JP2003130749A - Pressure sensor - Google Patents
Pressure sensorInfo
- Publication number
- JP2003130749A JP2003130749A JP2001331466A JP2001331466A JP2003130749A JP 2003130749 A JP2003130749 A JP 2003130749A JP 2001331466 A JP2001331466 A JP 2001331466A JP 2001331466 A JP2001331466 A JP 2001331466A JP 2003130749 A JP2003130749 A JP 2003130749A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- sensor chip
- circuit element
- mounting surface
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、圧力センサに関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor.
【０００２】[0002]
【従来の技術】従来より、ガスや液体などの被圧力検出
流体の圧力に応じて電気信号を出力するセンサチップ
と、前記センサチップからの電気信号を増幅するととも
に温度補償を行う増幅・温度補償用ＩＣ（以下「ＩＣ」
と略す）と、センサチップ及びＩＣを内部に収納し、前
記流体を内部に導入する圧力導入孔を有するハウジング
とを備えた圧力センサが提供されている。2. Description of the Related Art Conventionally, a sensor chip that outputs an electric signal according to the pressure of a fluid to be detected such as a gas or a liquid, and an amplification / temperature compensation that amplifies the electric signal from the sensor chip and performs temperature compensation IC (hereinafter "IC")
Abbreviated) and a housing having a sensor chip and an IC housed therein and having a pressure introduction hole for introducing the fluid therein is provided.
【０００３】このような圧力センサは、ハウジングの底
面を実装面として実装基板に略対向させた形で実装され
る。そして、外部の被圧力検出流体が圧力導入孔からハ
ウジング内部に導入されると、センサチップは前記流体
の圧力に応じた電気信号を出力して、この電気信号は、
ＩＣにより増幅されるとともに周囲の温度によって変動
しないように補正され、ハウジングに設けられた出力端
を介して実装基板に実装された他の電子部品に出力され
る。Such a pressure sensor is mounted in such a manner that the bottom surface of the housing is a mounting surface and is substantially opposed to the mounting substrate. Then, when an external pressure detection fluid is introduced into the housing through the pressure introduction hole, the sensor chip outputs an electric signal according to the pressure of the fluid, and the electric signal is
The signal is amplified by the IC, corrected so as not to fluctuate according to the ambient temperature, and output to another electronic component mounted on the mounting board via the output end provided on the housing.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来例では、ハウジング内部にセンサチップとＩＣとがハ
ウジングの実装面と略平行な面に沿って並べて実装され
ていることによって、ハウジングの実装面が広くなって
しまうといった問題があった。However, in the above-mentioned conventional example, since the sensor chip and the IC are mounted inside the housing side by side along a surface substantially parallel to the mounting surface of the housing, the mounting surface of the housing is There was a problem that it would become wider.
【０００５】本発明は上記問題点の解決を目的とするも
のであり、ハウジングの実装面が小さくなるように小型
化を図った圧力センサを提供する。An object of the present invention is to solve the above problems, and to provide a pressure sensor which is downsized so that the mounting surface of the housing becomes small.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、請求項１の発明は、被圧力検出流体の圧力に応じて
電気信号を出力するセンサチップと、前記センサチップ
からの電気信号を信号処理する回路素子と、前記センサ
チップ及び回路素子を内部に収納して、前記流体を内部
に導入する圧力導入孔を有するハウジングとを備えて、
ハウジングにはセンサチップと回路素子を電気的に接続
する配線パターンが形成された圧力センサであって、セ
ンサチップ及び回路素子は、それぞれのハウジングの実
装面に対する略垂直方向の投影の少なくとも一部が、互
いに重なるように配置されたことを特徴とし、センサチ
ップ及び回路素子をそれぞれの投影の少なくとも一部が
互いに重なるように配置したことによって、従来例のよ
うにセンサチップと回路素子をハウジングの実装面と略
平行な面に並べて配置する場合と比べて、ハウジングの
実装面に対するセンサチップ及び回路素子の投影面積が
小さくなるため、ハウジングの実装面を小さくして小型
化を図ることができる。In order to achieve the above object, the invention of claim 1 provides a sensor chip for outputting an electric signal according to the pressure of a fluid to be pressure-detected, and an electric signal from the sensor chip. A circuit element for signal processing, and a housing having the sensor chip and the circuit element housed therein and having a pressure introducing hole for introducing the fluid therein,
A pressure sensor in which a wiring pattern for electrically connecting a sensor chip and a circuit element is formed in a housing, and the sensor chip and the circuit element have at least a part of a projection in a substantially vertical direction on a mounting surface of each housing. , The sensor chip and the circuit element are arranged so that at least a part of their respective projections overlap each other, so that the sensor chip and the circuit element are mounted on the housing as in the conventional example. Since the projected area of the sensor chip and the circuit element with respect to the mounting surface of the housing is smaller than that in the case of arranging them side by side on a surface substantially parallel to the surface, the mounting surface of the housing can be made smaller and miniaturization can be achieved.
【０００７】請求項２の発明は、請求項１の発明におい
て、ハウジング内部における実装面側の内面には、前記
実装面と反対方向に突出する段差部が設けられるととも
に、前記段差部には、前記内面と略対向するように内部
基板が載置され、センサチップは前記内面に沿って配置
されて、回路素子は、前記内部基板上に配置されたこと
を特徴とし、請求項１と同様の作用を奏する。According to a second aspect of the present invention, in the first aspect of the invention, a step portion projecting in a direction opposite to the mounting surface is provided on the inner surface of the housing on the mounting surface side, and the step portion has The internal substrate is placed so as to substantially face the inner surface, the sensor chip is arranged along the inner surface, and the circuit element is arranged on the internal substrate. Play an action.
【０００８】請求項３の発明は、請求項１の発明におい
て、ハウジング内部における実装面側の内面には、前記
実装面と反対方向に突出する段差部が設けられ、センサ
チップは前記内面に沿って配置されて、回路素子は、セ
ンサチップと略対向するように前記段差部に配置された
ことを特徴とし、請求項１と同様の作用を奏する。According to a third aspect of the present invention, in the first aspect of the present invention, a step portion projecting in a direction opposite to the mounting surface is provided on the inner surface of the housing on the mounting surface side, and the sensor chip extends along the inner surface. And the circuit element is disposed in the step portion so as to substantially face the sensor chip, and the same operation as in claim 1 is achieved.
【０００９】請求項４の発明は、請求項３の発明におい
て、段差部における回路素子の配置面には溝部が設けら
れ、配線パターンは前記溝部を通して形成されたことを
特徴とし、前記配線パターンが溝部を通して形成されて
いることによって、配線パターンと回路素子との接触を
避けて、両者の間でショートするのを防止することがで
きる。According to a fourth aspect of the present invention, in the third aspect of the invention, a groove portion is provided on the stepped portion on which the circuit element is arranged, and the wiring pattern is formed through the groove portion. By being formed through the groove portion, it is possible to avoid contact between the wiring pattern and the circuit element and prevent a short circuit between them.
【００１０】請求項５の発明は、請求項１の発明におい
て、ハウジングは、実装面側と、実装面と反対側にそれ
ぞれ収納部を有し、センサチップ及び回路素子は、それ
ぞれ各収納部に分かれて収納されて、それぞれが収納さ
れる収納部における他方の収納部側の内面に配置された
ことを特徴とし、請求項１と同様の作用を奏する。According to a fifth aspect of the present invention, in the first aspect of the present invention, the housing has storage portions on the mounting surface side and on the side opposite to the mounting surface, respectively, and the sensor chip and the circuit element are respectively stored in the storage portions. It is separately stored, and is arranged on the inner surface of the other storage portion side of the storage portion that stores each, and the same operation as in claim 1 is achieved.
【００１１】[0011]
【発明の実施の形態】（実施形態１）本実施形態は、図
１（ａ），（ｂ）に示すように、ガスや流体などの被圧
力検出流体の圧力に応じて電気信号を出力するセンサチ
ップ１０と、センサチップ１０からの電気信号を増幅す
るとともに温度補償を行う増幅・温度補償ＩＣ（以下
「ＩＣ」と略す）２１と、センサチップ１０及びＩＣ２
１を内部に収納し、前記流体を内部に導入する圧力導入
孔３１を有する合成樹脂製のハウジング３０とを備えて
いる。BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) In this embodiment, as shown in FIGS. 1 (a) and 1 (b), an electric signal is output according to the pressure of a pressure detection fluid such as gas or fluid. The sensor chip 10, an amplification / temperature compensation IC (hereinafter abbreviated as “IC”) 21 that amplifies an electric signal from the sensor chip 10 and performs temperature compensation, the sensor chip 10 and the IC 2
1 is housed inside, and a housing 30 made of synthetic resin having a pressure introducing hole 31 for introducing the fluid therein is provided.
【００１２】センサチップ１０は、撓み自在に形成され
たダイアフラム部を有する半導体基板を備えており、流
体の圧力によりダイアフラム部が撓むと、半導体基板に
設けられた４つのピエゾ抵抗からなるブリッジ回路か
ら、前記撓みに応じた電気信号を出力する。The sensor chip 10 is provided with a semiconductor substrate having a flexibly formed diaphragm portion. When the diaphragm portion is bent by the pressure of fluid, the sensor chip 10 is provided with a bridge circuit composed of four piezoresistors provided on the semiconductor substrate. , And outputs an electric signal according to the deflection.
【００１３】ハウジング３０は、一面を開口する略矩形
箱状のハウジング本体３０ａと、ハウジング本体３０ａ
の底面３７ａ略中央部から略垂直に突出する圧力導入管
３０ｂと、ハウジング本体３０ａの開口面を塞ぐ略矩形
平板状の蓋体３０ｃとからなる。The housing 30 has a substantially rectangular box-shaped housing body 30a having an opening on one side, and a housing body 30a.
The bottom surface 37a is composed of a pressure introducing pipe 30b that projects substantially vertically from a substantially central portion, and a substantially rectangular flat plate-shaped lid 30c that closes the opening surface of the housing body 30a.
【００１４】ハウジング本体３０ａと圧力導入管３０ｂ
は一体に形成されており、圧力導入管３０ｂ内部と本体
３０ａ内部とは導通して上述の圧力導入孔３１が構成さ
れている。Housing body 30a and pressure introducing pipe 30b
Are integrally formed, and the inside of the pressure introducing pipe 30b and the inside of the main body 30a are electrically connected to each other to form the above-mentioned pressure introducing hole 31.
【００１５】また、ハウジング本体３０ａ内部には、底
面３７ａ側の内底面３７ｂから略垂直な方向に開口面側
に向って複数段（図１では４段）で突出する２組の階段
状の段差部３３が、それぞれハウジング本体３０ａの互
いに略対向する周壁３４に沿って形成されている。即
ち、段差部３３は、ハウジング本体３０ａの内底面３７
ｂ中央側から周部に向うに連れて、各段毎にその上面が
ハウジング本体３０ａ開口面側に近付くように形成され
ている。Further, inside the housing main body 30a, two sets of step-like steps projecting from the inner bottom surface 37b on the bottom surface 37a side in a substantially vertical direction toward the opening side in a plurality of steps (four steps in FIG. 1). The parts 33 are formed along the peripheral walls 34 of the housing body 30a, which are substantially opposite to each other. That is, the step portion 33 has the inner bottom surface 37 of the housing body 30a.
The upper surface of each step is formed so as to approach the opening side of the housing body 30a from the center side to the peripheral part.
【００１６】このようなハウジング本体３０ａには、セ
ンサチップ１０及びＩＣ２１を互いに電気的に接続する
とともに、センサチップ１０及びＩＣ２１を他の電子部
品に電気的に接続するための配線パターン３２が、内部
の段差部３３から周壁３４の外側を介して底面３７ａの
周部にまで形成されており、ハウジング３０は立体回路
部品（ＭＩＤ：Molded Interconnect Devices）として
構成されている。そして本実施形態が他の実装基板に実
装されるときには、本実施形態は、ハウジング３０にお
けるハウジング本体３０ａの底面３７ａ又は底面３７ａ
と反対側の面を実装面として前記実装基板に略対向させ
た形で実装される。Inside the housing body 30a, a wiring pattern 32 for electrically connecting the sensor chip 10 and the IC 21 to each other and electrically connecting the sensor chip 10 and the IC 21 to other electronic parts is provided inside. Is formed from the step portion 33 to the peripheral portion of the bottom surface 37a through the outside of the peripheral wall 34, and the housing 30 is configured as a three-dimensional circuit component (MID: Molded Interconnect Devices). When the present embodiment is mounted on another mounting board, the present embodiment is arranged such that the bottom surface 37a or the bottom surface 37a of the housing body 30a in the housing 30 is the same.
The surface opposite to the mounting surface is mounted so as to face the mounting substrate.
【００１７】また、ハウジング本体３０ａ内部には、ガ
ラスエポキシ樹脂からなる内部基板２０が、内底面３７
ｂと隙間をあけて略対向するように、両段差部３３，３
３に載置されている。即ち、内部基板２０の周縁部が、
両段差部３３，３３における内底面３７ｂから２段目の
上面とその周辺部に固定されているのである。Inside the housing body 30a, the inner substrate 20 made of glass epoxy resin is provided with an inner bottom surface 37.
b so as to be substantially opposed to b with a gap therebetween.
It is placed in 3. That is, the peripheral portion of the internal substrate 20 is
The two step portions 33, 33 are fixed to the upper surface of the second step from the inner bottom surface 37b and its peripheral portion.
【００１８】ここで上述のセンサチップ１０は、ハウジ
ング本体３０ａ内部の内底面３７ｂに、圧力導入孔３１
の開口面を塞ぐように、ダイアフラム部を前記開口面に
略対向させて配置され、センサチップ１０表面に設けら
れた上述のブリッジ回路の入出力端は、ハウジング本体
３０ａ内部の配線パターン３２にワイヤ９１で接続され
る。In the sensor chip 10 described above, the pressure introducing hole 31 is formed on the inner bottom surface 37b inside the housing body 30a.
The diaphragm portion is disposed so as to substantially face the opening surface of the sensor chip 10, and the input / output ends of the above-mentioned bridge circuit provided on the surface of the sensor chip 10 are connected to the wiring pattern 32 inside the housing body 30a by a wire. Connected at 91.
【００１９】そして、ＩＣ２１は内部基板２０に配置さ
れて、ＩＣ２１の入出力端はワイヤ９２で段差部３３上
に設けられた配線パターン３２に接続される。The IC 21 is arranged on the internal substrate 20, and the input / output end of the IC 21 is connected to the wiring pattern 32 provided on the step portion 33 by the wire 92.
【００２０】本実施形態では、上述のようにセンサチッ
プ１０及びＩＣ２１を配置することで、それぞれのハウ
ジング３０の実装面に対する略垂直方向の投影が、互い
に重なるようにしている。In the present embodiment, the sensor chip 10 and the IC 21 are arranged as described above so that the projections of the respective housings 30 in the substantially vertical direction on the mounting surface overlap each other.
【００２１】これにより、本実施形態では、従来例のよ
うにセンサチップ及びＩＣをハウジングの実装面と略平
行な面に並べて実装する場合と比べて、ハウジング３０
の実装面、つまりハウジング３０におけるハウジング本
体３０ａの底面３７ａ及び底面３７ａと反対側の面を小
さくして小型化を図ることができる。その結果、本実施
形態が実装される実装基板に対して、他の電子部品を実
装するためのスペースを広くすることができるのであ
る。
（実施形態２）本実施形態における基本構成は実施形態
１と共通するために共通する部分については同一の符号
を付して説明を省略し、本実施形態の特徴となる部分に
ついてのみ詳細に説明する。As a result, in this embodiment, compared to the case where the sensor chip and the IC are mounted side by side on a surface substantially parallel to the mounting surface of the housing as in the conventional example, the housing 30 is mounted.
The mounting surface, that is, the bottom surface 37a of the housing body 30a of the housing 30 and the surface on the side opposite to the bottom surface 37a can be made smaller to achieve miniaturization. As a result, it is possible to increase the space for mounting other electronic components on the mounting board on which the present embodiment is mounted. (Embodiment 2) Since the basic configuration of this embodiment is the same as that of the first embodiment, common parts are designated by the same reference numerals and description thereof is omitted, and only the characteristic parts of this embodiment will be described in detail. To do.
【００２２】本実施形態では、図２（ａ），（ｂ）に示
すように、実施形態１の内部基板２０をハウジング本体
３０ａ内部の段差部３３に載置せずに、ＩＣ２１をセン
サチップ１０に隙間をあけて略対向させた状態で両段差
部３３，３３に直接配置している。In the present embodiment, as shown in FIGS. 2A and 2B, the IC 21 is mounted on the sensor chip 10 without mounting the internal substrate 20 of the first embodiment on the step portion 33 inside the housing body 30a. They are directly arranged on both step portions 33, 33 in a state of facing each other with a gap therebetween.
【００２３】即ちＩＣ２１は、その周縁を両段差部３
３，３３における内底面３７ｂから３段目の側面に略対
向させて、両段差部３３，３３における内底面３７ｂか
ら２段目の上面を配置面として、配置されている。In other words, the IC 21 has both stepped portions 3 at the periphery thereof.
The inner bottom surface 37b of each of the stepped portions 33 and 33 is disposed to face the side surface of the third step from the inner bottom surface 37b of the step portions 33 and 33, and the upper surface of the second step from the inner bottom surface 37b of each of the step portions 33 and 33 is disposed as an arrangement surface.
【００２４】また、本実施形態では、図２（ｂ）及び図
３に示すように、段差部３３における上記配置面と、Ｉ
Ｃ２１の周縁と略対向する上記側面には、４つの溝部３
５が形成されており、配線パターン３２は、この溝部３
５を通して形成されている。これにより、本実施形態で
はＩＣ２１を段差部３３に直接配置しても、配線パター
ン３２とＩＣ２１との接触を避けて、両者の間でショー
トするのを防止することができる。
（実施形態３）本実施形態における基本構成は実施形態
１又は２と共通するために共通する部分については同一
の符号を付して説明を省略し、本実施形態の特徴となる
部分についてのみ詳細に説明する。Further, in the present embodiment, as shown in FIGS. 2B and 3, the above arrangement surface of the step portion 33 and I
Four groove portions 3 are provided on the side surface that substantially faces the peripheral edge of C21.
5 are formed, and the wiring pattern 32 is formed in the groove 3
It is formed through 5. Accordingly, in the present embodiment, even if the IC 21 is directly arranged on the step portion 33, it is possible to avoid contact between the wiring pattern 32 and the IC 21 and prevent a short circuit between the two. (Embodiment 3) Since the basic configuration of this embodiment is the same as that of the first or second embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted. Only the characteristic parts of this embodiment will be described in detail. Explained.
【００２５】本実施形態のハウジング本体３０ａは、図
４（ａ），（ｂ）に示すように、２つの収納部３６ａ，
３６ｂを有している。各収納部３６ａ，３６ｂはそれぞ
れ互いに反対方向に開口する凹所からなる。なお、図４
では各収納部３６ａ，３６ｂの開口を塞ぐ蓋体を省略し
ている。As shown in FIGS. 4A and 4B, the housing body 30a of the present embodiment has two storage portions 36a,
It has 36b. Each of the storage portions 36a and 36b is a recess that opens in the opposite direction. Note that FIG.
Then, the lid that closes the openings of the storage portions 36a and 36b is omitted.
【００２６】そして、圧力導入管３０ｂは、ハウジング
本体３０ａにおける収納部３６ａ，３６ｂの開口面と略
垂直な方向に沿った側面側から、略垂直に突出して、圧
力導入管３０ｂの内部がハウジング本体３０ａの収納部
３６ｂに導通して圧力導入孔３１が構成されている。The pressure introducing pipe 30b projects substantially vertically from the side surface of the housing body 30a along a direction substantially perpendicular to the opening surfaces of the storage portions 36a and 36b, and the inside of the pressure introducing pipe 30b is located inside the housing body. A pressure introducing hole 31 is formed so as to be electrically connected to the storage portion 36b of 30a.
【００２７】また、各収納部３６ａ，３６ｂ内部にはそ
れぞれ、実施形態１及び２と同様、２組の段差部３３，
３３が形成され、複数の配線パターン３２は、収納部３
６ａの段差部３３からハウジング本体３０ａ側面を介し
て収納部３６ｂの段差部３３にかけて形成されている。Further, in each of the storage portions 36a and 36b, as in the first and second embodiments, two sets of step portions 33,
33 is formed, and the plurality of wiring patterns 32 are formed in the storage portion 3
It is formed from the step portion 33 of 6a to the step portion 33 of the storage portion 36b via the side surface of the housing body 30a.
【００２８】センサチップ１０は、収納部３６ｂ内部の
収納部３６ａ側の内底面３７ｂに実装されて、センサチ
ップ１０の入出力端はワイヤ９１により収納部３６ｂの
段差部３３に形成された配線パターン３２に接続されて
いる。The sensor chip 10 is mounted on the inner bottom surface 37b of the storage portion 36b on the side of the storage portion 36a, and the input / output end of the sensor chip 10 is a wiring pattern formed on the step portion 33 of the storage portion 36b by the wire 91. Connected to 32.
【００２９】ＩＣ２１は、収納部３６ａ内部の収納部３
６ｂ側の内底面３７ｃに実装されて、ＩＣ２１の入出力
端はワイヤ９２により収納部３６ａの段差部３３に形成
された配線パターン３２に接続されている。The IC 21 is a storage unit 3 inside the storage unit 36a.
The IC 21 is mounted on the inner bottom surface 37c on the 6b side, and the input / output end of the IC 21 is connected by a wire 92 to the wiring pattern 32 formed on the stepped portion 33 of the housing portion 36a.
【００３０】そしてこのような本実施形態が他の実装基
板に実装されるときには、本実施形態は、ハウジング３
０におけるハウジング本体３０ａの収納部３６ａ開口面
に沿った面、又はハウジング本体３０ａの収納部３６ｂ
開口面に沿った面を、実装面として前記実装基板に略対
向させた形で実装される。ここで、前記何れか一方の面
を実装面として本実施形態を実装基板に実装したときに
は、ハウジング３０本体３０ａの実装面側と、実装面と
反対側に収納部３６ａ，３６ｂが位置することとなる。When this embodiment as described above is mounted on another mounting substrate, the embodiment 3 is provided with the housing 3
0, the surface of the housing body 30a along the opening surface of the housing portion 36a, or the housing portion 36b of the housing body 30a.
The mounting is performed with the surface along the opening surface substantially facing the mounting board as a mounting surface. Here, when the present embodiment is mounted on the mounting board with one of the surfaces as the mounting surface, the housing portions 36a and 36b are located on the mounting surface side of the housing 30 main body 30a and on the opposite side to the mounting surface. Become.
【００３１】本実施形態では、上述のようにセンサチッ
プ１０及びＩＣ２１を実装することで、実施形態１及び
２と同様、センサチップ１０及びＩＣ２１が、それぞれ
のハウジング３０の実装面に対する略垂直方向の投影
が、互いに重なるようにしている。In this embodiment, the sensor chip 10 and the IC 21 are mounted as described above, so that the sensor chip 10 and the IC 21 are arranged in a direction substantially perpendicular to the mounting surface of each housing 30, as in the first and second embodiments. The projections are made to overlap each other.
【００３２】これにより、ハウジング３０の実装面、つ
まりハウジング本体３０ａの収納部３６ａ開口面に沿っ
た面、及びハウジング本体３０ａの収納部３６ｂ開口面
に沿った面を小さくして小型化を図ることができる。As a result, the mounting surface of the housing 30, that is, the surface along the opening surface of the housing portion 36a of the housing body 30a and the surface along the opening surface of the housing portion 36b of the housing body 30a can be reduced to achieve miniaturization. You can
【００３３】[0033]
【発明の効果】請求項１の発明は、被圧力検出流体の圧
力に応じて電気信号を出力するセンサチップと、前記セ
ンサチップからの電気信号を信号処理する回路素子と、
前記センサチップ及び回路素子を内部に収納して、前記
流体を内部に導入する圧力導入孔を有するハウジングと
を備えて、ハウジングにはセンサチップと回路素子を電
気的に接続する配線パターンが形成された圧力センサで
あって、センサチップ及び回路素子は、それぞれのハウ
ジングの実装面に対する略垂直方向の投影の少なくとも
一部が、互いに重なるように配置されたので、センサチ
ップ及び回路素子をそれぞれの投影の少なくとも一部が
互いに重なるように配置したことによって、従来例のよ
うにセンサチップと回路素子をハウジングの実装面と略
平行な面に並べて配置する場合と比べて、ハウジングの
実装面に対するセンサチップ及び回路素子の投影面積が
小さくなるため、ハウジングの実装面を小さくして小型
化を図ることができるという効果がある。According to the invention of claim 1, a sensor chip for outputting an electric signal according to the pressure of the fluid to be pressure-detected, and a circuit element for processing the electric signal from the sensor chip are provided.
A housing having the sensor chip and the circuit element housed therein and having a pressure introducing hole for introducing the fluid therein is provided, and a wiring pattern for electrically connecting the sensor chip and the circuit element is formed in the housing. In the pressure sensor, the sensor chip and the circuit element are arranged so that at least a part of the projections in the substantially vertical direction with respect to the mounting surface of the respective housings are overlapped with each other. Since at least a part of the sensor chip and the circuit element are arranged so as to be overlapped with each other, the sensor chip with respect to the mounting surface of the housing is compared to the case where the sensor chip and the circuit element are arranged side by side on a surface substantially parallel to the mounting surface of the housing. Also, since the projected area of the circuit element becomes smaller, the mounting surface of the housing can be made smaller and the size can be reduced. There is an effect that that.
【００３４】請求項２の発明は、ハウジング内部におけ
る実装面側の内面には、前記実装面と反対方向に突出す
る段差部が設けられるとともに、前記段差部には、前記
内面と略対向するように内部基板が載置され、センサチ
ップは前記内面に沿って配置されて、回路素子は、前記
内部基板上に配置されたので、請求項１と同様の効果を
奏する。According to a second aspect of the present invention, a step portion protruding in a direction opposite to the mounting surface is provided on the inner surface of the housing on the side of the mounting surface, and the step portion is arranged so as to substantially face the inner surface. Since the internal substrate is mounted on the internal substrate, the sensor chip is disposed along the inner surface, and the circuit element is disposed on the internal substrate, the same effect as that of claim 1 is achieved.
【００３５】請求項３の発明は、ハウジング内部におけ
る実装面側の内面には、前記実装面と反対方向に突出す
る段差部が設けられ、センサチップは前記内面に沿って
配置されて、回路素子は、センサチップと略対向するよ
うに前記段差部に配置されたので、請求項１と同様の効
果を奏する。According to a third aspect of the present invention, a step portion projecting in a direction opposite to the mounting surface is provided on the inner surface of the housing on the mounting surface side, and the sensor chip is arranged along the inner surface to form a circuit element. Is disposed in the step portion so as to face the sensor chip substantially, and therefore, the same effect as that of the first aspect can be obtained.
【００３６】請求項４の発明は、段差部における回路素
子の配置面には溝部が設けられ、配線パターンは前記溝
部を通して形成されたことを特徴とし、前記配線パター
ンが溝部を通して形成されていることによって、配線パ
ターンと回路素子との接触を避けて、両者の間でショー
トするのを防止することができるという効果を奏する。According to a fourth aspect of the present invention, a groove portion is provided on the surface on which the circuit element is arranged in the step portion, and the wiring pattern is formed through the groove portion. The wiring pattern is formed through the groove portion. As a result, it is possible to avoid contact between the wiring pattern and the circuit element and prevent a short circuit between the two.
【００３７】請求項５の発明は、ハウジングは、実装面
側と、実装面と反対側にそれぞれ収納部を有し、センサ
チップ及び回路素子は、それぞれ各収納部に分かれて収
納されて、それぞれが収納される収納部における他方の
収納部側の内面に配置されたので、請求項１と同様の効
果を奏する。According to a fifth aspect of the present invention, the housing has a housing portion on the mounting surface side and a housing portion on the opposite side to the mounting surface, and the sensor chip and the circuit element are housed separately in the housing portions. Since it is arranged on the inner surface on the side of the other storage section in the storage section in which is stored, the same effect as that of claim 1 is achieved.
【図１】実施形態１を示す（ａ）は側面断面図、（ｂ）
は蓋体及び内部基板を外した状態の上面図である。FIG. 1A is a side sectional view showing Embodiment 1, and FIG.
[Fig. 4] is a top view showing a state in which a lid and an internal substrate are removed.
【図２】実施形態２を示す（ａ）は側面断面図、（ｂ）
は蓋体及び増幅・温度補償用ＩＣを外した状態の上面図
である。FIG. 2A is a side sectional view showing Embodiment 2, and FIG.
[Fig. 3] is a top view showing a state in which a lid and an IC for amplification / temperature compensation are removed.
【図３】同上の要部斜視図である。FIG. 3 is a perspective view of an essential part of the above.
【図４】実施形態３を示す（ａ）は側面断面図、（ｂ）
他の側面断面図である。FIG. 4A is a side sectional view showing the third embodiment, and FIG.
It is another side surface sectional view.
１０ センサチップ ２１ 増幅・温度補償用ＩＣ ３０ ハウジング ３０ａ ハウジング本体 ３０ｂ 圧力導入管 ３１ 圧力導入孔 ２０ 内部基板 ３７ａ 底面 ３７ｂ 内底面 10 sensor chips 21 Amplification / temperature compensation IC 30 housing 30a housing body 30b Pressure introduction pipe 31 Pressure introduction hole 20 Internal board 37a bottom 37b inner bottom
Claims (5)
を出力するセンサチップと、前記センサチップからの電
気信号を信号処理する回路素子と、前記センサチップ及
び回路素子を内部に収納して、前記流体を内部に導入す
る圧力導入孔を有するハウジングとを備えて、ハウジン
グにはセンサチップと回路素子を電気的に接続する配線
パターンが形成された圧力センサであって、センサチッ
プ及び回路素子は、それぞれのハウジングの実装面に対
する略垂直方向の投影の少なくとも一部が、互いに重な
るように配置されたことを特徴とする圧力センサ。1. A sensor chip that outputs an electric signal according to the pressure of a fluid to be pressure-detected, a circuit element that processes an electric signal from the sensor chip, and the sensor chip and the circuit element are housed inside. A pressure sensor having a housing having a pressure introducing hole for introducing the fluid therein, wherein a wiring pattern for electrically connecting the sensor chip and the circuit element is formed in the housing, the sensor chip and the circuit element Is a pressure sensor, wherein at least a part of projections of the respective housings in a direction substantially perpendicular to the mounting surface are arranged so as to overlap each other.
には、前記実装面と反対方向に突出する段差部が設けら
れるとともに、前記段差部には、前記内面と略対向する
ように内部基板が載置され、センサチップは前記内面に
沿って配置されて、回路素子は、前記内部基板上に配置
されたことを特徴とする請求項１記載の圧力センサ。2. A step portion projecting in a direction opposite to the mounting surface is provided on an inner surface of the housing on the mounting surface side, and the internal substrate is mounted on the step portion so as to substantially face the inner surface. 2. The pressure sensor according to claim 1, wherein the pressure sensor is disposed on the inner substrate, the sensor chip is disposed along the inner surface, and the circuit element is disposed on the inner substrate.
には、前記実装面と反対方向に突出する段差部が設けら
れ、センサチップは前記内面に沿って配置されて、回路
素子は、センサチップと略対向するように前記段差部に
配置されたことを特徴とする請求項１記載の圧力セン
サ。3. A step portion projecting in a direction opposite to the mounting surface is provided on an inner surface on the mounting surface side inside the housing, the sensor chip is arranged along the inner surface, and the circuit element is a sensor chip. The pressure sensor according to claim 1, wherein the pressure sensor is arranged in the step portion so as to substantially face each other.
部が設けられ、配線パターンは前記溝部を通して形成さ
れたことを特徴とする請求項３記載の圧力センサ。4. The pressure sensor according to claim 3, wherein a groove portion is provided on a surface of the stepped portion on which the circuit element is arranged, and the wiring pattern is formed through the groove portion.
対側にそれぞれ収納部を有し、センサチップ及び回路素
子は、それぞれ各収納部に分かれて収納されて、それぞ
れが収納される収納部における他方の収納部側の内面に
配置されたことを特徴とする請求項１記載の圧力セン
サ。5. The housing has a housing portion on the mounting surface side and a housing portion on the side opposite to the mounting surface, and the sensor chip and the circuit element are housed separately in the housing portions, respectively. The pressure sensor according to claim 1, wherein the pressure sensor is arranged on the inner surface of the other portion on the side of the other storage portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001331466A JP2003130749A (en) | 2001-10-29 | 2001-10-29 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001331466A JP2003130749A (en) | 2001-10-29 | 2001-10-29 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003130749A true JP2003130749A (en) | 2003-05-08 |
Family
ID=19147042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001331466A Pending JP2003130749A (en) | 2001-10-29 | 2001-10-29 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003130749A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1785708A2 (en) * | 2005-11-09 | 2007-05-16 | Aktiv Sensor GmbH | Pressure sensor component |
| JP2007315858A (en) * | 2006-05-24 | 2007-12-06 | Denso Corp | Pressure sensor |
| WO2008041607A1 (en) * | 2006-10-02 | 2008-04-10 | Panasonic Electric Works Co., Ltd. | Pressure sensor |
| JP2008089412A (en) * | 2006-10-02 | 2008-04-17 | Matsushita Electric Works Ltd | Pressure sensor |
| JP2008089559A (en) * | 2006-10-05 | 2008-04-17 | Matsushita Electric Works Ltd | Pressure sensor |
| JP2008128679A (en) * | 2006-11-16 | 2008-06-05 | Matsushita Electric Works Ltd | Pressure sensor |
| JP2008157740A (en) * | 2006-12-22 | 2008-07-10 | Matsushita Electric Works Ltd | Pressure sensor |
| US7775115B2 (en) | 2007-03-14 | 2010-08-17 | Infineon Technologies Ag | Sensor component and method for producing a sensor component |
| JP2010539685A (en) * | 2007-09-07 | 2010-12-16 | ケーエルエー−テンカー・コーポレーション | High density in-package microelectronic amplifier |
-
2001
- 2001-10-29 JP JP2001331466A patent/JP2003130749A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1785708A2 (en) * | 2005-11-09 | 2007-05-16 | Aktiv Sensor GmbH | Pressure sensor component |
| EP1785708A3 (en) * | 2005-11-09 | 2009-12-30 | Aktiv Sensor GmbH | Pressure sensor component |
| JP2007315858A (en) * | 2006-05-24 | 2007-12-06 | Denso Corp | Pressure sensor |
| US7992445B2 (en) | 2006-10-02 | 2011-08-09 | Panasonic Electric Works Co., Ltd. | Pressure sensor |
| WO2008041607A1 (en) * | 2006-10-02 | 2008-04-10 | Panasonic Electric Works Co., Ltd. | Pressure sensor |
| JP2008089412A (en) * | 2006-10-02 | 2008-04-17 | Matsushita Electric Works Ltd | Pressure sensor |
| CN101517387A (en) * | 2006-10-02 | 2009-08-26 | 松下电工株式会社 | Pressure sensor |
| JP2008089559A (en) * | 2006-10-05 | 2008-04-17 | Matsushita Electric Works Ltd | Pressure sensor |
| JP2008128679A (en) * | 2006-11-16 | 2008-06-05 | Matsushita Electric Works Ltd | Pressure sensor |
| JP2008157740A (en) * | 2006-12-22 | 2008-07-10 | Matsushita Electric Works Ltd | Pressure sensor |
| US7775115B2 (en) | 2007-03-14 | 2010-08-17 | Infineon Technologies Ag | Sensor component and method for producing a sensor component |
| DE102007012335B4 (en) * | 2007-03-14 | 2013-10-31 | Infineon Technologies Ag | Sensor component and method for producing a sensor component |
| JP2010539685A (en) * | 2007-09-07 | 2010-12-16 | ケーエルエー−テンカー・コーポレーション | High density in-package microelectronic amplifier |
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