JP2013153081A - Light-emitting device, lighting fixture, and method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device which is capable of protecting the surface of an electrode wiring pattern without limiting light distribution characteristics of emission light.SOLUTION: In a light-emitting device 100, a first phosphor-containing resin layer 40b and a second phosphor-containing resin layer 50b which cover LED chips 80 are partitioned by a main liquid-repellent line 20 constituted of a liquid-repellent agent, and the main liquid-repellent line 20 is arranged so as to cover an electrode wiring pattern 15.

Description

  The present invention relates to a light emitting device, a lighting fixture, and a method for manufacturing the light emitting device.

  In recent years, LEDs are often used as light sources of light emitting devices. As a method for obtaining white light for a light emitting device using LEDs, there are a method using three types of LEDs, a red LED, a blue LED, and a green LED, a method using a blue LED as a light source of a yellow phosphor, and the like. Since light emitting devices are required to have sufficient luminance, light emitting devices using a plurality of LED chips have been commercialized. Until now, lighting devices that can be toned using an LED light source have been realized by combining a plurality of LED packages that emit single-color light of a light bulb color or daylight white. In the future, as a more cost-effective and versatile structure, it is expected that a structure including a light source that emits light bulb color and daylight white in a single LED package will be mainstream.

  As a light-emitting device using LED, the light-emitting device disclosed by patent document 1 is mentioned, for example. In the light emitting device disclosed in Patent Document 1, when viewed from a direction perpendicular to the substrate on which the light emitting element is mounted, the sealing body in which the light emitting element is embedded has a plurality of annular shapes having the same center. The structure is separated by a partition wall. FIG. 12 is a plan view showing a specific configuration of the light emitting device disclosed in Patent Document 1. In FIG.

  As shown in FIG. 12, the light emitting device 100 ′ includes an LED chip 80 ′ formed on the ceramic substrate 10 ′ and a sealing body in which the LED chip 80 ′ is embedded. The sealing body is separated into the first phosphor-containing resin layer 40 ′ and the second phosphor-containing resin layer 50 ′ by the first resin ring 20 ′ and the second resin ring 30 ′ arranged in an annular shape. Yes. The first resin ring 20 'and the second resin ring 30' are colored milky white or white. Thereby, the light from the LED chip 80 ′ as the light emitting element is suppressed from being absorbed by the first resin ring 20 ′ and the second resin ring 30 ′. Furthermore, the light emitting device 100 ′ has a structure that also has surface protection of the electrode wiring pattern 15 ′ by disposing the first resin ring 20 ′ and the second resin ring 30 ′ on the electrode wiring pattern 15 ′. ing.

JP 2011-108744 A (released on June 2, 2011)

  In the light emitting device disclosed in Patent Document 1, the first resin ring 20 ′ and the second resin ring 30 ′ serve as a partition that separates the first phosphor-containing resin layer 40 ′ and the second phosphor-containing resin layer 50 ′. Yes. In such a structure, the first resin ring 20 ′ and the second resin ring 30 ′ are colored white so that the light from the light emitting element is reflected by the first resin ring 20 ′ and the second resin ring 30 ′. Yes. Thereby, the light from the light emitting element is suppressed from being absorbed by the resin ring (partition wall).

  However, some light is absorbed by the resin ring. For this reason, the light emitting device disclosed in Patent Document 1 still has a problem of causing a loss of light extraction efficiency of the entire device. The reflection of light by the resin ring acts to direct light from the light emitting element in a direction perpendicular to the ceramic substrate 10 '. For this reason, the subject that the light distribution characteristic of a light-emitting device is restrict | limited is left.

  Further, in order to increase the light extraction efficiency of the entire apparatus, it is conceivable to remove the partition structure formed by the resin ring. However, in this case, the resin ring is removed from the configuration in which the electrode wiring pattern 15 ′ is disposed so as to be sandwiched between the surface of the ceramic substrate 10 ′ and the resin ring. For this reason, the problem that the electrode wiring pattern 15 ′ is exposed to the air layer and deteriorates remains.

  The present invention has been made in view of the above-described problems, and its object is to provide a light-emitting device, a lighting fixture, and a back that can protect the surface of the electrode wiring pattern without limiting the light distribution characteristics of the emitted light. It is to provide a method for manufacturing a light and a light emitting device.

  In order to solve the above problems, a light-emitting device of the present invention includes a light-emitting element provided on a substrate, an electrode wiring pattern electrically connected to the light-emitting element, and a sealing body in which the light-emitting element is embedded. The sealing body is partitioned by a liquid repellent portion made of a liquid repellent, and the liquid repellent portion is disposed so as to cover the electrode wiring pattern.

  In the conventional light emitting device, since the sealing body is separated into a plurality of regions by the partition, the reflection of light by the partition acts to direct the light from the light emitting element in a direction perpendicular to the substrate. For this reason, the subject that the light distribution characteristic of emitted light was restrict | limited was left.

  According to said structure, since the said sealing body is divided by the liquid repellent part comprised with the liquid repellent rather than being isolate | separated into a several area | region by the partition, the said subject is not caused. Therefore, according to the above configuration, the light from the light emitting element can be emitted to the outside without acting so as to be directed in a direction perpendicular to the substrate, and the light distribution characteristic of the emitted light is not limited. A light emitting device can be realized. Therefore, according to the use of the light emitting device, it is possible to adjust the light distribution characteristics by arranging a reflector or a coupling lens outside the light emitting device.

  Moreover, according to said structure, since the said liquid repelling part is arrange | positioned so that the said electrode wiring pattern may be covered, an electrode wiring pattern does not touch air directly. Therefore, according to the above configuration, a light emitting device capable of protecting the surface of the electrode wiring pattern can be realized.

  As described above, according to the above configuration, a light-emitting device capable of protecting the surface of the electrode wiring pattern without limiting the light distribution characteristics of the emitted light can be realized.

  In the light emitting device of the present invention, the liquid repellent portion includes a first liquid repellent line that forms a plurality of rings or polygonal rings having the same center when viewed from the mounting surface of the light emitting element, and the ring or And a second liquid repellent line connecting the polygonal rings.

  According to the above configuration, the liquid repellent portion includes the first liquid repellent line that forms a plurality of rings or polygonal rings having the same center when viewed from the mounting surface of the light emitting element, and the ring or Since the second liquid repellent line that connects the polygonal rings is provided, it is possible to realize a light emitting device in which variation in chromaticity of the entire light emitting device is further reduced. Further, it can be suitably used as a light source for a circular illumination device viewed from the light emitting surface, a light source for an illumination device that needs to improve optical coupling with an external optical component, or the like. Examples of the circular illumination device as viewed from the light emitting surface include a bulb-type illumination device. Illumination equipment that needs to improve optical coupling with external optical components includes, for example, an illumination equipment in which an external lens for adjusting light distribution characteristics is arranged directly above.

  In the light emitting device of the present invention, the liquid repellent portion constitutes a third liquid repellent line having a circular or polygonal frame shape and the third liquid repellent line when viewed from the mounting surface of the light emitting element. And a fourth liquid repellent line composed of a plurality of linear lines arranged so that the inside of the frame to be parallel to each other.

  According to the above configuration, the liquid repellent portion constitutes one circular or polygonal frame-shaped third liquid repellent line and the third liquid repellent line when viewed from the mounting surface of the light emitting element. And a fourth liquid repellent line composed of a plurality of linear lines arranged so that the inside of the frame to be parallel to each other is provided, so that the plurality of light emitting elements can be arranged more densely. For this reason, according to said structure, a board | substrate area and the total area of the electrode wiring pattern formed on the board | substrate can be made small, and an inexpensive light-emitting device is realizable. Further, since the light emitting elements are densely arranged, the chromaticity variation of the entire light emitting device can be further reduced.

  In the light emitting device of the present invention, the mounting surface of the light emitting element is preferably white.

  According to said structure, the mounting surface of the said light emitting element is white, and the member which causes light absorption, such as an electrode wiring pattern, does not exist in the area | region where a light emitting element is mounted. Therefore, according to the above configuration, the light from the light-emitting element that is totally reflected at the sealing interface and returns to the inside of the sealing body is incident on the white surface and reflected, thereby efficiently outside the sealing body. To exit. For this reason, according to said structure, a structure with high light extraction efficiency is realizable.

  In the light emitting device of the present invention, the liquid repellent portion is made of a resin containing a fluorine-based polymer, and the film thickness is preferably 0.5 μm or less.

  According to the above configuration, the liquid repellent portion is made of a resin containing a fluorine-based polymer and has a film thickness of 0.5 μm or less. Therefore, an electrode wiring pattern is applied by applying ultrasonic waves and a load while applying heat. When the light emitting element and the light emitting element are connected with a wire, the electrode wiring pattern and the light emitting element can be stably connected without problems.

  In the light emitting device of the present invention, the liquid repellent portion is preferably milky white or white.

  According to the above configuration, since the liquid repellent part is milky white or white, the light from the light emitting element is emitted to the outside of the sealing body and then reaches the electrode wiring pattern covered with the liquid repellent part. However, light reflection is suppressed by reflection. Therefore, according to the above configuration, a part of the light from the light emitting element is not absorbed by the electrode wiring pattern, and the reduction of the emitted light amount can be suppressed.

  In the light emitting device of the present invention, the light emitting device includes a plurality of the light emitting elements, and the light emitting elements are divided into a plurality of groups, and each group of the divided light emitting elements is connected to an electrode wiring pattern having two terminals. Preferably it is.

  According to said structure, each group of the divided light emitting element is supplied with electric power by the independent electric power supply system. Therefore, each of the divided light emitting elements can be turned on or off.

  In the light emitting device of the present invention, it is preferable that the sealing body contains a single type or a plurality of types of phosphors, and at least one of the phosphor content or the mixing ratio is different for each set of the light emitting elements.

  According to the above configuration, the sealing body contains a single type or a plurality of types of phosphors, and at least one of the phosphor content or the mixing ratio is different for each set of the light emitting elements. The range of chromaticity adjustment of the light emitting device can be widened by changing the output of the light emitting element depending on the supply system. Furthermore, the chromaticity to emit light is uniquely determined for each group of divided light emitting elements. For this reason, when emitting only a single set or simultaneously emitting multiple sets, the chromaticity of the target emission can be reproduced more accurately.

  In the light emitting device of the present invention, it is preferable that a plurality of the light emitting elements are provided, and the light emitting elements are wire-connected in series and electrically connected to the electrode wiring pattern.

  According to said structure, since the said light emitting element is wire-connected in series, the contact point of a light emitting element and an electrode wiring pattern can be made few.

  In order to solve the above-described problems, a lighting fixture according to the present invention includes the above-described light-emitting device.

  According to said structure, the lighting fixture which can protect the surface of an electrode wiring pattern is not implement | achieved, without restrict | limiting the light distribution characteristic of emitted light.

  In order to solve the above problems, a method for manufacturing a light emitting device according to the present invention applies a liquid repellent to a substrate on which an electrode wiring pattern is formed so as to cover the electrode wiring pattern, thereby forming a liquid repellent portion. A part forming step, a light emitting element mounting step of mounting a light emitting element in a partitioned region partitioned by the applied liquid repellent, a connecting step of electrically connecting the light emitting element and the electrode wiring pattern, and And a sealing step of embedding the mounted light emitting element with a sealing body. It is characterized by including.

  According to said structure, the light distribution characteristic of an emitted light is not restrict | limited, The manufacturing method of the light-emitting device which can protect the surface of an electrode wiring pattern is realizable.

  As described above, the light-emitting device of the present invention includes a plurality of light-emitting elements provided on a substrate, an electrode wiring pattern electrically connected to the light-emitting elements, and a sealing body in which the plurality of light-emitting elements are embedded. The sealing body is partitioned by a liquid repellent portion made of a liquid repellent, and the liquid repellent portion is arranged to cover the electrode wiring pattern.

  Moreover, the lighting fixture of this invention is the structure provided with the said light-emitting device as mentioned above.

As described above, the method for manufacturing a light emitting device of the present invention includes a liquid repellent part forming step of forming a liquid repellent part by applying a liquid repellent to a substrate on which an electrode wiring pattern is formed so as to cover the electrode wiring pattern. ,
A light emitting element mounting step of mounting a light emitting element in a partitioned area partitioned by the applied liquid repellent; a connecting step of electrically connecting the light emitting element and the electrode wiring pattern; and a light emitting element mounted in the partitioned area And a sealing step of embedding with a sealing body.

  Therefore, the light distribution characteristic of the emitted light is not limited, and the light emitting device capable of protecting the surface of the electrode wiring pattern can be realized.

It is a top view which shows the structural example of the light-emitting device of one Embodiment of this invention. It is a top view which shows the manufacture procedure of the light-emitting device shown in FIG. 1, and shows the ceramic substrate before mounting an LED chip. It is a top view which shows the manufacturing procedure of the light-emitting device shown in FIG. 1, and shows the state after apply | coating a liquid repellent pattern. It is a top view which shows the manufacturing procedure of the light-emitting device shown in FIG. 1, and shows the state which mounted the LED chip. It is the sectional view on the AA line of the light-emitting device shown by FIG. It is the sectional view on the AA line of the light-emitting device shown by FIG. 1 in case a fluorescent substance containing composition is low viscosity. FIG. 6 is an enlarged cross-sectional view of the vicinity of a first phosphor-containing resin layer in the light emitting device shown in FIG. 5. It is a top view which shows the structure of the light-emitting device of the other embodiment of this invention. It is a top view which shows the structure of the light-emitting device of the further another form of implementation of this invention. FIG. 10 is a top view showing a state when the LED chip is mounted in the method for manufacturing the light emitting device shown in FIG. 9. It is sectional drawing which shows schematic structure of the lighting fixture using the light-emitting device of one Embodiment of this invention. FIG. 10 is a plan view showing a specific configuration of a light emitting device disclosed in Patent Document 1.

Embodiment 1
An embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a top view illustrating a configuration example of the light emitting device 100 according to the present embodiment. As shown in FIG. 1, the light emitting device 100 includes a ceramic substrate (substrate) 10, a main liquid repellent line 20 (liquid repellent portion; first liquid repellent line), and a sub liquid repellent line 21 (liquid repellent portion; first). 2 liquid repellent lines), first phosphor-containing resin layers (sealing bodies) 40a and 40b, second phosphor-containing resin layers (sealing bodies) 50a and 50b, and third phosphor-containing resin layers ( A sealing body) 60, a wire 70, and an LED chip (light emitting element) 80.

  The ceramic substrate 10 is a substrate for mounting the LED chip 80 and the like. On the ceramic substrate 10, an electrode land (terminal: anode) 90, an electrode land (terminal: cathode) 95, and an electrode wiring pattern (not shown) are provided.

  In this embodiment, the external shape of the ceramic substrate 10 is 20 mm × 24 mm and the thickness is 1 mm. However, the outer shape of the ceramic substrate included in the light emitting device according to the present invention is not limited to this.

  The main liquid repellent line 20 has a configuration in which a plurality of annular lines are arranged at the same center, and is arranged so as to cover the entire surface of an electrode wiring pattern (not shown). Further, the auxiliary liquid repellent line 21 is provided so as to connect a plurality of annular lines constituting the main liquid repellent line 20. The wire 70 is a wire that connects the LED chip 80 to an electrode wiring pattern (not shown).

  Further, in the region partitioned by the main liquid repellent line 20 and the sub liquid repellent line 21 (separated into a plurality), the first phosphor-containing resin layers 40a and 40b, the second phosphor-containing resin layers 50a and 50b, And the 3rd fluorescent substance containing resin layer 60 is provided.

  In the light emitting device 100 ′ shown in FIG. 12, the sealing body that embeds the LED chip 80 ′ is a first phosphor-containing resin layer by the first resin ring 20 ′ and the second resin ring 30 ′ arranged in an annular shape. 40 'and second phosphor-containing resin layer 50'. Therefore, the reflection of light by the first resin ring 20 'and the second resin ring 30' acts to direct the light from the LED chip 80 'in a direction perpendicular to the ceramic substrate 10'. For this reason, the subject that the light distribution characteristic of emitted light was restrict | limited was left.

  According to the configuration of the light emitting device 100, the first phosphor-containing resin layers 40a and 40b, the second phosphor-containing resin layers 50a and 50b, and the third phosphor-containing resin layer 60 are main repellents made of a liquid repellent. It is partitioned by the liquid line 20 and the auxiliary liquid repellent line 21 (liquid repellent part). For this reason, the said subject is not invited. Therefore, the light from the LED chip 80 can be emitted outside without acting so as to be directed in a direction perpendicular to the ceramic substrate 10. As a result, the light emitting device 100 in which the light distribution characteristic of the emitted light is not limited can be realized. Moreover, according to the use of the light-emitting device 100, a reflector and a coupling lens can be arrange | positioned outside the light-emitting device 100, and a light distribution characteristic can be adjusted.

  Further, according to the configuration of the light emitting device 100, the first phosphor-containing resin layers 40a and 40b, the second phosphor-containing resin layers 50a and 50b, and the third phosphor-containing resin layer 60 cover the electrode wiring pattern 15. Thus, the electrode wiring pattern 15 does not directly contact air. Therefore, the light emitting device 100 capable of protecting the surface of the electrode wiring pattern 15 can be realized.

  Further, the liquid repellent portion in the light emitting device 100, when viewed from the mounting surface of the LED chip 80 of the ceramic substrate 10, and the main liquid repellent line 20 that forms a plurality of rings having the same center, and the secondary repellent that connects the rings. And a liquid line 21. Therefore, it is possible to realize the light emitting device 100 in which the chromaticity variation of the entire device is further reduced. The main liquid repellent line 20 may be a line that forms a polygonal ring.

  The LED chip 80 is divided into a plurality of groups for each phosphor-containing resin layer, and each group of the divided LED chips 80 has an electrode wiring having two terminals of an electrode land 90 and an electrode land 95. Connected to pattern 15. That is, each set of LED chips 80 is supplied with power by an independent power supply system. Therefore, each set of the upper LED chips 80 can be turned on or off.

  Next, a method for manufacturing the light emitting device 100 will be described. The manufacturing method of the light emitting device 100 includes a liquid repellent part forming step, a light emitting element mounting step, a connecting step, and a sealing step. In the liquid repellent portion forming step, a liquid repellent agent is applied to the ceramic substrate 10 on which the electrode wiring pattern 15 is formed so as to cover the electrode wiring pattern 15, and the main liquid repellent line 20 and the sub liquid repellent line 21 as the liquid repellent portion. Form. In the light emitting element mounting step, the LED chip 80 is mounted in a partitioned area partitioned by the applied liquid repellent. In the connection step, the LED chip 80 and the electrode wiring pattern 15 are electrically connected (for example, wire connection). In the sealing step, the LED chip 80 mounted in the partition region is embedded with a phosphor-containing resin composition, and the first phosphor-containing resin layers 40a and 40b, the second phosphor-containing resin layers 50a and 50b, and A third phosphor-containing resin layer 60 is formed.

  2 to 4 are top views showing a manufacturing procedure of the light emitting device 100. FIG. FIG. 2 is a top view showing the ceramic substrate 10 before the LED chip 80 is mounted.

  As shown in FIG. 2, two sets of electrode lands 90 and electrode lands 95, an electrode wiring pattern 15, and a printed resistance element 30 are formed on the ceramic substrate 10 before the LED chip 80 is mounted. For each set of electrode land 90 and electrode land 95, the electrode wiring pattern 15 and the printed resistance element 30 are electrically connected. Therefore, the light-emitting device 100 of this embodiment has two independent power supply systems.

  Next, on the ceramic substrate 10 shown in FIG. 2, a liquid repellent agent is applied so as to cover the entire surface of the electrode wiring pattern 15 and the printed resistance element 30 (liquid repellent portion forming step). FIG. 3 is a top view showing a state after the liquid repellent is applied in a pattern. As shown in FIG. 3, the main liquid repellent line 20 and the sub liquid repellent line 21 are formed by pattern application of the liquid repellent.

  The liquid repellent pattern is applied using a flexographic printing press. The liquid repellent is mainly composed of a fluoropolymer. The main liquid repellent line 20 and the sub liquid repellent line 21 formed in this way become a coating thin film having a thickness of 0.5 μm or less. In general, the fluoropolymer coating agent used for pattern coating is transparent. However, the fluorine polymer coating agent can be dyed white by mixing titanium oxide or the like. In addition, the fluoropolymer coating agent can be dyed milky white. As a result, the main liquid repellent line 20 and the sub liquid repellent line 21 are milky white or white. Therefore, light absorption at the site where the liquid repellent is applied can be suppressed. Further, the pattern of the liquid repellent formed by the application can be divided into a main liquid repellent line 20 and a sub liquid repellent line 21. A plurality of partitioned regions surrounded by the main liquid repellent line 20 and the sub liquid repellent line 21 are formed.

  Thus, in the light emitting device 100, the main liquid repellent line 20 and the sub liquid repellent line 21 are milky white or white. For this reason, the light from the LED chip 80 is reflected even if it reaches the electrode wiring pattern 15 covered with the main liquid repellent line 20 and the sub liquid repellent line 21 after being emitted to the outside of the phosphor-containing resin layer. Can suppress light absorption. Therefore, a part of the light from the LED chip 80 is not absorbed by the electrode wiring pattern 15, and the reduction of the emitted light amount can be suppressed.

  Next, the LED chip 80 is mounted in a plurality of partitioned regions surrounded by the main liquid repellent line 20 and the sub liquid repellent line 21 (light emitting element mounting step). At this time, the LED chip 80 is fixed to the surface of the ceramic substrate 10 with a silicon resin (not shown). FIG. 4 is a top view showing a state in which the LED chip 80 is mounted.

  After mounting the LED chip 80, wire connection is performed using the wire 70 so that the LED chip 80 and the electrode wiring pattern 15 are electrically connected (connection process). At this time, the wire 70 is connected by an ultrasonic wave and a load while applying heat to the connection portion of the wire 70 between the LED chip 80 and the electrode wiring pattern 15. Here, the electrode wiring pattern 15 is covered with the main liquid repellent line 20 (or the sub liquid repellent line 21). That is, the surface of the electrode wiring pattern 15 is protected by the fluororesin coating. Since the main liquid repellent line 20 and the sub liquid repellent line 21 are coating thin films having a thickness of 0.5 μm or less, as described above, while applying heat to the connection portion of the wire 70 with the electrode wiring pattern 15, By connecting the wire 70 with a load, the wire 70 and the electrode wiring pattern 15 can be electrically connected without any trouble.

  Table 1 is a table showing the relationship between the film thickness of the liquid repellent line and whether or not the wire 70 and the electrode wiring pattern 15 after the wire connection are conductive. As shown in Table 1, when the film thickness of the liquid repellent line was 0.7 to 10 μm, contact failure occurred in some samples, and the conduction between the wire 70 and the electrode wiring pattern 15 was hindered. On the other hand, when the film thickness of the liquid repellent line was 0.5 μm or less (over 0 μm) with 0.5 μm as a boundary, the wire 70 and the electrode wiring pattern 15 could be conducted without any trouble. From the results in Table 1, it is understood that the film thickness of the liquid repellent line is preferably 0.5 μm or less in order to make the wire 70 and the electrode wiring pattern 15 conductive without any trouble.

  Subsequently, the phosphor-containing resin composition is filled into a plurality of partitioned regions surrounded by the main liquid repellent line 20 and the sub liquid repellent line 21 using a dispenser (sealing step). Then, the phosphor-containing composition is cured to form a phosphor-containing resin layer. The phosphor-containing resin layer composition has a curing temperature of 150 ° C. and a curing time of 30 minutes. However, the curing temperature and the curing time are not limited to this.

  In the present embodiment, among the plurality of partition regions surrounded by the main liquid repellent line 20 and the sub liquid repellent line 21, the partition region 110 that forms an annular outermost shell has a first phosphor-containing resin layer 40a. 40b is formed. In addition, the second phosphor-containing resin layers 50a and 50b are formed in the partition region 120 forming the annular middle shell. In addition, the third phosphor-containing resin layer 60 is formed in the partition region 130 that forms an annular center portion.

  Regarding the first phosphor-containing resin layers 40a and 40b, the second phosphor-containing resin layers 50a and 50b, and the third phosphor-containing resin layer 60, the constituting phosphor-containing resin composition may be a single type or a plurality of types of fluorescent materials. Contains the body. Then, at least one of the phosphor content and the mixing ratio differs for each phosphor-containing resin layer. Accordingly, the range of chromaticity adjustment of the light emitting device 100 can be widened by changing the output of the LED chip 80 by the power supply system. Furthermore, the chromaticity emitted for each set of LED chips 80 embedded in the phosphor-containing resin layer is uniquely determined. For this reason, when emitting only a single set or simultaneously emitting multiple sets, the chromaticity of the target emission can be reproduced more accurately.

  For example, with respect to the phosphor-containing resin composition constituting the first phosphor-containing resin layers 40a and 40b and the third phosphor-containing resin layer 60, the phosphor composition is prepared so as to reproduce light bulb color light emission. Moreover, about the fluorescent substance containing resin composition which comprises 2nd fluorescent substance containing resin layer 50a * 50b, the composition of a fluorescent substance is prepared so that daytime white light emission may be reproduced. Here, in the light emitting device 100, the partitioned areas 110 and 130 and the partitioned area 120 are each supplied with power by independent power supply systems. For this reason, the light emitting device 100 can realize light emission of only a light bulb color, light emission of only day white, and light emission of a mixed color of light bulb color and day white. Therefore, the chromaticity adjustment range of the light emitting device 100 can be widened.

  FIG. 5 is a cross-sectional view taken along line AA of the light emitting device 100 manufactured by the above-described manufacturing method, that is, the light emitting device 100 shown in FIG. As shown in FIG. 5, in the light emitting device 100, the first phosphor-containing resin layer 40 b and the second phosphor-containing resin layer 50 b are separated (without contacting each other) with the main liquid repellent line 20 as a boundary. It is formed in a hemispherical shape.

  Here, the phosphor-containing resin composition is applied onto the LED chip 80 and the wire 70. Therefore, particularly when the phosphor-containing composition has a low viscosity, the phosphor-containing resin composition may flow out of the partition region 110 or 120 through the wire 70 as shown in FIG. However, on the surface of the electrode wiring pattern 15, which is an area outside the partition area 110 or 120, the area other than the connection point with the wire 70 is coated with the liquid repellent agent to form the main liquid repellent line 20. For this reason, even if the phosphor-containing resin composition flows out of the partition region 110 or 120, the main liquid repellent line 20 does not leak to the outside.

  Similarly, even when a large amount of the phosphor-containing composition is applied to the partition regions 110 and 120, if the contact angle of the resin to be applied with the substrate surface exceeds the limit contact angle, the phosphor-containing resin composition is mainly used. There is a risk of entering the liquid repellent line 20. Even in such a case, the phosphor-containing resin composition does not leak out to the outside by the main liquid-repellent line 20, so the hemispherical shape of the first phosphor-containing resin layer 40b and the second phosphor-containing resin layer 50b is Maintained. As a result, the structure of the light emitting device 100 is maintained without mixing the phosphor resin composition between the adjacent first phosphor-containing resin layer 40b and the second phosphor-containing resin layer 50b.

  Next, the light extraction efficiency of the light emitting device 100 will be described below with reference to FIG. FIG. 7 is an enlarged cross-sectional view of the vicinity of the first phosphor-containing resin layer 40b in the light emitting device 100 shown in FIG.

As shown in FIG. 7, the phosphor 36 is uniformly diffused in the first phosphor-containing resin layer 40b. The particle size of the phosphor 36 is about 10 μm. In addition, the phosphor 36 may be precipitated in the first phosphor-containing resin layer 40b. Further, on the substrate surface of the ceramic substrate 10, the electrode wiring pattern 15 is disposed outside the first phosphor-containing resin layer 40b (that is, the partition region 110). On the other hand, the inner side of the first phosphor-containing resin layer 40b (that is, in the partition region 110) is covered with a white substrate 81 made of Al ₂ O ₃ . The LED chip 80 is provided on the white substrate 81.

Part of the emitted light from the LED chip 80 is directly emitted to the outside of the first phosphor-containing resin layer 40b, or is converted from a short wavelength to a long wavelength by the phosphor 36, and then to the outside of the first phosphor-containing resin layer 40b. Outgoes (solid arrow in FIG. 7). On the other hand, light emitted from the LED chip 80 having a small incident angle with respect to the interface of the first phosphor-containing resin layer 40b is totally reflected and cannot be extracted outside the first phosphor-containing resin layer 40b. Here, since the partition region 110 is covered with the white substrate 81 made of Al ₂ O ₃ , most of the totally reflected light is reflected by the white substrate 81 and then to the outside of the first phosphor-containing resin layer 40b. It will be emitted. Thus, since the partition region 110 is covered with the white substrate 81 made of Al ₂ O _3, it becomes possible to extract light having a small incident angle with respect to the interface of the first phosphor-containing resin layer 40b. The light extraction efficiency is increased.

  In addition, if the mounting surface of the LED chip 80 is white, it is possible to improve the light extraction efficiency. Therefore, the same effect can be obtained even when the white resist is formed in the partition region 110. Moreover, the structure which colored the partition area | region 110 of the ceramic substrate 10 in white may be sufficient.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIG. For convenience of explanation, components having functions similar to those of the components according to the first embodiment are denoted by the same reference numerals and description thereof is omitted. In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 8 is a top view showing the configuration of the light emitting device 200 of the present embodiment. The light emitting device 200 has a configuration in which the auxiliary liquid repellent line 21 is removed from the light emitting device 100 of the first embodiment. The configuration is the same as that of the light emitting device 100 of Embodiment 1 except that the sub-liquid-repellent line 21 is removed. Further, the manufacturing method of the light emitting device 200 is the same as that of the first embodiment except that the auxiliary liquid repellent line 21 is not formed.

  As a result, the region where the liquid repellent agent is applied is only the region of the plurality of annular lines constituting the main liquid repellent line 20. Therefore, when applying the phosphor-containing resin composition, the application region of the phosphor-containing resin composition cannot be distinguished from the application start point and the application end point by operating the dispenser in an annular line. One stroke line can be used. As a result, according to the light emitting device 200, more stable application of the phosphor-containing resin composition can be realized.

  As shown in FIG. 7, the electrode wiring pattern 15 has an exposed portion 15 a that is not covered with the liquid repellent pattern constituted by the liquid repellent. This exposed portion 15a is located inside the phosphor-containing resin layer. That is, the exposed portion 15a is located between the first phosphor-containing resin layers 40a and 40b, between the second phosphor-containing resin layers 50a and 50b, and within the third phosphor-containing resin layer 60. For this reason, the exposed portion 15a absorbs light emitted from the LED chip 80. However, the area of the exposed portion 15a is much smaller than the area of the region where the phosphor-containing resin layer is formed. Therefore, the light absorption by the exposed portion 15a does not significantly reduce the light extraction efficiency of the light emitting device 200.

[Embodiment 3]
The following will describe another embodiment of the present invention with reference to FIGS. For convenience of explanation, components having functions similar to those of the components according to the first embodiment are denoted by the same reference numerals and description thereof is omitted. In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 9 is a top view showing the configuration of the light emitting device 300 of the present embodiment. FIG. 10 is a top view showing a state when the LED chip 80 is mounted.

  As shown in FIG. 10, in the light emitting device 300, the electrode wiring patterns 15 are arranged on both sides. That is, the electrode wiring pattern 15 is a linear pattern, and two linear patterns are formed on each of two opposing sides of the rectangular ceramic substrate 10. The plurality of LED chips 80 are connected to the electrode wiring pattern 15 in series. The plurality of LED chips 80 arranged in series are connected to the electrode wiring pattern 15 by a single wire 70.

  As shown in FIG. 9, the main liquid repellent line 22 (liquid repellent portion; third liquid repellent line) is formed in a square frame shape so as to cover the electrode wiring pattern 15. In addition, a plurality of sub-liquid-repellent lines 23 (liquid-repellent portions; fourth liquid-repellent lines) are formed in parallel inside the rectangular liquid-shaped main liquid-repellent line 22. That is, the auxiliary liquid repellent line 23 is formed in a straight line so as to connect two sides covering the electrode wiring pattern 15 among the sides forming the rectangular frame in the main liquid repellent line 22. A plurality of sub-liquid-repellent lines 23 are formed in parallel to each other. In the partitioned areas partitioned by the main liquid repellent line 22 and the sub liquid repellent line 23, the same number of LED chips 80 are provided.

  As described above, the liquid repellent portion of the light emitting device 300, when viewed from the mounting surface of the LED chip 80 of the ceramic substrate 10, has one rectangular frame-shaped main liquid repellent line 22 and a frame constituting the main liquid repellent line 22. And a secondary liquid repellent line 23 composed of a plurality of linear lines arranged in parallel to each other. Therefore, the LED chips 80 can be densely arranged in the partitioned area partitioned by the main liquid repellent line 22 and the sub liquid repellent line 23. Therefore, the area of the ceramic substrate 10 and the total area of the electrode wiring patterns 15 formed on the ceramic substrate 10 can be reduced, and an inexpensive light emitting device 300 can be realized. Further, since the LED chips 80 are densely arranged, the chromaticity variation of the entire light emitting device can be further reduced. The main liquid repellent line 22 is not limited to a single rectangular frame, and may be a single polygonal frame shape. Moreover, the frame shape of one circle may be sufficient.

  Further, as shown in FIG. 9, the phosphor-containing resin layers 35a and 35b (sealing bodies) are alternately arranged for each partition region so as to have a stripe shape. Here, the phosphor-containing resin layer 35a reproduces light bulb color light, and the phosphor-containing resin layer 35b reproduces daylight white light.

  Here, in the light emitting device 100, the LED chips 80 covered with the phosphor-containing resin layers 35a and 35b are each supplied with power by an independent power supply system. Therefore, in the light emitting device 300, the chromaticity adjustment can be easily performed in a wide range.

  In the light emitting device 300, the phosphor-containing resin layers 35a and 35b have the same shape. For this reason, when manufacturing the light-emitting device 300, the phosphor-containing resin composition constituting the phosphor-containing resin layers 35a and 35b can be easily and stably applied. The LED chip 80 is wire-connected in series. For this reason, the number of contact points between the LED chip 80 and the electrode wiring pattern 15 can be reduced.

  The configuration other than the differences described above is the same as that of the light emitting device 100 of the first embodiment. Moreover, the manufacturing method of the light-emitting device 300 is also the same manufacturing method as that of the first embodiment except for the differences described above.

(Application example of light emitting device of the present invention)
The light emitting device of the present invention can be suitably used as, for example, a light source for a circular illumination device or a light source for an illumination device that needs to improve optical coupling with an external optical component when viewed from the light emitting surface. Examples of the circular illumination device as viewed from the light emitting surface include a bulb-type illumination device. Illumination equipment that needs to improve optical coupling with external optical components includes, for example, an illumination equipment in which an external lens for adjusting light distribution characteristics is arranged directly above.

  The light emitting device of the present invention can be suitably used for a backlight light source of a liquid crystal display.

  The light-emitting device of the present invention is a high-intensity light source as shown in FIG. 11 as a light source that needs to have a circular wide light distribution characteristic when viewed from the light-emitting surface, such as a light bulb-type lighting device. Can be used as FIG. 11 is a schematic plan view showing an example of a lighting fixture using the light emitting device of the present invention.

  As shown in FIG. 11, the lighting fixture of the present invention includes a reflector 96, a heat sink 97, a power supply unit 98, and a light emitting device 100. The power supply unit 98 is a power supply for the light emitting device 100. The heat sink 97 is a member for radiating heat from the light emitting device 100. In the lighting fixture shown in FIG. 11, a reflector 96 is disposed around the light emitting device 100 in order to adjust the light distribution characteristics. As a result, the light emitting device 100 can be used as a high brightness light source. In addition, since it is possible to realize both dimming and toning with a single light emitting device 100, the lighting fixture can be reduced in size.

(Supplement)
The light emitting device according to the present invention can also be expressed as follows.

  (1) In a light emitting device including an electrode wiring pattern formed on a substrate, a plurality of light emitting elements wire-connected to the electrode wiring pattern, and a sealing body in which the light emitting element is embedded, the sealing body is a phosphor. And a liquid repellent pattern formed by a liquid repellent agent, and the liquid repellent pattern is disposed so as to cover the entire surface of the electrode wiring pattern.

  (2) The liquid repellent pattern includes two or more main liquid repellent lines having the same center when the substrate is viewed from the vertical direction, and the annular or polygonal ring. The light-emitting device according to (1), wherein the light-emitting device is formed by a plurality of sub-liquid-repellent lines that connect the two rings.

  (3) When the substrate is viewed from the vertical direction, the liquid repellent pattern includes a main liquid repellent line that forms one circle or polygon, and a plurality of sub-repeats that are arranged in parallel inside the circle or polygon. The light-emitting device according to (1), which is formed by a liquid repellent line.

  (4) The light emitting device according to any one of (1) to (3), wherein only the white substrate or the white resist, the light emitting element, and the wire are arranged in the sealing body.

  (5) The light-emitting device according to any one of (1) to (4), wherein the liquid repellent pattern is a coating film containing a fluoropolymer as a main component and has a thickness of 0.5 μm or less.

  (6) The light emitting device according to any one of (1) to (5), wherein the liquid repellent pattern is colored milky white and white.

  (7) The plurality of light emitting elements are divided into two or more sets, and each set is connected to an electrode wiring pattern having two terminals. (1) to (6) The light-emitting device in any one.

  (8) The sealing body contains a single type or a plurality of types of phosphors, and at least one of the phosphor content and the mixing ratio for each set of light emitting elements divided into two or more sets. Both are different in one, The light-emitting device as described in (6) characterized by the above-mentioned.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The light emitting device and the method for manufacturing the light emitting device of the present invention can be suitably applied to an illumination light source.

10 Ceramic substrate 15 Electrode wiring pattern 20 Main liquid repellent line (liquid repellent portion; first liquid repellent line)
21 Sub liquid repellent line (liquid repellent part; second liquid repellent line)
22 Main liquid repellent line (liquid repellent part; third liquid repellent line)
23 Sub liquid repellent line (Liquid repellent part; 4th liquid repellent line)
30 Printing resistance element 35 Phosphor-containing resin layer (sealing body)
36 phosphor 40a first phosphor-containing resin layer (sealing body)
40b First phosphor-containing resin layer (sealing body)
50a Second phosphor-containing resin layer (sealing body)
50b Second phosphor-containing resin layer (sealing body)
60 3rd fluorescent substance containing resin layer (sealing body)
70 Wire 80 LED chip (light emitting device)
90 Electrode land (anode)
95 Electrode land (cathode)
100, 200, 300 Light emitting device

Claims (11)

A light emitting device provided on a substrate;
An electrode wiring pattern electrically connected to the light emitting element;
A sealing body in which the light emitting element is embedded,
The sealing body is partitioned by a liquid repellent portion composed of a liquid repellent,
The liquid-repellent part is disposed so as to cover the electrode wiring pattern. When the liquid repellent part is viewed from the mounting surface of the light emitting element,
A first liquid repellent line forming a plurality of circular or polygonal rings having the same center;
The light-emitting device according to claim 1, further comprising a second liquid repellent line that connects the circular rings or the polygonal rings. When the liquid repellent part is viewed from the mounting surface of the light emitting element,
A third liquid repellent line in the shape of a circle or a polygon;
2. The fourth liquid repellent line comprising a plurality of linear lines arranged so that the inside of the frame constituting the third liquid repellent line is parallel to each other. The light-emitting device of description.   The light-emitting device according to claim 1, wherein a mounting surface of the light-emitting element is white.   5. The light emitting device according to claim 1, wherein the liquid repellent portion is made of a resin containing a fluorine-based polymer and has a thickness of 0.5 μm or less.   The light emitting device according to claim 1, wherein the liquid repellent portion is milky white or white. A plurality of the light emitting elements are provided,
The light emitting element is divided into a plurality of groups, and each group of the divided light emitting elements is connected to an electrode wiring pattern having two terminals. 2. The light emitting device according to item 1.   The said sealing body contains single or multiple types of fluorescent substance, and at least one of the content or mixing ratio of fluorescent substance differs for every group of the said light emitting element, The Claim 7 characterized by the above-mentioned. Light emitting device. A plurality of the light emitting elements are provided,
The light-emitting device according to claim 1, wherein the light-emitting element is wire-connected in series and electrically connected to the electrode wiring pattern.   A lighting fixture comprising the light-emitting device according to claim 1. A liquid repellent part forming step of forming a liquid repellent part by applying a liquid repellent to the substrate on which the electrode wiring pattern is formed so as to cover the electrode wiring pattern;
A light-emitting element mounting step of mounting the light-emitting element in a partitioned area partitioned by the applied liquid repellent;
A connection step of electrically connecting the light emitting element and the electrode wiring pattern;
And a sealing step of embedding the light emitting element mounted in the partition region with a sealing body.

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