JP6274965B2 - 可逆性ポリマー接着剤組成物 - Google Patents

可逆性ポリマー接着剤組成物 Download PDF

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Publication number
JP6274965B2
JP6274965B2 JP2014100000A JP2014100000A JP6274965B2 JP 6274965 B2 JP6274965 B2 JP 6274965B2 JP 2014100000 A JP2014100000 A JP 2014100000A JP 2014100000 A JP2014100000 A JP 2014100000A JP 6274965 B2 JP6274965 B2 JP 6274965B2
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JP
Japan
Prior art keywords
adhesive composition
reversible
furan
maleimide
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014100000A
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English (en)
Japanese (ja)
Other versions
JP2014234514A5 (OSRAM
JP2014234514A (ja
Inventor
ジェームズ・ディー・マヨ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JP2014234514A publication Critical patent/JP2014234514A/ja
Publication of JP2014234514A5 publication Critical patent/JP2014234514A5/ja
Application granted granted Critical
Publication of JP6274965B2 publication Critical patent/JP6274965B2/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • B32B37/1292Application of adhesive selectively, e.g. in stripes, in patterns
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • C08G73/121Preparatory processes from unsaturated precursors and polyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • C08G73/128Unsaturated polyimide precursors the unsaturated precursors containing heterocyclic moieties in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09J179/085Unsaturated polyimide precursors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • B32B2037/1215Hot-melt adhesive
    • B32B2037/1223Hot-melt adhesive film-shaped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/31Heat sealable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2355/00Specific polymers obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in a single one of index codes B32B2323/00 - B32B2333/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00Adhesive articles, e.g. adhesive tapes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00Presence of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2014100000A 2013-05-30 2014-05-13 可逆性ポリマー接着剤組成物 Expired - Fee Related JP6274965B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/905,729 2013-05-30
US13/905,729 US9193139B2 (en) 2013-05-30 2013-05-30 Reversible polymer adhesive composition

Publications (3)

Publication Number Publication Date
JP2014234514A JP2014234514A (ja) 2014-12-15
JP2014234514A5 JP2014234514A5 (OSRAM) 2017-06-22
JP6274965B2 true JP6274965B2 (ja) 2018-02-07

Family

ID=51899632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014100000A Expired - Fee Related JP6274965B2 (ja) 2013-05-30 2014-05-13 可逆性ポリマー接着剤組成物

Country Status (3)

Country Link
US (1) US9193139B2 (OSRAM)
JP (1) JP6274965B2 (OSRAM)
DE (1) DE102014209708A1 (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6613649B2 (ja) * 2014-06-23 2019-12-04 東洋インキScホールディングス株式会社 接着剤組成物、積層シート、太陽電池用裏面保護シート
CN112750741B (zh) * 2019-10-29 2023-01-03 成都辰显光电有限公司 一种微元件的转移基板及转移方法
US20240271012A1 (en) * 2023-02-14 2024-08-15 The Boeing Company Thermoreversible urethane-based adhesive compositions and associated methods for bonding and bonded articles
EP4461758A1 (en) * 2023-05-11 2024-11-13 Vito NV Reversible lignin adhesive

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4303924A (en) 1978-12-26 1981-12-01 The Mead Corporation Jet drop printing process utilizing a radiation curable ink
US4978969A (en) 1989-07-05 1990-12-18 Hewlett-Packard Company Method for printing using ultra-violet curable ink
US5270368A (en) 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
IL111014A (en) 1994-09-21 1999-05-09 Scitex Corp Ltd Ink compositions and a method for making same
TW338044B (en) * 1994-11-15 1998-08-11 Shell Internattonale Res Mij B V A cross linked resin
US5840215A (en) * 1996-12-16 1998-11-24 Shell Oil Company Anisotropic conductive adhesive compositions
US5760337A (en) * 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
US5844020A (en) 1997-03-31 1998-12-01 Xerox Corporation Phase change ink compositions
JP4031866B2 (ja) * 1998-06-16 2008-01-09 横浜ゴム株式会社 リサイクル性エラストマー
US6042227A (en) 1998-05-19 2000-03-28 Xerox Corporation Hot melt phase change ink containing Diels-Alder polymerization precursor
JP2000037802A (ja) * 1998-07-24 2000-02-08 Dainippon Ink & Chem Inc 大面積積層体の製造法
US6883908B2 (en) * 2001-01-08 2005-04-26 3M Innovative Properties Company Methods and compositions for ink jet printing of pressure sensitive adhesive patterns or films on a wide range of substrates
US6825315B2 (en) * 2001-12-21 2004-11-30 Sandia Corporation Method of making thermally removable adhesives
DE102007062316A1 (de) * 2007-12-21 2009-06-25 Evonik Degussa Gmbh Reaktive Isocyanatzusammensetzungen
JP5544615B2 (ja) * 2009-05-14 2014-07-09 独立行政法人産業技術総合研究所 熱可逆反応型高分子組成物
EP2440627B1 (en) * 2009-06-11 2015-03-04 Henkel US IP LLC Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds

Also Published As

Publication number Publication date
US20140352884A1 (en) 2014-12-04
US9193139B2 (en) 2015-11-24
DE102014209708A1 (de) 2014-12-04
JP2014234514A (ja) 2014-12-15

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