JP6232323B2 - 分割装置 - Google Patents
分割装置 Download PDFInfo
- Publication number
- JP6232323B2 JP6232323B2 JP2014059992A JP2014059992A JP6232323B2 JP 6232323 B2 JP6232323 B2 JP 6232323B2 JP 2014059992 A JP2014059992 A JP 2014059992A JP 2014059992 A JP2014059992 A JP 2014059992A JP 6232323 B2 JP6232323 B2 JP 6232323B2
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- JP
- Japan
- Prior art keywords
- workpiece
- cutting
- blade
- spindle
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Description
12 保持手段
13 X軸移動手段
14 Y軸移動手段
15 Z軸移動手段
16 切削手段
21 保持面
61 スピンドルハウジング
62 スピンドル
63 切削ブレード
66 撮像手段
67 押圧刃
71 被加工物の表面
72 被加工物の裏面
73 分割予定ライン
74 分割溝
T1 ダイシングテープ
T2 保護テープ
W 被加工物
Claims (1)
- 被加工物を保持する保持面を有する保持手段と、該保持手段に保持された被加工物を切削する切削ブレードを装着するスピンドル及び該スピンドルを回転可能に支持するスピンドルハウジングを有する切削手段と、該保持手段に保持された被加工物の表面を撮像する撮像手段と、該保持手段と該切削手段とを相対的にX軸方向に移動するX軸移動手段と、該保持手段と該切削手段とを相対的にX軸方向に直交するY軸方向に移動するY軸移動手段と、該保持手段と該切削手段とを相対的に鉛直方向に移動するZ軸移動手段と、を少なくとも備えた分割装置であって、
該スピンドルハウジングの下端には、該スピンドルの軸芯方向に延伸し且つ該スピンドルハウジングの下端側に、該切削ブレードで被加工物を切削中に被加工物に接触しない量突出して形成された押圧刃が配設されており、
該保持手段上に保持された被加工物の表面に形成された分割予定ラインに沿って予め形成された分割起点の上方側から該押圧刃を該分割起点に沿って位置付けて押圧させ、該被加工物を該分割起点を起点として該分割予定ラインに沿って分割する分割装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014059992A JP6232323B2 (ja) | 2014-03-24 | 2014-03-24 | 分割装置 |
CN201510124566.XA CN104943003B (zh) | 2014-03-24 | 2015-03-20 | 分割装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014059992A JP6232323B2 (ja) | 2014-03-24 | 2014-03-24 | 分割装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015185654A JP2015185654A (ja) | 2015-10-22 |
JP6232323B2 true JP6232323B2 (ja) | 2017-11-15 |
Family
ID=54158325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014059992A Active JP6232323B2 (ja) | 2014-03-24 | 2014-03-24 | 分割装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6232323B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108621314A (zh) * | 2018-04-28 | 2018-10-09 | 佛山鼎容软件科技有限公司 | 一种稳定性强的晶体管生产用硅片定量切割装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107866916B (zh) * | 2017-08-16 | 2019-03-08 | 东海县一丰灯具有限公司 | 一种改良型led灯管装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62121016A (ja) * | 1985-11-21 | 1987-06-02 | 三菱電機株式会社 | ウエハのブレ−ク装置 |
JP5208644B2 (ja) * | 2008-09-26 | 2013-06-12 | 株式会社ディスコ | 加工方法および加工装置 |
KR101887448B1 (ko) * | 2011-10-13 | 2018-08-13 | 삼성전자주식회사 | 세라믹 기판을 채용한 발광소자 패키지의 절단 방법 및 다층구조의 가공 대상물의 절단방법 |
-
2014
- 2014-03-24 JP JP2014059992A patent/JP6232323B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108621314A (zh) * | 2018-04-28 | 2018-10-09 | 佛山鼎容软件科技有限公司 | 一种稳定性强的晶体管生产用硅片定量切割装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2015185654A (ja) | 2015-10-22 |
CN104943003A (zh) | 2015-09-30 |
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