JP2002107246A - Semiconductor sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the influence of a stress on a pressure detection characteristic of a sensor element. SOLUTION: A semiconductor sensor is provided with the sensor element 6 supporting a semiconductor sensor chip 1 and leading out a sensor element terminal 7 and a base board 8 provided with a sensor element terminal fixing part 8a for fixing the sensor element terminal 7 and an external connection terminal fixing part 8b for fixing an external connection terminal 12. In the base board 8, a connection terminal stress reducing part 8d reducing a connection terminal stress transmitted via the external connection terminal 12 is arranged between the sensor element terminal fixing part 8a and the external connection terminal fixing part 8b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor sensor such as a pressure sensor.

[0002]

2. Description of the Related Art Conventionally, as this kind of semiconductor sensor, there is one shown in FIGS. This is a pressure sensor which supports a semiconductor sensor chip 101a for detecting a pressure change and has a sensor element terminal 10a.
1b, the substrate 102 provided with the sensor element terminal fixing portion 102a for fixing the sensor element terminal 101b and the external connection terminal fixing portion 102b for fixing the external connection terminal 103, the sensor element 101 and the substrate 102 Pressure introduction hole 1 for accommodating and introducing pressure to semiconductor sensor chip 101a
A housing 104 having a housing 04a is provided.

The housing 104 accommodates the substrate 102 by fixing and supporting a fixed portion 102c provided on the substrate 102.

The sensor element terminal fixing portion 102a of the substrate 102 is a through hole, and the sensor element terminal 101b is soldered and fixed in a state where the sensor element terminal 101b passes through the through hole.
Also, the external connection terminal fixing portion 102b of the substrate 102
The external connection terminal 103 is soldered and fixed in a state where the external connection terminal 103 penetrates the through hole.

Further, the fixed portion 102c of the substrate 102 is also fixed to the housing 104 by being fitted into a projection 102d which is a through hole and protrudes from the housing 104.

[0006]

In the conventional semiconductor sensor described above, when a stress is transmitted to the external connection terminal fixing portion 102b via the external connection terminal 103, the stress is applied to the substrate. There is a possibility that the light is transmitted to the sensor element terminal fixing portion 102a via the sensor element terminal 102. If the stress is transmitted to the sensor element terminal fixing portion 102a, the stress is transmitted to the sensor element 101 via the sensor element terminal 101b, and the pressure of the sensor element 101 is detected. It will affect the characteristics.

Further, when stress is transmitted to the fixed portion 102c via the housing 104, the stress is transmitted to the fixed portion 1 for the sensor element terminal via the substrate 102.
02a may be transmitted. If the stress is transmitted to the sensor element terminal fixing portion 102a, the stress is transmitted to the sensor element 101 via the sensor element terminal 101b, and the pressure of the sensor element 101 is detected. It will affect the characteristics.

The present invention has been made in view of the above points, and an object of the present invention is to provide a semiconductor sensor in which the pressure sensing characteristics of a sensor element are hardly affected by stress.

[0009]

According to a first aspect of the present invention, there is provided a semiconductor sensor for supporting a semiconductor sensor chip and fixing a sensor element terminal from which a sensor element terminal is derived and a sensor element terminal. A substrate provided with a sensor element terminal fixing part and an external connection terminal fixing part for fixing an external connection terminal, wherein the substrate is provided with the sensor element terminal fixing part and the external connection terminal fixing part. A connection terminal stress relieving portion for relieving the connection terminal stress transmitted via the external connection terminal is provided between the external terminal and the external terminal.

According to a second aspect of the present invention, there is provided a semiconductor sensor.
The semiconductor sensor according to claim 1, further comprising: a housing that supports the substrate by fixing a fixed portion provided on the substrate, wherein the substrate is provided between the sensor element terminal fixing portion and the fixed portion via a housing. And a housing stress relieving portion for relieving the housing stress transmitted through the housing.

According to a third aspect of the present invention, there is provided a semiconductor sensor supporting a semiconductor sensor chip and extending a sensor element terminal, a substrate provided with a sensor element terminal fixing portion for fixing the sensor element terminal, and a substrate provided on the substrate. And a housing for supporting the substrate by fixing the fixed portion, wherein the substrate is transmitted through the housing between the sensor element terminal fixing portion and the fixed portion. And a housing stress relieving portion for relieving housing stress.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor sensor according to an embodiment of the present invention will be described below with reference to FIGS. This semiconductor sensor is, for example, a pressure sensor used for detecting air pressure. It is not limited to this use.

1 is a semiconductor sensor chip, for example,
A detection circuit formed of single crystal silicon and integrally having a thin diaphragm (not shown) and having, for example, four diffusion piezoresistors (not shown) bridge-connected to the upper surface of the diaphragm is formed. It is.
The semiconductor sensor chip 1 includes a pedestal 2 made of glass or the like.
It is joined and supported on. The pedestal 2 is fixed to a pipe 3 described later by bonding or the like.

Reference numeral 3 denotes a pipe having a through hole 3a vertically penetrated so as to introduce pressure to the diaphragm, and is fixed to a molded body 4 together with a sensor element terminal 7 described later, for example, by simultaneous molding or the like. The molded body 4 is made of a lid 5
Is mounted to protect the semiconductor sensor chip 1 from dust and the like. In FIG. 1, the lid 5 is omitted. The molded body 4 constitutes a sensor element 6 together with the pedestal 2, the pipe 3, and the lid 5.

Reference numeral 7 denotes a sensor element terminal, which is wire-bonded to the semiconductor sensor chip 1 and fixed to the molded body 4 by, for example, simultaneous molding as described above, and is led out of the sensor element 6. The distal end of the sensor element terminal 7 is bent at a substantially right angle from an intermediate portion of the lead-out portion, and the distal end of the sensor element terminal 7 penetrates a circuit board 8 described later and is connected by soldering.

Reference numeral 8 denotes a circuit board for processing signals from the semiconductor sensor chip 1, on which electronic components 9 for signal processing are mounted. The circuit board 8 is formed in a substantially rectangular plate shape, and the penetrated sensor element terminal fixing portion 8a through which the sensor element terminal 7 is inserted and connected by soldering.
Are provided along both short sides, and a penetrating external connection terminal fixing portion 8b through which an external connection terminal 12 described later is inserted and soldered is provided along one long side. Further, the circuit board 8 is provided with penetrated fixed portions 8c at four corners of which the projections 10d of the case 10 described later are inserted and fixed by thermal caulking.

Further, the circuit board 8 has a slit-like connection terminal stress cut from both short sides between the electronic component 9 and the sensor element terminal fixing portion 8a and the external connection terminal fixing portion 8b. A relaxation portion 8d is provided. The connection terminal stress relaxing portion 8d is not limited to a slit shape, but may be, for example, a groove shape or a series of intermittently provided through holes.

Further, the circuit board 8 is provided at the four corners on both sides of the other long side, between the electronic component 9 and the sensor element terminal fixing portion 8a and the fixed portion 8c.
A slit-shaped housing stress relieving portion 8e is provided so that the portion where c is provided is connected to the central portion of the circuit board 8 by a narrow portion. The housing stress relieving portion 8e is not limited to a slit shape, but may be, for example, a groove shape or a series of intermittently provided through holes.

Reference numeral 10 denotes a case, which is formed in a box shape having a substantially elliptical shape in plan view and having an opening on one side, and a protruding tube portion having a pressure introducing port 10a at its tip and a hollow portion communicating with the internal space 10b. 10c are provided integrally. This case 10
Is provided with a protrusion 10d which is inserted into the fixed portion 8c of the circuit board 8 to fix the circuit board 8 by thermal caulking at the opening edge thereof. The case 10 is provided with a protruding engaged portion 10e which is engaged with an engaging portion 13c of the cover 13 described later on the outer side of the side portion.

The above-described sensor element 6 is housed in an internal space 10b of the case 10, and an O-ring 11 is provided between the sensor element 6 and the case 10 in order to maintain airtightness against a fluid whose pressure is detected. Will be arranged.
A circuit board 8 to which a sensor element terminal 7 derived from the sensor element 6 housed in the case 10 is connected.
However, as described above, the sensor element 6 is also fixed to and accommodated in the case 10 by being fixed to the case 10.

Reference numeral 12 denotes an external connection terminal, which is used for power input and signal output.
It is fixed to 0. The external connection terminal 12 is formed in a substantially J-shape, and one end thereof has an insertion hole 13 of a cover 13 described later.
a, and is electrically connected to the circuit board 8 by soldering with the other end penetrating through the external connection terminal fixing portion 8 b of the circuit board 8.

Reference numeral 13 denotes a cover, which is formed in a substantially oval box shape having an opening on one side, and has an opening 13a for inserting the external connection terminal 12 and an opening for opening to the atmosphere. A hole 13b is provided. The cover 13 has a side portion formed to be thin enough to be elastically deformed, and has a hole-shaped engaging portion 13c which engages with the engaged portion 10e of the case 10 at both longitudinal ends. .

As described above, the case 10 includes the engaged portion 10
e and the cover 13 is provided with the engaging portion 13c, so that the opening of the case 10 is closed so that the cover 13 and the case 10 have a slight gap on each side. In the superposed state, the engaging portion 13c of the cover 13 is attached to the engaged portion 10e of the case 10 by the cover 13
The housing 14 is formed by the so-called snap-fit engagement with the elasticity of the above.

The cover 13 has screws (not shown) attached to hole-shaped mounting portions 13d provided at both ends in the short direction of the opening edge.
And is attached to an attachment object (not shown).

In such a semiconductor sensor, even when the connection terminal stress transmitted through the external connection terminal 12 is transmitted to the external connection terminal fixing portion 8b, the transmitted connection terminal stress is reduced. Since the connection terminal stress relief portion 8d provided between the sensor element terminal fixing portion 8a and the external connection terminal fixing portion 8b alleviates the transmission to the sensor element terminal fixing portion 8a, The connection terminal stress is not transmitted to the sensor element 6 via the sensor element terminal 7, and the pressure sensing characteristics of the sensor element 6 are not affected.

Further, even when the housing stress transmitted through the housing 14 is transmitted to the fixed portion, the transmitted housing stress causes the sensor element terminal fixing portion 8a and the fixed portion 8c to be in contact with each other. The connection terminal stress is transmitted to the sensor element 6 via the sensor element terminal 7 without being transmitted to the sensor element terminal fixing portion 8a because the housing stress relief portion 8e provided therebetween relieves the stress. It ’s gone,
The effect of not affecting the pressure detection characteristics of the sensor element 6 can be further achieved.

In this embodiment, the circuit board 8 includes
Connection terminal stress relaxing portion 8d and housing stress relaxing portion 8e
However, for example, when there is no possibility that the housing stress transmitted through the housing 14 is transmitted to the fixed portion 8c, only the connection terminal stress relaxing portion 8d is provided as shown in FIG. If there is no possibility that the connection terminal stress transmitted through the external connection terminal 12 is transmitted to the external connection terminal fixing portion 8b, only the housing stress relaxation portion 8e is provided as shown in FIG. It may be provided.

Although the semiconductor sensor of the present embodiment is a pressure sensor, other sensors such as an acceleration sensor can provide the same effect.

[0029]

According to the semiconductor sensor of the present invention, even if the connection terminal stress transmitted through the external connection terminal is transmitted to the external connection terminal fixing portion, the transmitted connection terminal stress is transmitted. Is mitigated by the connection terminal stress relieving portion provided between the sensor element terminal fixing portion and the external connection terminal fixing portion, and is not transmitted to the sensor element terminal fixing portion. No connection terminal stress is transmitted to the sensor element via the sensor element, and the pressure sensing characteristic of the sensor element is not affected.

In the semiconductor sensor according to the present invention, even if the housing stress transmitted through the housing is transmitted to the fixed portion, the transmitted housing stress is transmitted to the sensor element terminal fixing portion by the sensor element terminal fixing portion. Because it is relieved by the housing stress relieving part provided between the fixing part
A claim that the stress is not transmitted to the sensor element terminal fixing portion, the connection terminal stress is not transmitted to the sensor element via the sensor element terminal, and the pressure sensing characteristics of the sensor element are not affected. The effects of the semiconductor sensor according to item 1 can be further exhibited.

In the semiconductor sensor according to the third aspect, even when the housing stress transmitted via the housing is transmitted to the fixed portion, the transmitted housing stress is transmitted to the sensor element terminal fixing portion by the sensor element terminal fixing portion. Because it is relieved by the housing stress relieving part provided between the fixing part
The stress is not transmitted to the sensor element terminal fixing portion, the connection terminal stress is not transmitted to the sensor element via the sensor element terminal, and the pressure sensing characteristics of the sensor element are not affected.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is a perspective view showing a state in which a substrate is fixed to the above-mentioned body.

FIG. 4 is a perspective view of a circuit board provided with only connection terminal stress relieving portions.

FIG. 5 is a perspective view of a circuit board provided with only a housing stress relieving portion.

FIG. 6 is an exploded perspective view of a conventional example.

FIG. 7 is a sectional view of the above.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor sensor chip 6 Sensor element 7 Sensor element terminal 8 Circuit board 8a Sensor element terminal fixing part 8b External connection terminal fixing part 8c Fixed part 8d Connection terminal stress relieving part 8e Housing stress relieving part 12 External connection terminal 14 Housing

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F055 AA40 BB20 CC02 DD05 EE14 FF23 GG12 4M112 AA01 BA01 CA11 CA13 EA03 FA09 GA01 GA03

Claims (3)

[Claims] A sensor element for supporting a semiconductor sensor chip and leading a sensor element terminal;
A substrate provided with a sensor element terminal fixing portion for fixing the sensor element terminal and an external connection terminal fixing portion for fixing the external connection terminal, wherein the substrate comprises the sensor element terminal fixing portion; A semiconductor sensor, comprising: a connection terminal stress relieving portion for relieving a connection terminal stress transmitted via the external connection terminal, between the external connection terminal fixing portion and the fixing portion. 2. A housing for fixing the fixed portion provided on the substrate and supporting the substrate, wherein the substrate is provided between the sensor element terminal fixing portion and the fixed portion via a housing. 2. The semiconductor sensor according to claim 1, further comprising a housing stress relieving portion for relieving the transmitted housing stress. 3. A sensor element supporting a semiconductor sensor chip and having a sensor element terminal derived therefrom,
A semiconductor sensor, comprising: a substrate provided with a sensor element terminal fixing portion for fixing a sensor element terminal; and a housing for fixing a fixed portion provided on the substrate and supporting the substrate. A semiconductor sensor, comprising: a housing stress relieving portion that relieves a housing stress transmitted via the housing between a terminal fixing portion and the fixed portion.