JP6255288B2 - Sensor module - Google Patents

Description

  The present invention relates to a sensor module.

  In the sensor module disclosed in Japanese Patent No. 4281178 (Patent Document 1), a first case in which a sensor element made of a semiconductor is disposed and resin-molded, and a part of the first case are exposed. A lead that is insert-molded in the first case and electrically connected to the sensor element, a second case that is assembled to the first case and covers the sensor element, and a second case And an enclosure for enclosing the exposed portion of the lead. The exposed portion of the lead and the surrounding portion constitute a connector portion that can connect the exposed portion of the lead to the external terminal. The first case and the second case are fitted by a sliding operation, and are prevented from coming off by an engagement structure provided between the first case and the second case.

Japanese Patent No. 4281178

  In the sensor module of Patent Document 1, a circuit board on which electronic components such as a sensor element and a transistor are mounted is fixed to a sensor case with an adhesive. Therefore, many processes including an adhesion process are required for manufacturing the sensor module. .

  Further, in the conventional sensor module of Patent Document 1, since the first case and the second case are coupled by a sliding structure, a gap is easily generated between the first case and the second case, and assembly is performed. There is a problem of poor accuracy.

  An object of the present invention is to provide a sensor module that can securely fix a circuit board to a housing with a small number of steps.

  Another object of the present invention is to provide a sensor module with higher assembly accuracy than in the past.

  An object of the present invention is to improve a sensor module in which a sensor unit in which a sensor is mounted on the surface of a circuit board is housed in a housing.

  The housing includes a first housing half having an opening and a second housing half combined with the first housing half. The first housing half includes a first wall facing the opening, and a first peripheral wall that stands up from the first wall and surrounds the opening. A circuit board is fixed to the first wall portion. The second housing half includes a second wall that faces the first wall of the first housing half, and a second peripheral wall that rises from the peripheral edge of the second wall.

  In the sensor module of the present invention, in particular, a pair of fitting grooves into which a pair of opposite edges of the circuit board are fitted are formed in the first wall portion of the first housing half. Of the pair of opposing wall portions facing each other with the fitting groove interposed therebetween, one or more openings are made in one opposing wall portion located on the opening side toward the fitting groove, the opening portion, and the other fitting groove. Forming slits.

  In addition, one or more protrusions that pass through the one or more slits and enter the fitting groove are formed on the pair of edges of the circuit board.

  Specifically, the pair of fitting grooves has a predetermined length along the pair of fitting grooves after one or more protrusions of the circuit board are inserted into the fitting grooves through the one or more slits. One or more projecting portions are opposed to one opposing wall portion in a state of having a length dimension that allows sliding, and sliding the circuit board in a predetermined length along one pair of fitting grooves. The circuit board has a length dimension that prevents the circuit board from sliding at a position where the circuit board slides.

  The second housing half is combined with the first housing half so that the circuit board moves in the opposite direction to face the end surface of the edge located in the opposite direction to the one direction of the circuit board. It has a stopper part that prevents

  In the present invention, one or more protrusions of the circuit board are inserted into the fitting groove through the one or more slits, and then the circuit board is slid along the pair of fitting grooves for a predetermined length. Can be mounted on a housing. Therefore, since it is not necessary to form an opening for inserting the circuit board into the fitting groove in the second housing half in the direction in which the circuit board slides, the sealing performance inside the sensor module can be improved. Also, a length that prevents the circuit board from sliding at a position where one or more protrusions face one of the opposing wall portions in a state where the circuit board is slid in a predetermined length along one pair of fitting grooves. Since the fitting groove is configured to have dimensions, the circuit board does not fall out of the housing in a state in which the fitting groove is slid in a predetermined length along the fitting groove. Further, the second housing half is combined with the first housing half so that the circuit board moves in the opposite direction to face the end surface of the edge located in the opposite direction to the one direction of the circuit board. Since it has a stopper portion that prevents this, the circuit board is prevented from moving in the opposite direction simply by combining the second housing half with the first housing half, so the circuit board is in the opposite direction. And will not fall out of the housing. Therefore, the circuit board can be securely fixed to the housing without using an adhesive.

  It is preferable that a part of the second peripheral wall portion of the second housing half constitutes a stopper portion. If comprised in this way, since a 2nd housing half part and a stopper part are comprised integrally, it becomes unnecessary to prepare a stopper part as another member and to attach to a 2nd housing half part. As a result, the number of parts is reduced and assembly is facilitated.

  One of the opposing wall portions preferably has three slits, and one edge portion of the circuit board preferably has one or more protrusions. If comprised in this way, three protrusion parts will oppose one opposing wall part in the state which slid the circuit board to predetermined length one direction along the fitting groove. Therefore, rattling does not occur on the circuit board fixed to the first wall. In addition, even if a part of the protruding portion or one of the opposing wall portions is damaged, the circuit board fixed to the first wall portion does not fall off, and the circuit board is securely fixed to the first wall portion. Can do.

  It is preferable that the first peripheral wall portion of the first housing half and the second peripheral wall portion of the second housing half are engaged via an engagement structure to constitute the housing. If comprised in this way, a 1st housing half part and a 2nd housing half part can be easily combined with an engagement structure, and also assembly accuracy can be improved.

  For example, the sensor may be a pressure sensor in which a pressure sensor element is housed in a sensor case having a measurement fluid introduction hole. In this case, the pressure sensor is mounted on the surface of the circuit board facing the second wall portion. The second wall is provided with a guide hole communicating with the measurement fluid introduction hole. If comprised in this way, when it is set as a pressure sensor, the flow path which introduces a measurement fluid to a pressure sensor can be comprised easily.

  You may mount at least one part of the signal processing circuit of a sensor on the back surface of a circuit board. With this configuration, the circuit board can be reduced in size as compared with the case where the signal processing circuit is mounted only on the surface of the circuit board, so that the sensor module can be reduced in size.

  When the first peripheral wall portion of the first housing half and the second peripheral wall portion of the second housing half are engaged via the engagement structure, a pair of attachments are attached to the first housing half. The flange portion may be provided integrally. And it is comprised so that an engagement structure may be located in a circuit board side rather than a pair of flange part for attachment. If comprised in this way, since an engagement structure is located between an attachment flange part and a circuit board, it can suppress that water permeates into an engagement structure from the outside by an attachment flange part, and a sensor module Waterproof performance can be further increased.

It is sectional drawing of the sensor module of the 1st Embodiment of this invention. It is a perspective view of the circuit board with which the sensor and the sensor were mounted. (A) And (B) is the top view and perspective view of a 1st housing half part. FIGS. 9A to 9C are a plan view, a right side view, and a bottom view of the second housing half 50, respectively. (A) thru | or (C) is a figure explaining the procedure which fixes the circuit board in which the pressure sensor was mounted to the 1st housing half part. (A) is sectional drawing of the sensor module of the 2nd Embodiment of this invention, (B) is sectional drawing in the surface orthogonal to the cross section shown to (A). It is a figure which shows the procedure which fixes the circuit board by which the pressure sensor of 2nd Embodiment was mounted to the 1st housing half part.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each drawing, in order to facilitate understanding, the dimensional ratio and shape of each member are schematically shown, and are different from those of an actual member.

[First Embodiment]
FIG. 1 is a cross-sectional view of the sensor module 1 according to the first embodiment of the present invention. The sensor module 1 according to the present embodiment includes a pressure sensor 3, a circuit board 5 on which the pressure sensor 3 is mounted, a housing 7 that houses the pressure sensor 3 and the circuit board 5, and an O-ring 9. . FIG. 2 is a perspective view of the pressure sensor 3 and the circuit board 5 (sensor unit) on which the pressure sensor 3 is mounted.

[Pressure sensor]
The pressure sensor 3 includes a sensor case 11, a semiconductor pressure sensor element 13 as a pressure-sensitive part provided inside the sensor case 11, a cylinder 15 provided integrally with the sensor case 11, and eight terminals 17. And a signal processing IC chip (not shown) connected to some of these terminals 17.

  Inside the sensor case 11, a communication passage 11 a that communicates with the extension passage 15 a passing through the inside of the cylinder 15 and introduces the pressure of the fluid to be measured into the semiconductor pressure sensor element 13 is formed. In the present embodiment, the measurement fluid introduction hole is configured by the communication passage 11a and the extension passage 15a.

  The semiconductor pressure sensor element 13 is formed based on a Si semiconductor substrate, and includes a diaphragm portion 13a and a diaphragm support portion 13b. The diaphragm support portion 13b is airtightly joined to a support base 19 formed by processing a semiconductor substrate. Therefore, in the present embodiment, the fluid to be measured does not come into contact with the surface on which the diffusion resistance is formed. The support base 19 is formed with a through hole 19a communicating with the communication passage 11a. The diaphragm portion 13a has a resistance bridge circuit made up of a resistance element (not shown) and a resistance circuit made up of a resistance element formed on the surface. The surface on which the resistance bridge circuit or the like is formed is covered with a waterproof insulating resin. Note that the detailed configuration of the resistor circuit is not related to the gist of the present invention, and thus the description thereof is omitted.

  The eight terminals 17 are fixed to the sensor case 11 by insert molding. One end of each of the eight terminals 17 is exposed in the sensor case 11 and a part thereof is electrically connected to the electrode portion of the semiconductor pressure sensor element 13 by a bonding wire (not shown). The other end of the eight terminals 17 is electrically connected to the circuit board.

  Two atmospheric pressure introduction passages 21 and 23 are further formed in the sensor case 11. In the present embodiment, the sensor case has an airtight structure so that atmospheric pressure is not introduced into the sensor case 11 from other than the atmospheric pressure introduction passages 21 and 23. The detailed configuration of the two atmospheric pressure introduction passages 21 and 23 is not related to the gist of the present invention, and thus the description thereof is omitted.

[Circuit board]
As shown in FIG. 2, the circuit board 5 on which the pressure sensor 3 is mounted is formed in a substantially rectangular shape. In the present embodiment, all the signal processing circuits of the pressure sensor 3 are mounted on the front surface of the circuit board 5 and are not mounted on the back surface of the circuit board 5. Three protrusions 25a to 25c and 27a to 27c are formed on the pair of edges 25 and 27 of the circuit board 5, respectively. In the present embodiment, the three projecting portions 25a to 25c and 27a to 27c are formed so that the center portions of the pair of edge portions 25 and 27 are axisymmetric with respect to a virtual center line extending along the substrate surface. ing. Further, the protrusions 25a to 25c of the present embodiment are formed in different shapes. Similarly, the protrusions 27a to 27c are formed in different shapes. The protrusions 25a and 27a are formed at one end in the longitudinal direction of the edges 25 and 27, and the protrusions 25c and 27c are formed at the other end in the longitudinal direction of the edges 25 and 27. Yes. The circuit board 5 is provided with three lead terminals 29 constituting an output unit and a power input unit for outputting the detection result of the pressure sensor 3 to the outside. The three lead terminals 29 extend to the outside of the circuit board 5 beyond the edge portion 26 that connects one ends of the pair of edge portions 25 and 27. A female terminal of a connector of an external device (not shown) is connected to the lead terminal 29. The pressure sensor 3 is mounted closer to the edge 28 than the center of the circuit board 5.

[housing]
The circuit board 5 on which the pressure sensor 3 is mounted is accommodated in the housing 7. The housing 7 includes a first housing half 30 to which the circuit board 5 is fixed, and a second housing half 50 combined with the first housing half 30. The housing 7 includes a main body portion 7a that accommodates the pressure sensor 3 and the circuit board 5, and a connector insertion portion 7b that accommodates a main portion of the lead terminal 29 and into which a connector of an external device (not shown) is inserted. A partition wall portion 8 is provided between the main body portion 7a and the connector insertion portion 7b, and three through holes through which the lead terminals 29 pass are formed in the partition wall portion 8. The partition wall portion 8 is configured by combining a split wall portion half portion 32 and a partition wall portion half portion 52 provided in the first housing half portion 30 and the second housing half portion 50. .

[First housing half]
FIGS. 3A and 3B are a plan view and a perspective view of the first housing half 30. The first housing half 30 includes a first bottom wall portion 31 and a first peripheral wall portion 33 that stands up from the first bottom wall portion 31. The first housing half 30 has a body half 30a that constitutes a half of the body 7a of the housing 7 and a connector insertion half 30b that constitutes a half of the connector insertion 7b of the housing 7. doing. As shown in FIG. 3, the first peripheral wall portion 33 includes a peripheral wall portion 33a continuous with the connector insertion portion half 30b, a pair of peripheral peripheral wall portions 33b and 33c formed continuously with the peripheral wall portion 33a, and a peripheral wall. A peripheral wall portion 33d facing the portion 33a is provided. A locking portion 33e is formed on the pair of opposed peripheral wall portions 33b and 33c. The locking portion 33e has a shape in which a locking portion 54 of a snap-in type locking piece 53a described later of the second housing half 50 is locked. Specifically, an inclined surface 34 that inclines from the end surfaces of the peripheral wall portions 33b and 33c toward the first bottom wall portion 31, and a parallel surface 36 that extends in parallel with the end surfaces of the peripheral wall portions 33b and 33c continuously with the inclined surface. And. The parallel surface 36 constitutes a locked portion that is locked with the locking portion 54 of the snap-in type locking piece 53a. In the present embodiment, the first bottom wall portion 31 constitutes the first wall portion. The first housing half 30 has an opening 35 surrounded by a first peripheral wall 33 at a position facing the first bottom wall 31.

  A semicircular 3 for forming an insertion hole through which the lead terminal 29 is inserted in a portion adjacent to the connector insertion portion half 30b on the surface 31a of the first bottom wall portion 31 of the first housing half 30. Two recesses 31b and a substrate storage portion 37 in which the circuit board 5 is stored are formed.

  The substrate storage portion 37 includes a bottom surface portion 39 constituted by a rectangular plane, first opposing wall portions 41a and 41b rising from a pair of opposing sides 39a and 39b of the bottom surface portion 39, and a first opposing wall. Second opposing wall portions 43a and 43b that are formed to be spaced from the portions 41a and 41b and extend to the surface 31a of the first bottom wall portion 31, and the first opposing wall portion 41a and the second opposing wall portion 43a. And a fitting groove 45b formed between the first opposing wall portion 41b and the second opposing wall portion 43b. The first opposing wall portions 41a and 41b and the fitting grooves 45a and 45b are formed to extend in parallel with the peripheral wall portion 33b and the peripheral wall portion 33c.

  The length dimension L1 of the bottom surface portion 39, the fitting groove 45a, and the fitting groove 45b is longer than the length dimension L2 between the edge portion 26 and the edge portion 28 of the circuit board 5. The distance between the pair of opposite sides 39 a and 39 b of the bottom surface 39, that is, the width W 1 of the bottom 39 is slightly shorter than the width W 2 between the pair of edges 25 and 27 of the circuit board 5. The interval W3 between the second opposing wall portions 43a and 43b is slightly longer than the width dimension W2 between the pair of edges 25 and 27 of the circuit board 5.

  The second opposing wall portion 43a is formed with slits 47a to 47c through which the protruding portions 25a to 25c pass when the pair of edge portions 25 of the circuit board 5 are inserted into the fitting groove 45a. The second facing wall portion 43b is formed with slits 49a to 49c through which the protruding portions 27a to 27c pass when the pair of edge portions 27 of the circuit board 5 are inserted into the second facing wall portion 43b. Yes.

  The slits 47a to 47c open toward the opening 35, the fitting groove 45a, and the fitting groove 45b. The slits 49a to 49c are open toward the opening 35, the fitting groove 45b, and the fitting groove 45a. In the present embodiment, the slits 47c and 49c are formed at the ends of the second opposing wall portions 43a and 43b on the peripheral wall portion 33d side.

  A pair of opposing edges 25 and 27 of the circuit board 5 are fitted in the fitting groove 45a and the fitting groove 45b, respectively. The fitting groove 45a and the fitting groove 45b are formed by inserting the protrusions 25a to 25c and the protrusions 27a to 27c of the circuit board 5 into the fitting grooves 45a and 45b through the slits 47a to 47c and the slits 49a to 49c, respectively. The circuit board 5 has a length that allows the circuit board 5 to slide a predetermined length along the fitting grooves 45a and 45b. Further, the fitting groove 45a and the fitting groove 45b are formed in a state in which the edge portion 26 of the circuit board 5 is slid to the end portion on the peripheral wall portion 33a side of the fitting grooves 45a and 45b. 27a to 27c have a length so as to face the second facing wall portions 41a and 41b, respectively.

[Second housing half]
4A to 4C are a plan view, a right side view, and a bottom view of the second housing half 50, respectively. The second housing half portion 50 includes a second bottom wall portion (second wall portion) 51 that faces the first bottom wall portion 31, and a second peripheral wall portion 53 that rises from the peripheral edge portion of the second bottom wall portion 51. And. The second bottom wall portion 51 of the present embodiment includes mounting flange portions 51 a and 51 b having a hole portion H for mounting the sensor module 1 on the outside of the second peripheral wall portion 53. The second peripheral wall portion 53 is formed with two snap-in type locking pieces 53 a that engage with the two locking portions 33 e of the first peripheral wall portion 33 of the first housing half 30. The size of the second peripheral wall portion 53 of the present embodiment is accommodated inside the first peripheral wall portion 33, and the two snap-in type locking pieces 53 a are connected to the two locking portions 33 e of the first peripheral wall portion 33. A locking portion 54 that engages with the parallel surface 36 is provided.

  The second bottom wall portion 51 of the present embodiment is provided with a guide hole 55a that communicates with a measurement fluid introduction hole including a communication passage 11a and an extension passage 15a, and a cylindrical portion 55 having a substantially cylindrical cross section. Is formed. A cylindrical body 15 of the pressure sensor 3 is fitted to the cylindrical portion via an O-ring 9 (see FIG. 1). Therefore, in the present embodiment, the pressure sensor 3 is mounted on the surface of the circuit board 5 facing the second bottom wall portion 51.

  In addition, the second peripheral wall portion 53 is combined with the recess 31b formed in the first bottom wall portion 31 of the first housing half portion 30 when combined with the first housing half portion 30, and the lead terminal 29 is connected to the second peripheral wall portion 53. Three semicircular recesses 53c that form insertion holes to be inserted are formed in the peripheral wall portion 53d that faces the connector insertion portion 7b when combined with the first housing half 30. Further, the second peripheral wall portion 53 is integrally formed with a stopper portion 57 on a peripheral wall portion 53e facing the peripheral wall portion 53d.

  Next, the procedure for fixing the circuit board 5 on which the pressure sensor 3 of the present embodiment is mounted to the first housing half 30 will be described with reference to FIGS. 1 and 5A to 5C. First, as shown in FIG. 5A, the pressure sensor 3 is mounted on the surface facing the second bottom wall 51 when the first housing half 30 and the second housing half 50 are combined. The circuit board 5 is inserted into the board storage part 37 formed in the first bottom wall part 31 of the first housing half part 30. The circuit board 5 has three protrusions 25a to 25c formed on the edge 25 of the circuit board 5 inserted into the fitting groove 45a through the slits 47a to 47c, and three protrusions formed on the edge 27. By inserting 27a to 27c into the fitting groove 45b through the slits 49a to 49c, they are inserted into the substrate storage portion 37. Next, as shown in FIG. 5B, the circuit board 5 inserted in the board housing portion 37 is slid along the fitting grooves 45a and 45b in a direction toward the peripheral wall portion 33d for a predetermined length ( FIG. 5C). In the present embodiment, the end surface of the edge 25 of the circuit board 5 on the side where the protrusion 25a and the protrusion 27a of the edge 27 are formed are in contact with the end of the fitting grooves 45a and 45b on the peripheral wall portion 33a side. Slide until touching. 5C, the end surface of the edge 25 of the circuit board 5 on the side where the protrusion 25c and the protrusion 27c of the edge 27 are formed, and the end of the fitting grooves 45a and 45b on the side of the peripheral wall portion 33d. A gap is formed between the two parts. Then, when the second housing half 50 is combined with the first housing half 30, the stopper 57 formed on the second peripheral wall 53 of the second housing half 50 is inserted into this gap (see FIG. 1). . The stopper portion 57 is opposed to the end surface of the circuit board 5 on the peripheral wall portion 33d side and is prevented from moving the circuit board 5 toward the peripheral wall portion 33d side.

[Second Embodiment]
FIG. 6A is a cross-sectional view of the sensor module 101 according to the second embodiment of the present invention, and FIG. 6B is a cross-sectional view in a plane orthogonal to the cross section of FIG. FIG. 7 is a diagram illustrating a procedure for fixing the circuit board 105 on which the pressure sensor 103 according to the second embodiment is mounted to the first housing half 130. Members similar to those in the embodiment shown in FIG. 1 to FIG. 5 are given the same reference numerals as those in FIG. 1 to FIG. Compared with the first embodiment, the second embodiment is such that at least a part of the signal processing circuit of the sensor is mounted on the back surface of the substrate, and the mounting flange portion is the second housing half. Rather, it is different in that it is provided in the first housing half. The main differences will be described below.

  As shown in FIGS. 6A and 6B, in the second embodiment, a part of the circuit component P constituting the signal processing circuit of the pressure sensor 103 is mounted on the back surface of the circuit board 105. Has been. Therefore, as shown in FIGS. 7A to 7C, the length dimension L2 ′ between the edge 126 and the edge 128 of the circuit board 105 of the second embodiment is shown in FIG. It is shorter than the length dimension L2 between the edge part 26 and the edge part 28 of the circuit board 5 of 1st Embodiment. More specifically, in the circuit board 105 of the second embodiment, a part of the signal processing circuit of the pressure sensor 103 is mounted on the entire back surface, and the edge 126 and the edge 128 of the circuit board 105 are The length dimension L2 ′ between the two is approximately half the length dimension L2 between the edge portion 26 and the edge portion 28 of the circuit board 5 of the first embodiment shown in FIG. In the present embodiment, the housing 107, that is, the sensor module 101 is also downsized by downsizing the circuit board 105.

  As shown in FIGS. 7A to 7C, in the second embodiment, the first housing half 130 to which the circuit board 105 is fixed has a pair of opposed peripheral wall portions 133b and 133c is provided with a mounting flange portion 138, and the second housing half 150 is not provided with a mounting flange portion. When the mounting flange portion 138 is provided in the first housing half 130 to which the circuit board 105 is fixed as in the present embodiment, as shown in FIG. A portion where the peripheral wall portion 133 and the second peripheral wall portion 153 of the second housing half 150 are engaged with each other (the locking structure formed by the two locking portions 133e and the two snap-in type locking pieces 153a) is a mounting flange portion. And the circuit board 105. Therefore, even when water droplets adhere to the outside of the sensor module 101, the mounting flange portion 138 prevents the water droplets adhering to the portion where the first peripheral wall portion 133 and the second peripheral wall portion 153 are engaged from entering. Therefore, the waterproof performance of the sensor module can be further enhanced.

  In the above embodiment, a pressure sensor is used as a sensor, but the present invention can of course be applied when a sensor other than the pressure sensor is used.

  According to the present invention, after inserting one or more protrusions of the circuit board into the fitting groove through the one or more slits, the circuit board is slid along the pair of fitting grooves for a predetermined length, thereby The substrate can be mounted on the housing. Therefore, since it is not necessary to form an opening for inserting the circuit board into the fitting groove in the direction in which the circuit board slides, the airtightness of the sensor module can be improved. Also, a length that prevents the circuit board from sliding at a position where one or more protrusions face one of the opposing wall portions in a state where the circuit board is slid in a predetermined length along one pair of fitting grooves. Since the fitting groove is configured to have dimensions, the circuit board does not fall out of the housing in a state in which the fitting groove is slid in a predetermined length along the fitting groove. In addition, the second half of the housing is combined with the first half of the housing, and the circuit board moves in the opposite direction to face the end face of the edge located in the opposite direction to the one direction of the circuit board. Since it has a stopper portion that prevents the circuit board from moving in the opposite direction simply by combining the second housing half with the first housing half, an adhesive is used. In addition, the circuit board can be prevented from falling off the housing.

DESCRIPTION OF SYMBOLS 1 Sensor module 3 Pressure sensor 5 Circuit board 7 Housing 7a Main body part 7b Connection part 9 O-ring 11 Sensor case 11a Communication path 13 Semiconductor pressure sensor element 13a Diaphragm part 13b Diaphragm support part 15 Cylindrical body 15a Extension path 17 Terminal 19 Support stand 19a Through hole 21 Atmospheric pressure introduction passage 25 Edge 25a, 25b, 25c Projection 27 Edge 27a, 27b, 27c Projection 29 Terminal 30 Half of first housing 31 Bottom wall 31a Surface 31b Recess 33 Peripheral wall 33a Perimeter wall 33c Engagement part 35 Opening part 37 Concave part 39 Bottom part 39a Side 41a, 41b 1st opposing wall part 43a, 43b 2nd opposing wall part 45a, 45b Fitting groove 47a, 47b, 47c Slit 49a, 49b, 49c Slit 50 Second housing half Part 51 Bottom wall part 51a, 51b Mounting flange part 53 Peripheral wall part 53a Engaged part 53c Recessed part 53d Peripheral wall part 53e Peripheral wall part 55 Cylindrical part 55a Guide hole 57 Stopper part 138 Mounting flange part H Hole part

Claims (8)

A sensor unit in which a sensor is mounted on the surface of a circuit board is a sensor module housed in a housing,
The housing includes a first wall portion having an opening portion and facing the opening portion, and a first peripheral wall portion standing up from the first wall portion and surrounding the opening portion, and the circuit on the first wall portion. A first housing half having a substrate fixed thereto, a second wall facing the first wall, and a second peripheral wall rising from a peripheral edge of the second wall; A second housing half to be combined,
A pair of fitting grooves into which a pair of opposing edges of the circuit board are fitted are formed in the first wall portion of the first housing half,
Of the pair of opposing wall portions facing each other with the fitting groove interposed therebetween, one of the opposing wall portions located on the opening side faces the fitting groove, the opening portion, and the other fitting groove. One or more slits are formed to open,
The pair of edges of the circuit board are each provided with one or more protrusions that enter the fitting groove through the one or more slits,
The pair of fitting grooves are formed by inserting the one or more protrusions of the circuit board into the fitting groove through the one or more slits, and then inserting the circuit board along the pair of fitting grooves. The one or more projecting portions are opposed to the one opposing wall portion in a state where the length is allowed to slide and the circuit board is slid in a predetermined length along one pair of fitting grooves. Has a length dimension to prevent the circuit board from sliding in position,
The second housing half is combined with the first housing half so as to face an end surface of an edge located in a direction opposite to the one direction of the circuit board, and the circuit board is opposite to the circuit board. A sensor module having a stopper portion for preventing movement in a direction.   The sensor module according to claim 1, wherein a part of the second peripheral wall portion of the second housing half constitutes the stopper portion. 2. The sensor module according to claim 1, wherein the one or more slits are three slits, and the one or more protrusions provided on one edge of the circuit board are three protrusions. 3. The three slits have different shapes from each other,
The sensor module according to claim 3, wherein the three protrusions have different shapes.   2. The housing according to claim 1, wherein the first peripheral wall portion of the first housing half and the second peripheral wall portion of the second housing half are engaged via an engagement structure. The described sensor module. The sensor is a pressure sensor in which a pressure sensor element is housed in a sensor case having a measurement fluid introduction hole,
The pressure sensor is mounted on the surface of the circuit board facing the second wall;
The sensor module according to claim 1, wherein a guide hole communicating with the measurement fluid introduction hole is provided in the second wall portion.   The sensor module according to claim 1, wherein at least a part of a signal processing circuit of the sensor is mounted on a back surface of the circuit board. The first housing half is integrally provided with a pair of mounting flanges,
The engagement structure between the first peripheral wall portion of the first housing half and the second peripheral wall portion of the second housing half is positioned closer to the circuit board than the pair of mounting flange portions. The sensor module according to claim 5.

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