JP6210992B2 - 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル - Google Patents

応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル Download PDF

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JP6210992B2
JP6210992B2 JP2014537801A JP2014537801A JP6210992B2 JP 6210992 B2 JP6210992 B2 JP 6210992B2 JP 2014537801 A JP2014537801 A JP 2014537801A JP 2014537801 A JP2014537801 A JP 2014537801A JP 6210992 B2 JP6210992 B2 JP 6210992B2
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membrane
cell
stress layer
substrate
layer
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JP2015501594A (ja
JP2015501594A5 (cg-RX-API-DMAC7.html
Inventor
ペーター ディルクセン
ペーター ディルクセン
ロナルト デッケル
ロナルト デッケル
ヴィンセント アドリアヌス ヘンネケン
ヴィンセント アドリアヌス ヘンネケン
アドリアーン レーウェンステイン
アドリアーン レーウェンステイン
バウト マーセリス
バウト マーセリス
ヨン ダウフラス フラセル
ヨン ダウフラス フラセル
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Koninklijke Philips NV
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Koninklijke Philips NV
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/008Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means by using ultrasonic waves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292Electrostatic transducers, e.g. electret-type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Measuring Fluid Pressure (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
JP2014537801A 2011-10-28 2012-10-26 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル Active JP6210992B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161552482P 2011-10-28 2011-10-28
US61/552,482 2011-10-28
PCT/IB2012/055919 WO2013061298A2 (en) 2011-10-28 2012-10-26 Pre-collapsed capacitive micro-machined transducer cell with stress layer

Publications (3)

Publication Number Publication Date
JP2015501594A JP2015501594A (ja) 2015-01-15
JP2015501594A5 JP2015501594A5 (cg-RX-API-DMAC7.html) 2015-11-26
JP6210992B2 true JP6210992B2 (ja) 2017-10-11

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JP2014537801A Active JP6210992B2 (ja) 2011-10-28 2012-10-26 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル

Country Status (8)

Country Link
US (1) US9534949B2 (cg-RX-API-DMAC7.html)
EP (1) EP2771132B1 (cg-RX-API-DMAC7.html)
JP (1) JP6210992B2 (cg-RX-API-DMAC7.html)
CN (1) CN103917304B (cg-RX-API-DMAC7.html)
BR (1) BR112014009659A2 (cg-RX-API-DMAC7.html)
MX (1) MX347686B (cg-RX-API-DMAC7.html)
RU (1) RU2603518C2 (cg-RX-API-DMAC7.html)
WO (1) WO2013061298A2 (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IN2014CN04975A (cg-RX-API-DMAC7.html) 2011-12-20 2015-09-18 Koninkl Philips Nv
CN105263851B (zh) 2013-05-31 2017-10-13 罗伯特·博世有限公司 被限位的膜
DE102013223695B4 (de) * 2013-11-20 2016-09-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum herstellen eines kapazitiven ultraschallwandlers und anordnung einer mehrzahl von kapazitiven ultraschallwandlern
EP3110628B1 (en) * 2014-02-28 2019-07-03 The Regents of the University of California Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
JP6684817B2 (ja) * 2014-11-25 2020-04-22 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 超音波システム及び方法
CN105792084B (zh) * 2016-04-26 2020-02-21 瑞声声学科技(深圳)有限公司 Mems麦克风及其制造方法
US11458504B2 (en) 2016-12-22 2022-10-04 Koninklijke Philips N.V. Systems and methods of operation of capacitive radio frequency micro-electromechanical switches
RU2672099C2 (ru) * 2016-12-23 2018-11-12 Евгений Анатольевич Обжиров Электрическая машина емкостная (эме) с ячейками внутреннего сжатия
WO2018235415A1 (ja) * 2017-06-21 2018-12-27 パナソニックIpマネジメント株式会社 物理量センサ
DE102019203829B4 (de) * 2019-03-20 2020-12-31 Vitesco Technologies GmbH Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung
US11904357B2 (en) * 2020-05-22 2024-02-20 GE Precision Healthcare LLC Micromachined ultrasonic transducers with non-coplanar actuation and displacement

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
EP1028466B1 (en) 1999-02-09 2006-08-02 STMicroelectronics S.r.l. Method for manufacturing integrated devices including electromechanical microstructures, without residual stress
US20030022412A1 (en) 2001-07-25 2003-01-30 Motorola, Inc. Monolithic semiconductor-piezoelectric device structures and electroacoustic charge transport devices
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
WO2010097729A1 (en) 2009-02-27 2010-09-02 Koninklijke Philips Electronics, N.V. Pre-collapsed cmut with mechanical collapse retention
US8327521B2 (en) * 2007-09-17 2012-12-11 Koninklijke Philips Electronics N.V. Method for production and using a capacitive micro-machined ultrasonic transducer
WO2009041675A1 (en) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Electrostatic transducer and manufacturing method therefor
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
WO2009077961A2 (en) * 2007-12-14 2009-06-25 Koninklijke Philips Electronics, N.V. Collapsed mode operable cmut including contoured substrate
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
JP2010061976A (ja) * 2008-09-03 2010-03-18 Toshiba Corp スイッチ及びesd保護素子
WO2010032156A2 (en) 2008-09-16 2010-03-25 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasound transducer
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
BR112014009698A2 (pt) * 2011-10-28 2017-05-09 Koninklijke Philips Nv célula transdutora micromanufaturada capacitiva que sofreu colapso previamente e método de fabricação da mesma
JP6265906B2 (ja) * 2011-11-17 2018-01-24 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 円環形状の崩壊領域を持つ崩壊前の静電容量型トランスデューサーセル
IN2014CN04975A (cg-RX-API-DMAC7.html) * 2011-12-20 2015-09-18 Koninkl Philips Nv

Also Published As

Publication number Publication date
JP2015501594A (ja) 2015-01-15
CN103917304A (zh) 2014-07-09
US20140251014A1 (en) 2014-09-11
MX347686B (es) 2017-05-09
WO2013061298A3 (en) 2013-09-19
EP2771132B1 (en) 2018-08-29
CN103917304B (zh) 2016-08-17
RU2603518C2 (ru) 2016-11-27
EP2771132A2 (en) 2014-09-03
BR112014009659A2 (pt) 2017-05-09
MX2014004910A (es) 2014-05-28
US9534949B2 (en) 2017-01-03
WO2013061298A2 (en) 2013-05-02
RU2014121392A (ru) 2015-12-10

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