US9893038B2 - Light-emitting device having first and second wiring patterns - Google Patents

Light-emitting device having first and second wiring patterns Download PDF

Info

Publication number
US9893038B2
US9893038B2 US15/072,889 US201615072889A US9893038B2 US 9893038 B2 US9893038 B2 US 9893038B2 US 201615072889 A US201615072889 A US 201615072889A US 9893038 B2 US9893038 B2 US 9893038B2
Authority
US
United States
Prior art keywords
light
emitting
wiring patterns
emitting unit
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US15/072,889
Other versions
US20160276553A1 (en
Inventor
Masaki Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Assigned to NICHIA CORPORATION reassignment NICHIA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKUBO, MASAKI
Publication of US20160276553A1 publication Critical patent/US20160276553A1/en
Application granted granted Critical
Publication of US9893038B2 publication Critical patent/US9893038B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46Reflective coating, e.g. dielectric Bragg reflector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present disclosure relates to a light-emitting device.
  • a light-emitting device includes a base, a wiring pattern formed on the base, and a plurality of light-emitting elements arranged on the base or the wiring pattern, and the plurality of light-emitting elements include a first light-emitting element group that is covered with a first sealing member and constitutes a first light-emitting unit, and a second light-emitting element group that is covered with a second sealing member formed in such a manner as to surround the first sealing member and that constitutes a second light-emitting unit, and the wiring pattern includes first wiring patterns that drive the first light-emitting element group, and second wiring patterns that drive the second light-emitting element group, and the second wiring patterns are separated from each other in such a manner that the first wiring pattern is interposed therebetween, and a wire connects the second wiring patterns separated from each other so as to straddle the first wiring pattern.
  • FIG. 1 is a schematic front view illustrating the entire constitution of a light-emitting device according to a first embodiment of the present invention.
  • FIG. 2 is a schematic front view illustrating the constitution of the light-emitting device according to the first embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view taken along a line A-A in FIG. 1 .
  • X direction is also referred to as “lateral” direction
  • Y direction as “longitudinal” direction
  • Z direction as “up-and-down” direction or “height (thickness)” direction.
  • a light-emitting device 100 according to a first embodiment will be described referring to FIGS. 1 to 3 . It is noted that, for convenience, light reflective resins 6 a and 6 b in FIG. 2 are illustrated as being see-through, and the external shapes thereof are represented by a line. Sealing members (a first sealing member 7 and a second sealing member 8 ) are also illustrated as being see-through.
  • the light-emitting device 100 includes a base 1 , wiring patterns formed on the base 1 , and a plurality of light-emitting elements 2 (herein, the number of light-emitting elements is 66) arranged on the base 1 .
  • the light-emitting elements 2 include a first light-emitting element group 10 (the light-emitting elements encircled in a dotted line in FIG. 2 , and the number of light-emitting elements is 33) that is covered with the first sealing member 7 and that constitutes a first light-emitting unit, and a second light-emitting element group 11 (the light-emitting elements encircled in a dotted line in FIG. 2 , and the number of light-emitting elements is 33) that is covered with the second sealing member 8 formed in such a manner as to surround the first sealing member 7 and that constitutes a second light-emitting unit.
  • the wiring patterns are concentrically formed as illustrated in FIG. 2 and include first wiring patterns 4 a to 4 c that are formed along the first light-emitting element group 10 and drive the first light-emitting element group 10 , and second wiring patterns 5 a to 5 f that are formed along the second light-emitting element group 11 and drive the second light-emitting element group 11 .
  • the first wiring patterns 4 a to 4 c and the second wiring patterns 5 a to 5 f each include an arc-shaped portion, and an inner-side circle is formed by the first wiring patterns 4 a to 4 c , and an outer-side circle is formed by the second wiring patterns 5 a to 5 f
  • the second wiring patterns 5 a and 5 c are separated from each other and arranged between which the first wiring pattern 4 a is interposed, and a wire 12 connects the second wiring patterns 5 a and 5 c so as to straddle the first wiring pattern 4 a .
  • the wire 12 connects the second wiring patterns 5 e and 5 f so as to straddle the first wiring pattern 4 b.
  • Patent Literature 1 does not explicitly disclose wiring patterns in the case where each light-emitting unit emits light. For example, in the case where colors are mixed by adjusting the amount of light emission of each light-emitting unit, two-system independent circuits are required. Accordingly, in the case of what is called a single-sided board on which wiring patterns are provided only on the surface of a base, it is difficult to form the wiring patterns. Although a multilayer board can be used, the multilayer board necessitates an increase in cost, and therefore further reduction in cost is desired.
  • An object of the present disclosure is to provide a light-emitting device that can independently drive a plurality of light-emitting units even in the case of using a single-sided board.
  • the first wiring pattern 4 a passes between the second wiring patterns 5 a and 5 c in such a manner as to be drawn out from the inner side to the outer side in a plan view and extends to the end portion of the base 1 .
  • the first wiring pattern 4 a includes a pad portion (electric supply portion) at an end portion far away from the light-emitting elements of the first light-emitting element group 10 , and the first wiring pattern 4 b also includes the pad portion (electric supply portion) in a similar manner.
  • the wire 12 connects the end portions of the second wiring patterns 5 a and 5 c in such a manner as to extend in the direction approximately orthogonal to the direction that the second wiring pattern 5 a is drawn out.
  • the wire 12 extends along the shape of a frame body formed by the light reflective resin 6 b .
  • the length of the wire 12 is not particularly limited as long as the wire 12 is long enough to straddle the first wiring pattern 4 a and connect the second wiring pattern 5 a with the second wiring pattern 5 c.
  • the electrodes of the adjacent light-emitting elements 2 are connected in series with the wires 12 , and further the light-emitting elements 2 , of which the both ends (a starting point and an end point) are connected in series, are respectively electrically connected to the first wiring patterns 4 a and 4 b by the wires 12 .
  • the plurality of light-emitting elements 2 are circularly placed in the central area of the base 1 , and the first wiring patterns 4 a and 4 b that include the arc-shaped portion formed in such a manner as to surround the first light-emitting element group 10 are arranged.
  • the first wiring pattern 4 c on which a protective element 9 is mounted, is arranged between the first wiring patterns 4 a and 4 b , and the first wiring pattern 4 c is electrically connected with the first wiring patterns 4 a and 4 b by the wires 12 so as to establish inverse-parallel connection between the protective element 9 and the first light-emitting element group 10 .
  • the first light-emitting element group 10 is covered with the first sealing member 7 , and the light reflective resin 6 a is formed in such a manner as to cover the arc-shaped portions of the first wiring patterns 4 a and 4 b and the first wiring pattern 4 c .
  • the first light-emitting element group 10 is surrounded by the light reflective resin 6 a , and the first sealing member 7 is filled in this surrounded area, and a portion covered with the first sealing member 7 constitutes the first light-emitting unit.
  • the light-emitting elements 2 are circularly arranged along the circumference of the first sealing member 7 .
  • three lines made of eleven light-emitting elements connected in series are connected in parallel.
  • the electrodes of the adjacent light-emitting elements 2 are connected in series by the wires 12 , and further the light-emitting elements 2 , of which the both ends (a starting point and an end point) are connected in series, are respectively electrically connected to the second wiring patterns 5 c and 5 e , the second wiring patterns 5 f and 5 a , and the second wiring patterns 5 b and 5 a by the wires 12 .
  • the second light-emitting element group 11 is arranged in such a manner as to surround the first sealing member 7 . Also, the second light-emitting element group 11 is covered with the second sealing member 8 and constitutes the second light-emitting unit.
  • the light reflective resin 6 b is formed so as to cover the arc-shaped portions of the second wiring patterns 5 a and 5 b , and the second wiring patterns 5 c , 5 d , 5 e , and 5 f .
  • the second light-emitting element group 11 is surrounded by the light reflective resin 6 b , and the second sealing member 8 is filled in the area surrounded by the light reflective resins 6 a and 6 b.
  • the first sealing member 7 and the second sealing member 8 are separated from each other by the light reflective resin 6 a and constitute the first light-emitting unit and the second light-emitting unit.
  • the first light-emitting unit and the second light-emitting unit are concentrically formed.
  • the first wiring patterns 4 a and 4 b and the second wiring patterns 5 a and 5 b act as external terminal electrodes, so that approximately rectangular pad portions (electric supply portions) are formed in the four corners of the base 1 in such a manner that the wiring patterns are widened in a plan view as illustrated in FIGS. 1 and 2 .
  • An anode mark AM that indicates an anode is formed on each of the first wiring pattern 4 a and the second wiring pattern 5 a , each of which functions as a positive electrode.
  • Each of the first wiring pattern 4 b and the second wiring pattern 5 b serves as a cathode.
  • the light-emitting device 100 includes a two-system circuit for the first wiring patterns and the second wiring patterns and allows the light-emitting elements of the first light-emitting element group 10 and the second light-emitting element group 11 to separately light up. Accordingly, it is not necessary to form structure in which the wiring patters are laid on two or more layers. Even in the case where a single-sided board is used, the first light-emitting unit and the second light-emitting unit can independently light up.
  • light-emitting areas can be selected by lighting up any one of the light-emitting units or lighting up both light-emitting units. For example, in the case where the light having a small light-emitting diameter needs to be emitted, only the first light-emitting unit lights up, and in the case where the light having a large light-emitting diameter needs to be emitted, the first light-emitting unit and the second light-emitting unit simultaneously light up.
  • the emission spectra or color temperatures of the first light-emitting unit and the second light-emitting unit may differ.
  • the first light-emitting unit and the second light-emitting unit emit different light-emitting colors, and the light of the different light-emitting colors is mixed, thereby obtaining a desired color tone.
  • the first light-emitting unit and the second light-emitting unit each emit light of different colors such as a cold color and a warm color, so that the light-emitting device can emit the light of various color tones in range from warm white color to daylight color.
  • the light emission colors of the first light-emitting element group 10 and the second light-emitting element group 11 may differ, or the types or compounding ratio of wavelength conversion members of the first sealing member 7 and the second sealing member 8 may differ, in order to allow the first light-emitting unit and the second light-emitting unit to have different light emission colors.
  • the areas of the first light-emitting unit and the second light-emitting unit in a plan view can be formed with a desired area ratio depending on use or color tone.
  • the areas of the first light-emitting unit and the second light-emitting unit are formed in approximately equal size.
  • the shapes of the first light-emitting unit and the second light-emitting unit are not limited to concentrically shaped units, as long as the first light-emitting unit is arranged on the inner side, and the second light-emitting unit is arranged on its outer side.
  • the external shapes of the first light-emitting unit and the second light-emitting unit in a plan view may be formed in any shape such as a circle, an oval, a square, and a hexagon.
  • the base 1 on which electronic components such as the light-emitting elements 2 and the protective element 9 are to be placed includes the wiring patterns on the surface thereof.
  • the base 1 as illustrated in FIGS. 1 and 3 , is formed in a rectangular flat shape. A flat shape is preferable in term of reduction in cost, but the base 1 may include recess at sections where the light-emitting elements are to be placed.
  • the size of the base 1 is not particularly limited but can be appropriately selected depending on purpose and use in terms of the number of light-emitting elements 2 and the intervals of arrangement, light-emitting areas, or the like.
  • the materials of the base 1 it is preferable to use materials that have insulation properties and less likely to penetrate through the light discharged from the light-emitting elements or the light from the outside. Also, it is preferable to use materials having intensity to some degree. Specifically, the materials include ceramics (Al2O3, AlN, and the like), or resin such as phenol resin, epoxy resin, polyimide resin, BT resin, and polyphthalamide (PPA). A reflection member may be provided on the mounting surface of the light-emitting elements so as to enhance light reflectivity.
  • the reflection member for example, is made of the mixture of particles having light reflective properties such as titanium oxide (TiO2) and a binder of organic or inorganic matter, which corresponds to what is called white resist, white ink, or ceramics ink.
  • TiO2 titanium oxide
  • a binder of organic or inorganic matter which corresponds to what is called white resist, white ink, or ceramics ink.
  • the binder of the organic matter it is particularly preferable to use silicone resin having good heat resistance and light resistance. Accordingly, the light is reflected on the surface of the base, so that the light-emitting device that has the high efficiency of light extraction can be achieved.
  • the light-emitting element 2 is a semiconductor element that emits light by applying a voltage. As illustrated in FIG. 2 , the plurality of light-emitting elements 2 are arranged on the upper surface of the base 1 , and the whole of the plurality of light-emitting elements 2 constitutes the light-emitting units of the light-emitting device 100 .
  • the light-emitting elements 2 are bonded to the base 1 or the wiring patterns by bonding members.
  • As the bonding method for example, a bonding method in which resin or solder paste is used can be applied. As illustrated in FIG.
  • the light-emitting elements 2 may be bonded in such a manner that a p-electrode and an n-electrode are positioned on the upper surface, or may be bonded in such a manner that the p-electrode and the n-electrode are positioned on the lower surface, with what is called a flip chip bonding.
  • the light-emitting elements 2 are each formed in a rectangular shape.
  • the light-emitting element specifically, it is preferable to use a light emitting diode, and the light emitting diode having an arbitrary wavelength can be selected according to use.
  • ZnSe, nitride semiconductors and GaP can be used for the light-emitting element that emits blue light (wavelengths between 430 nm and 490 nm) or green light (wavelengths between 490 nm and 570 nm).
  • GaAlAs and AlInGaP can be used for the light-emitting element that emit red light (wavelengths between 620 nm and 750 nm).
  • the wavelength conversion members are contained in the first sealing member 7 and the second sealing member 8 , it is preferable to use the nitride semiconductors that can emit the light of a short wavelength that can efficiently excite the wavelength conversion members.
  • the composition of an ingredient, the light emission color, and size of the light-emitting elements 2 are not limited to the description above, but can be appropriately selected depending on purposes.
  • the light-emitting elements 2 can be constituted of elements that output not only light in a visible light area but also ultraviolet rays or infrared rays.
  • the light-emitting elements constituting the first light-emitting element group 10 and the light-emitting elements constituting the second light-emitting element group 11 may be of a same type, or may be of a different type, for example, which has a different light emission color.
  • the first wiring patterns 4 a to 4 c and the second wiring patterns 5 a to 5 f electrically connect electronic components, such as the plurality of light-emitting elements 2 or the protective element 9 on the base 1 , with an external power supply not illustrated and apply a voltage from the external power supply to the electronic components. That is, the wiring patterns act as electrodes (i.e., terminals) or part of the electrodes, through which electricity from the outside is conducted.
  • the materials of metal members constituting the wiring patterns are not particularly limited.
  • the wiring patterns are formed of such that metal or an alloy layer, for which the main ingredient is made of W, Mo, Ti, Ni, Au, Cu, Ag, Pd, Rh, Pt, and Sn as the materials of the wiring patterns formed into ceramics, is arranged on the base.
  • the wiring patterns are formed by vapor deposition, sputtering, or printing method and further being plated thereon. In view of little degradation and the adhesion to the bonding member, it is preferable to use a metal, for which the main ingredient is made of Au, be used on the uppermost surface of the wiring patterns.
  • the thickness of the wiring patterns is not particularly limited, and the number of wires to be connected, the number of light-emitting elements to be mounted, power to be supplied, or the like can be appropriately selected according to purpose and use.
  • a positioning mark, a mark representing polarity, and patterns for measuring a temperature may be concurrently formed together.
  • the anode mark AM and the patterns TP for measuring a temperature are exemplified in FIG. 1 .
  • part of the wiring patterns is covered with the light reflective resins 6 a and 6 b . Accordingly, even in the case of using Au that is prone to absorb light depending on the wavelengths, the light emitted from the light-emitting elements is reflected by the light reflective resins 6 a and 6 b without reaching the wiring patterns. Consequently, loss in light emission can be alleviated, and the efficiency of light extraction in the light-emitting device 100 can be improved.
  • the wires 12 are members that electrically connect between the wiring patterns and the electrodes of the light-emitting elements 2 , between the electrodes of the light-emitting elements 2 , and between the wiring patterns.
  • metallic lines made of Au, Cu, Ag, Pt, Al or an alloy of the aforementioned metal can be used.
  • Au which is not easily broken by the stress from the sealing members and has good heat resistance.
  • at least the surface of the wires 12 may be constituted of Ag or an alloy of Ag so as to enhance the efficiency of light extraction.
  • the diameter of the wires 12 is preferably in a range from 18 to 30 ⁇ m.
  • the light reflective resins 6 a and 6 b it is preferable to use, for example, a material, in which a light reflection member is contained in the resin having insulation properties.
  • a material, in which a light reflection member is contained in the resin having insulation properties for example, thermosetting resin or thermoplastic resin can be used so as to ensure intensity to some degree. More specifically, the phenol resin, the epoxy resin, the BT resin, the PPA, and the silicone resin can be exemplified.
  • the non-light-emitting device such as a protective element is mounted on the base, the non-light-emitting device is preferably embedded in the light reflective resin because the non-light-emitting device becomes a cause of light absorption. As illustrated in FIGS.
  • the light reflective resin is preferably formed of a frame body having a frame shape, in which the sealing member is to be filled.
  • the frame body can be formed by a drawing method of discharging the resin using a dispenser, a resin printing method, a transfer molding, a compression molding, or the like.
  • the light reflective resin is preferably formed in such a manner as to cover the whole of wiring patterns in the light-emitting areas as illustrated in FIG. 2 .
  • the wire 12 that straddles the first wiring pattern 4 a and connects the second wiring pattern 5 a with the second wiring pattern 5 c is preferably covered with the light reflective resin 6 b , more preferably completely embedded in the light reflective resin 6 b . Accordingly, not only the wires 12 can be protected from dust, water, external forces, or the like, but also the first wiring pattern 4 a and the wire 12 can be prevented from contacting each other, which reduce a risk of short circuit. In the case where the wires 12 are embedded in the light reflective resin 6 b , the highest portion of the wires 12 is lower than the height of the light reflective resin 6 b in the height direction.
  • wire 12 that connects the second wiring pattern 5 e with the second wiring pattern 5 f is also preferably covered with the light reflective resin 6 b.
  • the first sealing member 7 and the second sealing member 8 are preferably made of a material that has electrical insulation properties, allows the light emitted from the light-emitting elements to transmit, and has fluidity before solidification.
  • the light transmissivity of the sealing member is preferably 70 percent or more.
  • the light transmissive resin are silicone resin, silicone modified resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, or hybrid resin that includes one or more of the aforementioned resins are included.
  • the silicone resin has good characteristic in light resistance and heat resistance and has little volume contraction after the solidification, which is preferable.
  • the first sealing member 7 and/or the second sealing member 8 may include the wavelength conversion member that is excited by at least part of the light emitted from the light-emitting elements and emits light having a wavelength different from that of the light emitted from the light-emitting elements.
  • the representative wavelength conversion member a phosphor or a quantum dot is included.
  • blue-color light-emitting elements are used as the first light-emitting element group 10 and the second light-emitting element group 11 , and a yellow-color phosphor is contained in the first sealing member 7 , and the yellow-color phosphor and a red-color phosphor are contained in the second sealing member 8 , thereby allowing the first light-emitting unit to emit white light and the second light-emitting unit to emit warm white light.
  • phosphors of one type may be used, or phosphors of two or more types may be used. Any of known phosphors may be used as phosphors for LEDs. For example, phosphors of two types, which have a different particle diameter and light-emitting color, may be used. Thus, the phosphors of plural types that have a different light-emitting color are used, so that color reproduction and color rendering properties can be improved.
  • yellow-to-green color phosphors for example, yttrium aluminum garnet based phosphors (YAG based phosphors) and lutetium aluminum garnet based phosphors (LAG based phosphors) can be used.
  • YAG based phosphors yttrium aluminum garnet based phosphors
  • LAG based phosphors lutetium aluminum garnet based phosphors
  • green color phosphors for example, chlorosilicate phosphors and ⁇ sialon phosphors can be used.
  • red color phosphors for example, SCASN based phosphors such as (Sr, Ca)AlSiN3:Eu, CASN based phosphors such as CaAlSiN3:Eu, and KSF based phosphors such as SrAlSiN3:Eu and K2SiF6:Mn can be used, but not limited to these.
  • SCASN based phosphors such as (Sr, Ca)AlSiN3:Eu
  • CASN based phosphors such as CaAlSiN3:Eu
  • KSF based phosphors such as SrAlSiN3:Eu and K2SiF6:Mn can be used, but not limited to these.
  • the blue-color light-emitting elements are used as the light-emitting elements 2 , and the YAG based phosphor and the SCASN based phosphor are contained in the first sealing member, and the YAG based phosphor is contained in the second sealing member.
  • the first light-emitting unit can emit the light having the color temperature of approximately 2700 K
  • the second light-emitting unit can emit the light having the color temperature of approximately 5000 K
  • the light-emitting device can consequently emit the light having the color temperatures in a range from approximately 2700 to 5000 K by mixing the light of the first light-emitting unit and the second light-emitting unit.
  • the sealing members may further include additives such as a filler and a diffusing agent.
  • additives such as a filler and a diffusing agent.
  • SiO2, TiO2, and the like may be used as the dispersing agent.
  • a third light-emitting unit may be provided on the outer side of the second light-emitting unit.
  • the light-emitting device can be utilized for various lighting apparatuses, light sources of the backlight of the liquid crystal display, large-size displays, various display devices for advertisements or destination guide, and further, image reading devices such as digital video cameras, facsimile machines, copying machines, and scanners, and projector devices.

Abstract

A light-emitting device includes a base; wiring patterns formed on the base; and light-emitting elements arranged on the base and/or the wiring patterns. The light-emitting elements include: a first group of light-emitting elements that are covered with a first sealing member and constitute a first light-emitting unit, and a second group of light-emitting elements that are covered with a second sealing member and constitute a second light-emitting unit. The wiring patterns include first wiring patterns that drive the first light-emitting unit, and second wiring patterns that drive the second light-emitting unit. The second wiring patterns are separated from each other such that at least one of the first wiring patterns is interposed between adjacent ones of the second wiring patterns. A wire connects said adjacent ones of the second wiring patterns.

Description

CROSS-REFERENCE TO RELATED APPLICATION
This application claims priority to Japanese Patent Application No. 2015-054369, filed on Mar. 18, 2015. The entire disclosure of Japanese Patent Application No. 2015-054369 is hereby incorporated by reference.
BACKGROUND
Technical Field
The present disclosure relates to a light-emitting device.
Discussion of the Background
Conventionally, there have been known light-emitting devices constituted such that white light is emitted by use of light-emitting elements that emit blue light and phosphorous materials that are excited by absorbing part of the blue light and emit light having longer wavelengths. As for the light-emitting devices above, there have been known light-emitting devices in which a plurality of light-emitting units are concentrically provided, and the light-emitting units can simultaneously emit light, as described, for example, in Japanese Unexamined Patent Application Publication No. 2014-82236 (“Patent Literature 1”).
SUMMARY
A light-emitting device according to one embodiment includes a base, a wiring pattern formed on the base, and a plurality of light-emitting elements arranged on the base or the wiring pattern, and the plurality of light-emitting elements include a first light-emitting element group that is covered with a first sealing member and constitutes a first light-emitting unit, and a second light-emitting element group that is covered with a second sealing member formed in such a manner as to surround the first sealing member and that constitutes a second light-emitting unit, and the wiring pattern includes first wiring patterns that drive the first light-emitting element group, and second wiring patterns that drive the second light-emitting element group, and the second wiring patterns are separated from each other in such a manner that the first wiring pattern is interposed therebetween, and a wire connects the second wiring patterns separated from each other so as to straddle the first wiring pattern.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic front view illustrating the entire constitution of a light-emitting device according to a first embodiment of the present invention.
FIG. 2 is a schematic front view illustrating the constitution of the light-emitting device according to the first embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view taken along a line A-A in FIG. 1.
DESCRIPTION
Hereinafter, embodiments will be described referring to drawings. However, the embodiments described below are provided for the purpose of providing examples of the technical concept described in the present disclosure, and unless specifically stated otherwise, the present disclosure is not limited to embodiments described below. Also, disclosure related to one embodiment can be applied to other embodiments.
The magnitude and/or positional relationship of members illustrated in each drawing may be exaggerated so as to clarify the description. In the drawings, “X” direction is also referred to as “lateral” direction, “Y” direction as “longitudinal” direction, and “Z” direction as “up-and-down” direction or “height (thickness)” direction.
First Embodiment
A light-emitting device 100 according to a first embodiment will be described referring to FIGS. 1 to 3. It is noted that, for convenience, light reflective resins 6 a and 6 b in FIG. 2 are illustrated as being see-through, and the external shapes thereof are represented by a line. Sealing members (a first sealing member 7 and a second sealing member 8) are also illustrated as being see-through.
As illustrated in FIGS. 1 and 2, the light-emitting device 100 according to the present embodiment includes a base 1, wiring patterns formed on the base 1, and a plurality of light-emitting elements 2 (herein, the number of light-emitting elements is 66) arranged on the base 1. The light-emitting elements 2 include a first light-emitting element group 10 (the light-emitting elements encircled in a dotted line in FIG. 2, and the number of light-emitting elements is 33) that is covered with the first sealing member 7 and that constitutes a first light-emitting unit, and a second light-emitting element group 11 (the light-emitting elements encircled in a dotted line in FIG. 2, and the number of light-emitting elements is 33) that is covered with the second sealing member 8 formed in such a manner as to surround the first sealing member 7 and that constitutes a second light-emitting unit.
The wiring patterns are concentrically formed as illustrated in FIG. 2 and include first wiring patterns 4 a to 4 c that are formed along the first light-emitting element group 10 and drive the first light-emitting element group 10, and second wiring patterns 5 a to 5 f that are formed along the second light-emitting element group 11 and drive the second light-emitting element group 11. The first wiring patterns 4 a to 4 c and the second wiring patterns 5 a to 5 f each include an arc-shaped portion, and an inner-side circle is formed by the first wiring patterns 4 a to 4 c, and an outer-side circle is formed by the second wiring patterns 5 a to 5 f Also, the second wiring patterns 5 a and 5 c are separated from each other and arranged between which the first wiring pattern 4 a is interposed, and a wire 12 connects the second wiring patterns 5 a and 5 c so as to straddle the first wiring pattern 4 a. Furthermore, the wire 12 connects the second wiring patterns 5 e and 5 f so as to straddle the first wiring pattern 4 b.
Patent Literature 1 does not explicitly disclose wiring patterns in the case where each light-emitting unit emits light. For example, in the case where colors are mixed by adjusting the amount of light emission of each light-emitting unit, two-system independent circuits are required. Accordingly, in the case of what is called a single-sided board on which wiring patterns are provided only on the surface of a base, it is difficult to form the wiring patterns. Although a multilayer board can be used, the multilayer board necessitates an increase in cost, and therefore further reduction in cost is desired.
An object of the present disclosure is to provide a light-emitting device that can independently drive a plurality of light-emitting units even in the case of using a single-sided board.
The first wiring pattern 4 a passes between the second wiring patterns 5 a and 5 c in such a manner as to be drawn out from the inner side to the outer side in a plan view and extends to the end portion of the base 1. The first wiring pattern 4 a includes a pad portion (electric supply portion) at an end portion far away from the light-emitting elements of the first light-emitting element group 10, and the first wiring pattern 4 b also includes the pad portion (electric supply portion) in a similar manner. The wire 12 connects the end portions of the second wiring patterns 5 a and 5 c in such a manner as to extend in the direction approximately orthogonal to the direction that the second wiring pattern 5 a is drawn out. In other words, the wire 12 extends along the shape of a frame body formed by the light reflective resin 6 b. Also, the length of the wire 12 is not particularly limited as long as the wire 12 is long enough to straddle the first wiring pattern 4 a and connect the second wiring pattern 5 a with the second wiring pattern 5 c.
Thirty three light-emitting elements of the first light-emitting element group 10, are connected in series for each group of eleven light-emitting elements, and the three lines respectively made of the light-emitting elements connected in series are connected in parallel (three lines respectively made of eleven light-emitting elements connected in series are connected in parallel). Specifically, the electrodes of the adjacent light-emitting elements 2 are connected in series with the wires 12, and further the light-emitting elements 2, of which the both ends (a starting point and an end point) are connected in series, are respectively electrically connected to the first wiring patterns 4 a and 4 b by the wires 12.
In the first light-emitting element group 10, the plurality of light-emitting elements 2 are circularly placed in the central area of the base 1, and the first wiring patterns 4 a and 4 b that include the arc-shaped portion formed in such a manner as to surround the first light-emitting element group 10 are arranged. The first wiring pattern 4 c, on which a protective element 9 is mounted, is arranged between the first wiring patterns 4 a and 4 b, and the first wiring pattern 4 c is electrically connected with the first wiring patterns 4 a and 4 b by the wires 12 so as to establish inverse-parallel connection between the protective element 9 and the first light-emitting element group 10.
The first light-emitting element group 10, as described above, is covered with the first sealing member 7, and the light reflective resin 6 a is formed in such a manner as to cover the arc-shaped portions of the first wiring patterns 4 a and 4 b and the first wiring pattern 4 c. The first light-emitting element group 10 is surrounded by the light reflective resin 6 a, and the first sealing member 7 is filled in this surrounded area, and a portion covered with the first sealing member 7 constitutes the first light-emitting unit.
In the second light-emitting element group 11, the light-emitting elements 2 are circularly arranged along the circumference of the first sealing member 7. As is the same with the first light-emitting element group 10, in the second light-emitting element group 11, three lines made of eleven light-emitting elements connected in series are connected in parallel. Specifically, the electrodes of the adjacent light-emitting elements 2 are connected in series by the wires 12, and further the light-emitting elements 2, of which the both ends (a starting point and an end point) are connected in series, are respectively electrically connected to the second wiring patterns 5 c and 5 e, the second wiring patterns 5 f and 5 a, and the second wiring patterns 5 b and 5 a by the wires 12.
The second light-emitting element group 11 is arranged in such a manner as to surround the first sealing member 7. Also, the second light-emitting element group 11 is covered with the second sealing member 8 and constitutes the second light-emitting unit. Herein, the light reflective resin 6 b is formed so as to cover the arc-shaped portions of the second wiring patterns 5 a and 5 b, and the second wiring patterns 5 c, 5 d, 5 e, and 5 f. The second light-emitting element group 11 is surrounded by the light reflective resin 6 b, and the second sealing member 8 is filled in the area surrounded by the light reflective resins 6 a and 6 b.
In other words, as illustrated in FIG. 1, the first sealing member 7 and the second sealing member 8 are separated from each other by the light reflective resin 6 a and constitute the first light-emitting unit and the second light-emitting unit. The first light-emitting unit and the second light-emitting unit are concentrically formed.
The first wiring patterns 4 a and 4 b and the second wiring patterns 5 a and 5 b act as external terminal electrodes, so that approximately rectangular pad portions (electric supply portions) are formed in the four corners of the base 1 in such a manner that the wiring patterns are widened in a plan view as illustrated in FIGS. 1 and 2. An anode mark AM that indicates an anode is formed on each of the first wiring pattern 4 a and the second wiring pattern 5 a, each of which functions as a positive electrode. Each of the first wiring pattern 4 b and the second wiring pattern 5 b serves as a cathode. With this structure, the light-emitting device 100 includes a two-system circuit for the first wiring patterns and the second wiring patterns and allows the light-emitting elements of the first light-emitting element group 10 and the second light-emitting element group 11 to separately light up. Accordingly, it is not necessary to form structure in which the wiring patters are laid on two or more layers. Even in the case where a single-sided board is used, the first light-emitting unit and the second light-emitting unit can independently light up.
In the case where the first light-emitting unit and the second light-emitting unit emit the light of the same color, light-emitting areas can be selected by lighting up any one of the light-emitting units or lighting up both light-emitting units. For example, in the case where the light having a small light-emitting diameter needs to be emitted, only the first light-emitting unit lights up, and in the case where the light having a large light-emitting diameter needs to be emitted, the first light-emitting unit and the second light-emitting unit simultaneously light up.
Also, the emission spectra or color temperatures of the first light-emitting unit and the second light-emitting unit may differ. In this case, the first light-emitting unit and the second light-emitting unit emit different light-emitting colors, and the light of the different light-emitting colors is mixed, thereby obtaining a desired color tone. For example, the first light-emitting unit and the second light-emitting unit each emit light of different colors such as a cold color and a warm color, so that the light-emitting device can emit the light of various color tones in range from warm white color to daylight color. The light emission colors of the first light-emitting element group 10 and the second light-emitting element group 11 may differ, or the types or compounding ratio of wavelength conversion members of the first sealing member 7 and the second sealing member 8 may differ, in order to allow the first light-emitting unit and the second light-emitting unit to have different light emission colors.
The areas of the first light-emitting unit and the second light-emitting unit in a plan view can be formed with a desired area ratio depending on use or color tone. In the examples illustrated in FIGS. 1 to 3, the areas of the first light-emitting unit and the second light-emitting unit are formed in approximately equal size. In the present embodiment, the case where the first light-emitting unit and the second light-emitting unit are concentrically arranged has been described, but in a plan view, the shapes of the first light-emitting unit and the second light-emitting unit are not limited to concentrically shaped units, as long as the first light-emitting unit is arranged on the inner side, and the second light-emitting unit is arranged on its outer side. For example, the external shapes of the first light-emitting unit and the second light-emitting unit in a plan view may be formed in any shape such as a circle, an oval, a square, and a hexagon. In particular, it is preferable that the first light-emitting unit and the second light-emitting unit be similar in shape in a concentric manner.
(Base)
The base 1 on which electronic components such as the light-emitting elements 2 and the protective element 9 are to be placed includes the wiring patterns on the surface thereof. The base 1, as illustrated in FIGS. 1 and 3, is formed in a rectangular flat shape. A flat shape is preferable in term of reduction in cost, but the base 1 may include recess at sections where the light-emitting elements are to be placed. The size of the base 1 is not particularly limited but can be appropriately selected depending on purpose and use in terms of the number of light-emitting elements 2 and the intervals of arrangement, light-emitting areas, or the like.
As the materials of the base 1, it is preferable to use materials that have insulation properties and less likely to penetrate through the light discharged from the light-emitting elements or the light from the outside. Also, it is preferable to use materials having intensity to some degree. Specifically, the materials include ceramics (Al2O3, AlN, and the like), or resin such as phenol resin, epoxy resin, polyimide resin, BT resin, and polyphthalamide (PPA). A reflection member may be provided on the mounting surface of the light-emitting elements so as to enhance light reflectivity. The reflection member, for example, is made of the mixture of particles having light reflective properties such as titanium oxide (TiO2) and a binder of organic or inorganic matter, which corresponds to what is called white resist, white ink, or ceramics ink. As the binder of the organic matter, it is particularly preferable to use silicone resin having good heat resistance and light resistance. Accordingly, the light is reflected on the surface of the base, so that the light-emitting device that has the high efficiency of light extraction can be achieved.
(Light-Emitting Element)
The light-emitting element 2 is a semiconductor element that emits light by applying a voltage. As illustrated in FIG. 2, the plurality of light-emitting elements 2 are arranged on the upper surface of the base 1, and the whole of the plurality of light-emitting elements 2 constitutes the light-emitting units of the light-emitting device 100. The light-emitting elements 2 are bonded to the base 1 or the wiring patterns by bonding members. As the bonding method, for example, a bonding method in which resin or solder paste is used can be applied. As illustrated in FIG. 2, the light-emitting elements 2 may be bonded in such a manner that a p-electrode and an n-electrode are positioned on the upper surface, or may be bonded in such a manner that the p-electrode and the n-electrode are positioned on the lower surface, with what is called a flip chip bonding.
The light-emitting elements 2, as illustrated in FIG. 2, are each formed in a rectangular shape. As the light-emitting element, specifically, it is preferable to use a light emitting diode, and the light emitting diode having an arbitrary wavelength can be selected according to use. For example, ZnSe, nitride semiconductors and GaP can be used for the light-emitting element that emits blue light (wavelengths between 430 nm and 490 nm) or green light (wavelengths between 490 nm and 570 nm). Also GaAlAs and AlInGaP can be used for the light-emitting element that emit red light (wavelengths between 620 nm and 750 nm).
Also, in the case where the wavelength conversion members are contained in the first sealing member 7 and the second sealing member 8, it is preferable to use the nitride semiconductors that can emit the light of a short wavelength that can efficiently excite the wavelength conversion members. However, the composition of an ingredient, the light emission color, and size of the light-emitting elements 2 are not limited to the description above, but can be appropriately selected depending on purposes. Also, the light-emitting elements 2 can be constituted of elements that output not only light in a visible light area but also ultraviolet rays or infrared rays.
The light-emitting elements constituting the first light-emitting element group 10 and the light-emitting elements constituting the second light-emitting element group 11 may be of a same type, or may be of a different type, for example, which has a different light emission color.
(Wiring Pattern)
The first wiring patterns 4 a to 4 c and the second wiring patterns 5 a to 5 f electrically connect electronic components, such as the plurality of light-emitting elements 2 or the protective element 9 on the base 1, with an external power supply not illustrated and apply a voltage from the external power supply to the electronic components. That is, the wiring patterns act as electrodes (i.e., terminals) or part of the electrodes, through which electricity from the outside is conducted.
The materials of metal members constituting the wiring patterns are not particularly limited. For example, the wiring patterns are formed of such that metal or an alloy layer, for which the main ingredient is made of W, Mo, Ti, Ni, Au, Cu, Ag, Pd, Rh, Pt, and Sn as the materials of the wiring patterns formed into ceramics, is arranged on the base. Specifically, the wiring patterns are formed by vapor deposition, sputtering, or printing method and further being plated thereon. In view of little degradation and the adhesion to the bonding member, it is preferable to use a metal, for which the main ingredient is made of Au, be used on the uppermost surface of the wiring patterns. The thickness of the wiring patterns is not particularly limited, and the number of wires to be connected, the number of light-emitting elements to be mounted, power to be supplied, or the like can be appropriately selected according to purpose and use.
When forming the wiring patterns, a positioning mark, a mark representing polarity, and patterns for measuring a temperature may be concurrently formed together. The anode mark AM and the patterns TP for measuring a temperature are exemplified in FIG. 1.
Herein, part of the wiring patterns, as illustrated in FIGS. 1 and 2, is covered with the light reflective resins 6 a and 6 b. Accordingly, even in the case of using Au that is prone to absorb light depending on the wavelengths, the light emitted from the light-emitting elements is reflected by the light reflective resins 6 a and 6 b without reaching the wiring patterns. Consequently, loss in light emission can be alleviated, and the efficiency of light extraction in the light-emitting device 100 can be improved.
(Wire)
The wires 12 are members that electrically connect between the wiring patterns and the electrodes of the light-emitting elements 2, between the electrodes of the light-emitting elements 2, and between the wiring patterns. As the wires 12, metallic lines made of Au, Cu, Ag, Pt, Al or an alloy of the aforementioned metal can be used. As the wires 12, in particular, it is preferable to use Au, which is not easily broken by the stress from the sealing members and has good heat resistance. Alternatively, at least the surface of the wires 12 may be constituted of Ag or an alloy of Ag so as to enhance the efficiency of light extraction. Also, the diameter of the wires 12 is preferably in a range from 18 to 30 μm.
(Light Reflective Resin)
As for the light reflective resins 6 a and 6 b, it is preferable to use, for example, a material, in which a light reflection member is contained in the resin having insulation properties. For example, thermosetting resin or thermoplastic resin can be used so as to ensure intensity to some degree. More specifically, the phenol resin, the epoxy resin, the BT resin, the PPA, and the silicone resin can be exemplified. In the case where a non-light-emitting device such as a protective element is mounted on the base, the non-light-emitting device is preferably embedded in the light reflective resin because the non-light-emitting device becomes a cause of light absorption. As illustrated in FIGS. 1 to 3, the light reflective resin is preferably formed of a frame body having a frame shape, in which the sealing member is to be filled. The frame body can be formed by a drawing method of discharging the resin using a dispenser, a resin printing method, a transfer molding, a compression molding, or the like.
In the case where the light reflectance ratio of the light reflective resin is higher than that of the wiring patterns, the light reflective resin is preferably formed in such a manner as to cover the whole of wiring patterns in the light-emitting areas as illustrated in FIG. 2.
The wire 12 that straddles the first wiring pattern 4 a and connects the second wiring pattern 5 a with the second wiring pattern 5 c is preferably covered with the light reflective resin 6 b, more preferably completely embedded in the light reflective resin 6 b. Accordingly, not only the wires 12 can be protected from dust, water, external forces, or the like, but also the first wiring pattern 4 a and the wire 12 can be prevented from contacting each other, which reduce a risk of short circuit. In the case where the wires 12 are embedded in the light reflective resin 6 b, the highest portion of the wires 12 is lower than the height of the light reflective resin 6 b in the height direction. Also, it may be constituted such that part of the wires 12 is exposed from the light reflective resin 6 b, and for example, it may be such that the highest portion of the wires 12 is higher than the height of the light reflective resin 6 b in the height direction. The wire 12 that connects the second wiring pattern 5 e with the second wiring pattern 5 f is also preferably covered with the light reflective resin 6 b.
(Sealing Member)
The first sealing member 7 and the second sealing member 8 are preferably made of a material that has electrical insulation properties, allows the light emitted from the light-emitting elements to transmit, and has fluidity before solidification. The light transmissivity of the sealing member is preferably 70 percent or more. Examples of the light transmissive resin are silicone resin, silicone modified resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, or hybrid resin that includes one or more of the aforementioned resins are included. Among them, the silicone resin has good characteristic in light resistance and heat resistance and has little volume contraction after the solidification, which is preferable.
(Wavelength Conversion Member)
The first sealing member 7 and/or the second sealing member 8 may include the wavelength conversion member that is excited by at least part of the light emitted from the light-emitting elements and emits light having a wavelength different from that of the light emitted from the light-emitting elements. As the representative wavelength conversion member, a phosphor or a quantum dot is included.
For example, blue-color light-emitting elements are used as the first light-emitting element group 10 and the second light-emitting element group 11, and a yellow-color phosphor is contained in the first sealing member 7, and the yellow-color phosphor and a red-color phosphor are contained in the second sealing member 8, thereby allowing the first light-emitting unit to emit white light and the second light-emitting unit to emit warm white light.
(Phosphor)
As for the phosphor used as the wavelength conversion member, phosphors of one type may be used, or phosphors of two or more types may be used. Any of known phosphors may be used as phosphors for LEDs. For example, phosphors of two types, which have a different particle diameter and light-emitting color, may be used. Thus, the phosphors of plural types that have a different light-emitting color are used, so that color reproduction and color rendering properties can be improved.
As yellow-to-green color phosphors, for example, yttrium aluminum garnet based phosphors (YAG based phosphors) and lutetium aluminum garnet based phosphors (LAG based phosphors) can be used. As green color phosphors, for example, chlorosilicate phosphors and β sialon phosphors can be used. As for red color phosphors, for example, SCASN based phosphors such as (Sr, Ca)AlSiN3:Eu, CASN based phosphors such as CaAlSiN3:Eu, and KSF based phosphors such as SrAlSiN3:Eu and K2SiF6:Mn can be used, but not limited to these.
For example, for general lighting, it may be such that the blue-color light-emitting elements are used as the light-emitting elements 2, and the YAG based phosphor and the SCASN based phosphor are contained in the first sealing member, and the YAG based phosphor is contained in the second sealing member. Accordingly, the first light-emitting unit can emit the light having the color temperature of approximately 2700 K, the second light-emitting unit can emit the light having the color temperature of approximately 5000 K, and the light-emitting device can consequently emit the light having the color temperatures in a range from approximately 2700 to 5000 K by mixing the light of the first light-emitting unit and the second light-emitting unit.
In addition to the aforementioned wavelength conversion members, the sealing members may further include additives such as a filler and a diffusing agent. For example, SiO2, TiO2, and the like may be used as the dispersing agent.
Hereinbefore, the case where the two light-emitting units are provided has been described, but the number of light-emitting units may be further increased. For example, a third light-emitting unit may be provided on the outer side of the second light-emitting unit.
The light-emitting device according to the present disclosure can be utilized for various lighting apparatuses, light sources of the backlight of the liquid crystal display, large-size displays, various display devices for advertisements or destination guide, and further, image reading devices such as digital video cameras, facsimile machines, copying machines, and scanners, and projector devices.
It is to be understood that although the present invention has been described with regard to preferred embodiments thereof, various other embodiments and variants may occur to those skilled in the art, which are within the scope and spirit of the invention, and such other embodiments and variants are intended to be covered by the following claims.

Claims (8)

What is claimed is:
1. A light-emitting device comprising:
a base;
a plurality of wiring patterns formed on the base, the wiring patterns being formed using at least one method selected from the group consisting of vapor deposition, sputtering, printing, and plating;
a plurality of light-emitting elements arranged on the base and/or the wiring patterns; and
a plurality of wires;
wherein the plurality of light-emitting elements include:
a first group of light-emitting elements that are covered with a first sealing member and constitute a first light-emitting unit, and
a second group of light-emitting elements that are covered with a second sealing member and constitute a second light-emitting unit, the second sealing member surrounding the first sealing member;
wherein the plurality of wiring patterns include:
a plurality of first wiring patterns that drive the light-emitting elements of the first light-emitting unit, and
a plurality of second wiring patterns that drive the light-emitting elements of the second light-emitting unit;
wherein the plurality of wires include:
a plurality of first wires that connect the first wiring patterns to one another, and connect the light-emitting elements of the first light-emitting unit to one another, and
a plurality of second wires that connect the second wiring patterns to one another, and connect the light-emitting elements of the second light-emitting unit to one another,
wherein the second wiring patterns are separated from each other such that at least one of the first wiring patterns is interposed between adjacent ones of the second wiring patterns; and
wherein at least one of the second wires connects said adjacent ones of the second wiring patterns and straddles said at least one first wiring pattern that is interposed between said adjacent ones of the second wiring patterns.
2. The light-emitting device according to claim 1, wherein emission spectra of the first light-emitting unit and the second light-emitting unit differ.
3. The light-emitting device according to claim 1, wherein the first sealing member and the second sealing member each contain a wavelength conversion member.
4. The light-emitting device according to claim 1, wherein color temperatures of the first light-emitting unit and the second light-emitting unit differ.
5. The light-emitting device according to claim 1, further comprising:
a light reflective resin that separates the first sealing member from the second sealing member, wherein said at least one of the second wires is covered with the light reflective resin.
6. The light-emitting device according to claim 1, wherein the first light-emitting unit and the second light-emitting unit are concentrically formed.
7. The light-emitting device according to claim 1,
wherein each of the first wiring patterns and the second wiring patterns includes an integral pad portion, and
wherein, in a plan view, each of the pad portions is arranged at a respective corner of the base.
8. The light-emitting device according to claim 1, further comprising a third group of light-emitting elements that constitute a third light-emitting unit, the third light-emitting unit being located on an outer side of the second light-emitting unit.
US15/072,889 2015-03-18 2016-03-17 Light-emitting device having first and second wiring patterns Active US9893038B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-054369 2015-03-18
JP2015054369A JP6511887B2 (en) 2015-03-18 2015-03-18 Light emitting device

Publications (2)

Publication Number Publication Date
US20160276553A1 US20160276553A1 (en) 2016-09-22
US9893038B2 true US9893038B2 (en) 2018-02-13

Family

ID=56925639

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/072,889 Active US9893038B2 (en) 2015-03-18 2016-03-17 Light-emitting device having first and second wiring patterns

Country Status (2)

Country Link
US (1) US9893038B2 (en)
JP (1) JP6511887B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10495263B2 (en) * 2017-10-27 2019-12-03 Consumer Lighting (U.S.), Llc LED filament lamps with white filament appearance

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019106474A (en) * 2017-12-13 2019-06-27 シチズン電子株式会社 Light emitting device
JP6923808B2 (en) * 2018-06-22 2021-08-25 日亜化学工業株式会社 Light emitting device and its manufacturing method
JP6879270B2 (en) * 2018-07-20 2021-06-02 日亜化学工業株式会社 Light emitting device
JP7223646B2 (en) * 2019-06-25 2023-02-16 シーシーエス株式会社 Ring type light injection device
WO2021182413A1 (en) * 2020-03-10 2021-09-16 シチズン電子株式会社 Light-emitting device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110116252A1 (en) * 2009-11-13 2011-05-19 Makoto Agatani Light-emitting device and method for producing the same
WO2013038854A1 (en) 2011-09-14 2013-03-21 シャープ株式会社 Light emitting apparatus and method for manufacturing same
JP2013153081A (en) 2012-01-25 2013-08-08 Sharp Corp Light-emitting device, lighting fixture, and method for manufacturing light-emitting device
US20140055996A1 (en) 2012-08-27 2014-02-27 Citizen Holdings Co., Ltd. Lighting device
JP2014082236A (en) 2012-10-12 2014-05-08 Citizen Electronics Co Ltd Led light emitting device
JP2014086694A (en) 2012-10-26 2014-05-12 Sharp Corp Light-emitting device and manufacturing method of light-emitting device
US20140175595A1 (en) 2012-12-26 2014-06-26 Nichia Corporation Semiconductor device and method for manufacturing the same
US20140217428A1 (en) * 2013-02-07 2014-08-07 Everlight Electronics Co., Ltd. Light-Emitting Device With Multi-Color Temperature And Multi-Loop Configuration

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07219452A (en) * 1994-02-01 1995-08-18 Hitachi Media Electron:Kk Led display device
JP4062640B2 (en) * 1998-02-25 2008-03-19 スタンレー電気株式会社 LED display device
JP2013182898A (en) * 2012-02-29 2013-09-12 Panasonic Corp Light-emitting device and luminaire incorporating the same
US9048367B2 (en) * 2012-06-04 2015-06-02 Brightek Optoelectronic Co., Ltd. Multichip package structure for generating a symmetrical and uniform light-blending source
JP6277508B2 (en) * 2012-12-19 2018-02-14 パナソニックIpマネジメント株式会社 Light emitting module and lighting device
JP2014154641A (en) * 2013-02-06 2014-08-25 Stanley Electric Co Ltd LED package
JP6377953B2 (en) * 2013-05-20 2018-08-22 四国計測工業株式会社 LED lighting module and LED lighting device
JP6139976B2 (en) * 2013-05-21 2017-05-31 シチズン電子株式会社 LED light emitting device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110116252A1 (en) * 2009-11-13 2011-05-19 Makoto Agatani Light-emitting device and method for producing the same
WO2013038854A1 (en) 2011-09-14 2013-03-21 シャープ株式会社 Light emitting apparatus and method for manufacturing same
JP2013062438A (en) 2011-09-14 2013-04-04 Sharp Corp Light emitting device for plant cultivation and manufacturing method of the same
US20140340890A1 (en) 2011-09-14 2014-11-20 Sharp Kabushiki Kaisha Light emitting apparatus and method for manufacturing same
JP2013153081A (en) 2012-01-25 2013-08-08 Sharp Corp Light-emitting device, lighting fixture, and method for manufacturing light-emitting device
US20140055996A1 (en) 2012-08-27 2014-02-27 Citizen Holdings Co., Ltd. Lighting device
JP2014045089A (en) 2012-08-27 2014-03-13 Citizen Electronics Co Ltd Led light emitting device
JP2014082236A (en) 2012-10-12 2014-05-08 Citizen Electronics Co Ltd Led light emitting device
JP2014086694A (en) 2012-10-26 2014-05-12 Sharp Corp Light-emitting device and manufacturing method of light-emitting device
US20140175595A1 (en) 2012-12-26 2014-06-26 Nichia Corporation Semiconductor device and method for manufacturing the same
JP2014143396A (en) 2012-12-26 2014-08-07 Nichia Chem Ind Ltd Semiconductor device and manufacturing method of the same
US20140217428A1 (en) * 2013-02-07 2014-08-07 Everlight Electronics Co., Ltd. Light-Emitting Device With Multi-Color Temperature And Multi-Loop Configuration

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10495263B2 (en) * 2017-10-27 2019-12-03 Consumer Lighting (U.S.), Llc LED filament lamps with white filament appearance

Also Published As

Publication number Publication date
JP2016174120A (en) 2016-09-29
JP6511887B2 (en) 2019-05-15
US20160276553A1 (en) 2016-09-22

Similar Documents

Publication Publication Date Title
JP7054025B2 (en) Light emitting device
US9893038B2 (en) Light-emitting device having first and second wiring patterns
JP5842813B2 (en) Light emitting device and method for manufacturing light emitting device
JP5768435B2 (en) Light emitting device
US9673364B2 (en) Light emitting device and method of manufacturing the same
JP7208536B2 (en) light emitting device
JP6519135B2 (en) Light emitting device and substrate for light emitting device
JP2010526425A (en) Semiconductor light emitting device, and light source device and illumination system using the same
US20220209080A1 (en) Light emitting device
WO2011129203A1 (en) Light-emitting device
JP2014107307A (en) Light-emitting device
JP5598323B2 (en) Light emitting device and method for manufacturing light emitting device
US9960333B2 (en) Light-emitting device including light-emitting elements connected in series and light-emitting elements connected in parallel
JP6107415B2 (en) Light emitting device
JP2018101753A (en) Light-emitting device
JP5724573B2 (en) Light emitting device
JP2020061543A (en) Light-emitting device
WO2018220932A1 (en) Semiconductor module, display device, and method for manufacturing semiconductor module
JP6326830B2 (en) Light emitting device and lighting device including the same
JP6773166B2 (en) Light emitting device
JP7041375B2 (en) Light emitting device
US11043475B2 (en) Light emitting device and method of manufacturing the light emitting device
JP2017069378A (en) Light-emitting device

Legal Events

Date Code Title Description
AS Assignment

Owner name: NICHIA CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OKUBO, MASAKI;REEL/FRAME:038014/0579

Effective date: 20160317

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4