JP5564844B2

JP5564844B2 - Electronic equipment

Info

Publication number: JP5564844B2
Application number: JP2009170311A
Authority: JP
Inventors: 敏広三宅; 隆志神谷; 卓飯田; 与志雄廣中; 政史堀
Original assignee: Denso Corp; Nippon Soken Inc
Current assignee: Denso Corp; Soken Inc
Priority date: 2009-07-21
Filing date: 2009-07-21
Publication date: 2014-08-06
Anticipated expiration: 2029-07-21
Also published as: JP2011028856A

Description

本発明は、箱状のケース内に電子回路基板が収容されてなる電子装置に関する。 The present invention relates to an electronic device in which an electronic circuit board is accommodated in a box-shaped case.

箱状のケース内に電子回路基板が収容されてなる電子装置が、例えば、特開２００３−２５８４５４号公報（特許文献１）と特開２００３−１７８８３４号公報（特許文献２）に開示されている。 An electronic device in which an electronic circuit board is accommodated in a box-like case is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-258454 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2003-178835 (Patent Document 2). .

図１０は、特許文献１に開示されている電子装置（エンジン制御ユニット）８０を示す図で、図１０（ａ）は、電子装置８０の断面図であり、図１０（ｂ）は、図１０（ａ）の要部拡大断面図である。 10 is a diagram showing an electronic device (engine control unit) 80 disclosed in Patent Document 1, FIG. 10 (a) is a cross-sectional view of the electronic device 80, and FIG. 10 (b) is a diagram of FIG. It is a principal part expanded sectional view of (a).

図１０に示す電子装置８０において、符号８１は、エンジン制御ユニットの本体部分を構成するベースで、上向きに開口した略四角形状の箱状体として一体に形成されている。ベース８１の周壁は全体として四角形の枠状をなし、回路基板８２が、その内側に嵌合されている。回路基板８２は、プリント配線が形成された略四角形状の板体により構成され、その上面側には、例えばトランジスタ、コンデンサ、コイル、半導体ＩＣ等の複数の電子部品８３が搭載されている。回路基板８２の四辺のうち、後側、左側及び右側に位置する三辺はベース８１に当接する当接縁部となり、前側に位置する一辺には、コネクタ８４が取り付けられている。 In the electronic device 80 shown in FIG. 10, reference numeral 81 denotes a base that constitutes a main body portion of the engine control unit, and is integrally formed as a substantially rectangular box-like body that opens upward. The peripheral wall of the base 81 has a rectangular frame shape as a whole, and the circuit board 82 is fitted inside thereof. The circuit board 82 is configured by a substantially rectangular plate body on which printed wiring is formed, and a plurality of electronic components 83 such as transistors, capacitors, coils, and semiconductor ICs are mounted on the upper surface side thereof. Of the four sides of the circuit board 82, the three sides located on the rear side, the left side, and the right side serve as contact edge portions that contact the base 81, and a connector 84 is attached to one side located on the front side.

コネクタ８４は、コネクタケース８５、各端子ピン８６等により構成されている。各端子ピン８６の基端側は、コネクタケース８５の下面から下向きに突出し、回路基板８２のコネクタ取り付け部に設けたプリント配線に半田付け等の手段によって固着されている。また、各端子ピン８６の先端側は、コネクタケース８５の差し込み口側に突出し、当該差し込み口に差込まれる雄コネクタの端子ピン（いずれも図示せず）に接続される構成となっている。符号８７は、回路基板８２に搭載された電子部品８３を覆うためにベース８１に取り付けられたカバーである。 The connector 84 includes a connector case 85, terminal pins 86, and the like. The base end side of each terminal pin 86 protrudes downward from the lower surface of the connector case 85 and is fixed to a printed wiring provided on the connector mounting portion of the circuit board 82 by means such as soldering. Moreover, the front end side of each terminal pin 86 protrudes in the insertion port side of the connector case 85, and becomes a structure connected to the terminal pin (all are not shown) of the male connector inserted in the said insertion port. Reference numeral 87 denotes a cover attached to the base 81 to cover the electronic component 83 mounted on the circuit board 82.

図１１は、特許文献２に開示されている電子装置９０のコネクタ側の端部を示す図で、端子側ハウジング７０との非嵌合状態を示す側断面図である。 FIG. 11 is a view showing an end portion on the connector side of the electronic device 90 disclosed in Patent Document 2, and is a side sectional view showing a non-fitted state with the terminal-side housing 70.

図１１に示す電子装置９０の基板側ハウジング９１は、端子側ハウジング７０と互いに嵌合・離脱が可能なように構成されている。なお、以下の両ハウジング９１，７０の説明においては、互いに相手側と嵌合する側を前方とする。電子装置９０のコネクタ部は、以下に示すように、端子側ハウジング７０との間で、カードエッジコネクタ構造をなしている。 A board-side housing 91 of the electronic device 90 shown in FIG. 11 is configured to be able to be fitted to and detached from the terminal-side housing 70. In the following description of the housings 91 and 70, the side that mates with the other side is the front. As shown below, the connector portion of the electronic device 90 forms a card edge connector structure with the terminal side housing 70.

電子装置９０の基板側ハウジング９１は、合成樹脂材によって形成されており、前端に開口部９３を有する横長の角筒状のフード部９２を備えている。フード部９２の奥壁９４からは、回路基板９８の端縁部が前方へ向けて突出している。また、フード部９２内には、回路基板９８を保護するための基板保護部材９９が装着されている。基板保護部材９９の中央には、回路基板９８を前後方向に挿通可能な挿通孔９９ａが形成され、基板保護部材９９はフード部９２内において、開口部９３側の保護位置から奥壁９４側の退避位置までを前後方向に沿って変位可能とされている。フード部９２の左右両内側壁には、開口部９３のすぐ奥側に抜止突起９５が上下一対ずつ設けられ、これにより保護位置の基板保護部材９９が抜け止め状態で係止される。また、各抜止突起９５からやや奥側に離間して仮係止突起９６が突設され、この仮係止突起９６と抜止突起９５との間に保護位置の基板保護部材９９が挟まれた状態で保持されるようになっている。退避位置における基板保護部材９９は、奥壁９４に接しており、このとき回路基板９８は挿通孔９９ａに挿通されて、その先端側の上下両面に形成された端子部が基板保護部材９９よりも前方に露出される。 The board-side housing 91 of the electronic device 90 is formed of a synthetic resin material, and includes a horizontally long rectangular tube-shaped hood portion 92 having an opening 93 at the front end. From the back wall 94 of the hood part 92, the edge part of the circuit board 98 protrudes toward the front. In addition, a board protection member 99 for protecting the circuit board 98 is mounted in the hood portion 92. An insertion hole 99a through which the circuit board 98 can be inserted in the front-rear direction is formed at the center of the board protection member 99. The board protection member 99 is located in the hood portion 92 from the protection position on the opening 93 side to the back wall 94 side. It is possible to displace the retracted position along the front-rear direction. A pair of upper and lower retaining projections 95 are provided on the left and right inner side walls of the hood portion 92 immediately behind the opening portion 93, whereby the substrate protection member 99 at the protected position is locked in a retaining state. In addition, a temporary locking projection 96 is provided so as to be slightly away from each retaining projection 95 and the substrate protection member 99 at the protection position is sandwiched between the temporary retaining projection 96 and the retaining projection 95. It is supposed to be held at. The board protection member 99 in the retracted position is in contact with the back wall 94. At this time, the circuit board 98 is inserted into the insertion hole 99a, and the terminal portions formed on the upper and lower surfaces on the tip side are more than the board protection member 99. Exposed forward.

一方、端子側ハウジング７０は、合成樹脂材によって形成され、横長の箱形をなしてその前端側部分を電子装置９０のフード部９２内に嵌入可能とされている。端子側ハウジング７０の内部には、電線７１の端末に接続された端子金具７２が抜け止めされた状態で収容されている。端子側ハウジング７０の前端面には、横長のスリット状に開口した差込空間７３が形成され、ここには回路基板９８が差し込み可能とされている。差込空間７３には、端子金具７２の有する弾性接触片７４の一部が突出しており、回路基板９８が差し込まれたときには弾性接触片７４が回路基板９８の上下面の端子部に対し弾性的に接触するようになっている。また、端子側ハウジング７０の前端面には、左右両側縁側に上下一対ずつ係止片７５が設けられている。一方、基板保護部材９９には、各係止片７５が進入可能な貫通孔９９ｂが対応して形成されている。さらに、フード部９２の奥壁９４には、各係止片７５の先端部が進入可能な逃がし孔９７が凹んで形成されている。 On the other hand, the terminal-side housing 70 is formed of a synthetic resin material, has a horizontally long box shape, and a front end side portion thereof can be fitted into the hood portion 92 of the electronic device 90. Inside the terminal-side housing 70, a terminal fitting 72 connected to the end of the electric wire 71 is housed in a state of being prevented from coming off. The front end surface of the terminal-side housing 70 is formed with an insertion space 73 opened in a horizontally long slit shape, into which a circuit board 98 can be inserted. A part of the elastic contact piece 74 of the terminal fitting 72 protrudes into the insertion space 73. When the circuit board 98 is inserted, the elastic contact piece 74 is elastic with respect to the terminal portions on the upper and lower surfaces of the circuit board 98. To come into contact. The front end surface of the terminal-side housing 70 is provided with a pair of upper and lower locking pieces 75 on the left and right side edges. On the other hand, the substrate protection member 99 is formed with a corresponding through hole 99b into which each locking piece 75 can enter. Further, the back wall 94 of the hood portion 92 is formed with a relief hole 97 into which the front end portion of each locking piece 75 can enter.

両ハウジング９１，７０を嵌合する際には、端子側ハウジング７０をフード部９２に正対させて接近させる。嵌合を進めると、端子側ハウジング７０の前端面が基板保護部材９９に突き当たって基板保護部材９９が奥側へ押圧され、端子側ハウジング７０と共にフード部９２の奥側へと変位する。端子側ハウジング７０が正規の嵌合状態に至ると、端子側ハウジング７０の差込空間７３内に回路基板９８が差し込まれ、各端子金具７２の弾性接触片７４が回路基板９８の端子部に弾性的に接触する。 When the two housings 91 and 70 are fitted together, the terminal-side housing 70 is made to face the hood portion 92 and approached. When the fitting is advanced, the front end face of the terminal side housing 70 abuts against the board protection member 99, the board protection member 99 is pressed to the back side, and is displaced to the back side of the hood portion 92 together with the terminal side housing 70. When the terminal-side housing 70 reaches the proper fitting state, the circuit board 98 is inserted into the insertion space 73 of the terminal-side housing 70, and the elastic contact pieces 74 of the terminal fittings 72 are elastically applied to the terminal portions of the circuit board 98. Touch.

以上のように、図１１に示す電子装置９０は、収容されている回路基板９８の端子部が電線７１の端末に接続された端子金具７２を備える端子側ハウジング７０に差し込み接続されるように構成されている。 As described above, the electronic device 90 shown in FIG. 11 is configured such that the terminal portion of the circuit board 98 accommodated therein is inserted and connected to the terminal-side housing 70 including the terminal fitting 72 connected to the terminal of the electric wire 71. Has been.

特開２００３−２５８４５４号公報JP 2003-258454 A 特開２００３−１７８８３４号公報JP 2003-178834 A

図１０に示した電子装置８０は、コネクタ８４の各端子ピン８６を回路基板８２の端子部（配線）に設けられたスルーホールに貫通させ、各端子ピン８６を半田付け等の手段で配線に固着している。このため、電子装置８０では、コネクタ８４を回路基板８２に強固に取り付けることができ、ハーネス側コネクタの抜き差しの繰り返しに対して十分な耐久性を確保することができる。一方、各端子ピン８６をスルーホールに貫通させて半田付けするコネクタ８４と回路基板８２の上記結合構造においては、隣接する端子間において、半田による短絡を防止するための一定の間隔を確保する必要があるため、小型化の妨げとなっている。また、半田付け等の接合工程を要するため、コネクタ８４と回路基板８２の組み付け工数が大きく、コスト増要因にもなっている。 In the electronic device 80 shown in FIG. 10, each terminal pin 86 of the connector 84 is passed through a through hole provided in a terminal portion (wiring) of the circuit board 82, and each terminal pin 86 is wired by means such as soldering. It is stuck. For this reason, in the electronic device 80, the connector 84 can be firmly attached to the circuit board 82, and sufficient durability can be secured against repeated insertion and removal of the harness side connector. On the other hand, in the above-described coupling structure of the connector 84 and the circuit board 82 in which the terminal pins 86 are soldered by penetrating through the through holes, it is necessary to ensure a certain interval between adjacent terminals to prevent a short circuit due to solder. This hinders miniaturization. Further, since a joining process such as soldering is required, the number of steps for assembling the connector 84 and the circuit board 82 is large, which causes a cost increase.

逆に、図１１に示した電子装置９０は、回路基板９８の端縁部に設けられた端子部をそのまま端子金具７２の弾性接触片７４に対応する接点部としているため、図１０の電子装置８０のような半田付け等の接合工程は不要であり、回路基板９８の端子部の間隔を狭めて、小型化することが可能である。しかしながら、電子装置９０においては、端子側ハウジング７０の嵌合前の状態では、回路基板９８の端子部が外部に露出する構造であるため、端子部の間隔を狭めて小型化すると塵や水滴の付着に対して弱い構造となってしまう。また、半田付け等の接合工程は不要であるものの、基板側ハウジング９１は基板保護部材９９のような複雑構造の部品を必要とし、これがコスト要因になっている。 On the contrary, the electronic device 90 shown in FIG. 11 uses the terminal portion provided at the edge of the circuit board 98 as a contact portion corresponding to the elastic contact piece 74 of the terminal fitting 72 as it is. A joining step such as soldering as in 80 is unnecessary, and the distance between the terminal portions of the circuit board 98 can be reduced to reduce the size. However, the electronic device 90 has a structure in which the terminal portions of the circuit board 98 are exposed to the outside before the terminal-side housing 70 is fitted. The structure is weak against adhesion. In addition, although a bonding process such as soldering is not necessary, the board-side housing 91 requires a component having a complicated structure such as the board protection member 99, which is a cost factor.

そこで本発明は、箱状のケース内に電子回路基板が収容されてなる電子装置であって、端子部の間隔を狭めてコネクタを小型化することができ、電子回路基板への塵や水滴の付着を防止すると共に、簡単な構造で安価な電子装置を提供することを目的としている。 Therefore, the present invention is an electronic device in which an electronic circuit board is housed in a box-shaped case, and the connector can be miniaturized by reducing the interval between the terminal portions, and dust and water droplets on the electronic circuit board can be reduced. An object of the present invention is to provide an inexpensive electronic device with a simple structure while preventing adhesion.

請求項１に記載の電子装置は、電子部品が搭載された電子回路基板と、開口部と前記電子回路基板を位置決めして保持するための基板保持部を有してなり、前記電子回路基板を収容する箱状のケースと、前記電子回路基板の端部が挿入される基板挿入孔、および前記電子回路基板を外部配線に接続するためのコネクタピンを備え、前記ケースに嵌合して前記開口部に蓋をするコネクタハウジングと、を有してなり、前記電子回路基板を前記ケースに収容し、前記コネクタハウジングで前記開口部に蓋をした状態において、バネ性を有する前記コネクタピンの一端が、前記電子回路基板に設けられた端子部に接触して、前記コネクタピンと前記電子回路基板が電気的に接続され、前記コネクタピンのもう一端が、前記コネクタハウジングで蓋をされた前記ケースの外部に露出して、前記外部配線に接続するためのコネクタとして機能する電子装置であって、前記端子部の近くに、前記電子回路基板の基板面に垂直な方向の動きを抑制する、基板押え手段が設けられてなり、前記基板押え手段が、前記基板挿入孔の先端部に充填された弾性部材からなることを特徴としている。 The electronic device according to claim 1 includes an electronic circuit board on which electronic components are mounted, and an opening and a substrate holding part for positioning and holding the electronic circuit board. A box-like case for receiving, a board insertion hole into which an end of the electronic circuit board is inserted, and a connector pin for connecting the electronic circuit board to an external wiring; A connector housing that covers the portion, and the electronic circuit board is housed in the case, and in the state where the opening is covered with the connector housing, one end of the connector pin having spring property is The connector pin and the electronic circuit board are electrically connected to contact with the terminal portion provided on the electronic circuit board, and the other end of the connector pin is covered with the connector housing. The exposed to the outside of the case, said an electronic device which functions as a connector for connecting to external wiring, in the vicinity of the terminal portion, the motion in the direction perpendicular to the substrate surface of the electronic circuit board Substrate pressing means is provided, and the substrate pressing means is made of an elastic member filled in the tip of the substrate insertion hole .

上記電子装置は、電子回路基板、該電子回路基板を収容する箱状のケース、およびケースの開口部を蓋するコネクタハウジングで構成されている。上記電子装置におけるコネクタピンと電子回路基板の電気接続は、コネクタハウジングに備えられたコネクタピンの一端が電子回路基板の端子部に接触する構成がとられている。このコネクタピンと端子部の接触による電気接続の確実性は、ケースに設けられた基板保持部で電子回路基板が所定位置に位置決め保持されること、及びコネクタハウジングがケースに嵌合して所定位置に位置決めされることによって担保される。以上のように、上記電子装置においては、コネクタピンと電子回路基板の電気接続に、コネクタピンがスルーホールを貫通する構造や半田付け等による接合工程が用いられていない。このため、上記電子装置は、電子回路基板の端子部の間隔を狭めて小型化することが可能であると共に、安価に製造することができる。 The electronic device includes an electronic circuit board, a box-shaped case that accommodates the electronic circuit board, and a connector housing that covers an opening of the case. The electrical connection between the connector pin and the electronic circuit board in the electronic device is configured such that one end of the connector pin provided in the connector housing contacts the terminal portion of the electronic circuit board. The reliability of the electrical connection due to the contact between the connector pin and the terminal portion is that the electronic circuit board is positioned and held at a predetermined position by the board holding portion provided in the case, and the connector housing is fitted into the case to the predetermined position. Secured by being positioned. As described above, in the above-described electronic device, the connector pin and the electronic circuit board are not electrically connected with a structure in which the connector pin penetrates the through hole or a joining process by soldering or the like. Therefore, the electronic device can be reduced in size by reducing the interval between the terminal portions of the electronic circuit board, and can be manufactured at low cost.

また、上記電子装置におけるコネクタハウジングは、外部配線と接続するためのコネクタとしての機能、および電子回路基板を収容しているケースの開口部に蓋をする機能を担っている。すなわち、前記コネクタピンのもう一端が、コネクタハウジングで蓋をされたケースの外部に露出して、外部配線に接続するコネクタとして機能する構成となっている。外部からみた上記電子装置のコネクタ構造は、差し込み口に前記コネクタピンのもう一端が突き出た、簡単な構造のものであってよい。また、ケースの開口部をコネクタハウジングが蓋をしているため、塵や水滴のケース内への侵入を防止することができ、電子回路基板への塵や水滴の付着とそれによる不具合を防止することができる。 The connector housing in the electronic device has a function as a connector for connecting to external wiring and a function of covering the opening of the case housing the electronic circuit board. That is, the other end of the connector pin is exposed to the outside of the case covered with the connector housing and functions as a connector connected to the external wiring. The connector structure of the electronic device viewed from the outside may be a simple structure in which the other end of the connector pin protrudes from the insertion port. In addition, since the connector housing covers the opening of the case, it is possible to prevent dust and water droplets from entering the case, and to prevent dust and water droplets from adhering to the electronic circuit board and problems caused thereby. be able to.

以上のようにして、上記電子装置は、箱状のケース内に電子回路基板が収容されてなる電子装置であって、端子部の間隔を狭めてコネクタを小型化することができ、電子回路基板への塵や水滴の付着を防止すると共に、簡単な構造で安価な電子装置とすることができる。 As described above, the electronic device is an electronic device in which an electronic circuit board is accommodated in a box-shaped case, and the connector can be miniaturized by reducing the interval between the terminal portions. In addition to preventing dust and water droplets from adhering to the battery, it is possible to provide an inexpensive electronic device with a simple structure.

また、上記電子装置は、前記端子部の近くに、前記電子回路基板の基板面に垂直な方向の動きを抑制する、基板押え手段が設けられている。 Further, the electronic device is close to the front SL terminal unit, the electronic circuit for suppressing a vertical movement on the surface of the substrate, the substrate holding means.

上記基板押え手段がない場合には、電子回路基板は、端子部の周りにおいては主としてコネクタピンの一端のバネ性によって支持されることとなり、連続的に外部から振動が与えられると、コネクタピンが壊れてしまう可能性がある。上記基板押え手段により、電子回路基板の端子部の周りにおける基板面に垂直な方向の動きを抑制することで、端子部に接触しているコネクタピンの一端のバネ伸縮変位を小さくし、バネ寿命を向上させることができる。
また、上記電子装置における基板押え手段は、前記基板挿入孔の先端部に充填された弾性部材からなる。
これによれば、電子回路基板の基板面に垂直な方向の動きを抑制すると共に、先端部に電子回路基板を挿入したときの基板面に水平な方向の動きを抑制する機能も持たせることができる。
上記電子装置は、さらに請求項２に記載のように、前記電子回路基板の端子部の近くにおいて、前記端部の上下面に貼り合わされた弾性部材からなる第２の基板押え手段を有してなることが好ましい。該弾性部材も、電子回路基板が基板挿入孔に挿入された状態で、電子回路基板の基板面に垂直な方向の動きを抑制することができる。
また、請求項３に記載のように、前記コネクタハウジングが、前記電子回路基板の上面側と下面側にそれぞれ位置して互いに嵌合する、上側ハウジング部と下側ハウジング部に分割されてなる構成とすることも可能である。
これによれば、コネクタハウジングと電子回路基板のいずれか一方に基板押え手段が設けられている場合であっても、電子回路基板を上側ハウジング部と下側ハウジング部で挟み込むようにして組み付けることができるため、コネクタハウジングと電子回路基板の相互組み付けを容易に行うことができる。また、基板押え手段として弾性部材をコネクタハウジングの前記基板挿入孔に取り付ける場合においても、該取り付けを容易に行うことができる。 In the absence of the board pressing means, the electronic circuit board is mainly supported by the spring property of one end of the connector pin around the terminal portion. There is a possibility of breaking. By suppressing the movement in the direction perpendicular to the board surface around the terminal part of the electronic circuit board by the board holding means, the spring expansion / contraction displacement at one end of the connector pin in contact with the terminal part is reduced, and the spring life Can be improved.
Further, the substrate pressing means in the electronic device is made of an elastic member filled in the tip portion of the substrate insertion hole.
According to this, the function of suppressing the movement in the direction perpendicular to the substrate surface of the electronic circuit board and the function of suppressing the movement in the direction horizontal to the substrate surface when the electronic circuit board is inserted into the tip portion can be provided. it can.
According to a second aspect of the present invention, the electronic device further includes a second substrate pressing unit made of an elastic member bonded to the upper and lower surfaces of the end portion in the vicinity of the terminal portion of the electronic circuit board. It is preferable to become. The elastic member can also suppress movement in a direction perpendicular to the substrate surface of the electronic circuit board in a state where the electronic circuit board is inserted into the board insertion hole.
According to a third aspect of the present invention, the connector housing is divided into an upper housing portion and a lower housing portion that are located on the upper surface side and the lower surface side of the electronic circuit board and fit to each other. It is also possible.
According to this, even when the board holding means is provided on either the connector housing or the electronic circuit board, the electronic circuit board can be assembled so as to be sandwiched between the upper housing part and the lower housing part. Therefore, the connector housing and the electronic circuit board can be easily assembled to each other. Further, even when an elastic member is attached to the board insertion hole of the connector housing as the board pressing means, the attachment can be easily performed.

請求項４に記載の電子装置は、電子部品が搭載された電子回路基板と、開口部と前記電子回路基板を位置決めして保持するための基板保持部を有してなり、前記電子回路基板を収容する箱状のケースと、前記電子回路基板の端部が挿入される基板挿入孔、および前記電子回路基板を外部配線に接続するためのコネクタピンを備え、前記ケースに嵌合して前記開口部に蓋をするコネクタハウジングと、を有してなり、前記電子回路基板を前記ケースに収容し、前記コネクタハウジングで前記開口部に蓋をした状態において、バネ性を有する前記コネクタピンの一端が、前記電子回路基板に設けられた端子部に接触して、前記コネクタピンと前記電子回路基板が電気的に接続され、前記コネクタピンのもう一端が、前記コネクタハウジングで蓋をされた前記ケースの外部に露出して、前記外部配線に接続するためのコネクタとして機能する電子装置であって、前記端子部の近くに、前記電子回路基板の基板面に垂直な方向の動きを抑制する、基板押え手段が設けられてなり、前記基板押え手段が、前記電子回路基板の端子部の近くにおいて、前記端部の上下面に貼り合わされた弾性部材からなり、前記コネクタハウジングが、前記電子回路基板の上面側と下面側にそれぞれ位置して互いに嵌合する、上側ハウジング部と下側ハウジング部に分割されてなることを特徴としている。The electronic device according to claim 4 includes an electronic circuit board on which electronic components are mounted, and an opening and a board holding part for positioning and holding the electronic circuit board. A box-like case for receiving, a board insertion hole into which an end of the electronic circuit board is inserted, and a connector pin for connecting the electronic circuit board to an external wiring; A connector housing that covers the portion, and the electronic circuit board is housed in the case, and in the state where the opening is covered with the connector housing, one end of the connector pin having spring property is The connector pin and the electronic circuit board are electrically connected to contact with the terminal portion provided on the electronic circuit board, and the other end of the connector pin is covered with the connector housing. An electronic device that is exposed to the outside of the case and functions as a connector for connecting to the external wiring, and moves in a direction perpendicular to the substrate surface of the electronic circuit board near the terminal portion. Board holding means is provided, and the board holding means is made of an elastic member bonded to the upper and lower surfaces of the end portion near the terminal portion of the electronic circuit board, and the connector housing includes the connector housing, The electronic circuit board is divided into an upper housing part and a lower housing part, which are located on the upper surface side and the lower surface side of the electronic circuit board and fit to each other.
当該電子装置における基板押え手段の効果は、先の電子装置における第２の基板押え手段で説明したとおりである。また、コネクタハウジングが上側ハウジング部と下側ハウジング部に分割されてなる効果は、上記したとおりである。The effect of the substrate pressing means in the electronic device is as described in the second substrate pressing means in the previous electronic device. The effect of dividing the connector housing into the upper housing portion and the lower housing portion is as described above.

基板押え手段をコネクタハウジングと同一部材で一体成形する場合には、堅い基板押え手段と電子回路基板の間に、わずかなクリアランスが必要である。一方、上記電子装置のように、基板押え手段をコネクタハウジングとは別の弾性部材で形成する場合には、電子回路基板に基板押え手段を直接押し付けることができる。When the board holding means is integrally formed with the same member as the connector housing, a slight clearance is required between the rigid board holding means and the electronic circuit board. On the other hand, when the board pressing means is formed of an elastic member different from the connector housing as in the electronic device, the board pressing means can be directly pressed against the electronic circuit board.

請求項５に記載の電子装置は、電子部品が搭載された電子回路基板と、開口部と前記電子回路基板を位置決めして保持するための基板保持部を有してなり、前記電子回路基板を収容する箱状のケースと、前記電子回路基板の端部が挿入される基板挿入孔、および前記電子回路基板を外部配線に接続するためのコネクタピンを備え、前記ケースに嵌合して前記開口部に蓋をするコネクタハウジングと、を有してなり、前記電子回路基板を前記ケースに収容し、前記コネクタハウジングで前記開口部に蓋をした状態において、バネ性を有する前記コネクタピンの一端が、前記電子回路基板に設けられた端子部に接触して、前記コネクタピンと前記電子回路基板が電気的に接続され、前記コネクタピンのもう一端が、前記コネクタハウジングで蓋をされた前記ケースの外部に露出して、前記外部配線に接続するためのコネクタとして機能する電子装置であって、前記端子部の近くに、前記電子回路基板の基板面に垂直な方向の動きを抑制する、基板押え手段が設けられてなり、前記コネクタハウジングが、前記電子回路基板の上面側と下面側にそれぞれ位置して互いに嵌合する、上側ハウジング部と下側ハウジング部に分割されてなることを特徴としている。
尚、当該電子装置の効果は、上記したとおりである。 The electronic device according to claim 5 includes an electronic circuit board on which electronic components are mounted, and an opening and a board holding part for positioning and holding the electronic circuit board. A box-like case for receiving, a board insertion hole into which an end of the electronic circuit board is inserted, and a connector pin for connecting the electronic circuit board to an external wiring; A connector housing that covers the portion, and the electronic circuit board is housed in the case, and in the state where the opening is covered with the connector housing, one end of the connector pin having spring property is The connector pin and the electronic circuit board are electrically connected to contact with the terminal portion provided on the electronic circuit board, and the other end of the connector pin is covered with the connector housing. An electronic device that is exposed to the outside of the case and functions as a connector for connecting to the external wiring, and moves in a direction perpendicular to the substrate surface of the electronic circuit board near the terminal portion. Substrate holding means is provided, and the connector housing is divided into an upper housing portion and a lower housing portion, which are located on the upper surface side and the lower surface side of the electronic circuit board, respectively, and fit to each other. It is characterized by that.
The effects of the electronic device are as described above.

上記電子装置は、請求項６に記載のように、前記コネクタハウジングが、樹脂の射出成形によって形成されてなり、前記コネクタピンは、射出成型後に前記コネクタハウジングに圧入される。これによれば、前記射出成形時に前記コネクタピンをインサート成形する場合に較べて、製造コストを低減することができる。 The electronic device as claimed in claim 6, wherein the connector housing is made is formed by injection molding of resin, the connector pin is press-fitted into the connector housing after the injection molding. According to this, compared with the case where the connector pin is insert-molded at the time of the injection molding, the manufacturing cost can be reduced.

上記電子装置は、請求項７に記載のように、前記電子回路基板を前記ケースに収容し、前記コネクタハウジングで前記開口部に蓋をした状態において、前記コネクタハウジングと前記ケースの間が、シール部材で封止されてなる構成とすることが好ましい。これによって、塵や水滴のケース内への侵入を、確実に防止することができる。 The electronic device according to claim 7 , wherein the electronic circuit board is accommodated in the case, and the connector housing and the case are sealed in a state where the opening is covered with the connector housing. It is preferable to use a structure sealed with a member. As a result, it is possible to reliably prevent dust and water droplets from entering the case.

上記電子装置においては、例えば請求項８に記載のように、前記端子部が、前記電子回路基板の上面側と下面側にそれぞれ配置されてなる構成とすることができる。また、請求項９に記載のように、複数個の前記端子部が、前記電子回路基板の端部の先端から同じ距離にあって、列を構成するように配置されてなる構成としてもよい。さらに、この場合には請求項１０に記載のように、前記電子回路基板の端部の先端から異なる距離にある複数の前記列が、前記電子回路基板の少なくとも一方の面側に構成されていてもよい。これらの各構成によって、電子回路基板の端子部の間隔を狭めて、小型化を図ることができる。 In the electronic device, for example, as described in claim 8 , the terminal portions may be arranged on the upper surface side and the lower surface side of the electronic circuit board, respectively. According to a ninth aspect of the present invention, the plurality of terminal portions may be arranged so as to form a row at the same distance from the tip of the end portion of the electronic circuit board. Further, as described in claim 1 0 In this case, a plurality of said rows at different distances from the tip end of the electronic circuit board, is configured on at least one surface side of the electronic circuit board May be. With each of these configurations, the distance between the terminal portions of the electronic circuit board can be narrowed to reduce the size.

従って、上記電子装置は、請求項１１に記載のように、振動や塵や水滴の付着し易い過酷な環境下で使用され、小型で安価であることが要求される車載用電子装置として好適である。 Accordingly, the electronic apparatus, as described in claim 1 1, used in adhering easily harsh vibration environments and dust or water droplets, suitable as a vehicle-mounted electronic apparatus to be inexpensive is required in a small It is.

本発明に係る電子装置の一例を示す図で、電子装置１００の模式的な断面図である。1 is a diagram illustrating an example of an electronic device according to the present invention, and is a schematic cross-sectional view of an electronic device 100. FIG. 図１に示す電子装置１００の分解図で、（ａ）は電子回路基板１０の斜視断面図であり、（ｂ）はケース２０の断面図であり、（ｃ）はコネクタハウジング３０の断面図である。1 is an exploded view of the electronic device 100 shown in FIG. 1, (a) is a perspective sectional view of the electronic circuit board 10, (b) is a sectional view of the case 20, and (c) is a sectional view of the connector housing 30. is there. 図１に示す電子装置１００の２通りの組み付け方法を説明する図で、（ａ），（ｂ）は、それぞれ、電子回路基板１０、ケース２０およびコネクタハウジング３０の組み付け手順を示した図である。FIGS. 2A and 2B are diagrams illustrating two assembling methods of the electronic device 100 illustrated in FIG. 1, and FIGS. 3A and 3B are diagrams illustrating assembling procedures of the electronic circuit board 10, the case 20, and the connector housing 30, respectively. . （ａ），（ｂ）は、それぞれ、図１に示す電子装置１００に対して、ハーネス側の端子ハウジング６０を接続する過程を示した図である。(A), (b) is the figure which showed the process which connects the terminal housing 60 by the side of a harness with respect to the electronic device 100 shown in FIG. 1, respectively. 図１に示した電子装置１００の変形例で、（ａ）は、電子装置１０１の模式的な断面図であり、（ｂ）は、電子回路基板１０ａの斜視断面図である。In the modification of the electronic device 100 shown in FIG. 1, (a) is a schematic sectional view of the electronic device 101, and (b) is a perspective sectional view of the electronic circuit board 10a. 図１に示した電子装置１００の別の変形例で、電子装置１０２の模式的な断面図である。FIG. 6 is a schematic cross-sectional view of an electronic device 102 as another modification of the electronic device 100 shown in FIG. 1. 図１に示した電子装置１００の別の変形例で、電子装置１０３の模式的な断面図である。FIG. 6 is a schematic cross-sectional view of an electronic device 103 as another modification of the electronic device 100 shown in FIG. 1. 別の電子装置の例で、（ａ）は電子装置１０４の模式的な断面図であり、（ｂ）はコネクタハウジング５０ｄの断面図であり、（ｃ）は電子回路基板１０ｃの斜視断面図である。In another example of the electronic device, (a) is a schematic cross-sectional view of the electronic device 104, (b) is a cross-sectional view of the connector housing 50d, and (c) is a perspective cross-sectional view of the electronic circuit board 10c. is there. 別の電子装置の例で、（ａ）は電子装置１０５の模式的な断面図であり、（ｂ）はコネクタハウジング５０ｅの分解図である。In another example of the electronic device, (a) is a schematic cross-sectional view of the electronic device 105, and (b) is an exploded view of the connector housing 50e. 特許文献１に開示されている電子装置（エンジン制御ユニット）８０を示す図で、（ａ）は、電子装置８０の断面図であり、（ｂ）は、（ａ）の要部拡大断面図である。It is a figure which shows the electronic device (engine control unit) 80 currently disclosed by patent document 1, (a) is sectional drawing of the electronic device 80, (b) is the principal part expanded sectional view of (a). is there. 特許文献２に開示されている電子装置９０のコネクタ側の端部を示す図で、端子側ハウジング７０との非嵌合状態を示す側断面図である。FIG. 10 is a view showing an end portion on the connector side of an electronic device 90 disclosed in Patent Document 2, and is a side sectional view showing a non-fitted state with a terminal-side housing 70.

以下、本発明を実施するための形態を、図に基づいて説明する。 DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

図１は、本発明に係る電子装置の一例を示す図で、電子装置１００の模式的な断面図である。図２は、図１に示す電子装置１００の分解図で、図２（ａ）は電子回路基板１０の斜視断面図であり、図２（ｂ）はケース２０の断面図であり、図２（ｃ）はコネクタハウジング３０の断面図である。図３は、図１に示す電子装置１００の２通りの組み付け方法を説明する図で、図３（ａ），（ｂ）は、それぞれ、電子回路基板１０、ケース２０およびコネクタハウジング３０の組み付け手順を示した図である。また、図４（ａ），（ｂ）は、それぞれ、図１に示す電子装置１００に対して、ハーネス側の端子ハウジング６０を接続する過程を示した図である。 FIG. 1 is a diagram illustrating an example of an electronic device according to the present invention, and is a schematic cross-sectional view of an electronic device 100. 2 is an exploded view of the electronic device 100 shown in FIG. 1, FIG. 2 (a) is a perspective sectional view of the electronic circuit board 10, FIG. 2 (b) is a sectional view of the case 20, and FIG. c) is a cross-sectional view of the connector housing 30. FIGS. 3A and 3B are diagrams for explaining two methods of assembling the electronic device 100 shown in FIG. 1, and FIGS. 3A and 3B are procedures for assembling the electronic circuit board 10, the case 20, and the connector housing 30, respectively. FIG. FIGS. 4A and 4B are diagrams showing a process of connecting the harness-side terminal housing 60 to the electronic device 100 shown in FIG.

図１に示す電子装置１００は、電子回路基板１０、ケース２０およびコネクタハウジング３０で構成されている。 An electronic device 100 shown in FIG. 1 includes an electronic circuit board 10, a case 20, and a connector housing 30.

電子回路基板１０は、図２（ａ）に示すように略四角形状で、電子回路基板１０の両面には、図示を省略した多数の電子部品が搭載されている。略四角形状の電子回路基板１０において、図２（ａ）に示す第１端部Ｓ１は、次に示す箱状のケース２０に収容された状態で奥側に位置する端部であり、第１端部Ｓ１に対向する第２端部Ｓ２は、ケース２０の開口部側に位置する端部である。第２端部Ｓ２の近くにおける電子回路基板１０の上面側と下面側には、それぞれ、複数個の端子部１１，１２が電気接続のために配置されている。複数個の端子部１１，１２は、第２端部Ｓ２の先端から同じ距離Ｌにあって、間隔を狭めて並んで配置されており、上面側と下面側で、それぞれ一点鎖線で示した列が構成されている。 The electronic circuit board 10 has a substantially square shape as shown in FIG. 2A, and a large number of electronic components (not shown) are mounted on both surfaces of the electronic circuit board 10. In the substantially square-shaped electronic circuit board 10, the first end S1 shown in FIG. 2A is an end located on the back side in a state of being accommodated in the box-shaped case 20 shown below, The second end S <b> 2 facing the end S <b> 1 is an end located on the opening side of the case 20. On the upper surface side and the lower surface side of the electronic circuit board 10 near the second end portion S2, a plurality of terminal portions 11 and 12 are arranged for electrical connection, respectively. The plurality of terminal portions 11 and 12 are arranged at the same distance L from the tip of the second end portion S2 and are arranged side by side with a small distance therebetween, and the rows indicated by alternate long and short dash lines on the upper surface side and the lower surface side, respectively. Is configured.

ケース２０は、射出成形された樹脂または金属製で、箱状の形態をなすケースボディ２０ａからなる。ケース２０は、図２（ｂ）に示す第１の端面Ｔ１に開口部２１を有し、第１の端面Ｔ１に対向する第２の端面Ｔ２に、電子回路基板１０の第１端部Ｓ１を位置決めして保持するための基板保持部２２を有している。また、ケース２０の両側面には、電子回路基板１０を収容する際の挿入ガイド２３が形成されている。 The case 20 is made of an injection-molded resin or metal and includes a case body 20a having a box shape. The case 20 has an opening 21 on the first end surface T1 shown in FIG. 2B, and the first end S1 of the electronic circuit board 10 is formed on the second end surface T2 opposite to the first end surface T1. A substrate holding part 22 for positioning and holding is provided. In addition, insertion guides 23 for housing the electronic circuit board 10 are formed on both side surfaces of the case 20.

図２（ｃ）に示すコネクタハウジング３０は、射出成形された樹脂ボディ３０ａからなり、電子回路基板１０の第２端部Ｓ２が挿入される基板挿入孔３３、および電子回路基板１０を外部配線に接続するためのコネクタピン３１，３２を備えている。金属でできたコネクタピン３１，３２は、樹脂ボディ３０ａの射出成型後に圧入される。これによって、コネクタハウジング３０の射出成形時にコネクタピン３１，３２をインサート成形する場合に較べて、製造コストを低減することができる。 The connector housing 30 shown in FIG. 2C is made of an injection molded resin body 30a, and the board insertion hole 33 into which the second end S2 of the electronic circuit board 10 is inserted and the electronic circuit board 10 are used as external wiring. Connector pins 31 and 32 for connection are provided. The connector pins 31 and 32 made of metal are press-fitted after the injection molding of the resin body 30a. As a result, the manufacturing cost can be reduced as compared with the case where the connector pins 31 and 32 are insert-molded when the connector housing 30 is injection-molded.

コネクタピン３１，３２の一端３１ａ，３２ａは、バネ性を有するように弾性変形可能に形成されており、一端３１ａ，３２ａの図の上下方向における最短間隔が、電子回路基板１０の厚さより小さく設定されている。従って、電子回路基板１０が挿入されると、一端３１ａ，３２ａが弾性変形して上記最短間隔が押し広げられ、電子回路基板１０に対する押し付け力が発生する。一方、コネクタピン３１，３２のもう一端３１ｂ，３２ｂは、後で示すように、電子装置１００の外部に露出して、ハーネス側との接続ピンとして機能する。また、コネクタハウジング３０には、ケース２０の開口部２１に挿入される部分の全周に亘って、シール部材４１が取り付けられている。 The one ends 31 a and 32 a of the connector pins 31 and 32 are formed to be elastically deformable so as to have a spring property, and the shortest distance between the ends 31 a and 32 a in the vertical direction in the drawing is set smaller than the thickness of the electronic circuit board 10. Has been. Therefore, when the electronic circuit board 10 is inserted, the one ends 31a and 32a are elastically deformed to expand the shortest distance, and a pressing force against the electronic circuit board 10 is generated. On the other hand, the other ends 31b and 32b of the connector pins 31 and 32 are exposed to the outside of the electronic device 100 and function as connection pins to the harness side, as will be described later. In addition, a seal member 41 is attached to the connector housing 30 over the entire circumference of the portion inserted into the opening 21 of the case 20.

図１に示すように、コネクタハウジング３０は、ケース２０に嵌合して、ケース２０の開口部２１を気密に蓋をする。電子回路基板１０をケース２０に収容し、コネクタハウジング３０でケース２０の開口部２１に蓋をした状態において、バネ性を有するコネクタピン３１，３２の一端３１ａ，３２ａが、電子回路基板１０に設けられた端子部１１，１２に接触して、コネクタピン３１，３２と電子回路基板１０が、電気接続される。また、コネクタハウジング３０とケース２０の間が、シール部材４１で封止される。これによって、塵や水滴のケース２０内への侵入を、確実に防止することができる。 As shown in FIG. 1, the connector housing 30 is fitted in the case 20 and covers the opening 21 of the case 20 in an airtight manner. In a state where the electronic circuit board 10 is accommodated in the case 20 and the opening 21 of the case 20 is covered with the connector housing 30, one end 31 a, 32 a of the springy connector pins 31, 32 is provided on the electronic circuit board 10. The connector pins 31 and 32 and the electronic circuit board 10 are electrically connected in contact with the terminal portions 11 and 12 thus formed. Further, the space between the connector housing 30 and the case 20 is sealed with a seal member 41. As a result, it is possible to reliably prevent dust and water droplets from entering the case 20.

次に、図１に示した電子装置１００の２通りの組み付け方法について、図３（ａ），（ｂ）により説明する。 Next, two methods of assembling the electronic device 100 shown in FIG. 1 will be described with reference to FIGS.

図３（ａ）の組み付け方法では、最初に、電子回路基板１０の第１端部Ｓ１をケース２０の基板保持部２２に差し込んで、電子回路基板１０をケース２０に位置決め保持しておく。次に、太線矢印で示したように、電子回路基板１０の第２端部Ｓ２が基板挿入孔３３に入るようにして、コネクタハウジング３０をケース２０の開口部２１に挿入し、コネクタハウジング３０をケース２０に所定位置で嵌合させて開口部２１に蓋をする。 In the assembling method of FIG. 3A, first, the first end S1 of the electronic circuit board 10 is inserted into the board holding part 22 of the case 20, and the electronic circuit board 10 is positioned and held in the case 20. Next, as indicated by the thick arrow, the connector housing 30 is inserted into the opening 21 of the case 20 so that the second end S2 of the electronic circuit board 10 enters the board insertion hole 33, and the connector housing 30 is The case 21 is fitted in a predetermined position, and the opening 21 is covered.

以上で、図１の電子装置１００が組み付けられる。図３（ａ）の組み付け方法では、コネクタハウジング３０の組み付け時において、電子回路基板１０に触れる必要がない。 Thus, the electronic device 100 of FIG. 1 is assembled. In the assembling method of FIG. 3A, it is not necessary to touch the electronic circuit board 10 when the connector housing 30 is assembled.

これとは逆に、図３（ｂ）の組み付け方法では、最初に、電子回路基板１０の第２端部Ｓ２をコネクタハウジング３０の基板挿入孔３３に差し込んだ状態にしておく。次に、太線矢印で示したように、ケース２０の開口部２１から挿入ガイド２３に沿って電子回路基板１０とコネクタハウジング３０を挿入し、コネクタハウジング３０をケース２０に所定位置で嵌合させて開口部２１に蓋をすると共に、第１端部Ｓ１を基板保持部２２に差し込んで電子回路基板１０を位置決め保持する。 On the contrary, in the assembling method of FIG. 3B, first, the second end portion S <b> 2 of the electronic circuit board 10 is inserted into the board insertion hole 33 of the connector housing 30. Next, as indicated by the thick arrow, the electronic circuit board 10 and the connector housing 30 are inserted along the insertion guide 23 from the opening 21 of the case 20, and the connector housing 30 is fitted into the case 20 at a predetermined position. The opening 21 is covered and the first end S1 is inserted into the board holding part 22 to position and hold the electronic circuit board 10.

以上で、図１の電子装置１００が組み付けられる。図３（ａ）の組み付け方法では、コネクタハウジング３０のケース２０の開口部２１への挿入と、電子回路基板１０の第２端部Ｓ２の基板挿入孔３３への差し込みとが、同時に行われる。従って、図３（ａ）の組み付け方法では、コネクタハウジング３０の差し込みに際して、第２端部Ｓ２が図の上下方向で開口部２１の所定の高さに位置している必要があり、この位置がずれるとコネクタハウジング３０とケース２０がうまく噛み合わない。一方、図３（ｂ）の組み付け方法では、最初に電子回路基板１０の第１端部Ｓ１をケース２０の挿入ガイド２３に挿入してからコネクタハウジング３０が開口部２１へ挿入されるため、容易に組み付けが可能である。 Thus, the electronic device 100 of FIG. 1 is assembled. 3A, the insertion of the connector housing 30 into the opening 21 of the case 20 and the insertion of the second end S2 of the electronic circuit board 10 into the board insertion hole 33 are simultaneously performed. Therefore, in the assembling method of FIG. 3A, when the connector housing 30 is inserted, the second end S2 needs to be positioned at a predetermined height of the opening 21 in the vertical direction of the figure. If they are displaced, the connector housing 30 and the case 20 do not mesh well. On the other hand, in the assembling method shown in FIG. 3B, the first end S1 of the electronic circuit board 10 is first inserted into the insertion guide 23 of the case 20 and then the connector housing 30 is inserted into the opening 21. Can be assembled.

次に、図１の電子装置１００に対して、ハーネス側の端子ハウジング６０を接続する過程を、図４（ａ），（ｂ）により説明する。 Next, the process of connecting the harness-side terminal housing 60 to the electronic device 100 of FIG. 1 will be described with reference to FIGS.

図４（ａ）に示すように、外部からみた電子装置１００のコネクタ構造は、差し込み口３５，３６にコネクタピン３１，３２のもう一端３１ｂ，３２ｂが突き出た、簡単な構造のものである。また、ハーネス側の端子ハウジング６０も汎用品であるメス型端子６１，６２を使用している。端子ハウジング６０におけるメス型端子６１，６２とハーネス６３の接続部は、複数設けられたハーネス６３が貫通するシール部材全てを連結したファミリーシール６４によって、一括防水されている。 As shown in FIG. 4A, the connector structure of the electronic device 100 viewed from the outside is a simple structure in which the other ends 31b and 32b of the connector pins 31 and 32 protrude from the insertion openings 35 and 36, respectively. The harness-side terminal housing 60 also uses female terminals 61 and 62, which are general-purpose products. Connection portions of the female terminals 61 and 62 and the harness 63 in the terminal housing 60 are collectively waterproofed by a family seal 64 that connects all the seal members through which the plurality of harnesses 63 pass.

電子装置１００に対して、図４（ａ）の太線矢印で示したように、端子ハウジング６０の樹脂ボディ６０ａから突き出たメス型端子６１，６２を電子装置１００の差し込み口３５，３６に挿入し、図４（ｂ）に示すように、ハーネス側の端子ハウジング６０と電子装置１００のコネクタハウジング３０を嵌合させる。これによって、メス型端子６１，６２のピン６１ａ，６２ａがコネクタピン３１，３２のもう一端３１ｂ，３２ｂに接触し、メス型端子６１，６２とコネクタピン３１，３２が電気接続される。 With respect to the electronic device 100, the female terminals 61 and 62 protruding from the resin body 60 a of the terminal housing 60 are inserted into the insertion openings 35 and 36 of the electronic device 100 as indicated by the thick arrows in FIG. 4B, the terminal housing 60 on the harness side and the connector housing 30 of the electronic device 100 are fitted. As a result, the pins 61a and 62a of the female terminals 61 and 62 come into contact with the other ends 31b and 32b of the connector pins 31 and 32, and the female terminals 61 and 62 and the connector pins 31 and 32 are electrically connected.

以上で、電子装置１００に対するハーネス側の端子ハウジング６０の接続が完了する。 Thus, the connection of the harness-side terminal housing 60 to the electronic device 100 is completed.

以上説明したように、図１の電子装置１００は、図２（ａ）〜（ｃ）の電子回路基板１０、該電子回路基板１０を収容する箱状のケース２０、およびケース２０の開口部２１に蓋をするコネクタハウジング３０で構成されている。電子装置１００におけるコネクタピン３１，３２と電子回路基板１０の電気接続は、コネクタハウジング３０に備えられたコネクタピン３１，３２の一端が電子回路基板１０の端子部１１，１２にそれぞれ接触する構成がとられている。このコネクタピン３１，３２と端子部１１，１２の接触による電気接続の確実性は、ケース２０に設けられた基板保持部２２で電子回路基板１０が所定位置に位置決め保持されること、及びコネクタハウジング３０がケース２０に嵌合して所定位置に位置決めされることによって担保される。以上のように、図１の電子装置１００においては、図１０に示した電子装置８０と異なり、コネクタピン３１，３２と電子回路基板１０の電気接続に、コネクタピン３１，３２がスルーホールを貫通する構造や半田付け等による接合工程が用いられていない。このため、図１の電子装置１００は、電子回路基板１０の端子部１１，１２の間隔を狭めて小型化することが可能であると共に、安価に製造することができる。 As described above, the electronic device 100 of FIG. 1 includes the electronic circuit board 10 of FIGS. 2A to 2C, the box-shaped case 20 that houses the electronic circuit board 10, and the opening 21 of the case 20. It comprises a connector housing 30 that covers the lid. The electrical connection between the connector pins 31 and 32 and the electronic circuit board 10 in the electronic device 100 is configured such that one end of the connector pins 31 and 32 provided in the connector housing 30 contacts the terminal portions 11 and 12 of the electronic circuit board 10, respectively. It has been taken. The reliability of the electrical connection by the contact between the connector pins 31 and 32 and the terminal portions 11 and 12 is that the electronic circuit board 10 is positioned and held at a predetermined position by the board holding portion 22 provided in the case 20, and the connector housing. 30 is secured by being fitted to the case 20 and positioned at a predetermined position. As described above, in the electronic device 100 of FIG. 1, unlike the electronic device 80 shown in FIG. 10, the connector pins 31 and 32 pass through the through holes for electrical connection between the connector pins 31 and 32 and the electronic circuit board 10. The joining process by the structure and soldering etc. to be used is not used. Therefore, the electronic device 100 of FIG. 1 can be reduced in size by reducing the distance between the terminal portions 11 and 12 of the electronic circuit board 10 and can be manufactured at low cost.

また、図１の電子装置１００におけるコネクタハウジング３０は、外部配線と接続するためのコネクタとしての機能と、電子回路基板１０を収容しているケース２０の開口部２１に蓋をする機能を担っている。すなわち、コネクタピン３１，３２のもう一端３１ｂ，３２ｂが、コネクタハウジング３０で蓋をされたケース２０の外部に露出して、外部配線に接続するコネクタとして機能する構成となっている。外部からみた電子装置１００のコネクタ構造は、図１１に示した電子装置９０と異なり、図４において説明したように、差し込み口３５，３６にコネクタピン３１，３２のもう一端３１ｂ，３２ｂが突き出た、簡単な構造のものであってよい。また、ケース２０の開口部２１をコネクタハウジング３０が蓋をしているため、塵や水滴のケース２０内への侵入を防止することができ、電子回路基板１０への塵や水滴の付着とそれによる不具合を防止することができる。 In addition, the connector housing 30 in the electronic device 100 of FIG. 1 has a function as a connector for connecting to external wiring and a function of covering the opening 21 of the case 20 housing the electronic circuit board 10. Yes. That is, the other ends 31 b and 32 b of the connector pins 31 and 32 are exposed to the outside of the case 20 covered with the connector housing 30 and function as a connector connected to the external wiring. The connector structure of the electronic device 100 viewed from the outside is different from the electronic device 90 shown in FIG. 11, and the other ends 31 b and 32 b of the connector pins 31 and 32 protrude from the insertion ports 35 and 36 as described in FIG. 4. It may be of a simple structure. In addition, since the connector housing 30 covers the opening 21 of the case 20, it is possible to prevent dust and water droplets from entering the case 20, and adhesion of dust and water droplets to the electronic circuit board 10 It is possible to prevent problems caused by

以上のようにして、上記した電子装置１００は、箱状のケース２０内に電子回路基板１０が収容されてなる電子装置であって、端子部１１，１２の間隔を狭めてコネクタを小型化することができ、電子回路基板１０への塵や水滴の付着を防止すると共に、簡単な構造で安価な電子装置となっている。 As described above, the above-described electronic device 100 is an electronic device in which the electronic circuit board 10 is accommodated in the box-shaped case 20, and the connector is reduced in size by narrowing the interval between the terminal portions 11 and 12. Thus, dust and water droplets are prevented from adhering to the electronic circuit board 10, and the electronic device is simple and inexpensive.

次に、上記した電子装置１００の細部構造について、より詳細に説明する。 Next, the detailed structure of the electronic device 100 described above will be described in more detail.

上記電子装置１００には、図１に示すように、電子回路基板１０をケース２０に収容し、コネクタハウジング３０で開口部２１に蓋をした状態において、電子回路基板１０の端子部１１，１２の近くに、電子回路基板１０の基板面に垂直な方向の動きを抑制する、２つの基板押え手段が設けられている。 As shown in FIG. 1, in the electronic device 100, the electronic circuit board 10 is accommodated in a case 20, and the terminal portions 11, 12 of the electronic circuit board 10 are covered in a state where the opening 21 is covered with the connector housing 30. Two board holding means for suppressing movement in a direction perpendicular to the board surface of the electronic circuit board 10 are provided nearby.

第１の基板押え手段は、図２（ｃ）に示すコネクタハウジング３０の基板挿入孔３３の先端部３３ａである。該先端部３３ａは、図の上下方向の幅が、わずかなクリアランスと共に、電子回路基板１０の厚さに設定されている。従って、図１に示すように、電子回路基板１０の先端が基板挿入孔３３の先端部３３ａに挿入されると、電子回路基板１０の第２端部Ｓ２の基板面に垂直な方向の動きが、先端部３３ａで抑制される。尚、先端部３３ａは、上記した電子回路基板１０の基板面に垂直な方向の動きを抑制すると共に、先端部３３ａに電子回路基板１０を挿入したとき奥の側壁に先端が突き当たるように設定してあり、基板面に水平な方向の位置決め機能も持たせている。 The first board holding means is the tip 33a of the board insertion hole 33 of the connector housing 30 shown in FIG. The tip 33a has a vertical width in the drawing set to the thickness of the electronic circuit board 10 with a slight clearance. Therefore, as shown in FIG. 1, when the tip of the electronic circuit board 10 is inserted into the tip 33a of the board insertion hole 33, the movement of the second end S2 of the electronic circuit board 10 in a direction perpendicular to the substrate surface is caused. The tip 33a is restrained. The distal end portion 33a is set so that the movement in the direction perpendicular to the substrate surface of the electronic circuit board 10 described above is suppressed and the distal end abuts against the back side wall when the electronic circuit board 10 is inserted into the distal end portion 33a. It also has a positioning function in the horizontal direction on the substrate surface.

第２の基板押え手段は、図２（ｃ）に示すコネクタハウジング３０の基板挿入孔３３の入り口近くに設けられた突起部３４ａ，３４ｂである。該突起部３４ａ，３４ｂの図の上下方向における先端間隔も、わずかなクリアランスと共に、電子回路基板１０の厚さに設定されている。従って、図１に示すように、電子回路基板１０が基板挿入孔３３に挿入された状態で、電子回路基板１０の基板面に垂直な方向の動きが突起部３４ａ，３４ｂで抑制される。尚、突起部３４ａ，３４ｂは、コネクタハウジング３０の樹脂ボディ３０ａと同一部材で、一体成形されており、図１の組み付け状態において、端子部１１，１２を避けた基板面内の位置で電子回路基板１０を押さるように配置されている。 The second board pressing means is protrusions 34a and 34b provided near the entrance of the board insertion hole 33 of the connector housing 30 shown in FIG. The distance between the tips of the protrusions 34a and 34b in the vertical direction in the figure is also set to the thickness of the electronic circuit board 10 with a slight clearance. Therefore, as shown in FIG. 1, in a state where the electronic circuit board 10 is inserted into the board insertion hole 33, the movement in the direction perpendicular to the substrate surface of the electronic circuit board 10 is suppressed by the protrusions 34a and 34b. The protrusions 34a and 34b are formed of the same member as the resin body 30a of the connector housing 30 and are integrally formed. In the assembled state of FIG. 1, the electronic circuit is located at a position on the board surface avoiding the terminal portions 11 and 12. It arrange | positions so that the board | substrate 10 may be pushed.

上記基板押え手段である先端部３３ａと突起部３４ａ，３４ｂがない場合には、電子回路基板１０は、端子部１１，１２の周りにおいては主としてコネクタピン３１，３２の一端３１ａ，３２ａのバネ性によって支持されることとなり、連続的に外部から振動が与えられると、コネクタピン３１，３２が壊れてしまう可能性がある。上記基板押え手段である先端部３３ａと突起部３４ａ，３４ｂにより、電子回路基板１０の端子部１１，１２の周りにおける基板面に垂直な方向の動きを抑制することで、端子部１１，１２に接触しているコネクタピン３１，３２の一端３１ａ，３２ａのバネ伸縮変位を小さくし、バネ寿命を向上させることができる。 In the absence of the tip 33a and the projections 34a, 34b, which are the substrate pressing means, the electronic circuit board 10 is mainly springy at the ends 31a, 32a of the connector pins 31, 32 around the terminal portions 11, 12. If the vibration is continuously applied from the outside, the connector pins 31 and 32 may be broken. By suppressing the movement in the direction perpendicular to the substrate surface around the terminal portions 11 and 12 of the electronic circuit board 10 by the tip end portion 33a and the protrusion portions 34a and 34b as the substrate pressing means, the terminal portions 11 and 12 It is possible to reduce the spring expansion / contraction displacement of the ends 31a, 32a of the connector pins 31, 32 that are in contact with each other, thereby improving the spring life.

また、上記２つの基板押え手段である先端部３３ａと突起部３４ａ，３４ｂは、電子回路基板１０の第１端部Ｓ１と第２端部Ｓ２の間で、端子部１１，１２を間に挟むようにして、該端子部１１，１２の両側に配置されている。これによれば、基板押え手段として先端部３３ａまたは突起部３４ａ，３４ｂのいずれか一方だけを採用する場合に較べて、端子部１１，１２の周りにおける電子回路基板１０の基板面に垂直な方向の動きを、より安定的に抑制することができる。尚、基板押え手段である先端部３３ａと突起部３４ａ，３４ｂは、射出成形によって樹脂ボディ３０ａに一体成形できるものであり、基板押え手段を樹脂ボディ３０ａと別体で形成する場合に較べて、製造コストの増大を防止することができる。また、先端部３３ａと、突起部３４ａ，３４ｂの両方を同一材料からなるコネクタハウジング３０に形成することにより、先端部３３ａまたは突起部３４ａ，３４ｂの一方をケース２０に形成する場合に比べて、線膨張係数の差に起因する応力歪みを抑制することができる。 In addition, the tip portion 33a and the projection portions 34a and 34b, which are the two substrate holding means, sandwich the terminal portions 11 and 12 between the first end S1 and the second end S2 of the electronic circuit board 10. Thus, the terminals 11 and 12 are arranged on both sides. According to this, the direction perpendicular to the substrate surface of the electronic circuit board 10 around the terminal portions 11 and 12 is compared with the case where only one of the tip end portion 33a and the projection portions 34a and 34b is employed as the substrate pressing means. Can be more stably suppressed. The tip 33a and the projections 34a and 34b, which are substrate holding means, can be integrally formed with the resin body 30a by injection molding. Compared to the case where the substrate holding means is formed separately from the resin body 30a, An increase in manufacturing cost can be prevented. Further, by forming both the tip 33a and the projections 34a and 34b in the connector housing 30 made of the same material, compared to the case where one of the tip 33a or the projections 34a and 34b is formed in the case 20, The stress distortion resulting from the difference in linear expansion coefficient can be suppressed.

この他にも、先端部３３ａと、突起部３４ａ，３４ｂの両方をコネクタハウジング３０に形成することにより、先端部３３ａまたは突起部３４ａ，３４ｂの一方をケース２０に形成する場合に比べて、確実に端子部１１，１２と、コネクタピン３１，３２との電気的接触を確保可能、という効果も奏することができる。その理由を以下に述べる。電子回路基板１０のうち先端部３３ａと、突起部３４ａ，３４ｂと接触する部位には、共通のコネクタハウジング３０からの振動が伝達する。このため、先端部３３ａと、突起部３４ａ，３４ｂと接触する部位は、共通の振動数により振動するため、端子部１１，１２と、コネクタピン３１，３２とが接触している箇所が振動しにくい。このため、確実に端子部１１，１２と、コネクタピン３１，３２との電気的接触を確保することができる。 In addition, by forming both the tip 33a and the protrusions 34a and 34b on the connector housing 30, it is more reliable than when the tip 33a or one of the protrusions 34a and 34b is formed on the case 20. In addition, it is possible to ensure the electrical contact between the terminal portions 11 and 12 and the connector pins 31 and 32. The reason is described below. The vibration from the common connector housing 30 is transmitted to the portion of the electronic circuit board 10 that is in contact with the tip portion 33a and the protrusions 34a and 34b. For this reason, since the site | part which contacts the front-end | tip part 33a and protrusion part 34a, 34b vibrates with a common frequency, the location where the terminal parts 11 and 12 and the connector pins 31 and 32 are contacting vibrates. Hateful. For this reason, the electrical contact of the terminal parts 11 and 12 and the connector pins 31 and 32 can be ensured reliably.

また、限定されるものではないが、先端部３３ａの側壁と、電子回路基板１０の厚さ方向における突起部３４ａ，３４ｂの端面とが、電子回路基板１０の面方向において、面一であることが望ましい。この場合、電子回路基板１０の端子部１１，１２の周りであって、先端部３３ａの側壁と接触する部位、および、突起部３４ａ，３４ｂと接触する部位に印加される接触圧を均一にすることができる。 Although not limited thereto, the side wall of the tip portion 33 a and the end surfaces of the protrusions 34 a and 34 b in the thickness direction of the electronic circuit board 10 are flush with each other in the surface direction of the electronic circuit board 10. Is desirable. In this case, the contact pressure applied around the terminal portions 11 and 12 of the electronic circuit board 10 and in contact with the side wall of the tip end portion 33a and the portions in contact with the protrusions 34a and 34b is made uniform. be able to.

図５は、図１に示した電子装置１００の変形例で、図５（ａ）は、電子装置１０１の模式的な断面図であり、図５（ｂ）は、電子回路基板１０ａの斜視断面図である。尚、以下に示す電子装置の各例において、図１に示した電子装置１００と同様の部分については、同じ符号を付した。 5 is a modification of the electronic device 100 shown in FIG. 1. FIG. 5A is a schematic sectional view of the electronic device 101, and FIG. 5B is a perspective sectional view of the electronic circuit board 10a. FIG. In each example of the electronic device shown below, the same reference numerals are given to the same parts as those of the electronic device 100 shown in FIG.

図５（ｂ）に示すように、電子装置１０１の電子回路基板１０ａには、複数個の端子部１１ａ，１１ｂおよび複数個の端子部１２ａ，１２ｂが、上面側と下面側で、それぞれ第２端部Ｓ２の先端から異なる距離Ｌ１，Ｌ２にある一点鎖線で示した２本の列を構成するように配置されている。これに対応して、電子装置１０１のコネクタハウジング５０ａでは、図５（ａ）に示すように、電子回路基板１０ａの基板面に垂直な方向に多段化されたコネクタピン５１，５３およびコネクタピン５２，５４が、それぞれ電子回路基板１０ａの上面側の端子部１１ａ，１１ｂおよび下面側の端子部１２ａ，１２ｂとその一端が接触するようにして設けられている。このように、図１の電子装置１００の一列に配置された端子部１１，１２に限らず、複数列に配置された端子部１１ａ，１１ｂおよび端子部１２ａ，１２ｂであっても、一端が接触するコネクタピン５１，５３およびコネクタピン５２，５４をコネクタハウジング５０ａに設けることができる。これによって、電子回路基板の端子部の間隔を狭めて、小型化を図ることができる。 As shown in FIG. 5B, the electronic circuit board 10a of the electronic device 101 includes a plurality of terminal portions 11a, 11b and a plurality of terminal portions 12a, 12b on the upper surface side and the lower surface side, respectively. It arrange | positions so that two rows shown with the dashed-dotted line in different distance L1, L2 from the front-end | tip of edge part S2 may be comprised. Correspondingly, in the connector housing 50a of the electronic device 101, as shown in FIG. 5A, connector pins 51 and 53 and connector pins 52 that are multi-staged in a direction perpendicular to the substrate surface of the electronic circuit board 10a. , 54 are provided in such a manner that the terminal portions 11a, 11b on the upper surface side and the terminal portions 12a, 12b on the lower surface side of the electronic circuit board 10a are in contact with one end thereof. Thus, not only the terminal portions 11 and 12 arranged in one row of the electronic device 100 of FIG. 1, but also the terminal portions 11a and 11b and the terminal portions 12a and 12b arranged in a plurality of rows are in contact with each other. Connector pins 51 and 53 and connector pins 52 and 54 to be provided can be provided on the connector housing 50a. Thereby, the space | interval of the terminal part of an electronic circuit board can be narrowed, and size reduction can be achieved.

図６は、図１に示した電子装置１００の別の変形例で、電子装置１０２の模式的な断面図である。 FIG. 6 is a schematic cross-sectional view of an electronic device 102 as another modification of the electronic device 100 shown in FIG.

図６に示す電子装置１０２のコネクタハウジング５０ｂに設けられているコネクタピン５５，５６は、それぞれ基板挿入孔３３に露出している点５５ａ，５６ａで折り返されて、電子回路基板１０の端子部１１，１２に接触するようにしている。このように、コネクタピン５５，５６を折り返すことで、図１に示した電子装置１００のコネクタピン３１，３２に較べてバネ性による押付力を高めることができ、より確実な電気的接続を得ることができる。 Connector pins 55 and 56 provided on the connector housing 50b of the electronic device 102 shown in FIG. 6 are folded at points 55a and 56a exposed in the board insertion holes 33, respectively, and the terminal portions 11 of the electronic circuit board 10 are returned. , 12 are in contact with each other. Thus, by folding back the connector pins 55 and 56, the pressing force due to the spring property can be increased as compared with the connector pins 31 and 32 of the electronic device 100 shown in FIG. 1, and a more reliable electrical connection is obtained. be able to.

図７も、図１に示した電子装置１００の別の変形例で、電子装置１０３の模式的な断面図である。 FIG. 7 is also a schematic cross-sectional view of the electronic device 103 as another modification of the electronic device 100 shown in FIG.

前述した電子装置１００〜１０２では、いずれも電子回路基板１０，１０ａの基板面内の同じ位置において、上面側と下面側にそれぞれ端子部１１，１１ａ，１１ｂと１２，１２ａ，１２ｂが存在していた。また、上面側の端子部１１，１１ａ，１１ｂと下面側の端子部１２，１２ａ，１２ｂにそれぞれ対応する電子装置１００〜１０２のコネクタピン３１，５１，５３とコネクタピン３１，５２，５４は、電子回路基板１０，１０ａの上下面から対称的に挟み込むようにして押さえつける構成がとられていた。 In the electronic devices 100 to 102 described above, terminal portions 11, 11a, 11b and 12, 12a, 12b exist on the upper surface side and the lower surface side, respectively, at the same position in the substrate surface of the electronic circuit boards 10, 10a. It was. The connector pins 31, 51, 53 and connector pins 31, 52, 54 of the electronic devices 100-102 corresponding to the terminal portions 11, 11a, 11b on the upper surface side and the terminal portions 12, 12a, 12b on the lower surface side are respectively The electronic circuit boards 10 and 10a are configured to be pressed down so as to be sandwiched symmetrically from the upper and lower surfaces.

これに対して、図７に示す電子装置１０３の電子回路基板１０ｂにおいては、上面側の端子部１１ｂと下面側の端子部１２ａが基板面において異なる位置にあるように配置されている。このため、コネクタハウジング５０ｃに設けられているコネクタピン５７とコネクタピン５８のバネ性を有する一端５７ａ，５８ａは、それぞれ、基板挿入孔３３の高さ方向の下面から上面までを曲げストロークに利用することができ、これによってバネ性による押し付け力を高めることができる。 On the other hand, in the electronic circuit board 10b of the electronic device 103 shown in FIG. 7, the terminal portion 11b on the upper surface side and the terminal portion 12a on the lower surface side are arranged at different positions on the substrate surface. For this reason, the spring ends of the connector pin 57 and the connector pin 58 provided on the connector housing 50c use the bending stroke from the bottom surface to the top surface of the board insertion hole 33 in the height direction. Thus, the pressing force due to the spring property can be increased.

図８は、別の電子装置の例で、図８（ａ）は電子装置１０４の模式的な断面図であり、図８（ｂ）はコネクタハウジング５０ｄの断面図であり、図８（ｃ）は電子回路基板１０ｃの斜視断面図である。 8A and 8B show another example of the electronic device. FIG. 8A is a schematic cross-sectional view of the electronic device 104, FIG. 8B is a cross-sectional view of the connector housing 50d, and FIG. These are perspective sectional views of the electronic circuit board 10c.

図１の電子装置１００における２つの基板押え手段、すなわち基板挿入孔３３の先端部３３ａと突起部３４ａ，３４ｂは、いずれも、コネクタハウジング３０の樹脂ボディ３０ａと同一部材で、一体成形されたものであった。一方、図８の電子装置１０４における２つの基板押え手段は、コネクタハウジング５０ｄの樹脂ボディ３０ｂとは別の弾性部材４２〜４４で形成されている。 In the electronic device 100 of FIG. 1, the two board pressing means, that is, the tip end portion 33 a of the board insertion hole 33 and the projections 34 a and 34 b are both the same member as the resin body 30 a of the connector housing 30 and are integrally molded. Met. On the other hand, the two board pressing means in the electronic device 104 of FIG. 8 are formed of elastic members 42 to 44 different from the resin body 30b of the connector housing 50d.

電子装置１０４における第１の基板押え手段は、図８（ｂ）に示すコネクタハウジング５０ｄの基板挿入孔３３の先端部３３ｂに充填された弾性部材４２である。先端部３３ｂに充填された弾性部材４２は、図８（ａ）に示すように、電子回路基板１０ｃの基板面に垂直な方向の動きを抑制すると共に、先端部３３ｂに電子回路基板１０ｃを挿入したときの基板面に水平な方向の動きを抑制する機能も持たせている。 The first board pressing means in the electronic device 104 is an elastic member 42 filled in the tip 33b of the board insertion hole 33 of the connector housing 50d shown in FIG. 8B. As shown in FIG. 8A, the elastic member 42 filled in the distal end portion 33b suppresses movement in a direction perpendicular to the substrate surface of the electronic circuit substrate 10c, and inserts the electronic circuit substrate 10c into the distal end portion 33b. A function of suppressing the movement in the horizontal direction on the substrate surface is also provided.

第２の基板押え手段は、図８（ｃ）に示す電子回路基板１０ｃの端子部１１，１２の近くにおいて、第１端部Ｓ１側の上下面に貼り合わされた弾性部材４３，４４である。該弾性部材４３，４４も、図８（ａ）に示すように、電子回路基板１０ｃが基板挿入孔３３に挿入された状態で、電子回路基板１０ｃの基板面に垂直な方向の動きを抑制する。 The second substrate pressing means are elastic members 43 and 44 bonded to the upper and lower surfaces of the first end S1 side in the vicinity of the terminal portions 11 and 12 of the electronic circuit board 10c shown in FIG. As shown in FIG. 8A, the elastic members 43 and 44 also suppress movement in a direction perpendicular to the substrate surface of the electronic circuit board 10c in a state where the electronic circuit board 10c is inserted into the board insertion hole 33. .

基板挿入孔３３の先端部３３ｂに充填する弾性部材４２としては、例えば液状の熱硬化性シリコンゴムなどを用いることができ、電子回路基板１０ｃの第２端部Ｓ２を挿入した後で熱硬化させるようにする。また、電子回路基板１０ｃに貼り合わせる弾性部材４３，４４としては、例えばポリエステル系などの制振シートやシリコンゴムシート、あるいはシール部材４１と同じ材質の防水ゴムシート等を用いることができる。 As the elastic member 42 filled in the tip end portion 33b of the board insertion hole 33, for example, liquid thermosetting silicone rubber or the like can be used. After the second end S2 of the electronic circuit board 10c is inserted, the thermosetting is performed. Like that. Further, as the elastic members 43 and 44 to be bonded to the electronic circuit board 10c, for example, a vibration damping sheet such as polyester, a silicon rubber sheet, a waterproof rubber sheet made of the same material as the seal member 41, or the like can be used.

図１の電子装置１００のように、基板押え手段をコネクタハウジング３０の樹脂ボディ３０ａと同一部材で一体成形する場合には、堅い基板押え手段と電子回路基板１０の間に、わずかなクリアランスが必要である。一方、図８の電子装置１０４のように、基板押え手段をコネクタハウジング５０ｄの樹脂ボディ３０ｂとは別の弾性部材４２〜４４で形成する場合には、電子回路基板１０ｃに基板押え手段を直接押し付けることができる。また、基板挿入時に、端子部を傷つけたり、汚染したりすることが無い。 When the board pressing means is integrally formed of the same member as the resin body 30a of the connector housing 30 as in the electronic device 100 of FIG. 1, a slight clearance is required between the rigid board pressing means and the electronic circuit board 10. It is. On the other hand, when the board pressing means is formed of elastic members 42 to 44 different from the resin body 30b of the connector housing 50d as in the electronic device 104 of FIG. 8, the board pressing means is directly pressed against the electronic circuit board 10c. be able to. Further, the terminal portion is not damaged or contaminated when the board is inserted.

図９は、別の電子装置の例で、図９（ａ）は電子装置１０５の模式的な断面図であり、図９（ｂ）はコネクタハウジング５０ｅの分解図である。 FIG. 9 shows another example of the electronic device. FIG. 9A is a schematic cross-sectional view of the electronic device 105, and FIG. 9B is an exploded view of the connector housing 50e.

図９の電子装置１０５におけるコネクタハウジング５０ｅは、電子回路基板１０の上面側と下面側にそれぞれ位置して互いに嵌合する、上側ハウジング部５０ｅ１と下側ハウジング部５０ｅ２に分割された構成となっている。そして、基板抑え手段である弾性部材４５，４７および弾性部材４６，４８が、それぞれ上側ハウジング部５０ｅ１と下側ハウジング部５０ｅ２の基板挿入孔を形成する凹部３３ｃ，３３ｄに貼り合わされている。 The connector housing 50e in the electronic device 105 of FIG. 9 is divided into an upper housing portion 50e1 and a lower housing portion 50e2 that are located on the upper surface side and the lower surface side of the electronic circuit board 10 and fit to each other. Yes. Then, the elastic members 45 and 47 and the elastic members 46 and 48 as substrate holding means are bonded to the recesses 33c and 33d forming the substrate insertion holes of the upper housing portion 50e1 and the lower housing portion 50e2, respectively.

図９に示す電子装置１０５のようなコネクタハウジングの分割構成によれば、コネクタハウジングと電子回路基板のいずれか一方に基板押え手段が設けられている場合であっても、電子回路基板を上側ハウジング部と下側ハウジング部で挟み込むようにして組み付けることができる。このため、コネクタハウジングと電子回路基板の相互組み付けを容易に行うことができる。また、図９に示す電子装置１０５のように、基板押え手段として弾性部材をコネクタハウジングの基板挿入孔に取り付ける場合においても、該取り付けを容易に行うことができる。また、基板挿入時に、端子部を傷つけたり、汚染したりすることが無い。さらに、弾性体押さえ部材の厚さを組付け後の基板とハウジングの隙間よりも厚く設定した上で組み付けることが容易であり、より高い押さえ効果を得ることができる。同様に、上下分割されているために、一体でハウジングを形成した場合に上下ピンが緩衝する程度以上にコネクタピンの上下方向高さを高くしておくことが可能となる。その結果、コネクタピンが基板に押し付けられて嵌合する時のコネクタピンのストロークを大きく取ることができるため、基板板厚公差などのバラツキを吸収して、より大きな接圧を安定して確保することができる。 According to the divided structure of the connector housing such as the electronic device 105 shown in FIG. 9, the electronic circuit board is mounted on the upper housing even when the board pressing means is provided on either the connector housing or the electronic circuit board. And can be assembled so as to be sandwiched between the upper housing portion and the lower housing portion. For this reason, it is possible to easily assemble the connector housing and the electronic circuit board. Further, when the elastic member is attached to the board insertion hole of the connector housing as the board pressing means as in the electronic device 105 shown in FIG. 9, the attachment can be easily performed. Further, the terminal portion is not damaged or contaminated when the board is inserted. Furthermore, it is easy to assemble after setting the thickness of the elastic body pressing member to be thicker than the gap between the assembled substrate and the housing, and a higher pressing effect can be obtained. Similarly, since the upper and lower pins are divided, the height of the connector pins in the vertical direction can be made higher than the degree that the upper and lower pins cushion when the housing is integrally formed. As a result, it is possible to increase the stroke of the connector pin when the connector pin is pressed against the board to fit, so that variations such as board thickness tolerance are absorbed, and a larger contact pressure is stably secured. be able to.

以上に例示した電子装置１００〜１０５は、いずれも、箱状のケース２０内に電子回路基板が収容されてなる電子装置であって、端子部の間隔を狭めてコネクタを小型化することができ、電子回路基板への塵や水滴の付着を防止すると共に、簡単な構造で安価な電子装置とすることができる。 Each of the electronic devices 100 to 105 exemplified above is an electronic device in which an electronic circuit board is accommodated in a box-shaped case 20, and the connector can be miniaturized by reducing the distance between the terminal portions. In addition to preventing dust and water droplets from adhering to the electronic circuit board, it is possible to provide an inexpensive electronic device with a simple structure.

従って、上記電子装置１００〜１０５は、振動や塵や水滴の付着し易い過酷な環境下で使用され、小型で安価であることが要求される、車載用電子装置として好適である。 Accordingly, the electronic devices 100 to 105 are suitable for use as an on-vehicle electronic device that is used in a harsh environment where vibrations, dust, and water droplets are easily attached, and is required to be small and inexpensive.

８０，９０，１００〜１０５電子装置
１０，１０ａ〜１０ｃ電子回路基板
１１，１２，１１ａ，１１ｂ，１２ａ，１２ｂ端子部
２０ケース
２１開口部
２２基板保持部
３０，５０ａ〜５０ｅコネクタハウジング
３１，３２，５１〜５８コネクタピン
３３基板挿入孔
３３ａ先端部（基板押え手段）
３４ａ，３４ｂ突起部（基板押え手段）
４２〜４８弾性部材（基板押え手段） 80, 90, 100 to 105 Electronic device 10, 10a to 10c Electronic circuit board 11, 12, 11a, 11b, 12a, 12b Terminal portion 20 Case 21 Opening portion 22 Substrate holding portion 30, 50a to 50e Connector housing 31, 32, 51-58 Connector pin 33 Substrate insertion hole 33a Tip (substrate holding means)
34a, 34b Projection (substrate holding means)
42 to 48 Elastic member (substrate holding means)

Claims

An electronic circuit board on which electronic components are mounted;
A box-shaped case for housing the electronic circuit board, comprising an opening and a substrate holding part for positioning and holding the electronic circuit board;
A connector housing that includes a board insertion hole into which an end of the electronic circuit board is inserted, and a connector pin for connecting the electronic circuit board to an external wiring, and is fitted to the case and covers the opening. , And
In the state where the electronic circuit board is accommodated in the case and the opening is covered with the connector housing,
One end of the connector pin having a spring property is in contact with a terminal portion provided on the electronic circuit board, and the connector pin and the electronic circuit board are electrically connected,
The other end of the connector pin is an electronic device that is exposed to the outside of the case covered with the connector housing and functions as a connector for connecting to the external wiring ,
Substrate pressing means for suppressing movement in a direction perpendicular to the substrate surface of the electronic circuit board is provided near the terminal portion,
The electronic device according to claim 1, wherein the substrate pressing means is made of an elastic member filled in a tip portion of the substrate insertion hole .

The electronic device is
2. The electronic device according to claim 1, further comprising a second substrate pressing unit made of an elastic member bonded to the upper and lower surfaces of the end near the terminal portion of the electronic circuit board .

Said connector housing, said electronic circuit are fitted to each other are located respectively on the upper and lower surface side of the substrate, according to claim 1 or claim, characterized by comprising divided into upper housing part and lower housing part 2 An electronic device according to 1.

An electronic circuit board on which electronic components are mounted;
A box-shaped case for housing the electronic circuit board, comprising an opening and a substrate holding part for positioning and holding the electronic circuit board;
A connector housing that includes a board insertion hole into which an end of the electronic circuit board is inserted, and a connector pin for connecting the electronic circuit board to an external wiring, and is fitted to the case and covers the opening. , And
In the state where the electronic circuit board is accommodated in the case and the opening is covered with the connector housing,
One end of the connector pin having a spring property is in contact with a terminal portion provided on the electronic circuit board, and the connector pin and the electronic circuit board are electrically connected,
The other end of the connector pin is an electronic device that is exposed to the outside of the case covered with the connector housing and functions as a connector for connecting to the external wiring,
Substrate pressing means for suppressing movement in a direction perpendicular to the substrate surface of the electronic circuit board is provided near the terminal portion,
The substrate pressing means is made of an elastic member bonded to the upper and lower surfaces of the end portion near the terminal portion of the electronic circuit board,
The electronic device is characterized in that the connector housing is divided into an upper housing part and a lower housing part, which are located on the upper surface side and the lower surface side of the electronic circuit board and fit to each other .

An electronic circuit board on which electronic components are mounted;
A box-shaped case for housing the electronic circuit board, comprising an opening and a substrate holding part for positioning and holding the electronic circuit board;
A connector housing that includes a board insertion hole into which an end of the electronic circuit board is inserted, and a connector pin for connecting the electronic circuit board to an external wiring, and is fitted to the case and covers the opening. , And
In the state where the electronic circuit board is accommodated in the case and the opening is covered with the connector housing,
One end of the connector pin having a spring property is in contact with a terminal portion provided on the electronic circuit board, and the connector pin and the electronic circuit board are electrically connected,
The other end of the connector pin is an electronic device that is exposed to the outside of the case covered with the connector housing and functions as a connector for connecting to the external wiring,
Substrate pressing means for suppressing movement in a direction perpendicular to the substrate surface of the electronic circuit board is provided near the terminal portion,
It said connector housing, said fit each other respectively positioned on an upper surface side and lower surface side of the electronic circuit board, child electrodeposition characterized by comprising divided into upper housing part and lower housing part device.

The connector housing is formed by resin injection molding,
The connector pins, electronic device according to any one of claims 1 to 5, characterized in that pressed into the connector housing after the injection molding.

In the state where the electronic circuit board is accommodated in the case and the opening is covered with the connector housing,
Electronic device according to any one of claims 1 to 6 between the said connector housing case, characterized by comprising sealed by the sealing member.

The electronic device according to any one of claims 1 to 7, wherein the terminal portions are respectively disposed on an upper surface side and a lower surface side of the electronic circuit board .

The plurality of terminal portions are arranged to form a row at the same distance from the tip of the end portion of the electronic circuit board. The electronic device described.

The electronic device according to claim 9 , wherein the plurality of rows at different distances from a tip of an end of the electronic circuit board are configured on at least one surface side of the electronic circuit board .

The electronic device according to claim 1 , wherein the electronic device is a vehicle-mounted electronic device.