JP6171080B2 - 明視野差分干渉コントラストを用いた強化検査及び計測技法及びシステム - Google Patents

明視野差分干渉コントラストを用いた強化検査及び計測技法及びシステム Download PDF

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Publication number
JP6171080B2
JP6171080B2 JP2016501356A JP2016501356A JP6171080B2 JP 6171080 B2 JP6171080 B2 JP 6171080B2 JP 2016501356 A JP2016501356 A JP 2016501356A JP 2016501356 A JP2016501356 A JP 2016501356A JP 6171080 B2 JP6171080 B2 JP 6171080B2
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Prior art keywords
substrate
scan
determining
partially overlapping
spot
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Japanese (ja)
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JP2016517631A5 (enExample
JP2016517631A (ja
Inventor
アリ セレポア
アリ セレポア
ジャイディープ ケイ シンハ
ジャイディープ ケイ シンハ
クルト ハラー
クルト ハラー
プラディープ ボッカダラ
プラディープ ボッカダラ
メーディ バエズ−イラバニ
メーディ バエズ−イラバニ
ジョージ クリン
ジョージ クリン
ジアヤオ ジェン
ジアヤオ ジェン
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2016501356A 2013-03-12 2014-03-11 明視野差分干渉コントラストを用いた強化検査及び計測技法及びシステム Active JP6171080B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/797,901 2013-03-12
US13/797,901 US9052190B2 (en) 2013-03-12 2013-03-12 Bright-field differential interference contrast system with scanning beams of round and elliptical cross-sections
PCT/US2014/023824 WO2014164935A1 (en) 2013-03-12 2014-03-11 Enhanced inspection and metrology techniques and systems using bright-field differential interference contrast

Publications (3)

Publication Number Publication Date
JP2016517631A JP2016517631A (ja) 2016-06-16
JP2016517631A5 JP2016517631A5 (enExample) 2017-04-13
JP6171080B2 true JP6171080B2 (ja) 2017-07-26

Family

ID=51525937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016501356A Active JP6171080B2 (ja) 2013-03-12 2014-03-11 明視野差分干渉コントラストを用いた強化検査及び計測技法及びシステム

Country Status (4)

Country Link
US (1) US9052190B2 (enExample)
JP (1) JP6171080B2 (enExample)
TW (1) TWI623725B (enExample)
WO (1) WO2014164935A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104515481B (zh) * 2014-12-17 2017-06-09 中国科学院长春光学精密机械与物理研究所 测量大直径圆环面平面度的装置及方法
US10495446B2 (en) 2015-06-29 2019-12-03 Kla-Tencor Corporation Methods and apparatus for measuring height on a semiconductor wafer
JP6841202B2 (ja) * 2017-10-11 2021-03-10 株式会社Sumco 半導体ウェーハの評価方法および半導体ウェーハの製造方法
DE102017129356B3 (de) * 2017-12-08 2019-03-07 Infineon Technologies Ag Inspektionsverfahren für halbleitersubstrate unter verwendung von neigungsdaten und inspektionsgerät
KR102518971B1 (ko) * 2018-04-13 2023-04-05 가부시키가이샤 사무코 반도체 웨이퍼의 평가 방법 및 반도체 웨이퍼의 제조 방법
US11017520B2 (en) * 2018-09-04 2021-05-25 Kla Corporation Multi-wavelength interferometry for defect classification
JP7067524B2 (ja) * 2019-04-15 2022-05-16 信越半導体株式会社 ウェーハのフラットネス測定機の選定方法及び測定方法
JP7143831B2 (ja) * 2019-10-11 2022-09-29 信越半導体株式会社 ウェーハ形状の測定方法
US12216301B2 (en) * 2022-03-29 2025-02-04 Intel Corporation Apparatuses and methods for inspecting embedded features
US20240353219A1 (en) * 2023-04-18 2024-10-24 Kla Corporation Angular averaging calibration on bare wafer metrology tools for esfqr matching improvement
US20250290745A1 (en) * 2024-03-15 2025-09-18 Tokyo Electron Limited Apparatus and method for determining the surface profile of a semiconductor substrate using a laser scanning technique

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000035540A (ja) 1998-07-16 2000-02-02 Nikon Corp 微分干渉顕微鏡
AU2001295060A1 (en) * 2000-09-20 2002-04-02 Kla-Tencor-Inc. Methods and systems for semiconductor fabrication processes
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
JP4576500B2 (ja) 2001-03-28 2010-11-10 レーザーテック株式会社 位相シフトマスクの欠陥検査装置
JP2007086610A (ja) 2005-09-26 2007-04-05 Lasertec Corp 微分干渉顕微鏡及び欠陥検査装置
US7889355B2 (en) * 2007-01-31 2011-02-15 Zygo Corporation Interferometry for lateral metrology
US8120781B2 (en) * 2008-11-26 2012-02-21 Zygo Corporation Interferometric systems and methods featuring spectral analysis of unevenly sampled data
JP4674382B1 (ja) 2010-04-07 2011-04-20 レーザーテック株式会社 検査装置及び欠陥検査方法

Also Published As

Publication number Publication date
TW201447223A (zh) 2014-12-16
JP2016517631A (ja) 2016-06-16
US9052190B2 (en) 2015-06-09
TWI623725B (zh) 2018-05-11
US20140268172A1 (en) 2014-09-18
WO2014164935A1 (en) 2014-10-09

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