JP6222723B2 - Terminal structure, method of manufacturing terminal structure, and transformer - Google Patents

Description

  The present invention relates to a terminal structure, a manufacturing method of the terminal structure, and a transformer.

  In recent years, a technique for mounting electronic components on a substrate with high density and high accuracy is required. There is also a need for electronic component mounting technology that is resistant to vibration and shock.

  Patent Document 1 discloses a technique related to a terminal structure capable of absorbing and suppressing thermal stress generated in a through hole and stress when an electrical connection terminal is inserted into a printed board. Patent Document 2 discloses a technique related to the structure of a transformer coil so that there is no restriction on the temperature at which the coil is soldered to a terminal when the transformer coil is manufactured. Patent Document 3 discloses a technique related to a terminal structure that can solve the problem of disconnection due to external force application to the terminal and the problem of disconnection due to solder dip heat.

JP 2000-123899 A Japanese Patent Laid-Open No. 3-129712 JP 2007-201328 A

  In the technique disclosed in Patent Document 1, a lead member (electrical connection terminal) is inserted into a through hole formed in a substrate, and solder is poured into the through hole from the substrate surface to lead the substrate. Is fixed.

  However, when the substrate for fixing the lead member is thick, the temperature of the solder poured into the through hole from the surface of the substrate is radiated before reaching the central portion in the thickness direction of the substrate. For this reason, there is a problem that the solder does not reach the central portion in the thickness direction of the substrate, the attachment of the lead member to the substrate becomes insufficient, and the mounting quality of the electronic component is deteriorated.

  In view of the above problems, an object of the present invention is to provide a terminal structure, a method for manufacturing the terminal structure, and a transformer that can improve the quality of mounting.

  The terminal structure according to the present invention is formed in a base material including a terminal portion, a through hole penetrating the base material in a thickness direction of the base material, and an inner wall of the through hole in the terminal portion. A lead member including a metal cover layer, a first contact portion disposed in the through hole and contacting the metal cover layer in the through hole; and the lead member and the metal filled in the through hole A solder for electrically connecting the covering layer; and an opening formed on a side surface of the substrate and capable of filling the through hole with the solder.

  In the transformer according to the present invention, at least one of the primary side terminal connected to the primary side winding and the secondary side terminal connected to the secondary side winding includes the above terminal structure.

  The manufacturing method of the terminal structure according to the present invention includes forming a first through hole penetrating the base material in the thickness direction of the base material, penetrating the base material in the thickness direction of the base material, Forming a second through hole that forms a continuous space with one through hole, forming a metal coating layer on the inner walls of the first and second through holes, and cutting a part of the second through hole; In the first through hole, a lead member having a first abutting portion that abuts the metal coating layer in the first through hole is formed by cutting the base material to form an opening. The first through-hole is filled with solder from the side surface of the base material via the opening, and the lead member and the metal coating layer are electrically connected.

  The method for manufacturing a terminal structure according to the present invention includes forming a first through hole penetrating the base material in a thickness direction of the base material, forming a metal coating layer on an inner wall of the first through hole, A second through hole that penetrates the base material in the thickness direction of the base material to form a space continuous with the first through hole is formed, and a part of the second through hole is cut. The base member is cut to form an opening, and a lead member having a first contact portion that contacts the metal coating layer in the first through hole is disposed in the first through hole. The first through hole is filled with solder from the side surface of the base material via the opening to electrically connect the lead member and the metal coating layer.

  The method for manufacturing a terminal structure according to the present invention includes forming a through hole penetrating the base material in the thickness direction of the base material, forming a metal coating layer on an inner wall of the through hole, and from the side surface of the base material. An opening is formed so as to penetrate the base material to the through hole, and a lead member including a first contact portion that contacts the metal coating layer in the through hole is disposed in the through hole, The through hole is filled with solder from the side surface of the substrate through the opening, and the lead member and the metal coating layer are electrically connected.

  According to the present invention, it is possible to provide a terminal structure, a method for manufacturing the terminal structure, and a transformer that can improve the quality of mounting.

1 is a top view showing a terminal structure according to a first embodiment; 1 is a side view showing a terminal structure according to a first embodiment. FIG. 3 is a cross-sectional view of the terminal structure shown in FIG. 1 taken along section line III-III. FIG. 4 is a cross-sectional view of the terminal structure shown in FIG. 2 taken along section line IV-IV. FIG. 5 is a cross-sectional view of the terminal structure shown in FIG. FIG. 6 is a cross-sectional view showing another aspect of the lead member provided in the terminal structure according to the first embodiment. FIG. 6 is a cross-sectional view showing another aspect of the lead member provided in the terminal structure according to the first embodiment. FIG. 6 is a cross-sectional view for explaining the method for manufacturing the terminal structure according to the first embodiment; FIG. 6 is a cross-sectional view for explaining the method for manufacturing the terminal structure according to the first embodiment; FIG. 6 is a cross-sectional view for explaining the method for manufacturing the terminal structure according to the first embodiment; FIG. 6 is a cross-sectional view for explaining the method for manufacturing the terminal structure according to the first embodiment; FIG. 6 is a cross-sectional view for explaining the method for manufacturing the terminal structure according to the first embodiment; It is sectional drawing in the position corresponding to the cutting line VIIIF-VIIIF of the terminal structure shown to FIG. 8E. FIG. 6 is a cross-sectional view for explaining the method for manufacturing the terminal structure according to the first embodiment; It is sectional drawing in the position corresponding to the cutting line VIIIH-VIIIH of the terminal structure shown to FIG. 8G. FIG. 6 is a top view showing a terminal structure according to a second embodiment. FIG. 6 is a side view showing a terminal structure according to a second embodiment. FIG. 10 is a cross-sectional view taken along a cutting line XI-XI of the terminal structure shown in FIG. 9. It is sectional drawing in the cutting line XII-XII of the terminal structure shown in FIG. It is sectional drawing in the cutting | disconnection line XIII-XIII of the terminal structure shown in FIG. 10 is a cross-sectional view for explaining a method for manufacturing a terminal structure according to a second embodiment; FIG. 10 is a cross-sectional view for explaining a method for manufacturing a terminal structure according to a second embodiment; FIG. 10 is a cross-sectional view for explaining a method for manufacturing a terminal structure according to a second embodiment; FIG. It is sectional drawing in the position corresponding to the cutting line XIVD-XIVD of the terminal structure shown to FIG. 14C. 10 is a cross-sectional view for explaining a method for manufacturing a terminal structure according to a second embodiment; FIG. It is sectional drawing in the position corresponding to the cutting line XIVF-XIVF of the terminal structure shown to FIG. 14E. 10 is a cross-sectional view for explaining a method for manufacturing a terminal structure according to a second embodiment; FIG. It is sectional drawing in the position corresponding to the cutting line XIVH-XIVH of the terminal structure shown to FIG. 14F. FIG. 6 is a top view of a transformer according to the third exemplary embodiment. FIG. 6 is a side view of a transformer according to a third exemplary embodiment. FIG. 17 is a cross-sectional view taken along section line XVII-XVII of the transformer shown in FIG. 16. FIG. 17 is a cross-sectional view taken along section line XVIII-XVIII of the transformer shown in FIG. 16. It is sectional drawing in the cutting | disconnection line XIX-XIX of the transformer shown in FIG.

<Embodiment 1>
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a top view showing a terminal structure according to the first embodiment. FIG. 2 is a side view showing the terminal structure according to the present embodiment. 3 is a cross-sectional view of the terminal structure shown in FIG. 1 taken along section line III-III. 4 is a cross-sectional view of the terminal structure shown in FIG. 2 taken along section line IV-IV. FIG. 5 is a cross-sectional view of the terminal structure shown in FIG.

  As shown in FIGS. 1 and 2, the base material 10 includes a terminal portion 11 at an end portion. The terminal part 11 with which the base material 10 is provided may be plural. When there are a plurality of terminal portions 11, the terminal portions 11 may be arranged along the end portion of the base material. For example, the base material 10 may be a substrate on which a predetermined electronic component is mounted, or may be a part of the predetermined electronic component. The base material 10 has a predetermined thickness. For example, the thickness of the base material 10 is such that when solder is poured into the through hole from the surface side of the base material 10, the solder is solidified in the middle of the through hole and the solder does not reach the vicinity of the central portion in the thickness direction of the base material 10. It has. For example, the base material 10 can be configured using an insulating material. If an example is given, the thickness of the base material 10 of the location in which the terminal part 11 is formed is 4 mm or more, More preferably, it is 6 mm or more.

  The terminal portion 11 includes a through hole 12, an opening portion 13, a metal coating layer 14, a lead member 15, and solder 16. As shown in FIG. 3, the through hole 12 penetrates the base material 10 in the thickness direction of the base material 10. As shown in FIG. 2, FIG. 4, and FIG. 5, the opening 13 penetrates the base material 10 in the thickness direction of the base material 10 and forms a space continuous with the through hole 12. As shown in FIGS. 4 and 5, the cross-sectional shape of the through hole 12 (the cross-sectional shape in a plane parallel to the main surface of the base material 10) is a substantially circular shape with a part connected to the opening 13. Note that the cross-sectional shape of the opening 13 (the cross-sectional shape in a plane parallel to the main surface of the base material 10) is any shape as long as the side surface of the base material 10 and the through hole 12 are spatially connected. May be. The main surface of the base material 10 is a surface parallel to the front surface and the back surface of the base material 10.

  Here, the through hole 12 has a sector-shaped central angle θ formed by the intersections 25 and 26 of the through hole 12 and the opening 13 and the center point of the through hole 12 larger than 180 degrees. Is preferable (see FIGS. 4 and 8B). Thus, the lead member 15 can be reliably fixed in the through hole 12 by making the central angle θ larger than 180 degrees. Further, when the lead member 15 is inserted into the through hole 12 in the manufacturing process, the lead member 15 can be prevented from moving to the opening 13 side and coming off. In consideration of filling the through hole 12 with solder through the opening 13, it is preferable that the central angle θ of the sector formed by the intersections 25 and 26 and the center point of the through hole 12 be 330 degrees or less.

  As shown in FIGS. 2 to 5, the metal coating layer 14 is formed on the inner wall of the through hole 12 and the inner wall of the opening 13. As shown in FIGS. 1 and 2, the metal coating layer 14 is formed in a rectangular shape on the front surface and the back surface of the substrate 10. For example, the metal coating layer 14 is a metal plating layer. When the opening 13 is not opened on the side surface of the substrate 10 when forming the metal coating layer 14 (see FIG. 8B), the inside of the through hole 12 and the opening 13 from the front surface side and the back surface side of the substrate 10. Is supplied with a plating solution. At this time, the metal concentration of the plating solution is high on the front surface side and the back surface side of the base material 10, and is low in the central portion of the through hole 12 and the opening 13 in the thickness direction of the base material 10. For this reason, the thickness of the metal coating layer 14 formed on the inner wall of the through hole 12 and the opening 13 becomes thinner from the front surface side and the back surface side of the base material 10 toward the central portion in the thickness direction of the base material 10. .

  FIG. 4 is a cross-sectional view of the terminal structure shown in FIG. FIG. 5 is a cross-sectional view of the terminal structure shown in FIG. As shown in FIGS. 4 and 5, the thickness (see FIG. 5) of the metal coating layer 14 in the vicinity of the central portion in the thickness direction of the base material 10 is the thickness of the metal coating layer 14 in the vicinity of the front surface (back surface) of the base material 10. (See FIG. 4).

  As shown in FIGS. 1 and 3 to 5, the lead member 15 is disposed in the through hole 12. The lead member 15 includes a contact portion 21 (first contact portion), and the contact portion 21 is in contact with the metal coating layer 14 in the through hole 12. For example, the cross-sectional shape of the contact portion 21 is a substantially circular shape. The cross-sectional shape of the through hole 12 is also substantially circular. Therefore, by bringing the contact portion 21 into contact with the metal coating layer 14 in the through hole 12, the lead member 15 can be accurately and firmly fixed in the through hole 12. Further, when the lead member 15 is disposed in the through hole 12 (that is, before the solder is poured into the through hole 12), the contact portion 21 is brought into contact with the metal coating layer 14, so that the lead member 15 is The through hole 12 can be accurately arranged.

  In addition, the lead member 15 may include a contact portion 22 (third contact portion) that contacts the metal coating layer 14 formed on the back surface of the substrate 10. When the lead member 15 includes the contact portion 22, the contact portion 22 contacts the metal coating layer 14 when the lead member 15 is inserted to a predetermined position in the through hole 12. It can be arranged in the hole 12 with high accuracy.

  The solder 16 is filled in the through hole 12 and electrically connects the lead member 15 and the metal coating layer 14. When the solder 16 is filled into the through hole 12, the solder 16 is filled from the side surface of the substrate 10 through the opening 13. Although the case where the solder 16 is filled in the opening 13 is shown in the present embodiment, it is sufficient that the solder 16 is filled in at least the through hole 12, and the opening 13 is not necessarily filled. There is no need. For example, a part of the opening 13 may be filled with the solder 16.

  6 and 7 are cross-sectional views showing other modes of the lead member 15 shown in FIG. As shown in FIG. 6, the lead member 15 ′ may further include a contact portion 23 (second contact portion) that contacts the metal coating layer 14 in the through hole 12. Here, the cross-sectional shape of the contact portion 23 (the cross-sectional shape in a plane parallel to the main surface of the substrate 10) is substantially circular. In the case shown in FIG. 6, the two contact portions 21 and 23 are in contact with the metal coating layer 14 in the through hole 12. Therefore, the lead member 15 can be fixed in the through hole more accurately and firmly than when only the contact portion 21 is provided (see FIG. 3).

  Further, as shown in FIG. 7, the diameter d1 in the cross section of the contact portion 21 ′ included in the lead member 15 ″ may be different from the diameter d2 in the cross section of the contact portion 23 ′. For example, the diameter d1 in the cross section of the contact portion 21 ′ may be smaller than the diameter d2 in the cross section of the contact portion 23 ′. At this time, the contact portion 21 ′ may be disposed closer to the surface side of the substrate 10 than the contact portion 23 ′. Thus, by reducing the diameter d1 of the contact portion 21 ′ formed at the tip of the lead member 15 ″, when the lead member 15 ″ is inserted into the through hole 12, the insertion port side ( The stress acting on the metal coating layer 14 formed on the back surface side of the substrate 10 can be reduced. Further, the lead member 15 ″ can be easily inserted into the through hole 12. Further, the contact portion 21 ′ is disposed closer to the surface side of the substrate 10 than the contact portion 23 ′ by an amount corresponding to a reduction in the diameter of the contact portion 21 ′, so that the contact portion 21 ′ is disposed on the metal coating layer 14. Can be reliably brought into contact with each other. Therefore, the lead member 15 ″ can be fixed in the through hole 12 accurately and firmly.

  Next, the manufacturing method of the terminal structure concerning this Embodiment is demonstrated. 8A to 8H are diagrams for explaining a method for manufacturing the terminal structure according to the present embodiment. When producing the terminal structure according to the present embodiment, first, as shown in FIG. 8A, a through hole 12 (first through hole) penetrating through the base material 10 in the thickness direction of the base material 10 is formed. . The through hole 12 can be formed using a drill, for example. Next, as shown in FIG. 8B, a through hole 17 (second through hole) that penetrates the base material in the thickness direction of the base material 10 and forms a space continuous with the through hole 12 is formed. In other words, the through hole 17 is formed so as to overlap a part of the through hole 12. The through hole 17 can also be formed using a drill, for example. The cross-sectional shapes of the through hole 12 and the through hole 17 can be substantially circular.

  In FIG. 8B, the diameters of the through hole 12 and the through hole 17 are substantially the same, but the diameters of the through hole 12 and the through hole 17 may be different from each other. When the through hole 17 is formed, the central angle θ of the sector formed by the intersections 25 and 26 of the through hole 12 and the through hole 17 and the center point of the through hole 12 is larger than 180 degrees. To. Thus, by making the central angle θ larger than 180 degrees, when the lead member 15 is inserted into the through hole 12, the lead member 15 can be prevented from moving to the opening 13 side and coming off. . In consideration of filling the through hole 12 with solder through the opening 13, the sector central angle θ formed by the intersections 25 and 26 and the center point of the through hole 12 is preferably 330 degrees or less. .

  Next, as shown in FIG. 8C, the metal coating layer 14 is formed on the inner walls of the through hole 12 and the through hole 17. The metal coating layer 14 can be formed by applying metal plating to the inner walls of the through hole 12 and the through hole 17. At this time, the metal concentration of the plating solution is high on the front surface side and the back surface side of the base material 10, and is low in the center portion of the through hole 12 and the through hole 17 in the thickness direction of the base material 10. For this reason, the metal coating layer 14 formed on the inner walls of the through hole 12 and the through hole 17 is formed so as to become thinner from the front surface side and the back surface side of the base material 10 toward the central portion in the thickness direction of the base material 10. (See FIG. 8F).

  Next, as shown in FIG. 8D, the substrate 10 is cut along the cutting line 28 so that a part of the through hole 17 is cut. Thereby, the opening part 13 is formed. Thereafter, as shown in FIGS. 8E and 8F, the lead member 15 is disposed in the through hole 12. For example, the lead member 15 can be disposed in the through hole 12 by inserting the lead member 15 into the through hole 12 from the back surface side of the substrate 10. For example, the lead member 15 can be disposed in the through hole 12 by fitting the lead member 15 into the through hole 12 from the side surface of the base material 10 via the opening 13.

  At this time, as shown in FIG. 8F, by bringing the contact portion 21 into contact with the metal coating layer 14 in the through hole 12, the lead member 15 can be accurately placed in the through hole 12. Further, when the lead member 15 is inserted into the through hole 12 from the back surface side of the base material 10, the contact portion 22 becomes the metal coating layer 14 when the lead member 15 is inserted to a predetermined position in the through hole 12. Therefore, the lead member 15 can be accurately placed in the through hole 12.

  Next, as shown in FIGS. 8G and 8H, the solder 16 is filled into the through hole 12 from the side surface of the base material 10 through the opening 13, and the lead member 15 and the metal coating layer 14 are electrically connected. To do. Although the case where the solder 16 is filled in the opening 13 is shown in the present embodiment, it is sufficient that the solder 16 is filled in at least the through hole 12, and the opening 13 is not necessarily filled. There is no need. For example, a part of the opening 13 may be filled with the solder 16.

  By using the above method, the terminal structure according to this embodiment can be manufactured. In the terminal structure manufacturing method described above, the metal coating layer 14 is formed after the through hole 12 and the through hole 17 are formed. However, the metal coating layer 14 may be formed after forming the through hole 12 and before forming the through hole 17. In this case, the metal coating layer 14 is formed only on the inner wall of the through hole 12 and is not formed on the inner wall of the through hole 17 (opening 13).

  Further, the metal coating layer 14 may be formed after the through hole 12 and the through hole 17 are formed and a part of the through hole 17 is cut to form the opening 13. When the metal coating layer 14 is formed after the opening 13 is formed, the plating solution is supplied to the central portion of the through hole 12 through the opening 13, so that the metal coating layer 14 formed on the inner wall of the through hole 12 The thickness can be made uniform.

  In the technique disclosed in Patent Document 1, a lead member (electrical connection terminal) is inserted into a through hole formed in a substrate, and solder is poured into the through hole from the substrate surface to lead the substrate. Was fixed.

  However, when the substrate for fixing the lead member is thick, the temperature of the solder poured into the through hole from the surface of the substrate is radiated before reaching the central portion in the thickness direction of the substrate. For this reason, there is a problem that the solder does not reach the central portion in the thickness direction of the substrate, the attachment of the lead member to the substrate becomes insufficient, and the mounting quality of the electronic component is deteriorated.

  For example, by increasing the distance between the inner wall of the through hole and the lead member, the solder can easily flow through the through hole. However, when the distance between the inner wall of the through hole and the lead member is increased, there is a problem that the positional accuracy when the lead member is arranged in the through hole is lowered.

  Therefore, in the invention according to the present embodiment, the opening 13 for filling the through hole 12 with the solder 16 is formed on the side surface of the substrate 10. Therefore, even when the substrate is thick, the central portion of the through hole 12 in the thickness direction of the substrate can be uniformly filled with solder, and the quality of soldering can be improved.

  Further, the contact member 21 is formed on the lead member 15, and the contact member 21 is brought into contact with the metal coating layer 14 in the through hole 12, thereby fixing the lead member 15 to the through hole 12 accurately and firmly. be able to. Further, when the lead member 15 is disposed in the through hole 12 (that is, before the solder is poured into the through hole 12), the contact portion 21 is brought into contact with the metal coating layer 14, so that the lead member 15 is The through hole 12 can be accurately arranged.

  With the invention according to the present embodiment described above, it is possible to provide a terminal structure capable of improving the quality of mounting and a method for manufacturing the terminal structure.

<Embodiment 2>
Next, a second embodiment of the present invention will be described.
FIG. 9 is a top view of the terminal structure according to the second embodiment. FIG. 10 is a side view showing the terminal structure according to the present embodiment. 11 is a cross-sectional view of the terminal structure shown in FIG. 9 taken along section line XI-XI. 12 is a cross-sectional view of the terminal structure shown in FIG. 10 taken along section line XII-XII. 13 is a cross-sectional view of the terminal structure shown in FIG. 10 taken along section line XIII-XIII. The terminal structure 2 according to the present embodiment differs from the terminal structure 1 according to the first embodiment in the shape of the opening. Other than this, the terminal structure is the same as that described in the first embodiment.

  As shown in FIGS. 9 and 10, the base material 30 includes a terminal portion 31 at the end. The terminal part 31 with which the base material 30 is provided may be plural. When there are a plurality of terminal portions 31, each terminal portion 31 may be arranged along the end portion of the base material. For example, the base material 30 may be a substrate on which a predetermined electronic component is mounted, or may be a part of the predetermined electronic component. The base material 30 has a predetermined thickness. For example, the thickness of the base material 30 is such that when solder is poured into the through hole from the surface side of the base material 30, the solder hardens in the middle of the through hole and the solder does not reach the vicinity of the central portion in the thickness direction of the base material 30. It has. For example, the base material 30 can be configured using an insulating material. As an example, the thickness of the base material 30 where the terminal portions 31 are formed is 4 mm or more, more preferably 6 mm or more.

  The terminal portion 31 includes a through hole 32, an opening portion 33, a metal coating layer 34, a lead member 35, and solder 36. As shown in FIG. 11, the through hole 32 penetrates the base material 30 in the thickness direction of the base material 30. As shown in FIGS. 10, 12, and 13, the opening 33 penetrates the base material 30 from a part of the side surface of the base material 30 to the through hole 32. The opening 33 is formed at the center in the thickness direction of the substrate 30. That is, the opening 33 spatially connects the side surface of the base material 30 and the through hole 32. As shown in FIGS. 12 and 13, the cross-sectional shape of the through hole 32 (the cross-sectional shape in a plane parallel to the main surface of the substrate 30) is substantially circular.

  Moreover, as shown in FIG. 10, the shape of the opening 33 on the side surface of the base material 30 is substantially circular. In addition, the shape of the opening 33 on the side surface of the base material 30 can be an arbitrary shape such as an ellipse or a rectangle. That is, the shape of the opening 33 on the side surface of the base material 30 may be any shape as long as the side surface of the base material 30 and the through hole 32 can be spatially connected. Further, in the present embodiment, one opening 33 is formed for one terminal portion 31 as shown in FIG. 10, but a plurality of openings may be formed for one terminal portion 31.

  As shown in FIGS. 10 to 13, the metal coating layer 34 is formed on the inner wall of the through hole 32. Further, as shown in FIGS. 9 and 10, the metal coating layer 34 is formed in a rectangular shape on the front surface and the back surface of the substrate 30. For example, the metal coating layer 34 is a metal plating layer. When the opening 33 is not formed when forming the metal coating layer 34 (see FIG. 14B), the plating solution is supplied into the through hole 32 from the front surface side and the back surface side of the substrate 30. At this time, the metal concentration of the plating solution is high on the front surface side and the back surface side of the base material 30, and is low in the central portion of the through hole 32 in the thickness direction of the base material 30. For this reason, the thickness of the metal coating layer 34 formed on the inner wall of the through hole 32 becomes thinner from the front surface side and the back surface side of the base material 30 toward the central portion in the thickness direction of the base material 30.

  12 is a cross-sectional view taken along the cutting line XII-XII of the terminal structure shown in FIG. 10, and is a cross-sectional view in the vicinity of the front surface (back surface) of the substrate 30. 13 is a cross-sectional view taken along the cutting line XIII-XIII of the terminal structure shown in FIG. As shown in FIGS. 12 and 13, the thickness of the metal coating layer 34 (see FIG. 13) in the vicinity of the central portion in the thickness direction of the base material 30 is the thickness of the metal coating layer 34 in the vicinity of the front surface (back surface) of the base material 30. (See FIG. 12).

  As shown in FIGS. 9 and 11 to 13, the lead member 35 is disposed in the through hole 32. The lead member 35 includes a contact portion 41, and the contact portion 41 is in contact with the metal coating layer 34 in the through hole 32. For example, the cross-sectional shape of the contact part 41 is a substantially circular shape. The cross-sectional shape of the through hole 32 is also substantially circular. Therefore, by bringing the contact portion 41 into contact with the metal coating layer 34 in the through hole 32, the lead member 35 can be fixed accurately and firmly in the through hole 32. Further, when the lead member 35 is disposed in the through hole 32 (that is, before the solder is poured into the through hole 32), the contact portion 41 is brought into contact with the metal coating layer 34, whereby the lead member 35 is It can be arranged in the through hole 32 with high accuracy.

  In addition, the lead member 35 may include a contact portion 42 that contacts the metal coating layer 34 formed on the back surface of the base material 30. When the lead member 35 includes the contact portion 42, the contact portion 42 contacts the metal coating layer 34 when the lead member 35 is inserted to a predetermined position in the through hole 32. It can be arranged in the hole 32 with high accuracy. In this embodiment, the lead members 15 ′ and 15 ″ shown in FIGS. 6 and 7 may be used as the lead member 35.

  The solder 36 is filled in the through hole 32 and electrically connects the lead member 35 and the metal coating layer 34. When the solder 36 is filled into the through hole 32, the solder 36 can be filled from the side surface of the base material 30 through the opening 33. In the present embodiment, the case where the solder 36 is filled in the opening 33 is shown, but it is sufficient that the solder 36 is filled in at least the through hole 32, and the opening 33 is not necessarily filled. There is no need. For example, a part of the opening 33 may be filled with the solder 36.

  Next, the manufacturing method of the terminal structure concerning this Embodiment is demonstrated. 14A to 14H are views for explaining a method of manufacturing the terminal structure according to the present embodiment. When producing the terminal structure according to the present embodiment, first, as shown in FIG. 14A, a through hole 32 penetrating the base material 30 in the thickness direction of the base material 30 is formed. The through hole 32 can be formed using, for example, a drill.

  Next, as shown in FIG. 14B, a metal coating layer 34 is formed on the inner wall of the through hole 32. The metal coating layer 34 can be formed by performing metal plating on the inner wall of the through hole 32. At this time, the metal concentration of the plating solution is high on the front surface side and the back surface side of the base material 30, and is low in the central portion of the through hole 32 in the thickness direction of the base material 30. For this reason, the thickness of the metal coating layer 34 formed on the inner wall of the through hole 32 becomes thinner from the front surface (back surface) of the base material 30 toward the central portion in the thickness direction of the base material 30 (see FIG. 14D). .

  Next, as shown in FIG. 14C (corresponding to the cross-sectional view of FIG. 13; the same applies to FIGS. 14E and 14G) and the opening 33 is formed in the base material 30 as shown in FIG. 14D. The opening 33 is formed so as to penetrate the base material 30 from a part of the side surface of the base material 30 to the through hole 32. For example, as shown in FIG. 14D, the opening 33 is formed at the center in the thickness direction of the substrate 30. The opening 33 can be formed using, for example, a drill.

  Next, as shown in FIGS. 14E and 14F, the lead member 35 is disposed in the through hole 32. For example, the lead member 35 can be disposed in the through hole 32 by inserting the lead member 35 into the through hole 32 from the back surface side of the base material 30. At this time, as shown in FIG. 14F, the lead member 35 can be accurately placed in the through hole 32 by bringing the contact portion 41 into contact with the metal coating layer 34 in the through hole 32. In addition, since the contact portion 42 contacts the metal coating layer 34 when the lead member 35 is inserted to a predetermined position in the through hole 32, the lead member 35 can be accurately disposed in the through hole 32. .

  Next, as shown in FIGS. 14G and 14H, the through hole 32 is filled with the solder 36 from the side surface of the base material 30 through the opening 33, and the lead member 35 and the metal coating layer 34 are electrically connected. To do. In the present embodiment, the case where the solder 36 is filled in the opening 33 is shown, but it is sufficient that the solder 36 is filled in at least the through hole 32, and the opening 33 is not necessarily filled. There is no need. For example, a part of the opening 33 may be filled with the solder 36.

  In addition to filling the through hole 32 from the opening 33, the solder 36 may be filled into the through hole 32 from the front surface side and the back surface side of the base material 30 (filling the solder 36 from the back surface side). If this is the case, the contact portion 42 is not provided). Thus, by filling the through hole 32 with the solder 36 from the front surface side and the back surface side of the base material 30 in addition to the opening portion 33, the solder 36 is more uniform than when the solder 36 is filled only from the opening portion 33. Can be filled in the through hole 32.

  By using the above method, the terminal structure according to this embodiment can be manufactured. In the terminal structure manufacturing method described above, the metal coating layer 34 is formed before the opening 33 is formed. However, the metal coating layer 34 may be formed after the opening 33 is formed. When the metal coating layer 34 is formed after the opening 33 is formed, the plating solution is supplied to the central portion of the through hole 32 through the opening 33, so that the metal coating layer 34 formed on the inner wall of the through hole 32 is formed. The thickness can be made uniform.

  Also in the invention according to the present embodiment, the opening 33 for filling the through hole 32 with the solder 36 is formed on the side surface of the substrate 30. Therefore, even if the substrate is thick, the center of the through hole 32 in the thickness direction of the substrate can be uniformly filled with solder, and the soldering quality can be improved.

  Further, the contact member 41 is formed on the lead member 35, and the contact member 41 is contacted with the metal coating layer 34 in the through hole 32, thereby fixing the lead member 35 to the through hole 32 accurately and firmly. be able to. Further, when the lead member 35 is disposed in the through hole 32 (that is, before the solder is poured into the through hole 32), the contact portion 41 is brought into contact with the metal coating layer 34, whereby the lead member 35 is It can be arranged in the through hole 32 with high accuracy.

  With the invention according to the present embodiment described above, it is possible to provide a terminal structure capable of improving the quality of mounting and a method for manufacturing the terminal structure.

<Embodiment 3>
Next, a third embodiment of the present invention will be described. In the present embodiment, a case where the terminal structure according to the first and second embodiments is applied to a transformer will be described. FIG. 15 is a top view of the transformer according to the present embodiment. FIG. 16 is a side view of the transformer according to the present embodiment. 17 is a cross-sectional view taken along section line XVII-XVII of the transformer shown in FIG. 18 is a cross-sectional view taken along section line XVIII-XVIII of the transformer shown in FIG. 19 is a cross-sectional view taken along the cutting line XIX-XIX of the transformer shown in FIG.

  As shown in FIGS. 15 and 16, the transformer 3 according to the present embodiment includes a transformer main body 50 and a core 52. The transformer body 50 includes a base 51, a primary conductor layer 71, and a secondary conductor layer 72 (see FIGS. 17 to 19).

  The base material 51 is a structure that serves as a base material of the transformer main body 50, and can be configured using an insulating material. The base material 51 includes a primary side terminal 57 at the end of the primary side 55 of the base material 51. Further, the base 51 includes a secondary terminal 58 at the end of the secondary side 56 of the base 51. For example, the transformer main body 50 has a rectangular shape, and the primary side terminal 57 and the secondary side terminal 58 are disposed at respective end portions in the longitudinal direction of the transformer main body 50. The primary side terminal 57 is a terminal connected to the primary side conductor layer 71 (see FIG. 17). The secondary terminal 58 is a terminal connected to the secondary conductor layer 72 (see FIG. 18). The primary side terminal 57 and the secondary side terminal 58 are exposed to the outside of the base material 51 at the ends of the primary side 55 and the secondary side 56 of the base material 51, respectively. Here, the primary terminal 57 and the secondary terminal 58 have the terminal structure described in the first and second embodiments.

  As shown in FIG. 16, the transformer 3 according to the present embodiment is electrically connected to the substrate 60 using lead members 61 and 65. One end 62 of the lead member 61 is electrically connected to the primary side terminal 57, and the other end 63 is electrically connected to the substrate 60. Similarly, one end 66 of the lead member 65 is electrically connected to the primary side terminal 58, and the other end 67 is electrically connected to the substrate 60. Further, for example, at least two primary terminals 57 and the substrate 60 are connected using the lead member 61, and at least two secondary terminals 58 and the substrate 60 are connected using the lead member 65. The transformer 3 can be stably fixed to the substrate 60.

  A convex portion 53 and a concave portion 54 are formed on at least a part of the surface of the base 51 between the primary side terminal 57 and the secondary side terminal 58. In the example shown in FIGS. 15 and 16, convex portions 53 and concave portions 54 are formed on the side surface and the upper and lower surfaces of the base material 51. In other words, the convex portion 53 and the concave portion 54 are formed on the surface provided between the primary side terminal 57 and the secondary side terminal 58 among the surfaces of the base material 51.

  As shown in FIG. 17, the primary conductor layer 71 is provided in the substrate 51 and is electrically connected to the primary terminal 57. The primary conductor layer 71 corresponds to the primary winding of the transformer. For example, the primary conductor layer 71 extends from the primary terminal 57 in the direction of the secondary side 56, and is formed so as to go around the core portion 52 provided in the through hole 59 of the base material 51. At this time, one end of the primary conductor layer 71 is connected to the primary terminal 57_1, and the other end is connected to the primary terminal 57_2. The primary side conductor layer 71 can be configured using a metal material such as copper or aluminum, for example.

  FIG. 19 shows an example in which the transformer main body 50 includes four primary conductor layers 71, but the number of primary conductor layers 71 can be arbitrarily determined. When the plurality of primary conductor layers 71 are provided, the plurality of primary conductor layers 71 can be electrically connected to each other through, for example, through holes. The plurality of primary conductor layers 71 can be electrically connected to each other by, for example, connecting a plurality of primary terminals 57.

  As shown in FIG. 18, the secondary conductor layer 72 is provided in the base material 51 and is electrically connected to the secondary terminal 58. The secondary conductor layer 72 corresponds to the secondary winding of the transformer. For example, the secondary conductor layer 72 is formed so as to extend from the secondary terminal 58 in the direction of the primary side 55 and to make a round of the core portion 52 provided in the through hole 59 of the base material 51. At this time, one end of the secondary conductor layer 72 is connected to the secondary terminal 58_1, and the other end is connected to the secondary terminal 58_2. The secondary conductor layer 72 can be configured using a metal material such as copper or aluminum, for example.

  In FIG. 19, the transformer main body 50 includes the four secondary conductor layers 72 as an example, but the number of the secondary conductor layers 72 can be arbitrarily determined. When a plurality of secondary conductor layers 72 are provided, the plurality of secondary conductor layers 72 can be electrically connected to each other through, for example, through holes. The plurality of secondary conductor layers 72 can be electrically connected to each other by connecting a plurality of secondary terminals 58, for example.

  As shown in FIG. 19, the primary side conductor layer 71 and the secondary side conductor layer 72 are laminated | stacked on each other via the insulating material. In the example shown in FIG. 19, a plurality of primary conductor layers 71 are arranged near the central portion in the stacking direction, and a plurality of secondary conductor layers 72 are arranged on the end sides (upper surface side and lower surface side) in the stacking direction. ing. However, the arrangement of the primary side conductor layer 71 and the secondary side conductor layer 72 shown in FIG. 19 is an example, and the arrangement of the primary side conductor layer 71 and the secondary side conductor layer 72 can be arbitrarily determined.

  Moreover, you may comprise the base material 51 using a some insulator board | substrate. In this case, the transformer main body 50 can be configured by laminating a plurality of primary conductor layers 71, a plurality of insulator substrates, and a plurality of secondary conductor layers 72. As the insulator substrate constituting the base material 51, for example, a glass epoxy substrate, a glass composite substrate, a paper epoxy substrate, a bakelite substrate, or the like can be used.

  In the case where the base material 51 is configured using a plurality of insulator substrates, it is preferable that the respective insulator substrates constituting the base material 51 are made of the same material. By using the same insulator substrate, the resistance of the base material 51 to vibration and impact can be increased. Moreover, by using the same insulator substrate, the thermal expansion coefficient of the insulator substrate which comprises the base material 51 can be made substantially equal, and the temperature cycle characteristic of the base material 51 can be improved.

  The core portion 52 is disposed so as to surround at least a part of the primary conductor layer 71 and at least a part of the secondary conductor layer 72, respectively. The core part 52 can be configured using a magnetic material such as ferrite. By surrounding the primary side conductor layer 71 and the secondary side conductor layer 72 with the core portion 52, the primary side conductor layer 71 and the secondary side conductor layer 72 can be magnetically coupled. As shown in FIGS. 15 and 16, the core portion 52 is provided so as to cover the periphery of the transformer main body portion 50 near the secondary side 56. In addition, as shown in FIGS. 17 and 18, a part of the core portion 52 is inserted through a through hole 59 formed in the base material 51.

  Here, in the transformer according to the present embodiment, the voltage at the primary side terminal 57 is higher than the voltage at the secondary side terminal 58. Therefore, the core part 52 is provided in the secondary side terminal 58 side with a low voltage. In other words, the distance between the end on the primary side terminal 57 side of the core portion 52 and the primary side terminal 57 is longer than the distance between the end on the secondary side terminal 58 side of the core portion 52 and the secondary side terminal 58. .

  As shown in FIG. 19, the core part 52 can be comprised using the core members 52a and 52b whose cross-sectional shape is E type. The core portion 52 can be attached to the transformer main body 50 by sandwiching the transformer main body 50 between the core members 52a and 52b. As shown in FIG. 19, since the primary side conductor layer 71 and the secondary side conductor layer 72 are embedded in the base material 51, they are not in direct contact with the core part 52, and insulation is maintained.

  In the transformer according to the present embodiment, a high voltage (for example, about 15 to 30 kV / mm) is applied to the primary side terminal 57. Here, since the primary side terminal 57 is exposed to the outside of the base material 51, the insulation distance between the primary side terminal 57 and the secondary side terminal 58 (when the core portion 52 is grounded, the primary side terminal 57 It is necessary to ensure an insulation distance between 57 and the core portion 52. Therefore, in the transformer according to the present embodiment, the convex portion 53 and the concave portion 54 are formed on at least a part of the surface of the base 51 between the primary side terminal 57 and the secondary side terminal 58.

  In the present embodiment, since the voltage of the primary side terminal 57 is higher than the voltage of the secondary side terminal 58, the convex portion 53 and the concave portion 54 arranged between the primary side terminal 57 and the core portion 52. The number is larger than the number of the convex part 53 and the recessed part 54 which are arrange | positioned between the secondary side terminal 58 and the core part 52. FIG.

  Since the transformer 3 according to the present embodiment described above includes the terminal structure described in the first and second embodiments, the quality when the transformer 3 is mounted on the substrate 60 can be improved. That is, mounting resistant to vibration and impact can be realized, and the life of the transformer can be extended. Further, the operation of the transformer can be stabilized. Therefore, the reliability of the transformer can be improved. Furthermore, the transformer 3 can be mounted on the substrate 60 with high accuracy.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the configuration of the above embodiment, and those skilled in the art within the scope of the invention of the claims of the present application claims. It goes without saying that various modifications, modifications, and combinations that can be made are included.

1, 2 Terminal structure 3 Transformer 10, 30 Base material 11, 31 Terminal part 12, 32 Through hole 13, 33 Opening part 14, 34 Metal coating layer 15, 35 Lead member 16, 36 Solder 17 Through hole 21, 22, 23 , 41, 42 Contact portion 50 Transformer main body portion 51 Base material 52 Core portion 53 Convex portion 54 Concavity 55 Primary side 56 Secondary side 57 Primary side terminal 58 Secondary side terminal 59 Side conductor layer 72 Secondary conductor layer

Claims (17)

A base material provided with a terminal part;
In the terminal portion, a first through hole penetrating the base material in the thickness direction of the base material,
A metal coating layer formed on the inner wall of the first through hole;
Disposed within said first through hole, and a lead member within the first through hole comprises a first contact portion in contact with the metal coating layer,
Solder that fills the first through hole and electrically connects the lead member and the metal coating layer;
Wherein formed on the side surface of the substrate, Bei give a, an opening capable of filling the solder in the first through hole,
The opening is a part of a second through hole that penetrates the base material in the thickness direction of the base material and forms a space continuous with the first through hole.
Terminal structure. 2. The terminal structure according to claim 1 , wherein a cross-sectional shape of the first through hole in a plane parallel to the main surface of the base material is a substantially circular shape in which a part is connected to the opening. Cross-sectional shape of the first through-hole formed at the center point of the intersection and the first through hole and said opening and said first through hole, the center angle θ is in a large fan-shaped than 180 degrees The terminal structure according to claim 1 . The terminal structure according to any one of claims 1 to 3 , wherein the metal coating layer is formed so as to become thinner from a front surface and a back surface of the base material toward a central portion in a thickness direction of the base material. . The lead member, the first further comprising the metallization layer and the second contact portion which abuts in the through hole, the terminal structure according to any one of claims 1 to 4. The cross-sectional shape of the first and second contact portions in a plane parallel to the main surface of the base material is substantially circular, the diameter of the cross section of the first contact portion, and the second contact The terminal structure according to claim 5 , wherein the diameter of the cross section of the portion is different. The diameter of the cross section of the first contact portion is smaller than the diameter of the cross section of the second contact portion,
The first contact portion is disposed closer to the surface side of the substrate than the second contact portion.
The terminal structure according to claim 6 . The lead member includes a third contact portion that contacts a metal coating layer formed on a part of the back surface of the base material,
The second contact portion is disposed closer to the third contact portion than the first contact portion.
The terminal structure according to claim 7 . A transformer comprising at least one of a primary terminal connected to a primary winding and a secondary terminal connected to a secondary winding includes the terminal structure according to any one of claims 1 to 8 . The transformer according to claim 9 , wherein the transformer is electrically connected to a substrate using the lead member. Forming a first through hole penetrating the substrate in the thickness direction of the substrate;
Penetrating the base material in the thickness direction of the base material, forming a second through hole forming a space continuous with the first through hole,
Forming a metal coating layer on the inner walls of the first and second through holes;
Cutting the base material so that a part of the second through hole is cut to form an opening,
A lead member having a first contact portion that contacts the metal coating layer in the first through hole is disposed in the first through hole,
Filling the first through hole with solder from the side surface of the base material via the opening to electrically connect the lead member and the metal coating layer;
Manufacturing method of terminal structure. The method for manufacturing a terminal structure according to claim 11 , wherein a cross-sectional shape of the first through hole in a plane parallel to the main surface of the base material is a substantially circular shape in which a part is connected to the opening. The second through hole has a cross-sectional shape formed at an intersection of the first through hole and the second through hole and a center point of the first through hole, and a central angle θ is more than 180 degrees. The method for manufacturing a terminal structure according to claim 11 , wherein the terminal structure is formed to have a large fan shape. The terminal structure according to any one of claims 11 to 13 , wherein the metal coating layer is formed so as to become thinner from a front surface to a back surface of the base material toward a central portion in the thickness direction of the base material. Production method. The lead member further includes a second contact portion that contacts the metal coating layer in the first through hole,
Fixing the lead member in the first through hole by bringing the first and second contact portions into contact with the metal coating layer;
The manufacturing method of the terminal structure as described in any one of Claims 11 thru | or 14 . The lead member further includes a third contact portion that contacts a metal coating layer formed on a part of the back surface of the base material,
When the lead member is disposed in the first through hole, the position of the lead member with respect to the first through hole is determined by bringing the third contact portion into contact with the metal coating layer. ,
The manufacturing method of the terminal structure of Claim 15 . Forming a first through hole penetrating the substrate in the thickness direction of the substrate;
Forming a metal coating layer on the inner wall of the first through hole;
Penetrating the base material in the thickness direction of the base material, forming a second through hole forming a space continuous with the first through hole,
Cutting the base material so that a part of the second through hole is cut to form an opening,
A lead member having a first contact portion that contacts the metal coating layer in the first through hole is disposed in the first through hole,
Filling the first through hole with solder from the side surface of the base material via the opening to electrically connect the lead member and the metal coating layer;
Manufacturing method of terminal structure.

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