JP6266307B2 - 発光モジュール - Google Patents
発光モジュール Download PDFInfo
- Publication number
- JP6266307B2 JP6266307B2 JP2013229125A JP2013229125A JP6266307B2 JP 6266307 B2 JP6266307 B2 JP 6266307B2 JP 2013229125 A JP2013229125 A JP 2013229125A JP 2013229125 A JP2013229125 A JP 2013229125A JP 6266307 B2 JP6266307 B2 JP 6266307B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting elements
- module according
- emitting module
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000926 separation method Methods 0.000 claims description 48
- 238000003491 array Methods 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 230000007423 decrease Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000005669 field effect Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/37—Converter circuits
- H05B45/3725—Switched mode power supply [SMPS]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
- H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Led Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
Claims (21)
- ボディーと、
前記ボディー上に配置された複数の発光素子と、
前記複数の発光素子の点灯を制御する点灯制御部と、を含み、
前記複数の発光素子のうち少なくとも三つの隣接する発光素子は、互いに異なる間隔で離隔して配置され、
前記複数の発光素子は、前記ボディー上において一点を中心に放射方向に等距離に配置され、
互いに異なる電力を消費する前記複数の発光素子は、消費電力の偏差に応じて配置された、発光モジュール。 - 前記少なくとも三つの隣接する発光素子の中少なくとも二つの発光素子は、点灯頻度がお互い異なる、請求項1に記載の発光モジュール。
- 前記複数の発光素子は、互いに異なるグループにグルーピングされる、請求項1又は2に記載の発光モジュール。
- 前記グループ間の離隔距離は、前記グループのうちいずれか一つのグループ内の隣接する発光素子間の離隔距離よりも大きい、請求項3に記載の発光モジュール。
- 前記複数の発光素子のうち少なくとも一部は、点灯頻度の順位に従って一定の方向に配列された、請求項1ないし4のいずれかに記載の発光モジュール。
- 前記複数のグループのそれぞれに含まれた発光素子の点灯頻度の順位の和は、同一である、請求項3又は4に記載の発光モジュール。
- 前記複数の発光素子は、前記ボディーの上面を通過するある一つの線を中心に対称形状に配置された、請求項1ないし6のいずれかに記載の発光モジュール。
- 前記複数の発光素子において、前記一つの線を中心に一方に配置された発光素子は、互いに直列接続されて第1発光アレイをなし、
前記一つの線を中心に他方に配置された発光素子は、互いに直列接続されて第2発光アレイをなし、前記点灯制御部は、外部から印加される電源のレベルに比例して前記第1及び第2発光アレイの発光素子を順次点灯させる、請求項7に記載の発光モジュール。 - 前記点灯制御部は、外部から印加される前記電源のレベルに比例して前記第1及び第2発光アレイの発光素子を順次消灯させる、請求項8に記載の発光モジュール。
- 前記複数の発光素子の配置密度は、前記ボディー上において位置によって互いに異なる、請求項1ないし9のいずれかに記載の発光モジュール。
- 前記複数の発光素子の配置密度は、前記ボディー上において均一である、請求項1ないし9のいずれかに記載の発光モジュール。
- 前記複数のグループは、互いに等間隔に離隔して配置された、請求項6に記載の発光モジュール。
- 前記複数のグループは、互いに異なる間隔で離隔して配置された、請求項3に記載の発光モジュール。
- 前記複数のグループのそれぞれの前記複数の発光素子の配置密度は同一である、請求項3に記載の発光モジュール。
- 前記グループのうち少なくとも一つのグループに属する複数の発光素子の点灯順位は互いに同一である、請求項3に記載の発光モジュール。
- 前記グループのうち少なくとも一つのグループに属する発光素子の点灯順位は互いに異なる、請求項3に記載の発光モジュール。
- 前記複数のグループのうち隣接するグループ間の離隔距離は、前記一点を中心に40°〜90°の角度範囲内にある、請求項3に記載の発光モジュール。
- 前記複数のグループのいずれか一つのグループに属する隣接する発光素子間の離隔距離は、前記一点を中心に30°〜80°の角度範囲内にある、請求項3に記載の発光モジュール。
- 前記複数のグループのそれぞれは、一対の発光素子からなる、請求項3に記載の発光モジュール。
- 前記隣接する発光素子間の距離は、前記隣接する発光素子の中心間の距離に該当する、請求項18に記載の発光モジュール。
- 前記複数の発光素子のそれぞれは、
光を放出する発光セルと、
前記ボディー上に配置されて前記発光セルと電気的に接続され、互いに電気的に離隔した第n1及び第n2(ここで、1≦n≦N)リードフレームとを含む、請求項1ないし20のいずれかに記載の発光モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120123757A KR102007403B1 (ko) | 2012-11-02 | 2012-11-02 | 발광 소자 패키지 및 이를 포함하는 조명 유닛 |
KR10-2012-0123757 | 2012-11-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014093301A JP2014093301A (ja) | 2014-05-19 |
JP2014093301A5 JP2014093301A5 (ja) | 2016-12-22 |
JP6266307B2 true JP6266307B2 (ja) | 2018-01-24 |
Family
ID=49513810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013229125A Active JP6266307B2 (ja) | 2012-11-02 | 2013-11-05 | 発光モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US9089015B2 (ja) |
EP (1) | EP2728970B1 (ja) |
JP (1) | JP6266307B2 (ja) |
KR (1) | KR102007403B1 (ja) |
CN (1) | CN103807640A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102024295B1 (ko) | 2013-02-05 | 2019-09-23 | 엘지이노텍 주식회사 | 발광 모듈 |
KR102439761B1 (ko) * | 2017-12-22 | 2022-09-02 | 삼성전자주식회사 | 전자 장치 및 전자 장치의 제조 방법 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AUPQ818100A0 (en) * | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
JP2003068105A (ja) | 2001-08-28 | 2003-03-07 | Patoraito:Kk | 点滅警告表示器 |
US20050169006A1 (en) * | 2004-01-30 | 2005-08-04 | Harvatek Corporation | Led chip lamp apparatus |
CN100353240C (zh) * | 2005-07-25 | 2007-12-05 | 友达光电股份有限公司 | 直下式背光源 |
JP4684073B2 (ja) * | 2005-10-11 | 2011-05-18 | シャープ株式会社 | Ledバックライト装置及び画像表示装置 |
JP2008147575A (ja) | 2006-12-13 | 2008-06-26 | Pearl Denkyu Seisakusho:Kk | 発光ダイオード |
US20090101922A1 (en) | 2007-10-22 | 2009-04-23 | Chu-Hsien Lin | Led arrangement for producing pure monochomatic light |
EP2340186B1 (en) * | 2008-10-20 | 2018-12-19 | Lumileds Holding B.V. | Led light |
KR20120023619A (ko) * | 2009-03-26 | 2012-03-13 | 융 푼 쳉 | Led 조명등 |
TWI558948B (zh) * | 2009-06-16 | 2016-11-21 | 皇家飛利浦有限公司 | 點照明的照明系統 |
US8947014B2 (en) * | 2010-08-12 | 2015-02-03 | Huizhou Light Engine Ltd. | LED switch circuitry for varying input voltage source |
TW201233244A (en) * | 2011-01-31 | 2012-08-01 | Luxul Technology Inc | High brightness LED driving circuit |
US8721097B2 (en) * | 2011-05-19 | 2014-05-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | LED lamp with improved light output |
-
2012
- 2012-11-02 KR KR1020120123757A patent/KR102007403B1/ko active IP Right Grant
-
2013
- 2013-10-23 US US14/060,904 patent/US9089015B2/en active Active
- 2013-10-30 EP EP13190912.9A patent/EP2728970B1/en active Active
- 2013-11-04 CN CN201310537772.4A patent/CN103807640A/zh active Pending
- 2013-11-05 JP JP2013229125A patent/JP6266307B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20140057089A (ko) | 2014-05-12 |
US9089015B2 (en) | 2015-07-21 |
US20140125226A1 (en) | 2014-05-08 |
EP2728970A3 (en) | 2016-09-21 |
EP2728970B1 (en) | 2020-04-29 |
CN103807640A (zh) | 2014-05-21 |
JP2014093301A (ja) | 2014-05-19 |
KR102007403B1 (ko) | 2019-08-05 |
EP2728970A2 (en) | 2014-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9271354B2 (en) | Lighting source and lighting apparatus | |
JP6369784B2 (ja) | 発光装置、及びそれを用いた照明用光源及び照明装置 | |
EP3226313B1 (en) | Light emitting device and lighting device including the same | |
EP2753149B1 (en) | Light emitting module and lighting unit including the same | |
US10234112B2 (en) | Light source module and lighting device having same | |
US8820960B2 (en) | Light emitting device | |
KR20220024354A (ko) | Mjt led를 이용한 백라이트 모듈 및 이를 포함하는 백라이트 유닛 | |
JP5834257B2 (ja) | 可変色発光装置及びそれを用いた照明器具 | |
JP2009206383A (ja) | Ledモジュール及びそれを備えるled点灯装置 | |
JP6266307B2 (ja) | 発光モジュール | |
KR101287901B1 (ko) | 피엔접합 발광소자 조명 장치 | |
KR101099419B1 (ko) | 디밍 선택형 엘이디 램프 모듈 | |
KR100712880B1 (ko) | 색온도 편차를 줄일 수 있는 백색 발광 다이오드 | |
US20120086341A1 (en) | Alternating current led illumination apparatus | |
US10480760B2 (en) | Light source module | |
KR20030008770A (ko) | Led모듈을 적층 형성한 전구 | |
KR20150083248A (ko) | 발광 소자 패키지 | |
CN216249813U (zh) | 光源模组结构、光源模组、照明装置和显示装置 | |
KR102451722B1 (ko) | Mjt led를 이용한 백라이트 모듈 및 이를 포함하는 백라이트 유닛 | |
KR102454170B1 (ko) | 멀티셀 발광 다이오드를 이용한 백라이트 모듈을 포함하는 백라이트 유닛 | |
KR102532362B1 (ko) | 발광소자 패키지 | |
KR101163454B1 (ko) | 광 필터를 이용한 led 조명 장치 | |
KR20140069906A (ko) | 발광 모듈 | |
JP2008004827A (ja) | 光源システム | |
JP2013140873A (ja) | 交流発光ダイオード照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161104 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161104 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170810 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170822 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171108 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171205 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6266307 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |