JP5621306B2 - Resin slicing apparatus and method - Google Patents

Description

  The present invention relates to a resin slicing apparatus and a method thereof.

  Patent Document 1 discloses a method for manufacturing a heat conductive material. In this method, a sheet material in which carbon fibers are dispersed and mixed in a gel material having thermal conductivity is wound around the orientation direction of the carbon fibers to form a resin molded body. A plate-like heat conductive material in which carbon fibers are oriented in the thickness direction is obtained by slicing in a direction perpendicular to the axis.

  Since the heat conducting material is interposed between the electronic component serving as the heat source and the heat radiating component inside the electric / electronic device, the thickness of the heat conducting material is sufficient to secure the heat conductivity. It is desirable to be uniform and to be in close contact with both.

  Here, Patent Document 2 discloses a method of slicing a rubber block that is a resin molded body. In this method, by moving the blade horizontally with respect to the rubber block in a state where the rubber block is left standing, or by horizontally moving the rubber block with respect to the blade while leaving the blade stationary, A rubber block is sliced to obtain small pieces.

Japanese Patent No. 3288029 JP 2002-18782 A

  However, in the method described in Patent Document 2, when the rubber block is sliced by the blade, the rubber block or the blade is lifted, and there is a possibility that a piece having a uniform thickness cannot be obtained.

  This invention is made | formed in view of the said subject, Comprising: It aims at providing the resin slicing apparatus and its method which can obtain the resin sheet of more uniform thickness compared with the past.

In order to solve the above-mentioned problems, the resin slicing apparatus of the present invention is capable of sliding a resin molded body comprising an organic polymer compound and a scale-like, oval or rod-like inorganic material, and the inorganic material is oriented. A slide support portion having a slide surface to be supported, a slice portion having only one blade protruding from the slide surface, and the resin molding by the blade while pressing the resin molding against the slide surface A slide portion that slides the resin molded body so that the body is sliced; and a blade support portion that supports the blade from the opposite side of the slide portion across the slide surface.

  According to the resin slicing device, when the resin molded body is slidably supported on the slide surface and the resin molded body is slid by the slide portion, the resin molded body is sliced by the blade. To obtain a resin sheet.

  Here, the blade is supported by the blade support portion from the opposite side of the slide portion across the slide surface. When the resin molded body is sliced by the blade, the resin molded body is pressed against the slide surface by the slide portion. It is assumed that it was done. Therefore, when the resin molded body is sliced by the blade, it is possible to prevent the blade from sinking or the resin molded body from being lifted.

  In addition, since the slicing portion for slicing the resin molded body is configured to have only one blade, for example, when the resin molded body is sliced by a pair of blades, it is sliced by one blade. It is also possible to avoid the contact of the resin sheet made with the other blade. Thereby, it can suppress that the surface of the resin sheet after a slice gets a damage | wound, or a resin sheet curls.

  As described above, it is possible to obtain a resin sheet having a more uniform thickness as compared with the prior art.

Moreover, you may apply the resin slicing apparatus of this invention to the resin molding which is a laminated body of a primary sheet. And it is preferable that a laminated body is shape | molded by compressing at a compression amount of 3 to 20%. Further, the inorganic material contained in the resin molded body may be larger than the slice thickness.
Further, the resin slicing device of the present invention is the above-described resin slicing device, wherein the blade has a blade edge angle of 15 to 45 °, a rake angle of 35 to 75 °, and a clearance angle of 0 to 10 °. configuration and are not Rukoto was is preferable.

  When the blade edge angle is less than 15 °, the blade edge strength is weakened, the blade is damaged or the blade edge fluctuates during processing, and a sheet shape cannot be obtained. On the other hand, when the blade edge angle exceeds 45 °, the film thickness varies by 20% or more.

  In addition, if the rake angle of the blade is less than 35 °, the film thickness varies by 20% or more. If the rake angle of the blade exceeds 75 °, the strength of the blade edge becomes weak and the blade is damaged. Or the cutting edge fluctuates during processing, and the sheet shape cannot be obtained.

  Furthermore, an increase in the clearance angle of the blade means that the rake angle is reduced when the blade edge angle is constant. In order to set the rake angle to 35 to 75 ° in the range of 15 to 45 °, the clearance angle must be within 10 °.

  On the other hand, when the blade edge angle is 15 to 45 °, the rake angle is 45 to 75 °, and the clearance angle is 0 to 10 ° as in this resin slicing device, the blade edge strength is increased. It can be sufficiently secured, can be easily processed into a sheet shape, and the variation in film thickness can be suppressed to less than 20%.

Resin slicer of the present invention, in the above-described resin slicer, the sliding portion is the Rukoto the resin molded body is configured to be pressed against the sliding surface is preferably at pressure of 0.1 to 1.0 MPa.

  If the pressing force of the slide portion is less than 0.1 MPa, the resin molded body tends to be difficult to slide. On the other hand, when the pressing force of the slide part exceeds 1.0 MPa, the film thickness varies by 20% or more.

  On the other hand, when the pressing force of the slide portion is 0.1 to 1.0 MPa as in this resin slicing apparatus, the variation in film thickness can be suppressed to less than 20%.

In the resin slicing device according to the present invention , in the above-described resin slicing device, an angle formed between the edge of the blade and the end surface on the front end side in the sliding direction of the resin molded body when viewed from the normal direction of the sliding surface is 15. It is preferable that the configuration is set to be less than or equal to °.

  When the resin molded body is sliced in a state where the angle formed between the cutting edge of the blade and the end surface on the front end side in the sliding direction of the resin molded body when viewed from the normal direction of the slide surface exceeds 15 °, the film thickness becomes 20 % Or more variation occurs.

  On the other hand, when the resin molded body is sliced in a state where the angle is 15 ° or less as in this resin slicing apparatus, the variation in film thickness can be suppressed to less than 20%.

The resin slicing device according to the present invention is the above-described resin slicing device, wherein the slide portion includes a belt provided facing the slide surface in a normal direction of the slide surface, and the belt along the slide surface. a belt drive and a drive mechanism for moving the, that said that a belt drive is configured to have a support mechanism located adjustably supported in a normal direction of the sliding surface with respect to the slide support portion Is preferred .

  According to this resin slicing device, the resin molded body can be slid by moving the belt along the slide surface by the drive mechanism. Further, the pressing force acting on the resin molded body from the belt can be adjusted by adjusting the position of the belt drive device in the normal direction of the slide surface by the support mechanism.

In order to solve the above-mentioned problem, the resin slicing method of the present invention comprises a resin molded body comprising an organic polymer compound and a scale-like, oval or rod-like inorganic material, wherein the inorganic material is oriented. The resin molded body is slidably supported by the slide surface, and the resin molded body is slid in a state in which one blade whose tip is protruded from the slide surface is supported from the opposite side of the resin molded body sandwiching the slide surface. It is a method of slicing the resin molded body with only one blade by sliding it while pressing it on the surface.

  According to this resin slicing method, when slicing the resin molded body with the blade, the blade is supported from the opposite side of the resin molded body with the slide surface interposed therebetween, and the resin molded body is pressed against the slide surface. Therefore, when the resin molded body is sliced by the blade, it is possible to prevent the blade from sinking or the resin molded body from being lifted.

  In addition, since the resin molded body is sliced by only one blade, the resin sheet sliced by one blade may contact the other blade as in the case of slicing the resin molded body by a pair of blades, for example. Can be avoided. Thereby, it can suppress that the surface of the resin sheet after a slice gets a damage | wound, or a resin sheet curls.

  As described above, it is possible to obtain a resin sheet having a more uniform thickness as compared with the prior art.

Moreover, you may apply the resin slicing method of this invention to the resin molding which is a laminated body of a primary sheet. And it is preferable that a laminated body is a molded object compressed with the compression amount of 3-20%. Moreover, the inorganic material contained in the resin molding may be larger than the slice thickness.
In the resin slicing method of the present invention , in the above-described resin slicing method, a blade having a blade edge angle of 15 to 45 ° is used as the blade, and the rake angle is 35 to 75 ° and the clearance angle is 0 for the blade. It is preferable to set the angle to -10 ° and slice the resin molded body.

  When the blade edge angle is less than 15 °, the blade edge strength is weakened, the blade is damaged or the blade edge fluctuates during processing, and a sheet shape cannot be obtained. On the other hand, when the blade edge angle exceeds 45 °, the film thickness varies by 20% or more.

  In addition, if the rake angle of the blade is less than 35 °, the film thickness varies by 20% or more. If the rake angle of the blade exceeds 75 °, the strength of the blade edge becomes weak and the blade is damaged. Or the cutting edge fluctuates during processing, and the sheet shape cannot be obtained.

  Furthermore, an increase in the clearance angle of the blade means that the rake angle is reduced when the blade edge angle is constant. In order to set the rake angle to 35 to 75 ° in the range of 15 to 45 °, the clearance angle must be within 10 °.

  On the other hand, when the blade edge angle is 15 to 45 °, the rake angle is 45 to 75 °, and the clearance angle is 0 to 10 ° as in this resin slicing method, the blade edge strength is increased. It can be sufficiently secured, can be easily processed into a sheet shape, and the variation in film thickness can be suppressed to less than 20%.

Resin slicing method of the present invention, the resin slice method described above, it is a method of slicing the molded resin while pressing the resin molded body to the slide surface by the pressing force of 0.1~1.0MPa Is preferred .

  If the pressing force of the slide portion is less than 0.1 MPa, the resin molded body tends to be difficult to slide. On the other hand, when the pressing force of the slide part exceeds 1.0 MPa, the film thickness varies by 20% or more.

  On the other hand, when the pressing force of the slide portion is 0.1 to 1.0 MPa as in this resin slicing method, the variation in film thickness can be suppressed to less than 20%.

In the resin slicing method of the present invention , in the above-described resin slicing method, the angle formed by the edge of the blade and the end surface on the front end side in the slide direction of the resin molded body when viewed from the normal direction of the slide surface is 15. It is preferable that the method is a method of slicing the resin molded body as follows.

  When the resin molded body is sliced in a state where the angle formed between the cutting edge of the blade and the end surface on the front end side in the sliding direction of the resin molded body when viewed from the normal direction of the slide surface exceeds 15 °, the film thickness becomes 20 % Or more variation occurs.

  On the other hand, when the resin molded body is sliced in a state where the angle is 15 ° or less as in this resin slicing method, the variation in film thickness can be suppressed to less than 20%.

Moreover, in order to solve the said subject, after manufacturing the said resin molding, the manufacturing method of the resin sheet of this invention is the method of slicing the said resin molding using the above-mentioned resin slicing method, and obtaining a resin sheet It is.

According to the manufacturing method of the resin sheet, since a resin slice method described above, it can be compared with the prior art, to obtain a resin sheet of a more uniform thickness.

  As described above in detail, according to the present invention, a resin sheet having a more uniform thickness can be obtained as compared with the conventional one.

It is side surface sectional drawing which shows the whole structure of the resin slicing apparatus which concerns on one Embodiment of this invention. It is a top view of the resin slicing apparatus shown by FIG. It is a principal part enlarged view of the slicing tool shown by FIG. It is sectional drawing of the resin sheet sliced by the resin slicing apparatus shown by FIG. It is side surface sectional drawing which shows the modification of the resin slicing apparatus shown by FIG. It is side surface sectional drawing of the thermal module provided with the resin sheet shown by FIG. It is a figure which shows the result of having measured the thickness of the resin sheet. It is side surface sectional drawing of the thermal module provided with the resin sheet shown by FIG. It is side surface sectional drawing of the thermal module provided with the resin sheet shown by FIG. It is side surface sectional drawing of the resin slicing apparatus which concerns on a comparative example.

  First, an embodiment of the resin slicing device of the present invention will be described.

  A resin slicing apparatus 10 according to an embodiment of the present invention shown in FIG. 1 is suitably used for manufacturing a resin sheet 40 (see FIG. 4) used as a heat conductive sheet to be described later, and has a slide support. A support base 12 as a part, a slicing tool 14 as a slicing part, a slide mechanism 16 as a slide part, and a blade support base 18 as a blade support part are provided.

  The support base 12 has a slide surface 12A that slidably supports a resin molded body 50 that is a base of the resin sheet 40, and is formed in a flat plate shape that extends in a direction parallel to the horizontal direction. Further, an opening 20 that penetrates in the thickness direction is formed at a predetermined position of the support base 12.

  The slicing tool 14 is configured to have only one blade 22. The blade 22 penetrates the support base 12 through the opening 20, and a tip portion thereof protrudes from the slide surface 12 </ b> A by a predetermined height. Further, the blade 22 has a strip shape extending in a direction intersecting with the sliding direction of the resin molded body 50 (direction of arrow S) as shown in FIG. 2 when viewed from the normal direction of the sliding surface 12A. Is formed.

  The slide mechanism 16 shown in FIG. 1 is for sliding the resin molded body 50 against the slide surface 12 </ b> A, and includes a belt drive mechanism 24 and a support mechanism 26.

  The belt drive mechanism 24 includes an endless belt 28 and a drive mechanism 30 that rotates the belt 28. The belt 28 is provided to face the slide surface 12A in the normal direction of the slide surface 12A, and is wound around a plurality of rollers 34A to 34F described later. The drive mechanism 30 includes a main body 32, a plurality of rollers 34A to 34F, and a motor drive device 36 that rotates the rollers 34A.

  The support mechanism 26 includes a plurality of hydraulic jacks 38 disposed between the main body portion 32 and the support base 12 described above. Both end portions of each hydraulic jack 38 are fixed to the main body portion 32 and the support base 12, respectively. The support mechanism 26 supports the belt drive mechanism 24 with respect to the support base 12 so that the position (height) of the slide surface 12A can be adjusted in the normal direction (arrow H direction).

  In the resin slicing device 10, the support mechanism 26 adjusts the position of the belt drive mechanism 24 in the normal direction of the slide surface 12A, thereby adjusting the pressing force F acting on the resin molded body 50 from the belt 28. It has come to be.

  The blade support 18 is provided on the back side of the support 12, and supports the blade 22 from the side opposite to the slide mechanism 16 sandwiching the support 12. Further, the blade support base 18 is rotatable about the normal direction of the slide surface 12 </ b> A with respect to the support base 12, and is fixed so as to be integrally rotatable with the blade 22.

  More specifically, as shown in FIG. 2, the blade support base 18 includes a blade edge 22 </ b> A of the blade 22 and a tip of the resin molded body 50 in the slide direction when viewed from the normal direction of the slide surface 12 </ b> A. The angle θ formed with the side end surface 50A can be adjusted around the normal direction of the slide surface 12A with respect to the slide support portion so that the angle θ can be adjusted in the range of 0 ° to 60 °. Further, the blade support base 18 can be separated from the support base 12 shown in FIG. 1, whereby the height of the blade 22 can be adjusted and the blade 22 can be replaced.

  Next, the composition of the resin sheet manufactured using the above-described resin slicing apparatus 10 will be described.

  The resin sheet 40 shown in FIG. 3 is manufactured by using the above-described resin slicing apparatus 10, and is preferably used as, for example, a heat conductive sheet. The resin sheet 40 has the following composition.

  That is, the resin sheet 40 includes a composition containing a heat conductive inorganic material 4242 having a scale shape, an elliptical shape, or a rod shape and an organic polymer compound 44. The thermally conductive inorganic material 42 having a scale shape, an elliptical shape, or a rod shape is not limited to those listed below, but includes boron nitride, graphite, and carbon fiber.

  In this case, the “scale shape” indicates a thin and flat shape like a fish scale. “Ellipsoid” indicates an ellipsoidal shape obtained by rotating an ellipse, such as a rugby ball. “Bar-shaped” refers to a long and narrow columnar shape (a ratio of the length to the diameter is large, specifically, a ratio of the length to the diameter is about 100 to 500) or a prismatic shape. Any shape is anisotropic.

  Further, the content of the inorganic material 42 is not particularly limited, but is preferably 10 to 50% by volume, more preferably 30 to 45% by volume based on the total volume of the composition. In addition, content (volume%) of the inorganic material 42 in this embodiment is the value calculated | required by following Formula.

Content of inorganic material (% by volume) = (Aw / Ad) / ((Aw / Ad) + (Bw / Bd) + (Cw / Cd) + (Dw / Dd) +...) × 100
Aw: mass composition of inorganic material (mass%)
Bw: mass composition of organic polymer compound (mass%)
Cw: mass composition (mass%) of other optional components
Ad: Specific gravity of the inorganic material (Ad is calculated in the case of graphite: 2.1, boron nitride: 2.2, carbon fiber: 1.8)
Bd: Specific gravity of organic polymer compound Cd: Specific gravity of other optional components

  The organic polymer compound 44 has a Tg (glass transition temperature) of 50 ° C. or lower, preferably −70 to 20 ° C., more preferably −60 to 0 ° C. When the Tg exceeds 50 ° C., the flexibility is inferior, and the adhesion to the heating element and the radiator tends to be poor.

  The glass transition temperature is measured using thermomechanical measurement (TMA).

  Examples of the organic polymer compound 44 include a poly (meth) acrylate ester polymer compound (so-called acrylic rubber) mainly composed of butyl acrylate, 2-ethylhexyl acrylate, or the like, and a polydimethylsiloxane structure. A polymer compound having a main structure (so-called silicone resin), a polymer compound having a polyisoprene structure as a main structure (so-called isoprene rubber, natural rubber), a polymer compound having chloroprene as a main raw material component (so-called chloroprene rubber), Examples thereof include a flexible organic polymer compound 44 generally called “rubber”, such as a polymer compound having a polybutadiene structure as a main structure (so-called butadiene rubber).

  Among these, a poly (meth) acrylic acid ester-based polymer compound, in particular, any one or both of butyl acrylate and 2-ethylhexyl acrylate is included as a copolymerization component, and is 50% by mass or more in the copolymer composition. A poly (meth) acrylic acid ester polymer compound is preferable because it is easy to obtain high flexibility, excellent in chemical stability and processability, easily controls adhesiveness, and is relatively inexpensive.

  Moreover, it is preferable in terms of long-term adhesion retention and film strength to include a crosslinked structure within a range that does not impair flexibility. For example, a crosslinked structure can be included by reacting a compound having a —OH group with a compound having a plurality of isocyanate groups. Although content in particular of the organic polymer compound 44 is not restrict | limited, Preferably it is 10-70 volume% with respect to the composition whole volume, More preferably, it is 20-50 volume%.

  Moreover, the resin sheet 40 can contain a flame retardant. It does not specifically limit as a flame retardant, For example, a red phosphorus flame retardant and a phosphate ester flame retardant can be contained.

  Examples of red phosphorus flame retardants include pure red phosphorus powder, various coatings for the purpose of improving safety and stability, and master batches. Examples include trade names: Nova Red, Nova Excel, Nova Quel, Nova Pellet, etc., manufactured by Rin Chemical Industry Co., Ltd.

Examples of the phosphate ester flame retardant include aliphatic phosphate esters such as trimethyl phosphate, triethyl phosphate, tributyl phosphate;
Triphenyl phosphate, tricresyl phosphate, cresyl diphenyl phosphate, trixylenyl phosphate, cresyl-2,6-xylenyl phosphate, tris (t-butylated phenyl) phosphate, tris (isopropylated phenyl) phosphate, phosphoric acid Aromatic phosphates such as triaryl isopropylates;
Examples thereof include aromatic condensed phosphate esters such as resorcinol bisdiphenyl phosphate, bisphenol A bis (diphenyl phosphate), and resorcinol bisdixylenyl phosphate.

  These may be used alone or in combination of two or more. In addition, it is preferable that the flame retardant is a phosphoric acid ester compound and is a liquid material having a freezing point of 15 ° C. or lower and a boiling point of 120 ° C. or higher, which makes it easy to achieve both flame retardancy and flexibility and tackiness. . Examples of liquid phosphate ester flame retardants having a freezing point of 15 ° C. or lower and a boiling point of 120 ° C. or higher include trimethyl phosphate, triethyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, cresyl-2,6 -Xylenyl phosphate, resorcinol bisdiphenyl phosphate, bisphenol A bis (diphenyl phosphate) and the like.

  The content of the flame retardant is not particularly limited, but is preferably 5 to 50% by volume, more preferably 10 to 40% by volume with respect to the total volume of the composition. If the content of the flame retardant is within the above range, it is preferable because sufficient flame retardancy is exhibited and it is advantageous in terms of flexibility. When the content of the flame retardant is less than 5% by volume, it is difficult to obtain sufficient flame retardancy, and when it exceeds 50% by volume, the sheet strength tends to decrease.

  In addition, the resin sheet 40 may further include a toughness improver such as urethane acrylate; a hygroscopic agent such as calcium oxide or magnesium oxide; an adhesive strength improver such as a silane coupling agent, a titanium coupling agent, or an acid anhydride; Wetting improvers such as nonionic surfactants and fluorosurfactants; antifoaming agents such as silicone oil; ion trapping agents such as inorganic ion exchangers; and the like can be appropriately added.

  Next, a method for manufacturing the above-described resin sheet 40 will be described.

  The method for manufacturing the resin sheet 40 includes the following steps (1) to (4).

That is,
(1) a kneading step of kneading a composition containing a heat conductive inorganic material and an organic polymer compound in a scale, oval or rod shape to obtain a kneaded product,
(2) A primary sheet manufacturing step of obtaining a primary sheet by making the kneaded material into a sheet form,
(3) Laminating step of laminating the primary sheet or winding to obtain a resin molded body,
(4) A slicing step in which the resin molded body is sliced to obtain a resin sheet.

  The process for producing a resin sheet according to this embodiment does not require a process for forming a film or layer having a different composition on the surface of the resin sheet during the process. Moreover, the above-mentioned resin slicing apparatus is used for the slicing step of step (4).

  Below, each process is demonstrated.

(1) Kneading step The size of the inorganic material used in the kneading step of kneading a composition containing a heat conductive inorganic material and an organic polymer compound in the form of a scale, an ellipsoid or a rod, It is preferable to select according to the thickness of the slice processed in the slicing process. The longest part of the scale, ellipse, or rod is 250 μm on average, or 500 to 1000 μm or 1500 to 2000 μm. It's okay.

  In order to further increase the thermal conductivity, it is necessary to increase the amount of the inorganic material penetrating in the sheet cross section after slicing. Therefore, an inorganic material larger than the slice thickness is usually selected. The average particle diameter of the inorganic material is measured with a value of D50 when measured by a laser diffraction / scattering method. As the kneading means, an apparatus such as a two-roller or a kneader is used.

(2) Primary sheet production step In the primary sheet production step, the kneaded product obtained by kneading is produced by crushing using a flat plate press or a metal roll. When the temperature condition is too high, the resin becomes brittle, and when the temperature is too low, the resin is not softened. The thickness of the primary sheet is preferably thin, and the thickness of 0.2 to 2.0 mm is most preferable.

(3) Lamination process In the subsequent lamination process, the primary sheet is cut out and laminated to a predetermined size to obtain a resin molded body. At that time, pressure may be applied by a press or the like in order to increase adhesion between the primary sheets. The compression amount in the press is preferably in the range of 3 to 20%. A metal roll can be used without problems in addition to the press. The amount of compression is the amount of change before and after pressing.

  Alternatively, instead of laminating, it is possible to obtain a resin molded body by winding the primary sheet. The method for winding the primary sheet is not particularly limited, and the primary sheet may be wound around the orientation direction of the inorganic material as an axis. The shape of the winding is not particularly limited, and may be, for example, a cylindrical shape or a rectangular tube shape.

  In addition, about the process of said (1)-(3), the method as described in the above-mentioned patent document 1 (patent 3288029) can be used.

(4) Slicing Step Next, the resin molded body 50 is sliced using the resin slicing apparatus 10 shown in FIG. First, each setting of the resin slicing apparatus 10 is performed. That is, the blade support 18 is rotated about the normal direction of the slide surface 12A with respect to the support 12 and the blade 22 is viewed from the normal direction of the slide surface 12A as shown in FIG. An angle θ formed by the edge 22A of the cutting edge and the end surface on the front end side in the sliding direction of the resin molded body 50 is set to 15 ° or less.

  The blade 22 has a blade edge angle α of 15 to 45 °. At this time, for the blade 22, the rake angle β is set to 35 to 75 °, and the clearance angle γ is set to 0 to 10 °.

  Next, the resin molded body 50 is placed in a slidable state on the slide surface 12A. Then, the height of the belt drive mechanism 24 is adjusted by the support mechanism 26, and the belt 28 is brought into close contact with the resin molded body 50. At this time, the position of the belt drive mechanism 24 in the normal direction of the slide surface 12A is adjusted by the support mechanism 26 so that a pressing force F of 0.1 to 1.0 MPa acts on the resin molded body 50.

  Then, the motor drive device 36 is operated to rotate the roller 34A, and the belt 28 is rotated. At this time, the feeding speed of the resin molded body 50 is set to 30 to 60 mm / s.

  Thereby, the resin molded body 50 is slid while being pressed against the slide surface 12A, and the above-described resin sheet 40 (see FIG. 4) is formed.

  In addition, after the resin sheet 40 is formed in this way, the roller 34A is reversed by the motor driving device 36, the belt 28 is rotated in the opposite direction, and the resin molded body 50 is returned to the original position. Accordingly, the height of the belt driving mechanism 24 is adjusted by the support mechanism 26 so that the pressing force F of 0.1 to 1.0 MPa acts on the resin molded body 50 again.

  And the some resin sheet 40 is obtained from the resin molding 50 by repeating the above operation | work.

  In this embodiment, the slide mechanism 16 includes the belt drive mechanism 24. However, instead of the belt drive mechanism 24, as shown in FIG. Alternatively, a slider mechanism 52 that slides may be used. The slider mechanism 52 includes a slider 54 and a rail 56 that slidably supports the slider 54. In this case, the hydraulic jack 38 of the support mechanism 26 described above may be disposed between the rail 56 and the support base 12.

  Next, the operation and effect of this embodiment will be described.

  First, a comparative example will be described in order to clarify the operation and effect of the present embodiment. The resin slicing device 90 according to the comparative example shown in FIG. 10 is configured to slice the resin molded body 50 using a slicing tool 94 having a pair of blades 92A and 92B. The resin slicing device 90 is configured to slide the resin molded body 50 by applying a load F1 in a direction parallel to the slide surface 102A.

  However, in this resin slicing device 90, the resin sheet 40 sliced by one blade 92A contacts the other blade 92B, and the surface of the resin sheet after slicing may be damaged or the resin sheet may be curled. There is.

  Further, since the resin molded body 50 is not pressed against the slide surface 102A of the support base 102, the resin molded body 50 is lifted when the resin molded body 50 is sliced by the pair of blades 92A and 92B, and the resin having a uniform thickness. There is a possibility that a sheet cannot be obtained.

  In contrast, in the present embodiment, as shown in FIG. 1, when the resin molded body 50 is sliced by the blade 22, the resin molded body 50 is pressed against the slide surface 12 </ b> A by the slide portion. Therefore, when the resin molded body 50 is sliced by the blade 22, the resin molded body 50 can be prevented from floating. Moreover, since the blade 22 is supported by the blade support base 18 from the side opposite to the slide portion with the slide surface 12A interposed therebetween, it is possible to prevent the blade 22 from sinking.

  Moreover, since the slicing tool 14 for slicing the resin molded body 50 has only one blade 22, for example, as in the above-described comparative example, a slicing tool having a pair of blades 92A and 92B. As in the case where the resin molded body 50 is sliced by 94, it can be avoided that the resin sheet sliced by the one blade 92A contacts the other blade 92B. Thereby, it can suppress that the surface of the resin sheet after a slice gets a damage | wound, or a resin sheet curls.

  As described above, it is possible to obtain the resin sheet 40 having a more uniform thickness as compared with the conventional case (the above-described comparative example).

  By the way, if the blade edge angle of the blade 22 is less than 15 °, the blade edge strength becomes weak, the blade 22 is damaged, or the blade edge fluctuates during processing, and a sheet shape cannot be obtained. On the other hand, when the blade edge angle of the blade 22 exceeds 45 °, the film thickness varies by 20% or more.

  Further, if the rake angle of the blade 22 is less than 35 °, the film thickness varies by 20% or more. If the rake angle of the blade 22 exceeds 75 °, the strength of the blade edge becomes weak, and the blade 22 Is damaged or the cutting edge fluctuates during processing, and the sheet shape cannot be obtained.

  Furthermore, an increase in the clearance angle of the blade 22 means that the rake angle is reduced when the blade edge angle is constant. In order to set the rake angle to 35 to 75 ° in the range of 15 to 45 °, the clearance angle must be within 10 °.

  Moreover, when the pressing force of the slide mechanism 16 is less than 0.1 MPa, the resin molded body 50 tends to be difficult to slide. On the other hand, when the pressing force of the slide mechanism 16 exceeds 1.0 MPa, the film thickness varies by 20% or more.

  In addition, the resin molded body is sliced in a state where the angle formed by the edge 22A of the blade 22 and the end surface on the front end side in the sliding direction of the resin molded body 50 when viewed from the normal direction of the slide surface 12A exceeds 15 °. As a result, the film thickness varies by 20% or more.

  On the other hand, when the blade edge angle of the blade 22 is 15 to 45 °, the rake angle is 45 to 75 °, and the clearance angle is 0 to 10 ° as in the present embodiment, the blade edge strength is increased. It can be sufficiently secured, can be easily processed into a sheet shape, and the variation in film thickness can be suppressed to less than 20%.

  Moreover, when the pressing force of the slide mechanism 16 is 0.1 to 1.0 MPa as in this embodiment, the variation in film thickness can be suppressed to less than 20%.

  Furthermore, as in the present embodiment, the angle formed by the edge 22A of the blade 22 and the end surface on the front end side in the sliding direction of the resin molded body 50 when viewed from the normal direction of the slide surface 12A is 15 ° or less. When the resin molded body 50 is sliced, the variation in film thickness can be suppressed to less than 20%.

  Next, the thermal module using the resin sheet manufactured by the manufacturing method of the above-mentioned resin sheet is demonstrated.

  In the thermal module 60 shown in FIG. 6, the resin sheet 40 is interposed between the semiconductor chip 62 and the heat spreader 64 and between the heat spreader 64 and the radiation fins 66. Note that a heat pipe may be used instead of the radiation fin 66.

  As long as the resin sheet 40 can be fixed in a state where it is sufficiently adhered to the adherend, there is no limitation on the method of contact, but the resin sheet 40 is automatically adhered using a robot or the like that is manually pressed against and adhered. A contact method by means of, for example, is preferable.

  Next, the Example which manufactured the above-mentioned resin sheet is described.

<Example 1>
The example which produced the resin sheet according to the process mentioned above is demonstrated. As the thermally conductive inorganic material, scale-like graphite having a particle length of 500 to 1000 μm was used. The graphite content was 45% by volume of the total volume of the composition. As the organic polymer compound, a poly (meth) acrylic acid ester polymer compound in which butyl acrylate was 76% by mass in the copolymer composition was used. Its content was 30% by volume with respect to the total volume of the composition.

  The flame retardant was bisphenol A bis (diphenyl phosphate), which is a phosphate ester, and the content was 25% by volume based on the total volume of the composition.

  The above materials were blended and first kneaded using a pressure kneader. The mixture was kneaded at a temperature of 100 ° C. for 40 minutes per 3.5 kg of the composition substance amount to obtain a kneaded product. The kneaded product was compressed to a thickness of several tens of mm using a hydraulic press, and further passed through a metal roll at 80 ° C. several times to produce a 1.0 mm-thick primary sheet.

  Next, the primary sheet was cut into a shape of 50 mm × 250 mm and laminated until the height reached 50 mm to obtain a resin molded body. The resin molded body was further pressurized at a pressure of 0.1 MPa or less using a hydraulic press. And the resin molding was sliced.

  The amount of protrusion of the knife was adjusted so that the thickness of the slice sheet was 0.25 mm, and the laminated body temperature was 10 ° C., the processing speed was 54 mm / min, the blade angle was 3222 °, and the clearance angle was 3 °. . The knife was fixed, and the resin molded body was moved in the horizontal direction by applying a compressive force of 0.3 MPa from the vertical direction.

  The thickness of the resin sheet produced on the above conditions was measured. A dial gauge was used as a measuring device. The measurement locations were 12 points including the center and the periphery of the slice sheet. In order to grasp the thickness state of the entire sheet, each measurement point was provided at an equal interval. The results are shown in FIG.

  From this figure, it can be seen that even if continuous slicing is performed, the film thickness is within ± 10%. Thus, by using the above-described resin slicing apparatus, it is possible to produce a resin sheet with little variation in thickness.

<Example 2>
In the thermal module 70 shown in FIG. 8, the resin sheet 40 is interposed between the heat spreader 74 and the heat radiating fins 76. Thus, the resin sheet 40 can also be used for joining the heat sinks.

  In this case, since the resin sheet 40 has a suitable adhesive force, it is not necessary to load and fix the resin sheet 40 under high pressure or temperature, but it is preferable to sandwich the resin sheet under the following conditions when it is desired to fix more sufficiently.

  A temperature of 50 to 200 ° C. and a pressure of 0.1 to 2.0 MPa are applied between the heat spreader 74 and the heat radiating fins 76.

<Example 3>
In the thermal module 80 shown in FIG. 9, the resin sheet 40 is interposed between the semiconductor chip 82 and the heat sink 84. The heat sink 84 includes a heat spreader, a heat radiating fin, and a heat pipe. They have the ability to diffuse heat. The surface having adhesive force is brought into contact with the heat sink 84, and the surface having low adhesive force is mounted in contact with the semiconductor chip 82. With this structure, the resin sheet 40 can be easily adhered to the heat sink 84 and can be easily peeled even if it contacts the semiconductor chip 82 once.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above, and other various modifications can be made without departing from the spirit of the present invention. It is.

10 Resin slicing device 12 Support stand (slide support part)
12A Sliding surface 14 Slicing tool (slicing part)
16 Slide mechanism (slide part)
18 Blade support (blade support)
22 Blade 24 Belt drive device 26 Support mechanism 40 Resin sheet 50 Resin molded body

Claims (16)

It includes an organic polymer compound and a scale-like, oval or rod-like inorganic material, and a resin molded body formed by orientation of the inorganic material is slidably supported by a slide surface, and a tip portion projects from the slide surface. The resin molded body is slid while pressing the resin molded body against the slide surface in a state where the single blade is supported from the side opposite to the resin molded body sandwiching the slide surface. Resin slicing method to slice by only.   The resin slicing method according to claim 1, wherein the resin molded body is a laminate of primary sheets.   The resin slicing method according to claim 2, wherein the laminate is compressed and molded at a compression amount of 3 to 20%. The resin slicing method according to any one of claims 1 to 3, wherein the inorganic material included in the resin molded body is larger than a slice thickness. As the blade, a blade having a blade edge angle of 15 to 45 ° is used, and for this blade, the rake angle is set to 35 to 75 °, the clearance angle is set to 0 to 10 °, and the resin molded body is sliced.
The resin slicing method as described in any one of Claims 1-4 . Slicing the resin molded body while pressing the resin molded body against the slide surface with a pressing force of 0.1 to 1.0 MPa,
The resin slicing method according to any one of claims 1 to 5 . Slicing the resin molded body with an angle formed by the edge of the blade when viewed from the normal direction of the slide surface and the end surface on the front end side in the slide direction of the resin molded body is 15 ° or less,
The resin slicing method according to any one of claims 1 to 6 . A slide support unit having an organic polymer compound and a scale-like, oval or rod-like inorganic material, and having a slide surface that slidably supports a resin molded body in which the inorganic material is oriented ;
A slicing portion having only one blade with a tip protruding from the sliding surface;
A slide part that slides the resin molded body so that the resin molded body is sliced by the blade while pressing the resin molded body against the slide surface;
A blade support portion that supports the blade from the opposite side of the slide portion across the slide surface;
A resin slicing apparatus.   The resin slicing apparatus according to claim 8, wherein the resin molded body is a laminate of primary sheets.   The resin slicing apparatus according to claim 9, wherein the laminate is a molded body compressed at a compression amount of 3 to 20%. The resin slicing device according to any one of claims 8 to 10, wherein the inorganic material included in the resin molded body is larger than a slice thickness. The blade is
The edge angle is 15-45 °,
The rake angle is 35 to 75 °,
The clearance angle is 0-10 °,
The resin slicing device according to any one of claims 8 to 11 . The slide portion presses the resin molded body against the slide surface with a pressing force of 0.1 to 1.0 MPa.
The resin slicing device according to any one of claims 8 to 12 . The angle formed by the edge of the blade when viewed from the normal direction of the slide surface and the end surface of the resin molded body on the tip side in the slide direction is set to 15 ° or less.
The resin slicing device according to any one of claims 8 to 13 . The slide part is
A belt drive device having a belt provided facing the slide surface in a normal direction of the slide surface, and a drive mechanism for moving the belt along the slide surface;
A support mechanism that supports the belt drive device so that the position of the belt drive device in the normal direction of the slide surface can be adjusted with respect to the slide support portion;
have,
The resin slicing device according to any one of claims 8 to 14 . Wherein after forming the resin molded body, method for producing a resin sheet to obtain a resin sheet was sliced using a resin slice method according to the resin molded body in any one of claims 1 to 7.

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