JP6262753B2 - 定形逐次電力分配用の電力分配器 - Google Patents
定形逐次電力分配用の電力分配器 Download PDFInfo
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- JP6262753B2 JP6262753B2 JP2015540067A JP2015540067A JP6262753B2 JP 6262753 B2 JP6262753 B2 JP 6262753B2 JP 2015540067 A JP2015540067 A JP 2015540067A JP 2015540067 A JP2015540067 A JP 2015540067A JP 6262753 B2 JP6262753 B2 JP 6262753B2
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- Prior art keywords
- generator
- power
- switch
- target
- power distributor
- Prior art date
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- 239000003990 capacitor Substances 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Power Engineering (AREA)
- Direct Current Feeding And Distribution (AREA)
- Control Of Eletrric Generators (AREA)
- Particle Accelerators (AREA)
Description
RD:9オーム
RRC:9オーム
RI:2kオーム
RT:2kオーム
CRC:1μF
CI:3μF
である。
A〜X ターゲット
CI コンデンサ
CRC コンデンサ
RD オーム抵抗器
RI 抵抗器
RRC オーム抵抗器
RT オーム抵抗器
SA〜SX ターゲットスイッチ
SD スイッチ
SI スイッチ
SRC スイッチ
SS スイッチ
SSC スイッチ
ST スイッチ
TVS1 保護ダイオード
TVSS 保護ダイオード
Claims (8)
- 3つ以上のターゲットA、B、C、…、Xへ逐次、電力送出の中断なしに、DC発電機の実質的に一定の電力を分配することに適した電力分配器において、
前記電力分配器が、前記DC発電機の一方の出力端を前記3つ以上のターゲットA、B、C、…、Xの全てに接続する回路を備え、
前記DC発電機の他方の出力端が、オーム抵抗器RTを通った後、前記ターゲットの数に従って分枝し、各ターゲットA、B、C、...、Xが、前記分枝の1つに接続され、
前記分枝が、前記ターゲットにそれぞれ割り当てられたスイッチSA、SB、SC、…、SXを備え、前記スイッチによって、前記割り当てられたターゲットへのラインを遮断することができ、
前記DC発電機が接続されるときは必ず、RC要素の回路が設けられ、前記要素が、スイッチS RC を介して前記DC発電機の両出力端に接続されることを特徴とする電力分配器。 - 前記DC発電機の前記他方の出力端と前記オーム抵抗器RTとの間に、スイッチSTが設けられることを特徴とする、請求項1に記載の電力分配器。
- 前記DC発電機の前記一方の出力端と前記他方の出力端との間に直接接続部を備え、前記直接接続部がスイッチSSCによって遮断されることを特徴とする、請求項2に記載の電力分配器。
- 前記DC発電機が接続されるときは必ず、スイッチSDを介して前記DC発電機の両出力端に接続されるオーム抵抗器RDが設けられることを特徴とする、請求項3に記載の電力分配器。
- 前記DC発電機が接続されるときは必ず、着火を支援する回路が設けられ、前記回路が、スイッチSIと、抵抗器RIと、コンデンサCIとを備え、前記抵抗器RIとコンデンサCIとが互いに並列に接続され、着火を支援する前記回路が、前記DC発電機の両出力端に接続されていることを特徴とする、請求項1又は4に記載の電力分配器。
- 前記DC発電機が接続されるときは必ず、前記DC発電機の両出力端に接続される保護ダイオードTVS1が設けられることを特徴とする、請求項5に記載の電力分配器。
- 前記スイッチの少なくとも1つ、好ましくは前記スイッチの2つ以上、特に好ましくは全ての前記スイッチが、IGBTとして整えられることを特徴とする、請求項6に記載の電力分配器。
- DC発電機と、2つ以上の、スパッタリングカソードとしてのターゲットとを備えるコーティング装置において、前記ターゲットが、請求項6に記載の電力分配器を介して前記DC発電機に接続できることを特徴とするコーティング装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012021346.8A DE102012021346A1 (de) | 2012-11-01 | 2012-11-01 | Leistungsverteiler zur definierten sequenziellen Leistungsverteilung |
DE102012021346.8 | 2012-11-01 | ||
PCT/EP2013/003251 WO2014067650A1 (de) | 2012-11-01 | 2013-10-29 | Leistungsverteiler zur definierten sequenziellen leistungsverteilung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015536386A JP2015536386A (ja) | 2015-12-21 |
JP6262753B2 true JP6262753B2 (ja) | 2018-01-17 |
Family
ID=49596228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015540067A Active JP6262753B2 (ja) | 2012-11-01 | 2013-10-29 | 定形逐次電力分配用の電力分配器 |
Country Status (10)
Country | Link |
---|---|
US (1) | US10074976B2 (ja) |
EP (1) | EP2915181B1 (ja) |
JP (1) | JP6262753B2 (ja) |
KR (1) | KR102085704B1 (ja) |
CN (1) | CN105027255B (ja) |
AR (1) | AR093305A1 (ja) |
CA (1) | CA2892697C (ja) |
DE (1) | DE102012021346A1 (ja) |
RU (1) | RU2666775C2 (ja) |
WO (1) | WO2014067650A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111679621B (zh) * | 2020-07-15 | 2020-12-08 | 南京科远智慧科技集团股份有限公司 | 一种三重冗余中提高电流输出可靠性的电路方法 |
EP3945541A1 (en) * | 2020-07-29 | 2022-02-02 | TRUMPF Huettinger Sp. Z o. o. | Pulsing assembly, power supply arrangement and method using the assembly |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4438463C1 (de) * | 1994-10-27 | 1996-02-15 | Fraunhofer Ges Forschung | Verfahren und Schaltung zur bipolaren pulsförmigen Energieeinspeisung in Niederdruckplasmen |
JP3660018B2 (ja) | 1995-05-17 | 2005-06-15 | 株式会社アルバック | 真空装置の異常放電消滅装置 |
DE19702187C2 (de) * | 1997-01-23 | 2002-06-27 | Fraunhofer Ges Forschung | Verfahren und Einrichtung zum Betreiben von Magnetronentladungen |
JP2002091576A (ja) | 2000-09-13 | 2002-03-29 | Toshiba Corp | 電源装置および電源安定化方法 |
JP4101554B2 (ja) * | 2001-08-17 | 2008-06-18 | 株式会社神戸製鋼所 | スパッタ装置及び方法 |
EP1488444B1 (de) * | 2002-03-15 | 2016-11-02 | Oerlikon Surface Solutions AG, Pfäffikon | Vakuumplasmagenerator |
US6972079B2 (en) | 2003-06-25 | 2005-12-06 | Advanced Energy Industries Inc. | Dual magnetron sputtering apparatus utilizing control means for delivering balanced power |
DE102005017382A1 (de) * | 2005-04-14 | 2006-10-19 | Dorma Gmbh + Co. Kg | Gelenkband für Pendeltüren |
DE102006017382A1 (de) * | 2005-11-14 | 2007-05-16 | Itg Induktionsanlagen Gmbh | Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen |
JP5112921B2 (ja) | 2008-03-21 | 2013-01-09 | 新電元工業株式会社 | スパッタ装置用電源回路 |
JP5429772B2 (ja) | 2008-06-30 | 2014-02-26 | 株式会社アルバック | 電源装置 |
JP2010065240A (ja) | 2008-09-08 | 2010-03-25 | Kobe Steel Ltd | スパッタ装置 |
DE202010001497U1 (de) | 2010-01-29 | 2010-04-22 | Hauzer Techno-Coating B.V. | Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle |
CA2833796C (en) * | 2011-04-20 | 2018-07-31 | Oerlikon Trading Ag, Trubbach | Method for supplying sequential power impulses |
-
2012
- 2012-11-01 DE DE102012021346.8A patent/DE102012021346A1/de not_active Ceased
-
2013
- 2013-10-29 CN CN201380069485.3A patent/CN105027255B/zh active Active
- 2013-10-29 CA CA2892697A patent/CA2892697C/en not_active Expired - Fee Related
- 2013-10-29 US US14/439,815 patent/US10074976B2/en active Active
- 2013-10-29 RU RU2015120589A patent/RU2666775C2/ru active
- 2013-10-29 KR KR1020157014364A patent/KR102085704B1/ko active IP Right Grant
- 2013-10-29 WO PCT/EP2013/003251 patent/WO2014067650A1/de active Application Filing
- 2013-10-29 EP EP13792254.8A patent/EP2915181B1/de active Active
- 2013-10-29 JP JP2015540067A patent/JP6262753B2/ja active Active
- 2013-10-31 AR ARP130103974A patent/AR093305A1/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US10074976B2 (en) | 2018-09-11 |
EP2915181A1 (de) | 2015-09-09 |
CN105027255A (zh) | 2015-11-04 |
US20160043546A1 (en) | 2016-02-11 |
JP2015536386A (ja) | 2015-12-21 |
RU2015120589A (ru) | 2016-12-20 |
RU2666775C2 (ru) | 2018-09-12 |
KR20150079930A (ko) | 2015-07-08 |
CA2892697C (en) | 2020-09-01 |
KR102085704B1 (ko) | 2020-03-06 |
WO2014067650A1 (de) | 2014-05-08 |
CA2892697A1 (en) | 2014-05-08 |
AR093305A1 (es) | 2015-05-27 |
CN105027255B (zh) | 2017-07-14 |
DE102012021346A1 (de) | 2014-08-28 |
EP2915181B1 (de) | 2020-03-25 |
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