JP6208933B2 - トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 - Google Patents

トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 Download PDF

Info

Publication number
JP6208933B2
JP6208933B2 JP2012205150A JP2012205150A JP6208933B2 JP 6208933 B2 JP6208933 B2 JP 6208933B2 JP 2012205150 A JP2012205150 A JP 2012205150A JP 2012205150 A JP2012205150 A JP 2012205150A JP 6208933 B2 JP6208933 B2 JP 6208933B2
Authority
JP
Japan
Prior art keywords
transducer
columns
piezoelectric
substrate
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012205150A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013068616A5 (enExample
JP2013068616A (ja
Inventor
マシュー・ハーヴェイ・クローン
プラブジョット・シン
ポール・アロイシウス・メイヤー
ウェイ・ルオ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2013068616A publication Critical patent/JP2013068616A/ja
Publication of JP2013068616A5 publication Critical patent/JP2013068616A5/ja
Application granted granted Critical
Publication of JP6208933B2 publication Critical patent/JP6208933B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2012205150A 2011-09-22 2012-09-19 トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 Expired - Fee Related JP6208933B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/240,754 2011-09-22
US13/240,754 US8853918B2 (en) 2011-09-22 2011-09-22 Transducer structure for a transducer probe and methods of fabricating same

Publications (3)

Publication Number Publication Date
JP2013068616A JP2013068616A (ja) 2013-04-18
JP2013068616A5 JP2013068616A5 (enExample) 2015-11-05
JP6208933B2 true JP6208933B2 (ja) 2017-10-04

Family

ID=47828053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012205150A Expired - Fee Related JP6208933B2 (ja) 2011-09-22 2012-09-19 トランスデューサプローブのためのトランスデューサ構造体およびその製造方法

Country Status (6)

Country Link
US (1) US8853918B2 (enExample)
JP (1) JP6208933B2 (enExample)
CN (1) CN103008218B (enExample)
CA (1) CA2790266C (enExample)
DE (1) DE102012108796B4 (enExample)
FR (1) FR2980379A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10226234B2 (en) 2011-12-01 2019-03-12 Maui Imaging, Inc. Motion detection using ping-based and multiple aperture doppler ultrasound
US9282945B2 (en) 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
EP3563768A3 (en) 2010-10-13 2020-02-12 Maui Imaging, Inc. Concave ultrasound transducers and 3d arrays
JP2015503404A (ja) 2011-12-29 2015-02-02 マウイ イマギング，インコーポレーテッド 任意経路のｍモード超音波イメージング
EP2816958B1 (en) 2012-02-21 2020-03-25 Maui Imaging, Inc. Determining material stiffness using multiple aperture ultrasound
IN2014DN07243A (enExample) 2012-03-26 2015-04-24 Maui Imaging Inc
EP2883079B1 (en) 2012-08-10 2017-09-27 Maui Imaging, Inc. Calibration of multiple aperture ultrasound probes
KR102176319B1 (ko) 2012-08-21 2020-11-09 마우이 이미징, 인코포레이티드 초음파 이미징 시스템 메모리 아키텍처
CN103676827A (zh) 2012-09-06 2014-03-26 Ip音乐集团有限公司 用于远程控制音频设备的系统和方法
WO2014160291A1 (en) 2013-03-13 2014-10-02 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
DE102013213493A1 (de) * 2013-07-10 2015-01-15 Robert Bosch Gmbh Schallwandleranordnung
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
KR102617888B1 (ko) 2014-08-18 2023-12-22 마우이 이미징, 인코포레이티드 네트워크-기반 초음파 이미징 시스템
CN105810258B (zh) * 2014-12-30 2018-11-02 中核武汉核电运行技术股份有限公司 一种用于压水堆燃料组件超声检查的探头及其制造工艺
KR102681141B1 (ko) 2015-03-30 2024-07-02 마우이 이미징, 인코포레이티드 오브젝트 모션을 검출하기 위한 초음파 이미징 시스템들 및 방법들
WO2017132517A1 (en) 2016-01-27 2017-08-03 Maui Imaging, Inc. Ultrasound imaging with sparse array probes
RU2649061C1 (ru) * 2016-12-22 2018-03-29 федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") Широкополосный ультразвуковой преобразователь
KR102394585B1 (ko) * 2017-12-19 2022-05-04 현대자동차 주식회사 음향센서 및 이의 제조방법
KR102721452B1 (ko) * 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
US12409474B2 (en) * 2019-08-28 2025-09-09 S.C.R. (Engineers) Limited Devices for analysis of a fluid
US12414474B2 (en) * 2021-10-21 2025-09-09 Baker Hughes Oilfield Operations Llc Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems
CN116293473B (zh) * 2022-12-08 2025-08-01 海鹰企业集团有限责任公司 一种改进型管道声纳湿端处理装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518889A (en) * 1982-09-22 1985-05-21 North American Philips Corporation Piezoelectric apodized ultrasound transducers
US4658176A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Ultrasonic transducer using piezoelectric composite
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
ATE120670T1 (de) * 1990-06-21 1995-04-15 Siemens Ag Verbund-ultraschallwandler und verfahren zur herstellung eines strukturierten bauelementes aus piezoelektrischer keramik.
US6117612A (en) 1995-04-24 2000-09-12 Regents Of The University Of Michigan Stereolithography resin for rapid prototyping of ceramics and metals
US5648942A (en) 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
JPH11112048A (ja) * 1997-10-02 1999-04-23 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP4234846B2 (ja) * 1999-05-12 2009-03-04 上田日本無線株式会社 複合圧電体及び角柱状圧電セラミック焼結体
JP2001326999A (ja) * 2000-05-18 2001-11-22 Olympus Optical Co Ltd 圧電構造体の加工方法および複合圧電体の製造方法
US7088432B2 (en) * 2000-09-27 2006-08-08 The Regents Of The University Of California Dynamic mask projection stereo micro lithography
US6571444B2 (en) * 2001-03-20 2003-06-03 Vermon Method of manufacturing an ultrasonic transducer
US6984922B1 (en) * 2002-07-22 2006-01-10 Matsushita Electric Industrial Co., Ltd. Composite piezoelectric transducer and method of fabricating the same
JP4310586B2 (ja) * 2003-01-23 2009-08-12 株式会社日立メディコ 超音波探触子及び超音波診断装置
JP2005342337A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd 超音波探触子
US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP4945801B2 (ja) * 2005-03-24 2012-06-06 株式会社村田製作所 圧電素子、及び圧電素子の製造方法
US20100217160A1 (en) * 2005-06-13 2010-08-26 Takayuki Saguchi Ultrasonic Wave Radiator for Treatment
US7652410B2 (en) * 2006-08-01 2010-01-26 Insightec Ltd Ultrasound transducer with non-uniform elements
US20090199392A1 (en) * 2008-02-11 2009-08-13 General Electric Company Ultrasound transducer probes and system and method of manufacture
US20090230823A1 (en) * 2008-03-13 2009-09-17 Leonid Kushculey Operation of patterned ultrasonic transducers
US8212456B1 (en) * 2009-08-19 2012-07-03 Sandia Corporation Method of making and ceramic articles with multiple regions of distinct density

Also Published As

Publication number Publication date
FR2980379A1 (fr) 2013-03-29
CN103008218B (zh) 2016-06-29
US8853918B2 (en) 2014-10-07
JP2013068616A (ja) 2013-04-18
US20130076207A1 (en) 2013-03-28
CA2790266C (en) 2019-11-26
CA2790266A1 (en) 2013-03-22
DE102012108796A1 (de) 2013-03-28
DE102012108796B4 (de) 2021-03-04
CN103008218A (zh) 2013-04-03

Similar Documents

Publication Publication Date Title
JP6208933B2 (ja) トランスデューサプローブのためのトランスデューサ構造体およびその製造方法
CN101952052B (zh) 超声换能器探头及其制造系统和方法
US5164920A (en) Composite ultrasound transducer and method for manufacturing a structured component therefor of piezoelectric ceramic
US10522737B2 (en) Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (PMUT)
CN111465455B (zh) 高频超声波换能器
US20130043768A1 (en) Ultrasound transducer array
JPH1189835A (ja) 超音波探触子及びその製造方法並びにその超音波探触子を用いた超音波診断装置
CN100376214C (zh) 复合压电体
CN105679929A (zh) 基于超声驻波场的包覆压电单元薄膜的制造方法及装置
CN117582247A (zh) 一种医用全柔性超声器件
Kang et al. 2-D array design and fabrication with pitch-shifting interposer at frequencies from 4 MHz up to 10 MHz
CN210401326U (zh) 超声换能器
CN113411061A (zh) 基于体声波谐振器寄生模式的三维微阵列成型装置及方法
Wodnicki et al. PIN-PMN-PT single crystal composite and 3D printed interposer backing for ASIC integration of large aperture 2D array
JP6221679B2 (ja) 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置
Demore et al. 1–3 piezocomposite design optimised for high frequency kerfless transducer arrays
Boonruang et al. Design and characterisation of a micro-US linear array based on randomised piezocomposite
DE102012216996A1 (de) MEMS-Schallwandler, MEMS-Schallwandleranordnung und Verfahren zum Herstellen eines MEMS-Schallwandlers
JP2008005291A (ja) 音響整合層およびその製造方法、ならびに該音響整合層を含む超音波プローブ
JP2005101748A (ja) 素子アレイの製造方法、及び、超音波トランスデューサアレイの製造方法
CN120359095A (zh) 超声换能器、包括其的阵列、系统以及制造其的方法
JP2006313977A (ja) 複合圧電材料およびその製造方法
JP2004033829A (ja) バッキング製造方法及び超音波振動子
KR20150042050A (ko) 초음파 프로브의 유연성 어레이 및 그의 제조 방법
CN117082392A (zh) 具有声波聚焦功能的硅麦克风封装结构及麦克风

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150914

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150914

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160628

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160923

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170511

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170815

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170908

R150 Certificate of patent or registration of utility model

Ref document number: 6208933

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees