JP2018073878A - Board, and noise filter structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board capable of suppressing increase in size, and to provide a noise filter structure.SOLUTION: A board 1 to which a noise filter structure 100 is applied includes a multilayer board body 3 where multiple circuit bodies 33 constituting circuit systems different from each other are provided while being laminated via an isolating layer 32, and a magnetic substance 4 enclosing the outside of the multiple circuit bodies 33 collectively. With such an arrangement, the board 1 and the noise filter structure 100 can reduce noise of the multiple circuit bodies 33 collectively by the magnetic substance 4, and have an effect of suppressing increase in size while ensuring proper noise reduction performance.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate and a noise filter structure.

  As a technique related to a conventional substrate, for example, Patent Document 1 discloses a coil component configured by providing a laminated body between first and second magnetic substrates. The laminate is formed by stacking a first insulating layer, a primary coil, an inter-coil insulating layer, a secondary coil, a second insulating layer, and the like. The first and second magnetic substrates are configured such that a low dielectric constant layer is sandwiched between two magnetic layers. With this configuration, in the coil component, part of the electric lines of force generated around each coil pass through the inside of the low dielectric constant layer, and the stray capacitance of each coil is reduced.

JP 2010-062386

  By the way, there is a conventional substrate to which, for example, a noise reduction component is added, but in recent years, the number of circuits that are required to reduce noise is relatively increased, so that the entire substrate becomes relatively large. There is room for further improvement in this regard.

  This invention is made | formed in view of said situation, Comprising: It aims at providing the board | substrate which can suppress an enlargement, and a noise filter structure.

  In order to achieve the above object, a substrate according to the present invention includes a multilayer substrate body in which a plurality of circuit bodies constituting mutually different circuit systems are provided via an insulating layer, and an outer side of the plurality of circuit bodies. And a magnetic body that collectively surrounds the extending direction of the circuit body.

  In the above substrate, the multilayer substrate body may have a through-hole penetrating along the stacking direction of the plurality of circuit bodies and through which the magnetic body is inserted.

  In the substrate, the magnetic body may be formed in an annular shape that collectively surrounds the outside of the plurality of circuit bodies around the extending direction of the circuit bodies by combining a plurality of divided bodies. it can.

  In the substrate, the plurality of circuit bodies may include a power transmission power pattern and a ground GND pattern.

  In the substrate, the plurality of circuit bodies may further include signal lines for signal communication.

  In order to achieve the above object, a noise filter structure according to the present invention includes a multilayer substrate body in which a plurality of circuit bodies constituting mutually different circuit systems are stacked via an insulating layer. A through hole provided penetrating along the stacking direction, and a magnet that is assembled to the multilayer substrate body via the through hole and collectively surrounds the outside of the plurality of circuit bodies around the extending direction of the circuit body And a body.

  The substrate and the noise filter structure according to the present invention are provided by laminating an insulating layer on a multilayer substrate body, and collectively surround the outside of a plurality of circuit bodies constituting different circuit systems with a magnetic material. With this configuration, the substrate and the noise filter structure can reduce the noise of the plurality of circuit bodies in a lump by the magnetic body, so that an increase in size can be suppressed.

FIG. 1 is a partial cross-sectional view illustrating a schematic configuration of a substrate according to the embodiment. FIG. 2 is a partial cross-sectional view illustrating a schematic configuration of the substrate according to the embodiment. FIG. 3 is a schematic plan view illustrating a schematic configuration of the substrate according to the embodiment. FIG. 4 is a schematic diagram for explaining the interlayer capacitance in the substrate according to the embodiment.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same. Note that FIG. 1 described below corresponds to the AA cross-sectional view shown in FIG. 3. FIG. 2 corresponds to the BB cross-sectional view shown in FIG.

[Embodiment]
A substrate 1 shown in FIGS. 1, 2, and 3 is mounted with various electronic components 2, and is applied to various electronic component units mounted on a vehicle such as an automobile, for example. The substrate 1 of this embodiment constitutes a noise filter-equipped substrate in which a noise filter structure 100 is applied to a multilayer substrate body 3 on which various electronic components 2 are mounted. Hereafter, each structure of the board | substrate 1 is demonstrated in detail with reference to each figure.

  In the following description, among the first direction, the second direction, and the third direction intersecting with each other, the first direction is referred to as “lamination direction X”, and the second direction is referred to as “first width direction Y”. The third direction is called “second width direction Z”. Here, the stacking direction X, the first width direction Y, and the second width direction Z are orthogonal to each other. The stacking direction X typically corresponds to the direction in which the layers of the multilayer substrate body 3 are stacked. Each direction used in the following description represents a direction in a state where the respective parts are assembled to each other unless otherwise specified.

  Specifically, the substrate 1 includes an electronic component 2, a multilayer substrate body 3, and a noise filter structure 100. The noise filter structure 100 includes a through hole 35 formed in the multilayer substrate body 3 and the magnetic body 4.

  The electronic component 2 is an element that is mounted on the multilayer substrate body 3 and exhibits various functions. The electronic component 2 includes, for example, an electronic control unit including a fuse, a capacitor, a relay, a resistor, a transistor, a transformer, a coil, an IPS (Intelligent Power Switch), an ECU (Electronic Control Unit) and a microcomputer, various sensor elements, and an LED (Light Emitting Diode) element, speaker, etc., but is not limited to this. The electronic component 2 may include, for example, filter capacitors provided on both sides in the second width direction Z of the magnetic body 4 to be described later.

  The multilayer substrate main body 3 constitutes an electronic circuit on which various electronic components 2 are mounted and electrically connected to each other. The multilayer substrate body 3 is formed in a substantially rectangular plate shape whose plate thickness direction is along the stacking direction X, and is extended along the first width direction Y and the second width direction Z. Here, in the multilayer substrate body 3, the principal surfaces on both sides in the stacking direction X constitute the mounting surfaces 31, and the electronic component 2 is mounted on each mounting surface 31. The multilayer substrate body 3 of the present embodiment is a so-called printed circuit board. That is, the multilayer substrate body 3 has a wiring pattern (print pattern) printed on a conductive material such as copper on an insulating layer 32 made of an insulating material such as epoxy resin, glass epoxy resin, paper epoxy resin, or ceramic. Thus, the circuit body 33 is configured by the wiring pattern. The multilayer substrate body 3 is electrically connected to the circuit body 33 by soldering or the like by inserting lead wires and terminals of the electronic component 2 into through holes formed through the multilayer substrate body 3 along the stacking direction X. The electronic component 2 is mounted on each mounting surface 31 by being connected. The circuit body 33 electrically connects the plurality of electronic components 2 and configures a circuit system corresponding to the required function.

  In the multilayer substrate body 3 of the present embodiment, a plurality of circuit bodies 33 constituting different circuit systems are stacked with an insulating layer 32 interposed therebetween. That is, the multilayer substrate main body 3 is a so-called multilayer substrate in which a plurality of insulating layers 32 on which circuit bodies 33 are printed are stacked so that a plurality of insulating layers 32 and a plurality of circuit bodies 33 are alternately stacked. Configure. Here, the multilayer substrate main body 3 is formed by alternately laminating conductor layers of the circuit bodies 33 on the five insulating layers 32, so that six conductor layers of the circuit bodies 33 are laminated. That is, the multilayer substrate main body 3 includes a conductor layer formed by one circuit body 33 between five insulating layers 32 and one circuit body 33 on each outermost surface in the stacking direction X. As a result, the conductor layers of the circuit body 33 are stacked for six layers. The conductor layers of the circuit body 33 are the first layer 34A, the second layer 34B, the third layer 34C, the fourth layer 34D, and the fifth layer in the multilayer substrate body 3 from one side to the other side in the stacking direction X. 34E and the sixth layer 34F are stacked in this order. The circuit bodies 33 constituting the first layer 34A, the second layer 34B, the third layer 34C, the fourth layer 34D, the fifth layer 34E, and the sixth layer 34F have different circuit systems, that is, A total of six independent circuit systems are configured.

  Here, as an example, the first layer 34A and the sixth layer 34F constitute independent signal layers as a circuit system, and the circuit bodies 33 constitute signal lines 33a and 33f for signal communication, respectively. The signal lines 33 a and 33 f are transmission paths for supplying various signals to various devices connected to the substrate 1. The second layer 34B and the fifth layer 34E constitute an independent ground (GND) layer as a circuit system, and the circuit bodies 33 constitute ground GND patterns (GND lines) 33b and 33e, respectively. The GND patterns 33b and 33e are transmission paths for so-called grounding (grounding) of various devices connected to the substrate 1. The third layer 34C and the fourth layer 34D constitute independent power supply layers as a circuit system, and the circuit bodies 33 constitute power transmission power supply patterns (power supply lines) 33c and 33d, respectively. The power supply patterns 33 c and 33 d are transmission paths for transmitting power of a predetermined voltage to various devices connected to the substrate 1. That is, here, the multilayer substrate body 3 includes a signal layer by the first layer 34A, a ground layer by the second layer 34B, a power supply layer by the third layer 34C, and a fourth layer 34D from one side to the other side in the stacking direction X. Are stacked in this order: a power source layer, a ground layer by the fifth layer 34E, and a signal layer by the sixth layer 34F. In addition, the power supply pattern 33c and the power supply pattern 33d may constitute transmission paths for transmitting power of mutually different voltages, for example, one of which constitutes a 12V power supply system that transmits 12V of power, The other may constitute a 48V power supply system that transmits 48V power. In addition, here, the GND pattern 33b and the GND pattern 33e are typically provided in two systems to cope with a large current. For example, one corresponds to a 12V power supply system and the other corresponds to a 48V power supply system. May be configured. The signal line 33a and the signal line 33f are, for example, provided in two systems so that a relatively large number of signals can be transmitted. 1 and 2, the multilayer substrate body 3 is provided with the circuit body 33 of the first layer 34A exposed on one mounting surface 31, and the circuit body 33 of the sixth layer 34F is provided on the other mounting surface 31. However, the present invention is not limited to this. The multilayer substrate body 3 is arranged in such a positional relationship that one or both of the circuit body 33 of the first layer 34A and the circuit body 33 of the sixth layer 34F are provided in the layer made of the insulating layer 32. May be laminated.

  Since the multilayer substrate body 3 has the above-described layer structure, each power supply layer (the third layer 34C and the fourth layer 34D) that tends to have a relatively large noise is used as a pair of ground layers (second layer). Layer 34B, fifth layer 34E). In addition, the multilayer substrate body 3 has a layer structure as described above, so that a signal layer (first layer 34A, sixth layer 34F) in which a flowing current is relatively small compared to the power supply layer and the ground layer is provided. It can be an outer layer in the layer configuration. As a result, the multilayer substrate body 3 can be configured to be able to suppress the influence of noise due to a large current to a minimum by this layer configuration.

  The multilayer substrate body 3 of the present embodiment has a through hole 35 that constitutes a part of the noise filter structure 100. The through-hole 35 is a hollow portion provided through the multilayer substrate body 3 along the stacking direction X of the plurality of circuit bodies 33. The through hole 35 constitutes a portion into which a magnetic body 4 described later is inserted and assembled. Here, the through-holes 35 are formed in pairs with a gap in the first width direction Y orthogonal to the stacking direction X (hereinafter, when distinguishing between a pair of through-holes 35, It may be referred to as “hole 35A” and the other may be referred to as “through hole 35B”.) Each through-hole 35 has a substantially rectangular cross-sectional shape in a direction orthogonal to the stacking direction X. The pair of through holes 35, that is, the through hole 35 </ b> A and the through hole 35 </ b> B are positioned to face the first width direction Y across the noise reduction target portion 101 in the multilayer substrate body 3. The noise reduction target portion 101 is a portion including a plurality of circuit bodies 33 that are targets of noise reduction by the magnetic body 4 in the multilayer substrate body 3. In other words, the multilayer substrate main body 3 includes a plurality of circuit bodies 33 in which a portion sandwiched between the through hole 35A and the through hole 35B in the first width direction Y includes noise reduction targets by the magnetic body 4. It becomes the reduction target part 101. As described above, the multilayer substrate body 3 includes the circuit bodies 33 for six layers constituting the signal lines 33a and 33f, the GND patterns 33b and 33e, and the power supply patterns 33c and 33d as described above. Yes.

  The magnetic body 4 reduces noise in each circuit body 33 by collectively enclosing the outside of the plurality of circuit bodies 33 around the extending direction of the circuit body 33. The extending direction of the circuit body 33 corresponds to the direction in which the circuit body 33 extends (the direction in which the circuit body 33 extends) in the noise reduction target portion 101 of the multilayer substrate body 3. Here, the pair of through holes 35 are provided. This corresponds to the second width direction Z orthogonal to the opposing first width direction Y. The magnetic body 4 is made of, for example, ferrite that is a magnetic body with high magnetic permeability. Here, the magnetic body 4 is a portion sandwiched between the pair of through holes 35 in the multilayer substrate body 3, that is, the signal lines 33a and 33f, the GND patterns 33b and 33e, and the power supply patterns 33c and 33d. The outside of the noise reduction target part 101 on which the circuit bodies 33 are stacked is collectively surrounded. The magnetic body 4 of the present embodiment is assembled to the multilayer substrate body 3 through the through holes 35 and the second outside of the plurality of circuit bodies 33 included in the noise reduction target portion 101 sandwiched between the pair of through holes 35 is the second. Surrounds all around the width direction Z. Furthermore, the magnetic body 4 collectively surrounds the outside of the plurality of circuit bodies 33 so as to surround the circuit bodies 33 around the extending direction of the circuit bodies 33 in the noise reduction target portion 101.

  More specifically, the magnetic body 4 is formed by combining a plurality of divided bodies, here two divided bodies 41 and 42, so that the outside of the plurality of circuit bodies 33 constituting the noise reduction target portion 101 is outside the circuit body 3. Are formed in an annular shape surrounding the entire extending direction (second width direction Z). In the divided body 41, a cross-sectional shape (see FIG. 1) in a direction orthogonal to the second width direction Z is formed in a substantially gate shape (in other words, a substantially U-shaped shape). Specifically, the divided body 41 includes a base portion 41a formed in a substantially rectangular plate shape and a pair of leg portions 41b erected from the base portion 41a, and these are integrally formed. The base 41 a is a portion that is positioned opposite to the mounting surface 31 on one side in the stacking direction X of the multilayer substrate body 3. The pair of leg portions 41b are portions that stand up so as to protrude along the stacking direction X from both end portions in the first width direction Y of the base portion 41a. The pair of leg portions 41 b are formed in a substantially rectangular plate shape, are respectively inserted into the pair of through holes 35, and are formed in positions and shapes that can penetrate the pair of through holes 35 along the stacking direction X. In the divided body 41, the base portion 41 a is stacked in the stacking direction of the multilayer substrate body 3 as described above in a state where the pair of leg portions 41 b are inserted into the pair of through holes 35 and assembled to the multilayer substrate body 3. It is located opposite to the mounting surface 31 on one side of X. The divided body 42 is formed in a substantially rectangular plate shape having substantially the same size as the base portion 41a of the divided body 41, and is formed at the tip end portions (end portions opposite to the base portion 41a) of the pair of leg portions 41b of the divided body 41. Assembled. The division body 42 is assembled | attached to the front-end | tip part of a pair of leg part 41b via an adhesive material, various connection mechanisms, etc., for example. The divided body 42 is positioned opposite to the mounting surface 31 on the other side in the stacking direction X of the multilayer substrate body 3 in a state assembled to the distal ends of the pair of leg portions 41b. That is, in the magnetic body 4, the base portion 41 a and the divided body 42 of the divided body 41 are positioned opposite to each other with respect to the stacking direction X with the noise reduction target portion 101 of the multilayer substrate body 3 interposed therebetween. The pair of leg portions 41b are positioned to face each other with the noise reduction target portion 101 in between in the first width direction Y. With this configuration, the magnetic body 4 collectively surrounds the outside of the plurality of circuit bodies 33 constituting the noise reduction target portion 101 around the extending direction (second width direction Z) of the circuit body 3 in a substantially rectangular ring shape. It becomes. In other words, the magnetic body 4 extends along the second width direction Z inside the magnetic body 4 in which the plurality of circuit bodies 33 constituting the noise reduction target portion 101 are formed in a ring shape by the divided body 41 and the divided body 42. The multilayer substrate body 3 is assembled in such a positional relationship as to pass through. Furthermore, the magnetic body 4 is assembled to the multilayer substrate body 3 in such a positional relationship that the annular central axis is along the extending direction of the circuit body 33 (second width direction Z). With this configuration, the substrate 1 generates a magnetic flux in the magnetic body 4 when each circuit body 33 is energized, and the current energy is converted to magnetic energy. At the same time, the magnetic energy is again changed from the magnetic energy to the current energy by electromagnetic induction. In addition, a magnetic loss occurs, and a part of the noise current in each circuit body 33 is suppressed. As a result, the noise of each circuit body 33 whose substrate 1 is surrounded by the magnetic body 4 is reduced.

  The substrate 1 and the noise filter structure 100 described above are provided by laminating the outside of a plurality of circuit bodies 33 provided on the multilayer substrate body 3 through the insulating layer 32 and constituting different circuit systems by the magnetic body 4. Surround with. With this configuration, the substrate 1 and the noise filter structure 100 can collectively reduce the noise of the plurality of circuit bodies 33 by the magnetic body 4, so that an increase in size can be suppressed while ensuring appropriate noise reduction performance. can do. For example, the substrate 1 and the noise filter structure 100 have a smaller number of components compared to a case where noise reduction components are provided for a plurality of circuit bodies 33 constituting different circuit systems in the multilayer substrate body 3. The increase can be suppressed, the increase in the mounting area, weight, etc. of the noise reduction component can be suppressed, and the manufacturing cost can be suppressed. In particular, the substrate 1 and the noise filter structure 100 can be increased in size according to the present configuration even when, for example, a large current is achieved and the number of circuits requiring noise reduction is relatively increased. Can be remarkably exerted.

  Further, as illustrated in FIG. 4, the substrate 1 and the noise filter structure 100 include a first layer 34 </ b> A, a second layer 34 </ b> B, a second layer 34 </ b> B in which a plurality of circuit bodies 33 are stacked via an insulating layer 32 in the multilayer substrate body 3. A filter for countermeasures against high frequency noise by combining an interlayer capacitance (floating capacitance, parasitic capacitance) C generated between each of the third layer 34C, the fourth layer 34D, the fifth layer 34E, and the sixth layer 34F and the magnetic body 4 Can be configured. For example, as illustrated in FIG. 4, the substrate 1 and the noise filter structure 100 include a third layer due to an interlayer capacitance C generated between a second layer 34 </ b> B that is a ground layer and a third layer 34 </ b> C that is a power supply layer. High frequency noise in the power supply pattern 33c formed by the circuit body 33 of 34C can be reduced.

  In addition, the substrate 1 and the noise filter structure 100 described above are configured such that the magnetic body 4 is inserted into the multilayer substrate body 3 by inserting a part of the magnetic body 4 into the through hole 35 provided in the multilayer substrate body 3. Easy to assemble. With this configuration, since the substrate 1 and the noise filter structure 100 can improve, for example, the assembly workability, the manufacturing cost can also be suppressed in this respect.

  In addition, the substrate 1 and the noise filter structure 100 described above constitute the noise reduction target portion 101 in the plurality of circuit bodies 33 by forming the magnetic body 4 in an annular shape by combining the plurality of divided bodies 41 and 42. The part to be encircled can be surrounded by the magnetic body 4 in an annular shape around the entire extending direction of the circuit body 33. As a result, the substrate 1 and the noise filter structure 100 can more reliably reduce the noise of the plurality of circuit bodies 33 collectively.

  Further, in the substrate 1 and the noise filter structure 100 described above, the plurality of circuit bodies 33 surrounded by the magnetic body 4 include the signal lines 33a and 33f, the GND patterns 33b and 33e, and the power supply patterns 33c and 33d. The body 4 can collectively reduce noise of the signal lines 33a and 33f, the GND patterns 33b and 33e, and the power supply patterns 33c and 33d.

  In addition, the board | substrate and noise filter structure which concern on embodiment of this invention mentioned above are not limited to embodiment mentioned above, A various change is possible in the range described in the claim.

  Although the board | substrate 1 demonstrated above was demonstrated as what is applied to the various electronic component units mounted in vehicles, such as a motor vehicle, for example, it is not restricted to this, You may apply other than a vehicle.

  The multilayer substrate body 3 described above has been described as a printed circuit board, but is not limited to this, and is an insert bus bar substrate in which a conductive metal bus bar is incorporated in a so-called insulating resin material. May be. In this case, the multilayer substrate body 3 is configured to be multilayered by, for example, covering a bus bar as a circuit body made of a conductive metal material with an insulating resin material and laminating a plurality thereof. Further, the multilayer substrate body 3 has been described on the assumption that both surfaces in the stacking direction X constitute the mounting surface 31, but the present invention is not limited to this, and the mounting surface 31 may be either one of the surfaces.

  The multilayer substrate body 3 described above has been described as having a pair of through holes 35 (through holes 35A and 35B), but is not limited thereto. The multilayer substrate body 3 may have, for example, one through hole 35 according to the position and size of the noise reduction target portion 101 in the multilayer substrate body 3, or the through hole 35 is not provided in the first place. Also good.

  The multilayer substrate body 3 described above includes a signal layer by the first layer 34A, a ground layer by the second layer 34B, a power layer by the third layer 34C, a power layer by the fourth layer 34D, a ground layer by the fifth layer 34E, Although it has been described that the signal layers are stacked in the order of the sixth layer 34F, the number of layers and the order of stacking are not limited thereto. The multilayer substrate body 3 may have a configuration in which a plurality of circuit bodies 33 constituting different circuit systems are stacked via an insulating layer 32. For example, the conductor body of the circuit body 33 is equivalent to two layers. Alternatively, seven or more layers may be laminated. In other words, the plurality of circuit bodies 33 surrounded by the magnetic body 4 and reduced in noise are described as including the signal lines 33a and 33f, the GND patterns 33b and 33e, and the power supply patterns 33c and 33d. What constitutes a plurality of circuit systems may be used. In FIG. 1 and FIG. 2, the circuit body 33 constituting the GND patterns 33b and 33e and the power supply patterns 33c and 33d is illustrated as being relatively thick thick copper to cope with a large current, for example. However, the present invention is not limited to this and may not be heavy copper. For example, the multilayer substrate body 3 may be formed by stacking two signal layers and a total of four layers of one power source layer and one ground layer, respectively, unless they are for large currents.

  Although the magnetic body 4 demonstrated above was demonstrated as what is formed in cyclic | annular form by combining the split bodies 41 and 42, it may not be restricted to this but may be formed in cyclic | annular form by combining three or more divided bodies. . In addition, the magnetic body 4 does not necessarily have to be formed in an annular shape. For example, the divided body 41 alone may be used as long as it is configured to surround each of the stacked circuit bodies 33 to the extent that noise can be reduced. Thus, it may be formed in a substantially gate shape (substantially U-shaped).

DESCRIPTION OF SYMBOLS 1 Board | substrate 3 Multilayer board | substrate body 4 Magnetic body 32 Insulating layer 33 Circuit body 33a, 33f Signal line 33b, 33e GND pattern 33c, 33d Power supply pattern 35, 35A, 35B Through-hole 41, 42 Divided body 100 Noise filter structure X Lamination direction Y First width direction Z Second width direction

Claims (6)

A multilayer substrate body in which a plurality of circuit bodies constituting mutually different circuit systems are provided by being laminated via an insulating layer;
A magnetic body that collectively surrounds the outside of the plurality of circuit bodies around the extending direction of the circuit bodies,
substrate. The multilayer substrate body has a through hole that penetrates along the stacking direction of the plurality of circuit bodies and through which the magnetic body is inserted.
The substrate according to claim 1. The magnetic body is formed in an annular shape that collectively surrounds the outside of the plurality of circuit bodies around the extending direction of the circuit bodies by combining a plurality of divided bodies.
The substrate according to claim 1 or 2. The plurality of circuit bodies include a power transmission power pattern and a ground GND pattern.
The substrate according to any one of claims 1 to 3. The plurality of circuit bodies further include signal lines for signal communication.
The substrate according to claim 4. A plurality of circuit bodies constituting mutually different circuit systems are stacked through an insulating layer, and a through-hole provided through a multilayer substrate body provided along the stacking direction of the plurality of circuit bodies;
A magnetic body that is assembled to the multilayer substrate body through the through-holes and collectively surrounds the outside of the plurality of circuit bodies around the extending direction of the circuit bodies,
Noise filter structure.

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