JP6289808B2 - ワイヤーループ成形システムおよびその使用方法 - Google Patents

ワイヤーループ成形システムおよびその使用方法 Download PDF

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Publication number
JP6289808B2
JP6289808B2 JP2013019986A JP2013019986A JP6289808B2 JP 6289808 B2 JP6289808 B2 JP 6289808B2 JP 2013019986 A JP2013019986 A JP 2013019986A JP 2013019986 A JP2013019986 A JP 2013019986A JP 6289808 B2 JP6289808 B2 JP 6289808B2
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JP
Japan
Prior art keywords
wire
bonding
forming tool
tool
loop
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Active
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JP2013019986A
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English (en)
Japanese (ja)
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JP2013191836A (ja
JP2013191836A5 (https=
Inventor
マイケル バイアーズ、ジョナサン
マイケル バイアーズ、ジョナサン
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Orthodyne Electronics Corp
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Orthodyne Electronics Corp
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Publication date
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Publication of JP2013191836A5 publication Critical patent/JP2013191836A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07163—Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2013019986A 2012-02-07 2013-02-05 ワイヤーループ成形システムおよびその使用方法 Active JP6289808B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261596145P 2012-02-07 2012-02-07
US61/596,145 2012-02-07
US13/746,489 2013-01-22
US13/746,489 US8998063B2 (en) 2012-02-07 2013-01-22 Wire loop forming systems and methods of using the same

Publications (3)

Publication Number Publication Date
JP2013191836A JP2013191836A (ja) 2013-09-26
JP2013191836A5 JP2013191836A5 (https=) 2016-03-17
JP6289808B2 true JP6289808B2 (ja) 2018-03-07

Family

ID=48902029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013019986A Active JP6289808B2 (ja) 2012-02-07 2013-02-05 ワイヤーループ成形システムおよびその使用方法

Country Status (3)

Country Link
US (2) US8998063B2 (https=)
JP (1) JP6289808B2 (https=)
CN (2) CN103295934B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
DE102014011219B4 (de) * 2014-07-29 2017-10-26 Audi Ag Vorrichtung und Verfahren zur Ausbildung einer elektrischen Kontaktierung zwischen einer Energiespeicherzelle und einer Leiterblechstruktur
US9881891B1 (en) * 2016-11-15 2018-01-30 Asm Technology Singapore Pte Ltd Method of forming three-dimensional wire loops and wire loops formed using the method
DE102018221950A1 (de) 2018-12-17 2020-06-18 BINDER tecsys GmbH Verfahren zur Herstellung und Positionierung elektrischer Verbinder
KR102859474B1 (ko) 2020-07-10 2025-09-15 삼성전자주식회사 와이어 본딩 장치
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218702A (en) * 1961-06-09 1965-11-23 Frederick W Steudler Method and apparatus for bonding wires to metal surfaces
US4068371A (en) * 1976-07-12 1978-01-17 Miller Charles F Method for completing wire bonds
JPS58137221A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd ワイヤボンデイング装置
JPS58192688A (ja) 1982-04-30 1983-11-10 Chiyouonpa Kogyo Kk ワイヤボンデイング装置におけるワイヤル−プ整形方法
EP0383091B1 (en) * 1989-02-13 1993-11-10 Nihon Bayer Agrochem K.K. Insecticidally active nitro compounds
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method
JPH05144867A (ja) * 1991-11-19 1993-06-11 Hitachi Ltd 電子装置およびワイヤボンデイング方法ならびにワイヤボンデイング装置
US5277355A (en) * 1992-11-25 1994-01-11 Kulicke And Soffa Investments, Inc. Self-aligning fine wire clamp
JP2783125B2 (ja) 1993-07-23 1998-08-06 株式会社デンソー ワイヤボンディング方法
US5395038A (en) * 1994-04-25 1995-03-07 International Business Machines Corporation High placement accuracy wire bonder for joining small closely spaced wiring features
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
JPH09321074A (ja) * 1996-05-31 1997-12-12 Toyota Motor Corp ワイヤボンディング装置
JP4467175B2 (ja) * 2000-12-22 2010-05-26 株式会社新川 ボンディングデータ設定装置および方法
US7464854B2 (en) * 2005-01-25 2008-12-16 Kulicke And Soffa Industries, Inc. Method and apparatus for forming a low profile wire loop
US7735716B2 (en) * 2006-10-27 2010-06-15 Kulicke And Soffa Industries, Inc. Method of controlling the trajectory of a bonding tool during the formation of a wire loop
US7597235B2 (en) 2007-11-15 2009-10-06 Infineon Technologies Ag Apparatus and method for producing a bonding connection
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP2010118400A (ja) * 2008-11-11 2010-05-27 Renesas Technology Corp 半導体装置及びその製造方法
US8434669B1 (en) * 2012-01-05 2013-05-07 Asm Technology Singapore Pte Ltd. Universal bond head for wire bonders

Also Published As

Publication number Publication date
CN107039294A (zh) 2017-08-11
JP2013191836A (ja) 2013-09-26
US20130200134A1 (en) 2013-08-08
CN107039294B (zh) 2020-10-16
US20150144682A1 (en) 2015-05-28
US8998063B2 (en) 2015-04-07
CN103295934A (zh) 2013-09-11
CN103295934B (zh) 2016-11-16

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