JP6252982B2 - Glass member and manufacturing method thereof - Google Patents

Description

  The present invention relates to a glass member suitable as a cover member such as a wavelength conversion member provided on an upper part of a semiconductor light emitting element such as an LED (light emitting diode) or an LD (laser diode), and a manufacturing method thereof.

  In recent years, semiconductor light emitting device devices such as LEDs have attracted attention as next-generation light sources. The LED may be coated and molded with a resin to protect the surface. Moreover, it is also possible to convert the luminescent color of LED by carrying out the coating molding on LED with resin which mix | blended inorganic fluorescent substance powder. However, since the heat and light emitted from the LED are intensively applied to a limited portion, the resin used for the coating mold is easily colored or deformed. Therefore, there is a problem that the emission color changes in a short period of time and the lifetime as a semiconductor light emitting device is short. This problem is considered to be serious as the output of the LED is increased, and the development of a semiconductor light emitting device having excellent heat resistance has been desired.

  On the other hand, a member (wavelength conversion member) made of an inorganic solid that does not use a resin matrix has been proposed as a cover member of a semiconductor light emitting element (see, for example, Patent Document 1). The cover member has excellent heat resistance and hardly undergoes thermal deterioration. The cover member disclosed in Patent Document 1 is provided, for example, as a plate-shaped molded body by filling a mold with a mixture of glass powder and inorganic phosphor powder and heat-treating (sintering) in the vicinity of the softening point. .

JP 2003-258308 A

  It is difficult to accurately process the cover member described in Patent Document 1 into a desired shape. In particular, when attempting to reduce the thickness of the member in order to improve the light transmittance, the mechanical strength is reduced and the member is easily damaged.

  In view of the above, an object of the present invention is to provide a glass member that is suitable as a cover member for a semiconductor light-emitting element device and has a desired mechanical strength even if it is thinned, so that breakage can be suppressed. To do.

  The glass member of the present invention is a glass member comprising a translucent glass layer and a glass ceramic layer formed on one side of the translucent glass layer, the glass ceramic layer having an opening, and The window part which consists of a translucent glass layer is formed in the position which faces an opening part, It is characterized by the above-mentioned.

  The glass member of the present invention is a glass member provided with a translucent glass layer and a pair of glass ceramic layers formed on both main surfaces of the translucent glass layer, and the pair of glass ceramic layers are respectively opened. And a window formed of a light-transmitting glass layer is formed at a position facing the opening.

  In the glass member of the present invention, the glass ceramic layer is preferably composed of a sintered body of mixed powder containing glass powder and inorganic crystal powder.

  In the glass member of the present invention, the translucent glass layer is preferably made of a sintered body of glass powder.

  In the glass member of the present invention, the translucent glass layer preferably contains an inorganic phosphor powder.

  In the glass member of the present invention, it is preferable that a plurality of window portions are formed.

  The glass member of the present invention is preferably used by being installed on the light emitting surface of the semiconductor light emitting device.

  The semiconductor light emitting device of the present invention is characterized by comprising the glass member and the semiconductor light emitting device.

  The method for producing a glass member of the present invention is a method for producing the above glass member, and (a) a green sheet for forming a translucent glass layer for forming a translucent glass layer, and a glass ceramic. A step of preparing a green sheet for forming a glass ceramic layer for forming a layer, (b) a step of processing the green sheet for forming a glass ceramic layer to form an opening, and (c) formation of the light-transmitting glass layer A step of laminating the green sheet for forming and the green sheet for forming the glass ceramic layer after processing, and (d) a step of firing the laminate.

  The method for producing a glass member of the present invention is a method for producing the above glass member, and (a) a green sheet for forming a translucent glass layer for forming a translucent glass layer, and a pair of A step of preparing a pair of glass ceramic layer forming green sheets for forming a glass ceramic layer, (b) a step of processing each of the pair of glass ceramic layer forming green sheets to form an opening, (c) Laminating a pair of glass ceramic layer-forming green sheets after processing on both main surfaces of the light-transmitting glass layer-forming green sheets so that the openings overlap each other, and obtaining a laminate, and ( d) a step of firing the laminate.

  According to the present invention, since the translucent glass layer is laminated with the glass ceramic layer, even if the thickness is reduced in order to improve the light transmittance of the translucent glass layer, a high strength is obtained. Since the strength of the glass member is improved by the glass ceramic layer, it is possible to suppress breakage of the translucent glass layer.

(A) It is a typical perspective view which shows the glass member which concerns on the 1st Embodiment of this invention. (B) It is a figure which shows the A-A 'cross section in Fig.1 (a). It is a figure which shows a part of manufacturing process of the glass member which concerns on the 1st Embodiment of this invention. (A) It is a typical perspective view which shows the glass member which concerns on the 2nd Embodiment of this invention. (B) It is a figure which shows the A-A 'cross section in Fig.3 (a). It is a figure which shows a part of manufacturing process of the glass member which concerns on the 2nd Embodiment of this invention. It is a typical perspective view which shows the glass member which concerns on the 3rd Embodiment of this invention. It is a typical perspective view which shows the glass member which concerns on the 4th Embodiment of this invention. It is a typical perspective view which shows the glass member which concerns on the 5th Embodiment of this invention. It is a mimetic diagram showing one embodiment of a semiconductor light emitting element device of the present invention.

  Below, embodiment of the glass member of this invention is described.

(1-1) First Embodiment FIG. 1A is a schematic perspective view showing a glass member according to a first embodiment of the present invention. FIG.1 (b) is a figure which shows the AA 'cross section in Fig.1 (a).

  In the present embodiment, the glass member 1 includes a translucent glass layer 2 and a glass ceramic layer 3. The glass ceramic layer 3 is formed on one side (specifically, the main surface 2a) of the translucent glass layer 2. The glass ceramic layer 3 has a circular opening O, and a window W made of the translucent glass layer 2 is formed at a position facing the opening O. The shape of the opening O is not particularly limited, and may be a polygon such as a circle or a rectangle. In the glass member 1, since the translucent glass layer 2 is supported by the glass ceramic layer 3, even if the translucent glass layer 2 (window part W) is made thin, mechanical strength is fully ensured. Moreover, the window part W of a desired shape and magnitude | size can be easily obtained by processing the opening part O suitably so that it may mention later.

  Each component will be described below.

(Translucent glass layer 2)
The translucent glass layer 2 is a layer having a relatively high light transmittance in the visible range. Thereby, for example, when the glass member 1 is used as a cover member of a semiconductor light emitting element, light emitted from the semiconductor light emitting element (or light wavelength-converted by the inorganic phosphor powder) can be efficiently transmitted. Specifically, the total light transmittance at a wavelength of 400 to 800 nm of the translucent glass layer 2 is preferably 10% or more, more preferably 20% or more, and further preferably 30% or more. 40% or more is particularly preferable, and 50% or more is most preferable.

  The translucent glass layer 2 is preferably made of, for example, a sintered body of glass powder. The translucent glass layer 2 may contain an inorganic phosphor powder. In that case, when used as a cover member of the semiconductor light emitting device, when the light (excitation light) emitted from the semiconductor light emitting device passes through the window W formed by the opening O of the glass ceramic layer 3, the inorganic phosphor. Wavelength conversion can be performed by powder.

  It is necessary to select the composition of the glass powder in consideration of various conditions. For example, a sintered body of glass powder is required to have a high light transmittance in the visible region. Moreover, when the translucent glass layer 2 consists of the sintered compact of the mixed powder of glass powder and inorganic fluorescent substance powder, glass powder has a role as a medium for hold | maintaining inorganic fluorescent substance powder stably. In this case, since the reactivity with the inorganic phosphor powder varies depending on the glass composition system to be used, it is necessary to select a glass with a reactivity as low as possible with the inorganic phosphor powder.

  Although the softening point of glass powder is not specifically limited, For example, it is preferable that it is 850 degrees C or less, Furthermore, it is 800 degrees C or less. In particular, when the translucent glass layer 2 is made of a fired body of a mixed powder of glass powder and inorganic phosphor powder, the firing temperature also increases as the softening point of the glass powder increases, so that the inorganic phosphor powder deteriorates. Therefore, it is difficult to obtain high luminous efficiency.

Examples of the glass powder include SiO ₂ —B ₂ O ₃ glass, SiO ₂ —RO glass (R is at least one selected from Mg, Ca, Sr and Ba), SiO ₂ —B ₂ O _3. -RO based _{glass, SiO 2 -B 2 O 3 -R} '2 O -based glass (R' is at least one selected Li, from Na and _{K), SiO 2 -B 2 O} 3 -Al 2 O 3 Glass-based glass, SiO ₂ —B ₂ O ₃ —ZnO-based glass, SnO—P ₂ O ₅ -based glass, ZnO—B ₂ O ₃ -based glass, or the like can be used. Incidentally, for the purpose of low-temperature firing is relatively low softening point (e.g., 400 ° C. or less, more 380 ° C. or below) is obtained easily _ZnO-B 2 _{O 3} based glass or _SnO-P 2 _{O 5} based glass It is preferable to select. When it is desired to improve the weather resistance, SiO ₂ —B ₂ O ₃ glass, SiO ₂ —RO glass, SiO ₂ —B ₂ O ₃ —RO glass, SiO ₂ —B ₂ O ₃ —R ′ ₂ O What is necessary is just to select a glass based, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ based glass or SiO ₂ —B ₂ O ₃ —ZnO based glass.

The composition range of the SiO ₂ —B ₂ O ₃ —RO-based glass is mass%, SiO ₂ 30 to 70%, B ₂ O ₃ 1 to 15%, MgO 0 to 10%, CaO 0 to 25%, SrO 0. ~10%, BaO 8~40%, RO 10~45%, Al 2 O 3 0~20%, and is preferably 0% ZnO. In addition to the above components, various components can be contained within a range that does not impair the gist of the present invention. For example, R ′ ₂ O, P ₂ O ₅ , La ₂ O _{3 and the} like may be contained up to 30% in total.

The composition range of the SnO—P ₂ O ₅ glass is mass%, and is preferably SnO 30 to 90% and P ₂ O ₅ 10 to 60%. Further, the _B 2 _{O 3} in addition to the above-mentioned components may contain 0-30%. In addition, various components can be contained within a range not impairing the gist of the present invention. For example, SiO ₂ , Al ₂ O ₃ , RO, R ′ ₂ O, etc. may be contained up to 30% in total.

The average of the glass powder the particle diameter _{D 50} is preferably 0.1~300μm, 0.7~250μm is more preferable. When the average particle diameter D ₅₀ is too small, foaming to porosity (ratio of residual bubbles) is increased during sintering, or light transmittance is reduced and the mechanical strength may be lowered. On the other hand, when the average particle diameter D ₅₀ of the glass powder is too large, there is a tendency for low-temperature firing becomes difficult. In the present invention, the average particle diameter D ₅₀ refers to a value measured by a laser diffraction method.

  The inorganic phosphor powder can be used as long as it is generally available in the market. Inorganic phosphor powders comprising oxides (including garnets such as YAG), nitrides, oxynitrides, sulfides, rare earth oxysulfides, halides, aluminate chlorides, halophosphates, etc. Is mentioned. The oxide phosphor powder has a feature that it is stable even when mixed with glass powder and heated at a high temperature. Each phosphor powder of nitride, oxynitride, sulfide, rare earth oxysulfide, halide, aluminate chloride, and halophosphate chloride reacts with glass powder during firing, and abnormal reactions such as foaming and discoloration It is easy to cause. The degree tends to become more prominent as the firing temperature is higher. When using these inorganic phosphor powders, the reaction with the glass powder can be suppressed by optimizing the firing temperature and the glass powder composition.

  A plurality of inorganic phosphor powders may be mixed and used in accordance with the wavelength range of the excitation light and the color to be emitted. For example, in order to obtain white light by irradiating ultraviolet excitation light, inorganic phosphor powders emitting blue, green, and red fluorescence may be mixed and used.

The average particle diameter D50 of the inorganic phosphor powder is preferably 1 to 75 μm, and more preferably 1 to ₅₀ μm. When the average particle diameter D ₅₀ of the inorganic phosphor powder is too small, or react with the glass powder during firing, or by foaming, there is a tendency that the porosity of the translucent glass layer 2 is increased. On the other hand, when the average particle diameter D ₅₀ of the inorganic phosphor powder is too large, the excitation light emitted from the semiconductor light emitting element is hardly transmitted to the inside of the light-transmitting glass layer 2, luminous efficiency tends to decrease.

  The luminous efficiency of the translucent glass layer 2 containing the inorganic phosphor powder varies depending on the type and content of the inorganic phosphor powder, the thickness of the translucent glass layer 2, and the like. If you want to increase the luminous efficiency of the translucent glass layer 2, reduce the wall thickness to increase the transmittance of excitation light or wavelength-converted light, or increase the content of inorganic phosphor powder to reduce the amount of emitted light. What is necessary is just to adjust by increasing. However, when there is too much content of inorganic fluorescent substance powder, it will become difficult to sinter and there exists a tendency for the porosity of the translucent glass layer 2 to become large. On the other hand, if the content of the inorganic phosphor powder is too small, the emission intensity tends to decrease. Therefore, the content of the inorganic phosphor powder in the translucent glass layer 2 is preferably adjusted in the range of 0.01 to 30% by mass, 0.05 to 20% by mass, particularly 0.08 to 15% by mass. .

  Although the thickness of the translucent glass layer 2 is not specifically limited, For example, it is preferable that it is 0.05-1 mm, it is more preferable that it is 0.08-0.5 mm, and it is 0.1-0.2 mm. Is more preferable. When the thickness of the translucent glass layer 2 is too small, it will be inferior to mechanical strength and will be damaged easily. On the other hand, when the thickness of the translucent glass layer 2 is too large, the light transmittance in the visible region tends to be lowered.

(Glass ceramic layer 3)
The glass ceramic layer 3 is a layer having a relatively low light transmittance in the visible range. Thereby, for example, when the glass member 1 is used as a cover member of a semiconductor light emitting element, light emitted from the semiconductor light emitting element (or light converted in wavelength by the inorganic phosphor powder) can be shielded. Specifically, the total light transmittance at a wavelength of 400 to 800 nm of the glass ceramic layer 3 is preferably 5% or less, more preferably 3% or less, and even more preferably 1% or less.

  The glass ceramic layer 3 has a structure in which crystals are dispersed in a glass matrix, thereby achieving high strength. Examples of the crystal include alumina, diopside, anorthite, mullite, cordierite, spinel, zirconia, titania, quartz, niobium oxide and the like. The glass ceramic layer 3 is made of, for example, a sintered body of mixed powder containing glass powder and inorganic crystal powder.

  As the glass powder, those described above can be used. When the translucent glass layer 2 and the glass ceramic layer 3 are formed by firing at the same time, the glass powders used for the translucent glass layer 2 and the glass ceramic layer 3 have similar or the same softening point. Furthermore, it is preferable that the compositions are similar or the same.

  Examples of the inorganic crystal powder include alumina and zirconia. The content of the inorganic crystal powder in the glass ceramic layer 3 is preferably 1 to 90% by mass in total, more preferably 10 to 80% by mass, and 20 to 75% by mass. More preferably, it is especially preferable that it is 30-70 mass%.

The average particle diameter D50 of the inorganic crystal powder is preferably from 0.01 to 100 [mu] m, and preferably from 0.1 to _{50 [} mu] m. When the average particle diameter D ₅₀ of the inorganic crystalline powder is too small, mechanical strength penetration into the glass powder is likely to be low during firing. On the other hand, if the average particle diameter D ₅₀ of the inorganic crystal powder is too large, the glass powder flow is hindered during firing, and pores are easily generated in the glass ceramic layer 3.

  Although the thickness of the glass ceramic layer 3 is not specifically limited, 0.05-2 mm is preferable, 0.08-1.5 mm is more preferable, 0.1-1 mm is further more preferable. When the thickness of the glass ceramic layer 3 is too small, it is inferior in mechanical strength and easily broken. On the other hand, if the thickness of the glass ceramic layer 3 is too large, deformation or breakage due to the difference in thermal expansion coefficient between the layers tends to occur in the firing step of the manufacturing method by the green sheet method described later. In addition, the manufacturing cost tends to be high.

(1-2) Manufacturing method of glass member according to first embodiment The manufacturing method of the glass member according to the first embodiment is (a) Translucent glass layer formation for forming a translucent glass layer. A step of preparing a green sheet for forming a glass ceramic layer and a glass sheet for forming a glass ceramic layer for forming a glass ceramic layer, (b) a step of processing the green sheet for forming a glass ceramic layer to form an opening, (c ) A step of laminating the green sheet for forming a translucent glass layer and the green sheet for forming a glass ceramic layer after processing to obtain a laminate, and (d) a step of firing the laminate.

  Hereinafter, each process will be described in detail.

(A) Green sheet preparation process The green sheet for translucent glass layer formation can be produced as follows. A resin binder containing a predetermined amount of resin, plasticizer, solvent, etc. is added to the glass powder to form a slurry. If necessary, an inorganic phosphor powder or an inorganic filler powder is added to the glass powder. The slurry is formed into a sheet on a film of polyethylene terephthalate (PET) or the like by a doctor blade method or the like. A green sheet for forming a translucent glass layer is obtained by drying the slurry formed into a sheet.

  Regarding the green sheet for forming the glass ceramic layer, the green sheet for forming the glass ceramic layer is formed in the same manner as the green sheet for forming the translucent glass layer, except that a mixed powder of glass powder and inorganic crystal powder is used as the raw material powder. Can be produced.

(B) Green sheet processing step The glass ceramic layer forming green sheet obtained above is processed to form an opening so that a window W having a desired size and shape can be obtained. Examples of the processing method include mechanical punching using a metal pin and laser punching using a carbon dioxide laser. When laser punching with a carbon dioxide laser is performed on the green sheet, the resin binder can be burned out instantaneously, so that the opening can be formed with high dimensional accuracy and in a short time.

(C) Green sheet laminated body preparation process The green sheet for translucent glass layer formation obtained above and the processed green sheet for glass ceramic layer formation are laminated | stacked, and a laminated body is obtained. If necessary, it is preferable to integrate by heat pressing using a mold. In addition, you may cut | disconnect each green sheet to a desired shape and dimension before laminating | stacking.

(D) Green sheet baking process The glass member 1 is obtained by baking the laminated body obtained above. Specifically, first, the laminate is degreased by heat treatment at about 200 to 550 ° C., and then sintered by heat treatment at about 750 to 1000 ° C. Here, as shown in FIG. 2, the laminate 4 may be fired in a state of being sandwiched and fixed between constraining substrates 5 made of alumina or the like. Thereby, the deformation | transformation of the laminated body 4 by the shrinkage | contraction at the time of baking can be suppressed. The obtained glass member 1 may be subjected to post-processing such as cutting and polishing as necessary.

  According to the manufacturing method according to the present embodiment, at least the main surface 2 a ′ of both the main surfaces of the translucent glass layer forming green sheet 2 ′ can be fired without contacting the constraining substrate 5. . Therefore, in the obtained glass member 1, at least the main surface 2 a of the translucent glass layer 2 can be a fire-polished surface, and the surface roughness can be reduced. Thereby, the light scattering in the main surface 2a can be suppressed, and the light transmittance of the translucent glass layer 2 can be improved. When the translucent glass layer 2 contains inorganic fluorescent substance powder, the light emission efficiency of the translucent glass layer 2 can be improved.

(2-1) Second Embodiment FIG. 3A is a schematic perspective view showing a glass member according to a second embodiment of the present invention. FIG.3 (b) is a figure which shows the AA 'cross section in Fig.3 (a).

  In the present embodiment, the glass member 1 includes a translucent glass layer 2 and a pair of glass ceramic layers 3 formed on both main surfaces of the translucent glass layer 2. Each glass ceramic layer 3 has an opening O, and the openings O are in positions where they overlap each other. Thereby, the window part W which consists of the translucent glass layer 2 in the position which faces the opening part O is formed. In this embodiment, since the glass ceramic layer 3 is formed in both the main surfaces of the translucent glass layer 2, it is easy to achieve high mechanical strength.

  In addition, it is preferable that the opening part O in each glass ceramic layer 3 is substantially the same shape and the substantially same dimension, and has overlapped substantially completely.

  In the glass member according to the present embodiment, the above-described components can be applied to each component.

(2-2) Manufacturing method of glass member according to second embodiment The manufacturing method of the glass member according to the second embodiment is (a) Translucent glass layer formation for forming a translucent glass layer. A step of preparing a green sheet for forming a glass ceramic layer and a pair of green sheets for forming a glass ceramic layer for forming a pair of glass ceramic layers; (C) Laminating a pair of green sheets for forming a glass ceramic layer after processing on both main surfaces of the green sheet for forming a translucent glass layer so that the openings overlap each other. A step of obtaining a body, and (d) a step of firing the laminate.

  In the above manufacturing method, the same method as the manufacturing method of the glass member according to the first embodiment is applied to (a) the green sheet preparation step, (b) the green sheet processing step, and (d) the green sheet firing step. can do.

  (C) The green sheet laminate manufacturing step is performed as follows, for example. First, two glass ceramic layer forming green sheets having the same shape and dimensions are prepared, and openings having the same shape and the same dimensions are formed at the same positions of these glass ceramic layer forming green sheets. In this step, two glass ceramic layer forming green sheets are stacked and cut into a predetermined shape and size, and openings having the same shape and the same size are formed at predetermined positions of the cut glass ceramic layer forming green sheet. This can be achieved by forming the part. Next, the green sheets for forming a glass ceramic layer after processing are laminated on both main surfaces of the green sheet for forming a translucent glass layer so that the openings overlap each other, thereby obtaining a laminate.

  FIG. 4 shows a schematic cross-sectional view at the time of firing the laminate. As shown in FIG. 4, according to the manufacturing method which concerns on this embodiment, both main surface 2a 'and main surface 2b' of translucent glass layer forming green sheet 2 'contact the restraint base material 5. FIG. Firing can be performed without any problems. Therefore, in the obtained glass member, both the main surface 2a and the main surface 2b of the translucent glass layer 2 can be made into a fire polished surface. Moreover, since it becomes a vertically symmetrical structure by laminating | stacking glass-ceramic-layer formation green sheet 3 'of the same material and thickness on both main surfaces of green sheet 2' for translucent glass layer formation, each layer at the time of baking Deformation due to the difference in thermal expansion coefficient can be suppressed.

(3) Third Embodiment FIG. 5 is a schematic perspective view showing a glass member according to a third embodiment of the present invention. In the glass member according to the first embodiment, only one window portion W is provided, whereas in the glass member according to this embodiment, a plurality of window portions are provided in a matrix at substantially equal intervals.

  The glass member according to the present embodiment may be used as it is, or may be used after being cut into a predetermined size. For example, you may cut | disconnect and use to a piece along the cut surface C so that a window part may become one each.

(4) Fourth Embodiment FIG. 6 is a schematic perspective view showing a glass member according to a fourth embodiment of the present invention. In the glass member according to the second embodiment, only one window portion W is provided, whereas in the glass member according to the present embodiment, a plurality of window portions are provided in a matrix at substantially equal intervals. In FIG. 6, the opening O in the lower glass ceramic layer 3 is omitted for convenience (the same applies to FIG. 7).

(5) Fifth Embodiment FIG. 7 is a schematic perspective view showing a glass member according to a fifth embodiment of the present invention. In the glass member according to the fourth embodiment, the window portion W (opening portion O) is circular, whereas in the glass member according to the present embodiment, the window portion W is rectangular.

(6) Semiconductor Light Emitting Element Device FIG. 8 is a schematic view showing an embodiment of the semiconductor light emitting element device of the present invention. As shown in FIG. 8, the light emitting device 6 includes a glass member 1 and a semiconductor light emitting element 7. The glass member 1 is installed on the light emitting surface of the semiconductor light emitting element 7. The light L1 emitted from the semiconductor light emitting element 7 passes through the translucent glass layer 2 of the glass member 1 and is irradiated to the outside as light L2. Here, when the translucent glass layer 2 contains the inorganic phosphor powder, the light L1 is wavelength-converted and irradiated to the outside as light L2 having a different wavelength. At this time, the combined light of the light after wavelength conversion and the light transmitted without wavelength conversion may be emitted as the light L2.

  The present invention will be described in detail below based on examples, but the present invention is not limited to these examples.

Example 1
(1) Production of Green Sheet for Translucent Glass Layer Formation SiO ₂ —B ₂ O ₃ − having a composition of SiO ₂ 60%, B ₂ O ₃ 10%, BaO 10%, and CaO 20% by mass%. A slurry was prepared by appropriately mixing an acrylic binder, a plasticizer and a solvent with RO glass powder (softening point 820 ° C., average particle diameter D ₅₀ : 2.5 μm). The obtained slurry was formed into a sheet on a PET film by a doctor blade method to obtain a green sheet (thickness: 0.1 mm) for forming a translucent glass layer.

(2) Preparation of Green Sheet for Glass Ceramic Layer Formation 50% by mass of alumina powder (average particle diameter D ₅₀ : 2.0 μm) was added to 50% by mass of the glass powder to obtain a mixed powder. Using the obtained mixed powder, a green sheet for forming a glass ceramic layer (thickness: 0.15 mm) was obtained in the same manner as (1).

(3) Preparation and firing of laminate The green sheet for forming a light-transmitting glass layer was cut into 70 mm square using a metal mold. Further, in a state in which two glass ceramic layer forming green sheets are stacked, they are cut into 70 mm squares using a metal mold, and a plurality of circular openings having a diameter of 2 mm are arranged as shown in FIG. Formed.

  The green sheet for forming a light-transmitting glass layer after processing is sandwiched between two green sheets for forming a glass ceramic layer after processing, and thermocompression bonding is performed at 90 ° C. and a pressure of 30 MPa using a hot press machine. The laminated body was obtained by integrating.

  The obtained laminate was sandwiched between a pair of alumina substrates, degreased at 400 ° C. for 1 hour, and then baked at 850 ° C. for 30 minutes to obtain a glass member as shown in FIG.

  In the obtained glass member, the glass ceramic layer portion (thickness: 0.1 mm each) had a white and opaque appearance, and the window portion (thickness: 0.07 mm) had translucency. Specifically, the total light transmittance of the glass ceramic layer was 0.5%, and the total light transmittance of the window part (translucent glass layer) was 70%. The total light transmittance was measured according to JIS K 7015.

(Example 2)
(1) Production of Green Sheet for Translucent Glass Layer Formation 15% by mass of YAG phosphor powder was added to 85% by mass of the glass powder used in Example 1 to obtain a mixed powder. Using the obtained mixed powder, a green sheet for forming a translucent glass layer (thickness: 0.2 mm) was produced in the same manner as in Example 1.

(2) Production of Green Sheet for Glass Ceramic Layer Formation A green sheet for glass ceramic layer formation (thickness: 0.2 mm) was produced in the same manner as in Example 1.

(3) Preparation and firing of laminate The green sheet for forming a light-transmitting glass layer was cut into 70 mm square using a metal mold. Further, in a state in which two glass ceramic layer forming green sheets are stacked, the sheet is cut into 70 mm square using a metal mold, and a plurality of 1 mm square rectangular openings are arranged as shown in FIG. Formed.

  The green sheet for forming a light-transmitting glass layer after processing is sandwiched between two green sheets for forming a glass ceramic layer after processing, and thermocompression bonding is performed at 90 ° C. and a pressure of 30 MPa using a hot press machine. The laminated body was obtained by integrating.

  The obtained laminate was sandwiched between a pair of alumina substrates, degreased at 400 ° C. for 1 hour, and then baked at 850 ° C. for 30 minutes to obtain a glass member as shown in FIG.

In the obtained glass member, the glass ceramic layer portion (thickness: 0.15 mm each) had a white and opaque appearance, and the window portion (thickness: 0.15 mm) had a yellow color. Specifically, the total light transmittance of the glass ceramic layer was 0.1%, and the total light transmittance at 550 nm of the window portion (translucent glass layer) was 40%. As for this glass member, a window part functions as a wavelength conversion member.
(Comparative example)
Only the green sheet for translucent glass layer formation obtained in Example 1 was sandwiched between a pair of alumina substrates, degreased at 400 ° C. for 1 hour, and then baked at 850 ° C. for 30 minutes. When the obtained sintered body was detached from the alumina base material, it was damaged due to insufficient mechanical strength.

DESCRIPTION OF SYMBOLS 1 Glass member 2 Translucent glass layer 2a, 2b Main surface 2 'Green sheet 2a', 2b 'main surface for translucent glass layer formation 3 Glass ceramic layer 3' Green sheet 4 for glass ceramic layer formation Laminate 5 Restraint Substrate 6 Semiconductor light emitting device 7 Semiconductor light emitting device O Opening portion W Window portion C Cut surface

Claims (10)

A glass member comprising a translucent glass layer and a glass ceramic layer formed on one side of the translucent glass layer,
The glass member, wherein the glass ceramic layer has an opening, and a window made of the translucent glass layer is formed at a position facing the opening. A glass member comprising a translucent glass layer and a pair of glass ceramic layers formed on both sides of the translucent glass layer,
Each of the pair of glass ceramic layers has an opening, the opening is in a position where they overlap each other, and a window made of the translucent glass layer is formed at a position facing the opening. A characteristic glass member.   The glass member according to claim 1 or 2, wherein the glass ceramic layer is made of a sintered body of mixed powder containing glass powder and inorganic crystal powder.   The said translucent glass layer consists of a sintered compact of glass powder, The glass member as described in any one of Claims 1-3 characterized by the above-mentioned.   The said translucent glass layer contains inorganic fluorescent substance powder, The glass member as described in any one of Claims 1-4 characterized by the above-mentioned.   The said window part is formed in multiple numbers, The glass member as described in any one of Claims 1-5 characterized by the above-mentioned.   It installs and uses on the light emission surface of a semiconductor light-emitting element, The glass member as described in any one of Claims 1-6 characterized by the above-mentioned.   A semiconductor light-emitting element device comprising the glass member according to claim 6 and a semiconductor light-emitting element. It is a method for manufacturing the glass member as described in any one of Claims 1 and 3-7,
(A) a step of preparing a green sheet for forming a light transmissive glass layer for forming the light transmissive glass layer, and a green sheet for forming a glass ceramic layer for forming the glass ceramic layer;
(B) processing the green sheet for forming the glass ceramic layer to form an opening;
(C) Laminating the green sheet for forming a translucent glass layer and the green sheet for forming a glass ceramic layer after processing to obtain a laminate, and
(D) a step of firing the laminate;
The manufacturing method of the glass member characterized by including. It is a method for manufacturing the glass member as described in any one of Claims 2-7,
(A) A step of preparing a green sheet for forming a translucent glass layer for forming the translucent glass layer and a pair of green sheets for forming a glass ceramic layer for forming the pair of glass ceramic layers ,
(B) a step of forming each of the pair of glass ceramic layer forming green sheets to form an opening;
(C) Laminating a pair of glass ceramic layer forming green sheets after the processing on both main surfaces of the translucent glass layer forming green sheets so that the openings overlap each other; Obtaining step, and
(D) a step of firing the laminate;
The manufacturing method of the glass member characterized by including.