JP6236722B2 - Series circuit device - Google Patents

Series circuit device Download PDF

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JP6236722B2
JP6236722B2 JP2013085069A JP2013085069A JP6236722B2 JP 6236722 B2 JP6236722 B2 JP 6236722B2 JP 2013085069 A JP2013085069 A JP 2013085069A JP 2013085069 A JP2013085069 A JP 2013085069A JP 6236722 B2 JP6236722 B2 JP 6236722B2
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阿部　秀文
秀文 阿部
和隆 瀬野尾
和隆 瀬野尾
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Keihin Corp
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Description

本発明は、直列回路装置に関する。   The present invention relates to a series circuit device.

ハイブリッド自動車や電気自動車に搭載される高密度実装回路には、数百ボルトという大電圧がかかる。したがって、このような実装回路を製作する場合、部品（素子）間の電位差を考慮して部品端子間に要求される沿面距離を確保しつつ、大電位差に耐え得る部品（素子）を限られたスペースに配置しなければならない。   A high-density mounting circuit mounted on a hybrid vehicle or an electric vehicle requires a large voltage of several hundred volts. Therefore, when manufacturing such a mounting circuit, the components (elements) that can withstand a large potential difference are limited while securing the creepage distance required between the component terminals in consideration of the potential difference between the components (elements). Must be placed in space.

大電位差に耐え得る部品（素子）の配置方法としては、部品を複数に分けて直列に接続し、各部品にかかる電位差を低減する手法が知られている。しかし、単に部品を直列に接続するのでは、これら部品からなる直列回路の実装長さが長くなり、これら部品を実装する基板の長さに納まらなくなるおそれがある。   As a method for arranging components (elements) that can withstand a large potential difference, a method is known in which components are divided into a plurality of parts and connected in series to reduce the potential difference applied to each component. However, if the components are simply connected in series, the mounting length of the series circuit composed of these components becomes long and may not fit within the length of the board on which these components are mounted.

すなわち、電子部品は例えば全体を平面視して細長い矩形状に形成し、相対向する短辺に入力端子、出力端子をそれぞれ配置している。したがって、このような矩形上の部品をそれぞれの長辺の長さ方向に沿って直列に接続するのでは、前記したようにその直列回路の実装長さが長くなってしまうのである。
また、直列回路の実装長さに合わせて細長い基板を用いることも考えられるが、その場合には基板自体の納まりが悪くなり、自動車への搭載が難しくなるおそれがある。 In other words, for example, the electronic component is formed in a long and narrow rectangular shape as viewed from above, and an input terminal and an output terminal are disposed on opposite short sides. Therefore, if such rectangular parts are connected in series along the length direction of each long side, the mounting length of the series circuit becomes long as described above.
Although it is conceivable to use a long and narrow substrate in accordance with the mounting length of the series circuit, in that case, the accommodation of the substrate itself becomes worse, and it may be difficult to mount it on an automobile.

このような背景のもとに、特許文献１に開示された受動回路素子直列接続式電子回路装置では、高い電位差を負担する差動電圧増幅回路の入力抵抗素子を、プリント基板の表面に一列に固定された８本のチップ抵抗を導体層パターンにハンダ接続し、全体としてコ字状に形成配置することで、高電位差に耐え得る入力抵抗素子を短小化している。   Under such a background, in the passive circuit element series connection type electronic circuit device disclosed in Patent Document 1, the input resistance elements of the differential voltage amplifier circuit bearing a high potential difference are arranged in a line on the surface of the printed circuit board. The eight fixed chip resistors are solder-connected to the conductor layer pattern and formed in a U-shape as a whole, thereby shortening the input resistance element that can withstand a high potential difference.

特開２００７−２５８３５３号公報JP 2007-258353 A

しかしながら、前記特許文献１では直列接続式電子回路中の回路素子を高密度実装するため、該電子回路を配線基板上にて屈曲配置しているが、このように電子回路を屈曲配置すると実装面積が増大し、そのため回路全体の部品レイアウトが制約されてしまう。   However, in Patent Document 1, in order to mount the circuit elements in the series connection type electronic circuit with high density, the electronic circuit is bent on the wiring board. As a result, the component layout of the entire circuit is restricted.

本発明は前記事情に鑑みてなされたもので、回路素子端子間に要求される沿面距離を確保し、さらに回路全体の部品レイアウトの制約を小さくするとともに、回路素子の実装密度向上を可能にした、直列回路装置を提供することを目的としている。   The present invention has been made in view of the above circumstances, and has ensured a creepage distance required between circuit element terminals, further reduced restrictions on component layout of the entire circuit, and has made it possible to improve the mounting density of circuit elements. An object is to provide a series circuit device.

本発明の直列回路装置は、直流電源の正極に接続された正側配線に接続する正側接点、及び前記直流電源の負極に接続された負側配線に接続する負側接点と、これら前記正側接点と前記負側接点との間に形成された配線パターンと、複数の回路素子と、を有し、前記複数の回路素子が前記配線パターンにより互いに直列接続して構成される少なくとも一つの直列回路を備える直列回路装置において、
前記直列回路は、前記複数の回路素子の入力端子及び出力端子をそれぞれ同じ向きに揃えて配置し、前記複数の回路素子を、該回路素子の入力端子と出力端子とを結ぶ方向に対して交差する方向に並べて配置したことを特徴とする。 The series circuit device of the present invention includes a positive contact connected to a positive wiring connected to a positive electrode of a DC power supply, a negative contact connected to a negative wiring connected to a negative electrode of the DC power supply, and the positive contact. A wiring pattern formed between a side contact and the negative contact, and a plurality of circuit elements, wherein the plurality of circuit elements are connected in series by the wiring pattern. In a series circuit device comprising a circuit,
In the series circuit, input terminals and output terminals of the plurality of circuit elements are arranged in the same direction, and the plurality of circuit elements intersect with a direction connecting the input terminals and the output terminals of the circuit elements. It is characterized by being arranged side by side in the direction.

また、前記直列回路装置において、前記直列回路は、該直列回路を構成する回路素子どうしが隣り合うように同一軸上に配列していることが好ましい。   In the series circuit device, the series circuit is preferably arranged on the same axis so that circuit elements constituting the series circuit are adjacent to each other.

また、前記直列回路装置においては、前記配線パターンが前記正側接点側にて分岐され、かつ、前記負側接点側にて結合されてなり、これら分岐された配線パターンにより前記直列回路が複数設けられ、前記複数の直列回路のうちの隣り合う二つの直列回路は、各々同じ間隔で複数の回路素子が並べられ、かつ各々同じ特性の回路素子が用いられて同じ直列接続がなされた同一構成の直列回路が互いに並列回路を形成してなり、前記並列回路を構成する二つの直列回路は、一方の直列回路を構成する複数の回路素子が、他方の直列回路を構成する複数の回路素子に対して、各々入力端子と出力端子の向きを反転させていることが好ましい。   In the series circuit device, the wiring pattern is branched on the positive contact side and coupled on the negative contact side, and a plurality of the series circuits are provided by the branched wiring pattern. The adjacent two series circuits of the plurality of series circuits have the same configuration in which a plurality of circuit elements are arranged at the same interval, and circuit elements having the same characteristics are used to make the same series connection. A series circuit forms a parallel circuit, and two series circuits constituting the parallel circuit are configured such that a plurality of circuit elements constituting one series circuit are compared with a plurality of circuit elements constituting the other series circuit. Thus, it is preferable that the directions of the input terminal and the output terminal are reversed.

また、前記直列回路装置においては、前記配線パターンが前記正側接点側にて分岐され、かつ、前記負側接点側にて結合されてなり、これら分岐された配線パターンにより前記直列回路が複数設けられ、前記複数の直列回路のうちの隣り合う二つの直列回路は、各々同じ間隔で複数の回路素子が並べられ、かつ各々同じ特性の回路素子が用いられて同じ直列接続がなされた同一構成の直列回路が互いに並列回路を形成してなり、前記並列回路を構成する二つの直列回路は、一方の直列回路の、前記配線パターンによって前記正側接点に最も近く接続されている回路素子を、他方の直列回路の、前記配線パターンによって前記正側接点に最も近く接続されている回路素子に対して、該回路素子の入力端子と出力端子とを結ぶ方向に対して交差する方向において隣り合う回路素子間の距離に対応する分だけ、前記負側接点の側に離して配置していることが好ましい。   In the series circuit device, the wiring pattern is branched on the positive contact side and coupled on the negative contact side, and a plurality of the series circuits are provided by the branched wiring pattern. The adjacent two series circuits of the plurality of series circuits have the same configuration in which a plurality of circuit elements are arranged at the same interval, and circuit elements having the same characteristics are used to make the same series connection. A series circuit forms a parallel circuit with each other, and the two series circuits constituting the parallel circuit include a circuit element of one series circuit that is connected to the positive side contact closest to the positive side contact by the wiring pattern, In the series circuit of the circuit element, the circuit element that is connected closest to the positive contact by the wiring pattern intersects with the direction connecting the input terminal and the output terminal of the circuit element. By an amount corresponding to the distance between the circuit elements adjacent to each other in the direction, it is preferable that the spaced apart on the side of the negative side contact.

また、前記直列回路装置において、前記正側配線及び負側配線は、接地電位部から絶縁された非接地回路を構成していることが好ましい。   In the series circuit device, it is preferable that the positive side wiring and the negative side wiring constitute a non-ground circuit insulated from a ground potential portion.

本発明の直列回路装置によれば、複数の回路素子の入力端子及び出力端子をそれぞれ同じ向きに揃えて配置し、これら複数の回路素子を、該回路素子の入力端子と出力端子とを結ぶ方向に対して交差する方向に並べて配置したので、前記交差する方向に隣り合って並ぶ回路素子の端子間の電位差を最小限に抑えることができる。したがって、回路素子端子間に要求される沿面距離を確保しつつ、これら回路素子間の距離を従来に比べ短くすることができ、これによって回路全体の部品レイアウトの制約を小さくするとともに、回路素子の実装密度を向上することができる。   According to the series circuit device of the present invention, the input terminals and the output terminals of a plurality of circuit elements are arranged in the same direction, and the plurality of circuit elements are connected to the input terminals and the output terminals of the circuit elements. Accordingly, the potential difference between the terminals of the circuit elements arranged adjacent to each other in the intersecting direction can be minimized. Therefore, while ensuring the creepage distance required between the circuit element terminals, the distance between these circuit elements can be shortened as compared with the prior art, thereby reducing the restrictions on the component layout of the entire circuit and the circuit elements. Mounting density can be improved.

（ａ）は本発明に係る直列回路装置を備えた回路の一例の模式図、（ｂ）は本発明の第１実施形態の直列回路装置を示す模式図、（ｃ）は比較例としての従来の直列回路を示す模式図である。(A) is a schematic diagram of an example of a circuit provided with the series circuit device according to the present invention, (b) is a schematic diagram showing the series circuit device of the first embodiment of the present invention, and (c) is a conventional example as a comparative example. It is a schematic diagram which shows the series circuit of these. （ａ）〜（ｃ）は第１実施形態の直列回路装置の変形例を示す模式図である。(A)-(c) is a schematic diagram which shows the modification of the series circuit device of 1st Embodiment. （ａ）は本発明の第２実施形態の直列回路装置を示す模式図、（ｂ）は本発明の第３実施形態の直列回路装置を示す模式図である。(A) is a schematic diagram which shows the series circuit apparatus of 2nd Embodiment of this invention, (b) is a schematic diagram which shows the series circuit apparatus of 3rd Embodiment of this invention. （ａ）、（ｂ）は第１実施形態の直列回路装置の変形例を示す模式図である。(A), (b) is a schematic diagram which shows the modification of the series circuit device of 1st Embodiment.

以下、図面を参照して、本発明に係る直列回路装置について詳細に説明する。
図１（ａ）は、本発明に係る直列回路装置を備えた回路の一例の模式図であり、図１（ａ）中符号１は直流電源（バッテリー）、２は本発明に係る直列回路装置である。 Hereinafter, a series circuit device according to the present invention will be described in detail with reference to the drawings.
FIG. 1A is a schematic diagram of an example of a circuit including a series circuit device according to the present invention. In FIG. 1A, reference numeral 1 denotes a DC power source (battery), and 2 denotes a series circuit device according to the present invention. It is.

直流電源１には、その正極側に正側配線３が接続され、負極側に負側配線４が接続されている。直列回路装置２は、正側配線３中の正側接点３ａと負側配線４中の負側接点４ａとを含んでこれらの間に設けられている。また、これら正側配線３と負側配線４とは電力変換装置５に接続されている。電力変換装置５では直流が交流に変換され、これによって電力変換装置５に接続するモータ６が駆動させられるようになっている。このような構成のもとに前記正側配線３及び負側配線４は、接地電位部から絶縁された非接地回路を構成している。   The DC power supply 1 has a positive wiring 3 connected to the positive side and a negative wiring 4 connected to the negative side. The series circuit device 2 includes a positive contact 3 a in the positive wiring 3 and a negative contact 4 a in the negative wiring 4 and is provided between them. Further, the positive side wiring 3 and the negative side wiring 4 are connected to the power conversion device 5. In the power conversion device 5, direct current is converted into alternating current, and thereby the motor 6 connected to the power conversion device 5 is driven. Based on such a configuration, the positive side wiring 3 and the negative side wiring 4 constitute a non-grounded circuit insulated from the ground potential portion.

図１（ｂ）は、本発明の直列回路装置の第１実施形態を示す模式図、図１（ｂ）中において符号３ａは図１（ａ）に示した正側配線３中の正側接点３ａであり、４ａは図１（ａ）に示した負側配線４中の負側接点４ａである。本実施形態の直列回路装置２Ａは、前記正側接点３ａと負側接点４ａとの間に形成された配線パターン８と、複数の回路素子９と、を有して構成されている。そして、複数の回路素子９が配線パターン８によって互いに直列接続したことにより、一つの直列回路１０が形成されている。   FIG. 1B is a schematic diagram showing the first embodiment of the series circuit device of the present invention. In FIG. 1B, reference numeral 3a denotes a positive contact in the positive wiring 3 shown in FIG. 1A. 3a and 4a are the negative side contacts 4a in the negative side wiring 4 shown in FIG. The series circuit device 2A according to the present embodiment includes a wiring pattern 8 formed between the positive contact 3a and the negative contact 4a, and a plurality of circuit elements 9. A plurality of circuit elements 9 are connected in series with each other by the wiring pattern 8 to form one series circuit 10.

直列回路１０を構成する回路素子９は、抵抗素子であり、平面視矩形状に形成され、相対向する短辺にそれぞれ入力端子Ｉｎ、出力端子Ｏｕｔを有したものである。なお、図１（ｂ）では理解を容易にするため回路素子９を３つ有した例を挙げているが、本発明はこれに限定されることなく、４つ以上有していてもよく、また、２つでもよい。   The circuit element 9 constituting the series circuit 10 is a resistance element, is formed in a rectangular shape in plan view, and has an input terminal In and an output terminal Out on short sides facing each other. In addition, although FIG. 1B shows an example having three circuit elements 9 for easy understanding, the present invention is not limited to this and may have four or more, Two is also acceptable.

図１（ｂ）に示すように本実施形態の直列回路装置２Ａは、基板７上に正側配線３中の正側接点３ａと負側配線４中の負側接点４ａとを有し、これらの間、すなわち基板７上に直列回路１０を備えて構成されたものである。基板７は、単層基板でも積層基板（多層基板）でもよいが、本実施形態では単層基板が用いられている。   As shown in FIG. 1B, the series circuit device 2A of the present embodiment has a positive contact 3a in the positive wiring 3 and a negative contact 4a in the negative wiring 4 on the substrate 7, In other words, a series circuit 10 is provided on the substrate 7. The substrate 7 may be a single layer substrate or a multilayer substrate (multilayer substrate), but a single layer substrate is used in this embodiment.

直列回路１０を構成する配線パターン８、回路素子９は、本実施形態ではいずれも基板７の一方の面（表面）に配設されている。そして、回路素子９は全てが、その入力端子Ｉｎ及び出力端子Ｏｕｔをそれぞれ同じ向きに揃えて配置されている。すなわち、図中の左側に入力端子Ｉｎを向け、図中の右側に出力端子Ｏｕｔを向けて配置されている。また、これら回路素子９は、このように入力端子Ｉｎ及び出力端子Ｏｕｔをそれぞれ同じ向きに揃えた状態で、これら入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向（図中の左右方向）に対して交差する方向に並べられ、配置されている。   In the present embodiment, the wiring pattern 8 and the circuit element 9 constituting the series circuit 10 are both disposed on one surface (front surface) of the substrate 7. All circuit elements 9 are arranged with their input terminals In and output terminals Out aligned in the same direction. That is, the input terminal In is directed to the left side in the figure and the output terminal Out is directed to the right side in the figure. In addition, the circuit elements 9 have the input terminal In and the output terminal Out aligned in the same direction as described above, with respect to the direction connecting the input terminal In and the output terminal Out (the horizontal direction in the drawing). They are arranged and arranged in the intersecting direction.

本実施形態では、特に回路素子９は入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向（図中の左右方向）に対して直交する方向（図中の上下方向）に一列に並べられ、配置されている。すなわち、本実施形態の直列回路１０は、これを構成する回路素子９どうしが順次隣り合うように同一軸上に配列されている。   In the present embodiment, in particular, the circuit elements 9 are arranged and arranged in a line in a direction (vertical direction in the figure) orthogonal to a direction (horizontal direction in the figure) connecting the input terminal In and the output terminal Out. Yes. That is, the series circuit 10 of the present embodiment is arranged on the same axis so that the circuit elements 9 constituting the same are sequentially adjacent to each other.

また、このように配置された回路素子９を直列に接続するため配線パターン８は、正側接点３ａから１番目の回路素子９の入力端子Ｉｎに接続し、続いてこの回路素子９の出力端子Ｏｕｔから２番目の回路素子９の入力端子Ｉｎに接続し、さらにこの回路素子９の出力端子Ｏｕｔから２番目の回路素子９の入力端子Ｉｎに接続し、この回路素子９の出力端子Ｏｕｔから３番目の回路素子９の入力端子Ｉｎに接続し、その後負側接点４ａに接続している。   Further, in order to connect the circuit elements 9 arranged in this way in series, the wiring pattern 8 is connected from the positive contact 3a to the input terminal In of the first circuit element 9, and subsequently the output terminal of the circuit element 9 The output terminal Out of the circuit element 9 is connected to the input terminal In of the second circuit element 9, the output terminal Out of the circuit element 9 is connected to the input terminal In of the second circuit element 9, and the output terminal Out of the circuit element 9 is connected to 3 The second circuit element 9 is connected to the input terminal In and then connected to the negative contact 4a.

なお、各回路素子９の入力端子Ｉｎ、出力端子Ｏｕｔは、それぞれパッド１１を介して基板７上に接続実装されており、配線パターン８は、これらパッド１１を介して各回路素子９の入力端子Ｉｎ、出力端子Ｏｕｔにそれぞれ接続されている。また、図中では各回路素子９、９間の電位差をより分かり易くするために、配線パターン８には、各回路素子９の入力端子Ｉｎに接続する箇所の手前側にそれぞれ分岐配線８ａが形成されており、これら分岐配線８ａには、各回路素子９の端子部９ａが形成されている。   The input terminal In and the output terminal Out of each circuit element 9 are connected and mounted on the substrate 7 via pads 11, and the wiring pattern 8 is connected to the input terminal of each circuit element 9 via these pads 11. In and output terminal Out, respectively. In the drawing, in order to make the potential difference between the circuit elements 9 and 9 easier to understand, the wiring pattern 8 is formed with branch wirings 8a on the front side of the portion connected to the input terminal In of each circuit element 9 respectively. In addition, terminal portions 9a of the circuit elements 9 are formed in these branch wirings 8a.

ここで、図１（ｂ）に示すように正側接点３ａと負側接点４ａとの間の電位差が３００Ｖであり、回路素子９が各々同一特性であるとすると、各回路素子９の端子部９ａ、９ａ間の電位差は、正側接点３ａから１番目の回路素子９と２番目の回路素子９との間、及び正側接点３ａから２番目の回路素子９と３番目の回路素子９との間のいずれも、１００Ｖとなる。電子部品（回路素子９）は、沿面距離として単位電位差あたり所定長さ離間させる必要があり、仮に電位差１００Ｖあたり沿面距離を１ｍｍ離す必要があるとすると、図１（ｂ）に示した本実施形態では隣り合う回路素子９、９間の沿面距離ｄ１を１ｍｍ以上とする必要がある。   Here, as shown in FIG. 1B, if the potential difference between the positive side contact 3a and the negative side contact 4a is 300 V and the circuit elements 9 have the same characteristics, the terminal portions of the circuit elements 9 The potential difference between 9a and 9a is between the first circuit element 9 and the second circuit element 9 from the positive contact 3a and between the second circuit element 9 and the third circuit element 9 from the positive contact 3a. In any case, the voltage is 100V. The electronic component (circuit element 9) needs to be separated by a predetermined length per unit potential difference as a creepage distance. If the creepage distance needs to be separated by 1 mm per potential difference of 100 V, the present embodiment shown in FIG. Then, the creepage distance d1 between the adjacent circuit elements 9 and 9 needs to be 1 mm or more.

図１（ｃ）は、比較例としての従来の構成の直列回路を示す模式図であり、この例でも、正側接点３ａと負側接点４ａとの間の電位差は３００Ｖであるとする。この従来の直列回路では、各回路素子９の入力端子Ｉｎと出力端子Ｏｕｔとの向きが隣り合う回路素子９、９間で互いに逆になっている。したがって、各回路素子９の端子部９ａ、９ａ間の電位差は、正側接点３ａから１番目の回路素子９と２番目の回路素子９との間、及び正側接点３ａから２番目の回路素子９と３番目の回路素子９との間で、いずれも２００Ｖとなっている。   FIG. 1C is a schematic diagram showing a series circuit having a conventional configuration as a comparative example. In this example, the potential difference between the positive contact 3a and the negative contact 4a is 300V. In this conventional series circuit, the direction of the input terminal In and the output terminal Out of each circuit element 9 is opposite between the adjacent circuit elements 9 and 9. Therefore, the potential difference between the terminal portions 9a and 9a of each circuit element 9 is between the first circuit element 9 and the second circuit element 9 from the positive contact 3a and from the positive contact 3a to the second circuit element. 9 and the third circuit element 9 are both 200V.

よって、図１（ｃ）に示した従来の例では、隣り合う回路素子９、９間の電位差が本実施形態の倍の２００Ｖであることから、沿面距離ｄ２も倍の２ｍｍ以上とする必要があり、したがって本実施形態は、各回路素子９、９間の沿面距離を、従来に比べて短くすることができる。   Therefore, in the conventional example shown in FIG. 1C, the potential difference between the adjacent circuit elements 9 and 9 is 200 V which is twice that of the present embodiment. Therefore, in this embodiment, the creeping distance between the circuit elements 9 and 9 can be shortened compared to the conventional case.

図１（ｂ）に示した本実施形態の直列回路装置２Ａにあっては、複数の回路素子９の入力端子Ｉｎ及び出力端子Ｏｕｔをそれぞれ同じ向きに揃えて配置し、これら複数の回路素子９を、該回路素子９の入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して直交する方向に並べて配置したので、前記直交する方向に隣り合って並ぶ回路素子９、９の端子部９ａ、９ａ間の電位差を最小限に抑えることができる。したがって、回路素子９の端子間に要求される沿面距離を確保しつつ、これら回路素子９、９間の沿面距離ｄ１を従来に比べ短くすることができる。これにより、回路全体の部品レイアウトの制約を小さくするとともに、回路素子９の実装密度を向上することができる。   In the series circuit device 2A of the present embodiment shown in FIG. 1B, the input terminals In and the output terminals Out of the plurality of circuit elements 9 are arranged in the same direction, and the plurality of circuit elements 9 are arranged. Are arranged in a direction orthogonal to the direction connecting the input terminal In and the output terminal Out of the circuit element 9, so that the terminal portions 9a, 9a of the circuit elements 9, 9 arranged adjacent to each other in the orthogonal direction are arranged. The potential difference between them can be minimized. Therefore, the creepage distance d1 between the circuit elements 9 and 9 can be shortened as compared with the prior art while ensuring the creepage distance required between the terminals of the circuit element 9. As a result, it is possible to reduce the restrictions on the component layout of the entire circuit and improve the mounting density of the circuit elements 9.

また、特に回路素子９を、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向（図中の左右方向）に対して直交する方向（図中の上下方向）に一列に並べ、同一軸上に配列しているので、直列回路１０の実装長さを短くし、沿面距離を確保しながらも回路全体の部品レイアウトの制約をより小さくするとともに、回路素子９の実装密度をより向上することができる。   In particular, the circuit elements 9 are arranged in a line in the direction (vertical direction in the figure) perpendicular to the direction connecting the input terminal In and the output terminal Out (horizontal direction in the figure) and arranged on the same axis. Therefore, it is possible to reduce the mounting length of the series circuit 10 and to reduce the restriction on the component layout of the entire circuit while securing the creeping distance, and to further improve the mounting density of the circuit elements 9.

なお、前記第１実施形態では複数（３つ）の回路素子９を、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向（図中の左右方向）に対して直交する方向（図中の上下方向）に一直線状に並べ、配置しているが、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して交差する方向に並べて配置すれば、直交していなくても、また、一直線状に配置しなくてもよい。   In the first embodiment, a plurality (three) of circuit elements 9 are orthogonal to the direction connecting the input terminal In and the output terminal Out (the horizontal direction in the figure) (the vertical direction in the figure). However, if they are arranged in a direction that intersects the direction connecting the input terminal In and the output terminal Out, they may not be orthogonal and may not be arranged in a straight line. May be.

図２（ａ）〜（ｃ）は、いずれも第１実施形態の変形例を示す図であり、図２（ａ）は複数（３つ）の回路素子９のうち、真ん中の回路素子９を図中の右方向にずらして配置している。なお、真ん中の回路素子９を図中の左方向にずらして配置してもよい。このような例は、特に部品（回路素子９）の一つが他に比べて大きく、実装面積が大きくなるような場合に回路全体の部品レイアウトの制約を小さくすることができる。このように回路素子９を並べて配置した場合、図中の右方向にずらした回路素子９の入力端子Ｉｎと、負側接点４ａに最も近い回路素子９の出力端子Ｏｕｔとの間の電位差を考慮して、沿面距離が図１（ｂ）に示した直列回路１０の各回路素子９、９間の沿面距離よりも長くなる。しかし、図中の右方向にずらした回路素子９の入力端子Ｉｎが、正側配線に最も近い回路素子９の入力端子Iｎに対して、図中の右方向にずれているため、沿面距離が図１（ｂ）に示した直列回路１０の各回路素子９、９間の沿面距離よりも長くなっている。したがって、図中の右方向にずらした回路素子９と正側配線に最も近い回路素子９は、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して交差する方向に、より近接して配置することができる。なお、真ん中の回路素子９を図中の左方向にずらした場合は、図中の左方向にずらした回路素子９の出力端子Ｏｕｔと、正側配線３に最も近い回路素子９の入力端子Ｉｎとの間の電位差を考慮して、沿面距離が図１（ｂ）に示した直列回路装置２Ａの各回路素子９、９間の沿面距離よりも長くなる。しかし、図中の左方向にずらした回路素子９の入力端子Ｉｎが、負側配線に最も近い回路素子９の入力端子Ｉｎに対して、図中の左方向にずれているため、沿面距離が図１（ｂ）に示した直列回路１０の各回路素子９、９間の沿面距離よりも長くなっている。したがって、図中の左方向にずらした回路素子９と負側配線に最も近い回路素子９は、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して交差する方向に、より近接して配置することができる。したがって、直列回路装置２Ｂは、実装長さを図1（ｃ）に示した従来の直列回路よりも短くすることができ、沿面距離を確保しながらも回路素子９の実装密度を向上させることができる。加えて、このような配置は、基板７上に実装された図示しない他の回路素子を、直列回路装置２Ｂの領域に実装しなければならない場合にも、柔軟に対応することができる。   FIGS. 2A to 2C are diagrams showing modifications of the first embodiment, and FIG. 2A shows a middle circuit element 9 among a plurality (three) of circuit elements 9. FIG. They are shifted to the right in the figure. It should be noted that the middle circuit element 9 may be shifted in the left direction in the figure. In such an example, especially when one of the components (circuit element 9) is larger than the other and the mounting area is large, the restriction on the component layout of the entire circuit can be reduced. When the circuit elements 9 are arranged side by side in this way, the potential difference between the input terminal In of the circuit element 9 shifted in the right direction in the drawing and the output terminal Out of the circuit element 9 closest to the negative contact 4a is taken into consideration. Thus, the creepage distance becomes longer than the creepage distance between the circuit elements 9 and 9 of the series circuit 10 shown in FIG. However, since the input terminal In of the circuit element 9 shifted to the right in the figure is shifted to the right in the figure with respect to the input terminal In of the circuit element 9 closest to the positive side wiring, the creeping distance is The creepage distance between the circuit elements 9 and 9 of the series circuit 10 shown in FIG. Therefore, the circuit element 9 shifted to the right in the drawing and the circuit element 9 closest to the positive wiring are arranged closer to each other in the direction intersecting the direction connecting the input terminal In and the output terminal Out. be able to. When the middle circuit element 9 is shifted in the left direction in the figure, the output terminal Out of the circuit element 9 shifted in the left direction in the figure and the input terminal In of the circuit element 9 closest to the positive side wiring 3 are shown. The creepage distance is longer than the creepage distance between the circuit elements 9 and 9 of the series circuit device 2A shown in FIG. However, since the input terminal In of the circuit element 9 shifted to the left in the figure is shifted to the left in the figure with respect to the input terminal In of the circuit element 9 closest to the negative wiring, the creeping distance is The creepage distance between the circuit elements 9 and 9 of the series circuit 10 shown in FIG. Therefore, the circuit element 9 shifted to the left in the drawing and the circuit element 9 closest to the negative wiring are arranged closer to each other in the direction intersecting the direction connecting the input terminal In and the output terminal Out. be able to. Accordingly, the mounting length of the series circuit device 2B can be made shorter than that of the conventional series circuit shown in FIG. 1C, and the mounting density of the circuit elements 9 can be improved while ensuring the creeping distance. it can. In addition, such an arrangement can flexibly cope with the case where other circuit elements (not shown) mounted on the substrate 7 must be mounted in the region of the series circuit device 2B.

図２（ｂ）は、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して、回路素子９を出力端子Ｏｕｔ側の方向に順次ずれるように斜め方向に交差した状態に並べて配置している。このような例は、特に部品（回路素子９）の一つが他に比べて大きく、実装面積が大きくなるような場合に回路全体の部品レイアウトの制約を小さくすることができる。このように回路素子９を並べて配置した場合、真ん中の回路素子９の入力端子Ｉｎが、正側配線に最も近い回路素子９の入力端子Ｉｎに対して、図中の右方向にずれているため、沿面距離が図１（ｂ）に示した直列回路１０の各回路素子９、９間の沿面距離よりも長くなっている。したがって、正側配線に最も近い回路素子９と、真ん中の回路素子９は、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して交差する方向に、より近接して配置することができる。同じように、負側配線に最も回路素子９の入力端子Ｉｎが、真ん中の回路素子９の入力端子Ｉｎに対して、図中の右方向にずれているため、沿面距離が図１（ｂ）に示した直列回路１０の各回路素子９、９間の沿面距離よりも長くなっている。したがって、真ん中の回路素子９と、負側接点に最も近い回路素子９は、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して交差する方向に、より近接して配置することができる。そのため、回路素子９、９間の沿面距離は図1（ｂ）に示した直列回路装置２Ａの各回路素子９、９間の沿面距離よりも短くなる。したがって、沿面距離を確保しながらも回路素子９の実装密度を向上させることができる。加えて、このような配置は、基板７上に実装された図示しない他の回路素子を、直列回路装置２Ｃの領域に実装しなければならない場合にも、柔軟に対応することができる。   In FIG. 2B, the circuit elements 9 are arranged side by side in an oblique direction so as to be sequentially shifted in the direction toward the output terminal Out with respect to the direction connecting the input terminal In and the output terminal Out. In such an example, especially when one of the components (circuit element 9) is larger than the other and the mounting area is large, the restriction on the component layout of the entire circuit can be reduced. When the circuit elements 9 are arranged side by side in this way, the input terminal In of the middle circuit element 9 is shifted in the right direction in the figure with respect to the input terminal In of the circuit element 9 closest to the positive side wiring. The creepage distance is longer than the creepage distance between the circuit elements 9 and 9 of the series circuit 10 shown in FIG. Therefore, the circuit element 9 closest to the positive wiring and the middle circuit element 9 can be arranged closer to each other in the direction intersecting the direction connecting the input terminal In and the output terminal Out. Similarly, since the input terminal In of the circuit element 9 is shifted to the right in the figure with respect to the input terminal In of the middle circuit element 9 in the negative side wiring, the creepage distance is as shown in FIG. The creepage distance between the circuit elements 9 and 9 of the series circuit 10 shown in FIG. Therefore, the middle circuit element 9 and the circuit element 9 closest to the negative contact can be arranged closer to each other in the direction intersecting the direction connecting the input terminal In and the output terminal Out. Therefore, the creepage distance between the circuit elements 9 and 9 is shorter than the creepage distance between the circuit elements 9 and 9 of the series circuit device 2A shown in FIG. Therefore, the mounting density of the circuit elements 9 can be improved while ensuring the creepage distance. In addition, such an arrangement can flexibly cope with the case where other circuit elements (not shown) mounted on the substrate 7 must be mounted in the region of the series circuit device 2C.

図２（ｃ）は、複数（３つ）の回路素子９のうち、負側接点４ａに最も近い回路素子９を出力端子Ｏｕｔ側の方向（図中の右方向）にずらして配置している。なお、正側接点３ａに最も近い回路素子９を入力端子Ｉｎ側の方向（図中の右方向）にずらして配置してもよい。また、回路素子９を図中の左方向にずらして配置してもよい。このような例は、特に部品（回路素子９）の一つが他に比べて大きく、実装面積が大きくなるような場合に回路全体の部品レイアウトの制約を小さくすることができる。このように回路素子９を並べて配置した場合、隣り合う回路素子９、９の端子部９ａ、９ａ間の電位差は、図１（ｂ）に示した直列回路装置２Ａと同様に１００Ｖになるので、隣り合う回路素子９、９間の沿面距離を図１（ｂ）と同様にすることができ、特に、負側接点４ａに最も近い回路素子９の入力端子Ｉｎと、隣り合う回路素子９の出力端子Ｏｕｔとの間の電位差は０Ｖとなり、沿面距離を任意にすることができる。なお、正側接点３ａに最も近い回路素子９を入力端子Ｉｎ側の方向（図中の左方向）にずらした場合は、正側接点３ａに最も近い回路素子９の出力端子Ｏｕｔと、隣り合う回路素子９の入力端子Ｉｎとの間の電位差は０Ｖとなり、沿面距離を任意にすることができる。したがって、沿面距離を確保しながらも回路素子９の実装密度を向上させることができる。加えて、このような配置は、図示しない基板７上に実装された他の回路素子を、直列回路装置２Ｄの領域に実装しなければならない場合にも、柔軟に対応することができる。   In FIG. 2C, among the plurality (three) of circuit elements 9, the circuit element 9 closest to the negative contact 4a is shifted in the direction toward the output terminal Out side (right direction in the figure). . Note that the circuit element 9 closest to the positive contact 3a may be shifted in the direction toward the input terminal In (the right direction in the figure). Further, the circuit element 9 may be arranged shifted in the left direction in the figure. In such an example, especially when one of the components (circuit element 9) is larger than the other and the mounting area is large, the restriction on the component layout of the entire circuit can be reduced. When the circuit elements 9 are arranged side by side in this way, the potential difference between the terminal portions 9a and 9a of the adjacent circuit elements 9 and 9 is 100 V as in the series circuit device 2A shown in FIG. The creeping distance between the adjacent circuit elements 9 and 9 can be made the same as in FIG. 1B, and in particular, the input terminal In of the circuit element 9 closest to the negative contact 4a and the output of the adjacent circuit element 9 The potential difference with the terminal Out becomes 0 V, and the creeping distance can be made arbitrary. When the circuit element 9 closest to the positive contact 3a is shifted in the direction toward the input terminal In (left direction in the figure), it is adjacent to the output terminal Out of the circuit element 9 closest to the positive contact 3a. The potential difference between the input terminal In of the circuit element 9 is 0 V, and the creeping distance can be made arbitrary. Therefore, the mounting density of the circuit elements 9 can be improved while ensuring the creepage distance. In addition, such an arrangement can flexibly cope with a case where other circuit elements mounted on the substrate 7 (not shown) must be mounted in the region of the series circuit device 2D.

図３（ａ）は、本発明の直列回路装置の第２実施形態を示す図である。この第２実施形態の直列回路装置２Ｅが図１（ｂ）に示した第１実施形態の直列回路装置２Ａと主に異なるところは、図３（ａ）に示した直列回路装置２Ｅでは直列回路を二つ（複数）備えている点である。   Fig.3 (a) is a figure which shows 2nd Embodiment of the series circuit apparatus of this invention. The series circuit device 2E according to the second embodiment is different from the series circuit device 2A according to the first embodiment shown in FIG. 1B in that the series circuit device 2E shown in FIG. It is a point provided with two (plural).

すなわち、この直列回路装置２Ｅでは、正側接点３ａと負側接点４ａとの間に設けられた配線パターン８が、正側接点３ａ側にて２本に分岐され、これら２本が負側接点４ａ側にて１本に結合されている。そして、分岐された配線パターン８の一方（図３（ａ）中左側）に直列回路１０ａが設けられ、他方（図３（ａ）中右側）に直列回路１０ｂが設けられている。つまり、配線パターン８に２つの直列回路１０ａ、１０ｂが設けられている。   That is, in this series circuit device 2E, the wiring pattern 8 provided between the positive contact 3a and the negative contact 4a is branched into two on the positive contact 3a side, and these two are the negative contacts. It is combined into one on the 4a side. A series circuit 10a is provided on one side (left side in FIG. 3A) of the branched wiring pattern 8, and a series circuit 10b is provided on the other side (right side in FIG. 3A). That is, two series circuits 10 a and 10 b are provided in the wiring pattern 8.

これら二つの直列回路１０ａ、１０ｂは、第１実施形態と同様に、いずれも回路素子９の入力端子Ｉｎ及び出力端子Ｏｕｔをそれぞれ同じ向きに揃えて配置しており、また、回路素子９を、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向（図中の左右方向）に対して直交する方向（図中の上下方向）に一列に並べ、配置している。すなわち、本実施形態の直列回路１０は、これを構成する回路素子９どうしが順次隣り合うように、いずれも同一軸上に配列されている。   As in the first embodiment, these two series circuits 10a and 10b are both arranged with the input terminal In and the output terminal Out of the circuit element 9 aligned in the same direction. The input terminals In and the output terminals Out are arranged in a line in a direction (vertical direction in the figure) perpendicular to the direction connecting the input terminal In and the output terminal Out (horizontal direction in the figure). That is, the series circuit 10 of the present embodiment is arranged on the same axis so that the circuit elements 9 constituting the series circuit 10 are sequentially adjacent to each other.

また、これら二つの直列回路１０ａ、１０ｂは、各々同じ間隔で３つ（複数）の回路素子９が並べられ、かつ各々同じ特性の回路素子９が用いられて同じ直列接続がなされた同一構成に形成されており、互いに並列回路を形成している。そして、このように並列回路を構成する二つの直列回路１０ａ、１０ｂは、一方の直列回路１０ａを構成する３つの回路素子９が、他方の直列回路１０ｂを構成する３つの回路素子９に対して、各々入力端子Ｉｎと出力端子Ｏｕｔの向きを反転させている。本実施形態では、二つの直列回路１０ａ、１０ｂを構成する全ての回路素子９が、内側に出力端子Ｏｕｔを配置し、外側に入力端子Ｉｎを配置している。   Further, these two series circuits 10a and 10b have the same configuration in which three (plural) circuit elements 9 are arranged at the same interval, and the same series connection is made by using the circuit elements 9 having the same characteristics. Formed to form a parallel circuit. The two series circuits 10a and 10b constituting the parallel circuit in this way have three circuit elements 9 constituting one series circuit 10a and three circuit elements 9 constituting the other series circuit 10b. The directions of the input terminal In and the output terminal Out are reversed. In the present embodiment, all the circuit elements 9 constituting the two series circuits 10a and 10b have the output terminal Out disposed inside and the input terminal In disposed outside.

このような構成の直列回路装置２Ｅにあっても、同じ直列回路１０ａ（１０ｂ）中の回路素子９間では、隣り合う回路素子９、９の端子部（図示せず）間の電位差が図１（ｂ）に示した直列回路装置２Ａと同様に１００Ｖになるので、同じ直列回路１０ａ（１０ｂ）中で隣り合う回路素子９、９間の沿面距離を、図１（ｂ）と同様にすることができる。また、異なる直列回路１０ａ、１０ｂ間において隣り合う回路素子９、９間では、互いに出力端子Ｏｕｔを向け合っているので、これら出力端子Ｏｕｔ間の電位差が０Ｖとなり、したがってこれら回路素子９、９間の沿面距離を任意にすることができる。すなわち、沿面距離を短くして直列回路１０ａ、１０ｂ同士を近接配置することができ、実装面積を低減することができる。これにより、回路全体の部品レイアウトの制約を小さくするとともに、回路素子９の実装密度を向上することができる。   Even in the serial circuit device 2E having such a configuration, the potential difference between the terminal portions (not shown) of the adjacent circuit elements 9 and 9 is different between the circuit elements 9 in the same series circuit 10a (10b). Since the voltage is 100 V as in the series circuit device 2A shown in (b), the creepage distance between adjacent circuit elements 9 and 9 in the same series circuit 10a (10b) should be the same as in FIG. 1 (b). Can do. Further, between the adjacent circuit elements 9 and 9 between the different series circuits 10a and 10b, since the output terminals Out are directed to each other, the potential difference between these output terminals Out becomes 0 V. Therefore, between these circuit elements 9 and 9 The creepage distance of can be made arbitrary. That is, the creeping distance can be shortened so that the series circuits 10a and 10b can be arranged close to each other, and the mounting area can be reduced. As a result, it is possible to reduce the restrictions on the component layout of the entire circuit and improve the mounting density of the circuit elements 9.

図３（ｂ）は、本発明の直列回路装置の第３実施形態を示す図である。この第３実施形態の直列回路装置２Ｆが図３（ａ）に示した第２実施形態の直列回路装置２Ｅと主に異なるところは、図３（ｂ）に示した直列回路装置２Ｆでは二つの直列回路１０ｃ、１０ｄ、すなわち図３（ｂ）中左側に配置された直列回路１０ｃと、図３（ｂ）中右側に配置された直列回路１０ｄとを構成する回路素子９を、一段ずつずらして配置している点である。   FIG.3 (b) is a figure which shows 3rd Embodiment of the series circuit apparatus of this invention. The series circuit device 2F of the third embodiment is mainly different from the series circuit device 2E of the second embodiment shown in FIG. 3A in that there are two series circuit devices 2F shown in FIG. The circuit elements 9 constituting the series circuits 10c and 10d, that is, the series circuit 10c arranged on the left side in FIG. 3B and the series circuit 10d arranged on the right side in FIG. It is a point that is arranged.

この直列回路装置２Ｆでは、第２実施形態と同様に、配線パターン８が正側接点３ａと負側接点４ａとの間で２本に分岐され、これら分岐された配線パターン８のそれぞれに、直列回路１０ｃ、１０ｄが設けられている。
これら二つの直列回路１０ｃ、１０ｄは、第２実施形態と同様に、いずれも回路素子９の入力端子Ｉｎ及び出力端子Ｏｕｔをそれぞれ同じ向きに揃えて配置しており、また、回路素子９を、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向（図中の左右方向）に対して直交する方向（図中の上下方向）に一列に並べ、配置している。すなわち、本実施形態の直列回路１０は、これを構成する回路素子９どうしが順次隣り合うように、いずれも同一軸上に配列されている。 In this series circuit device 2F, as in the second embodiment, the wiring pattern 8 is branched into two between the positive contact 3a and the negative contact 4a, and each of the branched wiring patterns 8 is connected in series. Circuits 10c and 10d are provided.
In the two series circuits 10c and 10d, as in the second embodiment, both the input terminal In and the output terminal Out of the circuit element 9 are arranged in the same direction, and the circuit element 9 is The input terminals In and the output terminals Out are arranged in a line in a direction (vertical direction in the figure) perpendicular to the direction connecting the input terminal In and the output terminal Out (horizontal direction in the figure). That is, the series circuit 10 of the present embodiment is arranged on the same axis so that the circuit elements 9 constituting the series circuit 10 are sequentially adjacent to each other.

また、これら二つの直列回路１０ｃ、１０ｄは、各々同じ間隔で３つ（複数）の回路素子９が並べられ、かつ各々同じ特性の回路素子９が用いられて同じ直列接続がなされている。ただし、これら二つの直列回路１０ｃ、１０ｄは、第２実施形態と異なり、直列回路１０ｃ、１０ｄ間で入力端子Ｉｎ及び出力端子Ｏｕｔの向きを反転させることなく、全ての回路素子９が全て同じ方向に向くように配置されている。本実施形態では、図中の左方向に入力端子Ｉｎが向き、図中の右方向に出力端子Ｏｕｔが向くように、全ての回路素子９が配置されている。   In addition, these two series circuits 10c and 10d have three (a plurality of) circuit elements 9 arranged at the same interval and are connected in series by using the circuit elements 9 having the same characteristics. However, these two series circuits 10c and 10d differ from the second embodiment in that all the circuit elements 9 are all in the same direction without inverting the direction of the input terminal In and the output terminal Out between the series circuits 10c and 10d. It is arranged to face. In the present embodiment, all the circuit elements 9 are arranged so that the input terminal In faces in the left direction in the figure and the output terminal Out faces in the right direction in the figure.

そして、本実施形態では図中右側の直列回路１０ｄの回路素子９の並びに対し、図中左側の直列回路１０ｃの回路素子９の並びが、一段ずつずれて配置されている。すなわち、図中左側の直列回路１０ｃにおける、正側接点３ａから１番目の回路素子９は、図中右側の直列回路１０ｄにおける、正側接点３ａから２番目の回路素子９に隣り合うように配置され、図中左側の直列回路１０ｃおける、正側接点３ａから２番目の回路素子９は、図中右側の直列回路１０ｄにおける、正側接点３ａから３番目の回路素子９に隣り合うように配置されている。また、図中右側の直列回路１０ｄにおける、正側接点から１番目の回路素子９は、正側接点３ａ側に偏って配置され、逆に図中左側の直列回路１０ｃにおける、正側接点から３番目の回路素子９は、負側接点４ａ側に偏って配置されている。   In the present embodiment, the arrangement of the circuit elements 9 of the series circuit 10c on the left side of the drawing is shifted by one stage from the arrangement of the circuit elements 9 of the series circuit 10d on the right side of the drawing. That is, the first circuit element 9 from the positive side contact 3a in the series circuit 10c on the left side in the drawing is arranged adjacent to the second circuit element 9 from the positive side contact 3a in the series circuit 10d on the right side in the drawing. The second circuit element 9 from the positive side contact 3a in the series circuit 10c on the left side in the figure is arranged so as to be adjacent to the third circuit element 9 from the positive side contact 3a in the series circuit 10d on the right side in the figure. Has been. In the series circuit 10d on the right side in the figure, the first circuit element 9 from the positive side contact is arranged to be biased toward the positive side contact 3a, and conversely, 3 from the positive side contact in the series circuit 10c on the left side in the figure. The second circuit element 9 is biased to the negative contact 4a side.

すなわち、これら二つの直列回路１０ｃ、１０ｄは、図中左側の直列回路１０ｃを、図中右側の直列回路１０ｄに対して、直列回路１０ｃ、１０ｄを構成する回路素子９の入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して直交（交差）する方向において隣り合う回路素子９、９間の距離と同じ分だけ、負側接点４ａの側に離して配置している。   That is, the two series circuits 10c and 10d are configured so that the left side series circuit 10c is different from the right side series circuit 10d in the figure with respect to the input terminal In and the output terminal of the circuit element 9 constituting the series circuits 10c and 10d. They are arranged on the negative contact 4a side by the same distance as the distance between adjacent circuit elements 9, 9 in the direction orthogonal (crossing) to the direction connecting Out.

このような構成の直列回路装置２Ｆにあっても、同じ直列回路１０ｃ（１０ｄ）中の回路素子９間では、隣り合う回路素子９、９の端子部（図示せず）間の電位差が図１（ｂ）に示した直列回路装置２Ａと同様に１００Ｖになるので、同じ直列回路１０ｃ（１０ｄ）中で隣り合う回路素子９、９間の沿面距離を、図１（ｂ）と同様にすることができる。また、異なる直列回路１０ｃ、１０ｄ間において隣り合う回路素子９、９間でも端子間の電位差が０Ｖとなり、したがってこれら回路素子９、９間の沿面距離を任意にすることができる。すなわち、沿面距離を短くして直列回路１０ｃ、１０ｄ同士を近接配置することができ、実装面積を低減することができる。これにより、回路全体の部品レイアウトの制約を小さくするとともに、回路素子９の実装密度を向上することができる。   Even in the series circuit device 2F having such a configuration, between the circuit elements 9 in the same series circuit 10c (10d), the potential difference between the terminal portions (not shown) of the adjacent circuit elements 9 and 9 is as shown in FIG. Since the voltage is 100 V as in the series circuit device 2A shown in (b), the creepage distance between the adjacent circuit elements 9 and 9 in the same series circuit 10c (10d) should be the same as in FIG. 1 (b). Can do. Further, the potential difference between the terminals is also 0V between the adjacent circuit elements 9 and 9 between the different series circuits 10c and 10d. Therefore, the creeping distance between these circuit elements 9 and 9 can be made arbitrary. That is, the creeping distance can be shortened so that the series circuits 10c and 10d can be arranged close to each other, and the mounting area can be reduced. As a result, it is possible to reduce the restrictions on the component layout of the entire circuit and improve the mounting density of the circuit elements 9.

なお、前記第２実施形態、第３実施形態では、各直列回路１０における複数（３つ）の回路素子９を、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向（図中の左右方向）に対して直交する方向（図中の上下方向）に一直線状に並べ、配置しているが、第１実施形態の場合と同様に、入力端子Ｉｎと出力端子Ｏｕｔとを結ぶ方向に対して交差する方向に並べて配置すれば、直交していなくても、また、一直線状に配置しなくてもよい。すなわち、図２（ａ）〜（ｃ）に示したような配置で、各直列回路１０ａ、１０ｂ、１０ｃ、１０ｄを構成してもよい。そのように構成した場合、基板７上に実装された図示しない他の回路素子を、直列回路装置２Ｅ、２Ｆの領域に実装しなければならない場合にも、柔軟に対応することができる。   In the second embodiment and the third embodiment, a plurality (three) of circuit elements 9 in each series circuit 10 are connected to the direction connecting the input terminal In and the output terminal Out (the horizontal direction in the figure). In the same manner as in the first embodiment, the direction intersecting with the direction connecting the input terminal In and the output terminal Out is arranged. If they are arranged side by side, they do not have to be orthogonal, and may not be arranged in a straight line. That is, the series circuits 10a, 10b, 10c, and 10d may be configured in an arrangement as shown in FIGS. In such a configuration, even when other circuit elements (not shown) mounted on the substrate 7 have to be mounted in the region of the series circuit devices 2E and 2F, it is possible to flexibly cope with it.

また、前記実施形態では、本発明に係る直列回路装置２Ａ〜２Ｆ、すなわち正側接点３ａ及び負側接点４ａと、配線パターン８、回路素子９を、全て一つの基板の一方の面（表面）に形成配置した例について説明したが、本発明はこれに限定されることなく、単層基板の表裏面に各構成要素を形成してもよく、積層基板（多層基板）を用いて各層（各基板）に各構成要素を形成してもよい。   Moreover, in the said embodiment, the series circuit apparatus 2A-2F which concerns on this invention, ie, the positive side contact 3a and the negative side contact 4a, the wiring pattern 8, and the circuit element 9, all on one side (surface) of one board | substrate. However, the present invention is not limited to this, and each component may be formed on the front and back surfaces of a single layer substrate, and each layer (each layer) may be formed using a multilayer substrate (multilayer substrate). Each component may be formed on a substrate.

図４（ａ）は、第１実施形態の直列回路装置の変形例を示す模式図であり、図４（ａ）中符号２Ｇは直列回路装置である。この直列回路装置２Ｇが図１（ｂ）に示した直列回路装置２Ａと異なるところは、配線パターン８の一部を、基板７の裏面に形成した点にある。   Fig.4 (a) is a schematic diagram which shows the modification of the series circuit device of 1st Embodiment, and the code | symbol 2G in FIG.4 (a) is a series circuit device. This series circuit device 2G is different from the series circuit device 2A shown in FIG. 1B in that a part of the wiring pattern 8 is formed on the back surface of the substrate 7.

すなわち、この直列回路装置２Ｇでは、正側接点３ａから１番目の回路素子９の出力端子Ｏｕｔ側のパッドにスルーホール１２を形成し、同様に正側接点３ａから２番目の回路素子９の入力端子Ｉｎ側のパッド、正側接点３ａから２番目の回路素子９の出力端子Ｏｕｔ側のパッド、正側接点３ａから３番目の回路素子９の入力端子Ｉｎ側のパッドにそれぞれスルーホール１２を形成している。   That is, in this series circuit device 2G, the through-hole 12 is formed in the pad on the output terminal Out side of the first circuit element 9 from the positive contact 3a, and similarly the input of the second circuit element 9 from the positive contact 3a. Through-holes 12 are formed in the pad on the terminal In side, the pad on the output terminal Out side of the second circuit element 9 from the positive contact 3a, and the pad on the input terminal In side of the third circuit element 9 from the positive contact 3a. doing.

そして、図４（ａ）中に破線で示すように、１番目の回路素子９の出力端子Ｏｕｔ側のスルーホール１２から２番目の回路素子９の入力端子Ｉｎ側のスルーホール１２、及び２番目の回路素子９の出力端子Ｏｕｔ側のスルーホール１２から３番目の回路素子９の入力端子Ｉｎ側のスルーホール１２までを接続する配線パターン８を、それぞれ基板７の裏面に形成する。   4A, the through hole 12 on the input terminal In side of the second circuit element 9 from the through hole 12 on the output terminal Out side of the first circuit element 9, and the second A wiring pattern 8 is formed on the back surface of the substrate 7 to connect the through hole 12 on the output terminal Out side of the circuit element 9 to the through hole 12 on the input terminal In side of the third circuit element 9.

このように配線パターン８の一部を基板７の裏面側に這わすことにより、回路全体の部品レイアウトの制約を小さくするとともに、回路素子９の実装密度を向上することができる。更に、回路素子９と配線パターン８との電位差による沿面距離の確保が容易となり、パターン設計が容易になるという効果を得ることができる。
なお、スルーホール１２については、パッドに形成するのに代えて、配線パターン８の途中、例えば隣り合う回路素子９、９間を接続する配線パターン８の中間点に形成してもよい。 As described above, by partially displacing the wiring pattern 8 toward the back side of the substrate 7, it is possible to reduce the restrictions on the component layout of the entire circuit and improve the mounting density of the circuit elements 9. Further, it is easy to secure a creepage distance due to a potential difference between the circuit element 9 and the wiring pattern 8, and an effect that the pattern design becomes easy can be obtained.
Note that the through hole 12 may be formed in the middle of the wiring pattern 8, for example, at the midpoint of the wiring pattern 8 that connects between the adjacent circuit elements 9, instead of being formed in the pad.

図４（ｂ）も、第１実施形態の直列回路装置の変形例を示す模式図であり、図４（ｂ）中符号２Ｈは直列回路装置である。この直列回路装置２Ｈが図１（ｂ）に示した直列回路装置２Ａと主に異なるところは、回路素子９の一部、本例では３つ並べた回路素子９中の真ん中の回路素子９を、基板７の裏面に配置した点である。   FIG. 4B is also a schematic diagram showing a modification of the series circuit device of the first embodiment, and reference numeral 2H in FIG. 4B is a series circuit device. This series circuit device 2H is mainly different from the series circuit device 2A shown in FIG. 1B in that a part of the circuit element 9, that is, the middle circuit element 9 in the circuit element 9 arranged in this example is arranged. This is a point arranged on the back surface of the substrate 7.

すなわち、この直列回路装置２Ｈでは、正側接点３ａから２番目の回路素子９の入力端子Ｉｎ側のパッド１１と、正側接点３ａから３番目の回路素子９の入力端子Ｉｎ側のパッド１１とにそれぞれスルーホール１２を形成している。そして、図４（ｂ）中に破線で示すように、配線パターン８を、２番目の回路素子９の入力端子Ｉｎ側のスルーホール１２を介して基板７の裏面に配置した回路素子９に接続している。また、基板７の裏面にて２番目の回路素子９の出力端子Ｏｕｔに接続する配線パターン８を、スルーホール１２を介して基板７の表面に配置した３番目の回路素子９の入力端子Ｉｎに接続している。   That is, in this series circuit device 2H, the pad 11 on the input terminal In side of the second circuit element 9 from the positive contact 3a, and the pad 11 on the input terminal In side of the third circuit element 9 from the positive contact 3a Each of the through holes 12 is formed. 4B, the wiring pattern 8 is connected to the circuit element 9 disposed on the back surface of the substrate 7 through the through hole 12 on the input terminal In side of the second circuit element 9 as indicated by a broken line. doing. Further, the wiring pattern 8 connected to the output terminal Out of the second circuit element 9 on the back surface of the substrate 7 is connected to the input terminal In of the third circuit element 9 disposed on the surface of the substrate 7 through the through hole 12. Connected.

このように回路素子９の一部と配線パターン８の一部とを基板７の裏面側に配置することにより、回路全体の部品レイアウトの制約を小さくするとともに、回路素子９の実装密度を向上することができる。更に、回路素子９と配線パターン８との電位差による沿面距離の確保が容易となり、パターン設計が容易になるという効果を得ることができる。また、図４（ｂ）中では見易くするため、２番目（真ん中）の回路素子９を、平面視して他の回路素子９と重ならないように記載しているが、これらを一部あるいは全部、平面視して他の回路素子９（基板７の表面側の回路素子９）と重なるように配置してもよい。このように重ねて配置することにより、回路全体の部品レイアウトの制約を小さくするとともに、回路素子９の実装密度をより向上することができる。   Thus, by arranging a part of the circuit element 9 and a part of the wiring pattern 8 on the back surface side of the substrate 7, restrictions on the component layout of the entire circuit are reduced, and the mounting density of the circuit elements 9 is improved. be able to. Further, it is easy to secure a creepage distance due to a potential difference between the circuit element 9 and the wiring pattern 8, and an effect that the pattern design becomes easy can be obtained. 4B, the second (middle) circuit element 9 is described so as not to overlap with the other circuit elements 9 in plan view, but part or all of them are described. Alternatively, they may be arranged so as to overlap with other circuit elements 9 (circuit elements 9 on the surface side of the substrate 7) in plan view. By arranging in such a manner, it is possible to reduce the restrictions on the component layout of the entire circuit and further improve the mounting density of the circuit elements 9.

なお、図４（ｂ）では回路素子９を３つ配置しているが、回路素子９を４つ以上配置してもよく、その場合に、例えば回路素子９を基板７の表面側と裏面側に交互に配置することにより、実装密度のさらなる向上を図ることができる。
また、このように基板７の表裏面を用いたり、さらに積層基板（多層基板）を用いることにより、回路全体の部品レイアウトの制約をより小さくすることができる。 In FIG. 4B, three circuit elements 9 are arranged, but four or more circuit elements 9 may be arranged. In that case, for example, the circuit elements 9 are arranged on the front surface side and the back surface side of the substrate 7. By alternately disposing them, the mounting density can be further improved.
In addition, by using the front and back surfaces of the substrate 7 as described above, and further using a multilayer substrate (multilayer substrate), it is possible to further reduce the restrictions on the component layout of the entire circuit.

前記実施形態１〜３、及びその各々変形例として説明した直列回路装置２Ａ、２Ｂ、２Ｃ、２Ｄ, ２Ｅ、２Ｆ、２Ｇ、２Ｈは、正側配線３、負側配線４が接地電位部から絶縁された非接地回路に用いてもよい。これにより、例えば数百ボルトという大電圧がかかる非接地回路において、大電位差に耐え得る回路素子９を、沿面距離を確保しながらも実装長さを短く実装でき、回路全体の部品レイアウトの制約を小さくするとともに、回路素子９の実装密度を向上することができる。
さらに、本発明は前記実施形態に限定されることなく、本発明の主旨を逸脱しない範囲において種々の変更が可能である。 In the first to third embodiments and the series circuit devices 2A, 2B, 2C, 2D, 2E, 2F, 2G, and 2H described as modifications thereof, the positive wiring 3 and the negative wiring 4 are insulated from the ground potential portion. It may be used for a non-grounded circuit. As a result, in a non-grounded circuit where a large voltage of, for example, several hundred volts is applied, the circuit element 9 that can withstand a large potential difference can be mounted with a short mounting length while ensuring a creepage distance, which limits the component layout of the entire circuit. While being reduced, the mounting density of the circuit elements 9 can be improved.
Furthermore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

また、前記実施形態では本発明に係る直列回路装置を図１（ａ）に示した回路に適用した場合について説明したが、これ以外の種々の回路にも適用可能である。
また、回路素子９として抵抗素子を用いたが、他に例えば、コンデンサやインダクタを用いることもできる。 Moreover, although the said embodiment demonstrated the case where the series circuit apparatus based on this invention was applied to the circuit shown to Fig.1 (a), it is applicable also to various other circuits.
In addition, although the resistance element is used as the circuit element 9, for example, a capacitor or an inductor can be used.

１…直流電源、２、２Ａ、２Ｂ、２Ｃ、２Ｄ、２Ｅ、２Ｆ、２Ｇ、２Ｈ…直列回路装置、３…正側配線、３ａ…正側接点、４…負側配線、４ａ…負側接点、７…基板、８…配線パターン、９…回路素子、９ａ…端子部（端子）、１０、１０ａ、１０ｂ、１０ｃ、１０ｄ…直列回路、１１…パッド、１２…スルーホール、Ｉｎ…入力端子、Ｏｕｔ…出力端子 DESCRIPTION OF SYMBOLS 1 ... DC power source, 2, 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H ... Series circuit device, 3 ... Positive side wiring, 3a ... Positive side contact, 4 ... Negative side wiring, 4a ... Negative side contact , 7, substrate, 8, wiring pattern, 9, circuit element, 9 a, terminal portion (terminal), 10, 10 a, 10 b, 10 c, 10 d, series circuit, 11, pad, 12, through-hole, In, input terminal, Out ... Output terminal

Claims (4)

直流電源の正極に接続された正側配線に接続する正側接点、及び前記直流電源の負極に接続された負側配線に接続する負側接点と、これら前記正側接点と前記負側接点との間に形成された配線パターンと、複数の大電位差に耐えうる抵抗素子と、を有し、前記複数の抵抗素子が前記配線パターンにより互いに直列接続して構成される少なくとも一つの直列回路を備え、前記正側配線及び負側配線が非接地回路である直列回路装置において、
前記直列回路は、前記複数の抵抗素子の入力端子及び出力端子をそれぞれ同じ向きに揃えて配置し、
前記複数の抵抗素子を、該抵抗素子の入力端子と出力端子とを結ぶ方向に対して交差する方向に並べ、
前記抵抗素子は、該抵抗素子の入力端子と出力端子とを結ぶ方向に対して交差する方向において隣り合う抵抗素子の端子と同電位となる端子を有する
ことを特徴とする直列回路装置。 A positive contact connected to the positive wiring connected to the positive electrode of the DC power supply, a negative contact connected to the negative wiring connected to the negative electrode of the DC power supply, the positive contact and the negative contact, A wiring pattern formed between and a plurality of resistive elements capable of withstanding a large potential difference, and the plurality of resistive elements are connected in series with each other by the wiring pattern. In the series circuit device in which the positive wiring and the negative wiring are non-grounded circuits ,
In the series circuit, the input terminals and the output terminals of the plurality of resistance elements are arranged in the same direction.
Said plurality of resistance elements, parallel in a direction intersecting the direction connecting the input terminal and the output terminal of the resistor element,
The series circuit device , wherein the resistance element has a terminal having the same potential as a terminal of the resistance element adjacent in a direction intersecting a direction connecting the input terminal and the output terminal of the resistance element . 前記直列回路は、該直列回路を構成する抵抗素子どうしが隣り合うように同一軸上に配列していることを特徴とする請求項１記載の直列回路装置。 2. The series circuit device according to claim 1, wherein the series circuit is arranged on the same axis so that the resistance elements constituting the series circuit are adjacent to each other. 前記配線パターンが前記正側接点側にて分岐され、かつ、前記負側接点側にて結合されてなり、
これら分岐された配線パターンにより前記直列回路が複数設けられ、
前記複数の直列回路のうちの隣り合う二つの直列回路は、各々同じ間隔で複数の抵抗素子が並べられ、かつ各々同じ特性の抵抗素子が用いられて同じ直列接続がなされた同一構成の直列回路が互いに並列回路を形成してなり、
前記並列回路を構成する二つの直列回路は、一方の直列回路を構成する複数の抵抗素子が、他方の直列回路を構成する複数の抵抗素子に対して、各々入力端子と出力端子の向きを反転させていることを特徴とする請求項１又は２に記載の直列回路装置。 The wiring pattern is branched on the positive contact side and coupled on the negative contact side;
A plurality of the series circuits are provided by these branched wiring patterns,
Two adjacent series circuits of the plurality of series circuits have the same configuration in which a plurality of resistance elements are arranged at the same interval, and the resistance elements having the same characteristics are used to make the same series connection. Form a parallel circuit with each other,
In the two series circuits constituting the parallel circuit, the plurality of resistance elements constituting one series circuit invert the directions of the input terminal and the output terminal with respect to the plurality of resistance elements constituting the other series circuit. The series circuit device according to claim 1, wherein the series circuit device is provided. 前記配線パターンが前記正側接点側にて分岐され、かつ、前記負側接点側にて結合されてなり、
これら分岐された配線パターンにより前記直列回路が複数設けられ、
前記複数の直列回路のうちの隣り合う二つの直列回路は、各々同じ間隔で複数の抵抗素子が並べられ、かつ各々同じ特性の抵抗素子が用いられて同じ直列接続がなされた同一構成の直列回路が互いに並列回路を形成してなり、
前記並列回路を構成する二つの直列回路は、一方の直列回路の、前記配線パターンによって前記正側接点に最も近く接続されている抵抗素子を、他方の直列回路の、前記配線パターンによって前記正側接点に最も近く接続されている抵抗素子に対して、該抵抗素子の入力端子と出力端子とを結ぶ方向に対して交差する方向において隣り合う抵抗素子間の距離に対応する分だけ、前記負側接点の側に離して配置していることを特徴とする請求項１又は２に記載の直列回路装置。 The wiring pattern is branched on the positive contact side and coupled on the negative contact side;
A plurality of the series circuits are provided by these branched wiring patterns,
Two adjacent series circuits of the plurality of series circuits have the same configuration in which a plurality of resistance elements are arranged at the same interval, and the resistance elements having the same characteristics are used to make the same series connection. Form a parallel circuit with each other,
The two series circuits constituting the parallel circuit include a resistance element that is connected closest to the positive side contact by the wiring pattern of one series circuit, and the positive side by the wiring pattern of the other series circuit. to the resistance element which is connected closest to the contact point, by an amount corresponding to the distance between the resistance elements adjacent to each other in a direction intersecting the direction connecting the input and output terminals of the resistor element, the negative side The series circuit device according to claim 1, wherein the series circuit device is arranged apart from the contact side.
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