JP6262498B2 - Method for manufacturing ceramic laminate - Google Patents

Description

  The present invention relates to a method for manufacturing a ceramic laminate from a sheet laminate obtained by laminating ceramic grease sheets, and more particularly to a sheet laminate formed on a base via a fixing tape (underlying tape). The present invention relates to a method for separating a sheet laminate from a base by cutting a fixing tape.

  Conventionally, as a method for producing a ceramic laminate used for, for example, a wiring board, a so-called ceramic green sheet lamination method in which ceramic green sheets are produced by lamination is known (see Patent Document 1).

Below, the manufacturing process of this ceramic green sheet lamination | stacking method is shown.
As shown in FIG. 12, first, a ceramic green sheet P2 is formed on a protective tape P1 whose surface is coated with an adhesive, for example, by a doctor blade method.

  Separately, for example, a resin-made fixing tape P4 having an adhesive applied to both surfaces thereof is pasted on a ceramic base P3. Specifically, for example, a polyester having a rectangular frame shape so as to cover the groove P6 on a base P3 provided with a rectangular frame-like groove (concave portion) P6 in plan view (along the outer shape of the sheet laminate P5 described later). A fixing tape P4 made of (PET or the like) is attached.

  Next, the ceramic green sheet P2 lined with the protective tape P1 is placed on the fixing tape P4 so that the fixing tape P4 and the ceramic green sheet P2 are in contact with each other.

Then, after the ceramic green sheet P2 is placed, the protective tape P1 is peeled off from the ceramic green sheet P2.
Next, another ceramic green sheet P2 backed by another protective tape P1 is placed on the ceramic green sheet P2 placed on the fixing tape P4 so that the ceramic green sheets P2 are in contact with each other. To do.

  Next, the laminated ceramic green sheets P <b> 2 are pressed against each other by applying a temperature to form a sheet laminated body P <b> 5, and the protective tape P <b> 1 is peeled off from the sheet laminated body P <b> 5.

Thereafter, similarly, ceramic green sheets P2 are sequentially laminated and thermocompression bonded to form a multi-stage sheet laminate P5.
Next, the sheet laminate P5 is cut off from the base P3 by pressing the fixing tape P4 with the cutting blade P7 along the outer periphery of the sheet laminate P5 thus created (that is, along the groove P6). .

  Thereafter, the separated sheet laminate P5 is fired to produce a ceramic laminate.

JP 2005-260061 A

However, the above-described prior art has the following problems, and improvements are required.
Specifically, as shown in FIG. 13A, when the cutting blade P7 is used for cutting and cutting, the fixing tape P4 is cut by concentrating stress in the pressing direction. In the case of the tape P4, until the stress of the fixing tape P4 is released (that is, immediately before the fixing tape P4 is cut), the fixing tape P4 is bent, so that the fixing tape P4 may not be easily cut. .

  Therefore, in order to reliably cut the fixing tape P4, it is necessary to insert the cutting blade P7 to a position deep in the groove P6. However, depending on the type of the fixing tape P4 and the type of the adhesive, the cutting blade P7 is pressed deeply. However, the fixing tape P4 cannot be cut, and in some cases, the cutting blade P7 hits the bottom of the groove P6 and the cutting blade P7 may spill.

  Further, as shown in FIG. 13B, when the amount of deflection of the fixing tape P4 increases, the stress applied to the fixing tape P4 increases, and thus the fixing tape P4 may peel from the base P3. In this case, a part of the sheet laminate P5 adhered to the fixing tape P4 may drop off together with the fixed sheet P4, and the sheet laminate P5 may be damaged.

  Further, as shown in FIG. 13C, when the amount of deflection of the fixing tape P4 is large, the amount of stress release at the time of cutting the fixing tape P4 increases, so that the reaction of stress after cutting (stress release). As a result, the sheet laminate P5 may be damaged.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a ceramic laminate that can suitably separate a sheet laminate from a fixed tape fixed to a base. It is in.

(1) In the present invention, as a first aspect, a fixing tape is applied to a base having a groove along the outer shape of a sheet laminate on which ceramic green sheets are laminated so as to cover the groove. A first step, a second step of forming the sheet laminate on the fixing tape so that an outer periphery of the sheet laminate is in a region surrounded by the grooves in plan view, and the fixing tape. A ceramic laminate is manufactured by cutting along the groove using a cutting member and then firing the sheet laminate separated from the base, and a third step of separating the sheet laminate from the base. the method of manufacturing a ceramic laminate having a fourth step, the, as the fixing tapes, with use of the fixing tape to be cut to melt at a predetermined temperature, as the cutting member, before the fixing tape Using a heater that can be heated to a cutting temperature at which cutting is possible, in the third step, the cutting member heated to the cutting temperature is brought into contact with or close to the portion of the fixing tape that covers the groove. It is characterized by cutting.

  In the first aspect, a fixing tape that is melted and cut at a predetermined temperature is used as the fixing tape, and a heater that can be heated to a cutting temperature at which the fixing tape can be cut is used as the cutting member. In the third step, the fixing tape is cut by bringing the heater heated to the cutting temperature into contact with or close to the portion covering the groove of the fixing tape.

  Thus, in the first aspect, the fixing tape is not cut by the cutting blade as in the prior art, but the fixing tape is melted and cut (divided) by the heat of the heater, so that no great stress is applied to the fixing tape. Therefore, unlike the prior art, the cutting blade does not hit the bottom of the groove and is not damaged, and the sheet stack is not damaged by the pulling of the fixing tape or the reaction after cutting.

Therefore, in this 1st aspect, there exists a remarkable effect that a sheet | seat laminated body can be isolate | separated suitably from the fixed tape fixed to the base.
Here, the plan view indicates a case of viewing perpendicularly to the base surface (where grooves are formed) (the same applies hereinafter).

Moreover, although the area | region enclosed by the groove | channel has shown the area | region inside including a groove part by planar view, a groove | channel is not completely covered with a sheet | seat laminated body. That is, the sheet laminate is arranged so that a cutting member for cutting the fixing tape can be arranged on the groove (so that there is a predetermined space). In addition, the sheet | seat laminated body may be arrange | positioned inside a groove | channel. (The same applies hereinafter)
Furthermore, as a kind of fixing tape, what is necessary is just to be able to cut | disconnect by the heating of a heater, and various things, such as the product made from resin, paper, and the composite material which consists of various materials, are employable.

(2) In the present invention, as a second aspect, the groove has a frame shape in plan view, and the cutting member is a heater having a frame shape in plan view formed along the planar shape of the groove. It is characterized by.
The second aspect illustrates the planar shape of the groove and the cutting member. When the groove and the cutting member are formed in this way, the fixing tape that covers the (frame-like) groove is cut by the (frame-like) cutting member, so that the groove and the cutting member are formed in the region surrounded by the groove. The sheet laminate can be easily cut out.

(3) As a third aspect of the present invention, the fixing tape is simultaneously cut into a frame shape by bringing the frame-shaped cutting member into contact with or in proximity to the fixing tape.
In the third aspect, the fixing tape can be cut into a frame shape by bringing a frame-shaped cutting member similar to the groove into contact with or close to the fixing tape (on the groove).

Accordingly, it is possible to simultaneously cut the cut portions of the fixing tape (necessary for separating the sheet laminate) in one step.
(4) In the present invention, as a fourth aspect, a fixing tape is applied to a base having a groove along the outer shape of the sheet laminate on which ceramic green sheets are laminated so as to cover the groove. A first step, a second step of forming the sheet laminate on the fixing tape so that an outer periphery of the sheet laminate is in a region surrounded by the grooves in plan view, and the fixing tape. A ceramic laminate is manufactured by cutting along the groove using a cutting member and then firing the sheet laminate separated from the base, and a third step of separating the sheet laminate from the base. the method of manufacturing a ceramic laminate having a fourth step, the, as the fixing tapes, with use of the fixing tape to be broken by ultrasonic, as the cutting member, said breaking the fixing tape With ability ultrasonic cutter, in the third step, by contacting the cutting member in a portion covering the groove of the fixed tape, characterized by breaking the fixing tape.

  In the fourth aspect, a fixing tape that can be broken by ultrasonic waves is used as the fixing tape, and an ultrasonic cutter that can break the fixing tape is used as the cutting member. In the third step, the fixing tape is broken by bringing the ultrasonic cutter into contact with the portion covering the groove of the fixing tape.

  Thus, in this 4th aspect, since a fixed tape is not cut | disconnected with a cutting blade conventionally, but a fixed tape is fractured | ruptured (cut | disconnected) with an ultrasonic cutter, a big stress is not applied to a fixed tape. Therefore, unlike the prior art, the cutting blade does not hit the bottom of the groove and is not damaged, and the sheet stack is not damaged by the pulling of the fixing tape or the reaction after cutting.

Therefore, in this 4th aspect, there exists a remarkable effect that a sheet | seat laminated body can be isolate | separated suitably from the fixed tape fixed to the base.
Furthermore, as a kind of fixing tape, what is necessary is just to be able to cut | disconnect with an ultrasonic cutter, and various things, such as resin, can be employ | adopted.

  (5) In the present invention, as a fifth aspect, the groove has a polygonal frame shape in plan view, and the cutting member is formed in a plurality of directions along each side of the polygonal frame-shaped groove. A cutting blade that vibrates ultrasonically is provided.

  The fifth aspect illustrates the planar shape of the groove and the cutting member. When the groove and the cutting member are formed in this way, the fixing tape covering the groove (polygonal frame shape) is cut by the cutting member with a polygonal frame (for example, a rectangular frame shape). The sheet laminated body formed in the enclosed area can be easily cut out.

  (6) As a sixth aspect of the present invention, the plurality of ultrasonically oscillating cutting blades are brought into contact with the fixing tape to simultaneously cut the fixing tape into a polygonal frame shape.

In the sixth aspect, the fixing tape can be cut into a polygonal frame shape by bringing a cutting blade that vibrates ultrasonically into a frame shape similar to the groove to contact the fixing tape (on the groove).
Accordingly, it is possible to simultaneously cut the cut portions of the fixing tape (necessary for separating the sheet laminate) in one step.

(A) is a schematic block diagram which shows the electronic device using the ceramic laminated body of Example 1 from a side surface, (B) is a top view which shows typically the multi-piece substrate by which multiple ceramic laminated bodies are arrange | positioned. . It is process drawing explaining the manufacturing process of a ceramic laminated body. (A) is a top view of a base, (B) is X1-X1 sectional drawing of (A). (A) is a top view which shows the state which affixed the fixed tape on the surface of a base, (B) is X2-X2 sectional drawing of (A), (C) expands the Y section in (B), and is typical. FIG. It is explanatory drawing which shows typically the state which has arrange | positioned the ceramic green sheet on the protection tape among the manufacturing processes of a ceramic laminated body, fracture | ruptures each member in the thickness direction. FIG. 6 is an explanatory diagram schematically showing the stacked state of each member in the process following FIG. 5 by breaking each member in the thickness direction. (A) is a top view of a heater, (B) is X3-X3 sectional drawing of (A). FIG. 7 is an explanatory diagram schematically showing a state in which the fixing tape is cut, with each member being broken in the thickness direction, in a step subsequent to FIG. 6. It is explanatory drawing which shows the state which carries out the thermocompression bonding of the lamination | stacking intermediate body about the process following FIG. (A) is a top view which shows typically the ultrasonic cutter used in Example 2, (B) is X4-X4 sectional drawing of (A). In Example 2, it is explanatory drawing which shows the state which cut | disconnects a fixed tape, and fractures | ruptures each member in the thickness direction typically. It is explanatory drawing which shows the manufacturing method of the ceramic laminated body of a prior art. It is explanatory drawing which shows the subject in a prior art.

  Next, an embodiment of a method for manufacturing a ceramic laminate will be described as a mode for carrying out the present invention.

a) First, an electronic device using the ceramic laminate according to the first embodiment will be described with reference to FIG.
As shown in FIG. 1A, the electronic device 1 is used for a mobile communication module, a multichip module for a computer, and the like, and includes a plurality of ceramic layers 3 made of a low-temperature firing material (for example, 20 pieces) It is constituted by mounting electronic parts on the ceramic laminate 5 constituted by laminating.

  Specifically, conductive patterns 7 and 9 constituting capacitors and inductors are formed in the ceramic laminate 5. Further, a conductive pad 11 is formed on the upper surface of the ceramic laminate 5, and a chip component 13 such as a diode, an IC 15, a thick film resistor 17, and the like are connected to the conductive pad 11. On the other hand, the external electrode 19 is formed from the side surface to the lower surface of the ceramic laminate 5, and the conductive pad 11 on the lower surface connected to the external electrode 19 is connected to a circuit board (not shown).

As shown in FIG. 1B, the ceramic laminate 5 is divided and taken out from a multi-piece substrate 20 in which a large number of ceramic laminates 5 are arranged.
b) Next, the manufacturing process of the ceramic laminated body 5 of the present Example 1 is demonstrated based on FIGS. In addition, about the procedure of the process of step S100-S290, it shows collectively in FIG.

<Base preparation process (step S100)>
First, as shown in FIG. 3, for example, a base 21 made of a ceramic plate having a length of 250 mm × width of 250 mm × thickness of 20 mm is prepared.

  On the surface of the base 21, an outer diameter shape of a sheet laminate 23 (see FIG. 6) for a multi-piece substrate to be described later, that is, a vertical (outer diameter), for example, along the outer diameter shape of a square in plan view. A square frame-like groove 25 is formed along each side of a square of 200 mm × lateral (outer diameter) 200 × width 5 mm × depth 10 mm.

As the material of the ceramic plate constituting the base 21, for example, alumina is (Al 2 _{O 3),} can be adopted, other than a ceramic material (e.g., resin) can be used.
<Fixing tape placement step (step S110)>
Next, as shown in FIGS. 4A and 4B, a fixing tape (base tape) 27 is attached to the surface of the base 21 so as to cover the grooves 25. Specifically, for example, the fixing tape 27 that is a square-shaped double-sided tape (square) along each side of a square of 210 mm in length (outer diameter) 210 mm × width (outer diameter) 210 mm × width 15 mm × thickness 30 μm is formed in the groove 25. Cover and paste so that does not expose.

  Accordingly, as shown in FIG. 4C with the Y portion enlarged, the fixing tape 27 has the same widths L1 and L3 (for example, 10 mm) on the surfaces on both sides of the groove 25 (the upper surface in the left-right direction in FIG. ). The thickness of the fixing tape 27 is, for example, 0.5 mm in the range of 0.5 mm to 2.0 mm.

  Since the fixing tape 27 is provided with adhesive layers 31 and 33 made of an adhesive (adhesive) on both surfaces of the base film 29, the adhesive tape 33 on the base 21 side of the fixing tape 27 The fixing tape 27 is bonded to the base 21.

  As a material of the base film 29, polyester (such as PET), polyphenylene sulfide (PPS), polyetherimide (PEI), or the like can be used, and a film having a thickness in the range of 30 to 100 μm (for example, 100 μm) can be used.

  The fixing tape 27 is a heat-resistant tape whose characteristics do not change even when the temperature reaches 150 ° C. As the fixing tape 27, for example, Black Elastic Tacky (BETA) Tapes manufactured by Sumitomo 3M Limited: Part number 4485 can be adopted.

As an adhesive constituting the adhesive layers 31 and 33, for example, an acrylic or rubber pressure sensitive adhesive that can be bonded and peeled can be employed.
<Protective tape heat treatment process (step S120)>
Further, as shown in a partially enlarged view in FIG. 5A, the protective tape (carrier film) 41 that is a single-sided tape is heat-treated. This heat treatment is performed in order to reduce the influence of shrinkage of the protective tape 41 by heating such as thermocompression bonding in a later process. The heat treatment is performed by heating the protective tape 41 at 150 to 170 ° C. for 180 seconds or more. Note that this protective tape heat treatment step may be omitted.

The protective tape 41 is provided with an adhesive layer 45 made of an adhesive (adhesive) on one surface of a base film 43.
As a material for the base film 43, polyester (PET or the like), polyphenylene sulfide (PPS), polyetherimide (PEI) or the like can be employed, and a film having a thickness of 30 to 100 μm can be used.

In addition, when using a polyester film as the protective tape 41, for example, by dispersing solid particles in the film and making a structure in which long-chain molecules constituting the film are appropriately blocked in the middle, the shearing property of the film is increased. It is preferable to improve. As the solid particles, particles such as TiO ₂ , BaO ₃ , Ba ₂ (SO ₄ ) ₃ , alumina (Al ₂ O ₃ ), and silica (SiO ₂ ) can be used.

As an adhesive constituting the adhesive layer 45, for example, an acrylic or rubber pressure sensitive adhesive that can be bonded and peeled can be employed.
<Casting process (step S130)>
After the heat treatment, as shown in FIG. 5 (B), a slurry of a ceramic material is thinly spread on the protective tape 41 (that is, the adhesive layer 45) by a doctor blade method to form a ceramic green sheet 47 having a thickness of 30 to 120 μm, for example. Casting (tape forming).

Here, as the ceramic material, a low-temperature fired ceramic in which borosilicate glass and alumina are mixed, a high-temperature fired ceramic made of alumina, or the like can be used.
<Sheet cutting step (step S140)>
After casting, with the protective tape 41 attached to the ceramic green sheet 47, the ceramic green sheet 47 is cut into a predetermined size together with the protective tape 41 using a cutter (not shown).

<Punching process (step S150)>
After cutting the sheet, via holes 49 and reference holes 51 are punched and formed at predetermined positions of the ceramic green sheet 47 using an NC punch or the like as shown in FIG. The reference hole 51 represents a reference position when a print pattern to be described later is formed. In this step, punching holes 53 and 55 are also punched and formed in the protective tape 41 continuously with the via hole 49 and the reference hole 51 of the ceramic green sheet 47.

<Printing process (step S160)>
After punching, as shown in FIG. 5D, a conductor paste is filled and applied on the via hole 49 and the ceramic green sheet 47 by screen printing to form the via conductor 57 and the wiring pattern 59. As the conductive paste, Au—Pd alloy, W, Mo alloy, or the like can be used.

<Drying process (step S170)>
After printing, with the protective tape 41 attached to the ceramic green sheet 47, the printed wiring pattern 59 and the via conductor 57 are dried, for example, by heating at 60 to 80 ° C. for about 45 to 60 seconds.

  At this time, the preliminarily heat-treated protective tape 41 plays a role of suppressing the shrinkage of the ceramic green sheet 47 during the heat drying of the printing pattern. As a result, a sheet body 61 (see FIG. 6) having a predetermined shape including the protective tape 41 and the ceramic green sheet 47 provided with the via conductor 57 and the wiring pattern 59 is formed.

<Sheet Placement Step (Step S180)>
Next, as shown in FIG. 6A, the sheet body 61 is placed on the fixing tape 27 (attached to the surface of the base 21) and attached. At this time, it arrange | positions so that the gravity center of the square sheet | seat body 61 and the gravity center of the square base 1 may correspond by planar view. Thereby, each side of the outer periphery of the sheet body 61 is disposed above the groove 25. In plan view, there is an interval of 2.5 mm between the outer periphery of the sheet body 61 and the outer periphery of the groove 25.

In the following description, the sheet body 61, the ceramic green sheet 47, and the protective tape 41 are assigned first and second numbers from the lower side.
In detail, the first ceramic green sheet 47a is in contact with the fixing tape 27 (that is, the first ceramic green sheet 47a faces downward), and the first sheet body 61a is superimposed on the fixing tape 27. Accordingly, the first protective tape 41a is on the upper side of the first ceramic green sheet 47a.

<First protective tape peeling step (step S190)>
Next, as shown in FIG. 6 (B), the first protective tape 41a is peeled off from the first sheet body 61a (and hence the first ceramic green sheet 47a) attached on the fixing tape 27.

<Sheet Laminating Step (Step S200)>
Next, as shown in FIG. 6C, on the first ceramic green sheet 47a from which the first protective tape 41a has been peeled off, the second sheet body 61b (that is, the second backed by the second protective tape 41b). The ceramic green sheet 47 b) is placed to form a sheet laminate 23 that is a laminate of the ceramic green sheets 47.

  Specifically, the other second sheet body 61b is brought into contact with the first ceramic green sheet 47a on the fixing tape 27 so that the first ceramic green sheet 47a and the second ceramic green sheet 47b are in contact (that is, the second ceramic green sheet 47b). Overlay the ceramic green sheet 47b downward. Thereby, the 2nd protective tape 41b becomes the upper side of the 2nd ceramic green sheet 47b (hence, the sheet laminated body 23).

<Thermocompression bonding step (step S210)>
Next, with the second protective tape 41b attached, the sheet laminate 23 is integrated by thermocompression bonding under conditions of 55 ° C. and 12.0 to 12.7 MPa, for example.

<Second protective tape peeling step (step S220)>
Next, as shown in FIG. 6D, the second protective tape 41b is peeled from the second sheet body 61b (and hence the second ceramic green sheet 47b) placed on the first ceramic green sheet 47a.

<Multilayer Laminating Step (Step S230)>
Thereafter, in the same manner, the processes in steps S190 to S220 are repeated until the ceramic green sheets 47 have a desired number of laminated sheets (for example, 10 sheets), and a sheet laminated body having a predetermined number of stages as shown in FIG. A first laminated intermediate body 65 </ b> A that is 23 is produced.

<Conductive Pad Formation Step (Step S240)>
After the lamination, as shown in FIG. 6F, a pad pattern 11a that becomes the conductive pad 11 after firing is formed on the surface of the first laminated intermediate 65A. The conductive pad 11 is a terminal for mounting the above-described chip component 13 or the like or connecting to an external circuit. The pad pattern 11a can be formed by screen-printing a conductive paste with a thickness of 27 to 37 μm according to a predetermined pattern.

<Groove forming step (step S250)>
After the lamination, a break groove 69 (see FIG. 9) is formed on the main surface 67 on the first lamination intermediate 65A. In FIG. 9, the break groove 69 is shown only at one place in the periphery for the sake of simplicity. This break groove 69 is for facilitating the division of the ceramic laminate 5 after firing (that is, the division of each ceramic laminate 5 from the multi-chip substrate 20). By recognizing the pad pattern 11a, The cutter is aligned and a cut is made in a part of the main surface 67.

<Fixing tape cutting step (step S260)>
Next, as shown in FIG. 7, the fixing tape 27 is cut using a heater 71 which is a cutting member.

  In the heater 71, a nichrome wire 75 having a width of 5 mm and a height of 1 mm formed in a square frame shape is arranged on the surface of a rectangular plate material (for example, a ceramic plate made of alumina) 73.

  Specifically, the nichrome wire 75 is a rectangular frame-shaped member (center line) formed along each side of the rectangle so as to extend along the center line (in plan view) of the rectangular frame-shaped groove 25 of the base 21. (Dimension along 195 mm × width 195 mm).

  Therefore, in this fixing tape cutting step, the nichrome wire 75 is disposed between the outer periphery of the first laminated intermediate 65A and the outer periphery of the groove 25 in plan view, and as shown in FIG. The nichrome wire 75 is energized (specifically, the nichrome wire 75), the nichrome wire 75 is heated to, for example, 300 ° C., and the nichrome wire 75 is lowered from above the fixing tape 27 to contact (or approach) the fixing tape 27.

  As a result, as shown in an enlarged view in FIG. 8B, the temperature of the fixing tape 27 rises and melts, and the fixing tape 27 is cut. Accordingly, the fixing tape 27 is cut into a square frame shape in plan view along the outer periphery of the first laminated intermediate 65A.

<Fixing tape peeling process (step S270)>
Next, as shown in FIG. 8 (C), the first laminated intermediate 65A is peeled from the base 21 (with the remaining cut fixed tape 27) by a suction conveyance handler (not shown), and thereafter, FIG. 8 (D). As shown in FIG. 2, the remaining fixing tape 27 attached to the first laminated intermediate 65A is peeled off by physical peeling (physical peeling) by a tape peeling machine (not shown).

<Laminated Intermediate Joining Step (Step S280)>
Thereafter, through steps similar to the steps S100 to S270, a second laminated intermediate 65B having a different wiring pattern is formed as shown in the lower part of FIG. 9, and the first laminated intermediate 65A and the second laminated intermediate are formed. Thermocompression bonding with 65B. Here, the chip component 13 and the like (see FIG. 1) are mounted on the first laminated intermediate 65A, and the second laminated intermediate 65B is connected to the circuit board.

<Degreasing / firing step (step S290)>
After the first and second laminated intermediates 65A and 65B are thermocompression bonded, they are degreased by heating at 240 ° C. for 10 hours, and further fired at 840 ° C. for 60 minutes. Thereby, the multi-piece substrate 20 is obtained. In this case, when glass ceramic is used as the low-temperature firing material, firing is performed at about 870 ° C.

<Post process>
After that, by dividing the multi-piece substrate 20 by the break grooves 69, the ceramic laminates 5 are separately manufactured, and the electronic device 1 is manufactured by mounting the chip component 13 and the like on each ceramic laminate 5. Is done.

c) Next, the effect of the present embodiment will be described.
In the first embodiment, the fixing tape 27 that is melted and cut at a predetermined temperature is used as the fixing tape 27, and the nichrome wire 75 that can be heated to a cutting temperature at which the fixing tape 27 can be cut as the nichrome wire 75 of the heater 71. Is used. Then, the fixing tape 27 is cut by bringing the nichrome wire 75 heated to the cutting temperature into contact with or close to the portion covering the groove 25 of the fixing tape 27, so that the first lamination that is the sheet laminate 23 from the base 21. The intermediate body 65A and the second stacked intermediate body 65B are separated.

  Thus, in the first embodiment, the fixing tape 27 is not cut by the cutting blade as in the prior art, but the fixing tape 27 is melted and cut by the heat of the nichrome wire 75, so that a large stress is applied to the fixing tape 27. It does not take. Therefore, unlike the prior art, the cutting blade does not hit the bottom of the groove 25 and is not damaged, and the sheet laminate 23 is not damaged by the pulling of the fixing tape 27 or the reaction after cutting.

Therefore, in the present Example 1, the remarkable effect that the sheet | seat laminated body 23 can be isolate | separated suitably from the fixed tape 27 fixed to the base 21 is produced.
In the first embodiment, the groove 25 on the base 21 has a frame shape in plan view, and the nichrome wire 75 has a frame shape in plan view formed along the planar shape of the groove 25.

  Therefore, the fixing tape 27 can be cut into a frame shape at a time by bringing the frame-shaped nichrome wire 75 into contact with or in close proximity to the fixing tape 27 (on the groove 25).

Next, the second embodiment will be described, but the description of the same contents as the first embodiment will be omitted.
The method for manufacturing the ceramic laminate of the second embodiment is different from the first embodiment in that the method for cutting the fixing tape is different. In addition, the same member number is used for the same member as Example 1.

a) First, the cutting member used in the second embodiment will be described.
As shown in FIG. 10, in the second embodiment, an ultrasonic cutter 81 that cuts a member with a cutting member that vibrates ultrasonically is used as the cutting member.

  In this ultrasonic cutter 81, four plate-like cutting blades 85 that vibrate ultrasonically are arranged in a square frame shape so as to protrude from one surface of a base 83. Specifically, the cutting blade 85 that vibrates ultrasonically is provided at the center of the groove 25 (in the form of a square frame along the outer periphery of the rectangle in plan view) provided in the base 21 in the same manner as the arrangement of the nichrome wire in the first embodiment. 4, four plate-like cutting blades 85 that vibrate ultrasonically are arranged on each side of the groove 25 (in plan view) to form a square frame shape.

As the cutting blade 85 that vibrates ultrasonically, for example, product numbers SH-3510 and HG-110 manufactured by Sonotech Co., Ltd. can be used.
b) Next, a method for cutting the fixing tape 27 in the second embodiment will be described.

Here, after the steps S100 to S250 of the first embodiment, the fixing tape cutting step (step S260) in the second embodiment is performed.
In this fixing tape cutting step, as shown in FIG. 11A, the ultrasonic cutter 81 is energized, and the cutting blade 85 that vibrates ultrasonically is driven by setting the ultrasonic frequency to 20 kHz to 40 kHz. Then, the ultrasonically oscillating cutting 85 is lowered from above the fixing tape 27 at a speed of 10 to 100 μm per second and brought into contact with the fixing tape 27.

  As a result, as shown in an enlarged view in FIG. 11B, the fixing tape 27 is broken and cut. Accordingly, the fixing tape 27 is cut into a square frame shape in plan view along the outer periphery of the first laminated intermediate 65A.

  Thereafter, in the fixing tape peeling step (step S270), the first laminated intermediate 65A is peeled off from the base 21 (see FIG. 11C) in the same manner as in Example 1, and the remaining from the first laminated intermediate 65A. The fixing tape 27 is peeled off (see FIG. 11D).

Thereafter, as in the first embodiment, the ceramic laminate 5 is completed by the steps S280 and S290.
c) In this embodiment, the fixing tape 27 that is broken by ultrasonic waves is used as the fixing tape 27, and the ultrasonic cutter 81 that can break the fixing tape 27 is used as the cutting member. Then, the fixing tape 27 is broken by bringing the cutting blade 85 that vibrates ultrasonically into contact with the portion of the fixing tape 27 that covers the groove 25.

Therefore, similarly to the first embodiment, the sheet laminate 23 can be suitably separated from the fixing tape 27 fixed to the base 21.
In the second embodiment, the groove 25 on the base 21 has a square frame shape in plan view, and the four ultrasonic blades 85 have a square frame shape in plan view formed along the plane shape of the groove 25. Is.

  Accordingly, by bringing the four rectangular frame-shaped cutting blades 85 that vibrate ultrasonically into contact with the fixing tape 27 (on the groove 25), the fixing tape 27 can be cut into a rectangular frame at a time.

Needless to say, the present invention is not limited to the above-described embodiments, and can be implemented in various modes without departing from the scope of the present invention.
(1) For example, in Examples 1 and 2, a square frame-shaped fixing tape (having an opening at the center) was used, but a fixing tape without an opening covering the entire bottom surface of the ceramic green sheet was used. May be.

  (2) Further, in Examples 1 and 2, the nichrome wire arranged in a square frame shape and the cutting blade that vibrates ultrasonically are used so as to follow the shape of the base groove in plan view. For example, the fixing tape may be sequentially cut along the groove using a linear or rod-shaped nichrome wire or a cutting blade that vibrates ultrasonically.

  That is, the shape is not limited as long as the fixing tape can be cut along the groove.

DESCRIPTION OF SYMBOLS 5 ... Ceramic laminated body 21 ... Base 23 ... Sheet laminated body 25 ... Groove 27 ... Fixed tape 41, 41a, 41b ... Ceramic green sheet 71 ... Heater 81 ... Ultrasonic cutter

Claims (6)

A first step of attaching a fixing tape to cover the groove on the surface, on a base having a groove along the outer shape of the sheet laminate in which ceramic green sheets are laminated;
A second step of forming the sheet laminate on the fixing tape so that an outer periphery of the sheet laminate is in a region surrounded by the grooves in a plan view;
A third step of cutting the fixing tape along the groove using a cutting member, and then separating the sheet laminate from the base;
A fourth step of producing a ceramic laminate by firing the sheet laminate separated from the base;
In a method for producing a ceramic laminate having:
As the fixing tape, a fixing tape that is melted and cut at a predetermined temperature is used, and as the cutting member, a heater that can heat the fixing tape to the severable cutting temperature is used.
In the third step, the fixing tape is cut by bringing the cutting member heated to the cutting temperature into contact with or in proximity to a portion of the fixing tape covering the groove. Production method.   2. The ceramic laminate according to claim 1, wherein the groove has a frame shape in plan view, and the cutting member is a heater having a frame shape in plan view formed along the planar shape of the groove. Body manufacturing method.   The method for producing a ceramic laminate according to claim 2, wherein the fixing tape is simultaneously cut into a frame shape by bringing the frame-shaped cutting member into contact with or close to the fixing tape. A first step of attaching a fixing tape to cover the groove on the surface, on a base having a groove along the outer shape of the sheet laminate in which ceramic green sheets are laminated;
A second step of forming the sheet laminate on the fixing tape so that an outer periphery of the sheet laminate is in a region surrounded by the grooves in a plan view;
A third step of cutting the fixing tape along the groove using a cutting member, and then separating the sheet laminate from the base;
A fourth step of producing a ceramic laminate by firing the sheet laminate separated from the base;
In a method for producing a ceramic laminate having:
As the fixing tape, using a fixing tape that can be broken by ultrasonic waves, and using the ultrasonic cutter capable of breaking the fixing tape as the cutting member,
In the third step, the fixing tape is broken by bringing the cutting member into contact with the portion of the fixing tape that covers the groove.   The groove has a polygonal frame shape in plan view, and the cutting member includes a plurality of ultrasonically oscillating cutting blades formed along each side of the polygonal frame groove. The method for producing a ceramic laminate according to claim 4.   6. The method of manufacturing a ceramic laminate according to claim 5, wherein the plurality of ultrasonically oscillating cutting blades are brought into contact with the fixing tape to simultaneously cut the fixing tape into a polygonal frame shape.