CN106163702A - The isostatic pressed press fit device heating and cooling down and the manufacture method utilizing its device manufacture chip type component can be carried out - Google Patents
The isostatic pressed press fit device heating and cooling down and the manufacture method utilizing its device manufacture chip type component can be carried out Download PDFInfo
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- CN106163702A CN106163702A CN201480077938.1A CN201480077938A CN106163702A CN 106163702 A CN106163702 A CN 106163702A CN 201480077938 A CN201480077938 A CN 201480077938A CN 106163702 A CN106163702 A CN 106163702A
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- China
- Prior art keywords
- heat exchange
- isostatic pressed
- press fit
- chip type
- fit device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
- B22F3/04—Compacting only by applying fluid pressure, e.g. by cold isostatic pressing [CIP]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B11/00—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
- B30B11/001—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses using a flexible element, e.g. diaphragm, urged by fluid pressure; Isostatic presses
- B30B11/002—Isostatic press chambers; Press stands therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
- B22F2003/153—Hot isostatic pressing apparatus specific to HIP
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Press Drives And Press Lines (AREA)
- Powder Metallurgy (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Abstract
The present invention relates to the fluid by being filled in high-pressure bottle or isostatic pressed press fit device that gas is pressed.Isostatic pressed press fit device according to embodiments of the present invention is formed with the holding tank accommodating material, and include by filling pressure medium in described holding tank material to be carried out the high-pressure bottle of isostatic pressed pressurization, it is characterized in that, including heat exchanger, described heat exchanger includes heat exchange component, in described heat exchange component is located at described holding tank and carry out heat exchange with pressure medium, heat with the described pressure medium to supply to described holding tank or cool down.Therefore, it is possible at short notice material heated and cool down, thus obtain the material with compact tissue, it is possible to minimized by the fraction defective of material.
Description
Technical field
The present invention relates to the use of and be filled in the pressure medium of high-pressure bottle and carry out the isostatic pressed pressing that isostatic pressed is compressing
Device and utilize its device manufacture chip type component manufacture method.
Background technology
It is said that in general, isostatic pressed press fit device is when material is loaded high-pressure bottle, note in high-pressure bottle
Enter gas or fluid, utilize the device that the pressure of gas or fluid is pressed, recently, be frequently used for manufacturing chip
Type parts.
Traditional isostatic pressed press fit device has the " isostatic pressed being disclosed in KR published patent the 10-2007-0112718th
Pressue device ".
As it is shown in figure 1, traditional isostatic pressed pressue device possesses: thermal insulator 3, it is formed with the process accommodating material (W)
Room (R)；Pressure vessel 2, it is used for covering described thermal insulator 3；Heater 25, it is used for heating described pressure vessel 2；Pressure
Medium supply apparatus 5, pressure medium can be supplied the inside to described pressure vessel by it, it addition, thermal insulator 3 and pressure vessel 2
Between be configured with can import pressure medium pressure medium import space (S), process chamber (R) is through being formed at the top of thermal insulator 3
Intercommunicating pore and pressure medium import space (S) and connect, through being formed at the pressure medium introducing port 18 of the bottom of pressure vessel, make
Obtain pressure medium supply unit 5 to connect with pressure medium importing space (S).
Isostatic pressed pressue device as above is the method by utilizing heater 25 to heat pressure vessel 2
Pressure medium is heated, therefore, it is possible to material (W) is pressed when heating.
But, traditional isostatic pressed pressue device, in order to be processed material (W), needs heated pressure container 2, therefore
Heated material (W) required time is longer, the problem the most not only existing heat loss waste, but also exists and be difficult to homogeneous
The problem that material (W) is processed by temperature.
It is located at liner on lid, for closed pressure vessel 2 because of the heating to pressure vessel 2 it addition, there is also,
Because the impact of High Temperature High Pressure occurs damaged problem..
It addition, pressure medium can only be heated by traditional isostatic pressed pressue device, and refrigerating function cannot be fulfiled, because of
This cannot make material (W) be processed into by burning till and hardening possesses compact tissue.
Summary of the invention
The present invention proposes to solve problem as above, and the technical problem to be solved is,
There is provided and utilize the pressure medium that material is pressurizeed, by material being heated in the short time or cooling down, can not only
Reduce compressing required time and heat loss, and with homogeneous temperature material can also be heated or cool down etc. quiet
Pressure press fit device.
It addition, the technical problem to be solved is, it is provided that by fulfiling cooling while heating, it is possible to make thing
Expect the compressing tissue for possessing densification, and by the breakage minimizing and avoiding liner of rejected material rate, it is possible to subtract
Few pressure loss and the bubble-tight isostatic pressed press fit device of raising.
It addition, the technical problem to be solved is, it is provided that by heating and the cooling of pressure medium, it is possible to
Chip type component is pressed in short time, and dense structure and the low chip type component of fraction defective can be manufactured
Chip type component manufacture method.
For realizing the isostatic pressed pressing dress that the carrying out of the embodiments of the invention of above-mentioned technical problem is heated and cool down
Put and include: be formed can accommodate the holding tank of material, by filling pressure medium in described holding tank so that material is carried out
The high-pressure bottle of static pressure pressurization, it is characterised in that above-mentioned isostatic pressed press fit device includes: heat exchanger, described heat exchanger bag
Include heat exchange component, in described heat exchange component is located at described holding tank and carry out heat exchange with pressure medium, with to supply extremely
The described pressure medium of described holding tank carries out heating or cooling down.
Described heat exchange component can be heated or cooled by means of the thermal medium of supply to described heat exchange component.
Described heat exchanger can include the heating part heating described thermal medium and cool down described thermal medium
Cooling end.
Described heat exchanger can include selecting supply unit, and described selection supply unit will be from described heating part and described cooling end
The thermal medium of middle heating or cooling is selectively supplied to described heat exchange component.
Described heat exchanger can include the thermal medium storage tank for storing described thermal medium.
Described heat exchange component comprises the steps that inflow entrance, for the thermal medium for cooling down or heat described heat exchange component
Flow into；Outlet, discharges for flowing into the thermal medium of described inflow entrance；And micro-flow path, connect described inflow entrance and outlet,
So that described heat exchange component can be circulated in a zigzag.
Described thermal medium can include water.
Described heat exchange component can include carrying out, by means of electricity, the heater that heats.
Described heat exchange component can include carrying out, by means of coolant, the cooling unit that cools down.
Described heat exchange component is characterised by, its by plate-like shape or drum or spiral-shaped in any
One shape is formed.
Described heat exchange component can include the multiple through holes running through described heat exchange component or protrude from described heat friendship
The multiple projections changing the outside of component and formed, to expand the contact area with described pressure medium.
Can include that thermal insulating material, described thermal insulating material are configured at the inner face of described holding tank, be used for preventing described heat-exchanging part
Heat be conveyed to the outside of described holding tank.
Described thermal insulating material is characterised by, it includes any one in resin, ceramic-like.
Described high-pressure bottle also includes sealing the top of described high-pressure bottle and the upper cover of bottom and lower cover respectively, and can wrap
Including the heater for heating described pressure medium, this heater is located at any one in described upper cover and lower cover or in institute
State in upper cover and lower cover and all arrange.
Described high-pressure bottle also includes sealing the top of described high-pressure bottle and the upper cover of bottom and lower cover respectively, and can wrap
Include in any one being incorporated in described upper cover and lower cover, for shelving the shelf of material.
The manufacture method of the chip type component of utilization isostatic pressed press fit device according to embodiments of the present invention is to utilize and formed
There is the isostatic pressed press fit device of the holding tank accommodating chip type component to manufacture the manufacture method of chip type component, this isostatic pressed pressure
Including with device: high-pressure bottle, it, by being filled in the pressure medium in described holding tank, carries out isostatic pressed to chip type component
Pressurization；And heat exchanger, this heat exchanger includes carrying out the heat exchange component of heat exchange, this heat exchange structure with described pressure medium
Part is located at described holding tank, heats for the pressure medium supplied to described holding tank or cools down, utilizing such
The manufacture method of the chip type component of static pressure press fit device, including: move into step, described chip type component is moved into described appearance
Receive groove；Compressing step, pressure medium supply to described holding tank, carries out isostatic pressed to described chip type component and is pressed into
Type；Heating steps, under the state keeping pressure by described pressure medium, in order to described chip type component is heated,
The described heat exchange component carrying out heat exchange with described pressure medium is heated；Discharge step, supply to described receiving
Described pressure medium in groove, discharges from described holding tank；And take out of step, described in being contained in described holding tank
Chip type component takes out of.
Before the heating steps that the described heat exchange component carrying out heat exchange with described pressure medium is heated or
After person, it may include cooling step, this cooling step is under the state by described pressure medium holding pressure, in order to cool down
State chip type component and the described heat exchange component carrying out heat exchange with described pressure medium is cooled down.
Carrying out according to the present invention is heated and material is directly entered by the isostatic pressed press fit device that cools down by pressure medium
Row heating or cooling, therefore can heat material at short notice or cool down, with this can by the compressing time and
Further minimum heat losses.
It addition, the material burnt till can directly can be hardened when keeping pressure and obtain and there is fine and close group
The material knitted, therefore, it is possible to minimize fraction defective.
It addition, prevent internal heat to be conveyed to high-pressure bottle by arranging thermal insulating material in high-pressure bottle, it is possible to avoid lining
Pad damaged, therefore, it is possible to reduce the pressure loss and improve air-tightness.
It addition, because by pressure medium material being cooled down or heating, therefore, it is possible to homogeneous temperature to thing
Material carries out heating or cooling down.
The manufacture method of the chip type component utilizing isostatic pressed press fit device according to the present invention, is straight by pressure medium
Connect and chip type component is heated and cools down, therefore, it is possible at short notice chip type component heated and cool down, because of
This can manufacture the chip type component with compact tissue, and can be minimized by the fraction defective of chip type component.
It addition, can omit for manufacturing burning till or hardening process of chip type component, set therefore, it is possible to be greatly decreased
Standby required expense and manufacturing time.
Accompanying drawing explanation
Fig. 1 is the cross-sectional side view illustrating existing isostatic pressed pressue device；
Fig. 2 is the summary construction diagram of diagram isostatic pressed press fit device according to embodiments of the present invention；
Fig. 3 is the schematic configuration of the isostatic pressed press fit device of the diagram state opening holding tank according to embodiments of the present invention
Figure；
Fig. 4 is the summary construction diagram of the heat exchanger of diagram composition isostatic pressed press fit device according to embodiments of the present invention；
Fig. 5 is the heat exchange component of the heat exchanger of diagram composition isostatic pressed press fit device according to embodiments of the present invention
Schematic diagram；
Fig. 6 is the sectional drawing of pictorial image 5；
Fig. 7 is the heat exchange component of the heat exchanger of diagram composition isostatic pressed press fit device according to embodiments of the present invention
Modified example, it is illustrated that the schematic diagram of the heat-exchanging part formed by drum；
Fig. 8 is another modification of the heat exchange component of diagram composition isostatic pressed press fit device according to embodiments of the present invention
Example, it is illustrated that with the schematic diagram of the heat exchange component that threaded form is formed；
Fig. 9 is the manufacture method that diagram utilizes the chip type component of isostatic pressed press fit device according to embodiments of the present invention
General flowchart.
The explanation of reference
100: isostatic pressed press fit device 110: high-pressure bottle
111: holding tank 113: upper cover
114: shelf 115: lower cover
130: pressure medium feed mechanism 131: pressure medium storage tank
133: booster pump 135: medium supply line
200: heat exchanger 210: heat exchange component
211: inflow entrance 212: outlet
213: micro-flow path 214: through hole
215: temperature sensor 220: heating part
221: heater 230: cooling end
231: cooling unit 240: select supply unit
250: supply pump 260: thermal medium supply pipe
270: thermal medium discharge pipe 280: thermal medium storage tank
300: thermal insulating material
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings of embodiments of the invention.
First, the isostatic pressed press fit device 100 of the present invention can be used for manufacturing such as electric capacity chip, resistance chip, cache chip,
Chip type component that induction chip, antenna component, EMI filtering chip etc. are manufactured by ceramic-like material and for manufacturing FPCB, PCB
Deng substrate time compressing operation to be performed in, but also can be used in powder body material is pressed multiple
Field.
As shown in Figures 2 and 3, isostatic pressed press fit device 100 according to embodiments of the present invention can include high-pressure bottle 110.
This high-pressure bottle 110 is formed by the drum of hollow, can accommodate the material to be shaped by isostatic pressed.
It addition, the holding tank 111 of high-pressure bottle 110 can be situated between for the pressurization that material carries out isostatic pressed pressurization in filling
Matter, the top of the opening of high-pressure bottle 110 and bottom be combined with upper cover 113 and lower cover 115, can sealed high-pressure vessel with this
110.
Here, it is tens of bar～thousands of bar that pressure medium is filled in the pressure of holding tank 111, by this pressure medium
It is compressing that pressure carries out isostatic pressed.
And, the structure that the upper cover 113 of high-pressure bottle 110 and lower cover 115 are combined can be, such as sealed high-pressure vessel 110
The upper cover 113 on top and sealed high-pressure vessel 110 bottom lower cover 115 be formed around screw thread and high-pressure bottle
110 is threaded and knot that the structure combined, the structure be combineding with each other by means of bolt, the form that run through by pin be combined with each other
Structure, the structure be combineding with each other by means of fixture, prevent from upper cover 113 and lower cover 114 from departing from being inserted in framework in high-pressure bottle 110
Structure etc..
Here, the applicable multiple known technology side of structure combined because of upper cover 113 and the lower cover 115 of high-pressure bottle 110
Method, is not therefore limited it.
And, of upper cover 113 and lower cover 115 can be formed with medium supply mouth, for high-pressure bottle 110
Holding tank 111 supplies pressure medium, can be formed with the medium discharged to outside for the pressure medium that will be supplied in another
Outlet, medium supply mouth and medium outlet may be formed in the middle of any one of upper cover 113 and lower cover 115.
It addition, upper cover 113 and lower cover 115 any one in can be provided for shelving the shelf 114 of material, this shelf
114 are connected to the upper cover 113 for opening high-pressure bottle or lower cover 115, and its structure may be configured as, when open upper cover 113 or
During person's lower cover 115, shelf 114 exposes to outside together with high-pressure bottle 110.
Isostatic pressed press fit device 100 according to embodiments of the present invention can include pressure medium feed mechanism 130.
The pressure medium pressurizeing material can be supplied to high-pressure bottle 110 by this pressure medium feed mechanism 130
Holding tank 111 in.
It addition, pressure medium feed mechanism 130 can supply mouth by being formed at the medium of upper cover 113 or lower cover 115, will
The pressure medium being stored in pressure medium storage tank 131 supplies to holding tank 111, and pressure medium feed mechanism 130
Booster pump 133. can be included
Pressure medium can be pressurizeed by utilizing high pressure and supply to holding tank 111 by booster pump 133.
Here, pressure medium can be the fluid of water or oil etc., or can be gas, however, it is preferred to be as
For the water of universal fluid, in order to water quickly being heated or cooling down or increase pressurization dynamics, pressure medium can wrap
Include other compositions in addition to water.
And, pressure medium feed mechanism 130 can include booster pump 133 and medium supply line 135.
Booster pump 133 can make the pressure of pressure medium increase and be supplied, and medium supply line 135 passes through booster pump
133 make the pressure of fluid increase and are supplied to holding tank 111.
In embodiment, medium supply line 135 is configured to be located at lower cover 115, so that at lower cover 115 seal-accommodating groove 111
State under, make pressure medium supply to holding tank 111, but, medium supply line 135 also can with high-pressure bottle 110 or on
Lid 113 connection, and make pressure medium supply to holding tank 111.
And, medium supply line 135 can be provided with check valve, and this check valve can be fed to the pressure medium of holding tank 111
Carry out supplying or block its supply.
Isostatic pressed press fit device 100 according to embodiments of the present invention can include drive mechanism (not shown).
This drive mechanism is in order to move into high-pressure bottle 110 or in order to the material compressing by isostatic pressed material
Take out of, upper cover 113 or lower cover 115 can be moved the top to high-pressure bottle 110 or bottom, with open or sealing high pressure
Container 110.
It addition, drive mechanism can be configured to, in order to make taking out of and moving into facility of material, open at upper cover 113 and lower cover 115
Under the state putting holding tank 111, high-pressure bottle 110 can be made to move towards left and right directions or above-below direction.
It addition, drive mechanism can be implemented in the way of hydraulic pressure or pneumatics cylinder.
As shown in Figures 5 and 6, isostatic pressed press fit device 100 according to embodiments of the present invention can include heat exchanger 200.
The pressure medium being filled in holding tank 111 can be heated or cool down, heat exchanger by this heat exchanger 200
200 can include heat exchange component 210.
This heat exchange component 210 is positioned at the inside of holding tank 111, can be direct to the pressure medium being filled in holding tank 111
Carry out heating or cooling down, and heat exchange component 210 can arrange multiple inside holding tank.
It addition, heat exchange component 210 can be configured to, including cooling component and heater.
That is, heat exchange component 210 can be divided into cooling component and heater, and cooling component is filled in holding tank for cooling
The pressure medium of 111, heater is filled in the pressure medium of holding tank 111 for heating.
Here, heater can be by mean of the heater that electricity carries out heating, cooling component can be the cooling of heat absorption
Tank or vaporizer etc..
The most respectively one side is cooled down it addition, heat exchange component 210 can also is that, and another side is heated
Peltier (peltier) element.
And, heat exchange component 210 can be configured to as shown in the Examples, when the thermal medium as fluid or gas passes through
During heat exchange component 210, thermal medium can be made by heat exchange component 210 pressure medium to be cooled down or heat.
Now, heat exchange component 210 can be configured to, and is formed for inflow entrance 211 and heating medium row that thermal medium flows into
The outlet 212 gone out, inflow entrance 211 and outlet 212 are by a zigzag via the micro-flow path 213 of heat exchange component 210
It is connected with each other, so that the thermal medium flowing into inflow entrance 211 integrally circulates heat exchange component 210 by micro-flow path 213, and
Discharged by outlet 212.
Here, heat exchange component 210 can be configured to, by one side being formed with micro-flow path 213, inflow entrance 211 and row
Two plates of outlet 212 carry out docking laminating and are formed, and micro-flow path 213 can be according to the degree of depth of the thickness of plate and various shape shape
Become, with when carrying out not being flattened when isostatic pressed is compressing by pressure medium.
It addition, in order to the area that heat exchange component 210 is shared in holding tank 111 is minimized, by heat exchange component 210
Be formed as plate-like shape, or as it is shown in fig. 7, be formed as drum, when being formed as drum, micro-flow path 213
It is formed as threaded form therein.
It addition, heat exchange component 210 is as shown in Figure 8, the mode being formed as pipeline to be rolled into threaded form is formed.
And, heat exchange component 210 is formed with multiple through hole 214, passes through for the pressure medium being contained in receiving hole 111
Wear while heat exchange component 210 moves freely and can also expand its contact area, although illustrate not in the drawings, in order to expand
Its contact area can also be formed with multiple projection.
And, heat exchange component 210 also can be provided with the temperature sensor 215 of the temperature for measuring pressure medium.
It addition, heat exchange component 210 can be located at any one in the middle of upper cover 113 or lower cover 115, or on described
Lid 113 or lower cover 115 are all arranged, is located at the heat exchange component 210 in the middle of upper cover 113 or lower cover 115 and electricity is preferably used
The heater of heating.
Heat exchanger 200 can include thermal medium storage tank 280.This thermal medium storage tank 280 can accommodate by heat exchange structure
Part 210 will carry out the thermal medium of heat exchange with pressure medium.
And, heat exchanger 200 can include heating part 220 and cooling end 230, and this heating part 220 and cooling end 230 can lead to
Cross and obtain the thermal medium that is stored in thermal medium storage tank 280 and carry out heating or cooling down.
That is, the thermal medium being stored in thermal medium storage tank 280 can be heated in heating part, and cooling end is cold can be with cold storage
Thermal medium in thermal medium storage tank 280.
Heating part 220 can be configured to, and including by the heater 221 of electrical heating or heating medium for heating, cooling end 230 can be joined
It is set to, including the cooling unit 231 carrying out cooling down by coolant.Now, cooling unit 231 can be by vaporizer or cooling water
Groove is constituted, and cooling end 230 can be carried out, by by circulating common coolant, the refrigeration machine (chiller) cooled down.
And, heat exchange component 210 is when being configured to be made up of cooling component and two kinds of components of heater, configurable
For, heating part 220 is connected with heater, and cooling end 230 is connected with cooling component, at the cooled thermal medium of cooling end 230
Cool down pressure medium by cooling component, heat pressurization at the heated thermal medium in heating part 220 by heater and be situated between
Matter.
And, heat exchanger 200 can include selecting supply unit 240.
This selection supply unit 240 can be by the thermal medium that is contained in thermal medium storage tank 280 alternately through cooling end 230
Supply is to heat exchange component 210, or is supplied to heat exchange component 210 by heating part 220.
Here, select supply unit 240 can implement by electromagnetic valve, this electromagnetic valve be used for thermal medium from cooling end 230 or
Person heating part 220 to heat exchange component 210 supplies and blocks.
And, select supply unit 240 can include supplying pump 250, this supply pump 250 makes to be stored in thermal medium storage tank 280
Thermal medium supply to heat exchange component 210 via cooling end 230 or heating part 220, and by circulating thermal medium, can
The thermal medium being fed to heat exchange component 210 is stored again to thermal medium storage tank 280.
Here, thermal medium can be fluid or gas, however, it is preferred to be the water as fluid, when thermal medium is water
When, in order to quickly realize heat exchange, other additives can be mixed.
Heat exchanger 200 arranged as described above, selects being contained in adding in holding tank 111 when selecting supply unit 240
When pressure medium heats, the thermal medium being stored in thermal medium storage tank 280 is supplied to heating part 220, and having heated
Finish the thermal medium in state to supply to heat exchange component 210, when selecting supply unit 240 to select pressure medium is cooled down,
The thermal medium being stored in thermal medium storage tank 280 is supplied to cooling end 230, and the thermal medium cooled down in complete state is supplied
Give to heat exchange component 210, at short notice pressure medium can be cooled down with this or heat.
Isostatic pressed press fit device 100 according to embodiments of the present invention can include thermal insulating material 300, and this thermal insulating material 300 is configured at
The inner face of holding tank 111, is conveyed to high-pressure bottle 110 with this heat being prevented from heat exchange component 210.
That is, thermal insulating material 300 is incubated, so that heat exchange component 210 can only be with the pressure medium being contained in holding tank 111
Carry out heat exchange, go out to the external leakage of holding tank 111 with this intercept heat.
It addition, the inside of high-pressure bottle 110 not only can be located at, but also the upper cover for seal-accommodating groove 111 can be located at
113 and lower cover 115.
And, in order to bear the crunch of pressure medium, thermal insulating material 300 includes by having a high rigidity and height breaks hot property
The resin such as Teflon, polyimides etc., any one in the middle of ceramic-like formed, or can be only by any one material shape
Become.
Hereinafter, the effect between each structure in described above and effect are described.
Isostatic pressed press fit device 100 according to embodiments of the present invention, by setting in the holding tank 111 of high-pressure bottle 110
Put heat exchange component 210, thermal insulating material 300 is set in the inside of holding tank 111, to prevent the heat of heat exchange component 210 to height
The external communication of pressure vessel 110.
And, it is provided with thermal medium supply pipe 260 at the inflow entrance 211 of heat exchange component 210, borrows for heat exchange component 210
Help thermal medium supply pipe 260 be connected with each other with the cooling end 230 being positioned at outside high-pressure bottle 110 or heating part 220, with to
In cooling end 230 or heating part 220, heated or cooled thermal medium supplies.
Here, although accompanying drawing illustrates and is connected 210 with heat exchange component by upper cover 113 and supplies thermal medium, but also
It is configurable to the side by lower cover 113 or high-pressure bottle 110 by thermal medium supply to heat exchange component 210.
It addition, be provided with thermal medium discharge pipe 270 at the outlet 212 of heat exchange component 210, borrow for heat exchange component 210
Thermal medium discharge pipe 270 is helped to be connected with each other with thermal medium storage tank 280, to be added in cooling end 230 or heating part 220
Heat or cooled thermal medium supply.
And, heating part 220 and cooling end 230 are configured with selection supply unit 240, with by the heat of heating in heating part 220
Medium or by cooling end 230 cooling thermal medium be optionally supplied to heat exchange component 210.
It addition, the insert port of framework is located at by high-pressure bottle 110, drive mechanism can be located at framework or high-pressure bottle 110, with
Upper cover 113 or lower cover 115 is made to move by means of drive mechanism, to open or the holding tank of sealed high-pressure vessel 110
111。
And, the lower cover 115 of high-pressure bottle 110 can be provided with pressure medium feed mechanism 130, this pressure medium supply machine
Structure 130 is for supplying pressure medium to holding tank 111 when seal-accommodating groove 111.
Isostatic pressed press fit device 100 configured as described above is compressing in order to carry out isostatic pressed, first, in order to be removed by material
Enter to holding tank 111, utilize drive mechanism to move upper cover 113 or lower cover 115, to open high-pressure bottle 113.
Then, material is moved into the receiving holding tank 111 opened, at this moment, if set on upper cover 113 or lower cover 115
When having shelf 114, under the state that material is held on shelf 114, re-use drive mechanism for seal-accommodating groove 111
Mobile upper cover 113 or lower cover 115, and be situated between to the supply pressurization of the inside of holding tank 111 by pressure medium feed mechanism 130
Matter, carries out isostatic pressed with this compressing.
It addition, carry out in the middle of the process that isostatic pressed is compressing, if needing material is applied adding of more than arbitrary temp
During heat, such as, when material is kept supercharging, when needing it is burnt till, to storage to thermal medium storage tank 280
Thermal medium heated by heating part 220, and thermal medium is supplied to heat exchange component 210, by heat exchange component 210
Heat exchange is carried out, to utilize the temperature of more than arbitrary temp that material is heated with pressure medium.
At this moment, even if thermal medium water, also can be high because of the pressure of holding tank 111 so that the fluidizing point of water improves the most therewith,
Therefore, it is possible to pressure medium is heated with the temperature of more than 100 DEG C, and measure pressure medium by temperature sensor 215
Temperature, it is possible to keep homogenization temperature.
It addition, carry out in the middle of the process that isostatic pressed is compressing, if needing material is applied the cold of below arbitrary temp
But time, such as, when material is kept supercharging, during in order to it is hardened, to storage to thermal medium storage tank 280
Thermal medium cooled down by cooling end 230, and thermal medium is supplied to heat exchange component 210, by heat exchange component 210
Heat exchange is carried out, to utilize the temperature of below arbitrary temp that material is heated with pressure medium.
At this moment, the temperature of cooled pressure medium is measured also by temperature sensor 215, it is possible to keep homogeneous temperature
Degree.
And then, when isostatic pressed compressing the most complete after, utilize drive mechanism to open the upper cover of high-pressure bottle 110
113 or lower cover 115, it is filled in the pressure medium in holding tank 111 to discharge to outside, or by pressure medium feed mechanism
130 reclaim, and take out of the material on the shelf 114 being held on upper cover 113 or lower cover 115, terminate isostatic pressed pressure with this form
Operations for forming processed.
Therefore, isostatic pressed press fit device 100 according to embodiments of the present invention is direct to for thing by heat exchanger 200
Material carries out the pressure medium of isostatic pressed pressurization and carries out heating or cooling down, therefore, it is possible at short notice material is heated or
Person cools down, and therefore can cross compressing time and further minimum heat losses.
It addition, because directly material to be heated or cool down by pressure medium, therefore, it is possible to homogenization temperature pair
Material carries out heating or cooling down.
It addition, by material being heated when keeping pressure or cooling down, there is cause therefore, it is possible to obtain
The material of close tissue and the fraction defective of material can be minimized.
It addition, by arranging thermal insulating material in the inside of high-pressure bottle 110, to prevent internal heat to be conveyed to high-pressure bottle
110, therefore, it is possible to prevent liner damaged, reduce the pressure loss and improve air-tightness.
Hereinafter, illustrate that utilization above-mentioned isostatic pressed press fit device 100 according to embodiments of the present invention is to manufacture chip-shaped portion
The manufacture method of part.
Although according to utilizing according to embodiments of the present invention illustrated by the manufacture method of the chip type component of embodiment
Isostatic pressed press fit device 100, but as long as it is provided with above-mentioned in the middle of the known isostatic pressed press fit device of various form
Heat exchanger 200, then the most applicable.
First, before chip type component is moved into isostatic pressed press fit device 100 according to embodiments of the present invention, chip-shaped portion
Part can be via semi-finished product forming step.
This semi-finished product forming step for solvent, base material etc. are mixed in powder body, the serosity high to prepare mouldability, then will
This serosity is formed as lamellar form stacking together with electrode, or with after arbitrary shape molding and the form molding of shaped electrode
Semi-finished product.
Such as, in chip type component, serosity is prepared as lamellar form and by electrode and thin slice by electric capacity chip and resistance chip
Alternately laminated form forms semi-finished product, serosity is formed as arbitrary shape by induction chip and stratification is magnetic the thin of pattern
Sheets etc., can form respectively different semi-finished product according to each chip type component.
It addition, in the middle of semi-finished product forming step, powder body can be ceramic-like powder body or metal class powder body, can be by pottery
In the middle of porcelain class powder body or metal class powder body, the fluoropolymer resin of mixing polyimides or epoxy resin etc., can prepare and need not
The serosity of base material.
Here, when utilizing the serosity molding semi product including base material, need the etching operation carrying out eliminating base material, but
Be, utilize because of comprise fluoropolymer resin carry out semi-finished product molding without the serosity of base material time, then be made without etching work
Sequence.Therefore, present invention preferably uses and need not carry out the serosity containing fluoropolymer resin of etching operation and carry out molding semi product.
As it has been described above, after the semi-finished product molding for preparing chip type component completes, as following, utilize according to the present invention
The isostatic pressed press fit device 100 of embodiment is pressed.
As it is shown in figure 9, utilize the manufacturer of the chip type component of isostatic pressed press fit device 100 according to embodiments of the present invention
Method can include the step (S10) moving into the chip type component as material.
This step (S10) moving into chip type component is to carry out the semi-finished product of molding in semi-finished product forming step
Compressing and chip type component is moved in the holding tank 111 of isostatic pressed press fit device 100.
At this moment, in order to chip type component is moved into holding tank 111, open high-pressure bottle 110 upper cover 113 or under
Under the state of lid 115, it is possible to chip type component is moved into holding tank 111, and can be for the ease of chip type component is shelved also
It is carried to holding tank 111, chip type component is held under the state on the shelf being incorporated into upper cover 113 or lower cover 115, will
Chip type component is moved in holding tank 111.
Then, when chip type component accommodates after holding tank 111, upper cover 113 or lower cover 115 are shut, to seal height
Pressure vessel 110.
The manufacture method manufacturing chip type component utilizing isostatic pressed press fit device 100 according to embodiments of the present invention can be wrapped
Include and chip type component is carried out the compressing step of isostatic pressed (S20).
This carries out the compressing step of isostatic pressed (S20) to chip type component is by pressure medium feed mechanism 130
Pressure medium is supplied to holding tank 111, and to carry out isostatic pressed to the chip type component of holding tank 111 compressing to moving into.
At this moment, isostatic pressed is compressing to be supplied to holding tank 111 with preset pressure, and carries out etc. quiet according to Preset Time
Press compressing.
The manufacture method manufacturing chip type component utilizing isostatic pressed press fit device 100 according to embodiments of the present invention can be wrapped
Include the step (S30) that the heat exchange component 210 carrying out heat exchange with pressure medium is heated.
This step (S30) heating the heat exchange component 210 carrying out heat exchange with pressure medium is by heat
Exchange component 210 carries out heating and can heating pressure medium.That is, in order to chip type component is burnt till and can
Pressure medium is heated.
Here, the step (S30) heating the heat exchange component 210 carrying out heat exchange with pressure medium can be in pressurization
Medium supply to holding tank 111 and to schedule chip type component is carried out isostatic pressed compressing complete after, or
Carry out the compressing process of isostatic pressed central when keeping pressurization dynamics, pressure medium can be heated.
It addition, the form heating pressure medium can be the heat heated by the heating part 220 of heat exchanger 200
Medium supply is to heat exchange component 210, and the heat exchange component 210 by thermal medium heating carries out heat exchange with pressure medium.
At this moment, the heating to pressure medium can protected by being configured at the temperature sensor 215 of heat exchange component 210
Under the state holding preset temperature, carry out according to Preset Time.
The manufacture method manufacturing chip type component utilizing isostatic pressed press fit device 100 according to embodiments of the present invention can be wrapped
Include the step (S40) that the heat-exchanging part 210 carrying out heat exchange with pressure medium is cooled down.
This step (S40) cooling down the heat-exchanging part 210 carrying out heat exchange with pressure medium is in order to chip
Type parts harden, and can be cooled down chip type component by the form of cooling pressure medium.
Such as, if chip type component being cooled down when heating complete, it is possible to manufacture and there is compact tissue
Chip type component, the form that pressure medium can be utilized in this step to cool down the chip type component burnt till is carried out firmly
Change.
At this moment, the step cooled down the heat exchange component 210 carrying out heat exchange with pressure medium can be in above-mentioned institute
Implement after the step that the heat exchange component 210 carrying out heat exchange with pressure medium is heated illustrated, or can be
Is implemented before the step that the heat exchange component 210 carrying out heat exchange with pressure medium is heated.
It addition, the step (S40) cooling down the heat-exchanging part 210 carrying out heat exchange with pressure medium can be by joining
It is placed in the temperature sensor 215 of heat exchange component 210, when keeping preset temperature, implements according to Preset Time.
And, when pressure medium is cooled down, by the cooling end 230 of heat exchanger 200, thermal medium is cooled down,
And cooled down complete thermal medium supply is carried out heat friendship to heat exchange component 210, final heat exchange component 210 and pressure medium
Change, cooling can be implemented with this.
The manufacture method manufacturing chip type component utilizing isostatic pressed press fit device 100 according to embodiments of the present invention can be wrapped
Include the step (S50) that the pressure medium of supply to holding tank 111 is discharged from holding tank 111.
This supply is to take out of at holding tank to the pressure medium of holding tank 111 from the step that holding tank 111 is discharged
The pressure medium being filled in holding tank 111 is expelled to high-pressure bottle by the compressing chip type component of isostatic pressed by 111
The step of the outside of 110.
It addition, the step (S50) that the pressure medium of supply to holding tank 111 is discharged from holding tank 111 can be close by making
Upper cover 113 or the lower cover 115 of the bottom of envelope high-pressure bottle 110 are moved from high-pressure bottle 110 by drive mechanism, or pass through
Pressure medium feed mechanism 130 reclaims the form of pressure medium again, can the pressure medium being contained in holding tank 111 from
Holding tank 111 discharges.
The manufacture method manufacturing chip type component utilizing isostatic pressed press fit device 100 according to embodiments of the present invention can be wrapped
Include and the chip type component to be contained in holding tank 111 is taken out of step (S60).
The step (S60) that this chip type component being contained in holding tank 111 takes out of is in order to compressing to isostatic pressed
The next operation of complete chip type component and step that chip type component is taken out of from isostatic pressed press fit device 100.
It addition, in order to take out of the chip type component being contained in holding tank 111, drive mechanism to be passed through will seal high pressure-volume
Lower cover 115 or the upper cover 113 of device 110 are moved, and take out of chip type component when opening holding tank 111.
So, the chip type component taken out of from isostatic pressed press fit device 100 can cut off according to size to be used,
And under the state being ground to make the electrode of stacking be exposed to outside, for the ease of being mounted on circuit substrate, and with shape
The form becoming outer electrode completes the manufacture of chip type component.
At this moment, outer electrode can be stannum, nickel stannum etc., and is formed by galvanoplastic, can according to the kind of chip type component,
After isostatic pressed press fit device 100 takes out of, manufacture chip type component through different operations.
Therefore, the manufacturer manufacturing chip type component of utilization isostatic pressed press fit device 100 according to embodiments of the present invention
Method can be burnt till and harden in carrying out the isostatic pressed press fit device 100 that isostatic pressed is compressing, therefore, it is possible to manufacture
There is the chip type component of compact texture and the fraction defective of chip type component can be minimized.
It addition, in order to chip type component being burnt till and hardening without arranging other production equipment, therefore, it is possible to save
The manufacturing expense of chip type component.
It addition, directly chip type component can be heated by pressure medium or cool down, therefore can be at short notice
Chip type component is heated or cools down, therefore, it is possible to shorten the manufacturing time of chip type component.
This concludes the description of embodiments of the invention, the interest field of single present invention is not limited to that, and includes this area
Technical staff easily carries out changing and being considered to have all changes of the scope of equivalent and repair by the embodiment of the present invention
Change.
Industrial applicability
The present invention may use semiconductor manufacturing, ceramic-like processing, compressing etc. industrial circle.
Claims (31)
1. an isostatic pressed press fit device, it is formed with the holding tank that can accommodate material, and includes by described holding tank
Filling pressure medium to carry out the high-pressure bottle of isostatic pressed pressurization to material, it is characterised in that
Including: heat exchanger,
Described heat exchanger includes heat exchange component,
In described heat exchange component is located at described holding tank and carry out heat exchange with pressure medium, with to supply to described holding tank
Described pressure medium carry out heating or cooling down.
Isostatic pressed press fit device the most according to claim 1, it is characterised in that
Described heat exchange component is heated or cooled by means of the thermal medium of supply to described heat exchange component.
Isostatic pressed press fit device the most according to claim 2, it is characterised in that
Described heat exchanger includes the heating part heating described thermal medium and the cooling cooling down described thermal medium
Portion.
Isostatic pressed press fit device the most according to claim 3, it is characterised in that
Described heat exchanger includes selecting supply unit,
The thermal medium heated from described heating part and described cooling end or cool down optionally is supplied by described selection supply unit
Give to described heat exchange component.
Isostatic pressed press fit device the most according to claim 2, it is characterised in that
Described heat exchanger includes the thermal medium storage tank for storing described thermal medium.
Isostatic pressed press fit device the most according to claim 2, it is characterised in that
Described heat exchange component includes:
Inflow entrance, for the thermal medium inflow for cooling down or heat described heat exchange component；
Outlet, discharges for flowing into the thermal medium of described inflow entrance；And
Micro-flow path, connects described inflow entrance and outlet, can circulate described heat exchange component in a zigzag.
Isostatic pressed press fit device the most according to claim 2, it is characterised in that
Described thermal medium includes water.
Isostatic pressed press fit device the most according to claim 1, it is characterised in that
Described heat exchange component includes carrying out, by means of electricity, the heater that heats.
Isostatic pressed press fit device the most according to claim 1, it is characterised in that
Described heat exchange component includes carrying out, by means of coolant, the cooling unit that cools down.
Isostatic pressed press fit device the most according to claim 1, it is characterised in that
Described heat exchange component by plate-like shape or drum or spiral-shaped in any one shape formed.
11. isostatic pressed press fit devices according to claim 1, it is characterised in that
Described heat exchange component includes the multiple through holes running through described heat exchange component or protrudes from described heat exchange component
Outside and multiple projections of being formed, to expand the contact area with described pressure medium.
12. isostatic pressed press fit devices according to claim 1, it is characterised in that
Including thermal insulating material, described thermal insulating material is configured at the inner face of described holding tank, for preventing the heat of described heat-exchanging part
It is conveyed to the outside of described holding tank.
13. isostatic pressed press fit devices according to claim 12, it is characterised in that
Described thermal insulating material includes any one in resin, ceramic-like.
14. isostatic pressed press fit devices according to claim 1, it is characterised in that
Described high-pressure bottle also includes sealing the top of described high-pressure bottle and the upper cover of bottom and lower cover respectively,
And including the heater for heating described pressure medium, any one in described upper cover and lower cover be located at by this heater
Or all arrange in described upper cover and lower cover.
15. isostatic pressed press fit devices according to claim 1, it is characterised in that
Described high-pressure bottle also includes sealing the top of described high-pressure bottle and the upper cover of bottom and lower cover respectively,
And include being incorporated into any one in described upper cover and lower cover and for shelving the shelf of material.
16. 1 kinds utilize isostatic pressed press fit device to manufacture the manufacture method of chip type component, and its isostatic pressed press fit device is formed
Having the holding tank accommodating chip type component, and include: high-pressure bottle, it is by being filled in the pressure medium in described holding tank,
Chip type component is carried out isostatic pressed pressurization；And heat exchanger, this heat exchanger includes carrying out heat exchange with described pressure medium
Heat exchange component, this heat exchange component is located at described holding tank, enters for the pressure medium of supply to described holding tank
Row heating or cooling,
It is characterized in that, including:
Move into step, described chip type component is moved into described holding tank；
Compressing step, pressure medium supply to described holding tank, carries out isostatic pressed to described chip type component and is pressed into
Type；
Heating steps, under the state keeping pressure by described pressure medium, in order to described chip type component is heated,
The described heat exchange component carrying out heat exchange with described pressure medium is heated；
Discharge step, the described pressure medium in supply to described holding tank, discharge from described holding tank；And
Take out of step, the described chip type component being contained in described holding tank is taken out of.
17. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Before the heating steps that the described heat exchange component carrying out heat exchange with described pressure medium is heated or it
After, including cooling step,
Described cooling step is under the state keeping pressure by described pressure medium, in order to cool down described chip type component and right
The described heat exchange component carrying out heat exchange with described pressure medium cools down.
18. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Described heat exchange component is heated or cooled by means of the thermal medium of supply to described heat exchange component.
19. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 18, its feature
It is,
Described heat exchanger includes the heating part heating described thermal medium and the cooling cooling down described thermal medium
Portion.
20. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 18, its feature
It is,
Described heat exchanger includes selecting supply unit,
The thermal medium heated from described heating part and described cooling end or cool down optionally is supplied by described selection supply unit
Give to described heat exchange component.
21. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 18, its feature
It is,
Described heat exchanger includes the thermal medium storage tank for storing described thermal medium.
22. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 18, its feature
It is,
Described heat exchange component includes:
Inflow entrance, for the thermal medium inflow for cooling down or heat described heat exchange component；
Outlet, discharges for flowing into the thermal medium of described inflow entrance；And
Micro-flow path, connects described inflow entrance and outlet, can circulate described heat exchange component in a zigzag.
23. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 18, its feature
It is,
Described thermal medium includes water.
24. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Described heat exchange component includes carrying out, by means of electricity, the heater that heats.
25. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Described heat exchange component includes carrying out, by means of coolant, the cooling unit that cools down.
26. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Described heat exchange component by plate-like shape or drum or spiral-shaped in any one shape formed.
27. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Described heat exchange component includes the multiple through holes running through described heat exchange component or protrudes from described heat exchange component
Outside and multiple projections of being formed, to expand the contact area with described pressure medium.
28. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Including thermal insulating material, described thermal insulating material is configured at the inner face of described holding tank, for preventing the heat of described heat-exchanging part
It is conveyed to the outside of described holding tank.
29. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 28, its feature
It is,
Described thermal insulating material includes any one in resin, ceramic-like.
30. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Described high-pressure bottle also includes sealing the top of described high-pressure bottle and the upper cover of bottom and lower cover respectively,
And including the heater for heating described pressure medium, any one in described upper cover and lower cover be located at by this heater
Or all arrange in described upper cover and lower cover.
31. manufacture methods utilizing isostatic pressed press fit device to manufacture chip type component according to claim 16, its feature
It is,
Described high-pressure bottle also includes sealing the top of described high-pressure bottle and the upper cover of bottom and lower cover respectively,
And include being incorporated into any one in described upper cover and lower cover and for shelving the shelf of material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0043427 | 2014-04-11 | ||
| KR1020140043427A KR101708490B1 (en) | 2014-04-11 | 2014-04-11 | A isostatic press be able to heating and colding, and a manufacturing method of Chip Component using the same |
| PCT/KR2014/005936 WO2015156447A1 (en) | 2014-04-11 | 2014-07-03 | Isostatic press capable of performing heating and cooling and method for manufacturing chip component using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106163702A true CN106163702A (en) | 2016-11-23 |
| CN106163702B CN106163702B (en) | 2018-08-07 |
Family
ID=54288012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480077938.1A Active CN106163702B (en) | 2014-04-11 | 2014-07-03 | The isostatic pressed pressing device that can be heated and be cooled down and the manufacturing method using its device manufacturing chip type component |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP3130415B1 (en) |
| JP (1) | JP6293362B2 (en) |
| KR (1) | KR101708490B1 (en) |
| CN (1) | CN106163702B (en) |
| ES (1) | ES2869931T3 (en) |
| HU (1) | HUE055601T2 (en) |
| PL (1) | PL3130415T3 (en) |
| WO (1) | WO2015156447A1 (en) |
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| CN107718694A (en) * | 2017-11-21 | 2018-02-23 | 中国科学院深海科学与工程研究所 | A kind of super-pressure cryogenic gas pressure experiment device |
| CN108746607A (en) * | 2018-07-05 | 2018-11-06 | 江苏普隆磁电有限公司 | A kind of isostatic compaction device preparing magnet for powder metallurgy process |
| TWI714222B (en) * | 2019-08-20 | 2020-12-21 | 活全機器股份有限公司 | Press cycle system with heat recovery function |
| CN115488334A (en) * | 2022-09-27 | 2022-12-20 | 株洲东亚工具有限公司 | Compact forming equipment for hard alloy rod |
| CN117067665A (en) * | 2023-09-18 | 2023-11-17 | 浙江德龙科技有限公司 | Temperature isostatic pressing machine |
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| JP6840786B2 (en) * | 2019-05-15 | 2021-03-10 | 株式会社神戸製鋼所 | Isotropic pressure pressurizing device, accommodation unit for isotropic pressure pressurizing device, isotropic pressure pressurizing processing method |
| KR102138354B1 (en) * | 2019-11-27 | 2020-07-27 | 에너진(주) | A isostatic press be able to heating and colding |
| KR102462282B1 (en) | 2020-11-06 | 2022-11-07 | (주)삼양세라텍 | Warm isostatic press possible having colding function |
| KR102437272B1 (en) * | 2020-11-25 | 2022-08-30 | 동우에이치에스티(주) | Hot isostatic pressing device |
| KR102275860B1 (en) | 2021-01-26 | 2021-07-09 | 에너진(주) | Isostatic press device capable of rapid heating and cooling by pressurized liquid circulation fan |
| KR102344720B1 (en) * | 2021-07-28 | 2021-12-29 | (주)일신오토클레이브 | Hydrostatic device with non-contact agitation conveying system |
| KR102344685B1 (en) * | 2021-07-28 | 2021-12-29 | (주)일신오토클레이브 | Hydrostatic device with toothed fixture |
| CN113732284B (en) * | 2021-09-24 | 2023-06-09 | 河北宏靶科技有限公司 | Target hot isostatic pressing forming method and equipment |
| KR20230128661A (en) | 2022-02-28 | 2023-09-05 | 엔에이티엠 주식회사 | Gas pressure medium forming press using ultra-high temperature and ultra-high pressure equipment |
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| Publication number | Publication date |
|---|---|
| EP3130415B1 (en) | 2021-03-31 |
| PL3130415T3 (en) | 2021-10-25 |
| EP3130415A1 (en) | 2017-02-15 |
| EP3130415A4 (en) | 2018-01-10 |
| KR101708490B1 (en) | 2017-02-21 |
| HUE055601T2 (en) | 2021-12-28 |
| JP2017513718A (en) | 2017-06-01 |
| JP6293362B2 (en) | 2018-03-14 |
| ES2869931T3 (en) | 2021-10-26 |
| KR20150117829A (en) | 2015-10-21 |
| CN106163702B (en) | 2018-08-07 |
| WO2015156447A1 (en) | 2015-10-15 |
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