JP6142782B2 - Epoxy resin composition and optical semiconductor device - Google Patents

Description

  The present invention relates to, for example, an epoxy resin composition for an optical semiconductor device, which is a material for forming a reflector (reflecting portion) that reflects light emitted from an optical semiconductor element, and an optical semiconductor device.

  In recent years, demand for optical semiconductor elements such as LEDs has been increasing due to advantages such as high energy efficiency and long life, such as outdoor displays, portable liquid crystal backlights, and in-vehicle applications. In such an optical semiconductor device, the material for forming the reflector is manufactured by injection molding using a thermoplastic resin typified by polyphthalamide resin (PPA) or the like. And generally the white pigment is mix | blended with the said thermoplastic resin, and the light emitted from an optical semiconductor element is reflected (refer patent document 1).

  When a thermoplastic resin is used as the material for forming the reflector, the following problems occur. In other words, recently, the melting point of the solder material has been increased due to the lead-free solder material used for mounting, and surface mount packages such as the above-mentioned optical semiconductor devices require heat resistance against a reflow environment at a high temperature. Will be. Therefore, when the above thermoplastic resin is used to meet the heat resistance requirement at the solder mounting temperature of the package and the long-term heat resistance requirement due to the higher power of the optical semiconductor element, discoloration at a high temperature occurs. Along with this, a decrease in light reflection efficiency has become a problem.

  On the other hand, when a thermosetting resin is used as a material for forming the reflector, it is excellent in heat discoloration and good light reflectivity can be obtained. However, when a thermosetting resin is used as a material for forming the reflector to form a thermosetting resin composition, an antioxidant is usually blended (Patent Documents 2 to 5). However, when phosphorus-based or hindered phenol-based or hindered amine-based antioxidants are used alone, phosphorus-based antioxidants are often volatilized by heat, and hindered phenol-based and hindered amine-based antioxidants are often discolored by heat. In addition, it has been reported that a phosphorus-based antioxidant and a hindered phenol-based antioxidant are used in combination to exhibit good heat resistance (Patent Documents 6 and 7).

JP 2002-283498 A JP-A-2005-239901 JP 2012-178567 A JP 2012-77235 A JP 2012-41422 A JP 2003-40972 JP 2002-12743

  However, when the hydrogenated epoxy resin or alicyclic epoxy resin used in Patent Document 6 is used, the following problems occur. In recent years, surface mounting packages have become mainstream as semiconductor devices are mounted at higher density, and price competitiveness has become more severe year by year. In order to cope with cost reductions, the mounting of large areas and the increase in the number of packages are being promoted. Therefore, the wall thickness of the reflector material that seals the package tends to be reduced, and the package is not transported. Cracks and cracks are becoming a problem. In response to the above requirement, a decrease in strength becomes a problem when the epoxy resin is used. Moreover, when the phenol type hardening | curing agent currently used by patent document 7 is used, the problem that long-term heat resistance falls will generate | occur | produce.

  Therefore, the present invention has been made in view of the above circumstances, and has an epoxy resin composition for an optical semiconductor device having high heat resistance while maintaining strength and fillability, and an optical semiconductor sealed with a cured product of the resin composition. An object is to provide an apparatus.

  As a result of intensive studies to achieve the above object, (A) triazine derivative epoxy resin, (B) acid anhydride curing agent, (C) inorganic filler other than white pigment, (D) curing accelerator, ( E) In the epoxy resin composition containing white pigment and (F) antioxidant, (F1) contains phosphorous antioxidant and (F2) hindered phenol antioxidant as antioxidant It has been found that a cured product of an epoxy resin composition for an optical semiconductor device characterized in that it is useful as a reflector material for an optical semiconductor element such as an LED.

  Since the epoxy resin composition for optical semiconductor devices of the present invention has high heat resistance while maintaining strength and filling properties, it is useful as a reflector material for optical semiconductor elements such as LEDs.

Hereinafter, the present invention will be described in more detail.
[(A) Triazine derivative epoxy resin]
The triazine derivative epoxy resin used in the present invention has an epoxy group, preferably a triazine compound having 2 to 3 epoxy groups (particularly a 1,3,5-triazine compound), particularly 2 to 3 epoxy groups. A compound having a single isocyanurate ring, that is, an epoxy resin having an isocyanurate ring is preferred. Such an epoxy resin having an isocyanurate ring is excellent in light resistance and electrical insulation, and desirably has two, more preferably three epoxy groups per one isocyanurate ring. Specifically, tris (2,3-epoxypropyl) isocyanurate, tris (α-methylglycidyl) isocyanurate, or the like can be used.

  As the (A) triazine derivative epoxy resin used in the present invention, any one from liquid to solid can be used, but the softening point of the epoxy resin is 50 to 120 ° C., and the epoxy equivalent is 100 to 400. Are preferred. When an epoxy resin having a softening point lower than 50 ° C. is used, not only the glass transition temperature of the cured product is lowered, but also burrs and voids are easily generated during molding. Further, when an epoxy resin having a softening point higher than 120 ° C. is used, there is a possibility that the viscosity becomes too high to be molded.

  Moreover, when using the said epoxy resin for optical semiconductor sealing, it is suitable for the hydrolyzable chlorine in this epoxy resin to be 1000 ppm or less, especially 500 ppm or less, and sodium and potassium to each 10 ppm or less. If the optical semiconductor device is sealed with a resin having hydrolyzable chlorine exceeding 1000 ppm or sodium and potassium exceeding 10 ppm, and the semiconductor device is left under high temperature and high humidity for a long time, the moisture resistance may deteriorate.

[(B) Acid anhydride curing agent]
The acid anhydride of the component (B) used in the present invention acts as a curing agent, is non-aromatic to give light resistance, and has an unsaturated bond such as a carbon-carbon double bond. What does not have is preferable, for example, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, etc. are mentioned. These acid anhydride curing agents may be used alone or in combination of two or more.

The resin component is composed of a mixture containing (A) a triazine derivative epoxy resin and (B) an acid anhydride curing agent, that is, a combination of (A) a triazine derivative epoxy resin and (B) an acid anhydride curing agent. In this case, the blending amount of the components (A) and (B) is determined based on the acid anhydride group possessed by the (B) acid anhydride curing agent.
The amount of the epoxy group contained in the (A) triazine derivative epoxy resin is 1.0 to 2.0 mol, preferably 1.2 to 1.6 mol, relative to 1 mol. If the amount exceeds 2.0 mol, curing failure may occur and reliability may be lowered. Moreover, if it is less than 1.0 mol, an unreacted acid anhydride curing agent remains in the cured product, and the volatile matter may increase and the moisture resistance of the resulting cured product may be deteriorated.

The resin components (A) and (B) can also be prepolymerized and used, but the resin component comprises (A) a triazine derivative epoxy resin and (B) an acid anhydride curing agent. In the case of constituting a prepolymer obtained by reacting in advance, (A) a triazine derivative epoxy resin and (B) an acid anhydride, [(E) epoxy group of component (A)] / [(B) component is The acid anhydride group possessed] has a molar ratio (that is, [number of epoxy groups possessed by component (A) / number of acid anhydrides possessed by component (B))] of 1.0 to 2.0, preferably 1.2 to A solid product obtained by reacting in the presence of the same antioxidant as the component (F) and / or the same curing accelerator as the component (D) described later, preferably in an amount of 1.6. (Ie prepolymer) as a resin component It can be.
At this time, the solid product is preferably used in a fine powder state by pulverization or the like. The particle diameter of the fine powder is preferably in the range of 10 μm to 3 mm. As the thermosetting epoxy resin composition of the present invention, the resin component used as the solid prepolymer (particularly in the form of fine powder) can be used as a solid thermosetting resin with good workability. desirable.

  When synthesizing the prepolymer, an epoxy resin other than the component (A) can be used in combination with a certain amount or less as long as it does not impair the effects of the present invention. Examples of this epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol type epoxy resin, or 4,4′-biphenol type epoxy resin. Biphenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, naphthalenediol type epoxy resin, trisphenylol methane type epoxy resin, tetrakisphenylol ethane type epoxy resin, And an epoxy resin obtained by hydrogenating an aromatic ring of a phenol dicyclopentadiene novolac type epoxy resin, an alicyclic epoxy resin, or the like. Among these epoxy resins, an epoxy resin in which an aromatic ring is hydrogenated or an alicyclic epoxy resin is desirable because of heat resistance and ultraviolet resistance. Moreover, it is preferable that the softening point of another epoxy resin is 70-100 degreeC.

  In addition, when using these acid anhydride type hardening | curing agents for optical semiconductor sealing, it is preferable that sodium and potassium shall be 10 ppm or less, and the optical semiconductor device is sealed using what exceeded 10 ppm, and long. When the semiconductor device is left under high temperature and high humidity for a long time, deterioration of moisture resistance may be promoted.

[(C) Inorganic filler other than white pigment]
In the resin composition of the present invention, an inorganic filler other than the white pigment of the component (E) described later is used as the component (C) for the purpose of reducing the linear expansion coefficient and improving the fluidity. Examples of the inorganic filler other than the (C) white pigment include silica glass powder, silica powder such as talc, fused silica, and crystalline silica, aluminum nitride powder, and silicon nitride powder. Among them, it is preferable to use silica powder from the viewpoint of reducing the linear expansion coefficient, and it is particularly preferable to use spherical fused silica powder from the viewpoint of high filling property and high fluidity. These inorganic fillers may be used alone or in combination of two or more.

  The inorganic filler other than the (C) white pigment is previously surface-treated with a coupling agent such as a silane coupling agent or a titanate coupling agent in order to increase the bonding strength with the resin component of the components (A) and (B). It may be processed.

  Examples of such a coupling agent include epoxy functions such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. Functional alkoxysilanes such as N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, and γ-mercapto It is preferable to use a mercapto functional alkoxysilane such as propyltrimethoxysilane. The amount of coupling agent used for the surface treatment and the surface treatment method are not particularly limited.

  (C) It is preferable that the compounding quantity of inorganic fillers other than a white pigment is 100-1000 mass parts with respect to a total of 100 mass parts of (A) component and (B) component, and is 200-900 mass parts. It is more preferable. If it is 100 parts by mass or more, the cured product can obtain sufficient strength, and if it is 1000 parts by mass or less, there is no fear of unfilling failure due to thickening of the composition or loss of flexibility, This is preferable because there is no fear of occurrence of defects such as peeling in the LED device. In addition, it is preferable that inorganic fillers other than this (C) white pigment are contained in 50-93 mass% of the whole composition of this invention, More preferably, it is contained in 60-90 mass%.

[(D) Curing accelerator]
The (D) component curing accelerator blended in the thermosetting epoxy resin composition of the present invention is a condensation catalyst for curing the (A) and (B) components.
Examples of the condensation catalyst include amine octylate, trimethylbenzylammonium hydroxide, tetramethylammonium hydroxide, n-hexylamine, tributylamine, diazabicycloundecene (DBU), dicyandiamide, 2-ethyl-4-methyl. Basic compounds such as imidazole and 2-methylimidazole; tetraisopropyl titanate, tetrabutyl titanate, titanium acetylacetonate, aluminum triisobutoxide, aluminum triisopropoxide, aluminum trisacetylacetonate, aluminum bisethylacetoacetate, mono Acetyl acetonate, zirconium tetra (acetylacetonate), zirconium tetrabutyrate, cobalt octylate, cobalt acetate Metal-containing compounds such as luacetonate, iron acetylacetonate, tin acetylacetonate, dibutyltin octylate, dibutyltin laurate, zinc octylate, zinc benzoate, zinc p-tert-butylbenzoate, zinc laurate, zinc stearate Organic titanium chelate compounds such as diisopropoxybis (ethylacetoacetate) titanium and diisopropoxybis (ethylacetoacetate) titanium; Of these, amine octylate and 2-ethyl-4-methylimidazole are preferred.
The blending amount of the (D) curing accelerator is not particularly limited as long as it is an effective amount as a catalyst for curing the thermosetting epoxy resins of the components (A) and (B), but usually (A) and ( B) It is 0.10-0.50 mass part with respect to 100 mass parts of total of a component.

[(E) White pigment]
The (E) white pigment blended in the thermosetting epoxy resin composition of the present invention is blended as a white colorant to increase whiteness. The (E) white pigment is not particularly limited as long as it is added to the composition to enhance the shielding effect and the whiteness, but in particular, the composition of the present invention is used for producing a premold package for LED. In some cases, it is preferable to blend titanium dioxide as a white colorant in order to increase whiteness. The unit cell of titanium dioxide may be either a rutile type or an anatase type.

Also, the average particle diameter and shape are not limited, but fine powder is desirable for increasing the whiteness with a small amount, and the average particle diameter is usually 0.05 to 5.0 μm. The above titanium dioxide is a surface treated with a hydrous oxide such as Al or Si, silane or the like (particularly a rutile type is preferred) in order to improve compatibility with resin components and inorganic fillers, dispersibility, and light resistance. It is better to use. The average particle diameter can be determined as a cumulative weight average diameter D ₅₀ (or median diameter) in particle size distribution measurement by laser diffraction method.

  (E) As white pigment (white colorant), besides titanium dioxide, potassium titanate, zirconium dioxide, zinc sulfide, zinc oxide, magnesium oxide, alumina, aluminum hydroxide, glass fiber, etc. can be used alone or in carbon dioxide. It can also be used in combination with titanium.

  (E) The compounding quantity of a white pigment is 5-40 mass% of the whole composition, and 10-30 mass% is especially preferable. If the amount is 5% by mass or more, there is no fear that sufficient whiteness cannot be obtained. If the amount is 40% by mass or less, the fluidity of the composition is lowered, and there is a problem in moldability, resulting in unfilled or voids. It is preferable because there is no fear of doing so.

[(F) Antioxidant]
The antioxidant of the component (F) used in the present invention is a combination of (F1) a phosphorus antioxidant and (F2) a hindered phenol antioxidant.
The (F1) phosphorus antioxidant is not particularly limited as long as it is usually used as a phosphorus antioxidant for epoxy resins. Specifically, triphenyl phosphite, phenylisodecyl are used. Examples thereof include organic phosphorus antioxidants such as phosphite, distearyl pentaerythritol diphosphite, and tris (2,4-di-tert-butylphenyl) phosphite.
(F2) As the hindered phenol antioxidant, 2,6-di-tert-butyl-p-cresol, 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) Examples include phenolic antioxidants such as isocyanuric acid and tetrakis [methylene-3- (3 ′, 5′-di-tert-butyl-4-hydroxyphenyl) propionate] methane.
Preferably, (F1) phosphorus antioxidant is distearyl pentaerythritol diphosphite and (F2) phenolic antioxidant is tetrakis [methylene-3- (3 ′, 5′-di-tert-butyl-4- Hydroxyphenyl) propionate] methane.

  In the present invention, the blending amounts of (F1) phosphorus antioxidant and (F2) hindered phenol antioxidant are 100 masses in total of (A) triazine derivative epoxy resin and (B) acid anhydride curing agent. (F1) phosphorus antioxidant is 0.1 parts by mass or more and 10 parts by mass or less, and (F2) hindered phenol antioxidant is 0.1 parts by mass or more and 5 parts by mass or less. It is more preferable that (F1) the phosphorus-based antioxidant is 1 part by mass or more and 7 parts by mass or less, and (F2) the hindered phenol-based antioxidant is 0.5 part by mass or more and 3 parts by mass or less. .

[Other ingredients]
In the epoxy resin composition of the present invention, the following components may be blended in addition to the components (A) to (F) as long as the objects and effects of the present invention are not impaired.

  If necessary, the composition of the present invention is provided with a silicone-modified copolymer, various organic synthetic rubbers, styrene, or the like in order to impart flexibility or toughness to the cured product of the composition or to impart adhesiveness. -A thermoplastic resin such as butadiene-methyl methacrylate copolymer, styrene-ethylene-butene-styrene copolymer; or fine powders such as silicone gel and silicone rubber can be added. Further, the surface of the inorganic filler may be treated with a two-component type silicone rubber or silicone gel. The silicone-modified copolymer and styrene-butadiene-methyl methacrylate copolymer described above are effective in reducing the stress of the epoxy resin.

  As other additives, internal mold release agents, adhesion assistants, ion trapping agents, and the like can be added within a range that does not impair the properties of the cured product. When using an internal mold release agent and an adhesion assistant, they are usually used in an amount of 0.10 to 1.00 parts by mass with respect to 100 parts by mass in total of the components (A) and (B).

  When the thermosetting epoxy resin composition of the present invention is used for sealing a normal semiconductor sealing material or various on-vehicle modules, carbon black or the like can be used as a colorant. Any carbon black may be used as long as it is commercially available, but it is desirable that the carbon black has good purity and does not contain much alkali metal or halogen.

[Method for producing composition]
As a method for preparing the thermosetting epoxy composition of the present invention, for example, (A) a triazine derivative epoxy resin and (B) an acid anhydride curing agent [epoxy group contained in component (A)] / [(B Resin component mixed at a ratio of 1.0 to 2.0, (C) inorganic filler other than white pigment, (D) curing accelerator, (E) A white pigment, (F1) phosphorus antioxidant and (F2) hindered phenol antioxidant are blended at a predetermined ratio together with other additives added as necessary, for example, an internal mold release agent. There is a method in which the mixture is uniformly mixed by a mixer or the like, then melt mixed by a hot roll, a kneader, an extruder or the like, then cooled and solidified, and pulverized to an appropriate size. At this time, the component (A) and the component (B) are preferably prepolymerized and used as a solid product from the viewpoint of handling.
As detailed reaction conditions for the prepolymer synthesis, the above-described components (A) and (B) are reacted at 70 to 120 ° C., preferably 80 to 110 ° C. for 4 to 20 hours, preferably 6 to 15 hours. . Thus, a prepolymer is obtained as a solid product having a softening point of 50 to 100 ° C., preferably 60 to 90 ° C. In order to mix this with the composition of the present invention, it is preferable to make it fine powder by pulverization or the like. If the softening point of the substance obtained by the reaction is less than 50 ° C., it does not become a solid, and if it exceeds 100 ° C., the fluidity required for molding as a composition may be too low.

The epoxy resin composition of the present invention thus obtained is excellent in moldability, and the cured product not only suppresses the decrease in the brightness of the LED in portable liquid backlight applications, but also generates heat from the junction. It is also optimal as a package material for a power LED having a large current.
Furthermore, a pre-molded package that collectively seals using this material on a matrix array type metal substrate or organic substrate on which leads and pad portions are formed, leaving only the LED element mounting portion within the scope of the present invention. enter. It can also be used for sealing a normal semiconductor sealing material and various on-vehicle modules.

  In this case, the most common method for sealing the thermosetting epoxy resin composition of the present invention is a low-pressure transfer molding method. The molding temperature of the epoxy resin composition of the present invention is desirably 150 to 185 ° C., and the molding time is desirably 30 to 180 seconds. If necessary, post-curing may be performed at 150 to 185 ° C. for 2 to 20 hours.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to this. The raw materials used in the following examples and comparative examples are shown below.

<(A) Triazine derivative epoxy resin>
(A-1): Triazine derivative epoxy resin: Tris (2,3-epoxypropyl) isocyanurate (TEPIC-S: trade name, manufactured by Nissan Chemical Co., Ltd., epoxy equivalent 100)

<(B) Acid anhydride>
(B-1): Hexahydrophthalic anhydride (Ricacid HH: trade name, manufactured by Shin Nippon Rika Co., Ltd.)

<(C) Inorganic filler>
(C-1): Silica; Spherical fused silica (CS-6103 53C2: manufactured by Tatsumori Co., Ltd., average particle size: 15 μm)

<(D) Curing accelerator>
(D-1): 2-ethyl-4-methylimidazole (2E4MZ: trade name, manufactured by Shikoku Kasei Co., Ltd.)

<(E) White pigment>
(E-1): Titanium dioxide; rutile type (CR-95: trade name, manufactured by Ishihara Sangyo Co., Ltd., average particle size 0.28 μm)

<(F) Antioxidant>
(F1-1): Phosphorous antioxidant; distearyl pentaerythritol diphosphite (PEP-8: trade name manufactured by ADEKA Corporation)
(F1-2): Phosphorous antioxidant; Tris (2,4-di-tert-butylphenyl) phosphite (IRGAFOS168: trade name, manufactured by Ciba Specialty Chemicals)
(F2-1): Phenolic antioxidant; 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) isocyanuric acid (IRGANOX3114: trade name, manufactured by Ciba Specialty Chemicals Co., Ltd.)
(F2-2): Phenolic antioxidant; tetrakis [methylene-3- (3 ′, 5′-di-tert-butyl-4-hydroxyphenyl) propionate] methane (AO-60: manufactured by ADEKA Corporation) Name)

<Release agent>
Stearyl stearate (SL-900A: trade name, manufactured by Riken Vitamin Co., Ltd.)

<Adhesion aid>
3-mercaptopropyltrimethoxysilane (KBM-803P: trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)

[Examples 1-4, Comparative Examples 1-4]
About Examples 1-4 and Comparative Examples 1-4, according to the ratio shown in Table 1 and Table 2, respectively, the raw material was mix | blended and the resin composition was obtained, respectively.
In addition, (A) and (B) component were mix | blended with the predetermined quantity shown in Table 1 and Table 2, and the prepolymer of (A) and (B) component was obtained by heating at 80 degreeC for 6 hours.

Using the transfer molding machine, the resin composition obtained above has a mold temperature of 175 ° C., an injection pressure of 6.8 × 10 ⁶ Pa, a curing time of 2 minutes, and a post-curing condition of 150 ° C. for 2 hours. Thus, test pieces used in each test were prepared. Each evaluation method is as follows, and the results are summarized in a table.

[Evaluation of spiral flow]
Each resin composition was transfer-molded under the above conditions using a spiral flow measurement mold according to the standard of EMMI-1-66, and the flow distance (inch) at that time was determined.

[Evaluation of gel time]
A measurement sample of each resin composition was applied to a hot plate set at 175 ° C., and the time until curing started was defined as gel time (seconds).

[Evaluation of room temperature bending strength]
Using a mold conforming to the EMMI standard, a 10 × 4 × 100 mm test piece was molded from each resin composition under the above molding conditions, and the bending strength was measured at room temperature.

[Evaluation of heat resistance]
A test piece having a diameter of 50 mm and a thickness of 3 mm was molded from each resin composition, and the reflectance was taken as the initial reflectance. Thereafter, the test piece was post-cured and then placed at 150 ° C. and 180 ° C. for 240 hours, respectively. The reflectance after 240 hours was measured, and the reflectance after heat resistance at 150 ° C. and the reflectance after heat resistance at 180 ° C. were obtained, respectively.

  As is apparent from the results of Tables 1 and 2, the epoxy resin composition for optical semiconductor devices found in the present invention has improved heat resistance while maintaining fillability and strength. It was confirmed that the resin composition was suitable as an optical semiconductor reflector material.

Claims (9)

(A) a triazine derivative epoxy resin,
(B) an acid anhydride curing agent,
(C) inorganic fillers other than white pigments,
(D) a curing accelerator,
In the epoxy resin composition containing (E) a white pigment and (F) an antioxidant, (F) as an antioxidant,
Containing (F1) distearyl pentaerythritol diphosphite and (F2) tetrakis [methylene-3- (3 ', 5'-di-tert-butyl-4-hydroxyphenyl) propionate] methane. Reflector material for optical semiconductor devices. As an antioxidant for component (F), a total of 100 parts by weight of (A) triazine derivative epoxy resin and (B) acid anhydride curing agent,
(F1) 0.1 parts by mass or more and 10.0 parts by mass or less of distearyl pentaerythritol diphosphite ,
(F2) tetrakis [methylene-3- (3 ′, 5′-di-tert-butyl-4-hydroxyphenyl) propionate] methane in an amount of 0.1 to 5.0 parts by mass,
The reflector material for an optical semiconductor device according to claim 1, which is contained. The acid anhydride-based curing agent as component (B) is methylhexahydrophthalic anhydride and / or hexahydrophthalic anhydride, 3. The reflector material for an optical semiconductor device according to claim 1 or 2. The reflector material for an optical semiconductor device according to any one of claims 1 to 3, wherein the curing accelerator (D) contains an imidazole catalyst. (E) white pigment component, characterized in that at least one selected potassium titanium dioxide, titanates, zirconium dioxide, zinc sulfide, zinc oxide, alumina, magnesium oxide and hydroxide aluminum or Ranaru group The reflector material for optical semiconductor devices according to any one of claims 1 to 4. Furthermore, it contains a mold release agent, The reflector material for optical semiconductor devices of any one of Claims 1-5. The reflector material for optical semiconductor devices according to claim 1, wherein the inorganic filler other than the white pigment of component (C) is silica powder. The molar ratio of / [(A) an epoxy group component has] [(B) an acid anhydride group in the component having] is the ratio of the 1.0 to 2.0, any one of claims 1-7 Reflector material for optical semiconductor devices described in 1. The optical semiconductor device which comprises the reflector material of any one of Claims 1-8 .