JP6006033B2 - LIGHT EMITTING DEVICE, LIGHTING APPARATUS, AND LIGHT EMITTING DEVICE MANUFACTURING METHOD - Google Patents

Description

  The present invention relates to a light emitting device, a lighting fixture, and a method for manufacturing the light emitting device.

  In recent years, LEDs (light-emitting diodes) have been widely used as light sources for light-emitting devices used in lighting fixtures, liquid crystal displays, and the like. In particular, with the growing demand for lighting applications, LEDs have come to be used not only for household light bulbs and ceiling lights, but also for outdoor lighting and store downlights.

  Until now, in lighting fixtures using LED light sources, color matching has been realized by combining a plurality of LED packages emitting single-color light of light bulb color and daylight white. In the future, as a more versatile and low-cost structure, it is expected that a structure including an LED light source that emits a light bulb color and a neutral white color in a single LED package will be mainstream.

  A light-emitting device composed of such a single LED package is disclosed in Patent Document 1, for example. In the light emitting device disclosed in Patent Document 1, when viewed from a direction perpendicular to the substrate on which the LED chip is placed, the sealing resin body in which the LED chip is embedded has a plurality of annular shapes having the same center. The structure is separated by the partition walls. Each separated sealing resin body contains a phosphor, and the chromaticity can be adjusted by containing a different phosphor for each sealing resin body. For example, the chromaticity adjustment is realized by dividing into a sealing resin body that emits a light bulb color and a sealing resin body that emits daylight white.

JP 2011-108744 A (released on June 2, 2011)

  Recently, a high-intensity light-emitting device in which a plurality of LED chips are arranged with high density has been developed. FIG. 8 shows a top view of a light-emitting device in which a plurality of LED chips are arranged with high density. In the light-emitting device 200 with such a high density arrangement, as can be seen from FIG. 8, there is almost no space for providing a partition wall between the first sealing resin body 40 and the second sealing resin body 50. Therefore, a method of separating the sealing resin bodies by the liquid repellent part 20 instead of the partition is adopted. FIG. 9 shows an enlarged view of a portion where the sealing resin bodies are separated by the liquid repellent portion 20. As shown in FIG. 9 (a), since the intervals between the sealing resin bodies are small in the light emitting device 200, the liquid repellent portion 20 is formed to have a width of about 0.1 mm to a width of about 0.2 mm. The resin bodies are separated.

  However, when the width of the liquid repellent portion 20 is about 0.1 mm to 0.2 mm, the width of the water repellent pattern is narrow. Therefore, if a positional deviation or the like occurs when the LED chip 80 is disposed during the manufacturing process, the LED chip 80 Easily protrudes from the liquid repellent portion 20. As a result, as shown in FIG. 9B, the first sealing resin body 40 (or the second sealing resin body 50) is destroyed, and the first sealing resin body 40 (or the second sealing resin) The resin body 50) gets over the liquid repellent portion 20 and leaks out.

  The present invention has been made in view of the above problems, and its object is to provide a light-emitting device, a lighting fixture, and a light-emitting device capable of arranging a plurality of light-emitting elements with high density while preventing the sealing resin body from being broken. It is to provide a method for manufacturing a light emitting device.

  In order to solve the above problems, a light emitting device according to the present invention is a liquid repellent part composed of a substrate and a liquid repellent agent, the liquid repellent part partitioning the substrate into a plurality of regions, and each of the regions. A plurality of light emitting element arrays each having at least one array, the light emitting element arrays each including a plurality of light emitting elements connected to each other by electrode wiring, and the light emitting elements arranged in the region for each of the regions. A plurality of sealing resin bodies formed by embedding the element array, and a part of each of the light emitting elements constituting the two light emitting element arrays adjacent to the boundary portion between the two adjacent areas is the boundary The width (L1) of the liquid repellent portion at the boundary portion is L2, the width of each light emitting element is L2, the arrangement pitch of the plurality of light emitting element arrays is P, Each above departure The amount of positional deviation that may occur in the element when the [Delta] x, is characterized by satisfying the following relational expression (A).

Further, in order to solve the above-described problem, the method for manufacturing a light emitting device according to the present invention includes a partitioning step of partitioning a substrate into a plurality of regions by a liquid repellent portion configured of a liquid repellent agent, Arranging step of arranging at least one light emitting element array composed of a plurality of light emitting elements connected to each other by electrode wiring, and embedding step of embedding the light emitting element array arranged in the region for each region with a sealing resin body In the arranging step, a part of each of the light emitting elements constituting the two light emitting element arrays adjacent to the boundary part between the two adjacent regions is arranged on the liquid repellent part in the boundary part. In the partitioning step, the width (L1) of the liquid repellent portion in the boundary portion is set such that the width of each light emitting element is L2, the arrangement pitch of the plurality of light emitting element arrays is P, The amount of positional deviation of the light emitting device in the case of the [Delta] x, is characterized in that to satisfy the following relational expression (A).
(A) L1 ≧ (L2−P + 2Δx + 0.15)
According to the above configuration, a part of each light emitting element constituting the two light emitting element arrays adjacent to the boundary part between the two adjacent regions is arranged on the liquid repellent part in the boundary part, and The width of the liquid part is formed so as to satisfy the above relational expression (A). Therefore, in the light emitting device according to the present invention, the width of the liquid repellent portion at the boundary portion between two adjacent sealing resin bodies is large.

  In the conventional light emitting device, since the intervals between the sealing resin bodies are small, the liquid-repellent portions are formed with a width of about 0.1 mm to a width of about 0.2 mm to separate the sealing resin bodies. For this reason, the water-repellent pattern has a narrow width, and when the light-emitting element is displaced during the manufacturing process, the light-emitting element easily protrudes from the liquid-repellent part. As a result, the encapsulating resin body broke down, and the encapsulating resin body leaked over the liquid-repellent portion.

  On the other hand, in the light emitting device according to the present invention, even if a misalignment or the like occurs when the light emitting element is arranged in the manufacturing process by increasing the width of the liquid repellent portion at the boundary portion between two adjacent regions. At least 0.05 mm of width remains in the liquid repellent part. That is, even if the light emitting element is misaligned, the light emitting element does not protrude from the liquid repellent portion. Therefore, the sealing resin body can be prevented from breaking. As described above, in the light emitting device according to the present invention, the liquid repellent portion has high resistance to the positional deviation of the light emitting element, and the sealing resin body can be prevented from leaking over the liquid repellent portion. The yield at the time of manufacturing the device can be improved.

  As described above, according to the present invention, it is possible to provide a light emitting device and a method for manufacturing the same capable of arranging a plurality of light emitting elements with high density while preventing the sealing resin body from being broken.

In the light emitting device according to the present invention, the width (L1) of the liquid repellent portion at the boundary portion is set to L2 for the width of each light emitting element, P for the arrangement pitch of the plurality of light emitting element arrays, When the amount of positional deviation that can occur in the element is Δx, the following relational expression (B) is satisfied.
(B) L1 ≦ (P + 1/2 · L2-2Δx)
According to the above configuration, when the light emitting element is misaligned by forming the liquid repellent portion at the boundary between two adjacent regions so that the width of the liquid repellent portion satisfies the relational expression (B), the light emitting element Can reduce the risk of peeling.

  Further, in the light emitting device according to the present invention, the liquid repellent portion includes a first liquid repellent line that forms a ring when viewed from the mounting surface of the plurality of light emitting element arrays, and the circle within the ring. A plurality of second liquid-repellent lines are provided so that the ring is symmetrical in parallel with each other.

  According to said structure, the area of a board | substrate and the total area of the electrode wiring formed on the board | substrate can be made small, and an inexpensive light-emitting device is realizable. Further, since the light emitting elements are densely arranged, the chromaticity variation of the entire light emitting device can be further reduced.

  In the light emitting device according to the present invention, a mounting surface of the plurality of light emitting element arrays on the substrate is white.

  According to said structure, the mounting surface of a light emitting element is white, and the member which causes light absorption, such as electrode wiring, does not exist in the area | region where a light emitting element is mounted. Therefore, most of the light emitted from the light emitting element that is totally reflected at the interface of the sealing resin body is reflected by the white surface and then emitted to the outside of the sealing resin body. Thus, by making the mounting surface white, light having a small incident angle with respect to the interface of the sealing resin body can be extracted to the outside, and the light extraction efficiency is increased.

  Further, in the light emitting device according to the present invention, each of the plurality of resin sealing bodies contains a single type or a plurality of types of phosphors, and at least one of the phosphor content or the mixing ratio is mutually different. It is characterized by being different.

  According to said structure, the sealing resin body contains the single type or multiple types of fluorescent substance. And every content of a fluorescent substance or at least one of a mixing ratio differs for every sealing resin body. Thus, the range of chromaticity adjustment of the light emitting device can be widened by changing the output of the light emitting element by the power supply system. Furthermore, the chromaticity emitted for each light emitting element array embedded in the sealing resin body is uniquely determined. For this reason, when emitting only a single light emitting element array or simultaneously emitting light from a plurality of light emitting element arrays, it is possible to more accurately reproduce the chromaticity of the target light emission.

  In the light emitting device according to the present invention, the electrode wiring is formed so as not to straddle the liquid repellent portion in the boundary portion.

  In the light emitting device according to the present invention, the electrode wiring is formed substantially parallel to the liquid repellent portion at the boundary portion.

  According to said structure, the electrode wiring which connects a some light emitting element straddles the liquid repellent part in the boundary part of two adjacent area | regions, and prevents a sealing resin body from breaking down along electrode wiring. be able to.

  In the light emitting device according to the present invention, a part of the liquid repellent portion at the boundary portion between the two adjacent regions has a convex shape, and constitutes two light emitting element arrays adjacent to the boundary portion. A part of the plurality of light emitting elements is arranged in a mountain shape along the convex liquid repellent portion, and the electrode wiring forming the oblique side of the mountain shape in the plurality of light emitting elements arranged in the mountain shape Is characterized in that the angle formed between the light emitting element array and the extending direction of the light emitting element array is equal to or greater than the angle formed between the convex side of the liquid repellent portion and the extending direction of the light emitting element array.

  In a plurality of light emitting elements arranged in a mountain shape, if the electrode wiring forming the oblique side of the mountain shape is larger than the angle formed with the extending direction of the light emitting element array, a part of the sealing resin body is partitioned at right angles As a result, the sealing resin body may be destroyed. However, according to the above configuration, the angle formed by the hypotenuse of the convex liquid repellent portion and the light emitting element array becomes gentle. That is, in the plurality of light emitting elements arranged in a mountain shape, the electrode wiring forming the mountain-shaped hypotenuse becomes smaller than the angle formed with the extending direction of the light emitting element array. In this case, the liquid repellent part that partitions the sealing resin body has a gentle curve or straight line, and the sealing resin body can be prevented from breaking.

  Moreover, in order to solve said subject, the lighting fixture concerning this invention is equipped with one of the light-emitting devices mentioned above, It is characterized by the above-mentioned.

  According to said structure, the lighting fixture which can arrange a some light emitting element highly densely can be provided, preventing destruction of a sealing resin body.

  According to the present invention, since the width of the liquid repellent portion at the boundary portion between two adjacent sealing resin bodies is large, the light emitting element is repellent even if misalignment or the like occurs when the light emitting element is disposed during the manufacturing process. Does not protrude from the liquid part. Therefore, the liquid repellent portion is highly resistant to the positional deviation of the light emitting element, and can prevent the sealing resin body from being broken. As a result, it is possible to prevent the sealing resin body from leaking over the liquid-repellent portion, so that the yield at the time of manufacturing the light emitting device can be improved. As described above, according to the present invention, it is possible to provide a light emitting device, a lighting fixture, and a method for manufacturing the light emitting device capable of arranging a plurality of light emitting elements with high density while preventing the sealing resin body from being broken. it can.

It is a top view which shows the light-emitting device which concerns on one Embodiment of this invention. FIG. 2 is a cross-sectional view of the light emitting device according to one embodiment of the present invention shown in FIG. 1 when cut in the vertical direction of the paper (that is, cut along a plane perpendicular to the extending direction of the LED array). It is sectional drawing to which the 1st sealing resin body vicinity part in the light-emitting device which concerns on one Embodiment of this invention shown in FIG. 2 was expanded. (A)-(c) is an enlarged view of the location which has isolate | separated the 1st sealing resin body and the 2nd sealing resin body by the liquid repellent part in the light-emitting device which concerns on one Embodiment of this invention. It is a top view which shows the manufacturing procedure of the light-emitting device which concerns on one Embodiment of this invention, (a) is a top view which shows the ceramic substrate before mounting an LED chip, (b) is a liquid repellent pattern. It is a top view which shows the state after apply | coating, (c) is a top view which shows the state which mounted the LED chip, (d) has apply | coated 1st sealing resin body and 2nd sealing resin body It is a top view which shows the state after having performed. (A) And (b) is an enlarged view of the location currently formed in convex shape in the liquid repellent part which concerns on one Embodiment of this invention. (A) is a top view showing a light emitting device according to an embodiment of the present invention that has been commercialized, (b) is a vertical direction of the light emitting device according to an embodiment of the present invention shown in (a). It is sectional drawing when cut | disconnecting (namely, cut | disconnecting in a surface perpendicular | vertical to the extending direction of a LED array). It is a top view which shows the conventional light-emitting device which arranged the several LED chip | tip densely. It is an enlarged view of the location which isolate | separated between each sealing resin bodies by the conventional liquid repellent part.

  Embodiments of the present invention will be described in detail with reference to the drawings. In the following description, members having the same function and action are denoted by the same reference numerals and description thereof is omitted.

[First Embodiment]
(Configuration of Light Emitting Device 100)
A light emitting device 100 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a top view showing a light emitting device 100 according to the present embodiment. As shown in FIG. 1, the light emitting device 100 includes a ceramic substrate 10 (substrate), a main liquid repellent line 20a (first liquid repellent line), and a plurality of sub liquid repellent lines 20b (second liquid repellent lines). LED array 60 comprising a plurality of LED chips 80 (light emitting elements) connected to each other by electrode wiring, the liquid repellent portion 20, the first sealing resin body 40, the second sealing resin body 50, the wires 70. (Light emitting element array).

  The ceramic substrate 10 is a substrate for mounting the LED array 60 and the like. On the ceramic substrate 10, an electrode land (terminal: anode) 90, an electrode land (terminal: cathode) 95, and an electrode wiring pattern 15 are provided. In the light emitting device 100, two sets of annular electrode wiring patterns 15 are arranged so that one is arranged inside the other. The plurality of LED chips 80 are connected to the electrode wiring pattern 15 in series. The plurality of LED chips 80 arranged in series are connected to the electrode wiring pattern 15 by a single wire 70. The shape of the electrode wiring pattern 15 is not limited to the above shape.

  In addition, the liquid repellent portion 20 of the light emitting device 100 is located in the main liquid repellent line 20a forming the ring and the ring constituting the main liquid repellent line 20a when viewed from the mounting surface of the LED array 60 of the ceramic substrate 10. A plurality of sub-liquid-repellent lines 21 are provided that are substantially parallel to each other so that the ring is symmetrical. The substrate surface of the ceramic substrate 10 is partitioned into a plurality of regions (separated into a plurality) by the main liquid repellent line 20a and the sub liquid repellent line 20b. For example, in FIG. 1, it is divided into two mountain-shaped divided areas and a plurality of strip-shaped divided areas. The same number of LED chips 80 are provided in the partitioned areas partitioned by the main liquid repellent line 20a and the sub liquid repellent line 20b. By making the region partitioned by the main liquid repellent line 20a and the sub liquid repellent line 20b as described above, the LED chips 80 can be densely arranged in each partitioned region. For this reason, the area of the ceramic substrate 10 and the total area of the electrode wiring pattern 15 formed on the ceramic substrate 10 can be reduced, and the inexpensive light emitting device 100 can be realized. Further, since the LED chips 80 are densely arranged, the chromaticity variation of the entire light emitting device 100 can be further reduced. Here, the same number of LED chips 80 are arranged in each partition area by providing a recess in a straight line portion in the mountain-shaped partition area and providing a protrusion corresponding to the recess in the strip-shaped partition area adjacent to the partition area. However, the plurality of LED chips 80 can be arranged densely. The shapes of the main liquid repellent line 20a and the sub liquid repellent line 20b are not limited to the above shapes.

  A first sealing resin body 40 (sealing resin body) and a second sealing resin body 50 (sealing resin body) are provided in a region partitioned by the main liquid repellent line 20a and the sub liquid repellent line 20b. Yes. That is, since the first sealing resin body 40 and the second sealing resin body 50 are partitioned by the liquid repellent portion 20 made of a liquid repellent, the emitted light from the LED chip 80 is directed in a direction perpendicular to the ceramic substrate 10. The light can be emitted to the outside without acting so as to face. As a result, the light emitting device 100 in which the light distribution characteristic of the emitted light is not limited can be realized. Moreover, according to the use of the light-emitting device 100, a reflector and a coupling lens can be arrange | positioned outside the light-emitting device 100, and a light distribution characteristic can be adjusted.

  Further, at least one LED array 60 is embedded for each sealing resin body, and each LED array 60 is connected to the electrode wiring pattern 15 having two terminals (electrode land 90 and electrode land 95). That is, the LED array 60 is supplied with power by independent power supply systems. Therefore, the LED arrays 60 can be turned on or off independently.

  2 is a cross-sectional view of the light emitting device 100 shown in FIG. 1 when cut in the vertical direction of the paper (that is, cut along a plane perpendicular to the extending direction of the LED array 60). As shown in FIG. 2, in the light emitting device 100, the first sealing resin body 40 and the second sealing resin body 50 are formed separately (without contacting each other) with the auxiliary liquid repellent line 20 b as a boundary. ing.

  Here, the phosphor-containing resin that is the composition of the first sealing resin body 40 and the second sealing resin body 50 is applied onto the LED chip 80 and the wire 70. Therefore, when a large amount of the phosphor-containing resin is applied to the partition region, if the contact angle between the applied phosphor-containing resin and the ceramic substrate 10 exceeds the limit contact angle, the phosphor-containing resin may enter the partition region. There is. However, since the phosphor-containing resin does not leak out to the outside by the main liquid repellent line 20a, the shapes of the first sealing resin body 40 and the second sealing resin body 50 are maintained. As a result, the phosphor-containing resins are not mixed in the first sealing resin body 40 and the second sealing resin body 50 adjacent to each other.

(Light emission of the light emitting device 100)
Next, light emission in the light emitting device 100 will be described below with reference to FIG. FIG. 3 is an enlarged cross-sectional view of the vicinity of the first sealing resin body 40 in the light emitting device 100 shown in FIG. In the following description, light emission in the light emitting device 100 will be described with the first sealing resin body 40 as an example.

  As shown in FIG. 3, the phosphor 36 is uniformly diffused in the first sealing resin body 40. Alternatively, the phosphor 36 may be precipitated in the first sealing resin body 40. A part of the light emitted from the LED chip 80 is directly emitted to the outside of the first sealing resin body 40, or is converted from a short wavelength to a long wavelength by the phosphor 36 and is emitted to the outside of the first sealing resin body 40. . On the other hand, light emitted from the LED chip 80 having a small incident angle with respect to the interface of the first sealing resin body 40 is totally reflected and cannot be extracted outside the first sealing resin body 40.

Therefore, on the substrate surface of the ceramic substrate 10, the inner side of the first sealing resin body 40 (that is, in the partition region) may be covered with a white substrate made of Al ₂ O ₃ . In this case, the LED chip 80 is provided on this white substrate. Of the emitted light from the LED chip 80, most of the light totally reflected at the interface of the first sealing resin body 40 is reflected by the white substrate and then emitted to the outside of the first sealing resin body 40. Thus, by covering the partition region with the white substrate made of Al ₂ O _3, light having a small incident angle with respect to the interface of the first sealing resin body 40 can be extracted to the outside, and the light extraction efficiency is improved. Get higher.

  In addition, if the mounting surface of the LED chip 80 is white, it is possible to improve the light extraction efficiency. Therefore, the same effect can be obtained by forming a white resist in the partition region. Further, the partition region of the ceramic substrate 10 may be colored white.

(Liquid repellent part 20 of light emitting device 100)
In the conventional light emitting device, since the intervals between the sealing resin bodies are small, the liquid-repellent portions are formed with a width of about 0.1 mm to a width of about 0.2 mm to separate the sealing resin bodies. For this reason, the width of the water-repellent pattern is narrow, and when the LED chip is displaced during the manufacturing process, the LED chip easily protrudes from the liquid-repellent portion. As a result, the first sealing resin body (or the second sealing resin body) is destroyed, and the first sealing resin body (or the second sealing resin body) leaks over the liquid repellent portion. I was sorry.

  On the other hand, in the light emitting device 100 according to this embodiment, in order to prevent the first sealing resin body 40 and the second sealing resin body 50 from being broken, the two LED arrays 60 arranged with the sub-liquid-repellent line 20b interposed therebetween are arranged. A part of each LED chip 80 to be configured is disposed on the sub-liquid-repellent line 20b, and the width of the sub-liquid-repellent line 20b is increased. This will be described with reference to FIG. FIG. 4 is an enlarged view of a location where the first sealing resin body 40 and the second sealing resin body 50 are separated by the liquid repellent portion 20 in the light emitting device 100 according to the present embodiment. As shown in FIG. 4A, in the light emitting device 100, the width of the auxiliary liquid repellent line 20b provided between the first sealing resin body 40 and the second sealing resin body 50 is large. That is, the width of the liquid repellent portion 20 (that is, the secondary liquid repellent line 20b) at the boundary portion between the adjacent first sealing resin body 40 and the second sealing resin body 50 is two LED arrays adjacent to the boundary portion. Greater than the shortest distance between 60. The two LED arrays 60 adjacent to the boundary portion are the two LED arrays 60 adjacent to each other in the adjacent first sealing resin body 40 and second sealing resin body 50. . In other words, the two LED arrays 60 are arranged with the boundary portion interposed therebetween.

Here, in order to increase the width of the sub-liquid-repellent line 20b, the width (L1) of the sub-liquid-repellent line 20b is formed so as to satisfy the following relational expression (1).
L1 ≧ (L2−P + 2Δx + 0.15) (1)
L2 is the width of each LED chip 80 (more precisely, the base resin length of the LED chip 80), P is the arrangement pitch of the plurality of LED arrays 60, and Δx is the amount of positional deviation that can occur in each LED chip 80 (See FIG. 4B).

The grounds for establishing the above relational expression (1) will be described below. First, the arrangement pitch P of the plurality of LED arrays 60 is expressed as the following formula (2).
P = L1 + L2-2α (2)
α is a width in which each LED chip 80 overlaps the auxiliary liquid repellent line 20b.

Further, when the positional deviation of the LED chip 80 is caused by Δx, the width β of the remaining sub-liquid-repellent line 20b is expressed as the following formula (3).
β = L1− (Δx + α) (3)
Here, in order to prevent the first sealing resin body 40 and the second sealing resin body 50 from being broken, when the LED chip 80 is misaligned by Δx, the width β of the remaining sub-liquid-repellent line 20b is set to 0. It must be at least 05 mm. In other words, even if the LED chip 80 is misaligned, the LED chip 80 can be prevented from protruding from the auxiliary liquid repellent line 20b if the width of the auxiliary liquid repellent line 20b remains 0.05 mm or more. The first sealing resin body 40 and the second sealing resin body 50 can be prevented from breaking.

Therefore, the following formula (4) is established.
β ≧ 0.05 (4)
The following relational expression (1) described above is derived from the above expressions (2) to (4).
L1 ≧ (L2−P + 2Δx + 0.15) (1)
Here, when the LED chip 80 is displaced, in order for the LED chip 80 not to be peeled off, the length of the LED chip 80 that is not placed on the sub-liquid-repellent line 20b is ¼ · L2 or more. It must be present (see FIG. 4C). Therefore, the following formula (5) is established.
(Δx + α) ≦ 3/4 · L2 (5)
The following relational expression (6) is derived from the above expressions (2) and (5).
L1 ≦ (P + 1/2 · L2-2Δx) (6)
In order to reduce the risk of the LED chip 80 being peeled when the LED chip 80 is displaced, it is preferable that the width of the auxiliary liquid repellent line 20b satisfies the above relational expression (6).

Therefore, the following relational expression (7) is derived from the expressions (5) and (6).
(L2−P + 2Δx + 0.15) ≦ L1 ≦ (P + 1/2 · L2-2Δx) (7)
In order to reduce the risk of peeling of the LED chip 80 while preventing the first sealing resin body 40 and the second sealing resin body 50 from breaking when the LED chip 80 is displaced, It is preferable that the width of the liquid line 20b satisfies the relational expression (7).

For example, the liquid repellent part 20 and the LED chip 80 are printed and mounted on the basis of the alignment mark in the electrode wiring pattern 15 respectively. However, the alignment shape tolerance, the position crossing of the liquid repellent part, and the mounting crossing of the LED chip 80 Is approximately 0.25 mm. That is, the positional deviation amount Δx of the LED chip 80 can be 0.25 mm. Therefore, when Δx = 0.25 (mm), L2 = 0.5 (mm), and P = 0.8 (mm) are substituted into the relational expression (7),
0.35 (mm) ≦ L1 ≦ 0.55 (mm)

  Therefore, if the width of the auxiliary liquid repellent line 20b is about 0.4 mm to 0.5 mm, even if the LED chip 80 is misaligned, the first sealing resin body 40 and the second sealing resin body 50 are used. Can be prevented.

  In this way, by increasing the width of the sub-liquid-repellent line 20b of the liquid-repellent portion 20, even if misalignment occurs when the LED chip 80 is disposed during the manufacturing process, the width of the sub-liquid-repellent line 20b is reduced. 0.05 mm will be left. That is, even if the LED chip 80 is misaligned, the LED chip 80 does not protrude from the auxiliary liquid repellent line 20b. Therefore, the first sealing resin body 40 or the second sealing resin body 50 can be prevented from breaking. As described above, the sub-liquid-repellent line 20b of the liquid-repellent part 20 is highly resistant to the positional deviation of the LED chip 80, and the first sealing resin body 40 or the second sealing resin body 50 gets over the sub-liquid-repellent line 20b. Since leakage can be prevented, the yield at the time of manufacturing the light emitting device 100 can be improved. As described above, according to the present embodiment, the light emitting device 100 capable of densely arranging the plurality of LED chips 80 while preventing the first sealing resin body 40 and the second sealing resin body 50 from being broken. Can be provided.

(Method for manufacturing light emitting device 100)
Next, a method for manufacturing the light emitting device 100 will be described with reference to FIG. 5A to 5D are top views showing the manufacturing procedure of the light emitting device 100. FIG. FIG. 5A is a top view showing the ceramic substrate 10 before the LED chip 80 is mounted. FIG. 5B is a top view showing a state after the liquid repellent is applied in a pattern. FIG. 5C is a top view showing a state in which the LED chip 80 is mounted. FIG. 5D is a top view showing a state after the first sealing resin body 40 and the second sealing resin body 50 are applied.

  As shown in FIG. 5A, two sets of electrode lands 90 and electrode lands 95 and an electrode wiring pattern 15 are formed on the ceramic substrate 10 before the LED chip 80 is mounted. The electrode wiring pattern 15 is electrically connected to each set of the electrode land 90 and the electrode land 95. Therefore, the light emitting device 100 according to the present embodiment has two independent power supply systems.

Next, as shown in FIG. 5B, a liquid repellent is applied in a pattern in the region surrounded by the electrode wiring pattern 15 in the ceramic substrate 10. By applying the liquid repellent pattern, the liquid repellent portion 20 including the main liquid repellent line 20a and the sub liquid repellent line 20b is formed. A plurality of partitioned regions surrounded by the main liquid repellent line 20a and the sub liquid repellent line 20b are formed. At this time, as described above, the liquid repellent is applied so that the width of the liquid repellent portion 20 (sub liquid repellent line 20b) at the boundary portion between two adjacent divided regions satisfies the following relational expression (1).
L1 ≧ (L2−P + 2Δx + 0.15) (1)
The liquid repellent pattern is applied using a flexographic printing press. The liquid repellent is mainly composed of a fluoropolymer. The main liquid repellent line 20a and the sub liquid repellent line 20b formed in this way are coating thin films having a thickness of 0.5 μm or less.

  Next, as shown in FIG. 5C, the LED chip 80 is mounted in a plurality of partitioned regions surrounded by the main liquid repellent line 20a and the sub liquid repellent line 20b. At this time, the LED chip 80 is fixed to the surface of the ceramic substrate 10 with a silicon resin (not shown). At this time, as described above, a part of each LED chip 80 that constitutes the two LED arrays 60 adjacent to the boundary portion between the two adjacent partition regions is disposed on the liquid-repellent portion 20 (sub-liquid-repellent line 20b) in the boundary portion. ). After the LED chip 80 is mounted, the LED chip 80 and the electrode wiring pattern 15 are wire-connected using the wire 70 so as to be conductive. The wire 70 is connected by an ultrasonic wave and a load while applying heat to the connection portion of the wire 70 between the LED chip 80 and the electrode wiring pattern 15. At this time, the wires 70 of the LED chips 80 mounted in the odd-numbered partitioned areas counted from the upper direction on the paper surface are connected to the electrode wiring pattern 15 connected to one set of the electrode land 90 and the electrode land 95 on the upper surface of the paper surface. It is connected. On the other hand, the wire 70 of the LED chip 80 mounted in the even-numbered partitioned areas counted from the upper direction on the paper surface is connected to the electrode wiring pattern 15 connected to one set of the electrode land 90 and the electrode land 95 on the lower side of the paper surface. It is connected. As a result, the odd-numbered partitioned areas and the even-numbered partitioned areas are supplied with power by independent power supply systems.

  Subsequently, as shown in FIG. 5 (d), the phosphor-containing resin is filled into a plurality of partitioned regions surrounded by the main liquid repellent line 20a and the sub liquid repellent line 20b using a dispenser. Then, the phosphor-containing resin is cured to form the first sealing resin body 40 and the second sealing resin body 50. In the present embodiment, the first sealing resin body 40 and the second sealing resin body 50 are alternately formed in a plurality of partitioned regions surrounded by the main liquid repellent line 20a and the sub liquid repellent line 20b. . For example, in this figure, the first sealing resin bodies 40 are formed in the odd-numbered partitioned areas counted from the upper direction of the paper, and the second sealing is performed in the even-numbered partitioned areas counted from the upper direction of the paper. A resin body 50 is formed. Further, since the LED chip 80 is wire-connected in series, the number of contact points between the LED chip 80 and the electrode wiring pattern 15 can be reduced.

  In addition, there is no limitation in the formation location of the 1st sealing resin body 40 and the 2nd sealing resin body 50, For example, you may form the 1st sealing resin body 40 in all the division areas, or all the divisions The second sealing resin body 50 may be formed in the region. Alternatively, the first sealing resin body 40 and the second sealing resin body 50 may be formed unequal.

  About the 1st sealing resin body 40 and the 2nd sealing resin body 50, the fluorescent substance containing resin to comprise contains the single type or multiple types of fluorescent substance. Then, at least one of the phosphor content and the mixing ratio differs for each of the first sealing resin body 40 and the second sealing resin body 50. Accordingly, the range of chromaticity adjustment of the light emitting device 100 can be widened by changing the output of the LED chip 80 by the power supply system. Furthermore, the chromaticity emitted for each LED array 60 embedded in the first sealing resin body 40 and the second sealing resin body 50 is uniquely determined. For this reason, when emitting only a single LED array 60 or simultaneously emitting light from a plurality of LED arrays 60, the chromaticity of the target emission can be reproduced more accurately.

  For example, about the fluorescent substance containing resin which comprises the 1st sealing resin body 40, the composition of a fluorescent substance is prepared so that daytime white light emission may be reproduced. Moreover, about the fluorescent substance containing resin composition which comprises the 2nd sealing resin body 50, the composition of a fluorescent substance is prepared so that light bulb color light emission may be reproduced. Here, in the light emitting device 100, the odd-numbered divided areas (that is, the divided areas where the first sealing resin body 40 is formed) counted from the upper direction of the paper, and the even-numbered areas counted from the upper direction of the paper. The partitioned regions (that is, the partitioned regions in which the second sealing resin body 50 is formed) are supplied with power by independent power supply systems. For this reason, the light emitting device 100 can realize light emission of only the light bulb color, light emission of only day white, and light emission of a mixed color of light bulb color and day white. Therefore, the chromaticity adjustment range of the light emitting device 100 can be widened.

[Second Embodiment]
(Formation of electrode wiring 70)
As shown in FIG. 5 described above, the electrode wiring 70 that connects the plurality of LED chips 80 does not straddle the liquid repellent part 20 (that is, the sub liquid repellent line 20b) at the boundary part between two adjacent partition regions. It is preferable to be formed as described above. If the electrode wiring 70 that connects the plurality of LED chips 80 is formed so as to straddle the sub-liquid-repellent line 20b at the boundary portion between two adjacent partition regions, the first sealing resin travels along the electrode wiring 70. The body 40 or the second sealing resin body 50 may break down. Therefore, in order to prevent such breakage of the first sealing resin body 40 and the second sealing resin body 50, the electrode wiring 70 connecting the plurality of LED chips 80 is formed at the secondary portion at the boundary portion between two adjacent partition regions. It may be formed so as not to straddle the liquid repellent line 20b.

  As an example in which the electrode wiring 70 that connects the plurality of LED chips 80 is formed so as not to straddle the sub-liquid-repellent line 20b at the boundary portion between two adjacent partition regions, The case where it forms substantially parallel to the sub-liquid-repellent line 20b in the boundary part of a division area is mentioned. In this case, breakage of the first sealing resin body 40 and the second sealing resin body 50 can be effectively prevented.

  In addition, regarding the main liquid repellent line 20a of the liquid repellent portion 20, the electrode wiring 70 may straddle the main liquid repellent line 20a.

[Third Embodiment]
(Formation of the liquid repellent part 20)
As described above, of the regions partitioned by the liquid repellent portion 20, a concave portion is provided in a linear portion in the mountain-shaped partitioned region, and a convex portion corresponding to the recessed portion is provided in a strip-shaped partitioned region adjacent to the partitioned region. The shape may be different. In this case, a part of the liquid-repellent portion 20 (that is, the sub-liquid-repellent line 20b) at the boundary portion between two adjacent partition regions has a convex shape, and constitutes two LED arrays 60 adjacent to the boundary portion. Some of the plurality of LED chips 80 are arranged in a mountain shape along the convex sub-liquid-repellent line 20b.

  Here, in the plurality of LED chips 80 arranged in a mountain shape, the angle formed by the electrode wiring 70 forming the mountain-shaped oblique side with the extending direction of the LED array 60 is such that the oblique side of the convex sub-liquid-repellent line 20b is LED. It is preferable that the angle formed with the extending direction of the array 60 is the same as or larger than that. This will be described with reference to FIG. FIG. 6 is an enlarged view of a portion formed in a convex shape in the liquid repellent portion 20 according to the present embodiment.

In FIG. 6A, the angle θ _B formed by the oblique side of the convex sub-liquid-repellent line 20b and the extending direction of the LED array 60 (that is, the line segment H in the figure) is a right angle. That is, in the plurality of LED chips 80 arranged in a mountain shape, the electrode wiring 70 forming the mountain-shaped hypotenuse is larger than the angle θ _A formed with the line segment H. In this case, a part of the first sealing resin body 40 or the second sealing resin body 50 is partitioned at a right angle, and the first sealing resin body 40 or the second sealing resin body 50 may be destroyed. There is.

On the other hand, in FIG. 6B, the angle θ _B formed by the oblique side of the convex sub-liquid-repellent line 20b and the line segment H is gentle. That is, in the plurality of LED chips 80 arranged in a mountain shape, the electrode wiring 70 forming the mountain-shaped hypotenuse is smaller than the angle θ _A formed with the line segment H. In this case, the secondary liquid-repellent line 20b that partitions the first sealing resin body 40 and the second sealing resin body 50 is a gentle curve or straight line, and the first sealing resin body 40 or the second sealing resin Breakage of the resin body 50 can be prevented. In this way, in the plurality of LED chips 80 arranged in a mountain shape, the angle formed by the electrode wiring 70 forming the mountain-shaped hypotenuse with the extending direction of the LED array 60 is such that the hypotenuse of the convex sub-liquid-repellent line 20b is It is preferable that the angle formed with the extending direction of the LED array 60 is the same as or larger than that.

  The extension direction of the LED array 60 referred to here is the extension direction when the LED array 60 is viewed as a whole, and does not indicate the direction in which the LED chips 80 are connected. That is, the LED array 60 extends in the horizontal direction on the paper surface as a whole, and the horizontal direction on the paper surface corresponds to the extending direction.

[Application example of the present invention]
(Example of product form of light emitting device 100)
An example of one product form of the light emitting device 100 according to this embodiment is shown in FIG. FIG. 7A is a top view showing the commercialized light emitting device 100, and FIG. 7B is a sectional view of the light emitting device 100 shown in FIG. 7A in the vertical direction of the paper (that is, in the extending direction of the LED array 60). It is sectional drawing when it cut | disconnects in a perpendicular | vertical surface.

  As shown in FIG. 7A, the light emitting device 100 is provided with an annular reflecting wall 85 made of a white thermosetting resin. The reflection wall 85 is formed so as to surround the outer periphery of the liquid repellent portion 20 so as to cover the electrode wiring pattern 15. In addition, as shown in FIG. 7B, the region surrounded by the reflection wall 85, that is, the region where the plurality of LED arrays 60 are arranged is covered with a transparent resin 75. The electrode wiring pattern 15 can be protected by the reflection wall 85 described above, and the plurality of LED arrays 60 can be protected by the transparent resin 75.

(Application example of light emitting device 100)
The light emitting device 100 according to the present embodiment is preferably used as a light source of a circular lighting fixture, for example, as a light source of a lighting fixture that needs to improve optical coupling with an external optical component, as viewed from the light emitting surface. it can. An example of a circular lighting fixture viewed from the light emitting surface is a bulb-type lighting fixture. As a lighting fixture that needs to improve optical coupling with an external optical component, for example, a lighting fixture in which an external lens for adjusting the light distribution characteristic is arranged directly above.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The light emitting device and the manufacturing method thereof according to the present invention can be preferably applied to an illumination light source.

DESCRIPTION OF SYMBOLS 10 Ceramic substrate 15 Electrode wiring pattern 20 Liquid repellent part 20a Main liquid repellent line 20b Sub liquid repellent line 36 Phosphor 40 First sealing resin body 50 Second sealing resin body 60 LED array 70 Wire 75 Transparent resin 85 Reflecting wall 80 LED chip 90 electrode land 95 electrode land 100 light emitting device 200 light emitting device

Claims (10)

A substrate,
A liquid repellent part composed of a liquid repellent, the liquid repellent part partitioning the substrate into a plurality of regions;
A plurality of light emitting element arrays in which at least one is arranged for each of the regions, and a plurality of light emitting element arrays each including a plurality of light emitting elements connected to each other by electrode wiring;
A plurality of sealing resin bodies formed by embedding the light emitting element array arranged in the region for each of the regions,
A part of each of the light emitting elements constituting the two light emitting element arrays adjacent to the boundary part between the two adjacent regions is disposed on the liquid repellent part in the boundary part,
The width (L1 (mm) ) of the liquid repellent portion at the boundary portion is set such that the width of each light emitting element is L2 (mm) , the arrangement pitch of the plurality of light emitting element arrays is P (mm) , A light-emitting device characterized by satisfying the following relational expression (A) when the amount of positional deviation that can occur is Δx (mm) .
(A) L1 (mm) ≧ (L2 (mm) −P (mm) + 2Δx (mm) +0.15) The width (L1 (mm) ) of the liquid repellent portion at the boundary portion is set such that the width of each light emitting element is L2 (mm) , the arrangement pitch of the plurality of light emitting element arrays is P (mm) , 2. The light emitting device according to claim 1, wherein the following relational expression (B) is satisfied when an amount of positional deviation that may occur is Δx (mm) .
(B) L1 (mm) ≤ (P (mm) + 1/2 · L2 (mm) -2Δx (mm) )   When viewed from the mounting surface of the plurality of light emitting element arrays, the liquid repellent portion is substantially parallel to the first liquid repellent line that forms an annular shape so that the annular shape is symmetrical within the circular shape. The light-emitting device according to claim 1, further comprising a plurality of second liquid-repellent lines.   The light-emitting device according to claim 1, wherein a mounting surface of the plurality of light-emitting element arrays on the substrate is white.   The plurality of sealing resin bodies each contain a single type or a plurality of types of phosphors, and at least one of the phosphor content and the mixing ratio is different from each other. The light emitting device according to any one of the above.   The light emitting device according to claim 1, wherein the electrode wiring is formed so as not to straddle the liquid repellent portion at the boundary portion.   The light emitting device according to claim 6, wherein the electrode wiring is formed substantially parallel to the liquid repellent portion at the boundary portion. A part of the liquid repellent part at the boundary part has a convex shape,
A part of the plurality of light emitting elements constituting the two light emitting element arrays adjacent to the boundary part is arranged in a mountain shape along the convex liquid repellent part,
In the plurality of light emitting elements arranged in a chevron, the angle formed by the electrode wiring forming the chevron of the chevron and the extending direction of the light emitting element array is such that the oblique side of the convex liquid-repellent part is the light emitting element array. The light-emitting device according to claim 1, wherein the light-emitting device is equal to or larger than an angle formed with the extending direction.   A lighting fixture comprising the light-emitting device according to claim 1. A partitioning step of partitioning the substrate into a plurality of regions by a liquid repellent portion composed of a liquid repellent;
An arrangement step of arranging at least one light emitting element array composed of a plurality of light emitting elements connected to each other by electrode wiring for each of the regions;
For each of the regions, including a step of embedding the light emitting element array arranged in the region with a sealing resin body,
In the arranging step, a part of each of the light emitting elements constituting the two light emitting element arrays adjacent to the boundary part between the two adjacent regions is disposed on the liquid repellent part in the boundary part,
In the partitioning step, the width (L1 (mm) ) of the liquid repellent portion in the boundary portion is set such that the width of each light emitting element is L2 (mm) , and the arrangement pitch of the plurality of light emitting element arrays is P (mm) . A manufacturing method of a light-emitting device characterized by satisfying the following relational expression (A) when the amount of positional deviation of each of the light-emitting elements is Δx (mm) .
(A) L1 (mm) ≧ (L2 (mm) −P (mm) + 2Δx (mm) +0.15)