fix the heat sink 22 to the jig again and then to rework the surface of each cool block 24 with the machine tool M. [ Due to such a problem, it is a reality that the conventional chiller disposes of the chiller itself when the thermoelectric element 23 breaks down because its replacement work is troublesome.

Korean Patent Publication No. 10-2006-0100882 (published on September 21, 2006) Korean Patent Application No. 10-2010-0004145 (Notice of Nov. 03, 2010) Korean Patent Publication No. 10-2010-0123320 (published on Nov. 24, 2010) Korean Patent Application No. 10-2012-0013936 (Announcement on Mar. 10, 2014) Korean Patent Publication No. 10-2012-0132018 (published on December 05, 2012)

The object of the present invention is to solve the problems of the conventional heat exchanger as described above, and it is an object of the present invention to provide a thermoelectric semiconductor device and a heat transfer block closely attached thereto by thermally- The surface of the heat transfer block is processed to uniformize the flatness of the heat transfer block so that the flatness is matched by a predetermined thickness when a plurality of adhesives are assembled on the same plane to eliminate the process of matching the flatness pointed out in the conventional process And to provide a thermoelectric semiconductor element adhesive that can be easily assembled and has a uniform flatness, and a method of manufacturing the same.

Another object of the present invention is to reduce the number of assemblies by fixing the adhesive in a state in which the housing and the screw are not used when the heat exchanger is manufactured using the adhesive, The present invention also provides a heat exchanging apparatus using the thermoelectric semiconductor element adherend having a uniform flatness which can increase the heat transfer efficiency by making the thickness of the contact surface of the conventional heat sink plate small.

It is still another object of the present invention to provide a method of manufacturing a thermoelectric semiconductor device, in which a flatness is easily matched by replacing a corresponding adhesive when a thermoelectric semiconductor device fails, and therefore, a flatness capable of eliminating the conventional hassle, A heat exchanger using a thermoelectric semiconductor element adhered uniformly, and a method of manufacturing the same.

It is a further object of the present invention to provide a heat exchanger having an outer surface, which is manufactured by using a thermoelectric semiconductor element adhesive having a uniform flatness, by coating the outer surface of the heat exchanger with a hermetic member in a vacuum state, A heat exchanging device using the thermoelectric semiconductor device adhered with uniformity in flatness to penetrate into the heat exchanger, thereby preventing the flow of electricity to the inside of the heat exchanger, thereby ensuring safety of use, and a method of manufacturing the heat exchanger.

According to an aspect of the present invention, there is provided a method for manufacturing a thermoelectric semiconductor element adhesive having uniform flatness, comprising the steps of: (S1) closely bonding a heat transfer block to a surface of a thermoelectric semiconductor element with an adhesive;

(S2) fixing the adhesive to which the thermoelectric semiconductor element and the heat transfer block are adhered to the jig; And

(S3) of flattening the exposed surface of the heat transfer block fixed to the jig by planarizing the surface with a cutter to make the thickness of the adhesive constant.

In the present invention, the adhesive for bonding the thermoelectric semiconductor element and the heat transfer block in the step S1 is a thermally conductive thermosetting adhesive, and its physical properties are a viscosity of 8,000 to 8,800 Pa · s, a thermal conductivity of 1 to 1.44 W / m · K, Type) 55 to 62D.

The heat transfer block of the present invention is formed such that the width or width of the heat transfer block is larger than that of the thermoelectric semiconductor and both sides of the width or width of the heat transfer block are fixed tightly to the jig. Fix the heat transfer block to a low state so that the cutter does not collide with the cutter when machining the surface of the heat transfer block.

A method of manufacturing a heat exchanger using a thermoelectric semiconductor element adhesive having uniform flatness according to the present invention comprises the steps of: S1) closely bonding a heat transfer block to a surface of a thermoelectric semiconductor element with an adhesive; A step S2 of fixing the adhered adhesive to the jig, a step S3 of flattening the exposed surface of the heat-conducting block fixed to the jig by flattening the adhesive with the thickness of the adhered material, (S10) a thermoelectric semiconductor element adhesive having a uniform flatness; And

A thermoelectric semiconductor element adhesive is disposed between the heat exchange target and the heat sink so that the surface of the heat transfer block of the plurality of thermoelectric semiconductor element adhesives is in contact with the contact surface of the heat exchange object on the contact surface of the heat sink, (Step S20).

According to another embodiment of the present invention, there is provided a method for manufacturing a heat exchanger using a thermoelectric semiconductor element adhesive having uniform flatness, comprising the steps of: (S1) closely bonding a heat transfer block to a surface of a thermoelectric semiconductor element with an adhesive; A step S2 of fixing the adhesive to which the heat transfer block is adhered to the jig, a step S3 of flattening the exposed surface of the heat transfer block fixed to the jig by flattening the adhesive with the thickness of the adhesive, (S10) of producing a thermoelectric semiconductor element adhesive having uniform flatness;

Arranging the surfaces of the heat transfer blocks of the plurality of thermoelectric semiconductor element adhesives so that the surface of each thermoelectric semiconductor element is in contact with the contact surface of the heat sink on the contact surface of the heat exchange object;

Disposing a gasket at an edge between the heat exchange target and the heat sink (S30); And

And a step (S40) of fastening the gasket and the thermoelectric semiconductor device adhesives located inside by screwing the heat exchange target and the edge of the heat sink to each other.

According to still another embodiment of the present invention, there is provided a method of manufacturing a heat exchanger using a thermoelectric semiconductor element adhesive having uniform flatness, comprising the steps of: (S1) closely bonding a heat transfer block to a surface of a thermoelectric semiconductor element with an adhesive; (S2) fixing the adhesive to which the heat transfer block is adhered to the jig (S2), flattening the exposed surface of the heat transfer block fixed to the jig by a cutter to make the thickness of the adhesive constant, (S10) of producing a thermoelectric semiconductor element adherend having a uniform flatness;

Arranging the surfaces of the heat transfer blocks of the plurality of thermoelectric semiconductor element adhesives so that the surface of each thermoelectric semiconductor element is in contact with the contact surface of the heat sink on the contact surface of the heat exchange object;

Disposing a gasket at an edge between the heat exchange target and the heat sink (S30);

(S40) tightening the gasket and the thermoelectric semiconductor element adhesives located inside by fastening the heat-exchange target and the edge of the heat sink with screws; And

And a step (S50) of inserting the heat exchanger completed in step S40 into the vacuum chamber and coating the hermetic member on the outside of the heat exchanger in a vacuum state.

In the heat sink of the present invention, the heat-radiating fins are housed in the inner heat-exchange chamber, the heat-exchanging chambers are sealed by the lid, and the inlet and the outlet through which the cooling water flows in and out are formed on the side communicating with the heat exchange chamber. ;

The contact surfaces of the heat sinks to which the thermoelectric semiconductor elements are closely contacted are processed by planarizing the upper surface, the lower surface, or the upper and lower surfaces exposed with the cutter in a state where both side surfaces forming the thickness of the heat sink are compressed by jig, The jig is provided with a side edge of the heat sink on which the wall of the heat exchange chamber is located to be fixed by pressing so that the flatness of the contact surface does not change even if the jig is released from the clamped state.

The present invention relates to a thermoelectric semiconductor device and a heat transfer block by bonding a thermoelectric semiconductor element and a heat transfer block with a thermally conductive thermosetting adhesive, fixing the adhesives to a prepared jig, It is possible to simplify the assembly by simply mass-producing the adhesive material as one independent component and solving the flatness problem which is pointed out as the most problem in using the thermoelectric semiconductor device.

In addition, the present invention simplifies the replacement operation by simply replacing a new bonding material that has already been planarized in the event of a thermoelectric semiconductor device failure, by making the flatness of all the bonding materials the same as the initial assembly state, .

Further, in order to fix the thermoelectric semiconductor element, the present invention does not require a thermoelectric semiconductor element and a housing for fastening and fixing the thermoelectric semiconductor element to the heat sink, and a screw for fastening the thermoelectric semiconductor element to the heat sink. Thus, not only cost can be reduced, .

In addition, the present invention has an advantage that the heat transfer efficiency can be improved by eliminating the latent heat hidden in the heat radiating plate while the heat transfer is proceeding rapidly by making the contact surface thickness of the conventional heat radiating plate thinner than necessary for securing the screw fastening place .

That is, the thickness of the heat sink contact surface to which the thermoelectric semiconductor elements are closely contacted is remarkably reduced, and the heat radiated from the thermoelectric semiconductor elements is immediately transferred to the heat sink through the thickness of the thin contact surface to increase the heat radiation efficiency.

In addition, according to the present invention, when the heat exchanging device is put into a vacuum chamber at the final stage of manufacturing and the airtight member is coated on the outer surface in a vacuum state, air inside is removed so that condensation water is generated inside the thermoelectric semiconductor device And the sealed airtight member hermetically closes the heat exchanger to block the electric current from flowing into the interior of the heat exchanger, thereby solving the conventional problem of electric leakage due to condensation water.

1 is a front elevational view of a heat exchanger according to the present invention;
Fig. 2 is a conceptual diagram of a glue enlargement according to the present invention
3 is a conceptual view showing a state in which the adhesive of the present invention is fixed to a jig
4 is a front elevational view of a heat exchanger in which an adhesive and a gasket are assembled according to the present invention
5 is a plan view showing the interior of the heat sink according to the present invention.
Figure 6 is a top view of a heat sink in which an adhesive according to the present invention is disposed.
Fig. 7 is a flow chart of the adhesive preparation process according to the present invention
8 is a flowchart of a heat exchange apparatus manufacturing process according to an embodiment of the present invention
9 is a flowchart of a heat exchanger manufacturing process according to another embodiment of the present invention
10 is a flowchart of a heat exchanger manufacturing process according to another embodiment of the present invention
11 is a flowchart of a heat exchanger manufacturing process according to another embodiment of the present invention

Hereinafter, a heat exchanger and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in the figure, the method for manufacturing the thermoelectric semiconductor element adhesive 1 according to the present invention is such that the heat transfer block 3 is bonded to the surface of the thermoelectric semiconductor element 2 with the adhesive 4, (S1);

(S2) fixing the adhesive (1) to which the thermoelectric semiconductor element (2) and the heat transfer block (3) are bonded to the jig (5); And

(S3) of flattening the exposed surface of the heat transfer block (3) fixed to the jig (5) by planarizing the surface of the heat transfer block (3) with the cutter (61) while keeping the thickness of the adhesive (1) constant.

A thermally conductive thermosetting adhesive is used as the adhesive 4 used in the step S1 of closely bonding the heat transfer block 3 to the surface of the thermoelectric semiconductor element 2 with the adhesive 4. [

As described above, when power is supplied, one side of the thermoelectric semiconductor element 2 becomes a cooling surface due to its low temperature and the other side thereof serves as a heat-radiating surface which takes heat of the cooling surface and radiates heat to the outside, The temperature is considerably higher than the cotton. Therefore, when the heat is radiated smoothly on the heat-radiating surface and the temperature is lowered, the temperature of the cooling surface is also lowered in proportion thereto. Therefore, in order to increase the cooling efficiency, it is required to lower the temperature of the heat-

In the present invention, the cooling surface of the thermoelectric semiconductor element 2 is closely adhered to the heat transfer block 3 using a thermally conductive thermosetting adhesive. Of course, if the polarity of the power supply is changed, the cooling surface becomes the heat dissipation surface, the heat dissipation surface becomes the cooling surface, and such a polarity change can be changed according to the user's power supply polarity selection.

If the object 7 to be cooled is directly brought into close contact with the cooling surface of the thermoelectric semiconductor element 2 without using the heat transfer block 3, the object 7 can be cooled more quickly and at a lower temperature . Nevertheless, the reason why the heat transfer block 3 is closely attached to the thermoelectric semiconductor element 2 and the heat transfer block 3 is tightly fixed to the heat exchange object 7 is inevitably used in order to match the flatness. That is, in order to cool the object 7 having a large area, a plurality of thermoelectric semiconductor elements 2 are arranged at regular intervals to uniformly cool the entire object 7 as shown in FIG. 6, Since the thermoelectric semiconductor elements 2 have different thicknesses and flatnesses, it is impossible to closely adhere the cooling surface of each of them to the heat exchanging object 7 with the heat radiating plate 8 tightly.

More specifically, when examining closely the present thermoelectric semiconductor devices, the thicknesses of the thermoelectric semiconductor devices are different from each other, but the sides of the thermoelectric semiconductor devices are not parallel to each other, and their inclination and flatness do not match. Therefore, only a part of the thick thermoelectric semiconductor elements 2 are brought into close contact with the heat radiation surface 8 of the heat exchanging object 7 and the thermoelectric semiconductor elements 2 having a thin thickness, And the heat radiation surface does not contact the heat radiating plate 8 smoothly so that the heat radiation does not proceed smoothly. As a result, the cooling efficiency is low so that the object 7 can not be lowered to the desired cooling temperature.

1 and 2, the heat transfer block 3, which is a non-ferrous metal having a good thermal conductivity on the cooling surface of the thermoelectric semiconductor element 2, and the heat transfer block 3 mainly composed of aluminum or copper, The heat transfer blocks 3 constituting the adhesive 1 are fixed to the jig 5 and then the exposed surfaces are processed to form thermoelectric semiconductor elements 2 and heat transfer blocks 3) is equalized to the flatness even though the thickness is uniform. At this time, the bottom surface of the thermoelectric semiconductor element 2 is brought into close contact with the bottom surface of the jig 5, and the cutter 61 of the machine tool 6 is lowered to the heat transfer block 3 mounted on the thermoelectric semiconductor element 2 So that the flatness becomes uniform.

In this case, the total thickness of the bonded thermoelectric semiconductor elements 2 and the heat transfer block 3 is uniform and uniform to the flatness. Therefore, the adhesives 1 used when the heat exchanger 10 is formed by using a plurality of the adhesives 1 to cool the heat exchanger object 7 are uniform in thickness and flatness, so that the heat transfer blocks 3 The thermoelectric semiconductor element 2 can be closely fixed to the heat exchanging object 7 and the heat sink 8 so as to cool the heat exchanger object 7 to a lower temperature than the conventional one.

In the step S1, the thermoelectric semiconductor elements 2 and the heat transfer block 3 are closely adhered using a thermally conductive thermosetting adhesive as shown in FIG. This can be done manually or by an automated process by a mechanical device, and after the bonding, the drying process is performed for a certain period of time so that the thermally conductive thermosetting adhesive can be dried. The thermally conductive thermosetting adhesive to be used is a known one having a viscosity of 8,000 to 8,800 Pa · s, a thermal conductivity of 1 to 1.44 W / m · K, and a hardness Shore (D type) of 55 to 62 D. The thermally conductive thermosetting adhesive is excellent in heat transfer and hardly generates heat loss, so that the object of the present invention can be achieved.

When the thermally conductive thermosetting adhesive is dried, the thermoelectric semiconductor elements 2 and the heat transfer block 3 are firmly adhered and fixed to form a single bonded object 1, so that the thermoselective semiconductor element 2 and the heat transfer block 3 can not be separated. Therefore, if the thermoelectric semiconductor element 2 fails during use, it is replaced with the heat transfer block 3.

Since the step S1 is a step of bonding and fixing the thermoelectric semiconductor element 2 and the heat transfer block 3 with the adhesive 4, the operation thereof is relatively simple. However, there is no prior art in which the thermoelectric semiconductor element 2 and the heat transfer block 3 are bonded to each other before the heat exchanger 10 is assembled, and a single component There is no technique for machining the heat transfer block 3 of the bonded product 1.

The above-mentioned prior art Patent No. 10-2012-0132018 is a method developed by the inventor several years ago to meet the flatness. As described above, since the thermoelectric element 23 and the cool block 24 are covered with the lid 25 and the lid 25 is fixed by the screw, there is a problem in using the lid 25, If the element 23 fails, the surface of each cool block 24 must be processed again after replacing the failed thermoelectric element 23. If the thermoelectric element 23 fails due to such a problem, the chiller itself is discarded Currently, it is not used because of the problem.

In order to solve such a conventional problem, the present invention fixes the thermoelectric semiconductor element 2 and the heat transfer block 3 with an adhesive 4 to form a single component. The single component is inserted into the jig 5, Since the thickness and flatness of the adhesive 1 are made uniform before assembling the heat exchanger 10 by processing the block 3, the present invention is not limited to the technical idea of the prior art of Japanese Patent Application No. 10-2012-0132018 This is a completely different thing.

After the step S1 is completed, a step S2 of fixing the adhesives 1 to the jig 5 so as to match the flatness of the adhesives 1 composed of the thermoelectric semiconductor elements 2 and the heat transfer block 3 It proceeds. As shown in FIG. 3, the jig 5 may be formed in various forms. In one embodiment, a receiving groove 51 for receiving the adhesive 1 is formed, and the adhesive 51 inserted in the receiving groove 51 A slide member 52 is formed at an end of the bolt 53 so as to fix the side of the water 1 and reciprocates when the bolt 53 rotates so that the side surface of the heat transfer block 3 constituting the adhesive 1 Respectively. A plurality of the receiving grooves 51 are formed in a row and the slide members 52 and the cutter 61 are formed long to correspond to the receiving grooves 51 so that the surfaces of the plurality of heat transfer blocks 3 are It is preferable to uniformize the flatness of the adhesive 1 by processing. If the adhesive 1 is fixed so that the bottom surface of the thermoelectric semiconductor element 2 constituting the adhesive 1 is in close contact with the bottom surface of the jig 5 in the step S2, ) Are equal in thickness and flatness.

The heat transfer block 3 is formed to have a width or a width larger than that of the thermoelectric semiconductor and both sides of the heat transfer block 3 which form a width or a width larger than the width of the thermoelectric semiconductor are closely fixed to the jig 5, The heat transfer block 3 is fixed with the upper end lower than the upper surface of the heat transfer block 3 so that the cutter 61 does not collide with the cutter 61 when the surface of the heat transfer block 3 is machined. Also, when the bolt 53 is fastened and the slide member 52 is pressed and fixed to the side surface of the heat transfer block 3, the heat transfer block 3 is not compressed and deformed convexly. If the exposed plane of the heat transfer block 3 is deformed convexly or concavely by tightening the bolts 53 too tightly, the cutter 61 is machined in the plane in this state, and the post- The heat transfer block 3 is restored to the original state in the machined state, so that the machined surface is inevitably deformed and the flatness is not matched, so that the object of the present invention can not be achieved.

After the step S2 is completed, the exposed surface of the heat transfer block 3 fixed to the jig 5 is planarized by a cutter 61 to adjust the flatness of the adhesive 1 S3).

For example, in step S3, a cylindrical cutter 61 that linearly moves while rotating on the jig 5 can be used. When the cutter 61 in which the jig 5 is fixed and linearly moves and rotates is machined on the surface of the heat transfer block 3 of the adhesive 1 fixed to the receiving groove 51 of the jig 5, Since the water (1) is processed to a predetermined thickness, the flatness becomes uniform.

As described above, the plurality of thermoelectric semiconductor elements 2 to be used have different thicknesses and flatnesses due to the use of the adhesive 4 at the time of manufacturing. In addition, the thermoelectric semiconductor elements 2 are adhered to each other according to the thickness of the heat- The thickness and flatness of the water (1) are different. Therefore, if the surface of the exposed heat transfer block 3 is processed by the cutter 61 of the machine tool 6 after fixing the adhesive 1 to the jig 5, the processed adhesives 1 have a certain thickness But the flatness is matched. When the flat surface of the heat transfer block 3 is machined by the cutter 61 of the machine tool 6, the cutter 61 pushes the surface of the heat transfer block 3, The adhesive is kept in a pressurized state without moving, so that the thicknesses of all the bonded objects 1 to be processed are constant and uniform to flatness.

The bonded products 1 thus processed are mass-produced and mass-produced in a state where a plurality of the bonded products 1 are fixed in the jig 5, so that they are convenient to use and can be easily replaced when the thermoelectric semiconductor element 2 is broken during use of the heat exchanger 10 There is an effect that it is not necessary to carry out troublesome additional work for adjusting the flatness separately during the replacement process.

When the step S3 is completed, the thermoelectric semiconductor element adhesive 1 of the present invention having a uniform flatness is completed.

Next, a method of manufacturing the heat exchanger 10 using the thermoelectric semiconductor element adhesive 1, which has been manufactured through steps S1 to S3 and has a uniform flatness, will be described.

The method for manufacturing the heat exchanger 10 according to the present invention includes the steps of: (S10) fabricating a thermoelectric semiconductor element adhesive 1 having uniform flatness through steps S1 to S3 as shown in FIG. 8; And

The surface of the heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is adhered to the contact surface of the heat exchange object 7 with the heat exchange object 7 so that the surface of the thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 The step (S20) of placing the thermoelectric semiconductor element adhesive 1 between the heat sinks 8 and fixing the heat transfer target 7 and the heat sinks 8.

Since step S10 includes steps S1 through S3, it has already been described above, and thus a detailed description thereof will be omitted.

When the step S10 is completed, a step S20 of fixing the adhesive 1 between the heat exchanging object 7 and the heat sink 8 is performed. That is, the surface of the heat transfer block 3 of the adhesive 1 is fixed to the contact surface of the heat exchange object 7 so that the surface of the thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8.

When a plurality of adhesive substances 1 are provided between the object 7 and the heat sink 8 in step S20, the thermoelectric semiconductor elements 2 of the adhesives 1 are placed on the heat sink plate 8 at regular intervals The heat transfer object 7 is mounted on the upper portion of the heat transfer block 3 and then the edge of the heat sink 8 and the edge of the object 7 to be heat exchanged are fastened and fixed with screws 9 to press the adhesive 1 in a pressurized state Fixed. The heat transfer block 3 is adhered to the thermoelectric semiconductor element 2 to form a single part when the heat transfer object 7 is mounted on the heat transfer block 3 and moves to set the assembly position in the assembly process So that it does not move separately from the thermoelectric semiconductor elements 2.

Since the housing used as the fixing means for fixing the conventional thermoelectric semiconductor is not used in the step S20, the adhesives 1 can be densely arranged close to each other. When the adhesive 1 is densely arranged, the thermoelectric semiconductor elements 2 The heat exchange performance of the heat exchange device 10 can be increased. Further, according to the present invention, since the screw for fixing the housing is not fastened to the heat dissipating plate 8 because the housing is not used, the number of assembling holes is reduced, and the heat dissipating plate 8 is thickened It does not need to be formed. 4, when the thickness of the heat sink 8 is thinned within a safe range, the heat of the heat radiating surface of the thermoelectric semiconductor element 2 is quickly transferred to the heat sink 8, Can be increased.

The reason why the conventional housing is not used and thus the screw for fixing the housing is not used is that the thermoelectric semiconductor element 2 and the heat transfer block 3 are bonded to each other to form a single component .

When the thermoelectric semiconductor element 2 and the heat transfer block 3 are adhered to each other to form a single part, that is, when the thermoelectric semiconductor element 2 becomes the adhesive 1, they are not separated at the time of assembly, and they are placed between the object 7 and the heat sink 8 Easy to assemble. If the thermoelectric semiconductor element 2 and the heat transfer block 3 are separated from each other without being bonded by the adhesive 4 as in the conventional case, when the heat transfer block 3 is simply laminated on the thermoelectric semiconductor element 2 The heat transfer block 3 moves when the thermoelectric semiconductor element 2 is placed on the heat radiating plate 8 and then the heat transfer block 3 is mounted on the heat transfer block 3 in order to adjust the assembling position The heat transfer block 3 is stacked on the thermoelectric semiconductor element 2 in a state where the heat transfer block 3 is initially out of the assembled position, so that the contact area between the heat transfer block 3 and the heat transfer block 3 is reduced and the heat exchange efficiency is lowered.

The method for manufacturing the heat exchanger 10 according to another embodiment of the present invention includes the steps of producing a thermoelectric semiconductor element adhesive 1 having uniform flatness through steps S1 through S3 as shown in FIG. ;

The surface of each heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is placed on the contact surface of the heat exchange object 7 so that the surface of each thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 );

Disposing a gasket (11) at an edge between the heat exchange object (7) and the heat sink (8) (S40); And

(S50) tightening the gasket 11 and the thermoelectric semiconductor element adhesives 1 located inside by tightening the edges of the heat exchange object 7 and the heat sink 8 with the screws 9.

Since step S10 has already been described above, a detailed description will be omitted in order to avoid redundancy.

The step S30 is a step of disposing the heat radiating surfaces of the thermoelectric semiconductor elements 2 constituting the adhesive 1 at regular intervals on the heat radiating plate 8 as shown in FIG. 6, 2) are used more frequently so that the heat exchanger 10 has a better cooling performance.

The step S40 of disposing the gasket 11 is a process for sealing the adhesive 1 by fixing the gasket 11 to the edge between the heat exchange object 7 and the heat sink 8. [ A plurality of adhesives 1 are disposed between the heat exchange target 7 and the heat sink 8. The thermoelectric semiconductor elements 2 constituting the adhesive 1 cool the heat exchange object 7 when the object 1 is cooled When the temperature falls below the dew point, water vapor collects to form condensation water, which must inevitably occur due to the temperature difference. The condensation water generated around the thermoelectric semiconductor element 2 gradually increases in quantity and flows down to the periphery, causing a problem of corrosion of the object 7 and the heat sink 8 made of a metal material. There is a problem that the whole system using the heat exchange object 7 and the object 7 for heat exchange is electrically influenced and mass production of defective products or failure of the entire system itself occurs.

For example, the heat exchanging apparatus 1 of the present invention is used for suppressing the overheating of the apparatus for manufacturing wafers in the semiconductor manufacturing process. The object 7 to be cooled is used in close contact with the wafer manufacturing apparatus. The wafer is a highly precise product in which the elements such as transistors and diodes are formed on the surface and electrodes are made, that is, several hundred IC chips are arranged. If electricity exceeding the allowable limit is supplied to the apparatus for manufacturing the wafer and the current and the voltage are changed, the degree of integration of the wafer becomes abnormal, and thus, the expensive wafer becomes defective and the economic loss becomes large. In order to solve such a problem, when a leakage current occurs in a device for manufacturing a wafer, a monitoring device for immediately stopping the system drive is provided to prevent the production of defective wafers.

When a coolant (not shown) that circulates in the heat exchange object 7 due to the energization of the condensation water generated around the thermoelectric semiconductor element 2 in the wafer manufacturing process causes a change in characteristics, the wafer manufacturing apparatus is not normally cooled However, since the condensed water leaks electricity, there is a serious problem that the entire system of the wafer producing apparatus is shut down. In order to prevent this phenomenon, it is very important to shut off the power to the condensation water generated around the thermoelectric elements.

The gasket 11 used in the step S40 of disposing the gasket 11 is coated with an adhesive agent (not shown) at both end portions forming a thickness, that is, at both end portions of the heat- To adhere to the heat exchange target 7 and the heat sink 8 so that the outside air does not penetrate into the gasket 11.

As described above, when the gasket 11 is disposed in step S40, the edges of the heat exchange object 7 and the heat sink 8 are fastened with the screws 9, and the thermoelectric semiconductor element adhesives 1 and the gasket (S50) of tightly fixing the base 11 is proceeded. When the screw 9 is fastened, the heat exchange object 7 and the heat sink 8 are pulled together to press a plurality of the adhesive 1 and the gasket 11 located therebetween, The thermoelectric semiconductor elements 2 are in close contact with the heat radiating plate 8 and the heat transfer block 3 with the heat exchanging object 7 and the both ends of the gasket 11 are tightly fixed to each other.

The method for manufacturing the heat exchanger 10 according to another embodiment of the present invention includes steps S10 to S3 of fabricating a thermoelectric semiconductor element adhesive 1 having a uniform flatness );

The surface of each heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is placed on the contact surface of the heat exchange object 7 so that the surface of each thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 );

Disposing a gasket (11) at an edge between the heat exchange object (7) and the heat sink (8) (S40);

(S50) tightening the gasket (11) and the thermoelectric semiconductor element adhesives (1) located inside by fastening the edges of the heat exchange object (7) and the heat sink (8) with screws (9); And

And a step (S60) of inserting the heat exchanger 10 after the step S50 into the vacuum chamber and coating the hermetic member on the outside of the heat exchanger 10 in a vacuum state.

Since steps S10 to S50 have already been described, a detailed description will be omitted. However, no adhesive is used in arranging the gaskets 11 fixed to the edges of the heat exchange object 7 and the heat sink 8 in step S40. The reason for this is that when the airtightness member 12 to be described later is coated on the surface of the heat exchanger 10, the air existing inside the gasket 11 is discharged to the outside so that the inside of the gasket 11 can be maintained in a vacuum state to be. If an adhesive is not used, a gap is formed in a portion where the gasket 11 contacts, so that the air inside the gasket 11 is evacuated to the outside through the gap, and the inside becomes a vacuum state.

In the step S60, the condensed water generated by condensation of steam when the thermoelectric semiconductor element 2 cools the heat exchange object 7 is intrinsically blocked by permeating the condensed water into the heat exchange apparatus 10, The heat exchanger 10 is placed in a vacuum chamber and the exterior of the heat exchanger 10 is coated with the hermetic member 12 in a vacuum state.

The coating of the present invention is a polymer coating method which is deposited outside the heat exchanger 10 in the form of a gaseous form in vacuum, regardless of shape, in units of micrometer thickness. More specifically, the dimer in powder form is evaporated by heat, the evaporated dimer is converted to a gaseous state through pyrolysis, the dimer of the monomer is cooled before it diffuses into the vacuum chamber, Is polymerized in the vacuum chamber and coated on the surface of the heat exchanger 10 in the form of a film.

Since the polymerization reaction of the coating of the present invention takes place at a very low pressure and at a room temperature of 30 ° C or lower, thermal stress is not generated on the surface of the heat exchanger 10, Uniform coating film can be formed irrespective of shapes such as a contact gap, a sharp needle point, a corner, a corner, and a minute hole, and an excellent protective film is formed because no pores are formed on the coated surface. This coating method is applied to the needs of PCB surface protection and corrosion resistance, chemical resistance, chemical resistance and lubrication. Therefore, it is necessary to use a known paralle for device, parts and surface protection in electrical, mechanical, aerospace, It is widely used in industrial applications by lean coating.

Since the coating process of the present invention proceeds in a vacuum chamber, the inside of the heat exchanging apparatus 10 is in a vacuum state and air is not present, and the hermetic member 12 is coated on the surface of the heat exchanging apparatus 10 in the form of a protective film. Since outside air can not penetrate into the gasket 11, condensation water is not generated in the gasket 11 because there is no steam around the thermoelectric cooler.

Therefore, since the entire outer surface of the heat exchanging apparatus 10 of the present invention is coated with the hermetic member 12, the inside of the vacuum state is completely isolated from the outside where the electricity flows, so that electricity does not flow, So that the phenomenon that the condensed water pointed out as a conventional problem leaks electricity can be solved at all.

In the heat exchanger 10 of the present invention, the temperature of the heat-radiating surface of the thermoelectric semiconductor element 2 must be low so that the temperature of the cooling surface is also lowered. The heat radiating surface of the thermoelectric semiconductor element 2 is closely adhered to the heat radiating plate 8, and the heat radiating plate 8 of the present invention uses a water cooling type as shown in FIGS.

The heat dissipating plate 8 of the present invention has the heat dissipating fin 82 housed in the internal heat exchanging chamber 81. The heat exchanging chamber 81 is hermetically sealed by the lid 83. Cooling water is supplied to the side surface communicating with the heat exchanging chamber 81 An inlet 84 and an outlet 85 for entrance and exit are formed, and the contact surface where the heat radiating surface of the thermoelectric semiconductor element 2 is in close contact is flattened.

The contact surface of the heat sink 8 corresponds to the upper surface, the lower surface, or the upper and lower surfaces. In order to closely adhere the heat-radiating surface of the thermoelectric semiconductor element 2 to the contact surface of the manufactured heat sink 8, it is required that the contact surface is smoothly flattened to conform to the flatness. If the flatness is not uniform, there is a problem in that the heat exchange efficiency is lowered because the thermoelectric semiconductor elements 2 are not brought into close contact with the heat radiation surfaces of the plurality of thermoelectric semiconductor elements 2.

Therefore, the contact surface of the heat sink 8 to which the thermoelectric semiconductor element 2 is closely contacted is formed by pressing both side surfaces of the heat sink 8 in a compressed state by the jig 5, The jig 5 is formed by pressing and fixing the side edge of the heat sink 8 where the wall 86 of the heat exchange chamber 81 is located, 5 is released, the flatness of the contact surface is not changed.

Since the wall edge 86 of the heat exchange chamber 81 is located at the side edge of the heat sink 8, the wall 86 is resistant to the pressing force when the wall 86 is squeezed by the jig 5. Therefore, the contact surface of the heat sink 8, The surface does not deform convexly or concavely and remains flat. Therefore, even if the cutter 61 of the machine tool 6 flatly processes the contact surface and releases the jig 5, the contact surface is not deformed and the flatness is maintained.

If the jig 5 does not fix the side edge of the heat sink 8 by pressing and fixing the side central portion forming the heat exchange chamber 81 by pressing and fixing, the heat sink 8 may have a fine or convex surface When the jig 5 is released after the contact surface is flattened in this state, the deformed state of the contact surface is restored to its original position, so that the contact surface with which the flatness is adjusted is deformed again and the flatness is not met .

The inventor of the present invention has found that the contact surface of the heat sink 8 has a problem that it takes a long time to find out the reason why the flatness of the contact surface of the heat sink 8 does not coincide even after machining. .

The method of manufacturing the heat exchanger 10 according to another embodiment of the present invention includes the steps of producing the thermoelectric semiconductor element adhesive 1 having a uniform flatness through steps S1 to S3 as shown in FIG. );

The surface of the heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is adhered to the contact surface of the heat exchange object 7 with the heat exchange object 7 so that the surface of the thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 (S20) of arranging the thermoelectric semiconductor element adhesive (1) between the heat sinks (8) to fix the heat transfer target (7) and the heat sink (8); And

And a step (S60) of placing the heat exchanger 10 after step S20 in a vacuum chamber and coating the hermetic member 12 outside the heat exchanger 10 in a vacuum state.

Since the above embodiment performs step S60 without using the gasket 11, description thereof has already been described above, and a detailed description thereof will be omitted. Since the gasket 11 is not used in the above embodiment, the hermetic member 12 is attached to the surface of the adhesive 1 and thus the surface of the heat exchanger 10 is shut off from the outside.

The present invention produced as described above is characterized in that the adhesive 1 is obtained by bonding the thermoelectric semiconductor element 2 and the heat transfer block 3 with a thermally conductive thermosetting adhesive and planarizing the surface of the heat transfer block 3, . ≪ / RTI >

The present invention is a result of a lot of efforts to remove the conventional housing in which the adhesive 1 is wrapped and fixed with the screw 9. Although the result of the adhesive 1 may seem simple, it eliminates the process of removing the housing and fastening many screws to fix the housing, and by pre-assembling the flattened parts before assembling, , The assemblability that matches the flatness, the interchangeability during use, and the heat exchange performance due to the increase in the quantity due to the removal of the housing is not a technique that can be easily conceived by those skilled in the art considering efficiency.

1: Adhesive 2: Thermoelectric semiconductor element
3: Heat transfer block 4: Adhesive
5: Jig 7: Heat exchange object
8: Heat sink 9: Screw
10: heat exchanger 11: gasket
12:

Claims (10)

(S1) of closely bonding the heat transfer block (3) to the surface of the thermoelectric semiconductor element (2) with an adhesive (4);
(S2) fixing the adhesive (1) to which the thermoelectric semiconductor element (2) and the heat transfer block (3) are bonded to the jig (5); And
A step S3 of flattening the exposed surface of the heat transfer block 3 fixed to the jig 5 by flattening the surface of the heat transfer block 3 with the cutter 61 to make the thickness of the adhesive 1 constant, Wherein the flatness is uniform.
The adhesive (4) for bonding the thermoelectric semiconductor element (2) and the heat transfer block (3) in the step 1 is a thermally conductive thermosetting adhesive, and has physical properties of 8,000 to 8,800 Pa · s and a thermal conductivity of 1 to 1.44 W / m 占., Hardness Shore (D type) of 55 to 62D.
The heat transfer block according to claim 1, wherein the heat transfer block (3) is formed to have a width or a width larger than that of the thermoelectric semiconductor and both side surfaces forming a width or a thickness of greater width are tightly fixed to the jig The jig 5 fixes the heat transfer block 3 with the upper end lower than the upper surface of the heat transfer block 3 so that the cutter 61 does not collide with the cutter 61 when machining the surface of the heat transfer block 3 ≪ / RTI > wherein the thermoelectric element is a thermoelectric element.
The thermoelectric semiconductor device adhesive according to any one of claims 1 to 3, wherein the thermoelectric semiconductor device adhesive is uniform in flatness.
(S10) a thermoelectric semiconductor element adhesive (1) having a uniform flatness according to the method of claim 1;
The surface of the heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is adhered to the contact surface of the heat exchange object 7 with the heat exchange object 7 so that the surface of the thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 And a step (S20) of placing the thermoelectric semiconductor element adhesive (1) between the heat sinks (8) and fixing the heat transfer target (7) and the heat sink (8) (METHOD FOR MANUFACTURING HEAT EXCHANGER USING DEVICE ADHESIVE)
(S10) a thermoelectric semiconductor element adhesive (1) having a uniform flatness according to the method of claim 1;
The surface of each heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is placed on the contact surface of the heat exchange object 7 so that the surface of each thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 );
Disposing a gasket (11) at an edge between the heat exchange target (7) and the heat sink (8) (S40); And
And a step (S50) of fastening the thermoelectric semiconductor element adhesives (1) inside the gasket (11) by tightly fixing the edges of the heat exchange object (7) and the heat sink (8) with screws. A method of manufacturing a heat exchanger using a thermoelectric semiconductor element adhesive having a uniform flatness.
(S10) a thermoelectric semiconductor element adhesive (1) having a uniform flatness according to the method of claim 1;
The surface of each heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is placed on the contact surface of the heat exchange object 7 so that the surface of each thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 );
Disposing a gasket (11) at an edge between the heat exchange target (7) and the heat sink (8) (S40);
A step (S50) of tightly fixing the thermoelectric semiconductor element adhesives (1) located in the interior of the heat exchange target (7) and the heat sink (8) And
(S60) of coating the hermetic member (12) to the outside of the heat exchange apparatus (10) in a vacuum state by placing the heat exchange apparatus (10) completed in step S50 into a vacuum chamber Method of manufacturing a heat exchanger using a semiconductor device adhesive.
(S10) a thermoelectric semiconductor element adhesive (1) having a uniform flatness according to the method of claim 1;
The surface of the heat transfer block 3 of the plurality of thermoelectric semiconductor element adhesives 1 is adhered to the contact surface of the heat exchange object 7 with the heat exchange object 7 so that the surface of the thermoelectric semiconductor element 2 is in close contact with the contact surface of the heat sink 8 (S20) of arranging the thermoelectric semiconductor element adhesive (1) between the heat sinks (8) to fix the heat transfer target (7) and the heat sink (8); And
(S60) of coating the hermetic member (12) to the outside of the heat exchange apparatus (10) in a vacuum state by placing the heat exchange apparatus (10) completed in step S20 in a vacuum chamber Method of manufacturing a heat exchanger using a semiconductor device adhesive.
The heat sink (8) according to claim 5, wherein the heat dissipating fin (82) is housed in the internal heat exchange chamber (81), the heat exchanging chamber (81) is sealed by a lid (83) An inlet 84 and an outlet 85 through which cooling water enters and exits are formed on the side surface, and the contact surface to which the thermoelectric semiconductor element 2 is closely contacted is flattened;
The contact surface processing of the heat sink 8 to which the thermoelectric semiconductor elements 2 are closely attached is performed by pressing the upper surface, the lower surface or the upper and lower surfaces of the heat radiating plate 8 in a state where both side surfaces forming the thickness of the heat radiating plate 8 are fixed by the jig 5 The jig 5 is pressed and fixed to the side edge of the heat radiating plate 8 where the wall 86 of the heat exchange chamber 81 is located so as to fix the jig 5 Wherein the flatness of the contact surface is not changed even if the pressing and fixing state of the thermoelectric semiconductor element is released.
A heat exchange apparatus using a thermoelectric semiconductor element adhesive having uniform flatness, which is manufactured by the method of any one of claims 5 to 9.

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