JP6267011B2 - Semiconductor light emitting device manufacturing method and semiconductor light emitting device - Google Patents

Description

  The present invention relates to a method of manufacturing a semiconductor light emitting device and a semiconductor that emits large surface light by mounting a plurality of semiconductor light emitting elements on a large support substrate at predetermined intervals and providing a fluorescent resin layer on the light emitting surface of each light emitting element. The present invention relates to a light emitting device.

  2. Description of the Related Art In recent years, LED light-emitting elements (hereinafter abbreviated as LED elements), which are semiconductor light-emitting elements, have a long life and excellent driving characteristics, and are small in size, have high luminous efficiency, and have a bright emission color. It has come to be widely used for backlights and lighting. Also in the present invention, as an example of a semiconductor light emitting device, an LED light emitting device using an LED element as a semiconductor light emitting element will be described as an example.

  In particular, a blue LED is used as an LED light-emitting device that mounts a plurality of LED elements on a large-sized support substrate at predetermined intervals and provides a fluorescent resin layer on the light-emitting surface of each LED element to perform large surface light emission. However, white light emitting LED light emitting devices have been developed by combining the YAG phosphor layers in the fluorescent resin layer, and various proposals have been made for these LED light emitting devices (for example, Patent Document 1 and Patent Document 2). )

  Hereinafter, the conventional LED light-emitting device in Patent Document 1 will be described. FIG. 7 is a cross-sectional view of the LED light-emitting device in Patent Document 1, and the drawings are simplified and the part names are the same as those of the present invention without departing from the spirit of the invention. In FIG. 7, the LED light emitting device 100 has a large support substrate 102 on which a plurality of LED elements 101 are mounted mounted on a metal base 111 for heat dissipation. A wiring electrode 103 having a power supply terminal is provided around the support substrate 102, and ends of a plurality of LEDs 101 (not shown) connected in series and parallel on the support substrate 102 are connected to the wiring electrode 103 by wires 104. It is connected. The LED 101 group and the wire 104 on the support substrate 102 are covered with a fluorescent resin layer 105 mixed with fluorescent particles.

  The LED light emitting device 100 having the above configuration will be described using a blue LED as the LED 101 and a fluorescent resin layer in which YAG fluorescent particles are mixed as a wavelength conversion member in the fluorescent resin layer 105 as an example. When the LED light emitting device 100 supplies power to the power supply terminal provided on the wiring electrode 103, the LED light emitting device 100 emits pseudo white light by mixing the blue radiated light of the blue LED 101 and the yellow radiated light wavelength-converted by YAG. .

  8 and 9 show the LED light-emitting device in Patent Document 2, FIG. 8 is a plan view of the LED light-emitting device 200, and FIG. 9 is a cross-sectional view taken along line AA of the LED light-emitting device 200 shown in FIG. The drawings are simplified and the part names are the same as those of the present invention without departing from the spirit of the invention. 8 and 9, the LED light emitting device 200 is provided with a connection electrode 203d for connecting the LEDs in addition to the wiring electrode 203a, the power supply electrode 203b, and the through side electrode 203c on the large support substrate 202. The LED elements 201a and 201b are FC-mounted in series between the wiring electrode 203a and the connection electrode 203d. Although not shown, the LED elements 201c and 201d are similarly FC-mounted in series between the wiring electrode 203a and the connection electrode 203d. The two sets of LED elements 201a and 201b and the LED elements 201c and 201d connected in series are connected in parallel.

  The phosphor plates 205a, 205b, 205c, and 205d are independently bonded to the light emitting surfaces of the LED elements 201a, 201b, 201c, and 201d with a transparent adhesive, and the sealing is formed on the support substrate 202 by printing. Reflective resin 207 is filled between the frame 208 and the lower surface of each phosphor plate 205 and between the support substrate 202 and each LED element 201. Furthermore, the range including the upper surfaces of the four phosphor plates 205a to 205d is covered with the transparent resin 206, whereby the LED light emitting device 200 is completed. For the convenience of drawing, the LED light emitting device 200 shows an example in which four LED elements 201a to 201d are mounted on the support substrate 202. However, in an actual LED light emitting device, several tens to several hundreds It is natural that the LED elements are mounted at a predetermined interval.

JP 2010-170945 A (see FIG. 6) JP 2012-243822 A (see FIGS. 5 and 6)

By using a blue LED as the LED element and using a fluorescent resin layer in which YAG fluorescent particles are mixed as a wavelength conversion member for the fluorescent resin layer, the mixture of blue radiation light and yellow radiation light wavelength-converted by YAG In the LED light emitting device that emits pseudo white light, the following is required.
It has good heat dissipation characteristics to obtain bright synchrotron radiation, is thin in shape, and eliminates the yellow ring peculiar to LED light-emitting devices using fluorescent resins to improve emission chromaticity. is there.

  The reason for the occurrence of this yellow ring will be described with reference to FIGS. FIG. 10 is a cross-sectional view showing the state of the emitted light of the LED light emitting device 100 shown in FIG. 7, and the configuration is the same as that of the LED light emitting device 100 of FIG. That is, since the outgoing light Ph emitted upward from the blue LED element 101 has a short distance passing through the fluorescent resin layer 105 coated in a rectangular shape, the blue emitted light and the yellow emitted light wavelength-converted by YAG Are appropriately mixed, and the emitted light is close to white. On the other hand, since the outgoing light Py emitted obliquely laterally from the LED element 101 has a longer distance to pass through the fluorescent resin layer 105, the number of collisions with the YAG fluorescent particles increases, and the yellowish outgoing light and Become.

  FIG. 11 shows this state. That is, FIG. 11 is a top view of the portion of the fluorescent resin layer 105 in FIG. 10. White light Ph is emitted from the central portion, but yellowish light Py is emitted in a ring shape at the peripheral portion. ing. The ring-shaped yellow light Py around this is a yellow ring, which is not only difficult to see as a lighting device, but also when used in a camera flash, a color change occurs in a color photograph, which is fatal.

As described above, the LED element 100 described in Patent Document 1 is easy to manufacture because the fluorescent resin layer 105 can be collectively covered with respect to the plurality of LED elements 101, but there is a problem in that yellow ring occurs. On the other hand, in the LED light emitting device 200 described in Patent Document 2, since the phosphor plate 205 is individually fixed to the light emitting surface of each LED element 201, yellow ring is not generated, and the side surface of the LED element 201 is not generated. The drawback of the LED light emitting device 100 is improved in that the radiation efficiency is improved by coating the side with the reflective resin 207.
However, in the configuration of the LED light emitting device 200, since the phosphor plates 205 are individually fixed to the light emitting surfaces of the plurality of LED elements 201, there is a problem that the manufacturing is troublesome and the manufacturing cost is increased. In order to protect the phosphor plate 205 fixed to the element 201, there is a problem that it is necessary to coat the translucent resin 206 on the upper surface side of the phosphor plate 205.

  The object of the present invention is to solve the above-mentioned problems, and there is no occurrence of yellow ring as in the LED light emitting device 100, and it is troublesome to manufacture the LED light emitting device 200 and the manufacturing cost is increased. It is providing the manufacturing method of an LED light-emitting device and LED light-emitting device which solved this.

In order to achieve the above object, a method for manufacturing an LED light emitting device according to the present invention includes a light emitting element mounting substrate forming step of mounting a plurality of semiconductor light emitting elements on a large support substrate at a predetermined interval, and the light emitting element mounting substrate. A support frame forming step of forming a support frame on the light emitting element mounting surface, and a fluorescent resin for forming a plurality of fluorescent resin layers at positions corresponding to the light emitting elements on the light emitting element mounting substrate of the large-sized translucent sheet A sheet forming step, and the fluorescent resin sheet is stacked on the light emitting element mounting substrate, the fluorescent resin sheet is fixed to the support frame, and the fluorescent resin layers are fixed to the light emitting surface of the light emitting elements at once. The method includes a resin sheet fixing step and a reflective resin filling step of filling a reflective resin around a light emitting element mounted on the light emitting element mounting substrate .

  According to the manufacturing method, the fluorescent resin sheet on which the plurality of fluorescent resin layers are formed is stacked on the LED element mounting substrate on which the plurality of LED elements are mounted at predetermined intervals, and the fluorescent resin layer is formed on the light emitting surface of each LED element. Since it can be fixed together and the upper surface side of the fluorescent resin layer can be protected with a translucent sheet, it is possible to provide a method for manufacturing an LED light-emitting device that is thin, reliable, and easy to manufacture. .

  According to the above manufacturing method, an LED light emitting device with good emission efficiency can be manufactured.

  The fluorescent resin sheet forming step is a printing step of printing a fluorescent resin layer on a translucent sheet, and the fluorescent resin sheet fixing step is performed on the light emitting surface of each light emitting element by a curing process of the printed fluorescent resin layer. It is good that it is the adhering process which adheres.

  According to the said manufacturing method, the hardening process of a fluorescent resin layer and fixation of the fluorescent resin layer with respect to the light emission surface of an LED element can be performed simultaneously.

  The fluorescent resin sheet forming step is a print curing step in which a fluorescent resin layer is printed and cured on a translucent sheet, and the fluorescent resin sheet fixing step is performed by using a transparent adhesive to print and cure the fluorescent resin layer. A fixing process for fixing to the light emitting surface of each light emitting element is preferable.

  The fluorescent resin sheet forming step may be a multiple printing step for forming a plurality of fluorescent resin layers having different excitation light.

  As described above, according to the manufacturing method of the present invention, the fluorescent resin sheet on which the plurality of fluorescent resin layers are formed is stacked on the LED element mounting substrate on which the plurality of LED elements are mounted at predetermined intervals, and the light emitting surface of each LED element is stacked. The fluorescent resin layer can be fixed together, and the upper surface side of the fluorescent resin layer can be protected with a translucent sheet. Therefore, a thin, reliable and easy-to-manufacture method for manufacturing an LED light-emitting device is provided. Can be provided.

It is a top view which shows 1st Embodiment of the LED light-emitting device in this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is a process which shows the manufacturing method by 1st Embodiment for manufacturing the LED light-emitting device shown in FIG. It is process drawing which shows the manufacturing method by 2nd Embodiment for manufacturing the LED light-emitting device of this invention. It is process drawing which shows the manufacturing method by 3rd Embodiment for manufacturing the LED light-emitting device of this invention. It is a top view which shows 2nd Embodiment of the LED light-emitting device in this invention. It is sectional drawing of the conventional LED light-emitting device shown in the cited reference 1. It is a top view of the conventional LED light-emitting device shown in the cited reference 2. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is sectional drawing which shows the state of the radiated light of the conventional LED light-emitting device shown in FIG. It is a top view of the fluorescent resin layer part in the LED light-emitting device shown in FIG.

(Configuration of LED light-emitting device in the first embodiment)
Hereinafter, the manufacturing method of the LED light emitting device and the configuration of the LED light emitting device according to the present invention will be described with reference to the drawings. 1 and 2 show the configuration of an LED light-emitting device manufactured by the manufacturing method of the present invention, FIG. 1 is a plan view of the LED light-emitting device 10, and FIG. 2 is a cross-sectional view taken along line AA of the LED light-emitting device 10 shown in FIG. FIG. 1 and 2, an LED light emitting device 10 includes a plurality of LED elements 1 mounted on a support substrate 2 at a predetermined interval, and an LED element mounting substrate 2L provided with a support frame 8 around the upper surface of the support substrate 2. The fluorescent resin layer sheet 6K is formed by forming a plurality of fluorescent resin layers 5 by printing or the like at positions corresponding to the LED elements 1 of the LED element mounting substrate in the large-sized translucent sheet 6, and this LED element mounting The substrate 2 </ b> L and the fluorescent resin layer sheet 6 </ b> K are overlapped, and the periphery of the fluorescent resin layer sheet 6 </ b> K is fixed to the support frame 8 and the fluorescent resin layers 5 are fixed to the light emitting surfaces of the LED elements 1 at a time.

  Further, the reflective resin 7 is injected from an injection hole 6 a provided around the translucent sheet 6, so that the side surface and the lower surface of the LED light emitting device are covered with the reflective resin 7. As the translucent sheet 6, a transparent sheet or a diffusive sheet may be used.

  In the LED light emitting device 10 having the above-described configuration, the fluorescent resin layer 5 is fixed to the light emitting surfaces of the plurality of LED elements 1 intensively mounted on the large support substrate 2, and the side surfaces and the lower surface of the LED elements 1 are reflective. Since it is coated with the resin 7, the LED light emitting device that emits light with a large surface without generating a yellow ring is obtained, and the upper surface side of the fluorescent resin layer 5 is covered with a transparent or diffusible translucent sheet 6. By protecting, a highly reliable LED light-emitting device can be provided.

(Manufacturing method according to the first embodiment)
FIG. 3 is a process showing a manufacturing method according to the first embodiment for manufacturing the LED light emitting device 10 shown in FIGS. FIG. 3A shows a light emitting element mounting substrate forming process and a support frame forming process. That is, a plurality of LED elements 1 are mounted at predetermined intervals on wiring electrodes (not shown) formed on the upper surface of the large support substrate 2 to form the light emitting element mounting board 2L, and the LEDs on the light emitting element mounting board 2L A support frame 8 is formed on the mounting surface of the element 1.
As a method for forming the support frame 8, the support frame 8 prepared in advance may be bonded to the support substrate 2 with an adhesive, or a resin may be formed into a frame shape by molding or printing.

  FIG. 3B shows a fluorescent resin sheet forming process. A large-sized translucent sheet 6 is prepared, and a plurality of the translucent sheets 6 are provided at positions corresponding to the LED elements 1 on the light emitting element mounting substrate 2L. The fluorescent resin layer 5 is formed to form a fluorescent resin sheet 6K. In the method of forming the fluorescent resin layer 5, the fluorescent resin is formed at an accurate position by screen printing or the like using a mask. The fluorescent resin layer 5 formed by this printing or the like is in an uncured state.

  FIG. 3C shows a fluorescent resin sheet fixing step, in which the fluorescent resin sheet 6K is stacked on the light emitting element mounting substrate 2L, the fluorescent resin sheet 6K is fixed to the support frame 8, and the light emitting surface of each LED element 1 is attached. Each fluorescent resin layer 5 is fixed together. In the manufacturing method according to the first embodiment, when the fluorescent resin layer 5 is printed at a position corresponding to the LED element 1 of the translucent sheet 6, the fluorescent light is also emitted to the position corresponding to the support frame 8 of the translucent sheet 6. The resin layer 5 is formed, and the uncured fluorescent resin layer 5 is bonded to the light emitting surface of each LED element 1 and the support frame 8 by superimposing the fluorescent resin sheet 6K on the light emitting element mounting substrate 2L. By performing the treatment (depending on the curing temperature of the resin), the fluorescent resin sheet 6K is fixed to the support frame 8, and the fluorescent resin layers 5 are fixed to the light emitting surfaces of the LED elements 1 at a time.

  FIG. 3D shows a reflective resin filling step, and after the fixing step of the fluorescent resin sheet 6K, the LED element 1 is injected by injecting the reflective resin 7 from the injection hole 6a provided around the translucent sheet 6. The side surface and the lower surface are filled with a reflective resin 7 and covered. Since the manufacturing method of the LED light emitting device 20 in the first embodiment is performed by fixing the fluorescent resin sheet 6K and the light emitting element mounting substrate 2L by curing the fluorescent resin layer 5, the manufacturing process is simplified and the manufacturing price is reduced. Inexpensive can be expected.

(Manufacturing method according to the second embodiment)
Next, a manufacturing method according to the second embodiment for manufacturing the LED light emitting device 20 will be described with reference to FIG. FIG. 4 is a process showing the manufacturing method according to the second embodiment for manufacturing the LED light emitting device 10, and the basic manufacturing process is the same as the manufacturing process according to the first embodiment shown in FIG. The description of the same process will be omitted.

  The light emitting element mounting substrate forming process in FIG. 4A is the same as that in FIG. In the fluorescent resin sheet forming step in FIG. 4B, the fluorescent resin layer 5 is cured by performing a heat treatment after printing the same fluorescent resin layer 5 as in FIG. FIG. 4C shows an adhesive layer forming step, in which an adhesive layer 9 is formed on the fluorescent resin layer 5 cured in the fluorescent resin sheet forming step. FIG. 4D shows a fluorescent resin sheet fixing process, which is basically the same as the fluorescent resin sheet fixing process of FIG. 3C, but the fluorescent resin sheet 6K and the light emitting element mounting substrate 2L are fixed by the adhesive layer 9. Has been done. The reflective resin filling step in FIG. 4 (e) is the same as the reflective resin filling step in FIG. 3 (d). Thus, the LED light emitting device 20 is completed.

  In the manufacturing method of the LED light emitting device 20 in the second embodiment, since the fluorescent resin layer 6 is cured and then the fluorescent resin sheet 6K and the light emitting element mounting substrate 2L are fixed, the thickness dimension of the fluorescent resin layer 5 is managed. Is accurate, and it can be expected that the emitted light will be uniform.

(Manufacturing method according to the third embodiment)
Next, a manufacturing method according to the third embodiment for manufacturing the LED light emitting device 30 will be described with reference to FIG. FIG. 5 is a process showing a manufacturing method according to the third embodiment for manufacturing the LED light emitting device 30, and the basic manufacturing process is the same as the manufacturing process according to the first embodiment shown in FIG. The description of the same process will be omitted.

  FIG. 5A shows a light emitting element mounting substrate forming process. The difference from the light emitting element mounting substrate forming process of FIG. 3A is that the mounting intervals of the LED elements 1 are wide and the height of the support frame 8 is high. It is high and is provided so as to partition the LED elements 1. FIG. 5B shows a fluorescent resin sheet forming process. The difference from the fluorescent resin sheet forming process of FIG. 3B is that the size of the translucent sheet 6 is large and corresponds to each LED element 1. A plurality of injection holes 6a are provided.

  FIG. 5C shows a fluorescent resin sheet fixing step. The difference from the fluorescent resin sheet fixing step in FIG. 3C is that the height of the light emitting surface of the LED element 1 on the light emitting element mounting substrate 2L is higher than that of the support frame 8. Since the height is high, the fluorescent resin sheet 6K is overlapped on the light emitting element mounting substrate 2L and the fluorescent resin sheet 6K is fixed to the support frame 8, and the fluorescent resin layers 5 are collectively attached to the light emitting surface of each LED element 1. When fixed, the translucent sheet 6 is bent into a mortar shape with the bottom surface of the portion fixed to the light emitting surface of each LED element 1. In this fluorescent resin sheet fixing step, when the fluorescent resin sheet 6K is fixed to the light emitting element mounting substrate 2L, the uncured fluorescent resin layer 5 may be fixed by being cured as in the first embodiment. As in the second embodiment, after the fluorescent resin layer 5 is cured, it may be fixed using an adhesive.

  FIG. 5 (d) shows a reflective resin filling step, and the LED element 1 is injected by injecting the reflective resin 7 from a plurality of injection holes 6a provided in the translucent sheet 6 after the fixing step of the fluorescent resin sheet 6K. The side surface and the lower surface are filled with a reflective resin 7 and covered. Thus, by providing the injection holes 6 a corresponding to the respective LED elements 1, the reflective resin 7 can be sufficiently filled around each LED element 1 partitioned by the support frame 8. Thus, the LED light emitting device 30 is completed. In addition, in this LED light-emitting device 30, since the translucent sheet 6 and the reflective resin 7 are bent in a mortar shape, the emitted light from the LED element 1 is reflected in the front direction, and the brightness in the front direction. The effect which improves can be expected.

(Configuration of LED light emitting device in the second embodiment)
Next, the configuration of the LED light emitting device in the second embodiment will be described with reference to FIG. FIG. 6 is a plan view of the LED light emitting device 40 according to the second embodiment of the present invention. The basic configuration is the same as that of the LED light emitting device 10 according to the first embodiment shown in FIG. Are assigned the same numbers, and duplicate descriptions are omitted.

  The LED light emitting device 40 is different from the LED light emitting device 10 in that the fluorescent resin layer 5 fixed to the light emitting surface of the LED element 1 is the same type in the LED light emitting device 10, whereas in the LED light emitting device 40. That is, it is divided into three types of a red fluorescent resin layer 5r, a green fluorescent resin layer 5g, and a blue fluorescent resin layer 5b. In this case, a near-ultraviolet LED element may be used as the LED element 1, and printing may be performed using three types of masks of red, green, and blue for forming the fluorescent resin layer 5.

  As described above, in the present invention. A fluorescent resin sheet on which a plurality of fluorescent resin layers are formed can be stacked on an LED element mounting substrate on which a plurality of LED elements are mounted at a predetermined interval, and the fluorescent resin layers can be fixed together on the light emitting surface of each LED element. Since the upper surface side of the fluorescent resin layer can be protected by the translucent sheet, it is possible to provide a method for manufacturing an LED light-emitting device that is thin, reliable, and easy to manufacture. In each embodiment, in fixing the fluorescent resin sheet and the LED element mounting board, the height of the LED element light emitting surface on the LED element mounting board side and the height of the support frame are the same, and on the fluorescent resin sheet side of the LED element An example in which the LED element light emitting surface and the support frame are bonded to each other by printing the fluorescent resin layer on the light emitting surface and the adhesive surface to the support frame was shown. However, the present invention is not limited to this. The height of the support frame is set higher than the light emitting surface of the LED element, and the fluorescent resin sheet is directly translucent without printing the fluorescent resin on the portion corresponding to the support frame. The sheet and the support frame may be fixed with a strong adhesive.

DESCRIPTION OF SYMBOLS 1,101,201 LED element 2,102,202 Support board 2L LED element mounting board 5,105,205 Fluorescent resin layer 6 Translucent sheet 6K Fluorescent resin sheet 7,207 Reflective resin 8 Support frame 9 Adhesive 10, 20, 30, 40, 100, 200 LED light emitting device 103a, 103, 203a, 203b Connection electrode 103, 203 Wiring electrode 104 Wire 105a White light 105b Yellow ring 111 Metal base

Claims (4)

A light emitting element mounting substrate forming step of mounting a plurality of semiconductor light emitting elements on a large support substrate at a predetermined interval; a support frame forming step of forming a support frame on the light emitting element mounting surface of the light emitting element mounting substrate; A fluorescent resin sheet forming step of forming a plurality of fluorescent resin layers at a position corresponding to each light emitting element on the light emitting element mounting substrate of the translucent sheet, and stacking the fluorescent resin sheet on the light emitting element mounting substrate, The fluorescent resin sheet is fixed to the support frame, and the fluorescent resin sheet fixing step of fixing the fluorescent resin layers to the light emitting surface of the light emitting elements at once, and the light emitting element mounted on the light emitting element mounting substrate the method of manufacturing a semiconductor light emitting device characterized by a step reflecting resin filler to fill the reflective resin around. The fluorescent resin sheet forming step is a printing step of printing a fluorescent resin layer on a translucent sheet, and the fluorescent resin sheet fixing step is performed on the light emitting surface of each light emitting element by a curing process of the printed fluorescent resin layer. The method for manufacturing a semiconductor light emitting device according to claim 1, wherein the method is a fixing step for fixing. The fluorescent resin sheet forming step is a print curing step in which a fluorescent resin layer is printed and cured on a translucent sheet, and the fluorescent resin sheet fixing step is performed by using a transparent adhesive to print and cure the fluorescent resin layer. The method for manufacturing a semiconductor light emitting device according to claim 1, wherein the semiconductor light emitting device is a fixing step for fixing to a light emitting surface of each light emitting element. The fluorescent resin sheet forming step, a method of manufacturing a semiconductor light emitting device according to any one of claims 1 to 3, which is a multi-printing step for forming a plurality of fluorescent resin layers having different excitation light.

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