JP6219624B2 - Manufacturing method of thermal conductive sheet, manufacturing apparatus of thermal conductive sheet, cutting method of resin molded body - Google Patents

Description

  The present invention relates to a method for manufacturing a heat conductive sheet disposed between a heat generating component such as a semiconductor element and a heat radiating member, and a device for manufacturing a heat conductive sheet, and in particular, a molded body of a heat conductive resin composition is cut into a sheet shape. The present invention relates to a device for performing heat treatment, a method for producing a heat conductive sheet produced using the device, and a method for cutting a resin molded body.

  Conventionally, in semiconductor devices mounted on various electric devices such as personal computers and other devices, heat is generated by driving, and when the generated heat is accumulated, driving of the semiconductor devices and peripheral devices are adversely affected. Therefore, various cooling means are used. As a method for cooling electronic components such as semiconductor elements, there are a method in which a fan is attached to the device and the air in the device casing is cooled, and a method in which a heat sink such as a heat radiation fin or a heat sink is attached to the semiconductor device to be cooled Are known.

  When a semiconductor device is cooled by attaching a heat sink, a heat conductive sheet is provided between the semiconductor device and the heat sink in order to efficiently release the heat of the semiconductor device. As a heat conductive sheet, a silicone resin in which a filler such as a heat conductive filler such as carbon fiber is dispersed is widely used (see Patent Document 1).

  These heat conductive fillers have anisotropy of heat conduction. For example, when carbon fiber is used as the heat conductive filler, a heat of about 600 W / m · K to 1200 W / m · K in the fiber direction. When boron nitride is used, it has a thermal conductivity of about 110 W / m · K in the plane direction and about 2 W / m · K in the direction perpendicular to the plane direction. It is known to have.

JP 2010-56299 A JP 2010-50240 A JP 2009-55021 A JP 2011-218504 A

  Here, electronic parts such as CPUs of personal computers tend to increase in heat dissipation year by year as their speed and performance become higher. However, on the contrary, the chip size of a processor or the like has become equal to or smaller than the conventional size due to the advancement of fine silicon circuit technology, and the heat flow rate per unit area is high. Therefore, in order to avoid problems caused by the temperature rise, it is required to more efficiently dissipate and cool electronic components such as CPUs.

  In order to improve the heat dissipation characteristics of the heat conductive sheet, it is required to lower the thermal resistance, which is an index indicating difficulty in transferring heat. In order to lower the thermal resistance, it is effective to improve the adhesion to electronic components that are heat generators and heat radiators such as heat sinks.

  Here, the heat conductive sheet is obtained by curing a heat conductive resin composition containing a heat conductive filler in a binder resin and molding the heat conductive resin composition into a predetermined shape. Then, it is manufactured by slicing the molded body into a sheet.

  However, when slicing a molded body obtained by curing the thermally conductive resin composition, if the sheet cannot be sliced to a uniform thickness, the uneven portion on the surface of the sheet becomes large, and air is supplied to the uneven portion between the electronic component and the heat sink. There was a problem that it was caught and the excellent heat conduction was not utilized.

  In the conventional construction method, for example, Patent Document 1 proposes a heat conductive rubber sheet that is punched and sliced by blades arranged at equal intervals in a direction perpendicular to the longitudinal direction of the sheet. Further, Patent Document 2 proposes a method for obtaining a heat conductive sheet having a predetermined thickness by slicing a laminated body obtained by repeatedly applying and curing by a cutting device having a circular rotary blade. Yes. In Patent Document 3, a laminate in which two or more graphite layers containing anisotropic graphite particles are laminated is oriented at 0 ° with respect to the thickness direction of the sheet from which an expanded graphite sheet is obtained using a metal saw. It has been proposed to cut in such a way (at an angle of 90 ° to the laminated surface).

  However, these proposed cutting methods have a problem that the surface roughness of the cut surface increases, the thermal resistance at the interface increases, and the heat conduction in the thickness direction decreases.

  Patent Document 4 describes a configuration that slices thinly and uniformly by pressing the upper surface of the resin molded body or slicing it while holding the upper surface. However, on the premise of slicing a resin molded body having a certain degree of hardness. In order to obtain a high degree of adhesion between electronic parts, heat sinks, etc., when trying to slice thinly a resin molded body that has been molded more flexibly, there is a problem that the thickness becomes uneven and the thermal resistance increases. is there.

  Furthermore, in patent document 4, since it is slid along the longitudinal direction of a resin molding, a long heat conductive sheet is formed, but it is larger than the shape of a general heat conductive sheet, and further has a product size. It is necessary to cut the wafer. Further, in Patent Document 4, when the end surface is slid with the longitudinal direction of the resin molded body standing, the resin molded body is tilted and sliced because it merely presses or grips the upper end surface. I can't.

Then, this invention provides the manufacturing method of the heat conductive sheet which can slice a flexible resin molding uniformly and stably, the manufacturing apparatus of a heat conductive sheet, and the cutting method of a resin molding. Objective.

In order to solve the above-described problems, a method for producing a heat conductive sheet according to the present invention is obtained by curing a heat conductive resin composition containing a heat conductive filler in a binder resin and molding the heat conductive resin composition into a predetermined shape. The end surface of the resin molded body is supported on a slide surface by a support member, and the end surface of the resin molded body is slid onto the slide surface, whereby the resin molded body is held with a blade whose blade edge faces the slide surface. The method includes a step of slicing into a sheet shape, and slicing the resin molding into a sheet shape while applying ultrasonic vibration to the slide surface .

Moreover, the heat conductive sheet manufacturing apparatus according to the present invention cures a heat conductive resin composition containing a heat conductive filler in a binder resin, and slides the end face of a resin molded body molded into a predetermined shape. A sliding surface, a blade that faces the slide surface, slices the resin molded body, a support member that supports the resin molded body on the slide surface, and the resin that is supported by the support member A slide mechanism that slides the molded body with respect to the blade and a vibration mechanism that applies ultrasonic vibration to the slide surface are provided .

Further, the method for cutting a resin molded body according to the present invention cures the thermally conductive resin composition containing the thermally conductive filler in the binder resin, and the end surface of the resin molded body molded into a predetermined shape, A process of slicing the resin molded body into a sheet shape with a blade having a blade edge facing the slide surface by supporting the slide surface by a support member and sliding the end surface of the resin molded body to the slide surface. And slicing the resin molding into a sheet while applying ultrasonic vibration to the slide surface .

  According to the present invention, by supporting the position above the slice thickness and below the central portion in the height direction of the resin molded body from the end surface sliding on the slide surface on the back surface in the sliding direction of the resin molded body. The resin molded body having flexibility can be prevented from being tilted or swung, and can be sliced with a uniform thickness.

It is sectional drawing which shows the heat conductive sheet manufactured by this invention. It is a side view which shows a slicing apparatus. It is a figure which shows the blade edge | tip of a slice blade, (A) is a double blade, (B) (C) is a single blade, (D) is a figure which shows the state with a shallow angle with respect to the resin molding of both blades. It is a figure for demonstrating the back surface support area | region of a resin molding. It is a top view which shows the state which slides the corner part of a prism-shaped resin molding to a slice blade. It is a top view which shows the state which slides the corner part of a cylindrical resin molding toward a slice blade. It is a figure which shows the support aspect of a resin molding, (A) is a top view which shows the state which supported the back surface and both sides | surfaces, (B) is a top view which shows the state which supported the front surface and the back surface, (C) is a top surface It is a side view which shows the state which supported the back surface. It is a figure which shows the support aspect of a cylindrical resin molding, (A) is a top view which shows the state which supported the back surface and both side surfaces, (B) is a top view which shows the state which supported the front surface and the back surface. It is a top view which shows the slide pattern of a resin molding, (A) is the type which reciprocates a resin molding with respect to one slice blade, (B) is the resin molding which reciprocates with respect to two slice blades The type (C) indicates a type in which the resin molded body is moved around the two slice blades.

Hereinafter, the manufacturing method of the heat conductive sheet to which this invention was applied, the manufacturing apparatus of a heat conductive sheet, and the cutting method of a resin molding are demonstrated in detail, referring drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  A heat conductive sheet 1 manufactured according to the present invention radiates heat generated by an electronic component such as a semiconductor element 4. As shown in FIG. 1, a heat radiating component such as a heat sink 5 and a heat spreader 2 and an electronic component 4 It is sandwiched between the two. This heat conductive sheet 1 is manufactured by slicing a resin molded body formed by curing a heat conductive resin composition containing a heat conductive filler in a binder resin into a sheet shape by a slicing apparatus 10 described later. The

  Specifically, the manufacturing process of the heat conductive sheet 1 first prepares a heat conductive resin composition containing a binder, a heat conductive filler, and a filler. Next, the prepared heat conductive resin composition is molded into a predetermined shape such as a prism or cylinder. Next, after hardening the obtained resin molding, the heat conductive sheet 1 is obtained by slicing so that a blade cut | disconnects perpendicularly | vertically with respect to the resin molding by the slicing apparatus 10 mentioned later. Since the slicing apparatus 10 can slice the resin molded body with a uniform thickness, the thermal conductive sheet 1 having low thermal resistance at the interface and high thermal conductivity in the thickness direction of the sheet can be manufactured.

[binder]
There is no restriction | limiting in particular as said binder, According to the performance requested | required of a heat conductive sheet, it can select suitably, For example, a thermoplastic polymer or a thermosetting polymer is mentioned. Examples of the thermoplastic polymer include thermoplastic resins, thermoplastic elastomers, and polymer alloys thereof.

  There is no restriction | limiting in particular as a thermoplastic resin, According to the objective, it can select suitably, For example, ethylene-alpha-olefin copolymers, such as polyethylene, a polypropylene, an ethylene propylene copolymer; Polymethylpentene, polychlorination Fluorine resins such as vinyl, polyvinylidene chloride, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyacetal, polyvinylidene fluoride, polytetrafluoroethylene; polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, Polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer (ABS) resin, polyphenylene ether, modified polyphenylene ether, aliphatic polyamide , Aromatic polyamides, polyamideimide, polymethacrylic acid or its ester, polyacrylic acid or its ester, polycarbonate, polyphenylene sulfide, polysulfone, polyethersulfone, polyethernitrile, polyetherketone, polyketone, liquid crystal polymer, silicone resin And ionomers. These may be used individually by 1 type and may use 2 or more types together.

  Examples of the thermoplastic elastomer include a styrene-based thermoplastic elastomer such as a styrene-butadiene copolymer or a hydrogenated polymer thereof, a styrene-isoprene block copolymer or a hydrogenated polymer thereof, an olefin-based thermoplastic elastomer, and a vinyl chloride-based thermoplastic. Examples thereof include elastomers, polyester-based thermoplastic elastomers, polyurethane-based thermoplastic elastomers, and polyamide-based thermoplastic elastomers. These may be used individually by 1 type and may use 2 or more types together.

  Examples of the thermosetting polymer include crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin, benzocyclobutene resin, phenol resin, unsaturated polyester, diallyl phthalate resin, silicone resin, polyurethane, polyimide silicone, thermosetting polyphenylene ether. And thermosetting modified polyphenylene ether. These may be used individually by 1 type and may use 2 or more types together.

  Examples of the crosslinked rubber include natural rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene propylene rubber, chlorinated polyethylene, chlorosulfonated polyethylene, butyl rubber, halogenated butyl rubber, fluorine rubber, and urethane rubber. Acrylic rubber, polyisobutylene rubber, silicone rubber and the like. These may be used individually by 1 type and may use 2 or more types together.

  Among these, silicone resin is particularly preferable from the viewpoints of excellent moldability and weather resistance, and adhesion and followability to electronic components.

  The silicone resin is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include addition reaction type liquid silicone rubber and heat vulcanizable type millable type silicone rubber using peroxide for vulcanization. . Among these, an addition reaction type liquid silicone rubber is particularly preferable as a heat radiating member of an electronic device because adhesion between a heat generating surface of an electronic component and a heat sink surface is required.

[Thermal conductive filler]
There is no restriction | limiting in particular as a shape of a heat conductive filler, According to the objective, it can select suitably, For example, scale shape, plate shape, cylindrical shape, prismatic shape, elliptical shape, flat shape etc. are mentioned. Among these, a fibrous flat shape is particularly preferable. Examples of the filler having anisotropy include boron nitride (BN) powder, graphite, and carbon fiber. Among these, fibrous carbon fibers are particularly preferable.

  As the carbon fiber, for example, one synthesized by pitch system, PAN system, arc discharge method, laser evaporation method, CVD method (chemical vapor deposition method), CCVD method (catalyst chemical vapor deposition method) or the like is used. it can. Among these, pitch-based carbon fibers and carbon fibers obtained by graphitizing polybenzazole are particularly preferable from the viewpoint of heat conduction.

  The carbon fiber can be used by subjecting part or all thereof to a surface treatment, if necessary. Examples of surface treatment include oxidation treatment, nitridation treatment, nitration, sulfonation, or adhesion or bonding of metals, metal compounds, organic compounds, etc. to the surface of functional groups or carbon fibers introduced to the surface by these treatments. And the like. Examples of the functional group include a hydroxyl group, a carboxyl group, a carbonyl group, a nitro group, and an amino group.

  The average long axis length (average fiber length) of the carbon fibers is preferably 30 μm or more, and more preferably 40 μm to 6 mm. When the average major axis length is less than 30 μm, the fibrous form may not be sufficiently obtained, and the thermal resistance may be increased. The average minor axis length of the carbon fiber is preferably 5 μm to 15 μm.

Here, the average major axis length and the average minor axis length of the carbon fiber can be measured, for example, with a microscope, a scanning electron microscope (SEM), or the like. The tap density of the carbon fiber in the range of 0.4g ^/ cm ³ ~1.5g ^/ cm 3 are preferred. If the tap density is small, the amount of carbon fiber that can be filled is small, so the thermal conductivity may be small. One type of carbon fiber may be used, or two or more types of carbon fibers may be mixed and used after adjusting the tap density so as to be in the above range.

  As for content in the heat conductive resin composition of a heat conductive filler, 15 volume%-40 volume% are preferable. If the content of the heat conductive filler is less than 15% by volume, sufficient heat conductivity may not be imparted to the resin molded body. If it exceeds 40% by volume, the moldability of the resin molded body and The orientation may be affected.

[filler]
There is no restriction | limiting in particular about the shape, material, average particle diameter, etc. as a filler, According to the objective, it can select suitably. There is no restriction | limiting in particular as a shape, According to the objective, it can select suitably, For example, spherical shape, elliptical spherical shape, lump shape, granular form, flat shape, needle shape etc. are mentioned. Among these, spherical and elliptical shapes are preferable from the viewpoint of filling properties, and spherical shapes are particularly preferable.

  Examples of the material for the filler include aluminum nitride, silica, alumina, boron nitride, titania, glass, zinc oxide, silicon carbide, silicon (silicon), silicon oxide, aluminum oxide, and metal particles. These may be used individually by 1 type and may use 2 or more types together. Among these, alumina, boron nitride, aluminum nitride, zinc oxide, and silica are preferable, and alumina and aluminum nitride are particularly preferable from the viewpoint of thermal conductivity.

  The filler may be subjected to a surface treatment. When the surface treatment is performed with a coupling agent, the dispersibility is improved and the flexibility of the heat conductive sheet 1 is improved. Moreover, the surface roughness obtained by slicing can be further reduced. The average particle diameter of the filler is preferably 0.5 μm to 10 μm. If the average particle size is less than 0.5 μm, it may cause curing failure. If it exceeds 10 μm, the orientation of the carbon fibers may be hindered and the thermal conductivity of the cured product may be lowered.

  The average particle diameter of the filler can be measured by, for example, a particle size distribution meter or a scanning electron microscope (SEM).

  The content of the filler in the heat conductive composition is preferably 20% by volume to 60% by volume.

  For the heat conductive resin composition, if necessary, for example, a solvent, a thixotropic agent, a dispersant, a curing agent, a curing accelerator, a retarder, a slight tackifier, a plasticizer, a flame retardant, an antioxidant. In addition, other components such as a stabilizer and a colorant can be blended.

[Manufacturing process of heat conduction sheet]
Subsequently, the manufacturing process of a heat conductive sheet is demonstrated in detail. First, a heat conductive resin composition is prepared by uniformly mixing a binder, a heat conductive filler and a filler, and other additives such as a solvent by a known method.

  Next, the adjusted heat conductive resin composition is formed into a resin molded body having a predetermined shape by an extrusion molding method or a mold molding method. The extrusion molding method and the mold molding method are not particularly limited. Among various known extrusion molding methods and mold molding methods, the viscosity of the heat conductive resin composition, the characteristics required for the heat conductive sheet 1, and the like. Depending on the situation, it can be adopted as appropriate.

  There is no restriction | limiting in particular about a shape, a magnitude | size, a material, etc. as a type | mold, According to the objective, it can select suitably, A hollow cylinder shape, a hollow prism shape, etc. are mentioned as a shape. As a magnitude | size, it can select suitably according to the magnitude | size of the resin molding to manufacture and the heat conductive sheet 1. FIG. In the case of a hollow prismatic mold, for example, the cross-sectional size is 0.5 to 15 cm square and the length can be 20 to 40 cm. Examples of the material include stainless steel.

  When extruding the thermally conductive resin composition from the die in the extrusion molding method, or when press-fitting the thermally conductive resin composition into the mold in the mold molding method, the binder resin flows and follows the flow direction. Some fibrous fillers are oriented, but many are randomly oriented.

  When a slit is attached to the tip of the die, the fibrous filler tends to be easily oriented in the extrusion direction at the center with respect to the width direction of the extruded molded body block. On the other hand, the fibrous filler tends to be randomly oriented in the peripheral portion with respect to the width direction of the molded body block due to the influence of the slit wall.

  Next, the obtained resin molded body is cured. The curing method is not particularly limited and may be appropriately selected depending on the purpose. However, when a thermosetting resin such as a silicone resin is used as the binder, it is preferably cured by heating.

  Examples of the apparatus used for heating include a far infrared furnace and a hot stove. There is no restriction | limiting in particular as heating temperature, According to the objective, it can select suitably, For example, it carries out at 40 to 150 degreeC.

  There is no restriction | limiting in particular in the softness | flexibility of the silicone resin molding which the silicone resin hardened, According to the objective, it can select suitably, For example, it is preferable to set it as Asker C hardness 30-80. Furthermore, in order to improve the adhesiveness of the heat conductive sheet 1 to the adherend and to reduce the thermal resistance, it is necessary to be relatively flexible, and it is more preferable that the Asker C hardness is 30 to 50. . The flexibility of the resin molded body can be adjusted by, for example, the crosslinking density of silicone, the filling amount of the heat conductive filler, and the like.

  Next, the cured resin molded body is sliced into a sheet by a slicing apparatus 10 described below, whereby the heat conductive sheet 1 is formed.

[Slicing device]
As shown in FIG. 2, the slicing device 10 includes a support base 11 on which a resin molded body 3 formed by molding and curing a heat conductive resin composition into a predetermined shape is slidably mounted, and a back surface of the support base 11. Further, the blade edge 12a is exposed on the slide surface 11a on which the end surface of the resin molded body 3 slides, the slicing blade 12 that slices the end surface of the resin molded body 3, and the support member 13 that supports the resin molded body 3 on the slide surface 11a. And a slide mechanism 14 for sliding the resin molded body 3 supported by the support member 13 with respect to the slice blade 12.

  In the slicing device 10, the end surface 3a of the resin molded body 3 slides on the slide surface 11a of the support base 11, so that the end surface of the resin molded body 3 is sandwiched by the slide blade 12 facing the slide surface 11a. Slice as you cut.

  The support base 11 is formed in a flat plate shape, and has one surface as a slide surface 11a on which the resin molded body 3 slides. The support table 11 is provided with a slicing blade 12 on the other surface side, and is formed with an opening 15 for projecting the cutting edge 12a of the slicing blade 12 onto the slide surface 11a. Further, in the resin molded body 3, when the end surface 3a slides on the slide surface 11a, the thermal conductive filler that appears on the end surface 3a is dropped from the end surface 3a every time it is sliced or buried in the binder resin. Therefore, the heat conductive sheet 1 formed by slicing the end surface 3a does not show a heat conductive filler such as carbon fiber on the sheet surface, and can exhibit slight adhesiveness due to the binder resin.

  As shown in FIG. 3, the cutting edge 12 a of the slicing blade 12 faces the slide surface 11 a from the opening 15 so as to intersect with the sliding direction of the resin molded body 3 at a predetermined angle. The blade edge 12a may be either a double blade (FIG. 3A) or a single blade (FIGS. 3B and 3C). In addition, since the end surface 3a of the resin molding 3 will incline when the angle which applies a double-edged blade with respect to the resin molding 3 is too shallow (FIG. 3 (D)), as shown in FIG. It is necessary to incline the slicing blade 12 so that the cutting edge 12a is parallel to the end surface 3a of the resin molded body 3. In this case, the inclination of the slicing blade 12 is half the angle of the blade edge 12a of both blades.

  Further, the slice blade 12 is provided with an ultrasonic transducer 16 and can slice the resin molded body 3 while applying ultrasonic vibration, as will be described later. The ultrasonic transducer 16 can adjust the transmission frequency and amplitude, and the transmission frequency is preferably adjusted in the range of 10 kHz to 100 kHz and the amplitude in the range of 10 μm to 100 μm.

  Moreover, the slice blade 12 needs to have the shape of the blade edge | tip 12a which can transmit an ultrasonic wave, and in the case of a single blade, it is necessary to make it within 40 mm in width. This is because the single-edged blade is not a non-target shape, and if the width exceeds 40 mm, the oscillation becomes unstable. In the case of a double-edged blade, since it has a symmetrical shape, it can be formed with a width exceeding 40 mm.

  The support member 13 that supports the resin molded body 3 includes a back wall 20 that supports the back side of the resin molded body 3 in the sliding direction. The rear wall 20 stabilizes the flexible resin molded body 3 when the resin molded body 3 is slid and sliced by the slicing blade 12, and can be stably sliced with a uniform thickness. is there. The back wall 20 is positioned at least above the slice thickness from the end surface 3a sliding on the slide surface 11a of the resin molded body 3 and below the center in the height direction orthogonal to the slide surface 11a of the resin molded body 3. Support.

  The back wall 20 does not impede slicing by supporting the upper side of the slice thickness from the end surface 3 a in contact with the slide surface of the resin molded body 3. Further, the back wall 20 supports a position below the central portion in the height direction of the resin molded body 3, so that the resin molded body 3 tilts when the slide surface 11 a is slid or sliced by the slicing blade 12. Alternatively, it is possible to prevent the end surface 3a from sliding on the slide surface 11a.

  That is, as shown in FIG. 2, the slicing apparatus 10 slides one end surface 3a in the longitudinal direction of the resin molded body 3 formed in a prismatic or columnar shape on the slide surface 11a. In addition, the resin molded body 3 is formed flexibly with an Asker C hardness of 30 to 80, for example, in order to improve the adhesion of the heat conductive sheet 1 to the adherend and reduce the thermal resistance. Therefore, if the resin molded body 3 is simply slid while being pressed from the upper surface, the resin molded body 3 tilts or swings, so that the end surface 3a cannot be applied straight to the slicing blade 12, and the heat conduction is uneven. Sheet 1 will be manufactured.

  Therefore, the support member 13 is above the slice thickness from the end surface 3a of the back surface 3b of the resin molded body 3 sliding on the slide surface 11a by the back wall 20 and from the center in the height direction of the resin molded body 3. By supporting the lower position, the resin molded body 3 can be prevented from tilting or swinging and sliced with a uniform thickness. In addition, by stably holding and slicing the resin molded body 3, the surface roughness of the slicing surface can be reduced, the thermal resistance on the sheet surface is low, and the thermal conductive sheet 1 having high thermal conductivity is obtained. Can be manufactured.

  Further, the back wall 20 does not need to support the resin molded body 3 over the entire area below the slice thickness and below the central portion in the height direction of the resin molded body 3, and supports any position in this region. If you do. Of course, the back wall 20 may support the entire region below the slice thickness and below the central portion in the height direction of the resin molded body 3. Moreover, as shown in FIG. 2, you may support the back wall 20 from the upper part of the height direction of the resin molding 3 to the position below a center part continuously.

[Supporting area for the length in the sliding direction]
Further, the back wall 20 may support a position corresponding to a length of 20% or more of the length in the sliding direction of the resin molded body 3 from the end surface 3a in contact with the slide surface 11a of the resin molded body 3. . For example, as shown in FIG. 4, when the front surface 3c of the prism-shaped resin molded body 3 is slid with the front surface 3c facing the slice blade 12, the back wall 20 has a side surface of the resin molded body 3 with the back surface 3b from the end surface 3a. The position of the region R having a height corresponding to 20% or more of the length L in the sliding direction of 3d and 3e or the entire surface of the region R is supported.

  The ease of tilting of the resin molded body 3 having flexibility is determined by the length of the resin molded body 3 in the sliding direction and the position where the rear side in the sliding direction is supported. That is, when the height supported from the end surface 3a is the same, the resin molded body 3 is not easily tilted if the length in the sliding direction is long, and is easily tilted if the length is short. Therefore, tilting or bending is prevented by supporting at least one position of a region R having a height corresponding to 20% or more of the length L in the sliding direction of the resin molded body 3 by the back wall 20. A stable slice with a uniform thickness becomes possible. In addition, in order to ensure the stable slide, the support position of the back wall 20 is any one of the regions R having a height corresponding to 20% to 50% of the length L in the sliding direction of the resin molded body 3. It is more preferable to support this position or the entire surface of the region R.

  Here, the length L in the sliding direction of the resin molded body 3 is the maximum length in the sliding direction of the resin molded body, and slides with the front surface 3c of the prismatic resin molded body 3 facing the slice blade 12. When doing, it means the length of the side surfaces 3c and 3d in the sliding direction. In addition, as shown in FIG. 5, when the front surface 3 c is inclined with respect to the slicing blade 12 and is slid toward the corner portion 6 where the front surface 3 c and one side surface 3 d are in contact, the corner portion 6 directed toward the slicing blade 12 is used. And the length between the corner portion 7 and the back surface 3b opposite to the corner portion 6 and the other side surface 3e. Further, as shown in FIG. 6, in the case of a columnar resin molded body 3, it means the diameter of the resin molded body 3.

[Hold two opposite positions]
In the configuration shown in FIG. 2, the support member 13 also supports the front surface 3 c and both side surfaces 3 d and 3 e in the sliding direction S of the resin molded body 3. The support member 13 supports the resin molded body 3 by the front surface 3c and the back surface 3b, or both side surfaces 3d and 3e, thereby sandwiching at least two positions facing each other, thereby holding the resin molded body 3 on the slice surface 11a side. Is pressed. The pressing pressure at this time is preferably 0.005 MPa to 0.5 MPa. Further, as shown in FIG. 7A, the support member 13 may continuously form the back wall 20 and the side walls 21 and 22 that support the side surfaces 3 d and 3 e of the resin molded body 3. Further, as shown in FIG. 7B, the support member 13 may sandwich the resin molded body 3 between the back wall 20 and the front wall 23 that supports the front surface 3c. As shown in FIG. 7C, the support member 13 may be pressed toward the slide surface 11a by pressing the upper end surface 3f opposite to the end surface 3a of the resin molded body 3. The pressing pressure at this time is also preferably 0.005 MPa to 0.5 MPa.

  8A, when the resin molded body 3 is formed in a columnar shape, the support member 13 has a back wall that continues in an arc shape from the back side in the sliding direction S to the opposite side surfaces. It may be clamped by forming 24, and as shown in FIG. 8B, it is clamped by forming arcuate back wall 25 and front wall 26 on the back side and front side in the sliding direction S, respectively. May be.

  The support member 13 is moved by the slide mechanism 14 to slide the resin molded body 3 on the slide surface 11a in the direction of arrow S in FIG. The slide mechanism 14 can be formed using a known drive mechanism. For example, the slide mechanism 14 includes a guide screw provided along the slide direction S, and a drive motor that is provided at one end of the guide screw and rotationally drives the guide screw, and a rack in which the support member 13 is inserted into the guide screw. It is connected and moved along the axial direction of the guide screw according to the rotation.

  Here, when the resin molded body 3 is formed in a prismatic shape, it may be sliced with the front surface 3c facing the slicing blade 12, but as shown in FIG. It is preferable to incline the front surface 3c and slide it toward the corner portion 6 where the front surface 3c and the one side surface 3d are in contact.

  When the front surface 3c of the resin molded body 3 formed in a prismatic shape is slid while facing the slicing blade 12 (see FIG. 4), the blade tip 12a has resistance from the entire side edge where the front surface 3c and the end surface 3a are in contact. In addition, a certain amount of force is required to enter the end face 3a. Therefore, when thinly slicing, the resin molded body 3a may be deformed such as being tilted or curved. On the other hand, when the corner portion 6 where the front surface 3c and the one side surface 3d are in contact with the slicing blade 12 is slid toward the edge portion 3a, resistance is applied to the blade edge 12a from one point of the corner portion 6, and therefore the end surface 3a can be easily formed with a small force. Can be entered. Thereby, since a sword can be performed smoothly, the resin molding 3 can be sliced stably and can be sliced to uniform thickness.

  At this time, the back wall 20 of the support member 13 is the back side of the resin molded body 3 in the sliding direction with respect to the slide blade 12, that is, the back surface 3b and the other side surface 3e opposite to the side surface 3d facing the slice blade 12. Supports two surfaces. As described above, the region where the back wall 20 supports the back surface 3b and the other side surface 3e is higher than the slice thickness from the end surface 3a sliding on the slide surface 11a of the resin molded body 3, and the slide surface of the resin molded body 3 It is a position below the central part of the height direction orthogonal to 11a.

  Further, the support member 13 supports the front surface 3c and / or one side surface 3d, thereby holding the opposite side surfaces of the resin molded body 3 together with the back surface 3b or the other side surface 3e, and applying a downward pressing force. To do.

[Slide direction]
As shown in FIG. 9A, the slicing device 10 reciprocates the resin molded body 3 on one slicing blade 12 to move the resin molded body 3 when it is slid in the direction of arrow S in FIG. You may make it slice.

  Further, as shown in FIG. 9B, the slicing device 10 is provided with two slicing blades 12 arranged in the sliding direction with the blade edges 12a facing in opposite directions, and the resin molded body 3 is provided with these two slicing blades. The resin molded body 3 may be sliced each time it is slid in the directions of arrows S1 and S2 in FIG. In this case, the support member 13 is provided with a pair of back walls 20 that support the back surfaces of the resin molding 3 in the sliding directions S1 and S2, that is, both surfaces in the sliding direction. In the configuration shown in FIG. 9B, since the resin molded body 3 is equally sliced from both sides in the sliding direction, one side of both sides in the sliding direction is not reduced and the slicing proceeds. Also, the shape of the resin molded body 3 is stabilized, and can be sliced to an equal thickness.

  In addition, as shown in FIG. 9C, the slicing device 10 is provided with two slicing blades 12 arranged in a direction perpendicular to the sliding direction with the blade edges 12a facing away from each other, You may make it drive round so that it may slide on the two slice blades 12. FIG.

  In addition, it is preferable that the supporting member 13 moves the resin molding 3 relatively to the slide surface 11a side from the back wall 20 at a predetermined interval according to the slicing process of the resin molding 3. That is, since the support member 13 supports the back surface 3b of the resin molded body 3 by the back wall 20, and sandwiches the two opposite side surfaces and presses them toward the slide surface 11a, the slicing process proceeds. The back wall 20 and other support walls are close to the slice surface 11a and cannot be supported above the slice thickness from the end surface 3a of the resin molded body 3. Therefore, it is preferable that the support member 13 regularly adjusts the height supported by the resin molded body 3 and always supports the end surface 3a of the resin molded body 3 above the slice thickness.

  The support height of the resin molded body 3 by the support member 13 can be adjusted by providing a height adjustment mechanism in the slide mechanism 14 that drives the support member 13, for example. This type of height adjusting mechanism can be realized by using a known mechanism such as providing a guide shaft in the height direction of the resin molded body 3.

  Alternatively, the adjustment of the support height of the resin molded body 3 by the support member 13 is, for example, provided with a mechanism for pressing down the upper end surface 3f of the resin molded body, and the resin molded body 3 is relatively back as the slice progresses. You may make it descend | fall with respect to the wall 20. FIG.

[Ultrasonic transducer]
The slicing device 10 may slice the resin molded body 3 while applying longitudinal vibration by the ultrasonic vibrator 16 provided on the slicing blade 12. In addition, the slicing device 10 is provided with an ultrasonic transducer 16 in the vicinity of the opening 15 of the support base 11 to slice the resin molded body 3 while applying longitudinal vibration to the support base 11 from the side opposite to the slide surface 11a. Also good. The slicing device 10 may apply either one or both of the ultrasonic vibration to the slice blade 12 and the ultrasonic vibration to the support base 11 at the same time.

  By applying ultrasonic vibration to the slicing blade 12, the friction of the slicing blade 12 with respect to the resin molded body 3 can be reduced, and the end surface 3a of the resin molded body 3 having flexibility during slicing can be curled, It is possible to prevent the resin molded body 3 from adhering to 12. Further, by reducing the friction of the sliced blade 12 with respect to the resin molded body 3, even in the resin molded body 3 having flexibility, the surface roughness of the slice surface can be reduced, the sheet surface is smoother, and the thermal resistance is increased. Low thermal conductive sheet 1 can be produced.

  Further, by applying ultrasonic vibration to the support base 11, friction between the end surface 3a of the resin molded body 3 and the slide surface 11a can be reduced, and the resin molded body 3 is pressed against the slide surface 11a. Can slide smoothly.

  In addition, in the slicing device 10, the slicing blade 12 generates heat due to frictional heat at the time of slicing the resin molded body 3, whereby the resin molded body 3 becomes soft and the cutting performance deteriorates, or the slicing blade 12 becomes hot. In order to prevent the slicing apparatus 10 from stopping, the resin molded body 3 and the slicing blade may be sliced while being cooled. The cooling method for the resin molded body 3 can be performed, for example, by a method using dry ice, and the cooling method for the slice blade 12 can be performed, for example, by spraying alcohol or air on the blade edge 12a.

  Next, a first embodiment of the present invention will be described. In the first embodiment, a resin molded body sample is formed, and the support form is changed and sliced into a sheet shape by the above-described slicing apparatus or a conventional construction method. Whether or not slicing is possible, the uniformity of the thickness of the manufactured heat conduction sheet And thermal resistance were measured and evaluated.

The uniformity of the slice thickness can be measured with a laser microscope. Moreover, the thermal resistance was measured on the conditions of the load of 1.0 kgf / cm < ² > using the thermal conductivity measuring apparatus based on ASTM-D5470.

[Example 1]
In Example 1, 45% by volume of alumina particles (thermal conductive particles: manufactured by Denki Kagaku Kogyo Co., Ltd.) having an average particle diameter of 5 μm, which are coupled to a two-component addition reaction type liquid silicone resin with a silane coupling agent, Then, 23% by volume of pitch-based carbon fiber having an average fiber length of 100 μm (thermal conductive fiber: manufactured by Nippon Graphite Fiber Co., Ltd.) was dispersed to prepare a silicone resin composition (thermal conductive resin composition). The obtained silicone resin composition was extruded into a rectangular parallelepiped mold having a PET film peeled on the inner wall and cured in an oven at 100 ° C. for 6 hours to form a silicone molded body (cross section: 65 mm × 65 mm). , Length: 80 mm). The obtained silicone resin molded body was heated in an oven at 100 ° C. for 1 hour, and then one end surface in the longitudinal direction was supported on the slicing surface of the slicing device described above to obtain a heat conductive sheet having a thickness of 0.2 mm.

  In Example 1, the supporting member of the slicing device provides a downward pressing force (0.05 MPa) by supporting the upper end surface of the silicone resin molded body, and the back surface of the silicone resin molded body from the upper end side to the lower end surface. Up to 15 mm above was supported. That is, in Example 1, the position above the slice thickness (0.2 mm) and below the center part (40 mm) in the height direction of the silicone resin molded body is supported.

[Example 2]
In Example 2, aluminum nitride particles having an average particle diameter of 1 μm, which are coupled with a silane coupling agent in addition to 19 volume% alumina particles and 29 volume% pitch-based carbon fibers in a two-component addition reaction type liquid silicone resin. (Thermal conductive particles: manufactured by Tokuyama Corporation) 22% by volume was dispersed. Further, the obtained silicone resin molded body was sliced while being pressed against the slide surface at 0.05 MPa to produce a heat conductive sheet having a thickness of 0.1 mm. Other conditions are the same as those in the first embodiment.

[Example 3]
In Example 3, the obtained silicone resin molded body was moved by 30 cm on the slicing surface while being pressed at 0.05 MPa to smooth the end surface, and then sliced. Other conditions are the same as those in Example 2.

[Example 4]
In Example 4, after obtaining a heat conductive sheet having a thickness of 0.11 mm, it was pressed at 0.25 MPa through a spacer having a thickness of 0.1 mm. Other conditions are the same as those in Example 3. In Example 4, the thermal resistance in the low load region was reduced by pressing.

[Example 5]
In Example 5, after obtaining a heat conductive sheet having a thickness of 0.11 mm, it was pressed at 0.25 MPa through a spacer having a thickness of 0.1 mm. Other conditions are the same as those in Example 3. In Example 5, the thermal resistance in the low load region was reduced by pressing.

[Example 6]
In Example 6, aluminum nitride particles having an average particle diameter of 1 μm, which are coupled with a silane coupling agent in addition to 20 volume% alumina particles and 23 volume% pitch-based carbon fibers in a two-component addition reaction type liquid silicone resin. (Thermal conductive particles: manufactured by Tokuyama Co., Ltd.) 23% by volume was dispersed. The obtained silicone resin molded body was moved 30 cm on the slicing surface while being pressed at 0.05 MPa, the end surface was smoothed, and then sliced to produce a heat conductive sheet having a thickness of 2.1 mm. Other conditions are the same as those in Example 2.

[Example 7]
In Example 7, after obtaining a heat conductive sheet having a thickness of 2.1 mm, it was pressed at 0.25 MPa through a spacer having a thickness of 2.0 mm. Other conditions are the same as in Example 6. In Example 7, as a result of pressing, the thermal resistance in the low load region was smaller than that of the heat conductive sheet according to Example 6.

[Example 8]
In Example 8, the obtained silicone resin molded body was moved 30 cm on the slicing surface while being pressed at 0.05 MPa, the end surface was smoothed, and then sliced to obtain a thermal conductivity of 0.5 mm in thickness. A sheet was produced. The obtained heat conductive sheet was pressed at 0.25 MPa without a spacer. Other conditions are the same as in Example 6.

[Comparative Example 1]
In Comparative Example 1, slicing with a slicing device was attempted without fixing the silicone resin molded body produced under the same production conditions as in Example 1.

[Comparative Example 2]
In Comparative Example 2, only the upper end surface was supported with respect to the silicone resin molded body manufactured under the same manufacturing conditions as in Example 1, and slicing with a slicing device was attempted while applying downward pressing force (0.05 MPa). .

[Comparative Example 3]
In Comparative Example 3, an attempt was made to slice with a slicing device, supporting only the upper end surface and the upper side of the center in the height direction of the back surface with respect to the silicone resin molded body produced under the same production conditions as in Example 1.

[Comparative Example 4]
In Comparative Example 4, an attempt was made to slice with a meat slicer (rotary blade) (Remacom Electric Slicer: RSL-A19) while pressing the end surface of the silicone resin molded body manufactured under the same manufacturing conditions as in Example 1 against the slicing surface. .

[Comparative Example 5]
In Comparative Example 5, the cutting with a pressing cutter was attempted without pressing the end face of the silicone resin molded body manufactured under the same manufacturing conditions as in Example 1.

  As shown in Table 1, in Examples 1 to 8, any heat conductive sheet could be sliced to a uniform thickness, and the thermal resistance was low. In Examples 1-8, while applying the downward pressing force (0.05 MPa) by supporting the upper end surface of the silicone resin molded body, the back surface of the silicone resin molded body is lower than the lower end surface from the upper end side. By supporting up to 15 mm above. That is, in Example 1, since the position above the slice thickness (0.2 mm) and below the central portion (40 mm) in the height direction of the resin molding 3 is supported, the silicone resin molding tilts. This is because it was possible to slide on the slide surface without doing.

  On the other hand, in Comparative Example 1, the silicone resin molded body was not fixed and could not be sliced. Further, in Comparative Example 2, since the back surface of the silicone resin molded body was not supported, the silicone resin molded body collapsed before reaching the slicing blade, and could not be sliced.

  In Comparative Example 3, since only the upper side from the center in the height direction of the back surface of the silicone resin molded body was supported, the silicone resin molded body tilted during slicing, and the slice thickness became non-uniform. In the slicing method according to Comparative Example 4 and Comparative Example 5, the hardness of the silicone resin molded body was too soft and the slice thickness became non-uniform.

  Next, a second embodiment of the present invention will be described. In the second embodiment, a resin molded body sample is formed, sliced into slices by changing the application conditions of ultrasonic vibration to the slice thickness, slice blade or slide surface, whether or not the slice is possible, and the manufactured heat conduction sheet The thickness variation was measured and evaluated. Variation in the thickness of the heat conductive sheet can be measured with a laser microscope.

[Example 9]
In Example 9, 20 parts by volume of alumina particles (thermal conductive particles: manufactured by Denki Kagaku Kogyo Co., Ltd.) having an average particle size of 4 μm, which were coupled to a two-component addition reaction type liquid silicone resin with a silane coupling agent, 20% by volume of pitch-based carbon fiber (thermal conductive fiber: manufactured by Nippon Graphite Fiber Co., Ltd.) having an average fiber length of 150 μm and an average shaft diameter of 9 μm, and an aluminum nitride particle having an average particle diameter of 1 μm coupled with a silane coupling agent (Thermal conductive particles: manufactured by Tokuyama Co., Ltd.) 20% by volume was dispersed to prepare a silicone resin composition (thermally conductive resin composition). The obtained silicone resin composition was extruded into a rectangular parallelepiped mold having a release-treated polyethylene terephthalate film attached to the inner wall and cured in an oven at 100 ° C. for 6 hours to form a silicone molded body (cross section: 65 mm). X 65 mm, length: 80 mm). The obtained silicone resin molded body was heated in an oven at 100 ° C. for 1 hour, and then one end surface in the longitudinal direction was supported on the slicing surface of the slicing device described above to obtain a heat conductive sheet having a thickness of 0.2 mm.

  The silicone resin molded body according to Example 9 has an Asker C hardness of 30 to 40, and is a downward pressing force (0.05 MPa) by supporting the upper end surface of the silicone resin molded body with the support member of the slicing apparatus. In addition, the back surface of the silicone resin molded body was supported from the upper end side up to 15 mm above the lower end surface. That is, in Example 9, the position above the slice thickness (0.2 mm) and below the central portion (40 mm) in the height direction of the silicone resin molded body is supported.

  In Example 9, the end face of the silicone resin molded body was sliced while applying ultrasonic waves with an oscillation frequency of 20.5 kHz and an amplitude of 50 μm to the slicing blade.

[Example 10]
In Example 10, the conditions were the same as in Example 9 except that the slice thickness of the heat conductive sheet was set to 2.0 mm.

[Example 11]
In Example 11, in addition to the slicing blade, the end surface of the silicone resin molding was sliced while applying an ultrasonic wave having an oscillation frequency of 20.5 kHz and an amplitude of 50 μm to the sliding surface of the silicone resin molding. The other conditions are the same as in Example 10.

[Comparative Example 6]
In Comparative Example 6, the slice blade and the slide surface were sliced without applying ultrasonic waves. The other conditions are the same as in Example 9.

[Comparative Example 7]
In Comparative Example 7, a silicone resin molded body having an Asker C hardness of 40 to 50 was used. Other conditions are the same as those in Comparative Example 6.

[Comparative Example 8]
In Comparative Example 8, the slice blade and the slide surface were sliced without applying ultrasonic waves. The other conditions are the same as in Example 10.

[Reference example]
As a reference example, a silicone resin molding having an Asker C hardness of 55 to 60 was used. Other conditions are the same as those in Comparative Example 6.

  As shown in Table 2, in each of Examples 9 to 11, the heat conductive sheet could be sliced to a predetermined thickness, and the thickness variation in the sheet surface was 50 μm or less.

  In Examples 9 to 11, since ultrasonic waves are applied to the slicing blade or the slicing blade and the slide surface, the friction of the slicing blade against the silicone resin molded body can be reduced, and the silicone has flexibility. This is because the surface roughness of the sliced surface can be reduced also in the resin molded body. Thereby, in Examples 9-11, the sheet | seat surface was smoother and the heat conductive sheet with low heat resistance was able to be manufactured. Moreover, in Examples 9-11, the situation which the end surface of the silicone resin molding which has a softness | flexibility at the time of slicing, and the silicone resin molding adhering to a slice blade could be prevented.

  Further, in Example 11, by applying ultrasonic vibration to the slide surface, friction between the end surface of the silicone resin molded body and the slide surface can be reduced, while pressing the silicone resin molded body on the slide surface. In addition, it was possible to slide smoothly, and the thickness variation in the sheet surface could be further reduced as compared with Example 10.

  On the other hand, Comparative Example 6 and Comparative Example 7 are low in Asker C hardness (30 to 40, 40 to 50) of the silicone resin molded body with respect to the slice thickness (0.2 mm), and are sheet-like without application of ultrasonic vibration. Could not be sliced.

  In Comparative Example 8, although the slice could be sliced to a thickness of 2.0 mm, the thickness variation in the sheet surface was as large as 500 μm.

  In the reference example, the Asker C hardness of the silicone resin molding was high (55 to 65) with respect to the slice thickness (0.2 mm), and the slice could be sliced without application of ultrasonic vibration.

DESCRIPTION OF SYMBOLS 1 Thermal conductive sheet, 2 Heat spreader, 3 Resin molding, 3a End surface, 3b Back surface, 3c Front surface, 3d, 3e Side surface, 3f Upper end surface, 4 Semiconductor element, 5 Heat sink, 6 Corner part, 10 Slice apparatus, 11 Support stand, 11a slide surface, 12 slice blade, 12a cutting edge, 13 support member, 14 slide mechanism, 15 opening, 16 ultrasonic transducer, 20 back wall, 21, 22 side wall, 23 front wall, 24 back wall, 25 back wall 26 Front wall

Claims (12)

Curing the thermally conductive resin composition containing the thermally conductive filler in the binder resin, supporting the end surface of the resin molded body molded into a predetermined shape on the slide surface by the support member,
Slicing the resin molded body into a sheet with a blade having a blade edge facing the slide surface by sliding the end surface of the resin molded body onto the slide surface;
A method for producing a heat conductive sheet, wherein the resin molding is sliced into a sheet while applying ultrasonic vibration to the slide surface . The manufacturing method of the heat conductive sheet of Claim 1 which slices the said resin molding to a sheet form, cooling the said resin molding or the said blade. The support member includes a back wall that supports the back side of the resin molded body in the sliding direction, and the back wall is at least above the slice thickness from the end surface in contact with the slide surface of the resin molded body, and the above The manufacturing method of the heat conductive sheet of Claim 1 or 2 which supports the position below the center part of the height direction orthogonal to the said slide surface of a resin molding. The heat conduction according to claim 3 , wherein the back wall supports a position corresponding to a length of 20% or more of a length of the resin molded body in the sliding direction from an end surface of the resin molded body in contact with the slide surface. Sheet manufacturing method. The said support member is a manufacturing method of the heat conductive sheet of Claim 3 or 4 which clamps the two positions which the said resin molding body opposes, and slides it pressing downward. The method for producing a heat conductive sheet according to any one of claims 3 to 5 , wherein the resin molded body is a columnar body having a longitudinal direction in a direction orthogonal to the slide surface. The said support member moves the said resin molding body relatively to the said slide surface side from the said back wall at predetermined intervals according to the slice process of the said resin molding body in any one of Claims 3-6. The manufacturing method of the heat conductive sheet of description. A sliding surface on which an end surface of a resin molded body formed by curing a thermally conductive resin composition containing a thermally conductive filler in a binder resin is molded into a predetermined shape;
A blade edge is exposed on the slide surface, and a blade for slicing the resin molded body,
A support member for supporting the resin molded body on the slide surface;
A slide mechanism for sliding the resin molding supported by the support member with respect to the blade ;
A heat conductive sheet manufacturing apparatus comprising: a vibration mechanism that applies ultrasonic vibration to the slide surface . The support member includes a back wall that supports the back side of the resin molded body in the sliding direction, and the back wall is at least above the slice thickness from the end surface in contact with the slide surface of the resin molded body, and the above The manufacturing apparatus of the heat conductive sheet of Claim 8 which supports the position below the center part of the height direction orthogonal to the said slide surface of a resin molding. The said blade is a manufacturing apparatus of the heat conductive sheet of Claim 9 which has the inclination of a predetermined angle with respect to the sliding direction of the said resin molding. A pair of said blades are arrange | positioned in a symmetrical position, and each blade is a manufacturing apparatus of the heat conductive sheet of Claim 9 or 10 with which the said resin molding is slid from a different direction, respectively. Curing the thermally conductive resin composition containing the thermally conductive filler in the binder resin, supporting the end surface of the resin molded body molded into a predetermined shape on the slide surface by the support member,
Slicing the resin molded body into a sheet with a blade having a blade edge facing the slide surface by sliding the end surface of the resin molded body onto the slide surface;
A method for cutting a resin molded body in which the resin molded body is sliced into a sheet while applying ultrasonic vibration to the slide surface .