JP6259564B2 - Electronic components - Google Patents

Description

  The present invention relates to a bottom-mount type electronic component mounted on an external substrate with a bottom surface as a mounting surface.

  The bottom-mount type electronic component includes an input / output electrode and a ground electrode on the bottom surface of the substrate, and is mounted on the external substrate by soldering the input / output electrode and the ground electrode to the component mounting electrode on the external substrate. In such a bottom-mount type electronic component, a ground electrode having a large area is provided at the center of the bottom surface of the substrate, thereby improving the grounding property against a high-frequency signal or the like. Also, by providing a resist pattern on the bottom of the substrate that prevents the mounting solder from wrapping around, each input / output electrode and the ground electrode can be prevented from being short-circuited by the mounting solder protruding from the electrode (for example, Patent Document 1). reference).

  FIG. 9A is a bottom plan view of a bottom-mount electronic component according to a conventional example. FIG. 9B is a cross-sectional view showing a mounting mode of the bottom surface mounting type electronic component according to the conventional example.

  A bottom-mount electronic component 101 shown in FIG. 9A includes a substrate portion 102, bottom surface electrodes 103 and 104, and a resist portion 105. The plurality of bottom electrodes 103 are arranged along the outer edge of the bottom surface of the substrate unit 102 and include input / output electrodes and a ground electrode. The bottom electrode 104 is provided in a large area in the center of the bottom surface of the substrate portion 102 and surrounded by the bottom electrode 103, and functions as a ground electrode. The resist portion 105 is formed in a lattice shape having a plurality of openings 106 arranged in a matrix, and is provided so as to cover the bottom surface of the substrate portion 102. Each bottom electrode 103 faces one opening 106 of the resist portion 105 and is exposed from the facing opening 106 to the substrate bottom side. On the other hand, the bottom electrode 104 having a large area faces the plurality of openings 106 of the resist portion 105 and is exposed to the substrate bottom surface side from the plurality of openings 106 facing each other.

  As shown in FIG. 9B, the electronic component 101 is mounted on an external substrate 111 on which a component mounting electrode 112 is formed. When mounting the electronic component 101, first, a cream-like mounting solder (solder paste) 113 is applied on the component mounting electrode 112 of the external substrate 111. Then, the electronic component 101 is placed on the external substrate 111 so that the bottom electrodes 103 and 104 are in contact with the mounting solder 113 and face the component mounting electrode 112. Thereafter, the mounting solder 113 is melted and solidified by heating by reflow or the like, so that the bottom electrodes 103 and 104 are bonded to the component mounting electrode 112 of the external substrate 111, and the electronic component 101 is mounted on the external substrate 111. To do.

International Publication No. 2010-070964

  In the electronic component 101 according to the conventional example, the area of the mounting solder 113 bonded to the periphery of the large area bottom electrode 104 is large, and the linear expansion coefficient of the bottom electrode 104 is different from that of the external substrate 111 and the mounting solder 113. Therefore, the bottom electrode 104 has lower adhesion to the mounting solder 113 than the bottom electrode 103. In addition, since the substrate portion 102 and the bottom electrode 104 have a quadrangular shape, when an impact, warpage, swell, or the like is applied from the external substrate 111, the amount of deformation that occurs near the end of the bottom electrode 104 on the diagonal line and the external The stress tends to be large, and problems such as a decrease in grounding performance due to the peeling of the mounting solder 113, dropping of the electronic component 101, and cracking of the board portion 102 may occur.

  Therefore, in the vicinity of the end of the bottom electrode 104 on the diagonal line, it is desired that there are few defects such as a shape defect and a bonding defect of each part generated at the time of manufacture. However, in the electronic component 101 according to the conventional example, soldering is performed at the time of manufacture or mounting. Due to the flash, a shape defect such as a crack in the mounting solder 113 and a bulge of the resist portion 105 along the diagonal line of the bottom electrode 104 or a bonding defect occurs, and the vicinity of the end of the bottom electrode 104 on the diagonal line is generated. Had reached up to.

  Specifically, a defect caused by solder flash is caused by a minute gap formed by residual moisture or solvent components at the time of resist molding at the joint surface between the bottom surface electrodes 103 and 104 and the resist portion 105 during manufacturing or mounting. When the molten mounting solder 113 enters and thermally expands, the deformation of the resist portion 105 proceeds with directionality. Therefore, a minute defect due to the solder flash is generated at an arbitrary position of the mounting solder 113 in an arbitrary traveling direction, but external stress acts greatly on the diagonal line of the bottom electrode 104, and therefore, along the diagonal line of the bottom electrode 104. The minute defects in the traveling direction become large due to the action of external stress, and tend to travel to the vicinity of the end of the bottom electrode 104 on the diagonal line.

  Therefore, the present invention can control the direction in which the solder flash proceeds, and even if an external stress from the external substrate acts on the mounting solder, the electronic component is dropped, the electronic component is cracked, and the ground performance is deteriorated. It is an object of the present invention to provide a bottom-mount type electronic component that is unlikely to occur.

  An electronic component according to the present invention covers a substrate portion having a mounting surface for an external substrate, a ground electrode provided on the mounting surface, a plurality of terminal electrodes provided on the mounting surface, and the mounting surface. And a resist portion. The resist portion has a first soldering region and a second soldering region when viewed from the mounting surface, and the ground electrode has an edge electrode portion. The first soldering region is a region in which a plurality of openings exposing the ground electrode are arranged vertically and horizontally, and a single mounting solder is joined thereto. The second soldering region is a region provided with a plurality of openings for exposing a plurality of terminal electrodes, and a plurality of mounting solders are joined to each other. The edge-side electrode portion is opposed to a part of the opening of the first soldering region, extends along the edge portion of the first soldering region, and has no electrode on the center side of the first soldering region. Forming portions are provided adjacent to each other.

  In this configuration, when solder flash occurs in the vicinity of the edge electrode portion, the traveling direction of the solder flash can be controlled in the direction along the edge electrode portion, that is, the direction along the edge of the first soldering region. Then, the direction in which the external stress acts greatly is the direction from the center of the first soldering region toward the edge side, so that the solder flash traveling direction can be shifted from the direction in which the external stress acts largely. Conversely, when solder flash occurs in a region away from the vicinity of the edge electrode portion in the first soldering region, it is possible to prevent the solder flash from progressing beyond the electrode non-forming portion to the vicinity of the edge electrode portion. it can.

  Moreover, in the above-described electronic component, it is preferable that the first soldering region has a quadrangular shape, and the edge electrode portion passes through at least the end on the diagonal line of the first soldering region. Further, in this case, it is more preferable that the electronic component includes a line electrode that traverses the diagonal extension of the first soldering region.

  In this configuration, even when a large stress is applied along the diagonal line in the first soldering region in a state where the electronic component is mounted on the external substrate, the solder flash can be prevented from proceeding along the diagonal line. Furthermore, if a line electrode is provided that crosses the extended line of the diagonal line, external stress is hardly transmitted to the ground electrode, and the connection reliability between the ground electrode and the external substrate is improved.

  Moreover, in the above-described electronic component, the edge-side electrode portion may be provided in an annular shape along the entire circumference of the edge portion of the first soldering region. In this case, it is preferable that the ground electrode is provided with a center side electrode portion that is opposed to the opening of the resist portion and is provided at the center portion of the first soldering region. Furthermore, it is preferable that the center-side electrode portion is provided in an annular shape along the edge portion of the edge-side electrode portion. The electrode non-forming portion is preferably provided in a ring shape along the entire circumference of the edge portion of the edge electrode portion.

  In this configuration, the direction in which the solder flash proceeds can be along the edge of the first soldering region over the entire circumference of the edge portion of the first soldering region. Further, by providing the center side electrode portion, it is possible to improve the grounding performance of the electronic component and realize good high frequency characteristics. In addition, even when a solder flash occurs at the center electrode portion, the solder flash can be prevented from proceeding beyond the electrode non-forming portion. Further, since the center side electrode portion is provided in an annular shape, the traveling direction of the solder flash generated in the center side electrode portion can be made to follow the edge of the first soldering region. Furthermore, since the electrode non-formation part is provided in an annular shape, external stress is hardly transmitted to the center side electrode part, and the connection reliability between the ground electrode and the external substrate is improved.

  In the above-described electronic component, the edge electrode portion and the center electrode portion are line electrodes that connect between a plurality of pad electrode portions facing the opening of the resist portion and pad electrode portions that are narrower than the pad electrode and adjacent to each other. May be provided. In this case, it is preferable that the edge-side electrode portion and the center-side electrode portion include a plurality of line electrode portions that connect the pad electrode portions adjacent to each other.

  In this configuration, by providing the line electrode portion, the traveling direction of the solder flash can be controlled more precisely. Although the risk of disconnection occurs by providing the line electrode portion, the risk of disconnection can be reduced by providing a plurality of line electrode portions.

  According to the present invention, the direction in which the solder flash proceeds can be shifted from the direction in which external stress acts greatly (the direction from the center of the first soldering region toward the edge side), and defects due to the solder flash increase. Can be prevented. Moreover, it is possible to prevent a defect generated near the center of the first soldering region from reaching the end portion of the first soldering region beyond the electrode non-forming portion. Therefore, defects generated at the end of the first soldering region can be reduced, and even when external stress from the external substrate acts on the mounting solder, the electronic component is dropped or the electronic component is cracked, It is possible to make it difficult to cause a decrease in ground performance.

It is a circuit diagram using the electronic component which concerns on 1st Embodiment. FIG. 3 is a side sectional view and a bottom plan view showing the electronic component according to the first embodiment. It is side surface sectional drawing which shows the mounting aspect of the electronic component which concerns on 1st Embodiment. It is a bottom side resist permeation | transmission figure which shows the electronic component which concerns on 1st Embodiment. It is the bottom side plan view and bottom side resist permeation figure which show the electronic component which concerns on 2nd Embodiment. It is the bottom side top view and bottom side resist permeation | transmission figure which show the electronic component which concerns on 3rd Embodiment. It is the bottom side top view and bottom side resist permeation | transmission figure which show the electronic component which concerns on 4th Embodiment. It is a bottom side resist permeation | transmission figure which shows the electronic component which concerns on other embodiment. It is the bottom side top view and sectional drawing which show the electronic component which concerns on a prior art example.

  Hereinafter, the present invention will be described with reference to FIGS. In each figure, the conductive member is indicated by hatching by a solid line, and the insulating member is indicated by hatching by a non-solid line.

  First, the electronic component according to the first embodiment of the present invention will be described.

FIG. 1 is a circuit diagram of a wireless communication circuit 11 using the electronic component 1 according to the first embodiment.
The wireless communication circuit 11 is, for example, an NFC (Near Field Communication) reader / writer circuit, and includes an electronic component 1 and an antenna 12.
The electronic component 1 according to the first embodiment includes an RF-IC 16 and a plurality of passive elements 17. The plurality of passive elements 17 constitute a low-pass filter circuit 18 and a matching circuit 19. The RF-IC 16 is connected to the antenna 12 via a low-pass filter circuit 18 and a matching circuit 19. In the wireless communication circuit 11 such as the NFC reader / writer circuit, since the ground potential is stable, the high frequency characteristics of each part, that is, the filter characteristics in the low-pass filter circuit 18 and the matching characteristics by the matching circuit 19 are obtained. Stabilize.

FIG. 2A is a side sectional view of the electronic component 1. FIG. 2B is a plan view of the bottom surface side of the electronic component 1. The cross section shown in FIG. 2A is a cross section at a position indicated by a broken line BB ′ in FIG.
In addition to the RF-IC 16 and the passive element 17 described above, the electronic component 1 includes a substrate portion 2, bottom electrodes 3 and 4, a bottom resist portion 5, a top electrode 13, and a top resist portion 15. It is equipped with.

  The substrate portion 2 has a flat plate shape with a bottom surface as a mounting surface, and in the circuit diagram shown in FIG. 1, wiring for connecting the RF-IC 16, each passive element 17, and the antenna 12 is incorporated as an internal electrode. .

  The RF-IC 16 and each passive element 17 are configured as chip-type elements mounted on the top surface of the substrate unit 2. Part or all of the passive element 17 is configured as a chip-type element mounted on the top surface of the substrate unit 2, or may be configured as a chip-type element built in the substrate unit 2, or the inside of the substrate unit 2. You may comprise by an electrode.

  The top surface electrode 13 is provided on the top surface of the substrate unit 2, and the terminals of the RF-IC 16 and each passive element 17 are joined to each other. The top surface resist portion 15 is provided on the top surface of the substrate portion 2 except for the region where the top surface electrode 13 is formed, and mounting solder for mounting the RF-IC 16 and each passive element 17 is provided on each top surface side resist portion 15. It has a function of preventing the occurrence of a short circuit due to leakage from the top electrode 13.

The bottom electrodes 3 and 4 are provided on the bottom surface of the substrate portion 2 and are joined to component mounting electrodes 23 and 24 of the external substrate 21 described later. Therefore, the electronic component 1 has a bottom mounting type configuration. The bottom electrode 3 is arranged along the outer edge on the bottom surface of the substrate unit 2 and outputs a control terminal to which a control signal for controlling the RF-IC 16 is input and an output signal output from the RF-IC 16. A plurality of pad electrodes having a small area that function as output terminals, ground terminals, and the like. These bottom electrodes 3 correspond to the terminal electrodes described in the claims.
Further, the bottom electrode 4 is provided in the center portion surrounded by the bottom electrode 3 on the bottom surface of the substrate portion 2, and is configured as a large-area electrode that functions as a ground terminal. The bottom electrode 4 corresponds to the ground electrode described in the claims.

  The bottom surface side resist portion 5 is provided on the bottom surface of the substrate portion 2 except for most of the formation regions of the bottom surface electrodes 3 and 4, and mounting solder is applied to each bottom surface electrode when mounted on the external substrate 21 described later. It has a function to prevent short circuit defects from leaking from 3 and 4. Therefore, the bottom-side resist portion 5 has a plurality of openings 6 for exposing the bottom electrode 3 and the bottom electrode 4 vertically and horizontally, that is, in a matrix.

  Among all the openings 6, each of the plurality of openings 6 located in the outer row and column arranged along the outer edge of the bottom surface of the substrate unit 2 is one of the plurality of bottom electrodes 3. The entire surface of the bottom electrode 3 is exposed to the bottom surface side of the substrate portion 2. In addition, among all the openings 6, the plurality of openings 6 located in the inner rows and columns arranged in the vicinity of the center portion on the bottom surface of the substrate portion 2 respectively face a part of the bottom electrode 4. Thus, the bottom electrode 4 is partially exposed to the bottom surface side of the substrate portion 2.

  In the bottom side resist portion 5, the region where the opening 6 exposing the bottom electrode 4 is arranged is a region where a single mounting solder is bonded to the bottom electrode 4 exposed from each opening 6. Yes, hereinafter referred to as the first soldering area 5A. Therefore, in the present embodiment, the first soldering region 5 </ b> A is disposed near the center portion on the bottom surface of the substrate portion 2. Further, in the bottom-side resist portion 5, in the region where the openings 6 exposing the bottom electrodes 3 are arranged, a plurality of mounting solders are individually bonded to the plurality of bottom electrodes 3 exposed from the openings 6. Hereinafter, this region is referred to as a second soldering region 5B. Therefore, in the present embodiment, the second soldering region 5 </ b> B is disposed near the outer edge of the substrate unit 2 on the bottom surface of the substrate unit 2.

  FIG. 3 is a side sectional view showing a mode in which the electronic component 1 is mounted on the external substrate 21, FIG. 3 (A) shows a mode immediately before mounting, and FIG. 3 (B) shows a mode after mounting. Yes. The cross section shown in FIG. 3B is a cross section at the position where the bottom electrode 4 is exposed from the opening 6 unlike the cross section shown in FIG.

  The electronic component 1 is mounted on the external substrate 21. The external substrate 21 is provided with component mounting electrodes 23 and 24 on the surface. The component mounting electrode 23 is a plurality of pad-shaped electrodes provided in a region overlapping the second soldering region 5B described above, and each has a shape and an arrangement facing the bottom electrode 3 of the electronic component 1. The component mounting electrode 24 is a single pad-shaped electrode provided in a region overlapping the first soldering region 5A described above, and has a shape and an arrangement facing the entire first soldering region 5A. It faces the plurality of bottom surface electrodes 4 provided on the bottom surface of the electronic component 1.

  When the electronic component 1 is mounted, cream-like mounting solder (solder paste) 25 is applied to the entire surface of the component mounting electrodes 23 and 24 of the external substrate 21 as shown in FIG. Then, as shown in FIG. 3B, the electronic component 1 is connected to the external substrate 21 so that the bottom electrodes 3 and 4 exposed from the opening 6 are in contact with the mounting solder 25 and face the component mounting electrodes 23 and 24. Placed on top. Thereafter, the solder 25 for mounting is melted and solidified by heating by reflow or the like, whereby the bottom electrodes 3 and 4 are joined to the component mounting electrodes 23 and 24 of the external substrate 21, thereby allowing the external substrate 21 to have electrons. The component 1 is mounted.

  FIG. 4 is a bottom side resist transmission diagram of the electronic component 1.

  The bottom electrode 4 provided on the bottom surface of the substrate part 2 includes an edge electrode part 7 and a center electrode part 8. The edge-side electrode portion 7 and the center-side electrode portion 8 are formed so as to be separated from each other with an electrode non-forming portion 9 interposed therebetween, and both are annular, and the center-side electrode portion 8 is inside the edge-side electrode portion 7. Is arranged. The edge-side electrode portion 7 extends along the edge of the first soldering area 5A and faces a part of the opening 6 located at the edge of the first soldering area 5A. The electrode non-forming portion 9 is adjacent to the inside of the edge-side electrode portion 7 and extends along the entire inner edge of the edge-side electrode portion 7.

  The edge electrode part 7 includes a pad electrode part 7A and line electrode parts 7B and 7C. 7 A of pad electrode parts are the arrangement | positioning and shape which oppose the some opening part 6 located in an outer row | line | column and column among all the opening parts 6 provided in the above-mentioned 1st soldering area | region 5A, Four are arranged in each row and each column. The line electrode portions 7B and 7C are narrower than the pad electrode portion 7A, are arranged between the adjacent pad electrode portions 7A, and connect the adjacent pad electrode portions 7A. The line electrode portion 7B is disposed on the edge side of the first soldering region 5A, and the line electrode portion 7C is disposed on the center side of the first soldering region 5A. These line electrode portions 7 </ b> B and 7 </ b> C are covered with the bottom surface side resist portion 5 without being exposed to the bottom surface side of the substrate portion 2.

  The center side electrode part 8 includes a pad electrode part 8A and a line electrode part 8B. The pad electrode portion 8A is arranged and shaped to face the plurality of openings 6 located in the inner rows and columns among all the openings 6 provided in the first soldering region 5A described above, Two are arranged in each row and each column. The line electrode portion 8B is narrower than the pad electrode portion 8A, is disposed between the adjacent pad electrode portions 8A, and connects the adjacent pad electrode portions 8A. The line electrode portion 8 </ b> B is covered with the bottom surface side resist portion 5 without being exposed on the bottom surface side of the substrate portion 2.

  In the electronic component 1 having such a configuration, a solder flash is generated at the time of manufacturing or mounting, which may cause a shape defect such as a crack in the mounting solder 25 or a bulge of the bottom side resist portion 5 or a bonding failure. is there. Small defects due to solder flash can occur in various traveling directions on the entire surface of the mounting solder 25.

  However, even if minute defects due to solder flash occur in the annular region of the mounting solder 25 facing the edge side electrode part 7 and the center side electrode part 8, the traveling direction of these minute defects is almost the edge side electrode part 7. And the direction along the edge of the central electrode portion 8, that is, the direction almost along the edge of the first soldering region 5A. In addition, a minute defect generated in the region facing the edge side electrode portion 7 proceeds to the annular region facing the center side electrode portion 8 or conversely occurs in the region facing the center side electrode portion 8. A minute defect does not travel to the edge electrode portion 7.

  Further, in the edge side electrode portion 7 and the center side electrode portion 8, the line electrode portions 7B, 7C, 8B connected to the pad electrode portions 7A, 8A are configured to be narrower than the pad electrode portions 7A, 8A. However, this limits the traveling direction and the number of minute defects generated in the regions facing the line electrode portions 7B, 7C, and 8B, and is more parallel to the edge of the first soldering region 5A. It is in the direction of travel.

  Therefore, impact, warpage, and undulation are generated in the external substrate 21, and there are almost no micro defects in the traveling direction along the diagonal line of the bottom electrode 4, even if external stress acts greatly on the diagonal line of the bottom electrode 4. A minute defect does not travel on the diagonal line of the bottom electrode 4 due to the action of the external stress and reach the vicinity of the end of the bottom electrode 4 on the diagonal line. Therefore, defects such as defective shape and poor bonding of each part, which occur near the end of the bottom electrode 4 on the diagonal line, are suppressed. As a result, problems such as a decrease in grounding performance due to the peeling of the mounting solder 25, a dropout of the electronic component 1, and a crack in the substrate portion 2 are suppressed.

  The center side electrode portion 8 is not necessarily essential, but by providing the center side electrode portion 8, the ground performance and high frequency characteristics of the electronic component 1 and the electronic characteristics can be improved as compared with the case where only the edge side electrode portion 7 is provided. The connection reliability of the component 1 can be improved.

  In addition, the center side electrode portion 8 does not necessarily have an annular configuration, but by providing the center side electrode portion 8 in an annular shape, minute defects due to solder flash in a region facing the center side electrode portion 8 are eliminated. The direction of travel can be controlled.

  Here, the edge electrode portion 7 is provided with a plurality of line electrode portions 7B, 7C, but this reduces the risk of disconnection even if one of the line electrode portions 7B, 7C breaks. For this reason, the number of line electrode portions provided between adjacent pad electrode portions may be singular or may be two or more. In addition, for the center side electrode portion 8 in which a single line electrode portion 8B is provided between adjacent pad electrode portions, the number of line electrode portions provided between adjacent pad electrode portions is two or more. May be.

  Further, although the center side electrode portion 8 and the edge side electrode portion 7 are separated by the electrode non-forming portion 9, a line electrode portion that connects between the center side electrode portion 8 and the edge side electrode portion 7 may be formed. Good. In this case, the grounding performance can be further improved. In this case, a minute defect due to solder flash occurs on the line electrode portion, and the traveling direction of the minute defect is the center of the first soldering region. There is a danger of facing from the part to the edge. Therefore, if the number, shape, and arrangement of the line electrode portions are adjusted so that the line electrode portions do not overlap with the diagonal lines of the first soldering region, the earth performance is lowered, the electronic component 1 is dropped, the substrate Problems such as cracking of the portion 2 can be made difficult to occur.

  Also, here, the bottom electrode 4 is disposed inside the array of bottom electrodes 3, that is, the first soldering area 5A is disposed inside the second soldering area 5B. The first soldering area 5A and the second soldering area 5B are not limited to such an arrangement relationship.

  Next, an electronic component according to a second embodiment of the present invention will be described.

  FIG. 5A is a bottom plan view of the electronic component 31 according to the second embodiment. FIG. 5B is a resist transmission diagram of the bottom surface side of the electronic component 31.

  The electronic component 31 includes a substrate part 2, bottom electrodes 3 and 34, and a bottom side resist part 5. The substrate part 2, the bottom electrode 3, and the bottom side resist part 5 have the same configuration as in the first embodiment. The bottom electrode 34 is provided at the center of the bottom surface of the substrate portion 2 surrounded by the bottom surface electrode 3 and is configured as a large-area electrode that functions as a ground terminal. Exposed to the side.

  More specifically, the bottom electrode 34 includes an edge electrode part 37 and a center electrode part 38. The edge-side electrode part 37 and the center-side electrode part 38 are formed separately from each other with the electrode non-formation part 9 interposed therebetween, and both are formed in an annular shape with a constant width dimension. The center side electrode part 38 is arrange | positioned inside.

  Even in the electronic component 31 having such a configuration, even if a minute defect due to solder flash occurs in an annular region facing the edge-side electrode portion 37 and the center-side electrode portion 38, the traveling direction of these minute defects is determined. The direction along the edges of the edge side electrode part 37 and the center side electrode part 38 can be set.

  In the present embodiment as well, the center-side electrode portion 38 is not an essential configuration.

  Next, an electronic component according to a third embodiment of the present invention will be described.

  FIG. 6A is a bottom plan view of the electronic component 41 according to the third embodiment. FIG. 6B is a bottom-surface resist permeation diagram of the electronic component 41.

  The electronic component 41 includes a substrate portion 2, bottom surface electrodes 43 and 34, and a bottom surface side resist portion 5. The substrate unit 2, the bottom electrode 34, and the bottom side resist unit 5 have the same configuration as in the second embodiment. The bottom electrode 43 includes a plurality of pad electrode portions 44 and a line electrode portion 45 connected between two of the plurality of pad electrode portions 44. The plurality of pad electrode portions 44 are arranged along the outer edge on the bottom surface of the substrate portion 2, and a control terminal to which a control signal for controlling the RF-IC 16 is input and an output signal output from the RF-IC 16 are provided. Functions as output terminal, ground terminal, etc. The line electrode portion 45 passes between at least the pad electrode portion 44 disposed at the corner of the plurality of pad electrode portions 44 and the bottom electrode 34, that is, crosses the diagonal extension of the bottom electrode 34. .

  Even in the electronic component 41 having such a configuration, even if a minute defect due to solder flash occurs in a region facing the bottom electrode 34, the traveling direction of the minute defect is a direction along the edge of the bottom electrode 34. It can be. In addition, external stress from the external substrate is hardly transmitted to the bottom electrode 34, and the connection reliability between the bottom electrode 34 and the external substrate is improved.

  In the present embodiment, the line electrode unit 45 includes not only the pad electrode unit 44 disposed at the corner, but also a plurality of pad electrode units 44 adjacent to the pad electrode unit 44 disposed at the corner, and the bottom electrode 34. It is configured to pass between. Further, any one of the line electrode portions 45 passes between all the pad electrode portions 44 and the bottom electrode 34. For this reason, the connection reliability between the bottom electrode 34 and the external substrate can be more effectively improved.

  Also in this embodiment, the center side electrode part 38 and the edge side electrode part 37 may be constituted by a line electrode part and a pad electrode part. Moreover, the center side electrode part 38 is not an essential structure.

  Next, an electronic component according to a fourth embodiment of the present invention will be described.

  FIG. 7A is a bottom plan view of the electronic component 51 according to the fourth embodiment. FIG. 7B is a resist transmission diagram of the bottom surface side of the electronic component 51.

  The electronic component 51 includes a substrate portion 52, bottom surface electrodes 53 and 34, and a bottom surface side resist portion 55. Two bottom electrodes 34 are provided adjacent to each other. The substrate portion 52 and the bottom surface side resist portion 55 are configured to have a larger area because the two bottom surface electrodes 34 are provided. The bottom electrode 53 is provided so as to surround the two bottom electrodes 34.

  Also in this embodiment, a line electrode that passes between the bottom electrode 53 located at the corner and the two bottom electrodes 34 may be provided. Moreover, you may comprise the two bottom electrodes 34 by the line electrode part and the pad electrode part. In each bottom electrode 34, the center side electrode portion 38 is not an essential configuration. Further, the two bottom electrodes 34 may be configured to be partially connected without being completely separated by the electrode non-forming portion 9.

  Next, configuration examples of other embodiments will be described.

  FIG. 8A is a resist transmission diagram on the bottom surface side of the electronic component 61 according to another embodiment.

  An electronic component 61 and a bottom electrode 64 are provided. The bottom electrode 64 includes a center electrode part 38, an edge electrode part 37, and four connection electrode parts 65. The four connection electrode portions 65 connect the center side electrode portion 38 and the edge side electrode portion 37, and are connected to the centers of the four sides with respect to the center side electrode portion 38 and the edge side electrode portion 37, respectively. Has been. Thus, the center side electrode part 38 and the edge side electrode part 37 do not need to be completely separated by the electrode non-forming part 9, and the center side electrode part 38 and the edge side electrode part 37 are connected. May be.

  FIG. 8B is a resist transmission diagram of the bottom surface side of the electronic component 71 according to another embodiment.

  The electronic component 71 includes a bottom electrode 74. The bottom electrode 74 includes a center side electrode part 78 and an edge side electrode part 37. The center side electrode portion 78 is formed in a quadrangular shape. Thus, the center side electrode part 78 may have a shape other than the annular shape.

  FIG. 8C is a bottom-side resist permeation diagram of an electronic component 81 according to another embodiment.

  The electronic component 81 includes a bottom electrode 84. The bottom electrode 84 includes four edge side electrode portions 87, a center side electrode portion 78, and four connection electrode portions 65. The four edge-side electrode portions 87 are each formed in a straight line, and the electrode non-formation portion 9 is provided on the center side of the first soldering region. Each of the four edge-side electrode portions 87 is a corner portion of the first soldering region. Are separated from each other. As described above, the edge electrode portion 87 may have a shape other than the annular shape. Further, for example, the bottom electrode 84 as a whole may have a meander line shape or a spiral shape.

1, 31, 41, 51, 61, 71, 81... Electronic component 2, 52... Substrate portion 3, 4, 34, 43, 53, 64, 74, 84. First soldering area 5B ... Second soldering area 6 ... Openings 7, 37, 87 ... Edge side electrode parts 8, 38, 78 ... Center side electrode parts 7A, 8A ... Pad electrode parts 7B, 7C, 8B, 45 ... line electrode part 9 ... electrode non-formation part 11 ... wireless communication circuit 12 ... antenna 13 ... top surface electrode 15 ... top surface side resist part 16 ... RF-IC
DESCRIPTION OF SYMBOLS 17 ... Passive element 18 ... Low-pass filter circuit 19 ... Matching circuit 21 ... External substrate 23, 24 ... Component mounting electrode 25 ... Solder 65 for mounting ... Connection electrode part

Claims (10)

A board portion having a mounting surface for an external board;
A ground electrode provided on the mounting surface;
A plurality of terminal electrodes provided on the mounting surface;
A resist portion covering the mounting surface;
With
The resist portion has a plurality of openings vertically and horizontally arranged to expose the ground electrode when viewed from the mounting surface, a first soldering region to which a single mounting solder is joined, and the plurality of openings A plurality of openings for exposing the terminal electrodes, and a second soldering region to which a plurality of mounting solders are joined,
The ground electrode is opposed to a part of the opening of the first soldering region, extends along an edge portion of the first soldering region, and is disposed on the center side of the first soldering region. A non-formed part is provided adjacent to the edge electrode part,
Electronic components. The first soldering area has a quadrangular shape when viewed from the mounting surface;
2. The electronic component according to claim 1, wherein the edge-side electrode portion passes at least an end portion on a diagonal line of the first soldering region.   3. The electronic component according to claim 1, wherein the edge-side electrode portion is provided in an annular shape along an entire circumference of an edge portion of the first soldering region.   The said ground electrode is provided with the center side electrode part provided in the center part of the said 1st soldering area | region facing the opening of a part of said 1st soldering area | region. Electronic components.   The electronic component according to claim 4, wherein the electrode non-forming portion is provided in an annular shape along the entire circumference of the edge portion of the edge-side electrode portion.   The edge electrode portion includes a plurality of pad electrode portions facing the opening of the resist portion, and a line electrode portion that is narrower than the pad electrode portion and connects between the pad electrode portions adjacent to each other. The electronic component in any one of Claims 1-5. Before SL line electrode portion, a plurality of line electrodes part, electronic component according to claim 6.   The center-side electrode part includes a plurality of pad electrode parts facing the opening of the resist part, and a line electrode part that is narrower than the pad electrode part and connects between the pad electrode parts adjacent to each other. The electronic component according to claim 4 or 5. Before SL line electrode portion, a plurality of line electrodes part, electronic component according to claim 8.   3. The electronic component according to claim 2, further comprising a line electrode that crosses a diagonal extension of the first soldering region and connects the plurality of terminal electrodes.

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